JP2018125528A - 容量素子、半導体装置、および半導体装置の作製方法 - Google Patents
容量素子、半導体装置、および半導体装置の作製方法 Download PDFInfo
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- JP2018125528A JP2018125528A JP2018009272A JP2018009272A JP2018125528A JP 2018125528 A JP2018125528 A JP 2018125528A JP 2018009272 A JP2018009272 A JP 2018009272A JP 2018009272 A JP2018009272 A JP 2018009272A JP 2018125528 A JP2018125528 A JP 2018125528A
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- 239000004065 semiconductor Substances 0.000 title claims abstract description 346
- 238000000034 method Methods 0.000 title claims description 295
- 238000004519 manufacturing process Methods 0.000 title claims description 45
- 239000012212 insulator Substances 0.000 claims abstract description 1093
- 239000004020 conductor Substances 0.000 claims abstract description 814
- 229910044991 metal oxide Inorganic materials 0.000 claims abstract description 127
- 229910052739 hydrogen Inorganic materials 0.000 claims abstract description 125
- 239000001257 hydrogen Substances 0.000 claims abstract description 124
- 150000004706 metal oxides Chemical class 0.000 claims abstract description 117
- 239000007789 gas Substances 0.000 claims description 246
- 229910052760 oxygen Inorganic materials 0.000 claims description 174
- 239000001301 oxygen Substances 0.000 claims description 171
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 claims description 169
- 239000003990 capacitor Substances 0.000 claims description 135
- UFHFLCQGNIYNRP-UHFFFAOYSA-N Hydrogen Chemical compound [H][H] UFHFLCQGNIYNRP-UHFFFAOYSA-N 0.000 claims description 117
- 238000005530 etching Methods 0.000 claims description 114
- 230000008569 process Effects 0.000 claims description 99
- XKRFYHLGVUSROY-UHFFFAOYSA-N Argon Chemical compound [Ar] XKRFYHLGVUSROY-UHFFFAOYSA-N 0.000 claims description 60
- 238000004544 sputter deposition Methods 0.000 claims description 56
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 claims description 54
- 229910052814 silicon oxide Inorganic materials 0.000 claims description 53
- 238000001312 dry etching Methods 0.000 claims description 48
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 claims description 38
- 229910052799 carbon Inorganic materials 0.000 claims description 37
- 229910052786 argon Inorganic materials 0.000 claims description 30
- 229910052782 aluminium Inorganic materials 0.000 claims description 25
- 239000012298 atmosphere Substances 0.000 claims description 25
- 238000000623 plasma-assisted chemical vapour deposition Methods 0.000 claims description 22
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 claims description 20
- 238000000151 deposition Methods 0.000 claims description 19
- 239000011737 fluorine Substances 0.000 claims description 15
- 229910052731 fluorine Inorganic materials 0.000 claims description 15
- 229910052733 gallium Inorganic materials 0.000 claims description 14
- 230000003746 surface roughness Effects 0.000 claims description 12
- 229910052727 yttrium Inorganic materials 0.000 claims description 10
- 238000001505 atmospheric-pressure chemical vapour deposition Methods 0.000 claims description 8
- PXGOKWXKJXAPGV-UHFFFAOYSA-N Fluorine Chemical compound FF PXGOKWXKJXAPGV-UHFFFAOYSA-N 0.000 claims 2
- 230000005540 biological transmission Effects 0.000 abstract description 6
- 125000004435 hydrogen atom Chemical class [H]* 0.000 abstract description 6
- 230000010354 integration Effects 0.000 abstract description 4
- 239000010408 film Substances 0.000 description 442
- 230000006870 function Effects 0.000 description 165
- 239000000758 substrate Substances 0.000 description 156
- 230000015654 memory Effects 0.000 description 121
- 239000012535 impurity Substances 0.000 description 106
- 230000015572 biosynthetic process Effects 0.000 description 100
- 230000004888 barrier function Effects 0.000 description 89
- 239000011701 zinc Substances 0.000 description 78
- 239000010410 layer Substances 0.000 description 75
- 229910052710 silicon Inorganic materials 0.000 description 74
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 73
- 239000010703 silicon Substances 0.000 description 73
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 72
- 230000002829 reductive effect Effects 0.000 description 71
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 64
- 229910001868 water Inorganic materials 0.000 description 64
- 239000000463 material Substances 0.000 description 61
- 238000000231 atomic layer deposition Methods 0.000 description 52
- 238000010438 heat treatment Methods 0.000 description 51
- TWNQGVIAIRXVLR-UHFFFAOYSA-N oxo(oxoalumanyloxy)alumane Chemical compound O=[Al]O[Al]=O TWNQGVIAIRXVLR-UHFFFAOYSA-N 0.000 description 43
- 238000005229 chemical vapour deposition Methods 0.000 description 42
- 229910052751 metal Inorganic materials 0.000 description 36
- 229910052757 nitrogen Inorganic materials 0.000 description 36
- 239000002184 metal Substances 0.000 description 33
- 229910052581 Si3N4 Inorganic materials 0.000 description 31
- HQVNEWCFYHHQES-UHFFFAOYSA-N silicon nitride Chemical compound N12[Si]34N5[Si]62N3[Si]51N64 HQVNEWCFYHHQES-UHFFFAOYSA-N 0.000 description 31
- MYMOFIZGZYHOMD-UHFFFAOYSA-N Dioxygen Chemical compound O=O MYMOFIZGZYHOMD-UHFFFAOYSA-N 0.000 description 28
- 229910001882 dioxygen Inorganic materials 0.000 description 27
- 229910052721 tungsten Inorganic materials 0.000 description 26
- WFKWXMTUELFFGS-UHFFFAOYSA-N tungsten Chemical compound [W] WFKWXMTUELFFGS-UHFFFAOYSA-N 0.000 description 25
- 239000010937 tungsten Substances 0.000 description 25
- 239000013078 crystal Substances 0.000 description 24
- 238000012545 processing Methods 0.000 description 22
- NRTOMJZYCJJWKI-UHFFFAOYSA-N Titanium nitride Chemical compound [Ti]#N NRTOMJZYCJJWKI-UHFFFAOYSA-N 0.000 description 21
- 229910052735 hafnium Inorganic materials 0.000 description 21
