JP2019029997A - 半導体装置 - Google Patents
半導体装置 Download PDFInfo
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- JP2019029997A JP2019029997A JP2018117317A JP2018117317A JP2019029997A JP 2019029997 A JP2019029997 A JP 2019029997A JP 2018117317 A JP2018117317 A JP 2018117317A JP 2018117317 A JP2018117317 A JP 2018117317A JP 2019029997 A JP2019029997 A JP 2019029997A
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- semiconductor chip
- heat sink
- layer
- resistor
- mosfet
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Abstract
【解決手段】JFET10と、MOSFET20と、JFET10のゲート電極13とMOSFET20のソース電極21との間に配置された接合型FET用調整抵抗42を備え、JFET10とMOSFET20がJFET10のソース電極11とMOSFET20のドレイン電極22とが電気的に接続されてカスコード接続されるようにする。そして、接合型FET用調整抵抗42は、スイッチングオン動作用の第1抵抗回路421およびスイッチングオフ動作用の第2抵抗回路422を有するようにする。
【選択図】図1
Description
なお、上記および特許請求の範囲における括弧内の符号は、特許請求の範囲に記載された用語と後述の実施形態に記載される当該用語を例示する具体物等との対応関係を示すものである。
第1実施形態について図面を参照しつつ説明する。まず、本実施形態の半導体装置における回路構成について説明する。図1に示されるように、本実施形態の半導体装置は、第1半導体チップ100に形成されたノーマリオン型のJFET10と、第2半導体チップ200に形成されたノーマリオフ型のMOSFET20とがカスコード接続されて構成されている。なお、本実施形態では、JFET10およびMOSFET20は、それぞれNチャネル型とされている。
第2実施形態について説明する。本実施形態は、第1実施形態に対して、第1半導体チップ100に温度センスを備えると共に、第2半導体チップ200に電流センスを備えるようにしたものであり、その他に関しては第1実施形態と同様であるため、ここでは説明を省略する。
第3実施形態について説明する。本実施形態は、第2実施形態に対して、第2半導体チップ200に温度センス120を形成したものであり、その他に関しては第2実施形態と同様であるため、ここでは説明を省略する。
第4実施形態について説明する。本実施形態は、第1実施形態に対して、第1半導体チップ100のソース電極11と第2配線パターン302とをボンディワイヤで接続すると共に、第2半導体チップ200のソース電極21と第3配線パターン303とをボンディワイヤで接続するようにしたものである。その他に関しては、第1実施形態と同様であるため、ここでは説明を省略する。
第5実施形態について説明する。本実施形態は、第1実施形態に対して、複数の第1半導体チップ100と複数の第2半導体チップ200とを備えたものであり、その他に関しては、第1実施形態と同様であるため、ここでは説明を省略する。
第6実施形態について説明する。第6実施形態は、第5実施形態に第2実施形態を組み合わせたものであり、その他に関しては第5実施形態と同様であるため、ここでは説明を省略する。
第7実施形態について説明する。第7実施形態は、第1実施形態に対して両面放熱構造としたものであり、その他に関しては第1実施形態と同様であるため、ここでは説明を省略する。
第8実施形態について説明する。第8実施形態は、第7実施形態に対し、第1半導体チップ100と第2半導体チップ200とを積層して配置したものであり、その他に関しては第1実施形態と同様であるため、ここでは説明を省略する。
第9実施形態について説明する。第9実施形態は、第8実施形態に対し、第1半導体チップ100を第2半導体チップ200より小さくしたものであり、その他に関しては第8実施形態と同様であるため、ここでは説明を省略する。
