JP2019062038A - Method of manufacturing molded object, method of manufacturing electronic component, method of manufacturing wiring component, and method of manufacturing three-dimensional circuit component - Google Patents

Abstract

To provide a method of manufacturing a molded object, a method of manufacturing an electronic component, a method of manufacturing a wiring component, and a method of manufacturing a three-dimensional circuit component, capable of suppressing a short circuit between metal patterns while ensuring the degree of freedom in selecting a resin as a base material and the degree of freedom in selecting metal to be plated.SOLUTION: A method of manufacturing a molded object (three-dimensional circuit component 1) includes: a formation step of forming a first component 3 including two or more light absorbing resins having absorption rates different from each other; a light irradiation step of irradiating a first resin 4 in the light absorbing resins with predetermined light, the first resin absorbing the predetermined light; a catalyst fixing step of supplying and fixing a catalyst 21 on a surface of the first resin 4 in the light absorbing resins; and a plating step of applying a plating process to a portion where the catalyst 21 is fixed in the light absorbing resins.SELECTED DRAWING: Figure 2

Description

  The present invention relates to a method of manufacturing a three-dimensional object whose surface is plated, a method of manufacturing an electronic component, a method of manufacturing a wiring component, and a method of manufacturing a three-dimensional circuit component.

  BACKGROUND Electronic components such as wiring components having electric circuits, wiring, and the like formed on the surface thereof are incorporated in various electronic devices and the like. In particular, three-dimensional circuit components provided with an electric circuit, wiring, and the like on the surface of a three-dimensional object formed by injection molding or the like called MID (Molded Interconnect Device) are applied to various fields. For example, they are applied to antennas for mobile phones, sensors for automobiles, and the like. As a method of producing an electric circuit, wiring, etc. on the surface of such a three-dimensional circuit component, a predetermined region of a base material formed by kneading a metal polymer additive into a thermoplastic resin is irradiated with a laser beam. There is known an LDS (Laser Direct Structuring) method in which a metal nucleus is formed on the surface and a metal is plated on the area by plating. As another method, a catalyst deactivator is applied to the surface of the substrate, and after removing the catalyst deactivator in a predetermined area by laser light irradiation, a plating catalyst is applied to the area to plate the metal. The method of making is disclosed (refer to patent documents 1).

JP, 2016-148116, A

  However, in the above-mentioned LDS method, since the resin material for exclusive use which knead | mixed in the metal polymer additive was used, the range of selection of the resin material was narrow. In addition, since the resin is colored by kneading the metal polymer additive, the resin of the substrate can not be applied to a transparent one. Further, in the method of applying the catalyst deactivator described above, the plating catalyst is limited to one which is easily lost in catalytic ability by the catalyst deactivator, and the range of selection of the plating catalyst and, consequently, the range of selection of the metal to be plated. Was narrowed. In addition, shorts between plated metal patterns are a concern in either of the two methods described above.

  The present invention has been made in view of such circumstances, and its object is to secure the freedom of selection of a resin as a base material and the freedom of selection of a metal to be plated. It is an object of the present invention to provide a method of manufacturing a three-dimensional object, a method of manufacturing an electronic component, a method of manufacturing a wiring component, and a method of manufacturing a three-dimensional circuit component.

The method for producing a shaped article of the present invention is proposed to achieve the above object, and a forming step of forming a first part including two or more light absorbing resins having different light absorptivity;
A light irradiation step of irradiating the first light of the light absorbing resin which absorbs the predetermined light;
A catalyst fixing step of supplying and fixing a catalyst to the surface of the first resin of the light absorbing resin;
A plating step of plating a portion of the light absorbing resin to which the catalyst is fixed;
It is characterized by including.

  According to this manufacturing method, if it is two or more light absorbing resins having different light absorptivity, it does not depend on the material, so the degree of freedom of selection of the resin is improved. In addition, since the catalyst deactivator is not necessary, the degree of freedom in the choice of the catalyst and hence in the selection of the metal to be plated is improved.

  In the manufacturing method, it is desirable that the forming step forms the first component by a three-dimensional modeling method of laminating a light absorbing resin to produce a three-dimensional shape.

  According to this manufacturing method, complex shaped objects can be easily manufactured. Moreover, the mechanism which irradiates light can be mounted in the three-dimensional modeling apparatus which performs a three-dimensional modeling method, and simplification of a manufacturing apparatus is attained.

