JP2019033269A - Purge nozzle unit, load port, and stocker - Google Patents

Abstract

To provide a purge nozzle unit that takes into consideration the possibility of wear and damage of a nozzle due to aged deterioration or the like while adopting a bottom purge method capable of performing a purge process with a high arrival concentration of a predetermined gas atmosphere.SOLUTION: A purge nozzle unit 1 capable of replacing a gas atmosphere in a purge target container with a purge gas via a port includes a nozzle having a flow path through which the purge gas can pass and a holder 3 that holds the nozzle in a vertically movable state. The nozzle has a nozzle head portion 5 that contacts the port when moving upward and a main body portion that is provided on the side opposite to the port side of the nozzle head portion. The nozzle head portion is provided so as to be exchangeable with respect to the main body portion.SELECTED DRAWING: Figure 2

Description

  The present invention relates to a purge nozzle unit that performs a purge process on a purge target container having a purge target space, a purge device including the purge nozzle unit, and a load port.

  In the semiconductor manufacturing process, wafers are processed in a clean room in order to improve yield and quality. In recent years, as an alternative to improving the cleanliness of the entire clean room, the “mini-environment method”, which improves the cleanliness of only the local space around the wafer, has been introduced. It has been adopted. In the mini-environment method, a storage container called FOUP (Front-Opening Unified Pod) for transporting and storing wafers in a highly clean environment and the wafers in the FOUP are transferred to and from the semiconductor manufacturing equipment. A load port (Load Port), which is a device of an interface unit that exchanges FOUP with a device, is used as an important device.

  By the way, the inside of the semiconductor manufacturing apparatus is maintained in a predetermined gas atmosphere suitable for wafer processing or processing. However, when the wafer is sent from the FOUP into the semiconductor manufacturing apparatus, the internal space of the FOUP and the inside of the semiconductor manufacturing apparatus. The space communicates with each other. Therefore, if the environment in the FOUP is less clean than in the semiconductor manufacturing apparatus, the gas in the FOUP may enter the semiconductor manufacturing apparatus and adversely affect the gas atmosphere in the semiconductor manufacturing apparatus. In addition, when the wafer is accommodated in the FOUP from the semiconductor manufacturing apparatus, there is a problem that an oxide film can be formed on the surface of the wafer by moisture, oxygen, or other gas in the gas atmosphere in the FOUP.

  As a technique for coping with such a problem, Patent Document 1 discloses that the FOUP door is opened at the door portion of the load port, and the internal space of the FOUP communicates with the internal space of the semiconductor manufacturing apparatus. There is disclosed a load port including a purge device that blows a predetermined gas (for example, nitrogen or inert gas) into a FOUP by a purge unit (purge nozzle) provided on the semiconductor manufacturing apparatus side with respect to the opening.

  However, a predetermined gas is injected from the front side (semiconductor manufacturing apparatus side) into the FOUP opened to the internal space of the semiconductor manufacturing apparatus through such a carry-in / out port, and the inside of the FOUP is replaced with a predetermined gas atmosphere. A so-called front purge type purge apparatus performs a purging process in a state where the opening of the FOUP is opened and the internal space of the FOUP is in direct communication with the entire internal space of the semiconductor manufacturing apparatus. It was difficult to maintain the concentration, and there was a demerit that the concentration reached in a predetermined gas atmosphere was low.

  On the other hand, in Patent Document 2, a predetermined gas (for example, nitrogen or inert gas) is injected into the FOUP from the bottom side of the FOUP while the FOUP containing the wafer is placed on the loading table. A load port having a purge device that is filled to replace the inside of a FOUP with a predetermined gas atmosphere is disclosed. The so-called bottom purge method, in which a gas such as nitrogen or dry air is injected into the FOUP from the bottom side of the FOUP and the inside of the FOUP is replaced with a predetermined gas atmosphere, is compared with a front purge type purge device. There is an advantage that the ultimate concentration of the gas atmosphere is high.

  By the way, when the bottom purge method is employed, if the purge nozzle always protrudes upward from the upward surface of the mounting table, when the FOUP is mounted on the mounting table, the FOUP is moved by the positioning pins on the mounting table. Before the positioning, the purge nozzle may hit a part of the FOUP or be easily caught, and the FOUP may not be placed at the intended position.

  In particular, the FOUP is mounted on the mounting table from above the load port via a transport device such as OHT (Overhead Hoist Transfer). However, the above-mentioned problem is likely to occur due to the FOUP shaking during the transport or mounting. In addition to the above, there is a resin member provided on the bottom surface of the FOUP, and the injection portion (purging port) that comes into contact (contact) with the purge nozzle at the time of the purge process is the process before the purge process. When the FOUP is mounted on the mounting table, there is a possibility that it will be worn by rubbing against the purge nozzle.

  Therefore, in Patent Document 2, with the positioning pin on the mounting table engaged with the positioning groove provided on the bottom surface of the FOUP, the nozzle is driven so as to contact the purge port formed on the bottom surface of the FOUP. A purge device with a drive is disclosed.

  In Patent Document 2, as a specific example of the drive unit, a pair of left and right air cylinders respectively attached to both sides of a nozzle holder that holds a nozzle, and working ends of each air cylinder are connected to both ends, and a central part And a common lifting plate to which the nozzle is attached, and a mode in which each air cylinder is driven synchronously to move the lifting plate up and down is disclosed.

  However, with such an embodiment, air cylinders must be attached to both sides of the nozzle holder, and at least the plane dimension is larger than the plane dimension of the nozzle holder, and it is difficult to achieve compactness. In addition, if the pair of left and right air cylinders are not driven synchronously, it is assumed that the lifting operation of the lifting plate, the nozzle holder and the lifting movement of the nozzle accompanying the lifting operation of the lifting plate will be unstable or impossible to lift Is done.

  Such a problem may occur not only in the load port purge device but also in a purge device other than the load port, for example, a stocker purge device or a purge station purge device.

JP 2009-038074 A JP 2011-187539 A

  In the purge process, the purge nozzle comes into contact (contact) with the purge port. However, in the conventional configuration, it is not considered that the wear damage / deformation occurs depending on the aging deterioration and the use frequency.

  That is, the present invention relates to a purge nozzle unit that can replace a gas atmosphere in a purge target container with a purge gas made of either nitrogen or dry air through a port provided on the bottom surface of the purge target container. Here, the “purging target container” in the present invention includes all containers having a purging target space inside such as FOUP. "Purge gas" includes gases such as nitrogen, inert gas or dry air.

  The purge nozzle unit according to the present invention supplies the purge gas through a port provided on the bottom surface of the purge target container in which the substrate is accommodated, thereby changing the gas atmosphere in the purge target container to the purge gas. The purge nozzle unit is replaceable, and the purge nozzle unit includes a nozzle having a flow path through which the purge gas can pass, and a holder that holds the nozzle in a state where the nozzle can be raised and lowered. A nozzle head that contacts the port when moved, and a main body provided on a side opposite to the port side of the nozzle head, wherein the nozzle head is provided to be replaceable with respect to the main body. It is characterized by being able to.

   Also, the load port of the present invention is provided adjacent to the semiconductor manufacturing apparatus in the clean room, receives the FOUP that is the container to be purged, and transfers the wafers stored in the FOUP into the semiconductor manufacturing apparatus and the FOUP. And a purge nozzle unit having the above-described configuration. The purge nozzle unit is provided in the front and rear of the FOUP.

  The stocker of the present invention stores a purge target container, and is provided with the purge nozzle unit described above.