- 229910052738 indium Inorganic materials 0.000 description 21
- 238000001039 wet etching Methods 0.000 description 21
- 125000004429 atom Chemical group 0.000 description 20
- VBJZVLUMGGDVMO-UHFFFAOYSA-N hafnium atom Chemical compound [Hf] VBJZVLUMGGDVMO-UHFFFAOYSA-N 0.000 description 20
- 229910000449 hafnium oxide Inorganic materials 0.000 description 20
- 239000000203 mixture Substances 0.000 description 20
- WIHZLLGSGQNAGK-UHFFFAOYSA-N hafnium(4+);oxygen(2-) Chemical compound [O-2].[O-2].[Hf+4] WIHZLLGSGQNAGK-UHFFFAOYSA-N 0.000 description 19
- APFVFJFRJDLVQX-UHFFFAOYSA-N indium atom Chemical compound [In] APFVFJFRJDLVQX-UHFFFAOYSA-N 0.000 description 18
- 230000007547 defect Effects 0.000 description 16
- 238000009792 diffusion process Methods 0.000 description 16
- 239000011810 insulating material Substances 0.000 description 16
- MZLGASXMSKOWSE-UHFFFAOYSA-N tantalum nitride Chemical compound [Ta]#N MZLGASXMSKOWSE-UHFFFAOYSA-N 0.000 description 16
- 230000008021 deposition Effects 0.000 description 14
- 150000002431 hydrogen Chemical class 0.000 description 14
- YCKRFDGAMUMZLT-UHFFFAOYSA-N Fluorine atom Chemical compound [F] YCKRFDGAMUMZLT-UHFFFAOYSA-N 0.000 description 13
- 150000001722 carbon compounds Chemical class 0.000 description 13
- 238000000206 photolithography Methods 0.000 description 13
- 150000001768 cations Chemical class 0.000 description 12
- AJNVQOSZGJRYEI-UHFFFAOYSA-N digallium;oxygen(2-) Chemical compound [O-2].[O-2].[O-2].[Ga+3].[Ga+3] AJNVQOSZGJRYEI-UHFFFAOYSA-N 0.000 description 12
- 239000000945 filler Substances 0.000 description 12
- 229910001195 gallium oxide Inorganic materials 0.000 description 12
- 239000011347 resin Substances 0.000 description 12
- 229920005989 resin Polymers 0.000 description 12
- 238000010586 diagram Methods 0.000 description 11
- 230000002349 favourable effect Effects 0.000 description 11
- 239000002356 single layer Substances 0.000 description 11
- 238000003860 storage Methods 0.000 description 11
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical group [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 10
- -1 hafnium aluminate Chemical class 0.000 description 10
- 229910052715 tantalum Inorganic materials 0.000 description 10
- 229910052725 zinc Inorganic materials 0.000 description 10
- OAICVXFJPJFONN-UHFFFAOYSA-N Phosphorus Chemical compound [P] OAICVXFJPJFONN-UHFFFAOYSA-N 0.000 description 9
- 229910052796 boron Inorganic materials 0.000 description 9
- 239000000460 chlorine Substances 0.000 description 9
- 229910052698 phosphorus Inorganic materials 0.000 description 9
- 239000011574 phosphorus Substances 0.000 description 9
- 238000000926 separation method Methods 0.000 description 9
- GUVRBAGPIYLISA-UHFFFAOYSA-N tantalum atom Chemical compound [Ta] GUVRBAGPIYLISA-UHFFFAOYSA-N 0.000 description 9
- ZOXJGFHDIHLPTG-UHFFFAOYSA-N Boron Chemical compound [B] ZOXJGFHDIHLPTG-UHFFFAOYSA-N 0.000 description 8
- KRHYYFGTRYWZRS-UHFFFAOYSA-N Fluorane Chemical compound F KRHYYFGTRYWZRS-UHFFFAOYSA-N 0.000 description 8
- MWUXSHHQAYIFBG-UHFFFAOYSA-N Nitric oxide Chemical compound O=[N] MWUXSHHQAYIFBG-UHFFFAOYSA-N 0.000 description 8
- BOTDANWDWHJENH-UHFFFAOYSA-N Tetraethyl orthosilicate Chemical compound CCO[Si](OCC)(OCC)OCC BOTDANWDWHJENH-UHFFFAOYSA-N 0.000 description 8
- 239000010949 copper Substances 0.000 description 8
- 238000003795 desorption Methods 0.000 description 8
- 230000003647 oxidation Effects 0.000 description 8
- 238000007254 oxidation reaction Methods 0.000 description 8
- 229910052719 titanium Inorganic materials 0.000 description 8
- 239000010936 titanium Substances 0.000 description 8
- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical compound [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 description 7
- HCHKCACWOHOZIP-UHFFFAOYSA-N Zinc Chemical compound [Zn] HCHKCACWOHOZIP-UHFFFAOYSA-N 0.000 description 7
- 239000000969 carrier Substances 0.000 description 7
- 229910052802 copper Inorganic materials 0.000 description 7
- 229910052749 magnesium Inorganic materials 0.000 description 7
- 239000011777 magnesium Substances 0.000 description 7
- 125000004430 oxygen atom Chemical group O* 0.000 description 7
- 239000000126 substance Substances 0.000 description 7
- 229910052726 zirconium Inorganic materials 0.000 description 7
- GYHNNYVSQQEPJS-UHFFFAOYSA-N Gallium Chemical compound [Ga] GYHNNYVSQQEPJS-UHFFFAOYSA-N 0.000 description 6
- FYYHWMGAXLPEAU-UHFFFAOYSA-N Magnesium Chemical compound [Mg] FYYHWMGAXLPEAU-UHFFFAOYSA-N 0.000 description 6
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 6
- XLOMVQKBTHCTTD-UHFFFAOYSA-N Zinc monoxide Chemical compound [Zn]=O XLOMVQKBTHCTTD-UHFFFAOYSA-N 0.000 description 6
- QCWXUUIWCKQGHC-UHFFFAOYSA-N Zirconium Chemical compound [Zr] QCWXUUIWCKQGHC-UHFFFAOYSA-N 0.000 description 6
- 229910052784 alkaline earth metal Inorganic materials 0.000 description 6
- 238000006243 chemical reaction Methods 0.000 description 6
- 239000011248 coating agent Substances 0.000 description 6
- 238000000576 coating method Methods 0.000 description 6
- 230000000295 complement effect Effects 0.000 description 6
- 239000000470 constituent Substances 0.000 description 6
- 229910052732 germanium Inorganic materials 0.000 description 6
- GNPVGFCGXDBREM-UHFFFAOYSA-N germanium atom Chemical compound [Ge] GNPVGFCGXDBREM-UHFFFAOYSA-N 0.000 description 6
- 239000001307 helium Substances 0.000 description 6
- 229910052734 helium Inorganic materials 0.000 description 6
- SWQJXJOGLNCZEY-UHFFFAOYSA-N helium atom Chemical compound [He] SWQJXJOGLNCZEY-UHFFFAOYSA-N 0.000 description 6
- MRELNEQAGSRDBK-UHFFFAOYSA-N lanthanum(3+);oxygen(2-) Chemical compound [O-2].[O-2].[O-2].[La+3].[La+3] MRELNEQAGSRDBK-UHFFFAOYSA-N 0.000 description 6
- PLDDOISOJJCEMH-UHFFFAOYSA-N neodymium(3+);oxygen(2-) Chemical compound [O-2].[O-2].[O-2].[Nd+3].[Nd+3] PLDDOISOJJCEMH-UHFFFAOYSA-N 0.000 description 6