  In the above manufacturing method, it is preferable that the forming step forms the first part by a multicolor molding method in which two or more light absorbing resins are sequentially injected and molded in a mold.

  According to this manufacturing method, manufacturing of a shaped article becomes easy.

  Furthermore, in any of the above manufacturing methods, it is desirable that the resin excluding the first resin in the light absorbing resin transmits light.

  According to this manufacturing method, the irradiation of light to the first resin is facilitated. That is, for example, it becomes possible to irradiate light from the side opposite to the part to be plated, and the degree of freedom of the light irradiation direction is increased.

  In any of the above manufacturing methods, it is desirable that the light irradiation step modify the surface of the first resin.

  According to this manufacturing method, the catalyst is easily fixed to the reformed portion, while the catalyst is difficult to fix to the non-reformed portion. As a result, it is possible to suppress metal plating on the non-reformed portion, and to suppress a short circuit between the metal patterns.

  Furthermore, in the above manufacturing method, the modification is preferably roughening of the surface of the first resin.

  According to this manufacturing method, the adhesion of the plated metal is improved by the anchor effect.

And the manufacturing method of the electronic component of this invention is a manufacturing method of the electronic component whose said 1st component becomes a base material, Comprising:
A manufacturing method of any one of the manufacturing methods of the above-mentioned each three-dimensional object is characterized by being applied.

Moreover, the method of manufacturing a wiring component of the present invention is a method of manufacturing a wiring component having a wiring on the surface of the first component,
It is characterized in that the method of manufacturing the electronic component is applied.

Furthermore, the method of manufacturing a three-dimensional circuit component according to the present invention is a method of manufacturing a three-dimensional circuit component including the wiring on two or more intersecting surfaces of the surface of the first component,
The manufacturing method of the said wiring component is characterized by the above-mentioned.

  According to these manufacturing methods, it is possible to select the optimum resin according to the respective characteristics of the electronic component, the wiring component, or the three-dimensional circuit component.

It is a schematic diagram of a three-dimensional circuit component. It is a flowchart explaining the manufacturing method of a three-dimensional circuit component. It is the schematic of the three-dimensional modeling apparatus which forms a resin component. It is a schematic diagram explaining the formation method of resin components. It is a schematic diagram explaining a light irradiation process. It is a schematic diagram explaining a catalyst fixing process. It is a flowchart explaining the manufacturing method of the three-dimensional circuit component in 2nd Embodiment. It is a schematic diagram explaining the catalyst fixing process in 2nd Embodiment. It is a schematic diagram explaining the plating process in 2nd Embodiment. It is a schematic diagram explaining the peeling process in 2nd Embodiment. It is a schematic diagram explaining the formation method of the resin component in 3rd Embodiment. It is a schematic diagram explaining the formation method of the resin component in 3rd Embodiment.

  Hereinafter, an embodiment for carrying out the present invention will be described with reference to the attached drawings. In the embodiment described below, various limitations are given as preferable specific examples of the present invention, but the scope of the present invention is as long as there is no description to the effect of limiting the present invention in the following description. It is not limited to these aspects. Moreover, in the following, the three-dimensional circuit component 1 will be described as an example as a type of a shaped object.

  The three-dimensional circuit component 1 is an electronic component in which the metal wiring 2 is three-dimensionally wired on the surface of a resin component 3 (corresponding to a first component in the present invention) which is a base material. The three-dimensional circuit component 1 in the present embodiment is formed in a cubic shape as shown in FIG. 1, and a predetermined metal wiring 2 is formed on each surface. That is, the three-dimensional circuit component 1 in the present embodiment is a wiring member in which wiring is formed on two or more intersecting surfaces of the surfaces of the resin component 3. The resin component 3 is formed of two resins having different light absorptivity (one type of light absorbing resin in the present invention). Specifically, the area covered with the metal wiring 2 of the resin component 3 in this embodiment is made of, for example, the first resin 4 which is a light absorbing resin having a relatively high light absorptivity colored in black or the like. It is formed. On the other hand, the portion other than the first resin 4 (the other portion excluding the first resin 4) is formed of the second resin 5 which is a light absorbing resin having a relatively low light absorption rate. . That is, the second resin 5 is formed of a resin that can transmit light. The second resin 5 may be colored as long as it can transmit light. Further, as the first resin 4 and the second resin 5, for example, a thermoplastic resin, a thermosetting resin, a photocurable resin or the like can be used. Furthermore, the resin part 3 is not limited to one composed only of the light absorbing resin such as the first resin 4 and the second resin 5 and the like, and partially includes other than the light absorbing resin (for example, metal etc.) It may be something. And such a three-dimensional circuit component 1 is incorporated and used in the said electronic device as one component of an electronic device, for example.