  According to the present invention, even if the purge nozzle is worn or damaged or deformed according to aging or frequency of use, the nozzle head is replaced with a new nozzle head or worn or deformed. By replacing with another nozzle head that is not provided, it is possible to provide a purge nozzle unit, a load port, and a stocker that can ensure a good contact state that ensures high airtightness with the port.

1 is an overall configuration diagram of a load port according to an embodiment of the present invention. The top view of the purge nozzle unit which concerns on the same embodiment. The x direction arrow line view of FIG. 2 of the purge nozzle unit which has a nozzle main body in a standby position in the embodiment. The x direction arrow directional view of FIG. 2 of the purge nozzle unit which has a nozzle main body in a purge position in the same embodiment. FIG. 3 is a cross-sectional view taken along the line yy of FIG. 2 of the purge nozzle unit in which the nozzle body is in the standby position in the same embodiment. FIG. 3 is a cross-sectional view taken along line yy of FIG. 2 of the purge nozzle unit in which the nozzle body is in the purge position in the same embodiment. The whole block diagram of the load port concerning other embodiments of the present invention. The top view of the purge nozzle unit which concerns on the same embodiment. FIG. 9 is an arrow view in the x direction of FIG. 8 of the purge nozzle unit in which the nozzle body is in the standby position in the same embodiment. FIG. 9 is a view in the direction of the arrow x in FIG. 8 of the purge nozzle unit in which the nozzle body is in the purge position in the same embodiment. FIG. 9 is a sectional view taken along line yy of FIG. 8 of the purge nozzle unit in which the nozzle body is in the standby position in the same embodiment. FIG. 9 is a cross-sectional view taken along line yy of FIG. 8 of the purge nozzle unit in which the nozzle body is in the purge position in the same embodiment.

  Hereinafter, an embodiment of the present invention will be described with reference to the drawings.

  The purge nozzle unit 1 according to the present embodiment can be attached to, for example, a purge device P applied to the load port X shown in FIG. The load port X is used in a semiconductor manufacturing process and is disposed adjacent to a semiconductor manufacturing apparatus (not shown) in a clean room. The load port X is a door portion of a door of a FOUP 100 which is an example of a purge target container according to the present invention. A wafer (not shown), which is an object to be accommodated in the FOUP 100, is taken in and out of the semiconductor manufacturing apparatus by opening and closing D in close contact.

  The FOUP 100 applied in the present embodiment accommodates a plurality of wafers inside, and is configured so that these wafers can be taken in and out through a carry-in / out opening formed on the front surface, and has a door that can open and close the carry-in / out entrance. Therefore, detailed description is omitted. In the present embodiment, the front surface of the FOUP 100 means a surface on the side facing the door portion D of the load port X when placed on the load port X. On the bottom surface of the FOUP 100, a purge port 101 is provided at a predetermined location as shown in FIG. The port 101 mainly includes, for example, a hollow cylindrical grommet seal fitted in an opening 102 formed on the bottom surface of the FOUP 100, and a gas such as nitrogen, inert gas, or dry air (this is described later) in the grommet seal. In the embodiment, nitrogen gas is used, and a valve (not shown) that switches from a closed state to an open state by an injection pressure or a discharge pressure of “which may be referred to as“ purge gas ”in the following description” is provided.

  The semiconductor manufacturing apparatus includes, for example, a semiconductor manufacturing apparatus main body that is disposed relatively far from the load port X, and a transfer chamber that is disposed between the semiconductor manufacturing apparatus main body and the load port X. In the transfer chamber, for example, a transfer machine is provided for transferring wafers in the FOUP 100 one by one between the FOUP 100 and the transfer chamber, and between the transfer chamber and the semiconductor manufacturing apparatus main body. In addition, it is also possible to transfer the cassette in which a plurality of wafers are stored between the FOUP 100 and the semiconductor manufacturing apparatus (semiconductor manufacturing apparatus main body and transfer chamber). With such a configuration, in the clean room, the inside of the semiconductor manufacturing apparatus main body, the transfer chamber, and the inside of the FOUP 100 are maintained with high cleanliness, while the space in which the load port X is arranged, in other words, the outside of the semiconductor manufacturing apparatus main body and the outside of the transfer chamber. , And outside the FOUP 100 is relatively low cleanliness.

  As shown in FIG. 1, the load port X is arranged in a standing posture and has a frame F having a door portion D capable of opening and closing an opening that can communicate with the carry-in / out port of the FOUP 100, and the frame F is away from the semiconductor manufacturing apparatus. And a purge device P that can inject a purge gas into the FOUP 100 and replace the gas atmosphere in the FOUP 100 with a purge gas such as nitrogen gas. .

  The door part D provided on the frame F has an open position where the door is opened and the carry-in / out opening is opened in close contact with a door (not shown) provided on the front surface of the FOUP 100 in a state where the FOUP 100 is placed on the mounting table B. It is operable between a closing position for closing the carry-in / out port. As the door elevating mechanism (not shown) that moves the door portion D up and down at least between the open position and the closed position, a known one can be applied.

  The mounting table B is arranged in a substantially horizontal posture at a position slightly above the center in the height direction of the frame F, and has a plurality of positioning protrusions B1 (kinematic pins) protruding upward. . The positioning projection B1 is engaged with a positioning recess (not shown) formed on the bottom surface of the FOUP 100, thereby positioning the FOUP 100 on the mounting table B. As an example of the positioning projection B1, the upper portion that contacts the V-shaped positioning concave portion formed by facing the inclined wall surface facing downward is curved, and the upper curved surface can be in good contact with each inclined wall surface of the positioning recess. The aspect comprised in can be mentioned. The mounting table B is provided with a seating sensor B2 that detects whether or not the FOUP 100 is mounted on the mounting table B at a predetermined position. The structure and arrangement location of the positioning projection B1 and the seating sensor B2 can be set and changed as appropriate according to the standard. As the mounting table B, the FOUP 100 in the mounting state is located at a position where the carry-in / out entrance (door) is closest to the opening (door D) of the frame F and at a predetermined distance from the opening (door D). It is also possible to apply a device provided with a moving mechanism for moving between the two.

  The purge device P includes a plurality of purge nozzle units 1 arranged at predetermined positions with the upper end portion exposed on the mounting table B, and the plurality of purge nozzle units 1 are used for injecting a purge gas. It functions as a purge nozzle unit or a discharge purge nozzle unit that discharges the gas atmosphere in the FOUP 100. The ratio of the injection purge nozzle unit and the discharge purge nozzle unit in the total number of injection purge nozzle units may be the same, or one of them may be larger than the other.

  The plurality of purge nozzle units 1 can be attached to appropriate positions on the mounting table B according to the position of the port 101 provided on the bottom surface of the FOUP 100. Each purge nozzle unit 1 (purge nozzle unit for injection, purge nozzle unit for discharge) has a valve function that regulates the backflow of gas, and can contact a port 101 provided at the bottom of the FOUP 100. Of the plurality of ports 101 provided at the bottom of the FOUP 100, the port 101 that contacts the purge nozzle unit for injection functions as an injection port, and the port 101 that contacts the purge nozzle unit for discharge functions as a discharge port. .

  Each purge nozzle unit 1 is shown in FIGS. 2 to 6 (FIG. 2 is a plan view of the purge nozzle unit 1, FIGS. 3 and 4 are views in the direction of the arrow x in FIG. 2, and FIGS. 5 and 6 are y- As shown in the y-line sectional view), the nozzle body 2 and the nozzle body 2 are held in a state where they can be raised and lowered (more specifically, the body portion (first flow path forming member) 4 constituting the nozzle body 2). And a holder 3 for holding).