第10実施形態について説明する。第10実施形態は、第7実施形態の半導体装置を並べて配置したものであり、その他に関しては第7実施形態と同様であるため、ここでは説明を省略する。
第11実施形態について説明する。第11実施形態は、第8実施形態の半導体装置を並べて配置したものであり、その他に関しては第8実施形態と同様であるため、ここでは説明を省略する。
第12実施形態について説明する。本実施形態は、第1実施形態に対して、MOSFET用調整抵抗41の構成を変更したものであり、その他に関しては第1実施形態と同様であるため、ここでは説明を省略する。
第13実施形態について説明する。本実施形態は、第12実施形態に対して、MOSFET用調整抵抗41およびJFET用調整抵抗42の構成を変更したものであり、その他に関しては第2実施形態と同様であるため、ここでは説明を省略する。
本発明は上記した実施形態に限定されるものではなく、特許請求の範囲に記載した範囲内において適宜変更が可能である。
11 ソース電極
12 ドレイン電極
13 ゲート層(ゲート電極)
20 MOSFET
21 ソース電極
22 ドレイン電極
23 ゲート電極
42 JFET用調整抵抗
421 第1抵抗回路
422 第2抵抗回路
Claims (14)
- 接合型FET(10)が形成された第1半導体チップ(100)とMOSFET(20)が形成された第2半導体チップ(200)とを有する半導体装置において、
前記接合型FETが形成された前記第1半導体チップと、
前記MOSFETが形成された前記第2半導体チップと、
前記接合型FETのゲート電極(13)と前記MOSFETのソース電極(21)との間に配置された接合型FET用調整抵抗(42)と、を備え、
前記接合型FETと前記MOSFETは、前記接合型FETのソース電極(11)と前記MOSFETのドレイン電極(22)とが電気的に接続されてカスコード接続されており、
前記接合型FET用調整抵抗は、スイッチングオン動作用の第1抵抗回路(421)およびスイッチングオフ動作用の第2抵抗回路(422)を有している半導体装置。 - 前記第1半導体チップおよび前記第2半導体チップを封止するモールド樹脂(400)を備え、
前記接合型FET用調整抵抗は、前記モールド樹脂から露出する状態で配置されている請求項1に記載の半導体装置。 - 前記第1抵抗回路は、第1ダイオード(421a)と第1抵抗(421b)とを有し、前記第1ダイオードと前記第1抵抗とが直列に接続され、
前記第2抵抗回路は、第2ダイオード(422a)と第2抵抗(422b)とを有し、前記第2ダイオードと前記第2抵抗とが直列に接続され、
前記第1抵抗回路および前記第2抵抗回路は、前記第1ダイオードのカソードおよび前記第2ダイオードのアノードが前記接合型FETのゲート電極と接続されるように並列に接続されている請求項1または2に記載の半導体装置。 - 前記MOSFETのゲート電極(23)とゲート駆動回路(51)との間に配置されるMOSFET用調整抵抗(41)を有し、
前記MOSFET用調整抵抗は、スイッチングオン動作用の第3抵抗回路(411)およびスイッチングオフ動作用の第4抵抗回路(412)を有している請求項1ないし3のいずれか1つに記載の半導体装置。 - 前記第3抵抗回路は、第3ダイオード(411a)と第3抵抗(411b)とを有し、前記第3ダイオードと前記第3抵抗とが直列に接続され、
前記第4抵抗回路は、第4ダイオード(412a)と第4抵抗(412b)とを有し、前記第4ダイオードと前記第4抵抗とが直列に接続され、
前記第3抵抗回路および前記第4抵抗回路は、前記第3ダイオードのカソードおよび前記第4ダイオードのアノードが前記MOSFETのゲート電極と接続されるように並列に接続されている請求項4に記載の半導体装置。 - 前記第1半導体チップは、
第1導電型のドリフト層(113)と、
前記ドリフト層上に配置された第1導電型のチャネル層(114)と、
前記チャネル層の表層部に形成され、前記チャネル層よりも高不純物濃度とされた第1導電型のソース層(115)と、
前記チャネル層に前記ソース層よりも深くまで形成され、前記ゲート電極としての第2導電型のゲート層(13)と、
前記ドリフト層を挟んで前記ソース層と反対側に配置されるドレイン層(111)と、
前記ゲート層と電気的に接続されるゲート配線(118)と、