- 150000004767 nitrides Chemical class 0.000 description 6
- 230000003071 parasitic effect Effects 0.000 description 6
- 230000002093 peripheral effect Effects 0.000 description 6
- 238000002230 thermal chemical vapour deposition Methods 0.000 description 6
- ZAMOUSCENKQFHK-UHFFFAOYSA-N Chlorine atom Chemical compound [Cl] ZAMOUSCENKQFHK-UHFFFAOYSA-N 0.000 description 5
- 229910052779 Neodymium Inorganic materials 0.000 description 5
- 229910052783 alkali metal Inorganic materials 0.000 description 5
- 150000001340 alkali metals Chemical class 0.000 description 5
- 150000001342 alkaline earth metals Chemical class 0.000 description 5
- 238000004458 analytical method Methods 0.000 description 5
- 229910052801 chlorine Inorganic materials 0.000 description 5
- 238000004891 communication Methods 0.000 description 5
- PMHQVHHXPFUNSP-UHFFFAOYSA-M copper(1+);methylsulfanylmethane;bromide Chemical compound Br[Cu].CSC PMHQVHHXPFUNSP-UHFFFAOYSA-M 0.000 description 5
- 230000006378 damage Effects 0.000 description 5
- 238000007599 discharging Methods 0.000 description 5
- 230000000694 effects Effects 0.000 description 5
- AMGQUBHHOARCQH-UHFFFAOYSA-N indium;oxotin Chemical compound [In].[Sn]=O AMGQUBHHOARCQH-UHFFFAOYSA-N 0.000 description 5
- 239000011229 interlayer Substances 0.000 description 5
- 239000002159 nanocrystal Substances 0.000 description 5
- BPUBBGLMJRNUCC-UHFFFAOYSA-N oxygen(2-);tantalum(5+) Chemical compound [O-2].[O-2].[O-2].[O-2].[O-2].[Ta+5].[Ta+5] BPUBBGLMJRNUCC-UHFFFAOYSA-N 0.000 description 5
- 238000000851 scanning transmission electron micrograph Methods 0.000 description 5
- 229910001936 tantalum oxide Inorganic materials 0.000 description 5
- 229910052720 vanadium Inorganic materials 0.000 description 5
- JBRZTFJDHDCESZ-UHFFFAOYSA-N AsGa Chemical compound [As]#[Ga] JBRZTFJDHDCESZ-UHFFFAOYSA-N 0.000 description 4
- 229910001218 Gallium arsenide Inorganic materials 0.000 description 4
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical group [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 4
- ZOKXTWBITQBERF-UHFFFAOYSA-N Molybdenum Chemical compound [Mo] ZOKXTWBITQBERF-UHFFFAOYSA-N 0.000 description 4
- GQPLMRYTRLFLPF-UHFFFAOYSA-N Nitrous Oxide Chemical compound [O-][N+]#N GQPLMRYTRLFLPF-UHFFFAOYSA-N 0.000 description 4
- KJTLSVCANCCWHF-UHFFFAOYSA-N Ruthenium Chemical compound [Ru] KJTLSVCANCCWHF-UHFFFAOYSA-N 0.000 description 4
- GWEVSGVZZGPLCZ-UHFFFAOYSA-N Titan oxide Chemical compound O=[Ti]=O GWEVSGVZZGPLCZ-UHFFFAOYSA-N 0.000 description 4
- 239000000956 alloy Substances 0.000 description 4
- 239000004760 aramid Substances 0.000 description 4
- 229920003235 aromatic polyamide Polymers 0.000 description 4
- 229910052790 beryllium Inorganic materials 0.000 description 4
- 238000004140 cleaning Methods 0.000 description 4
- 238000010894 electron beam technology Methods 0.000 description 4
- 229910003437 indium oxide Inorganic materials 0.000 description 4
- PJXISJQVUVHSOJ-UHFFFAOYSA-N indium(iii) oxide Chemical compound [O-2].[O-2].[O-2].[In+3].[In+3] PJXISJQVUVHSOJ-UHFFFAOYSA-N 0.000 description 4
- 150000002500 ions Chemical class 0.000 description 4
- 229910052746 lanthanum Inorganic materials 0.000 description 4
- FZLIPJUXYLNCLC-UHFFFAOYSA-N lanthanum atom Chemical compound [La] FZLIPJUXYLNCLC-UHFFFAOYSA-N 0.000 description 4
- 239000011159 matrix material Substances 0.000 description 4
- 229910052750 molybdenum Inorganic materials 0.000 description 4
- 239000011733 molybdenum Substances 0.000 description 4
- QEFYFXOXNSNQGX-UHFFFAOYSA-N neodymium atom Chemical compound [Nd] QEFYFXOXNSNQGX-UHFFFAOYSA-N 0.000 description 4
- 239000012299 nitrogen atmosphere Substances 0.000 description 4
- QGLKJKCYBOYXKC-UHFFFAOYSA-N nonaoxidotritungsten Chemical compound O=[W]1(=O)O[W](=O)(=O)O[W](=O)(=O)O1 QGLKJKCYBOYXKC-UHFFFAOYSA-N 0.000 description 4
- SIWVEOZUMHYXCS-UHFFFAOYSA-N oxo(oxoyttriooxy)yttrium Chemical compound O=[Y]O[Y]=O SIWVEOZUMHYXCS-UHFFFAOYSA-N 0.000 description 4
- RVTZCBVAJQQJTK-UHFFFAOYSA-N oxygen(2-);zirconium(4+) Chemical compound [O-2].[O-2].[Zr+4] RVTZCBVAJQQJTK-UHFFFAOYSA-N 0.000 description 4
- BASFCYQUMIYNBI-UHFFFAOYSA-N platinum Chemical compound [Pt] BASFCYQUMIYNBI-UHFFFAOYSA-N 0.000 description 4
- 238000005498 polishing Methods 0.000 description 4
- 229910021420 polycrystalline silicon Inorganic materials 0.000 description 4
- 238000004549 pulsed laser deposition Methods 0.000 description 4
- 229910052707 ruthenium Inorganic materials 0.000 description 4
- 238000001004 secondary ion mass spectrometry Methods 0.000 description 4
- 238000005477 sputtering target Methods 0.000 description 4
- OGIDPMRJRNCKJF-UHFFFAOYSA-N titanium oxide Inorganic materials [Ti]=O OGIDPMRJRNCKJF-UHFFFAOYSA-N 0.000 description 4
- 229910001930 tungsten oxide Inorganic materials 0.000 description 4
- 230000008016 vaporization Effects 0.000 description 4
- VWQVUPCCIRVNHF-UHFFFAOYSA-N yttrium atom Chemical compound [Y] VWQVUPCCIRVNHF-UHFFFAOYSA-N 0.000 description 4
- 229910001928 zirconium oxide Inorganic materials 0.000 description 4
- CURLTUGMZLYLDI-UHFFFAOYSA-N Carbon dioxide Chemical compound O=C=O CURLTUGMZLYLDI-UHFFFAOYSA-N 0.000 description 3
- 206010021143 Hypoxia Diseases 0.000 description 3
- 239000004677 Nylon Substances 0.000 description 3
- 239000004952 Polyamide Substances 0.000 description 3
- 239000004642 Polyimide Substances 0.000 description 3
- 229910000577 Silicon-germanium Inorganic materials 0.000 description 3
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 3
- NIXOWILDQLNWCW-UHFFFAOYSA-N acrylic acid group Chemical group C(C=C)(=O)O NIXOWILDQLNWCW-UHFFFAOYSA-N 0.000 description 3
- 229910045601 alloy Inorganic materials 0.000 description 3
- 238000003491 array Methods 0.000 description 3
- ATBAMAFKBVZNFJ-UHFFFAOYSA-N beryllium atom Chemical compound [Be] ATBAMAFKBVZNFJ-UHFFFAOYSA-N 0.000 description 3