  The nozzle body 2 includes a cylindrical body portion 41 and a main body portion (first flow path forming member) 4 mainly composed of a large-diameter cylindrical portion 42 having an outer diameter larger than that of the body portion 41, and an upper end portion of the main body portion 4. A nozzle head portion 5 that can be attached and a nozzle bottom portion (second flow path forming member) 6 that can be attached to the lower end portion of the main body portion 4 are provided.

  A concave portion 43 for attaching the nozzle head 5 is formed on the upper end portion of the main body portion 4 (upward surface of the large-diameter cylindrical portion 42). Further, a ring-shaped recess 44 for attaching a seal member 7 that comes into contact with a side wall 31 of the holder 3 described later is formed on the outer surface of the large-diameter cylindrical portion 42. In the present embodiment, a small-diameter cylindrical portion 45 having an outer diameter smaller than that of the trunk portion 41 is provided at the lower end portion of the trunk portion 41, and the nozzle bottom portion 6 can be fitted into the small-diameter cylindrical portion 45 so that the nozzle bottom portion 6 can be attached. It is composed. A purge gas flow path (first flow path) 46 penetrating in the height direction is formed in the axial center portion of the main body 4. The main body part 4 of the present embodiment is made of metal having these parts integrally.

  The nozzle head 5 is fitted to the head main body 51 having the same outer diameter as the large-diameter cylindrical portion 42 of the main body 4 and the recess 43 of the main body 4 protruding downward from the lower end of the head main body 51. A fitting projection 52 capable of (press-fitting) and a port contact portion 53 provided on the upward surface of the head body 51 and capable of contacting the port 101 (injection port, discharge port) are provided. In the present embodiment, the port contact portion 53 is configured by a ring-shaped upward projecting portion that projects upward from the upward surface of the head body 51. A head-side purge gas flow path 54 that penetrates in the height direction and communicates with the purge gas flow path 46 of the main body 4 is formed in the axial center portion of the nozzle head 5. The nozzle head 5 of this embodiment is made of metal having these parts integrally.

  And in the state which fitted the fitting protrusion 52 of the nozzle head part 5 to the recessed part 43 of the main-body part 4, and assembled | attached both members integrally, the large diameter cylindrical part 42 of the main-body part 4, and a nozzle head 5 head bodies 51 form an outer surface (outward surface) that smoothly continues in the height direction. The large-diameter cylindrical portion 42 of the main body portion 4 and the head main body 51 of the nozzle head portion 5 are portions corresponding to the flange portion 8 of the present invention.

  The nozzle bottom portion 6 has a bottomed rectangular tube shape in which a fitting recess 61 that can be fitted to the small-diameter tubular portion 45 of the main body portion 4 is formed on the upward surface, and is connected to a purge gas supply source (not shown). A pipe mounting recess 62 to which a flexible pipe can be mounted, and a bottom side purge gas that communicates with the internal space of the pipe that is mounted on the pipe mounting recess 62 and that communicates with the purge gas flow path 46 of the main body 4. A flow path (second flow path) 63 is provided. In the state where the fitting concave portion 61 of the nozzle bottom portion 6 is fitted to the small-diameter cylindrical portion 45 of the main body portion 4 and both members are assembled together, the width dimension of the nozzle bottom portion 6 is the trunk portion 41 of the main body portion 4. It is set to be larger than the outer diameter.

  The holder 3 protrudes inwardly (center side) from the side wall 31 to which the outward surface (outer peripheral surface) of the flange portion 8 of the nozzle body 2 contacts, and only the body portion 41 of the nozzle body 2 protrudes inward (center side). A fixing portion 36 mainly including a holder main body 34 having a bottom wall 33 formed with a through-hole 32 through which can be inserted, protrudes laterally from the holder main body 34 and has a screw insertion hole 35 at a predetermined position. I have. In the present embodiment, the upper side region of the side wall 31 is set in a cylindrical shape, and the other region is set in a rectangular tube shape. A vent hole 30 communicating with the outside is formed in a part of the side wall 31 of the holder 3. Further, the opening diameter of the through hole 32 formed in the bottom wall 33 is set to a size with which the outward surface of the body portion 41 of the nozzle body 2 is attached. On the inward surface of the through hole 32, a ring-shaped recess 37 for attaching the seal member 7 that contacts the body 41 of the nozzle body 2 is formed.

  In order to hold the nozzle body 2 in such a holder 3 in an inseparable manner, the main body part 4 is inserted into the holder 3 from above the holder 3 in a state where the nozzle bottom part 6 is not assembled to the small diameter cylindrical part 45 of the main body part 4. It is only necessary to insert the small-diameter cylindrical portion 45 through the through-hole 32 of the bottom wall 33 and expose the holder 3 to the outside, and press-fit the fitting concave portion 61 of the nozzle bottom portion 6 into the small-diameter cylindrical portion 45. In this assembled state, it is possible to prevent the nozzle body 2 from coming off below or above the holder 3 when the flange portion 8 or the nozzle bottom portion 6 of the nozzle body 2 hits the bottom wall 33 of the holder 3. The operation of assembling the nozzle head 5 to the main body 4 of the nozzle main body 2 may be performed before the main body 4 is housed in the holder 3 or at any time after the housing. Good. Since the upward surface of the main body portion 4 (the upward surface of the large-diameter cylindrical portion 42) and the downward surface of the head body 51 are set to flat horizontal surfaces, in an attached state in which these horizontal surfaces are in contact with each other The port contact portion 53 (the upper end of the nozzle head 5) of the nozzle head 5 is also a flat horizontal surface.

  In the present embodiment, the purge nozzle unit 1 is constituted by the nozzle body 2 and the holder 3 assembled together.

  Further, the purge nozzle unit 1 according to the present embodiment uses gas (pressurized air) as a drive source for moving the nozzle body 2 up and down relative to the holder 3. Then, the gas is supplied into the pressure adjustment space S which is a space formed between the holder 3 and the nozzle body 2 and through which the gas can flow through the vent hole 30 formed in the side wall 31 of the holder 3. Alternatively, the pressure in the pressure adjustment space S is adjusted by discharging the gas in the pressure adjustment space S out of the pressure adjustment space S, and the nozzle body 2 is moved up and down relative to the holder 3.

  Specifically, the pressure adjustment space S is a space partitioned by the body portion 41 and the flange portion 8 of the nozzle body 2 and the side wall 31 and the bottom wall 33 of the holder 3. In the present embodiment, the seal member 7 is interposed between the flange portion 8 and the side wall 31 and between the trunk portion 41 and the bottom wall 33, thereby ensuring high airtightness of the pressure adjustment space S. .

  In the present embodiment, the pipe H is connected to the vent hole 30 formed in the side wall 31 of the holder 3, and the gas is injected into the pressure regulation space S through the pipe H and the vent hole 30. The operation of the switching unit V (for example, a solenoid valve (solenoid valve)) that can be switched between a pressurizing state for increasing the pressure and a negative pressure state for evacuating the pressure adjusting space S to lower the pressure in the pressure adjusting space S is controlled. Thus, the nozzle body 2 is configured to move up and down with respect to the holder 3. Note that a gas supply source V2 and a vacuum source V1 are connected to the switching unit V in parallel.