  Next, a method of manufacturing the three-dimensional circuit component 1 will be described. FIG. 2 is a flow chart for explaining a method of manufacturing the three-dimensional circuit component 1. First, in the forming step, the resin component 3 is formed of two resins having different light absorptivity, that is, the first resin 4 and the second resin 5 (step S1). In particular, in the present embodiment, the resin component 3 is formed by a three-dimensional modeling method in which resins are stacked to form a three-dimensional shape (three-dimensional shape). Specifically, the resin component 3 is formed using a three-dimensional modeling apparatus 8 (also referred to as a 3D printer) that executes a three-dimensional modeling method. FIG. 3 is a schematic view of the three-dimensional modeling apparatus 8. FIG. 4 is a schematic view for explaining the method of forming the resin part 3 by the three-dimensional modeling apparatus 8. The three-dimensional shaping apparatus 8 in the present embodiment is an apparatus for forming a three-dimensional shape by extruding a thermoplastic resin melted at a high temperature from the nozzle 11 and laminating it on the stage 10. Moreover, in FIG. 4, only the nozzle 11 of the three-dimensional modeling apparatus 8 is represented typically.

  As shown in FIG. 3, the three-dimensional modeling apparatus 8 moves the housing 9, the stage 10 provided in the housing 9, the head unit 12 having the nozzles 11, the carriage 13 on which the head unit 12 is mounted, and the carriage 13. Control unit (not shown) for controlling the operation of each part of the three-dimensional modeling apparatus 8 and the carriage moving mechanism 14 to be moved, the reel-like resin 15 in which the first resin 4 and the second resin 5 are wound in a reel shape. Etc. The stage 10 is configured to be movable in the vertical direction (z direction in FIG. 3) by the control of the control unit. The head unit 12 includes a heating mechanism (not shown), and is configured to be able to heat the resin (the resin to be the first resin 4 or the second resin 5) sent from the reel-like resin 15 by the heating mechanism. . The resin melted by heating is extruded from the nozzle 11 of the head unit 12 toward the stage 10. The head unit 12 in the present embodiment is provided with a nozzle 11 a for discharging the resin 4 ′ to be the melted first resin 4 and a nozzle 11 b to discharge the resin 5 ′ to be the melted second resin 5. (See Figure 4). The carriage 13 is configured to be movable in the surface direction parallel to the upper surface of the stage 10 (the x-y surface direction in FIG. 3) by the drive of the carriage moving mechanism 14. Then, by discharging the resin from the nozzles 11 while moving the carriage 13 (that is, the head unit 12) in the xy plane direction according to the signal from the control unit, the first position on the stage 10 can be obtained. A resin 4 ′ to be the resin 4 and a resin 5 ′ to be the second resin 5 are supplied, and a layer of resin consisting of the first resin 4 and the second resin 5 is formed on the stage 10. By laminating such a layer of resin while sequentially moving the stage 10 in the z direction, the resin component 3 composed of the first resin 4 and the second resin 5 is three-dimensionally formed.

