JP2019125610A - Equipment and method for component mounting - Google Patents

Abstract

To enable, when the type of a substrate B which is a target for component mounting is changed, promptly starting to mount a component E for the substrate B.SOLUTION: During the execution of mounting processing for a substrate B1 according to a mounting program P1, a substrate B2 is fed to a waiting location Lw. Thus, by making the substrate B2 wait at the waiting location Lw beforehand, the substrate B2 can be promptly fed to a mounting location Lm in order to start component mounting on the substrate B2. Before the arrival of the substrate B1 at an exit location Le after the start of mounting on the substrate B1, the reading of a mounting program P2 is started. Thus, by reading the mounting program P2 beforehand, a prompt preparation of the mounting program P2 can be made in order to start component mounting on the substrate B2. As a result, at the change of the type of the substrate B, which is the target for the component mounting, a prompt start of mounting the component E on the substrate B becomes possible.SELECTED DRAWING: Figure 3

Description

  The present invention relates to control when a type of a substrate on which a component is to be mounted is changed, in component mounting technology for mounting a component on a substrate based on a mounting program.

  BACKGROUND Conventionally, there has been known a component mounting machine for mounting components on a substrate carried into a mounting stage. Specifically, the component mounting machine reads a mounting program that defines a component mounting sequence, and mounts the components on the substrate according to the mounting program. Moreover, the component mounting machine of patent document 1 reads and utilizes the mounting program according to the kind of board | substrate after a change, when the kind of board | substrate which becomes an object of component mounting is changed.

Unexamined-Japanese-Patent No. 2000-31694

  By the way, in order to efficiently produce a component-mounted substrate, it is required to promptly start component mounting after the type of substrate has been changed. However, Patent Document 1 only shows the contents of loading the mounting program according to the type of substrate after the type of substrate is changed, and leaves much room for improving the efficiency of substrate production. there were.

  The present invention has been made in view of the above problems, and in component mounting technology for mounting a component on a substrate based on a mounting program, when the type of substrate to be a target of component mounting is changed, mounting of the component on the substrate is quickened. The aim is to provide technology that will allow you to get started.

  The component mounter according to the present invention picks up the components supplied by the substrate transport unit in which the standby position, the mounting position, and the outlet position are sequentially arranged in the substrate transport direction, a component supply unit that supplies components, and a component supply unit. A mounting head for executing a mounting process for mounting on the substrate held at the mounting position by the substrate transfer unit, and a storage unit for reading and storing a mounting program indicating a procedure for mounting a component on the substrate in the mounting process; A control unit configured to control mounting processing by the mounting head based on the mounting program stored in the storage unit; and the mounting processing for the one substrate is the mounting program for the one substrate stored in the storage unit When executed based on the program, the next substrate of a type different from that of one substrate is transported from the upstream of the substrate transport direction to the mounting position, and the mounting process for the next substrate is stored in the storage unit. It is executed based on the next mounting program that is the mounting program for the next board assumed, and the board transport unit waits for the next board while the mounting head executes the mounting processing based on the one mounting program on one board. It is possible to execute pre-loading to the position, and when the mounting head completes the mounting process based on the mounting program on the substrate, the transfer of the substrate from the mounting position to the exit position is started, and the control unit From the start of the mounting process for one board to the arrival at the exit position of one board, reading of the next mounting program to the storage unit is started.

  In the component mounting method according to the present invention, the one substrate is transported to the mounting position by the substrate transport unit in which the standby position, the mounting position, and the exit position are sequentially arranged in the substrate transport direction, and one mounting stored in the storage unit The step of mounting components on one substrate based on the program, and the next substrate of a type different from the one substrate is transported by the substrate transport unit from the upstream of the substrate transport direction to the mounting position, and the next stored in the storage unit Mounting the component on the next board based on the mounting program, and while carrying out the mounting of the part based on the one mounting program on the one board, the pre-loading to carry the next board to the standby position is performed When the mounting of a component based on a mounting program is completed on a substrate, the transfer of the substrate from the mounting position to the exit position is started, and the mounting of the component on a substrate starts Exit position Of up to reach, reading the next mounting program in the storage unit is started.

  In the present invention (component mounter, component mounting method) configured as described above, the pre-loading for loading the next substrate to the standby position is performed while the mounting processing based on the mounting program is being performed on the one substrate. To be executed. In this manner, the next substrate is quickly transported to the mounting position to start the mounting of the component on the next substrate by previously waiting the next substrate at the standby position upstream of the mounting position in the substrate transport direction. Is possible. Also, the loading of the next mounting program is started from the start of the mounting of the component on one board to the arrival at the exit position of the one board. In this way, by starting reading of the next mounting program in advance, it is possible to quickly prepare the next mounting program for the start of component mounting on the next board. As described above, according to the present invention, it is possible to promptly carry out the transport of the next substrate and the reading of the next mounting program, which are required to start the mounting of components on the next substrate. As a result, when the type of substrate to be component mounted is changed, it is possible to promptly start the mounting of the component on the substrate.

  In addition, the substrate transport unit configures the component mounter to start transport of the next substrate from the standby position to the mounting position from the start of transport of one substrate to the exit position to the arrival of the exit position. You may. This makes it possible to quickly transport the next substrate to the mounting position for the start of component mounting on the next substrate.

  In addition, the substrate transport unit mounts from the standby position of the next substrate when one substrate being transported toward the exit position reaches a predetermined position downstream of the mounting position and upstream of the exit position in the substrate transport direction. The component mounter may be configured to initiate transport to a position. This makes it possible to quickly transport the next substrate to the mounting position for the start of component mounting on the next substrate.