In the present embodiment, by adjusting the pressure in the pressure adjusting space S, the nozzle body 2 is moved to the position shown in FIGS. 3 and 5, that is, the upward surface of the nozzle body 2 (the upward surface of the nozzle head 5) and the holder. 3 and the standby position (a) where the port contact portion 53 does not contact the port 101 of the FOUP 100, and the positions shown in FIG. 4 and FIG. The upward surface of the nozzle body 2 (the upward surface of the nozzle head 5) is higher than the upward surface of the holder 3 (the upward surface of the side wall 31), and the port contact portion 53 of the nozzle body 2 is connected to the port 101 of the FOUP 100. It can be moved up and down between purge positions (b) that can be contacted. When the nozzle body 2 is moved up and down, the outward surface of the collar portion 8 of the nozzle body 2 is in sliding contact with the inward surface of the side wall 31 of the holder body 34, and the outward surface of the body portion 41 of the nozzle body 2 is The nozzle body 2 is configured to be in sliding contact with the inward surface of the through hole 32 formed in the bottom wall 33 so that the nozzle body 2 can be moved up and down smoothly and appropriately.

  The purge nozzle unit 1 according to the present embodiment described in detail above is attached to a plurality of predetermined locations (in the vicinity of the four corners of the mounting table B in the present embodiment) on the mounting table B of the load port X in a unitized state. It functions as a purge device P that can replace the gas atmosphere in the FOUP 100 mounted on the mounting table B with the purge gas. In addition, the mounting process of each purge nozzle unit 1 to the mounting table B is realized by fixing to an appropriate position of the mounting table B using a screw (not shown) inserted into a screw insertion hole 35 formed in the fixing part 36 of the holder 3. it can. In this fixed state, the upward surface of the holder 3 is set to be substantially the same level as the upward surface of the mounting table B.

  Next, the usage method and operation of the load port X in which the purge nozzle unit 1 having such a configuration is mounted on the mounting table B will be described.

  First, the FOUP 100 is transported to the load port X by a transport device such as OHT (not shown) and placed on the mounting table B. At this time, by setting the switching portion V to a negative pressure state, the nozzle body 2 can be positioned at the standby position (a), and the positioning projection B1 fits into and contacts the positioning recess of the FOUP 100. Thus, the FOUP 100 can be placed at a predetermined regular position on the placement table B. Further, it is detected by the seating sensor B2 that the FOUP 100 is placed at the normal position on the placement table B. At this time, since the nozzle body 2 is in the standby position (a), it does not contact the port 101. That is, the standby position (a) of the nozzle body 2 is the upper end (port contact portion 53) of the nozzle body 2 when the positioning projection B1 is engaged with the positioning recess and the FOUP 100 is mounted on the mounting table B. ) Is a position lower than the lower end of the port 101 provided in the FOUP 100.

  The load port X according to the present embodiment detects the normal seating state of the FOUP 100 by the seating sensor B2, and then switches the switching unit V from the negative pressure state to the pressurization state, thereby moving the nozzle body 2 to the standby position (a). To the purge position (b). That is, gas is injected into the pressure adjusting space S through the vent hole 30 formed in the side wall 31 of the holder 3 and the pipe H connected to the vent hole 30 to increase the pressure in the pressure adjusting space S, and the nozzle body 2 is moved. The holder 3 is moved upward.

  As a result, as shown in FIG. 6, the port contact portion 53 of the nozzle body 2 comes into contact with the lower end of the port 101, the internal space 103 of the port 101, the head-side purge gas flow path 54 of the nozzle body 2, and the purge The gas flow path 46 and the bottom side purge gas flow path 63 communicate with each other. In this state, the load port X of the present embodiment uses the purge gas supplied from a supply source (not shown) as the internal space of the pipe, the bottom side purge gas channel 63, the purge gas channel 46, and the head side. The gas is filled into the FOUP 100 through the purge gas flow path 54 and the internal space 103 of the port 101, and the gas filled in the FOUP 100 is discharged out of the FOUP 100 through the discharge port and the discharge purge nozzle unit. Note that the discharge process may be started prior to the injection process, and the injection process may be performed in a state where the air in the FOUP 100 is discharged to some extent outside the FOUP 100 and the pressure inside the FOUP 100 is reduced.

  After performing the purge process as described above or during the purge process, the load port X of the present embodiment passes the wafer in the FOUP 100 into the semiconductor manufacturing apparatus through the loading / unloading port of the FOUP 100 communicating with the opening of the frame F. Pay out sequentially. The wafer transferred into the semiconductor manufacturing apparatus is subsequently subjected to a semiconductor manufacturing processing step by the semiconductor manufacturing apparatus main body. Wafers for which the semiconductor manufacturing process has been completed by the semiconductor manufacturing apparatus main body are sequentially stored in the FOUP 100.

  In the load port X of this embodiment, the bottom purge process by the purge device P can be continuously performed even when the wafer is taken in and out, and the gas atmosphere in the FOUP 100 is used for purging nitrogen gas or the like while the wafer is taken in or out. It can be kept at a high concentration by continuing to be replaced with gas.

  When all the wafers have been processed in the semiconductor manufacturing process and are stored in the FOUP 100, the door portion D is moved from the open position to the closed position in a state of being in close contact with the door of the FOUP 100. As a result, the opening of the load port X and the carry-in / out port of the FOUP 100 are closed. Subsequently, the FOUP 100 mounted on the mounting table B is carried out to the next process by a transport mechanism (not shown). If necessary, the bottom purge process may be performed again on the FOUP 100 containing the wafer that has undergone the semiconductor manufacturing process. In this way, the purge process can be started immediately on the FOUP 100 in which the wafer that has undergone the semiconductor manufacturing process is stored, and the processed wafer can be prevented from being oxidized.

  As described in detail above, the load port X according to the present embodiment can maintain the purge gas filling degree (substitution degree) in the FOUP 100 at a high value by the bottom purge process by the purge device P.

  In addition, among the plurality of wafers accommodated in the common FOUP 100, the wafer that is first completed in the semiconductor manufacturing process and accommodated in the FOUP 100 is the wafer that is finally subjected to the semiconductor manufacturing process is accommodated in the FOUP 100. Until normally, exposure to a gas atmosphere in which the filling degree (substitution degree) of the purge gas decreases in the FOUP 100 with the passage of the wafer loading / unloading operation time may cause a slight adverse effect. By injecting the purge gas into the FOUP 100, a decrease in the purge gas filling degree (substitution degree) in the FOUP 100 can be effectively suppressed, and the wafer is stored in the FOUP 100 in a good state. Can do.

  In addition, when the FOUP 100 storing the wafer after the completion of the semiconductor manufacturing process is delivered to the transport mechanism or at a predetermined timing after delivery, the switching unit V is switched from the pressurized state to the negative pressure state, and the nozzle The main body 2 is moved downward from the purge position (b) to the standby position (a). That is, the pressure adjusting space S is evacuated through the vent hole 30 formed in the side wall 31 of the holder 3 and the pipe H connected to the vent hole 30 to reduce the pressure in the pressure adjusting space S, and the nozzle body 2 is held in the holder. 3 is moved downward. As a result, it is possible to prevent the nozzle body 2 from interfering with the downward surface of the FOUP 100 when receiving the FOUP 100 storing unprocessed wafers on the mounting table B from the transport mechanism.

  Thus, the purge nozzle unit 1 of this embodiment formed by unitizing two parts of the nozzle body 2 and the holder 3 is configured so that the pressure in the pressure adjustment space S formed between the nozzle body 2 and the holder 3 is The nozzle body 2 is configured to move up and down with respect to the holder 3 by adjusting through the vent hole 30 formed in the side wall 31 of the holder 3. That is, the purge nozzle unit 1 of the present embodiment realizes the lifting and lowering operation of the nozzle body 2 by operating the nozzle body 2 as a piston (cylinder shaft) when the holder 3 is regarded as a cylinder. In addition to these two parts, there is no need to provide a separate mechanism for moving the nozzle body 2 up and down, and not only can the number of parts and costs be reduced, but also the purge nozzle unit 1 can be made compact as a whole. Can do.