前記ソース層と電気的に接続される前記ソース電極と、
前記ドレイン層と電気的に接続されるドレイン電極(12)と、を備え、
前記チャネル層には、前記ソース層よりも深くまで形成され、前記ソース電極と電気的に接続される第2導電型のボディ層(116)が形成されている請求項1ないし5のいずれか1つに記載の半導体装置。 - 前記ボディ層の底部側では、前記ゲート層の底部側よりも電界強度が高くなる請求項6に記載の半導体装置。
- 前記第1半導体チップおよび前記第2半導体チップには、いずれか一方に温度を検出する温度センス(120)が形成されていると共に、いずれか一方に電流を検出する電流センス(220)が形成されており、
前記MOSFETのゲート電極(23)には、前記電流センスの検出結果および前記温度センスの検出結果に基づいたゲート電圧が印加される請求項1ないし7のいずれか1つに記載の半導体装置。 - 前記第1半導体チップは、炭化珪素基板を用いて構成され、
前記第2半導体チップは、シリコン基板を用いて構成され、
前記電流センスは、前記第2半導体チップに形成されている請求項8に記載の半導体装置。 - 前記第1半導体チップは、前記第2半導体チップよりオン抵抗が高くされており、
前記温度センスは、前記第1半導体チップに形成されている請求項8または9に記載の半導体装置。 - 前記第1半導体チップは、前記第2半導体チップよりオン抵抗が高くされており、
前記温度センスは、前記第2半導体チップに形成され、
前記MOSFETのゲート電極に前記ゲート電圧を印加するゲート駆動回路(51)を有し、
前記ゲート駆動回路は、前記温度センスで検出された温度から前記第1半導体チップの温度を導出する温度導出回路(51a)を有し、前記温度導出回路で導出された前記第1半導体チップの温度も加味した前記ゲート電圧を印加する請求項8または9に記載の半導体装置。 - 対向して配置された第1下側ヒートシンク(601)および第1上側ヒートシンク(604)と、
対向して配置された第2下側ヒートシンク(602)および第2上側ヒートシンク(606)と、
前記第1半導体チップおよび前記第2半導体チップを封止するモールド樹脂(400)と、を有し、
前記第1半導体チップは、前記第1下側ヒートシンクおよび前記第1上側ヒートシンクとの間に配置されて前記第1下側ヒートシンクおよび前記第1上側ヒートシンクと電気的、および熱的に接続されており、
前記第2半導体チップは、前記第2下側ヒートシンクおよび前記第2上側ヒートシンクとの間に配置されて前記第2下側ヒートシンクおよび前記第2上側ヒートシンクと電気的、および熱的に接続されており、
前記第1上側ヒートシンクと前記第2下側ヒートシンクとが電気的に接続され、
前記モールド樹脂は、前記第1下側ヒートシンクおよび前記第1上側ヒートシンクのうちの前記第1半導体チップ側と反対側の部分、および前記第2下側ヒートシンクおよび前記第2上側ヒートシンクのうちの前記第2半導体チップ側と反対側の部分が露出する状態で、前記第1半導体チップおよび前記第2半導体チップを封止している請求項1ないし11のいずれか1つに記載の半導体装置。 - 対向して配置された下側ヒートシンク(601)および上側ヒートシンク(604)と、
前記第1半導体チップおよび前記第2半導体チップを封止するモールド樹脂(400)と、を有し、
前記第1半導体チップおよび前記第2半導体チップは、前記下側ヒートシンクと前記上側ヒートシンクとの間に積層されて配置され、
前記モールド樹脂は、前記下側ヒートシンクおよび前記上側ヒートシンクのうちの前記第1半導体チップおよび前記第2半導体チップ側と反対側の部分が露出する状態で、前記第1半導体チップおよび前記第2半導体チップを封止している請求項1ないし11のいずれか1つに記載の半導体装置。 - 前記第1半導体チップは、前記第2半導体チップより平面形状が小さくされており、
前記第1半導体チップと前記第2半導体チップとの間には、前記第1半導体チップ側に、前記第1半導体チップと接続されると共に前記第1半導体チップの平面形状に対応する形状のスペーサ(608)が配置され、前記スペーサと前記第2半導体チップとの間に、前記第2半導体チップと接続されると共に前記第2半導体チップの平面形状に対応する形状の金属ブロック(603)が配置されている請求項13に記載の半導体装置。
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