  The resin component 3 in the present embodiment has a relatively high light absorptivity at the surface portion of the resin component 3 at the position where the metal wiring 2 is to be formed, as shown in FIG. The first resin 4 which is easy to absorb is formed, and the second resin 5 which has a relatively low light absorptivity (in other words, it is relatively difficult to absorb light) is formed in the other part. Thus, when the resin component 3 composed of the first resin 4 and the second resin 5 is formed, in the light irradiation step, the portion of the resin component 3 in which the first resin 4 is formed is irradiated with light. (Step S2). In the present embodiment, the first resin 4 is irradiated with a laser beam having a wavelength that is easily absorbed by the first resin 4 and easily transmitted through the second resin 5 using the laser irradiator 18 (FIG. 5). White arrow in). In addition, the light to irradiate is not restricted to visible light, According to the material of resin, the light of an ultraviolet area | region, an infrared area | region, etc. is also employable. The laser irradiator 18 can also be mounted on the three-dimensional modeling apparatus 8. In this way, the manufacturing apparatus can be simplified. The laser irradiator 18 in the present embodiment is configured to be movable, for example, in the xy plane direction. Then, the laser irradiator 18 is moved along the pattern of the first resin 4 on the surface of the resin component 3 to irradiate the surface of the first resin 4 with laser light. The irradiation of the laser light heats the first resin 4 and the surface of the first resin 4 is reformed. Specifically, the surface of the first resin 4 is roughened. That is, minute irregularities are formed on the surface of the first resin 4. In addition, all the 1st resin in each surface of the resin component 3 by changing the attitude | position of the resin component 3 automatically or manually, or moving the laser irradiator 18 three-dimensionally, for example. Irradiate the pattern of 4. Further, since the second resin 5 in the present embodiment transmits light, laser light is irradiated from the upper side of one surface without changing the posture of the resin part 3, and the second resin 5 is allowed to transmit. It is also possible to irradiate a laser beam to the pattern of the first resin 4 formed on the surface opposite to the surface of. Thereby, the surface of the first resin 4 on each surface of the resin component 3 is roughened.

  By the way, the light irradiated to the resin component 3 is not limited to laser light, that is, light having high directivity. For example, light with low directivity can also be used, such as light emitted from a light source such as a lamp. In this case, since the second resin 5 transmits light, the pattern of the first resin 4 on each surface can be exposed only by applying light from one direction without changing the posture of the resin part 3 it can. In addition, if the surface of the place (e.g., the stage 10) on which the resin component 3 is placed is a mirror surface on which light is easily reflected, the light can be efficiently applied to the first resin 4. As a result, the surface of the first resin 4 on each surface of the resin component 3 can be easily roughened. Even in this case, each surface of the resin component 3 can also be illuminated by changing the posture of the resin component 3 automatically or manually or moving the light source such as a lamp.

  If the surface of the first resin 4 is roughened by the irradiation of light to the resin component 3, the catalyst 21 is applied to the surface of the first resin 4 of the resin component 3 irradiated with light in the catalyst fixing step. Supply and fix (step S3). In the present embodiment, as shown in FIG. 6, a catalyst liquid in which a catalyst 21 is dissolved or dispersed in a solvent is applied to the surface of the first resin 4 using a dispenser 19 and then dried. For example, the dispenser 19 is moved along the pattern of the first resin 4 on the surface of the resin part 3 to apply the catalyst 21 to the surface of the first resin 4, and then the posture of the resin part 3 is automatically or The catalyst 21 is applied to the pattern of all the first resins 4 on each surface of the resin part 3 by manually changing or moving the dispenser 19 three-dimensionally (see FIG. 6). Here, since the surface of the first resin 4 is roughened, the catalyst 21 is easily fixed to the surface of the first resin 4 by the anchor effect. The catalyst 21 is a catalyst for metal plating, and for example, metal fine particles such as Pd, Ni, Pt, Cu, etc., metal complexes, metal alkoxides, etc. are used. The solvent may be any liquid as long as it can dissolve or disperse the catalyst 21. For example, water, methanol, ethanol or the like is used.

  After the catalyst 21 is fixed on the surface of the first resin 4, in the plating step, the surface of the first resin 4 on which the catalyst 21 is fixed is plated to form the metal wiring 2 (step S4). . In the present embodiment, the metal wiring 2 is formed by electroless plating. That is, the resin part 3 is immersed in an aqueous solution (for example, a nickel phosphorus plating solution) containing metal ions to perform plating. Thereby, metal is plated on the area (in the present embodiment, the surface of the first resin 4) to which the catalyst 21 is fixed, and the metal wiring 2 as shown in FIG. 1 is formed on the surface of the resin component 3. That is, a three-dimensional circuit component 1 as shown in FIG. 1 is formed.