- 230000008859 change Effects 0.000 description 3
- 239000002131 composite material Substances 0.000 description 3
- 238000005520 cutting process Methods 0.000 description 3
- 229910001873 dinitrogen Inorganic materials 0.000 description 3
- 230000005684 electric field Effects 0.000 description 3
- YBMRDBCBODYGJE-UHFFFAOYSA-N germanium oxide Inorganic materials O=[Ge]=O YBMRDBCBODYGJE-UHFFFAOYSA-N 0.000 description 3
- 239000011521 glass Substances 0.000 description 3
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 3
- 238000000227 grinding Methods 0.000 description 3
- 239000011261 inert gas Substances 0.000 description 3
- 238000001459 lithography Methods 0.000 description 3
- 238000004518 low pressure chemical vapour deposition Methods 0.000 description 3
- CPLXHLVBOLITMK-UHFFFAOYSA-N magnesium oxide Inorganic materials [Mg]=O CPLXHLVBOLITMK-UHFFFAOYSA-N 0.000 description 3
- 239000000395 magnesium oxide Substances 0.000 description 3
- AXZKOIWUVFPNLO-UHFFFAOYSA-N magnesium;oxygen(2-) Chemical compound [O-2].[Mg+2] AXZKOIWUVFPNLO-UHFFFAOYSA-N 0.000 description 3
- 239000007769 metal material Substances 0.000 description 3
- 230000004048 modification Effects 0.000 description 3
- 238000012986 modification Methods 0.000 description 3
- 238000001451 molecular beam epitaxy Methods 0.000 description 3
- 238000000465 moulding Methods 0.000 description 3
- 229910052759 nickel Inorganic materials 0.000 description 3
- 125000004433 nitrogen atom Chemical group N* 0.000 description 3
- 229920001778 nylon Polymers 0.000 description 3
- 230000001590 oxidative effect Effects 0.000 description 3
- PVADDRMAFCOOPC-UHFFFAOYSA-N oxogermanium Chemical compound [Ge]=O PVADDRMAFCOOPC-UHFFFAOYSA-N 0.000 description 3
- 238000005268 plasma chemical vapour deposition Methods 0.000 description 3
- 238000009832 plasma treatment Methods 0.000 description 3
- 238000007747 plating Methods 0.000 description 3
- 229920002647 polyamide Polymers 0.000 description 3
- 229920000515 polycarbonate Polymers 0.000 description 3
- 239000004417 polycarbonate Substances 0.000 description 3
- 229920000728 polyester Polymers 0.000 description 3
- 229920001721 polyimide Polymers 0.000 description 3
- 229920000098 polyolefin Polymers 0.000 description 3
- 230000001681 protective effect Effects 0.000 description 3
- 238000011084 recovery Methods 0.000 description 3
- 229910001925 ruthenium oxide Inorganic materials 0.000 description 3
- WOCIAKWEIIZHES-UHFFFAOYSA-N ruthenium(iv) oxide Chemical compound O=[Ru]=O WOCIAKWEIIZHES-UHFFFAOYSA-N 0.000 description 3
- 239000010409 thin film Substances 0.000 description 3
- GPPXJZIENCGNKB-UHFFFAOYSA-N vanadium Chemical compound [V]#[V] GPPXJZIENCGNKB-UHFFFAOYSA-N 0.000 description 3
- YVTHLONGBIQYBO-UHFFFAOYSA-N zinc indium(3+) oxygen(2-) Chemical compound [O--].[Zn++].[In+3] YVTHLONGBIQYBO-UHFFFAOYSA-N 0.000 description 3
- 239000011787 zinc oxide Substances 0.000 description 3
- 229910052684 Cerium Inorganic materials 0.000 description 2
- VYZAMTAEIAYCRO-UHFFFAOYSA-N Chromium Chemical compound [Cr] VYZAMTAEIAYCRO-UHFFFAOYSA-N 0.000 description 2
- BPQQTUXANYXVAA-UHFFFAOYSA-N Orthosilicate Chemical compound [O-][Si]([O-])([O-])[O-] BPQQTUXANYXVAA-UHFFFAOYSA-N 0.000 description 2
- 229910003902 SiCl 4 Inorganic materials 0.000 description 2
- LEVVHYCKPQWKOP-UHFFFAOYSA-N [Si].[Ge] Chemical compound [Si].[Ge] LEVVHYCKPQWKOP-UHFFFAOYSA-N 0.000 description 2
- 229910052785 arsenic Inorganic materials 0.000 description 2
- RQNWIZPPADIBDY-UHFFFAOYSA-N arsenic atom Chemical compound [As] RQNWIZPPADIBDY-UHFFFAOYSA-N 0.000 description 2
- 238000004380 ashing Methods 0.000 description 2
- 238000000089 atomic force micrograph Methods 0.000 description 2
- 238000005452 bending Methods 0.000 description 2
- 230000000903 blocking effect Effects 0.000 description 2
- 229910052795 boron group element Inorganic materials 0.000 description 2
- 229910052800 carbon group element Inorganic materials 0.000 description 2
- 229910052804 chromium Inorganic materials 0.000 description 2
- 239000011651 chromium Substances 0.000 description 2
- 238000001816 cooling Methods 0.000 description 2
- 229910021419 crystalline silicon Inorganic materials 0.000 description 2
- 230000003247 decreasing effect Effects 0.000 description 2
- 239000000835 fiber Substances 0.000 description 2
- 230000005669 field effect Effects 0.000 description 2
- 238000004868 gas analysis Methods 0.000 description 2
- 229910052737 gold Inorganic materials 0.000 description 2
- 239000010931 gold Substances 0.000 description 2
- 238000009616 inductively coupled plasma Methods 0.000 description 2
- 238000009413 insulation Methods 0.000 description 2
- 238000010884 ion-beam technique Methods 0.000 description 2
- 229910052742 iron Inorganic materials 0.000 description 2
- 230000001788 irregular Effects 0.000 description 2
- 230000014759 maintenance of location Effects 0.000 description 2
- 230000007257 malfunction Effects 0.000 description 2
- WPBNNNQJVZRUHP-UHFFFAOYSA-L manganese(2+);methyl n-[[2-(methoxycarbonylcarbamothioylamino)phenyl]carbamothioyl]carbamate;n-[2-(sulfidocarbothioylamino)ethyl]carbamodithioate Chemical compound [Mn+2].[S-]C(=S)NCCNC([S-])=S.COC(=O)NC(=S)NC1=CC=CC=C1NC(=S)NC(=O)OC WPBNNNQJVZRUHP-UHFFFAOYSA-L 0.000 description 2
- 238000005259 measurement Methods 0.000 description 2
- 229910021421 monocrystalline silicon Inorganic materials 0.000 description 2
- RUFLMLWJRZAWLJ-UHFFFAOYSA-N nickel silicide Chemical compound [Ni]=[Si]=[Ni] RUFLMLWJRZAWLJ-UHFFFAOYSA-N 0.000 description 2
- 229910021334 nickel silicide Inorganic materials 0.000 description 2
- 229910052758 niobium Inorganic materials 0.000 description 2
- 239000010955 niobium Substances 0.000 description 2
- GUCVJGMIXFAOAE-UHFFFAOYSA-N niobium atom Chemical compound [Nb] GUCVJGMIXFAOAE-UHFFFAOYSA-N 0.000 description 2