  In addition, the control unit may configure the component mounter so as to start reading of the next mounting program to the storage unit upon start of advance loading. This allows the next program to be loaded quickly for the start of component mounting on the next board.

  In addition, in the reading of the next mounting program started with the start of the advance loading, the control unit stores only a part of the next mounting program that includes information indicating a component to be mounted on the next board first. The component mounter may be configured to read in the In such a configuration, the component mounting on the next board can be started by reading some information of the next mounting program. As a result, component mounting on the next board can be started promptly, regardless of the time required to read the entire next mounting program.

  In addition, the control unit may configure the component mounter so that the rest of the next mounting program is read into the storage unit after the mounting process on one substrate is completed. By this, all of the following mounting programs can be read into the storage unit.

  Also, even though the mounting head configures the component mounting machine so as to pick up a component to be mounted first on the next substrate from the component supply unit in parallel with the conveyance of one substrate from the mounting position to the exit position. good. This makes it possible to quickly mount the first component on the next board.

  Further, the control unit may configure the component mounter to start reading of the next mounting program to the storage unit when conveyance of one substrate from the mounting position to the exit position is started. This allows the next program to be loaded quickly for the start of component mounting on the next board.

  In addition, the control unit causes the next mounting program to be stored in the storage unit when one substrate being transported toward the exit position reaches a predetermined position downstream of the mounting position and upstream of the exit position in the substrate transport direction. The component mounter may be configured to start reading. This allows the next program to be loaded quickly for the start of component mounting on the next board.

  In addition, when the loading head completes reading the next loading program into the storage unit, the component feeding section feeds the component to be first mounted on the next substrate in parallel with the transfer from the standby position of the next substrate to the loading position. The component mounter may be configured to pick up from. This makes it possible to quickly mount the first component on the next board.

  Further, while the standby position and the mounting position can simultaneously hold substrates having the same width in the width direction orthogonal to the substrate transport direction, they can not simultaneously hold the substrates having different widths, and the control unit has the width of one substrate The component mounter may be configured to prohibit the substrate transfer unit from performing the pre-loading when the substrate width condition that the width of the next substrate is equal is not satisfied. As a result, it is possible to prevent the next substrate having a width that can not be held at the standby position from being erroneously carried to the standby position by the pre-loading.

  Further, the control unit may configure the component mounter so as to allow the substrate transfer unit to execute the advance loading when the substrate width condition is satisfied. By this, the next substrate having a width that can be held at the standby position is carried in advance to the standby position by advance loading, and the next substrate is quickly transported to the mounting position for the start of component mounting on the next substrate. It is possible to

  In addition, at the mounting position, a support pin for supporting the substrate from below is disposed, and the control unit arranges the support pin for supporting one substrate and the arrangement of the support pin for supporting the next substrate. If this is not the case, change the placement of the indicator pin for the next board by the mounting head after one board reaches the exit position, and then start transporting the next board from the standby position to the mounting position The component mounter may be configured as follows. This allows the next substrate to be firmly supported at the mounting position by the properly arranged support pins.

  At the mounting position, a support pin for supporting the substrate from below is disposed, and the control unit arranges the support pin for supporting one substrate and the arrangement of the support pin for supporting the next substrate. The component mounter may be configured to prohibit the substrate transfer unit from executing the pre-loading in the case where the pin arrangement condition of being equal to the aspect is not satisfied.

  In this case, the control unit may configure the component mounter so as to permit the substrate transfer unit to execute the pre-loading when both the substrate width condition and the pin arrangement condition are satisfied. By this, the next substrate which does not require the change in the arrangement of the support pins is carried in advance to the standby position by carrying in advance, and the next substrate is quickly transported to the mounting position for the start of component mounting on the next substrate. It is possible to

  According to the present invention, in the component mounting technology for mounting a component on a substrate based on a mounting program, it is possible to promptly start the mounting of the component on the substrate when the type of the substrate targeted for component mounting is changed. Become.

FIG. 1 is a partial plan view schematically showing a component mounter according to the present invention. FIG. 2 is a block diagram showing an electrical configuration of the component mounter of FIG. 1; The flowchart which shows the 1st example of the board | substrate type change preparation which the component mounting machine of FIG. 1 performs. FIG. 4 schematically shows an operation performed in accordance with the flowchart of FIG. 3; The flowchart which shows the 2nd example of the board type change preparation which the component mounting machine of FIG. 1 performs. FIG. 6 schematically shows an operation performed in accordance with the flowchart of FIG. 5; The flowchart which shows the 3rd example of the board | substrate type change preparation which the component mounting machine of FIG. 1 performs. FIG. 8 schematically shows an operation performed in accordance with the flowchart of FIG. 7; The flowchart which shows the 4th example of the board | substrate type change preparation which the component mounting machine of FIG. 1 performs.

  FIG. 1 is a partial plan view schematically showing a component mounter according to the present invention. FIG. 1 and the following drawings show XYZ orthogonal coordinates in which the Z direction is a vertical direction and the X direction and the Y direction are horizontal directions. FIG. 2 is a block diagram showing the electrical configuration of the mounter shown in FIG. In FIG. 2, a host computer which is provided outside the component mounter and controls the component mounter is also shown.