  Further, in the purge nozzle unit 1 according to the present embodiment, the outward surface of the flange portion 8 of the nozzle body 2 is in contact with the inward surface of the side wall 31 of the holder 3 and the outside of the body portion 41 of the nozzle body 2. Since the nozzle body 2 is moved up and down while the facing surface is in contact with the inward surface of the through hole 32 in the bottom wall 33 of the holder 3, the nozzle body 2 can be moved up and down smoothly and appropriately. It can be carried out.

  In addition, the purge nozzle unit 1 according to the present embodiment can easily perform an assembling operation by holding the nozzle body 2 on the holder 3 to form a unit, and, for example, by simultaneously expanding and contracting a plurality of cylinders, Compared with the mode in which the cylinder 2 is moved up and down, the control for expanding and contracting the cylinders at the same time is unnecessary, and the nozzle body 2 can be moved up and down with high accuracy by simple control for adjusting the pressure in the pressure adjustment space S. Reliability is obtained.

  In particular, the purge nozzle unit 1 according to the present embodiment forms one pressure adjustment space S between the holder 3 and the nozzle body 2, and puts the only pressure adjustment space S in a pressurized state through the vent hole 30. Since the nozzle body 2 is raised and the nozzle body 2 is lowered when the pressure adjusting space S is brought into a negative pressure state, the nozzle body 2 can be appropriately lifted and lowered with a simple structure. Can be secured.

  Next, regarding the purge nozzle unit A1 according to an embodiment different from the above-described embodiment (hereinafter referred to as the second embodiment, and the above-described embodiment is referred to as the first embodiment), FIG. 7 to FIG. The purge nozzle unit A1 will be described with reference to a plan view, FIGS. 9 and 10 are views taken in the direction of the arrow x in FIG. 8, and FIGS. 11 and 12 are sectional views taken along the line yy in FIG.

  As shown in FIGS. 8 to 12, each purge nozzle unit A1 according to the second embodiment includes a nozzle body A2 and a holder A3 that holds the nozzle body A2 in a liftable state. Here, as shown in FIGS. 11 and 12, the purge nozzle unit A1 of the present embodiment has two pressure adjustment spaces (lower side) partitioned in the height direction between the nozzle body A2 and the holder A3. Although it is different from the purge nozzle unit 1 according to the first embodiment in that it has a pressure adjustment space S1 and an upper pressure adjustment space S2), as shown in FIG. The point applicable to the port X is the same as that of the purge nozzle unit 1 according to the first embodiment.

  The nozzle body A2 includes a cylindrical body A41 and a body A4 mainly composed of a large-diameter cylindrical part A42 having an outer diameter larger than that of the body A41, and a nozzle head A5 that can be attached to the upper end of the body A4. And a nozzle bottom A6 that can be attached to the lower end of the main body A4.

  A concave portion A43 for attaching the nozzle head portion A5 is formed in the upper end portion of the main body portion A4 (the upward surface of the large diameter cylindrical portion A42). Further, a ring-shaped recess A44 for attaching a seal member A7 that comes into contact with a side wall A31 of the holder A3 described later is formed on the outer surface of the large-diameter cylindrical portion A42. In the present embodiment, a small-diameter cylindrical portion A45 whose outer diameter is set smaller than that of the trunk portion A41 is provided at the lower end portion of the trunk portion A41, and the nozzle bottom portion A6 is fitted to the small-diameter cylindrical portion A45 so that attachment is possible. It is composed. A purge gas flow path A46 penetrating in the height direction is formed in the axial center portion of the main body A4. Further, in the purge nozzle unit A1 of the present embodiment, as shown in FIGS. 11 and 12, a side protrusion A49 that protrudes laterally from a predetermined height position in the body part A41 of the nozzle body A2 is provided. A ring-shaped recess for attaching a seal member A7 that comes into contact with a side wall A31 of the holder A3 described later is formed on the outer surface of the side protrusion A49. The main body A4 of the present embodiment is made of metal having these parts integrally.

  The nozzle head A5 is fitted into a head main body A51 having the same outer diameter as the large-diameter cylindrical portion A42 of the main body A4 and a recess A43 of the main body A4 protruding downward from the lower end of the head main body A51. A fitting protrusion A52 capable of (press fitting) and a port contact portion A53 provided on the upward surface of the head main body A51 and capable of contacting the port 101 (injection port, discharge port) are provided. In the present embodiment, the port contact portion A53 is configured by a ring-shaped upward projecting portion that projects upward from the upward surface of the head body A51. A head-side purge gas flow path A54 that penetrates in the height direction and communicates with the purge gas flow path A46 of the main body A4 is formed in the axial center portion of the nozzle head A5. The nozzle head A5 of this embodiment is made of metal having these parts integrally.

  In the state where the fitting projection A52 of the nozzle head A5 is fitted into the recess A43 of the main body A4 and the two members are assembled together, the large-diameter cylindrical portion A42 of the main body A4 and the nozzle head The A5 head body A51 forms an outer surface (outward surface) that smoothly continues in the height direction. The large-diameter cylindrical portion A42 of the main body portion A4 and the head main body A51 of the nozzle head portion A5 are portions corresponding to the flange portion A8 of the present invention.

  The nozzle bottom portion A6 has a bottomed rectangular tube shape with a fitting recess A61 that can be fitted to the small-diameter tubular portion A45 of the main body portion A4 formed on the upward surface, and is connected to a purge gas supply source (not shown). A pipe mounting recess A62 to which a flexible pipe can be mounted, and a bottom side purge gas communicating with the internal space of the pipe mounted in the pipe mounting recess A62 and communicating with the purge gas flow path A46 of the main body A4 A flow path A63 is provided. In the state where the fitting concave portion A61 of the nozzle bottom portion A6 is fitted to the small diameter cylindrical portion A45 of the main body portion A4 and the two members are assembled together, the width dimension of the nozzle bottom portion A6 is the trunk portion A41 of the main body portion A4. It is set to be larger than the outer diameter.

  The holder A3 includes a side wall A31 where the outward surface (outer peripheral surface) of the flange A8 of the nozzle body A2 and the outward surface (outer peripheral surface) of the side protrusion A49 are in contact, and the inner side (center) from the lower end of the side wall A31. And a bottom wall A33 having a through hole A32 formed in the center portion through which only the body portion A41 of the nozzle body A2 can be inserted, and projecting sideways from the holder body A34. A fixing portion A36 having a screw insertion hole A35 formed at a predetermined location is provided. In the present embodiment, the upper side region of the side wall A31 is set in a cylindrical shape, and the other region is set in a rectangular tube shape. The side wall A31 of the holder A3 is formed with vent holes (lower vent hole A3a, upper vent hole A3b) communicating with the outside. In the present embodiment, two vent holes (lower vent A3a and upper vent A3b) are formed at different positions in the height direction. Further, the opening diameter of the through hole A32 formed in the bottom wall A33 is set to a size with which the outward surface of the body portion A41 of the nozzle body A2 comes into contact. On the inward surface of the through-hole A32, a ring-shaped recess A37 for attaching a seal member A7 that contacts the body A41 of the nozzle body A2 is formed.