- 150000001282 organosilanes Chemical class 0.000 description 2
- 230000001151 other effect Effects 0.000 description 2
- 230000000149 penetrating effect Effects 0.000 description 2
- 229910052697 platinum Inorganic materials 0.000 description 2
- 229910052696 pnictogen Inorganic materials 0.000 description 2
- 238000007639 printing Methods 0.000 description 2
- 238000001552 radio frequency sputter deposition Methods 0.000 description 2
- 230000009467 reduction Effects 0.000 description 2
- 238000007789 sealing Methods 0.000 description 2
- 229910021332 silicide Inorganic materials 0.000 description 2
- FVBUAEGBCNSCDD-UHFFFAOYSA-N silicide(4-) Chemical compound [Si-4] FVBUAEGBCNSCDD-UHFFFAOYSA-N 0.000 description 2
- 229910052709 silver Inorganic materials 0.000 description 2
- 239000004332 silver Substances 0.000 description 2
- 239000007787 solid Substances 0.000 description 2
- 239000000243 solution Substances 0.000 description 2
- 238000004528 spin coating Methods 0.000 description 2
- 239000011029 spinel Substances 0.000 description 2
- 229910052596 spinel Inorganic materials 0.000 description 2
- 238000009834 vaporization Methods 0.000 description 2
- VUFNLQXQSDUXKB-DOFZRALJSA-N 2-[4-[4-[bis(2-chloroethyl)amino]phenyl]butanoyloxy]ethyl (5z,8z,11z,14z)-icosa-5,8,11,14-tetraenoate Chemical group CCCCC\C=C/C\C=C/C\C=C/C\C=C/CCCC(=O)OCCOC(=O)CCCC1=CC=C(N(CCCl)CCCl)C=C1 VUFNLQXQSDUXKB-DOFZRALJSA-N 0.000 description 1
- DDFHBQSCUXNBSA-UHFFFAOYSA-N 5-(5-carboxythiophen-2-yl)thiophene-2-carboxylic acid Chemical compound S1C(C(=O)O)=CC=C1C1=CC=C(C(O)=O)S1 DDFHBQSCUXNBSA-UHFFFAOYSA-N 0.000 description 1
- 238000012935 Averaging Methods 0.000 description 1
- 239000004215 Carbon black (E152) Substances 0.000 description 1
- 102100040862 Dual specificity protein kinase CLK1 Human genes 0.000 description 1
- 102100040844 Dual specificity protein kinase CLK2 Human genes 0.000 description 1
- 101000749294 Homo sapiens Dual specificity protein kinase CLK1 Proteins 0.000 description 1
- 101000749291 Homo sapiens Dual specificity protein kinase CLK2 Proteins 0.000 description 1
- DGAQECJNVWCQMB-PUAWFVPOSA-M Ilexoside XXIX Chemical compound C[C@@H]1CC[C@@]2(CC[C@@]3(C(=CC[C@H]4[C@]3(CC[C@@H]5[C@@]4(CC[C@@H](C5(C)C)OS(=O)(=O)[O-])C)C)[C@@H]2[C@]1(C)O)C)C(=O)O[C@H]6[C@@H]([C@H]([C@@H]([C@H](O6)CO)O)O)O.[Na+] DGAQECJNVWCQMB-PUAWFVPOSA-M 0.000 description 1
- GPXJNWSHGFTCBW-UHFFFAOYSA-N Indium phosphide Chemical compound [In]#P GPXJNWSHGFTCBW-UHFFFAOYSA-N 0.000 description 1
- WHXSMMKQMYFTQS-UHFFFAOYSA-N Lithium Chemical compound [Li] WHXSMMKQMYFTQS-UHFFFAOYSA-N 0.000 description 1
- 229910017855 NH 4 F Inorganic materials 0.000 description 1
- CBENFWSGALASAD-UHFFFAOYSA-N Ozone Chemical compound [O-][O+]=O CBENFWSGALASAD-UHFFFAOYSA-N 0.000 description 1
- 241000862969 Stella Species 0.000 description 1
- NINIDFKCEFEMDL-UHFFFAOYSA-N Sulfur Chemical compound [S] NINIDFKCEFEMDL-UHFFFAOYSA-N 0.000 description 1
- 238000003917 TEM image Methods 0.000 description 1
- IMMKYCILXUEWSS-UHFFFAOYSA-N [Sn]=O.[Zn].[In].[In] Chemical compound [Sn]=O.[Zn].[In].[In] IMMKYCILXUEWSS-UHFFFAOYSA-N 0.000 description 1
- 230000001133 acceleration Effects 0.000 description 1
- MDPILPRLPQYEEN-UHFFFAOYSA-N aluminium arsenide Chemical compound [As]#[Al] MDPILPRLPQYEEN-UHFFFAOYSA-N 0.000 description 1
- 239000007864 aqueous solution Substances 0.000 description 1
- LDDQLRUQCUTJBB-UHFFFAOYSA-O azanium;hydrofluoride Chemical compound [NH4+].F LDDQLRUQCUTJBB-UHFFFAOYSA-O 0.000 description 1
- 239000002585 base Substances 0.000 description 1
- 229910052810 boron oxide Inorganic materials 0.000 description 1
- 125000004432 carbon atom Chemical group C* 0.000 description 1
- 229910002092 carbon dioxide Inorganic materials 0.000 description 1
- 239000001569 carbon dioxide Substances 0.000 description 1
- 229910002090 carbon oxide Inorganic materials 0.000 description 1
- JJWKPURADFRFRB-UHFFFAOYSA-N carbonyl sulfide Chemical compound O=C=S JJWKPURADFRFRB-UHFFFAOYSA-N 0.000 description 1
- ZMIGMASIKSOYAM-UHFFFAOYSA-N cerium Chemical group [Ce][Ce][Ce][Ce][Ce][Ce][Ce][Ce][Ce][Ce][Ce][Ce][Ce][Ce][Ce][Ce][Ce][Ce][Ce][Ce][Ce][Ce][Ce][Ce][Ce][Ce][Ce][Ce][Ce][Ce][Ce][Ce][Ce][Ce][Ce][Ce][Ce][Ce] ZMIGMASIKSOYAM-UHFFFAOYSA-N 0.000 description 1
- 150000001875 compounds Chemical class 0.000 description 1
- 238000012937 correction Methods 0.000 description 1
- 238000013461 design Methods 0.000 description 1
- 230000006866 deterioration Effects 0.000 description 1
- JKWMSGQKBLHBQQ-UHFFFAOYSA-N diboron trioxide Chemical compound O=BOB=O JKWMSGQKBLHBQQ-UHFFFAOYSA-N 0.000 description 1
- 238000007865 diluting Methods 0.000 description 1
- 239000000428 dust Substances 0.000 description 1
- 238000005265 energy consumption Methods 0.000 description 1
- 239000003822 epoxy resin Substances 0.000 description 1
- 238000011049 filling Methods 0.000 description 1
- 238000007667 floating Methods 0.000 description 1
- 239000011888 foil Substances 0.000 description 1
- 230000007274 generation of a signal involved in cell-cell signaling Effects 0.000 description 1
- 229910002804 graphite Inorganic materials 0.000 description 1
- 239000010439 graphite Substances 0.000 description 1
- 229930195733 hydrocarbon Natural products 0.000 description 1
- 150000002430 hydrocarbons Chemical class 0.000 description 1
- 238000003384 imaging method Methods 0.000 description 1
- 238000007654 immersion Methods 0.000 description 1
- 238000007689 inspection Methods 0.000 description 1
- 238000002955 isolation Methods 0.000 description 1
- 229910052743 krypton Inorganic materials 0.000 description 1
- DNNSSWSSYDEUBZ-UHFFFAOYSA-N krypton atom Chemical compound [Kr] DNNSSWSSYDEUBZ-UHFFFAOYSA-N 0.000 description 1
- 238000010030 laminating Methods 0.000 description 1
- 238000003475 lamination Methods 0.000 description 1