  As shown in FIG. 2, the component mounter 1 includes a main control unit 100 including an arithmetic processing unit 110, a drive control unit 120, a storage unit 130, and a communication control unit 140. The arithmetic processing unit 110 is a processor configured by a central processing unit (CPU) and a random access memory (RAM), and the drive control unit 120 and the storage unit 130 are based on the mounting program P and the like stored in the storage unit 130. And by controlling the communication control unit 140, each operation described later is controlled. The storage unit 130 is, for example, a storage device configured by an HDD (Hard Disk Drive).

  As shown in FIG. 1, the component mounter 1 includes a substrate transfer unit 12 that transfers the substrate B in the X direction (substrate transfer direction). The substrate transport unit 12 has a pair of conveyors 121, 121 arranged in parallel in the X direction on the base 11, and transports the substrate B in the X direction by the conveyors 121, 121. The distance between the conveyors 121 and 121 can be changed in the Y direction (width direction) orthogonal to the X direction, and the substrate conveyance unit 12 adjusts the distance between the conveyors 121 according to the width of the substrate B to be conveyed.

  The standby position Lw, the mounting position Lm, and the exit position Le are aligned in the X direction in the transport path of the substrates B of the conveyors 121 and 121, and the substrate transport unit 12 is downstream of each of the positions Lw, Lm, and Le in the X direction. The side has stoppers Sw, Sm, Se. Each of the stoppers Sw, Sm, and Se is provided with a stopper driving unit Ms configured of, for example, an actuator, and the drive control unit 120 individually raises and lowers the stoppers Sw, Sm, and Se by the stopper driving unit Ms. Thus, the substrate B can be stopped at each of the positions Lw, Lm, and Le.

  That is, the stopper Sw abuts on the leading end of the substrate B transported from the upstream in the X direction by the conveyor 121 and stops the substrate B at the standby position Lw by being positioned at the abutment position (the state of FIG. 1) ). On the other hand, in the state where the stopper Sw is lowered from the contact position, the substrate B passes the standby position Lw to the downstream side in the X direction. The stopper Sm abuts on the tip end of the substrate B transported from the upstream in the X direction by the conveyor 121 and stops the substrate B at the mounting position Lm by being positioned at the abutment position. On the other hand, in a state where the stopper Sm is lowered from the contact position, the substrate B passes the mounting position Lm to the downstream side in the X direction. The stopper Se abuts on the tip end of the substrate B transported from the upstream in the X direction by the conveyor 121 to stop the substrate B at the exit position Le. On the other hand, in a state where the stopper Se is lowered from the contact position, the substrate B passes the outlet position Le to the downstream side in the X direction.

  Moreover, the board | substrate conveyance part 12 has a board | substrate support mechanism similar to the mechanism described, for example in Unexamined-Japanese-Patent No. 2009-44084 grade | etc.,. That is, in the substrate transport unit 12, the plurality of backup pins I are disposed on the elevation stage provided below the mounting position Lm. Then, the plurality of backup pins I ascend along with the elevation stage to lift the substrate B stopped at the mounting position Lm from the conveyors 121 and 121 and fix the substrate B at the mounting position Lm. On the other hand, the plurality of backup pins I are lowered together with the elevating stage to release the fixation of the substrate B and place the substrate B on the conveyors 121 and 121.

  Furthermore, the substrate transport unit 12 includes a substrate sensor 123 that detects the substrate B present at a detection position D123 (such as FIG. 4) between the mounting position Lm and the exit position Le. That is, the substrate sensor 123 can detect the leading end of the substrate B being transported from the mounting position Lm to the exit position Le. The substrate sensor 123 is an optical sensor, for example, and outputs an on signal to the drive control unit 120 while detecting the substrate B, and outputs an off signal to the drive control unit 120 while the substrate B is not detected. .

  Two component supply units 25 are aligned in the X direction on both sides of the pair of conveyors 12 and 12 in the Y direction, and in each component supply unit 25, a plurality of tape feeders 26 are arranged in the X direction. Each tape feeder 26 is provided with a component supply reel on which is wound a carrier tape that accommodates small pieces E of small pieces such as integrated circuits, transistors, capacitors, etc. at predetermined intervals, and each tape feeder 26 By intermittently feeding the carrier tape pulled out from the component supply reel, the component E is supplied to the component supply position at its tip.

  Further, in the component mounting machine 1, a pair of Y-axis rails 21, 21 extending in the Y-direction, a Y-axis ball screw 22 extending in the Y-direction, and a Y-axis motor My for rotating the Y-axis ball screw 22 are provided. The support member 23 is fixed to the nut of the Y-axis ball screw 22 in a state where the support member 23 is supported movably in the Y direction by the pair of Y-axis rails 21, 21. An X-axis ball screw 24 extending in the X direction and an X-axis motor Mx for rotationally driving the X-axis ball screw 24 are attached to the head support member 23, and the head unit 3 can be moved in the X direction with the head support member 23. While being supported by the X axis ball screw 24 is fixed to the nut of the X axis ball screw 24. Therefore, the drive control unit 120 rotates the Y-axis ball screw 22 by the Y-axis motor My to move the head unit 3 in the Y direction, or rotates the X-axis ball screw 24 by the X-axis motor Mx to rotate the head unit 3 It can be moved in the direction.

