JP2018133331A - 異方性導電接続構造体、異方性導電接続構造体の製造方法、異方性導電フィルム、及び異方性導電ペースト - Google Patents

異方性導電接続構造体、異方性導電接続構造体の製造方法、異方性導電フィルム、及び異方性導電ペースト Download PDF

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Publication number
JP2018133331A
JP2018133331A JP2018016466A JP2018016466A JP2018133331A JP 2018133331 A JP2018133331 A JP 2018133331A JP 2018016466 A JP2018016466 A JP 2018016466A JP 2018016466 A JP2018016466 A JP 2018016466A JP 2018133331 A JP2018133331 A JP 2018133331A
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Japan
Prior art keywords
anisotropic conductive
electronic component
less
connection structure
film
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JP2018016466A
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English (en)
Japanese (ja)
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JP2018133331A5 (https=
Inventor
宮内　幸一
Koichi Miyauchi
幸一 宮内
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Dexerials Corp
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Dexerials Corp
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Publication of JP2018133331A publication Critical patent/JP2018133331A/ja
Publication of JP2018133331A5 publication Critical patent/JP2018133331A5/ja
Pending legal-status Critical Current

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    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
    • C09J11/02—Non-macromolecular additives
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J167/00—Adhesives based on polyesters obtained by reactions forming a carboxylic ester link in the main chain; Adhesives based on derivatives of such polymers
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J9/00—Adhesives characterised by their physical nature or the effects produced, e.g. glue sticks
    • C09J9/02—Electrically-conducting adhesives
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
    • H01B1/20—Conductive material dispersed in non-conductive organic material
    • H01B1/22—Conductive material dispersed in non-conductive organic material the conductive material comprising metals or alloys
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B5/00—Non-insulated conductors or conductive bodies characterised by their form
    • H01B5/16—Non-insulated conductors or conductive bodies characterised by their form comprising conductive material in insulating or poorly conductive material, e.g. conductive rubber
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R11/00—Individual connecting elements providing two or more spaced connecting locations for conductive members which are, or may be, thereby interconnected, e.g. end pieces for wires or cables supported by the wire or cable and having means for facilitating electrical connection to some other wire, terminal, or conductive member, blocks of binding posts
    • H01R11/01—Individual connecting elements providing two or more spaced connecting locations for conductive members which are, or may be, thereby interconnected, e.g. end pieces for wires or cables supported by the wire or cable and having means for facilitating electrical connection to some other wire, terminal, or conductive member, blocks of binding posts characterised by the form or arrangement of the conductive interconnection between the connecting locations
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistors
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits

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  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Engineering & Computer Science (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Physics & Mathematics (AREA)
  • Dispersion Chemistry (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Manufacturing & Machinery (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Conductive Materials (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
  • Adhesive Tapes (AREA)
  • Wire Bonding (AREA)
  • Non-Insulated Conductors (AREA)
JP2018016466A 2017-02-15 2018-02-01 異方性導電接続構造体、異方性導電接続構造体の製造方法、異方性導電フィルム、及び異方性導電ペースト Pending JP2018133331A (ja)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2017026025 2017-02-15
JP2017026025 2017-02-15

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JP2018133331A true JP2018133331A (ja) 2018-08-23
JP2018133331A5 JP2018133331A5 (https=) 2021-05-20

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JP2018016466A Pending JP2018133331A (ja) 2017-02-15 2018-02-01 異方性導電接続構造体、異方性導電接続構造体の製造方法、異方性導電フィルム、及び異方性導電ペースト

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JP (1) JP2018133331A (https=)
TW (1) TW201834858A (https=)
WO (1) WO2018150897A1 (https=)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2022014625A1 (ja) * 2020-07-17 2022-01-20 京都エレックス株式会社 導電性接着剤組成物

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2025134747A1 (ja) * 2023-12-22 2025-06-26 株式会社レゾナック 回路接続用接着剤フィルム、接続構造体の製造方法、導電材料、及び接続構造体

Citations (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH11224976A (ja) * 1998-02-05 1999-08-17 Matsushita Electric Ind Co Ltd 配線基板
JP2010199527A (ja) * 2009-03-31 2010-09-09 Sony Chemical & Information Device Corp 接合体及びその製造方法
JP2013064104A (ja) * 2011-08-30 2013-04-11 Hitachi Chemical Co Ltd 接着剤組成物及び回路接続構造体
JP2013199525A (ja) * 2012-03-23 2013-10-03 Dic Corp 共重合ポリエステル樹脂及び樹脂組成物
JP2014102943A (ja) * 2012-11-19 2014-06-05 Dexerials Corp 異方性導電フィルム、接続方法、及び接合体
JP2015103242A (ja) * 2013-11-22 2015-06-04 サムソン エレクトロ−メカニックス カンパニーリミテッド． タッチセンサモジュールおよびその製造方法
JP2016072097A (ja) * 2014-09-30 2016-05-09 デクセリアルズ株式会社 接続方法、接合体、及びタッチパネル装置
JP2016082070A (ja) * 2014-10-16 2016-05-16 デクセリアルズ株式会社 接続体の製造方法、電子部品の接続方法、接続体
JP2016170330A (ja) * 2015-03-13 2016-09-23 富士ゼロックス株式会社 画像形成方法、画像形成装置、液体現像剤カートリッジ、及び液体現像剤

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3447569B2 (ja) * 1998-07-23 2003-09-16 シャープ株式会社 異方性導電膜およびそれを用いた電極接続構造
JP6002500B2 (ja) * 2011-08-05 2016-10-05 積水化学工業株式会社 接続構造体の製造方法
JP2014046622A (ja) * 2012-08-31 2014-03-17 Dexerials Corp 透明導電体、入力装置および電子機器
JP6061643B2 (ja) * 2012-09-24 2017-01-18 株式会社タムラ製作所 異方性導電性ペーストおよびそれを用いたプリント配線基板

Patent Citations (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH11224976A (ja) * 1998-02-05 1999-08-17 Matsushita Electric Ind Co Ltd 配線基板
JP2010199527A (ja) * 2009-03-31 2010-09-09 Sony Chemical & Information Device Corp 接合体及びその製造方法
JP2013064104A (ja) * 2011-08-30 2013-04-11 Hitachi Chemical Co Ltd 接着剤組成物及び回路接続構造体
JP2013199525A (ja) * 2012-03-23 2013-10-03 Dic Corp 共重合ポリエステル樹脂及び樹脂組成物
JP2014102943A (ja) * 2012-11-19 2014-06-05 Dexerials Corp 異方性導電フィルム、接続方法、及び接合体
JP2015103242A (ja) * 2013-11-22 2015-06-04 サムソン エレクトロ−メカニックス カンパニーリミテッド． タッチセンサモジュールおよびその製造方法
JP2016072097A (ja) * 2014-09-30 2016-05-09 デクセリアルズ株式会社 接続方法、接合体、及びタッチパネル装置
JP2016082070A (ja) * 2014-10-16 2016-05-16 デクセリアルズ株式会社 接続体の製造方法、電子部品の接続方法、接続体
JP2016170330A (ja) * 2015-03-13 2016-09-23 富士ゼロックス株式会社 画像形成方法、画像形成装置、液体現像剤カートリッジ、及び液体現像剤

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2022014625A1 (ja) * 2020-07-17 2022-01-20 京都エレックス株式会社 導電性接着剤組成物
JP2022019451A (ja) * 2020-07-17 2022-01-27 京都エレックス株式会社 導電性接着剤組成物

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WO2018150897A1 (ja) 2018-08-23
TW201834858A (zh) 2018-10-01

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