- 239000007788 liquid Substances 0.000 description 1
- 239000004973 liquid crystal related substance Substances 0.000 description 1
- 229910052744 lithium Inorganic materials 0.000 description 1
- 238000001755 magnetron sputter deposition Methods 0.000 description 1
- 230000007246 mechanism Effects 0.000 description 1
- 238000002844 melting Methods 0.000 description 1
- 230000008018 melting Effects 0.000 description 1
- 239000011156 metal matrix composite Substances 0.000 description 1
- 238000002488 metal-organic chemical vapour deposition Methods 0.000 description 1
- 239000011259 mixed solution Substances 0.000 description 1
- 238000002156 mixing Methods 0.000 description 1
- 239000002105 nanoparticle Substances 0.000 description 1
- 229910052754 neon Inorganic materials 0.000 description 1
- GKAOGPIIYCISHV-UHFFFAOYSA-N neon atom Chemical compound [Ne] GKAOGPIIYCISHV-UHFFFAOYSA-N 0.000 description 1
- 239000001272 nitrous oxide Substances 0.000 description 1
- 238000007645 offset printing Methods 0.000 description 1
- 239000002245 particle Substances 0.000 description 1
- 230000035515 penetration Effects 0.000 description 1
- 239000012466 permeate Substances 0.000 description 1
- 230000000704 physical effect Effects 0.000 description 1
- 238000001020 plasma etching Methods 0.000 description 1
- 238000007517 polishing process Methods 0.000 description 1
- 229920000647 polyepoxide Polymers 0.000 description 1
- 229920005591 polysilicon Polymers 0.000 description 1
- 239000011148 porous material Substances 0.000 description 1
- 230000002265 prevention Effects 0.000 description 1
- 239000000047 product Substances 0.000 description 1
- 238000010926 purge Methods 0.000 description 1
- 239000010453 quartz Substances 0.000 description 1
- 230000005855 radiation Effects 0.000 description 1
- 238000005546 reactive sputtering Methods 0.000 description 1
- 230000009257 reactivity Effects 0.000 description 1
- 230000000717 retained effect Effects 0.000 description 1
- 230000002441 reversible effect Effects 0.000 description 1
- 230000033764 rhythmic process Effects 0.000 description 1
- 238000004439 roughness measurement Methods 0.000 description 1
- 229910052594 sapphire Inorganic materials 0.000 description 1
- 239000010980 sapphire Substances 0.000 description 1
- 238000007650 screen-printing Methods 0.000 description 1
- 238000004904 shortening Methods 0.000 description 1
- HBMJWWWQQXIZIP-UHFFFAOYSA-N silicon carbide Chemical compound [Si+]#[C-] HBMJWWWQQXIZIP-UHFFFAOYSA-N 0.000 description 1
- 229910010271 silicon carbide Inorganic materials 0.000 description 1
- 229910052708 sodium Inorganic materials 0.000 description 1
- 239000011734 sodium Substances 0.000 description 1
- 238000005476 soldering Methods 0.000 description 1
- 238000004611 spectroscopical analysis Methods 0.000 description 1
- 229910002076 stabilized zirconia Inorganic materials 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
- 229910052717 sulfur Inorganic materials 0.000 description 1
- 239000011593 sulfur Substances 0.000 description 1
- 239000013589 supplement Substances 0.000 description 1
- 229910052723 transition metal Inorganic materials 0.000 description 1
- 150000003624 transition metals Chemical class 0.000 description 1
- 238000007740 vapor deposition Methods 0.000 description 1
- 239000011800 void material Substances 0.000 description 1
- 229910052724 xenon Inorganic materials 0.000 description 1
- FHNFHKCVQCLJFQ-UHFFFAOYSA-N xenon atom Chemical compound [Xe] FHNFHKCVQCLJFQ-UHFFFAOYSA-N 0.000 description 1
- 229910001233 yttria-stabilized zirconia Inorganic materials 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L28/00—Passive two-terminal components without a potential-jump or surface barrier for integrated circuits; Details thereof; Multistep manufacturing processes therefor
- H01L28/40—Capacitors
- H01L28/60—Electrodes
- H01L28/82—Electrodes with an enlarged surface, e.g. formed by texturisation
- H01L28/90—Electrodes with an enlarged surface, e.g. formed by texturisation having vertical extensions
-
- H—ELECTRICITY
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- H10B—ELECTRONIC MEMORY DEVICES
- H10B12/00—Dynamic random access memory [DRAM] devices
- H10B12/30—DRAM devices comprising one-transistor - one-capacitor [1T-1C] memory cells
-
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- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/02104—Forming layers
- H01L21/02107—Forming insulating materials on a substrate
- H01L21/02225—Forming insulating materials on a substrate characterised by the process for the formation of the insulating layer
- H01L21/0226—Forming insulating materials on a substrate characterised by the process for the formation of the insulating layer formation by a deposition process
- H01L21/02263—Forming insulating materials on a substrate characterised by the process for the formation of the insulating layer formation by a deposition process deposition from the gas or vapour phase
- H01L21/02266—Forming insulating materials on a substrate characterised by the process for the formation of the insulating layer formation by a deposition process deposition from the gas or vapour phase deposition by physical ablation of a target, e.g. sputtering, reactive sputtering, physical vapour deposition or pulsed laser deposition
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- H01L21/02104—Forming layers
- H01L21/02107—Forming insulating materials on a substrate
- H01L21/02225—Forming insulating materials on a substrate characterised by the process for the formation of the insulating layer
- H01L21/0226—Forming insulating materials on a substrate characterised by the process for the formation of the insulating layer formation by a deposition process