  The head unit 3 has a plurality of (five) mounting heads 4 aligned in the X direction, and the mounting head 4 executes mounting processing for mounting the component E on the substrate B fixed at the mounting position Lm. That is, the drive control unit 120 causes the nozzle of the mounting head 4 to face the component E supplied by the tape feeder 26 from above by the X-axis motor Mx and the Y-axis motor My. Next, the drive control unit 120 lowers the mounting head 4 to bring the nozzle 32 into contact with the component E, and then raises the mounting head 4 having the component E adsorbed by the nozzle. Thus, when the mounting head 4 completes picking up the component E from the tape feeder 26, the drive control unit 120 moves the mounting head 4 above the substrate B by the X-axis motor Mx and the Y-axis motor My, and the mounting head 4 The component E is mounted on the substrate B by releasing the suction of the component E.

  As described above, the mounting head 4 picks up the component E from the tape feeder 26 and repeatedly executes the mounting turn for mounting on the substrate B, thereby mounting the component E on all mounting locations provided on the substrate B. Complete. At this time, the procedure for mounting the component E on the substrate B is defined in the mounting program P, and the arithmetic processing unit 110 causes the mounting head 4 to execute the mounting turn based on the mounting program P stored in the storage unit 130. . Thus, all the parts E specified to be mounted in the mounting program P are mounted on the substrate B, and the mounting processing on the substrate B is completed.

  By the way, the kind of board | substrate B which can perform mounting processing with the component mounting machine 1 is not restricted to one type, The component mounting machine 1 can perform mounting processing with respect to the mutually different board | substrates B of several types. At this time, the component mounter 1 reads (downloads) a mounting program P corresponding to the type of the substrate B from the external host computer C to the storage unit 130 via the communication control unit 140. In particular, in the present embodiment, preparation for changing the type of the substrate B to be mounted is performed as follows.

  FIG. 3 is a flow chart showing a first example of substrate type change preparation performed by the component mounting machine of FIG. 1, and FIG. 4 is a view schematically showing an operation performed according to the flow chart of FIG. In FIG. 4, the substrate B1 is the last one of the types of substrates B to be produced first to be mounted, and the substrate B2 is one of the types of substrates B to be produced next. , Is the first one to be implemented processing. Further, in FIG. 4, in addition to the component mounter 1, an upstream mounter 1 U that partially mounts the component E on the substrate B on the upstream side in the X direction of the component mounter 1 is partially shown. The upstream mounting machine 1U basically has the same configuration as the component mounting machine 1. These notations regarding FIG. 4 are the same as in FIG. 6, FIG. 8, etc. shown below.

  The arithmetic processing unit 110 of the component mounting machine 1 monitors whether the board B2 of the next type has reached the exit position Le of the upstream mounting machine 1U while executing the mounting process on the substrate B1 held at the mounting position Lm. (Step S101). The mounting process on the substrate B1 is executed according to the mounting program P1 for the substrate B1 stored in the storage unit 130. In the situation shown in the column “A11” of FIG. 4, the board B2 has not reached the exit position Le of the upstream mounting device 1U, and “NO” is determined in step S101. On the other hand, as shown in the column “A12” of FIG. 4, when the board B2 reaches the exit position Le in the upstream mounting machine 1U, the upstream mounting machine 1U directs the arrival notification to the component mounting machine 1 via the host computer C. When receiving the arrival notification via the communication control unit 140, the arithmetic processing unit 110 of the component mounter 1 determines that the board B2 has reached the exit position Le of the upstream mounter 1U ("in step S101 YES "). At this time, the upstream mounting machine 1U acquires board information on the board B2 (including the width of the board B and the arrangement of the backup pins I for supporting the board B) from the identifier attached to the board B2, It is transmitted to the arithmetic processing unit 110 of the mounting machine 1.

  If “YES” is determined in the step S101, the processing unit 110 of the component mounting machine 1 satisfies the condition for receiving the substrate B2 from the upstream mounting device 1U to the standby position Lw, that is, the substrate width condition and the pin arrangement condition are satisfied. It is judged based on the substrate information whether or not it is determined (step S102). That is, while each of the standby position Lw, the mounting position Lm, and the exit position Le of the substrate transfer unit 12 can simultaneously hold the substrates B having the same width, it can not simultaneously hold the substrates B having different widths. Therefore, the arithmetic processing unit 110 determines whether or not a substrate width condition that requires the width of the substrate B1 being mounted at the mounting position Lm to be equal to the width of the substrate B2 is satisfied. Furthermore, the arithmetic processing unit 110 satisfies the pin arrangement condition for determining that the arrangement mode of the backup pins I for supporting the substrate B1 and the arrangement mode of the backup pins I for supporting the substrate B2 are equal. to decide.

  When both the substrate width condition and the pin arrangement condition are satisfied (in the case of “YES” in step S102), as shown in the column “A13” in FIG. The substrate B2 is carried from the (exit position Le of) the mounting machine 1U to the standby position Lw (step S103). Thus, while the mounting head 4 is executing the mounting process based on the mounting program P1 on the substrate B1 at the mounting position Lm, the pre-loading to carry the substrate B2 to the standby position Lw is performed.

  When the mounting process on the substrate B1 at the mounting position Lm is completed, the transfer of the substrate B1 from the mounting position Lm to the exit position Le is started. Then, as shown in the column “A14” of FIG. 4, the leading end of the substrate B1 being transported to the exit position Le reaches the detection position D123 of the substrate sensor 123 (the position of the alternate long and short dash line in FIG. If it is detected (“YES” in step S104), the arithmetic processing unit 110 reads the mounting program P2 for the substrate B2 from the external host computer C to the storage unit 130 via the communication control unit 140 (step S105) . Further, along with the detection of the substrate B1 by the substrate sensor 123, the arithmetic processing unit 110 starts transportation from the standby position Lw to the mounting position Lm to the substrate B2, as shown in the column “A15” of FIG. Step S106). Then, as shown in the column "A16" of FIG. 4, when the substrate B2 is transported to the mounting position Lm, mounting processing on the substrate B2 based on the mounting program P2 is started (step S107).