  Thus, the resin component 3 is made of the first resin 4 having a relatively high light absorption rate and the second resin 5 having a relatively low light absorption rate, and the surface of the first resin 4 is irradiated with light. Since the catalyst 21 is reformed (roughened in the present embodiment), the catalyst 21 is easily fixed to the reformed portion, but the catalyst 21 is difficult to fix to the portion not reformed. Thereby, the plating process can be reliably performed on the surface of the first resin 4. Moreover, it can suppress that metal is plated in the part which is not reformed, and can suppress the short circuit between metal patterns, ie, the short circuit between metal wiring 2. Further, since the surface of the first resin 4 is roughened, the adhesion of the metal (metal wiring 2) plated by the anchor effect is improved.

  Also, a predetermined area on the surface of the resin component 3 is roughened using the difference in light absorptivity of two or more resins, and a catalyst or the like is kneaded to fix the catalyst 21 on the roughened portion. Various resins can be adopted without being limited to the resin. That is, if it is two or more resins having different light absorptivity, it becomes possible to selectively perform the plating process regardless of the material, so the degree of freedom in selecting the resin is improved. As a result, it is possible to select an optimal resin according to the characteristics of the three-dimensional circuit component 1. Furthermore, since it is not necessary to apply a catalyst deactivator to the surface of the resin part 3, the degree of freedom in the choice of the catalyst and hence in the selection of the metal to be plated is improved. In particular, in the present embodiment, since a resin that transmits light is used as the second resin 5 formed other than the portion to be plated, light is applied from the side opposite to the portion to be plated It becomes possible to irradiate and the degree of freedom of the light irradiation direction is increased. In addition, even when laser light is irradiated along the pattern of the first resin 4, even if the laser light is irradiated to portions other than the first resin 4 (that is, the second resin 5) due to a manufacturing error or the like. Since the said part transmits light, it can suppress that parts other than 1st resin 4 are roughened. As a result, the pattern accuracy of the metal wires 2 to be plated is improved, and a short circuit between the metal wires 2 can be further suppressed. Furthermore, it is also possible to irradiate the entire resin part 3 with ordinary light emitted from a lamp or the like without being limited to laser light. As a result, drawing with a laser beam is not necessary, and the manufacture of the three-dimensional circuit component 1 is further facilitated. And in this embodiment, since the resin component 3 was formed by the three-dimensional modeling method, the complicated resin component 3 can be manufactured easily. Moreover, the laser irradiator 18 which irradiates light can be mounted in the three-dimensional modeling apparatus 8 which performs a three-dimensional modeling method, and simplification of a manufacturing apparatus is attained.

  By the way, in the first embodiment described above, the resin component 3 which is the base material of the three-dimensional circuit component 1 is formed of two resins (light absorbing resins) having different light absorptivity, but it is not limited thereto . It can also be formed of three or more resins (light absorbing resins) different in light absorptivity. In this case, one of these resins has the highest light absorptivity for at least a predetermined light (for example, a lamp light including various wavelengths other than laser light such as YAG laser and ruby laser). The surface of the one resin is roughened, the catalyst 21 is fixed to the roughened portion, and plating is performed. That is, in the light irradiation step, the predetermined light is irradiated to one resin (corresponding to the first resin in the present invention) which absorbs the predetermined light or absorbs the predetermined light more easily than the other resin. The surface of the resin is roughened. Then, after the catalyst 21 is fixed to the roughened portion in the catalyst fixing step, the plating process is performed in the plating step. In short, the resin component 3 may be made of two or more resins having different light absorptivity, and the light to be irradiated may be a predetermined light which is absorbed by the resin to be subjected to the plating process among these resins. If it is The two or more resins having different light absorptivity may be the same type of resin or different types of resin. In the case of the same kind of resin, or even in the case of different kinds of resins, when the light absorptivity is approximately the same, for example, the resin can be colored by containing a pigment or the like to make the light absorptivity different. Furthermore, although the second resin 5 is formed to be transparent and the first resin 4 is colored in the first embodiment described above, the present invention is not limited thereto. The color of each resin may be any color as long as the light absorptivity of each of the resins constituting the resin component 3 is different and only the surface of one of the resins can be roughened by light irradiation.

  In the first embodiment described above, although the surface of the resin of the first resin 4 is roughened by light irradiation, the present invention is not limited thereto. For example, a resin in which a metal polymer additive is kneaded may be used as the first resin, and metal nuclei may be formed on the surface by irradiating a laser beam. In this case, the plating process is applied to the portion where the metal core is formed on the surface. That is, if the resin that absorbs the predetermined light can be irradiated with the predetermined light so that the surface of the resin can be reformed so as to be easily subjected to the plating process as compared with other portions, the surface is simply roughened. It is not limited to.