  In order to hold the nozzle body A2 in such a holder A3 in an inseparable manner, the main body part A4 is inserted into the holder A3 from above the holder A3 without the nozzle bottom part A6 being assembled to the small diameter cylindrical part A45 of the main body part A4. The small-diameter cylindrical portion A45 may be exposed to the outside of the holder A3 through the through hole A32 of the bottom wall A33, and the fitting concave portion A61 of the nozzle bottom portion A6 may be press-fitted into the small-diameter cylindrical portion A45. In this assembled state, it is possible to prevent the nozzle body A2 from coming off below or above the holder A3 due to the side protrusion A49 or the nozzle bottom A6 of the nozzle body A2 hitting the bottom wall 33 of the holder A3. The operation of assembling the nozzle head A5 to the main body A4 of the nozzle main body A2 may be performed before the main body A4 is accommodated in the holder A3, or at any time after it is accommodated. Good. Since the upward surface of the main body A4 (the upward surface of the large-diameter cylindrical portion A42) and the downward surface of the head main body A51 are set to flat horizontal surfaces, these mounting surfaces are in contact with each other. The port contact portion A53 (the upper end of the nozzle head A5) of the nozzle head A5 is also a flat horizontal surface.

  In this embodiment, the purge nozzle unit A1 is constituted by the nozzle body A2 and the holder A3 assembled to each other. In the purge nozzle unit A1 according to the present embodiment, in the state where the nozzle body A2 is held by the holder A3, the outward surface (side surface) of the side protrusion A49 is the side wall A31 of the holder A3 in the same manner as the flange A8. It is configured to be attached to.

  Further, the purge nozzle unit A1 according to the present embodiment uses gas (pressurized air) as a drive source for moving the nozzle body A2 up and down relative to the holder A3. Gas flows through two air holes (an upper air hole A3b and a lower air hole A3a) formed in the side wall A31 of the holder A3, which is a space formed between the holder A3 and the nozzle body A2. The nozzle body A2 is configured to move up and down relative to the holder A3 by relatively changing the pressure in two pressure adjustment spaces (lower pressure adjustment space S1 and upper pressure adjustment space S2) that are possible spaces. ing.

  Specifically, the lower pressure adjustment space S1 is a space partitioned by the body A41 and the side protrusion A49 of the nozzle body A2 and the side wall A31 and the bottom wall 33 of the holder A3, and the upper pressure adjustment space. S2 is a space partitioned by the body A41, the flange A8, the side protrusion A49, and the side wall A31 of the holder A3 of the nozzle body A2. In the present embodiment, the seal member A7 is interposed between the flange A8 and the side wall A31, between the side protrusion A49 and the side wall A31, and between the trunk A41 and the bottom wall A33, respectively. High airtightness is secured in the pressure adjustment space (lower pressure adjustment space S1, upper pressure adjustment space S2).

  The purge nozzle unit A1 according to the present embodiment connects the individual pipes (lower pipe Ha, upper pipe Hb) to the respective vent holes (lower vent hole A3a, upper vent hole A3b). Gas is injected into the lower pressure adjustment space S1 through the side pipe Ha and the lower vent hole A3a, and at the same time, the gas in the upper pressure adjustment space S2 is released to the outside through the upper pipe Hb and the upper vent hole A3b. By doing so, the pressure in the lower pressure adjustment space S1 is made higher than the pressure in the upper pressure adjustment space S2 (first pressure adjustment state), and the upper pressure adjustment space through the upper pipe Hb and the upper vent hole A3b. At the same time as pressure injection of gas into S2, the gas in the lower pressure adjustment space S1 is released to the outside through the lower pipe Ha and the lower vent hole A3a. The nozzle body is controlled by controlling the operation of a switching unit AV (for example, a solenoid valve (solenoid valve)) that can be switched to a state (second pressure adjustment state) in which the force is higher than the pressure in the lower pressure adjustment space S1. A2 is configured to move up and down relative to the holder A3. Note that a gas supply source AV1 is connected to the switching unit AV.

  In the present embodiment, by setting the second pressure adjustment state, the nozzle body A2 is positioned as shown in FIGS. 9 and 11, that is, the upward surface of the nozzle body A2 (upward surface of the nozzle head A5) and the upward of the holder A3. The surface (upward surface of the side wall A31) is at substantially the same height position, and the port contact portion A53 can be positioned at the standby position (a) where it does not contact the port 101 of the FOUP 100. Further, by setting the first pressure adjustment state, the position of the nozzle body A2 shown in FIGS. 10 and 12, that is, the upward surface (the upward surface of the nozzle head A5) of the nozzle body A2 is the upward surface (side wall) of the holder A3. 31 can be positioned at a purge position (b) where the port contact portion A53 of the nozzle body A2 can contact the port 101 of the FOUP 100.

  When the nozzle body A2 is moved up and down, the outward surface of the flange A8 and the outward surface of the side protrusion A49 of the nozzle body A2 are in sliding contact with the inward surface of the side wall A31 of the holder body A34. The body A2 is configured such that the outward surface of the body A41 is in sliding contact with the inward surface of the through hole A32 formed in the bottom wall A33 so that the nozzle body A2 can be moved up and down smoothly and appropriately.

  The purge nozzle unit A1 according to this embodiment described in detail above is attached to a plurality of predetermined locations on the mounting table B of the load port X in the unitized state (in the vicinity of the four corners of the mounting table B in this embodiment). It functions as a purge device P that can replace the gas atmosphere in the FOUP 100 mounted on the mounting table B with the purge gas. Note that the mounting process of the purge nozzle unit A1 to the mounting table B can be realized by fixing the mounting table B to an appropriate position on the mounting table B using a screw (not shown) inserted into a screw insertion hole A35 formed in the fixing part A36 of the holder A3. . In this fixed state, the upward surface of the holder A3 is set to be substantially the same level as the upward surface of the mounting table B.

  Here, the purge apparatus P includes a plurality of purge nozzle units A1 arranged at predetermined positions with the upper end exposed on the mounting table B, and injects a purge gas into the plurality of purge nozzle units A1. The purge nozzle unit for injection and the purge nozzle unit for discharge for discharging the gas atmosphere in the FOUP 100 are used. The ratio of the injection purge nozzle unit and the discharge purge nozzle unit in the total number of injection purge nozzle units may be the same, or one of them may be larger than the other.

  The plurality of purge nozzle units A1 can be attached at appropriate positions on the mounting table B according to the position of the port 101 provided on the bottom surface of the FOUP 100. Each purge nozzle unit A1 (injection purge nozzle unit, discharge purge nozzle unit) has a valve function for regulating the backflow of gas. Of the plurality of ports 101 provided on the bottom of the FOUP 100, the port 101 that contacts the purge nozzle unit for injection functions as an injection port, and the port 101 that contacts the purge nozzle unit for discharge functions as a discharge port. .

  Next, the usage method and operation of the load port X in which the purge nozzle unit A1 having such a configuration is mounted on the mounting table B will be described.

  First, the FOUP 100 is transported to the load port X by a transport device such as OHT (not shown) and placed on the mounting table B. At this time, by setting the switching portion AV to the second pressure adjustment state, the nozzle body A2 can be positioned at the standby position (a), and the positioning projection B1 fits into the positioning recess of the FOUP 100 and makes contact. By doing so, the FOUP 100 can be placed at a predetermined regular position on the placement table B. Further, it is detected by the seating sensor B2 that the FOUP 100 is placed at the normal position on the placement table B. At this time, since the nozzle body A2 is at the standby position (a), it does not come into contact with the port 101. That is, the standby position (a) of the nozzle main body A2 is the upper end (port contact portion A53) of the nozzle main body A2 in a state where the positioning projection B1 is engaged with the positioning concave portion and the FOUP 100 is mounted on the mounting table B. ) Is a position lower than the lower end of the port 101 provided in the FOUP 100.