  On the other hand, when it is determined in step S102 that at least one of the substrate width condition and the pin arrangement condition is not satisfied (when it is determined "NO"), the substrate B2 stands by at the exit position Le of the upstream mounting device 1U ( Step S108). Then, when the substrate B1 is carried out of the conveyor 121 of the component mounting machine 1 (“YES” in step S109), the adjustment of the widths of the conveyors 121 and 121 and the arrangement change of the backup pins I are performed as necessary ( Step S110). That is, when it is determined in step S102 that the substrate width condition is not satisfied, the interval between the conveyors 121 and 121 is adjusted according to the width of the substrate B2 (step S110). If it is determined in step S102 that the pin arrangement condition is not satisfied, the arrangement of the backup pins I is changed to an arrangement mode for supporting the substrate B2. The placement change of the backup pin I is performed by the mounting head 4. And if step S110 is completed, step S105-S107 will be performed similarly to the above-mentioned.

  In the first example described above, while the mounting process based on the mounting program P1 is being performed on the substrate B1, the pre-loading to load the substrate B2 to the standby position Lw is performed (step S103). Thus, the substrate B2 can be quickly transported to the mounting position Lm to start the component mounting on the substrate B2 by holding the substrate B2 in standby in advance at the standby position Lw upstream of the mounting position Lm in the X direction. It becomes possible. Further, reading of the mounting program P2 is started in a period from the start of the mounting of the component E on the substrate B1 to the arrival at the exit position Le of the substrate B1 (steps S104 and S105). Thus, by starting reading of the mounting program P2 in advance, the mounting program P2 can be quickly prepared for the start of component mounting on the substrate B2. As described above, in the first example, transportation of the substrate B2 to the mounting position Lm and reading of the mounting program P2 to the mounting position Lm, which are necessary for starting component mounting on the substrate B2, can be performed promptly. As a result, when the type of the substrate B to be component-mounted is changed, the mounting of the component E on the substrate B can be started promptly.

  In addition, the substrate transfer unit 12 starts transferring the substrate B2 from the standby position Lw to the mounting position Lm between the start of transfer of the substrate B1 to the exit position Le and the arrival of the substrate B2 to the exit position Le (step S104). , S106). Thus, the substrate B2 can be quickly transported to the mounting position Lm for the start of component mounting on the substrate B2.

  Specifically, when the substrate B1 being conveyed toward the exit position Le reaches the detection position D123 downstream of the mounting position Lm and upstream of the exit position Le in the X direction (step S104) And transport from the standby position Lw of the substrate B2 to the mounting position Lm is started (step S106). Thus, the substrate B2 can be quickly transported to the mounting position Lm for the start of component mounting on the substrate B2.

  Further, when the substrate B1 being transported toward the exit position Le reaches the detection position D123 (step S104), the arithmetic processing unit 110 starts reading of the mounting program P2 from the host computer C to the storage unit 130 (step S105). As a result, the mounting program P2 can be read quickly for the start of component mounting on the substrate B2.

  Further, when the substrate width condition that the width of the substrate B1 and the width of the substrate B2 are equal is not satisfied, the arithmetic processing unit 110 prohibits the substrate transfer unit 12 from executing the pre-loading (steps S102 and S108). As a result, it is possible to prevent the substrate B2 having a width that can not be held at the standby position Lw from being erroneously carried into the standby position Lw by the pre-loading.

  Further, when the substrate width condition is satisfied, the arithmetic processing unit 110 permits the substrate transfer unit 12 to execute the advance loading (steps S102 and S103). By this, the substrate B2 having a width that can be held at the standby position Lw is carried in advance to the standby position Lw by advance loading, and the substrate B2 is rapidly transported to the mounting position Lm for the start of component mounting on the substrate B2. It is possible to

  Further, when the arrangement manner of the backup pins I for supporting the substrate B1 and the arrangement manner of the backup pins I for supporting the substrate B2 are not satisfied, the arithmetic processing unit 110 does not satisfy the condition. The substrate transfer unit 12 is prohibited from executing the pre-loading (steps S102 and S108). On the other hand, when both of the substrate width condition and the pin arrangement condition are satisfied, the arithmetic processing unit 110 permits the substrate transport unit 12 to execute the advance loading (steps S102 and S103). By this, the substrate B2 which does not require the change of the layout of the backup pins I is carried in in advance to the standby position Lw by carrying in in advance, and the substrate B2 is rapidly transported to the mounting position Lm for the start of component mounting on the substrate B2. It is possible to

  FIG. 5 is a flow chart showing a second example of substrate type change preparation executed by the component mounting machine of FIG. 1, and FIG. 6 is a view schematically showing an operation performed according to the flow chart of FIG. Here, the explanation will be made focusing on the difference from the above embodiment, and the common points will be given the corresponding reference numerals and the explanation will be appropriately omitted. However, it goes without saying that the same effect can be obtained by providing the same configuration as the embodiment.