- H01L21/02263—Forming insulating materials on a substrate characterised by the process for the formation of the insulating layer formation by a deposition process deposition from the gas or vapour phase
- H01L21/02271—Forming insulating materials on a substrate characterised by the process for the formation of the insulating layer formation by a deposition process deposition from the gas or vapour phase deposition by decomposition or reaction of gaseous or vapour phase compounds, i.e. chemical vapour deposition
- H01L21/02274—Forming insulating materials on a substrate characterised by the process for the formation of the insulating layer formation by a deposition process deposition from the gas or vapour phase deposition by decomposition or reaction of gaseous or vapour phase compounds, i.e. chemical vapour deposition in the presence of a plasma [PECVD]
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- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
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- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/28—Manufacture of electrodes on semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/268
-
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- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
- H01L21/31—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to form insulating layers thereon, e.g. for masking or by using photolithographic techniques; After treatment of these layers; Selection of materials for these layers
- H01L21/3105—After-treatment
- H01L21/311—Etching the insulating layers by chemical or physical means
- H01L21/31105—Etching inorganic layers
- H01L21/31111—Etching inorganic layers by chemical means
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-
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- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
- H01L21/31—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to form insulating layers thereon, e.g. for masking or by using photolithographic techniques; After treatment of these layers; Selection of materials for these layers
- H01L21/3205—Deposition of non-insulating-, e.g. conductive- or resistive-, layers on insulating layers; After-treatment of these layers
- H01L21/321—After treatment
- H01L21/32115—Planarisation
- H01L21/3212—Planarisation by chemical mechanical polishing [CMP]
-
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- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/52—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames
- H01L23/522—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames including external interconnections consisting of a multilayer structure of conductive and insulating layers inseparably formed on the semiconductor body
- H01L23/532—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames including external interconnections consisting of a multilayer structure of conductive and insulating layers inseparably formed on the semiconductor body characterised by the materials
- H01L23/5329—Insulating materials
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- H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
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- H01L27/12—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being other than a semiconductor body, e.g. an insulating body
- H01L27/1214—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being other than a semiconductor body, e.g. an insulating body comprising a plurality of TFTs formed on a non-semiconducting substrate, e.g. driving circuits for AMLCDs
- H01L27/1222—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being other than a semiconductor body, e.g. an insulating body comprising a plurality of TFTs formed on a non-semiconducting substrate, e.g. driving circuits for AMLCDs with a particular composition, shape or crystalline structure of the active layer
- H01L27/1225—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being other than a semiconductor body, e.g. an insulating body comprising a plurality of TFTs formed on a non-semiconducting substrate, e.g. driving circuits for AMLCDs with a particular composition, shape or crystalline structure of the active layer with semiconductor materials not belonging to the group IV of the periodic table, e.g. InGaZnO
-
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- H01L29/00—Semiconductor devices specially adapted for rectifying, amplifying, oscillating or switching and having potential barriers; Capacitors or resistors having potential barriers, e.g. a PN-junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
- H01L29/40—Electrodes ; Multistep manufacturing processes therefor
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- H01L29/417—Electrodes ; Multistep manufacturing processes therefor characterised by their shape, relative sizes or dispositions carrying the current to be rectified, amplified or switched
-
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- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L29/00—Semiconductor devices specially adapted for rectifying, amplifying, oscillating or switching and having potential barriers; Capacitors or resistors having potential barriers, e.g. a PN-junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
- H01L29/40—Electrodes ; Multistep manufacturing processes therefor
- H01L29/41—Electrodes ; Multistep manufacturing processes therefor characterised by their shape, relative sizes or dispositions
- H01L29/423—Electrodes ; Multistep manufacturing processes therefor characterised by their shape, relative sizes or dispositions not carrying the current to be rectified, amplified or switched
-
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- H01L29/40—Electrodes ; Multistep manufacturing processes therefor
- H01L29/43—Electrodes ; Multistep manufacturing processes therefor characterised by the materials of which they are formed