  The load port X according to the present embodiment detects the normal seating state of the FOUP 100 by the seating sensor B2, and then switches the switching unit AV from the second pressure adjustment state to the first pressure adjustment state, and waits for the nozzle body A2. The position is moved upward from the position (a) to the purge position (b). That is, gas is injected into the lower pressure adjustment space S1 through the lower vent hole A3a formed in the side wall 31 of the holder A3 and the lower pipe Ha connected to the lower vent hole A3a. The pressure in the pressure adjustment space S1 is increased, and the gas in the upper pressure adjustment space S2 is discharged to the outside through the upper vent hole A3b and the upper pipe Hb connected to the upper vent hole A3b. The nozzle body A2 is moved upward relative to the holder A3 by making the pressure in the pressure adjustment space S1 higher than the pressure in the upper pressure adjustment space S2.

  As a result, as shown in FIG. 12, the port contact portion A53 of the nozzle body A2 comes into contact with the lower end of the port 101, the internal space 103 of the port 101, the head side purge gas flow path A54 of the nozzle body A2, and the purge The gas passage A46 and the bottom-side purge gas passage A63 communicate with each other. In this state, the load port X of the present embodiment uses the purge gas supplied from a supply source (not shown) as the pipe internal space, the bottom-side purge gas channel A63, the purge gas channel A46, and the head side. The gas is filled into the FOUP 100 through the purge gas flow path A54 and the internal space 103 of the port 101, and the gas filled in the FOUP 100 is discharged out of the FOUP 100 through the discharge port and the discharge purge nozzle unit. Note that the discharge process may be started prior to the injection process, and the injection process may be performed in a state where the air in the FOUP 100 is discharged to some extent outside the FOUP 100 and the pressure inside the FOUP 100 is reduced.

  After performing the purge process as described above or during the purge process, the load port X of the present embodiment passes the wafer in the FOUP 100 into the semiconductor manufacturing apparatus through the loading / unloading port of the FOUP 100 communicating with the opening of the frame F. Pay out sequentially. The wafer transferred into the semiconductor manufacturing apparatus is subsequently subjected to a semiconductor manufacturing processing step by the semiconductor manufacturing apparatus main body. Wafers for which the semiconductor manufacturing process has been completed by the semiconductor manufacturing apparatus main body are sequentially stored in the FOUP 100.

  In the load port X of this embodiment, the bottom purge process by the purge device P can be continuously performed even when the wafer is taken in and out, and the gas atmosphere in the FOUP 100 is used for purging nitrogen gas or the like while the wafer is taken in or out. It can be kept at a high concentration by continuing to be replaced with gas.

  When all the wafers have been processed in the semiconductor manufacturing process and are stored in the FOUP 100, the door portion D is moved from the open position to the closed position in a state of being in close contact with the door of the FOUP 100. As a result, the opening of the load port X and the carry-in / out port of the FOUP 100 are closed. Subsequently, the FOUP 100 mounted on the mounting table B is carried out to the next process by a transport mechanism (not shown). If necessary, the bottom purge process may be performed again on the FOUP 100 containing the wafer that has undergone the semiconductor manufacturing process. In this way, the purge process can be started immediately on the FOUP 100 in which the wafer that has undergone the semiconductor manufacturing process is stored, and the processed wafer can be prevented from being oxidized.

  As described in detail above, the load port X according to the present embodiment can maintain the purge gas filling degree (substitution degree) in the FOUP 100 at a high value by the bottom purge process by the purge device Pb.

  In addition, among the plurality of wafers accommodated in the common FOUP 100, the wafer that is first completed in the semiconductor manufacturing process and accommodated in the FOUP 100 is the wafer that is finally subjected to the semiconductor manufacturing process is accommodated in the FOUP 100. Until normally, exposure to a gas atmosphere in which the filling degree (substitution degree) of the purge gas decreases in the FOUP 100 with the passage of the wafer loading / unloading operation time may cause a slight adverse effect. By injecting the purge gas into the FOUP 100, a decrease in the purge gas filling degree (substitution degree) in the FOUP 100 can be effectively suppressed, and the wafer is stored in the FOUP 100 in a good state. Can do.

  Further, when the FOUP 100 in which the wafer having undergone the semiconductor manufacturing process is stored is transferred to the transfer mechanism or at a predetermined timing after the transfer, the switching unit AV is changed from the second pressure adjustment state to the first pressure adjustment state. By switching, the nozzle body A2 is moved downward from the purge position (b) to the standby position (a). That is, gas is injected into the upper pressure adjustment space S2 through the upper vent hole A3b formed in the side wall 31 of the holder A3 and the upper pipe Hb connected to the upper vent hole A3b, and the upper pressure adjustment space S2 is injected. The pressure in the lower pressure adjustment space S1 is discharged to the outside through the lower vent hole A3a and the lower pipe Ha connected to the lower vent hole A3a. By making the pressure in the adjustment space S2 higher than the pressure in the lower pressure adjustment space S1, the nozzle body A2 is moved downward relative to the holder A3. As a result, it is possible to prevent the nozzle body A2 from interfering with the downward surface of the FOUP 100 when receiving the FOUP 100 storing unprocessed wafers on the mounting table B from the transport mechanism.

  In this way, the purge nozzle unit A1 of this embodiment formed by unitizing the two parts of the nozzle body A2 and the holder A3 has two pressure adjustment spaces S1 and S2 formed between the nozzle body A2 and the holder A3. The nozzle body A2 is configured to move up and down with respect to the holder A3 by adjusting the pressure difference through the vent holes (the lower vent hole A3a and the upper vent hole A3b) formed in the side wall 31 of the holder A3. ing. That is, the purge nozzle unit A1 of the present embodiment realizes the lifting and lowering operation of the nozzle body A2 by operating the nozzle body A2 as a piston (cylinder shaft) when the holder A3 is regarded as a cylinder. In addition to these two parts, it is not necessary to provide a separate mechanism for moving the nozzle body A2 up and down, and not only can the number of parts be reduced and the cost can be reduced, but also the purge nozzle unit A1 as a whole can be made compact. Can do.

  Further, in the purge nozzle unit A1 according to the present embodiment, not only the outward face of the flange A8 in the nozzle body A2, but also the lateral protrusion A49 that partitions the two pressure adjustment spaces S1 and S2 in the height direction. The facing surface contacts the inward surface of the side wall A31 of the holder A3, and the outward surface of the body A41 of the nozzle body A2 contacts the inward surface of the through hole A32 of the bottom wall A33 of the holder A3. Since the nozzle body A2 is moved up and down in the state, the nozzle body A2 can be moved up and down smoothly and appropriately.

  In addition, the purge nozzle unit A1 of the present embodiment can be easily assembled by holding the nozzle body A2 on the holder A3 and unitizing it, and, for example, by simultaneously expanding and contracting a plurality of cylinders, the nozzle body Compared with the mode in which A2 is moved up and down, the control for simultaneously expanding and contracting the cylinder is unnecessary, and the accuracy of the nozzle body A2 can be improved by simple control for adjusting the relative pressure difference between the two pressure adjustment spaces S1 and S2. High elevating movement can be realized and reliability is improved.

  In particular, the purge nozzle unit A1 according to the present embodiment does not need to evacuate each pressure adjustment space (the lower pressure adjustment space S1 and the upper pressure adjustment space S2). This is advantageous in that no source is required.

  In addition, this invention is not limited to embodiment mentioned above. For example, as a gas used for adjusting the pressure in the pressure adjustment space, a purge gas can be used (divided).