  In the second example, the operation after the pre-loading (step S103) when the substrate width condition and the pin arrangement condition are satisfied (in the case of “YES” in step S102) is different. That is, after the pre-loading (step S103), when the mounting process on the substrate B1 at the mounting position Lm is completed, the transfer of the substrate B1 from the mounting position Lm to the exit position Le is started. Then, in the second example, when conveyance of the substrate B1 to the exit position Le is started (“YES” in step S201), the arithmetic processing unit 110 transmits the storage unit 130 from the host computer C via the communication control unit 140. Then, the mounting program P2 for the substrate B2 is read (step S105). In addition, with the start of conveyance of the substrate B1 to the exit position Le, the arithmetic processing unit 110 conveys the substrate B2 from the standby position Lw to the mounting position Lm, as shown in the column “A21” of FIG. It starts (step S106).

  According to this flow, the loading of the mounting program P2 can be completed before the substrate B1 reaches the exit position Le, and the arithmetic processing unit 110 first refers to the substrate B2 by referring to the mounting program P2. The part E to be mounted can be confirmed. Therefore, when the reading of the mounting program P2 into the storage unit 130 is completed, the arithmetic processing unit 110 causes the mounting head 4 to pick up the part E (step S202). That is, in the second example, the mounting head 4 moves to the substrate B2 in parallel with the conveyance of the substrate B1 from the mounting position Lm to the exit position Le (in other words, before the substrate B1 reaches the exit position Le). The component E to be mounted first is picked up from the component supply unit 25. By this, it is possible to quickly mount the first component E on the substrate B2.

  From another point of view, according to the flow, when the loading of the mounting program P is completed before the substrate B2 reaches the mounting position Lm, the arithmetic processing unit 110 first mounts the components on the substrate B2 E is picked up by the mounting head 4 (step S202). That is, in the second example, the mounting head 4 moves to the substrate B2 in parallel with the conveyance of the substrate B2 from the standby position Lw to the mounting position Lm (in other words, before the substrate B2 reaches the mounting position Lm). The component E to be mounted first is picked up from the component supply unit 25. By this, it is possible to quickly mount the first component E on the substrate B2.

  Further, when transport of the substrate B1 from the mounting position Lm to the exit position Le is started (step S201), the arithmetic processing unit 110 starts reading of the mounting program P2 from the host computer C to the storage unit 130 (step S201). S105). As a result, the mounting program P2 can be read quickly for the start of component mounting on the substrate B2.

  FIG. 7 is a flow chart showing a third example of substrate type change preparation performed by the component mounter of FIG. 1, and FIG. 8 is a view schematically showing an operation performed according to the flow chart of FIG. Here, the explanation will be made focusing on the difference from the above embodiment, and the common points will be given the corresponding reference numerals and the explanation will be appropriately omitted. However, it goes without saying that the same effect can be obtained by providing the same configuration as the embodiment.

  In the third example, unlike the first example, no pin arrangement condition is required as a condition for receiving the substrate B2 from the upstream mounting device 1U to the standby position Lw (step S301). That is, when the board B2 reaches the exit position Le of the upstream mounting machine 1U ("YES" in step S101), the arithmetic processing unit 110 of the component mounting machine 1 determines whether the board width condition is satisfied (step S301). Then, when the substrate width condition is satisfied (in the case of “YES” in step S301), as shown in the column “A13” of FIG. 8, the substrate transport unit 12 of the component mounter 1 is of the upstream mounter 1U. The substrate B2 is carried from the exit position Le to the standby position Lw (step S103). On the other hand, when the substrate width condition is not satisfied (in the case of “NO” in step S301), the substrate B2 stands by at the exit position Le of the upstream mounting device 1U (step S108).

  In addition, when the transport of the substrate B1 to the exit position Le is started, the arithmetic processing unit 110 determines whether it is necessary to change the arrangement of the pins (step S302). Then, when the arrangement mode of the backup pins I for supporting the substrate B1 and the arrangement mode of the backup pins I for supporting the substrate B2 are equal, it is determined that the change in the arrangement of the pins is unnecessary (in step S302). NO)), the substrate B2 is transported from the standby position Lw to the mounting position Lm ("step S106").

  If the arrangement of the backup pins I for supporting the substrate B1 is different from the arrangement of the backup pins I for supporting the substrate B2, it is determined that the arrangement of the pins needs to be changed (YES in step S302) "). Then, as shown in the column “A31” of FIG. 8, the mounting head 4 places the backup pins I for the substrate B2 in a state where the substrate B1 reaches the exit position Le while the substrate B2 stands by at the standby position Lw. It changes (step S303). Then, when the change of the layout of the backup pins I is completed, the board B2 is transported from the standby position Lw to the mounting position Lm as shown in the column "A16" of FIG. 8 ("step S106").

  As described above, in the third example, when the arrangement mode of the backup pins I for supporting the substrate B1 and the arrangement mode of the backup pins I for supporting the substrate B2 are different, the arithmetic processing unit 110 After B1 reaches the exit position Le, the mounting head 4 changes the arrangement of the backup pins I for the substrate B2 (step S303), and then starts transporting the substrate B2 from the standby position Lw to the mounting position Lm (step S106). Thus, the substrate B2 can be firmly supported at the mounting position Lm by the backup pin I appropriately arranged.

  FIG. 9 is a flow chart showing a fourth example of the board type change preparation executed by the component mounting machine of FIG. 1, and here, the explanation will be made focusing on the differences from the above embodiment, and common points will be described. The corresponding symbols are given and the description is omitted as appropriate. However, it goes without saying that the same effect can be obtained by providing the same configuration as the embodiment.