  Furthermore, in the above-described first embodiment, the catalyst 21 is fixed on the surface of the first resin 4 irradiated with light in the resin part 3 in the catalyst fixing step, but the invention is not limited thereto. The catalyst 21 can also be applied to the entire surface of each surface of the resin component 3. For example, in the second embodiment, after the catalyst 21 is supplied to the entire surface of each surface of the resin component 3 and plating is performed, unnecessary metal is peeled off. Specifically, description will be made with reference to FIGS. 7 to 10. FIG. 7 is a flowchart for explaining the method of manufacturing the three-dimensional circuit component 1 according to the second embodiment. FIG. 8 to FIG. 10 are schematic views explaining each process in the second embodiment.

  First, the resin component 3 in which the surface of the first resin 4 is roughened is manufactured through the forming step (step S11) and the light irradiation step (step S12). The forming step and the light irradiation step are the same as those in the first embodiment described above, and thus the description thereof is omitted. Next, as shown in FIG. 8, in the catalyst fixing step, the catalyst 21 is applied to the entire surface of each surface of the resin part 3 (step S13). For example, a catalyst solution in which the catalyst 21 is dissolved or dispersed in a solvent by a method such as dip coating or spray coating is applied to the entire surface of each surface of the resin component 3 and then dried. Next, in the plating step, the surface of the resin part 3 is plated as in the first embodiment described above (step S14). Here, in the present embodiment, since the catalyst 21 is applied to the entire surface of each surface of the resin component 3, as shown in FIG. 9, the metal layer 22 is formed on the entire surface of each surface of the resin component 3. . However, the area other than the first resin 4 (that is, the surface of the second resin 5) is not roughened, so the adhesion of the metal layer 22 is weak and the metal layer 22 is easily peeled off. On the other hand, since the surface of the first resin 4 is roughened, the adhesion of the metal layer 22 is improved by the anchor effect, and the metal layer 22 is firmly fixed.

  In this state, the process proceeds to the peeling step (step S15). In the peeling step, for example, as shown in FIG. 10, a peeling member 23 such as a tape having an adhesive surface is attached to one surface of the resin component 3 and peeled off. Thereby, the metal layer 22 formed on the surface of the second resin 5 is attached to the adhesive surface of the peeling member 23, and the metal layer 22 is peeled from the surface of the resin component 3. On the other hand, since the metal layer 22 formed on the surface of the first resin 4 is firmly fixed to the surface, it is not peeled off. That is, the metal layer 22 remains on the surface of the first resin 4 and becomes the metal wiring 2. By performing peeling by such a peeling member 23 on each surface of the resin component 3, a three-dimensional circuit fixture as shown in FIG. 1 is formed. The other configurations and the like are the same as those of the first embodiment described above, and thus the description thereof is omitted.

  In the first embodiment described above, as a method of forming the resin component 3, the resin 4 ′ to be the melted first resin 4 and the resin 5 ′ to be the second resin 5 are extruded from the nozzle 11 and the stage 10 Although the three-dimensional modeling method to laminate on top was adopted, it is not restricted to this. Other three-dimensional modeling methods of laminating resins to produce three-dimensional shapes can also be employed. For example, a method in which a liquid photocurable resin is jetted from the nozzle 11 and light is irradiated to cure the photocurable resin, or a method in which powder resin is spread and then sintered using a laser or a discharge etc. Various methods can be adopted. Furthermore, a two-color molding method may be employed as in the third embodiment shown in FIGS. 11 and 12 without being limited to the three-dimensional modeling method. 11 and 12 are schematic views for explaining the two-color molding method according to the third embodiment.