  Moreover, in each embodiment mentioned above, although the aspect which formed the pressure regulation space and the ventilation hole in the one-to-one relationship was illustrated, even if the structure which formed the several ventilation hole connected to one pressure regulation space is employ | adopted. Good. The location of the vent hole in the holder is not particularly limited as long as it is a location communicating with the pressure adjustment space, and can be formed, for example, on the bottom wall of the holder.

  Moreover, the aspect which integrally assembles a nozzle head part and a nozzle bottom part with respect to a nozzle main body may be various aspects, such as screwing, engagement, or adhesion | attachment, for example instead of or in addition to press fit.

  Further, in the above-described embodiment, since the main body portion and the nozzle head portion of the nozzle body are composed of separate parts, the port contact portion that can come into contact with the port in the nozzle body depends on aging and frequency of use. Even if it is worn and deformed due to wear, replace the nozzle head in use with a new nozzle head or another nozzle head that is not worn or deformed. It is possible to ensure a good contact state with high airtightness. On the other hand, although there is a demerit that only such a nozzle head cannot be replaced or repaired, it is also possible to apply a nozzle body in which the nozzle head and the main body are integrally formed.

  Furthermore, a seal member may not be interposed between the nozzle body and the holder as long as the airtightness of the pressure adjustment space can be ensured.

  In the above-described embodiment, the FOUP is exemplified as the purge target container. However, another container (carrier) may be used, and the container to be accommodated in the purge target container is not limited to the wafer, and is a display device. Or a glass substrate used for a photoelectric conversion device or the like.

  Further, the purge device can be applied to other than a load port, for example, a stocker for storing a purge target container or a purge dedicated station.

  As described above, the purge nozzle unit according to the above embodiment has the following characteristics. First, by adjusting the pressure in the pressure adjustment space formed between the first flow path forming member (main body portion) and the holder through the vent hole formed in the holder, the first flow path forming member is moved with respect to the holder. Since it is configured to move up and down, there is no need to separately provide a dedicated mechanism (such as a pair of air cylinders) for moving the first flow path forming member up and down, and simplification of the structure and cost reduction are effectively achieved. be able to.

  In addition, with such a purge nozzle unit, the entire purge nozzle unit can be made compact, and for example, the cylinders can be moved simultaneously as compared with a mode in which a plurality of cylinders are moved up and down at the same time. Control for expanding and contracting is unnecessary, and it can be moved up and down with high accuracy by relatively simple control for adjusting the pressure in the pressure adjusting space, thereby improving reliability.

  In addition, in such a purge nozzle unit, the outward surface of the flange portion of the first flow path forming member is in contact with the inward surface of the side wall of the holder, and the outward surface of the body portion of the first flow path forming member However, the first flow path forming member can be moved up and down while being in contact with the through hole in the bottom wall of the holder, and the up and down movement can be performed smoothly and appropriately.

  As a specific example, one pressure adjustment space is formed between the holder and the first flow path forming member, and the first flow path is formed by increasing the pressure of the pressure adjustment space by supplying gas to the pressure adjustment space through the vent hole. There may be mentioned an embodiment in which the first flow path forming member is lowered by raising the member and exhausting the gas in the pressure adjustment space to the outside through a common vent and lowering the pressure in the pressure adjustment space.

  As another specific example, two pressure adjustment spaces partitioned in the height direction are formed between the first flow path forming member and the holder, and the lower pressure adjustment is made through the vent hole communicating with the lower pressure adjustment space. By supplying gas to the space and exhausting the gas in the upper pressure adjustment space to the outside through a vent hole communicating with the upper pressure adjustment space, the pressure in the lower pressure adjustment space is changed to the pressure in the upper pressure adjustment space. And the first flow path forming member is configured to rise, and gas is supplied to the upper pressure adjustment space through the vent hole communicating with the upper pressure adjustment space and communicated with the lower pressure adjustment space. By exhausting the gas in the lower pressure adjustment space to the outside through the vent hole, the pressure in the upper pressure adjustment space is made higher than the pressure in the lower pressure adjustment space so that the first flow path forming member descends. The aspect configured in It is possible.

  Compared to the latter mode, the former mode forms a single pressure adjustment space between the first flow path forming member and the holder, and moves up and down only by adjusting the pressure of the only pressure adjustment space. This is advantageous in that it can be realized.

  Further, the latter mode is different in structure from the former mode in that two stages of pressure adjustment spaces are formed between the first flow path forming member and the holder, but the pressure difference between the different pressure adjustment spaces is different. It is possible to realize the raising and lowering operation of the first flow path forming member simply by adjusting

Further, the pressure adjustment space is set to a space partitioned by the body portion and the flange portion of the first flow path forming member and the side wall and the bottom wall of the holder, or the height of the pressure adjustment space is set at the axial center portion of the first flow path forming member. There may be mentioned one in which a first flow path (purge gas flow path) penetrating in the direction is formed.
Further, the purge atmosphere can be passed through a purge nozzle unit that can replace the gas atmosphere in the purge target container with a purge gas composed of either nitrogen or dry air through a port provided on the bottom surface of the purge target container. A first flow path forming member having a trunk portion and a flange portion projecting laterally from the trunk portion, and a holder having a side wall that contacts the outward surface of the flange portion and the outer surface of the trunk portion contacts And forming a vent hole communicating with the outside in at least a part of the holder, and adjusting the pressure of the pressure adjusting space formed between the first flow path forming member and the holder and communicating with the vent hole. The path forming member is configured to move up and down with respect to the holder, and the purge gas flow path that allows the purge gas to pass through and communicates with the internal space of the port and the pressure adjustment space are set in a space separated from each other It can be mentioned. In this case, the holder has a bottom wall formed with a through hole through which the body portion is inserted, and is configured to move up and down by adjusting the pressure difference between the pressure adjustment spaces partitioned by the two spaces. Is preferred.

  In addition, the specific configuration of each part is not limited to the above embodiment, and various modifications can be made without departing from the spirit of the present invention.

DESCRIPTION OF SYMBOLS 1, A1 ... Purge nozzle unit 2, A2 ... Nozzle main body 3, A3 ... Holder 30 ... Vent hole 31, A31 ... Side wall 32, A32 ... Through-hole 33, A33 ... Bottom wall 41, A41 ... Body part 8, A8 ... 鍔Part 100 ... Purge target container (FOUP)
101 ... Port A3a ... Lower vent hole A3b ... Upper vent hole S ... Pressure adjustment space S1 ... Lower pressure adjustment space S2 ... Upper pressure adjustment space P ... Purge device X ... Load port

Claims (6)

A purge nozzle unit capable of replacing a gas atmosphere in the purge target container with the purge gas by supplying a purge gas through a port provided on a bottom surface of the purge target container in which a substrate is accommodated;
The purge nozzle unit includes a nozzle having a flow path through which the purge gas can pass.
A holder for holding the nozzle in a state where it can be raised and lowered,
The nozzle has a nozzle head that contacts the port when moved upward, and a main body provided on the opposite side of the nozzle head from the port side,
The nozzle head is provided to be exchangeable with respect to the main body.
A purge nozzle unit characterized by that. The holder has a side wall that contacts the outward surface of the main body,
The purge nozzle unit according to claim 1, wherein a seal member is provided between the outward surface and the side wall. The purge nozzle unit according to claim 1, wherein the nozzle head is housed in the holder when the nozzle is moved downward. The purge nozzle unit according to claim 1, wherein the holder has a through-hole through which the main body portion is inserted. A load port to which a plurality of purge nozzle units according to any one of claims 1 to 4 are attached to a mounting table on which the purge target container is mounted according to the position of the port of the purge target container. A stocker for storing the purge target container, to which the purge nozzle unit according to claim 1 is attached.

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