  In the fourth example, the operation in the case where the substrate width condition and the pin arrangement condition are satisfied (in the case of “YES” in step S102) is different from that in the second example. That is, in step S103 following step S102, when loading (preloading) of the substrate B2 to the standby position Lw is started, initial data that is part of the mounting program P2 is transferred from the host computer C to the storage unit 130. It is read (step S401). The initial data includes information indicating the component E to be mounted on the substrate B2 first in the mounting program P2. When the pre-loading started in step S103 is completed and the mounting process on the substrate B1 at the mounting position Lm is completed, the transfer of the substrate B1 from the mounting position Lm to the exit position Le is started. Then, with the start of conveyance of the substrate B1 to the exit position Le (“YES” in step S201), reading of remaining data (data other than initial data) of the mounting program P2 is started (step S402).

  Further, in step S202, as in the second example, the mounting head 4 supplies the component E to be mounted first on the substrate B2 in parallel with the conveyance of the substrate B1 from the mounting position Lm to the exit position Le. Pick up from. However, since the pickup of the part E by the mounting head 4 is performed based on the initial data read in step S402, it is not necessary to complete the reading of the remaining data started in step S403.

  As described above, in the fourth example, the arithmetic processing unit 110 starts reading the next mounting program P2 from the host computer C to the storage unit 130 with the start of advance loading (steps S103 and S401). By this, it is possible to quickly read the next mounting program P2 for the start of component mounting on the substrate B2.

  In addition, in the loading of the mounting program P2 started with the start of advance loading, the arithmetic processing unit 110 stores only initial data including the information indicating the component E to be mounted first on the substrate B2 in the mounting program P2. It is read into 130 (step S401). In such a configuration, the component mounting on the substrate B2 can be started by reading the initial data of the mounting program P2. As a result, even if the amount of data of the mounting program P2 is large, component mounting on the substrate B2 can be promptly started regardless of the time required to read the entire mounting program P2.

  The arithmetic processing unit 110 also reads remaining data of the mounting program P2 from the host computer C into the storage unit 130 after the mounting process on the substrate B1 is completed (step S402). By this, the entire mounted program P2 can be read into the storage unit 130.

  The mounting head 4 picks up from the component supply unit 25 the component E to be mounted first on the substrate B2 in parallel with the transportation of the substrate B1 from the mounting position Lm to the exit position Le (steps S201 and S202). By this, it is possible to quickly mount the first component E on the substrate B2.

  As described above, in the present embodiment, the component mounter 1 corresponds to an example of the “component mounter” of the present invention, and the substrate conveyance unit 12 corresponds to an example of the “substrate conveyance unit” of the present invention. Corresponds to an example of the "parts supply unit" of the present invention, the main control unit 100 corresponds to an example of the "control unit" of the present invention, and the storage unit 130 corresponds to an example of the "storage unit" of the present invention, The mounting head 4 corresponds to an example of the "mounting head" of the present invention, the standby position Lw corresponds to an example of the "standby position" of the present invention, and the mounting position Lm corresponds to an example of the "mounting position" of the present invention The outlet position Le corresponds to an example of the "outlet position" of the present invention, the X direction corresponds to an example of the "substrate transfer direction" of the present invention, and the component E corresponds to an example of the "component" of the present invention, The substrate B corresponds to an example of the "substrate" of the present invention, the substrate B1 corresponds to an example of the "one substrate" of the present invention, and the substrate B Corresponds to an example of the "next substrate" of the present invention, the mounting program P corresponds to an example of the "mounting program" of the present invention, and the mounting program P1 corresponds to an example of the "one mounting program" of the present invention The mounting program P2 corresponds to an example of the "next mounting program" of the present invention, the detection position D123 corresponds to an example of the "predetermined position" of the present invention, and the backup pin I is an example of the "support pin" of the present invention It corresponds to

  The present invention is not limited to the above-described embodiment, and various modifications can be made to the above-described one without departing from the scope of the invention. For example, the flowcharts of the first to fourth examples of substrate type change preparation can be appropriately changed. Specifically, for example, only the substrate width condition may be obtained without obtaining the pin arrangement condition in step S102 of FIG. Also, each step of these flowcharts may be omitted or replaced as appropriate.

  Further, the substrate transport unit 12 may be configured such that the widths of the standby position Lw, the mounting position Lm, and the exit position Le can be individually changed. In this case, it is not necessary to obtain the substrate width condition as a condition for carrying the substrate B from the upstream mounting device 1U to the standby position Lw. That is, when the widths of the substrate B1 and the substrate B2 are different from each other, the width of the standby position Lw is changed according to the width of the substrate B2 while holding the substrate B1 at the mounting position Lm. You can carry it to

  Further, in the above-described example, the storage unit 130 reads the mounting program P from the host computer C provided outside the component mounting apparatus 1. However, the storage unit 130 may read the mounting program P stored in advance in another storage unit (for example, an HDD) provided inside the component mounter 1 from the other storage unit. That is, from the other storage device including the external device (host computer C) provided outside the component mounter 1 or the internal device (another storage unit) provided inside the component mounter 1 to the storage unit 130 The component mounting machine 1 can be configured to read the mounting program P and execute mounting processing based on the mounting program P.