  Specifically, in the forming step in the third embodiment, as shown in FIG. 11, the primary mold 25 is disposed on the common mold 24 and the two are put together from the gate 26 of the primary mold 25. The resin 5 'to be the melted second resin 5 is injected. Thereby, the resin 5 ′ to be the second resin 5 melted in the common mold 24 and the primary mold 25 is filled. Then, after the mold opening is performed through a cooling process, as shown in FIG. 12, with the second resin 5 produced by the primary mold 25 left on the common mold 24, the common mold 24 is concerned. The secondary mold 27 is placed on top. Then, in a state where the common mold 24 and the secondary mold 27 are combined, the molten resin 4 'to be the first resin 4 is injected from the gate 28 of the secondary mold 27. As a result, the second resin 5 produced by the primary mold 25 is filled with the resin 4 'to be the first resin 4 melted. Then, the resin part 3 which consists of the 1st resin 4 and the 2nd resin 5 can be produced by performing a mold opening by passing through a cooling process again. In addition, when resin parts consist of 3 or more resin, the metal mold | die according to the number of the said resin is prepared, and injection molding is performed using each metal mold | type one by one as mentioned above. That is, resin parts 3 composed of three or more resins can be formed by a multicolor molding method in which three or more resins are sequentially injected and molded in a mold. In addition, since the other configurations and the like are the same as those of the first embodiment described above, the description will be omitted.

  By the way, in the above, although the manufacturing method of the three-dimensional circuit component 1 was mentioned as an example and demonstrated as a manufacturing method of a modeling thing, this invention is applicable also to the manufacturing method of another modeling thing. For example, the present invention can be applied to a method of manufacturing a wiring component having a wiring on the surface of a resin component, a method of manufacturing an electronic component including the wiring component, and the like. Also in these cases, the degree of freedom in selecting the resin to be the base material can be secured, so that the optimum resin can be selected according to the respective characteristics of the electronic component or the wiring component. Further, the present invention is not limited to the production of electronic components, and can be applied to the production of a case, a case, and the like of electronic components such as a printer, a game machine, and a mobile phone. Furthermore, in addition to these, the present invention can be applied to the manufacture of accessories such as frames of glasses, cases of watches, pendants and the like. That is, this invention is applicable to the manufacturing method of the various shaped article which performs a plating process.

  DESCRIPTION OF SYMBOLS 1 ... Three-dimensional circuit components, 2 ... Metal wiring, 3 ... Resin parts, 4 ... 1st resin, 5 ... 2nd resin, 8 ... Three-dimensional modeling apparatus, 9 ... Casing, 10 ... Stage, 11 ... Nozzle, 12: Head unit, 13: Carriage, 14: Carriage moving mechanism, 15: Reel resin, 18: Laser irradiator, 19: Dispenser, 21: Catalyst, 22: Metal layer, 23: Peeling member, 24: Common mold , 25 ... primary mold, 26 ... gate, 27 ... secondary mold, 28 ... gate

Claims (9)

Forming a first part including two or more light absorbing resins having different light absorptivity;
A light irradiation step of irradiating the first light of the light absorbing resin which absorbs the predetermined light;
A catalyst fixing step of supplying and fixing a catalyst to the surface of the first resin of the light absorbing resin;
A plating step of plating a portion of the light absorbing resin to which the catalyst is fixed;
A method of producing a shaped article, comprising:   The method according to claim 1, wherein in the forming step, the first component is formed by a three-dimensional modeling method in which a light absorbing resin is laminated to prepare a three-dimensional shape.   The method according to claim 1, wherein in the forming step, the first part is formed by a multicolor molding method in which two or more light absorbing resins are sequentially injected and molded in a mold. Method.   The method for producing a shaped article according to any one of claims 1 to 3, wherein the resin excluding the first resin of the light absorbing resin transmits light.   The said light irradiation process modify | reforms the surface of said 1st resin, The manufacturing method of the molded article as described in any one of the Claims 1-4 characterized by the above-mentioned.   The method for producing a shaped article according to claim 5, wherein the modification is roughening of a surface of the first resin. A method of manufacturing an electronic component, wherein the first component is a base material,
A method of manufacturing an electronic component, wherein the method of manufacturing a shaped article according to any one of claims 1 to 6 is applied. A method of manufacturing a wiring component having a wiring on the surface of the first component, the method comprising the steps of:
A method of manufacturing a wiring component to which the method of manufacturing an electronic component according to claim 7 is applied. A method of manufacturing a three-dimensional circuit component, wherein the wiring is provided on two or more intersecting surfaces of the surfaces of the first component.
A method of manufacturing a three-dimensional circuit component to which the method of manufacturing a wiring component according to claim 8 is applied.

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