DESCRIPTION OF SYMBOLS 1 ... Component mounting machine 12 ... Board | substrate conveyance part 25 ... Component supply part 4 ... Mounting head 100 ... Main control part (control part)
130: Memory unit B: Substrate B1: Substrate (one substrate)
B2 ... Substrate (next substrate)
C: Host computer Lw: Standby position Lm: Mounting position Le: Exit position X: X direction (substrate transfer direction)
E: Part D123: Detection position (predetermined position)
I: Backup pin (support pin)
P: mounting program P1: mounting program (one mounting program)
P2 ... mounting program (next mounting program)

Claims (16)

A substrate transport unit in which the standby position, the mounting position, and the outlet position are sequentially arranged in the substrate transport direction;
A parts supply unit for supplying parts;
A mounting head that picks up a component supplied by the component supply unit and executes a mounting process of mounting the component on the substrate held at the mounting position by the substrate conveyance unit;
It has a storage part which reads and memorizes a mounting program which shows a procedure which mounts a component on the substrate by the mounting processing, and controls the mounting processing by the mounting head based on the mounting program stored in the storage part Equipped with
When the mounting process for one substrate is executed based on one mounting program that is the mounting program for the one substrate stored in the storage unit, the next substrate of a type different from the one substrate is The mounting process is carried to the mounting position from the upstream of the substrate carrying direction, and the mounting process for the next substrate is executed based on the next mounting program that is the mounting program for the next substrate stored in the storage unit. And
The substrate transport unit can execute pre-loading to load the next substrate to the standby position while the mounting head is executing the mounting process based on the one mounting program on the one substrate, When the head completes the mounting process based on the one mounting program on the one substrate, the head starts conveying the one substrate from the mounting position to the exit position;
The component mounter starts reading the next mounting program to the storage unit from the start of the mounting process for the one substrate to the arrival of the one substrate at the exit position.   The substrate transport unit starts transport of the next substrate from the standby position to the mounting position from the start of transport of the one substrate to the outlet position to the arrival of the outlet position. The component mounting machine described in.   When the one substrate being conveyed toward the outlet position reaches a predetermined position downstream of the mounting position and upstream of the outlet position in the substrate conveyance direction, the substrate transport unit moves to the next substrate. The component mounting machine according to claim 2, wherein conveyance from the standby position to the mounting position is started.   The component mounting machine according to any one of claims 1 to 3, wherein the control unit starts reading the next mounting program to the storage unit with the start of the pre-loading.   The control unit is a part including information indicating a component to be initially mounted on the next substrate in the next mounting program in the reading of the next mounting program started with the start of the pre-loading. The component mounting machine according to claim 4, wherein only the data is read into the storage unit.   6. The component mounter according to claim 5, wherein the control unit reads the rest of the next mounting program other than the part into the storage unit after the mounting process on the one substrate is completed.   The said mounting head is parallel to the conveyance of the said one board | substrate from the said mounting position to the said exit position, and picks up the components initially mounted in the said following board | substrate from the said components supply part. Part mounting machine.   The said control part will start reading of the said next mounting program to the said memory part, when conveyance of the said 1st board | substrate from the said mounting position to the said exit position is started. The component mounting machine described in the section.   The control unit is configured to move to the storage unit when the one substrate being transported toward the outlet position reaches a predetermined position downstream of the mounting position and upstream of the outlet position in the substrate transport direction. The component mounting machine according to any one of claims 1 to 3, wherein reading of the next mounting program is started.   When the loading of the next mounting program into the storage unit is completed, the mounting head is first mounted on the next substrate in parallel with the transfer of the next substrate from the standby position to the mounting position. The component mounting machine according to claim 8, wherein a component is picked up from the component supply unit. The standby position and the mounting position can simultaneously hold the substrates having the same width in the width direction orthogonal to the substrate transfer direction, but can not simultaneously hold the substrates having different widths.
The control unit prohibits the substrate transfer unit from carrying out the pre-loading when the substrate width condition that the width of the one substrate and the width of the next substrate are not satisfied is satisfied. The component mounting machine according to any one of the above.   The component mounter according to claim 11, wherein the control unit permits the substrate transfer unit to execute the advance loading when the substrate width condition is satisfied. At the mounting position, a support pin for supporting the substrate from below is disposed.
When the arrangement mode of the support pins for supporting the one substrate is different from the arrangement mode of the support pins for supporting the next substrate, the control unit performs the one process using the one substrate. The transfer of the next substrate from the standby position to the mounting position is started after changing the arrangement of the indication pins for the next substrate by the mounting head after reaching the exit position. Part mounting machine. At the mounting position, a support pin for supporting the substrate from below is disposed.
When the pin arrangement condition that the arrangement mode of the support pin for supporting the one substrate and the arrangement mode of the support pin for supporting the next substrate are equal is not satisfied. 12. The component mounting machine according to claim 11, wherein execution of the pre-loading is prohibited in the substrate transfer unit.   The component mounter according to claim 14, wherein the control unit permits the substrate transport unit to execute the pre-loading when both the substrate width condition and the pin arrangement condition are satisfied. One substrate is transported to the mounting position by the substrate transport unit in which the standby position, the mounting position, and the outlet position are sequentially arranged in the substrate transport direction, and the one substrate is transferred based on the one mounting program stored in the storage unit. The process of mounting the parts;
The next substrate of a type different from one substrate is transported by the substrate transport unit from the upstream of the substrate transport direction to the mounting position, and the component is mounted on the next substrate based on the next mounting program stored in the storage unit. And the step of
While the mounting of the component based on the one mounting program is performed on the one substrate, the pre-loading to carry the next substrate to the standby position is performed.
When the mounting of the component based on the one mounting program is completed for the one substrate, the transfer of the one substrate from the mounting position to the exit position is started.
The component mounting method wherein reading of the next mounting program to the storage unit is started from the start of mounting of a component on the one substrate to the arrival of the outlet position of the one substrate.

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