- H01L29/49—Metal-insulator-semiconductor electrodes, e.g. gates of MOSFET
-
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- H01L29/00—Semiconductor devices specially adapted for rectifying, amplifying, oscillating or switching and having potential barriers; Capacitors or resistors having potential barriers, e.g. a PN-junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
- H01L29/66—Types of semiconductor device ; Multistep manufacturing processes therefor
- H01L29/66007—Multistep manufacturing processes
- H01L29/66075—Multistep manufacturing processes of devices having semiconductor bodies comprising group 14 or group 13/15 materials
- H01L29/66227—Multistep manufacturing processes of devices having semiconductor bodies comprising group 14 or group 13/15 materials the devices being controllable only by the electric current supplied or the electric potential applied, to an electrode which does not carry the current to be rectified, amplified or switched, e.g. three-terminal devices
- H01L29/66409—Unipolar field-effect transistors
- H01L29/66477—Unipolar field-effect transistors with an insulated gate, i.e. MISFET
-
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- H01L29/00—Semiconductor devices specially adapted for rectifying, amplifying, oscillating or switching and having potential barriers; Capacitors or resistors having potential barriers, e.g. a PN-junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
- H01L29/66—Types of semiconductor device ; Multistep manufacturing processes therefor
- H01L29/66007—Multistep manufacturing processes
- H01L29/66969—Multistep manufacturing processes of devices having semiconductor bodies not comprising group 14 or group 13/15 materials
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- H01L29/66—Types of semiconductor device ; Multistep manufacturing processes therefor
- H01L29/68—Types of semiconductor device ; Multistep manufacturing processes therefor controllable by only the electric current supplied, or only the electric potential applied, to an electrode which does not carry the current to be rectified, amplified or switched
- H01L29/76—Unipolar devices, e.g. field effect transistors
- H01L29/772—Field effect transistors
- H01L29/78—Field effect transistors with field effect produced by an insulated gate
- H01L29/786—Thin film transistors, i.e. transistors with a channel being at least partly a thin film
-
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- H01L29/66—Types of semiconductor device ; Multistep manufacturing processes therefor
- H01L29/68—Types of semiconductor device ; Multistep manufacturing processes therefor controllable by only the electric current supplied, or only the electric potential applied, to an electrode which does not carry the current to be rectified, amplified or switched
- H01L29/76—Unipolar devices, e.g. field effect transistors
- H01L29/772—Field effect transistors
- H01L29/78—Field effect transistors with field effect produced by an insulated gate
- H01L29/786—Thin film transistors, i.e. transistors with a channel being at least partly a thin film
- H01L29/78645—Thin film transistors, i.e. transistors with a channel being at least partly a thin film with multiple gate
- H01L29/78648—Thin film transistors, i.e. transistors with a channel being at least partly a thin film with multiple gate arranged on opposing sides of the channel
-
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- H01L29/66—Types of semiconductor device ; Multistep manufacturing processes therefor
- H01L29/68—Types of semiconductor device ; Multistep manufacturing processes therefor controllable by only the electric current supplied, or only the electric potential applied, to an electrode which does not carry the current to be rectified, amplified or switched
- H01L29/76—Unipolar devices, e.g. field effect transistors
- H01L29/772—Field effect transistors
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Abstract
Description
<半導体装置の構成例>
以下では、本発明の一態様に係るトランジスタ400および容量素子100を有する半導体装置の一例について説明する。
容量素子100は、酸化物406、絶縁体412、導電体404、および絶縁体410の上に配置される。絶縁体422、絶縁体112、絶縁体114、および絶縁体116に形成された開口115の内壁、絶縁体420、および導電体108bに接して配置された導電体110と、導電体110の上に配置された絶縁体130と、絶縁体130の上に配置された導電体120aおよび導電体120bを有する。なお、以下において、導電体120aおよび導電体120bをまとめて導電体120という場合がある。
容量素子100およびトランジスタ400を有する半導体装置を形成する基板としては、例えば、絶縁体基板、半導体基板または導電体基板を用いればよい。絶縁体基板としては、例えば、ガラス基板、石英基板、サファイア基板、安定化ジルコニア基板(イットリア安定化ジルコニア基板など)、樹脂基板などがある。また、半導体基板としては、例えば、シリコン、ゲルマニウムなどの半導体基板、または炭化シリコン、シリコンゲルマニウム、ヒ化ガリウム、リン化インジウム、酸化亜鉛、酸化ガリウムからなる化合物半導体基板などがある。さらには、前述の半導体基板内部に絶縁体領域を有する半導体基板、例えばSOI(Silicon On Insulator)基板などがある。導電体基板としては、黒鉛基板、金属基板、合金基板、導電性樹脂基板などがある。または、金属の窒化物を有する基板、金属の酸化物を有する基板などがある。さらには、絶縁体基板に導電体または半導体が設けられた基板、半導体基板に導電体または絶縁体が設けられた基板、導電体基板に半導体または絶縁体が設けられた基板などがある。または、これらの基板に素子が設けられたものを用いてもよい。基板に設けられる素子としては、容量素子、抵抗素子、スイッチ素子、発光素子、記憶素子などがある。
絶縁体としては、絶縁性を有する酸化物、窒化物、酸化窒化物、窒化酸化物、金属酸化物、金属酸化窒化物、金属窒化酸化物などがある。
導電体404、導電体108a、導電体108b、導電体120b、および導電体162bとしては、アルミニウム、クロム、銅、銀、金、白金、タンタル、ニッケル、チタン、モリブデン、タングステン、ハフニウム、バナジウム、ニオブ、マンガン、マグネシウム、ジルコニウム、ベリリウム、インジウム、ルテニウムなどから選ばれた金属元素を1種以上含む材料を用いることができる。また、リン等の不純物元素を含有させた多結晶シリコンに代表される、電気伝導度が高い半導体、ニッケルシリサイドなどのシリサイドを用いてもよい。
次に、本発明に係るトランジスタ400および容量素子100を有する半導体装置の作製方法を、図2から図16を用いて説明する。
本実施の形態に示す半導体装置は図1に示すものに限られるものではない。以下では、図17から図19を用いて、本実施の形態に示す半導体装置の変形例について説明する。
次に、上記のトランジスタ400の構成例について、図20から図26を用いて説明する。図20(A)は、本発明の一態様に係るトランジスタ400aの上面図である。また、図20(B)は、図20(A)にA1−A2の一点鎖線で示す部位の断面図である。つまりトランジスタ400aのチャネル長方向の断面図を示す。図20(C)は、図20(A)にA3−A4の一点鎖線で示す部位の断面図である。つまりトランジスタ400aのチャネル幅方向の断面図を示す。図20(A)の上面図では、図の明瞭化のために一部の要素を省いて図示している。なお、トランジスタのチャネル長方向とは、基板と水平な面内において、ソース(ソース領域またはソース電極)及びドレイン(ドレイン領域またはドレイン電極)間において、キャリアが移動する方向を意味し、チャネル幅方向は、基板と水平な面内において、チャネル長方向に対して垂直の方向を意味する。
トランジスタを、水素などの不純物および酸素の透過を抑制する機能を有する絶縁体で囲うことによって、トランジスタの電気特性を安定にすることができる。例えば絶縁体401、及び絶縁体420として、水素などの不純物および酸素の透過を抑制する機能を有する絶縁体を用いればよい。また、絶縁体303に水素などの不純物および酸素の透過を抑制する機能を有する絶縁体を用いてもよい。絶縁体401、絶縁体303、及び絶縁体420は、絶縁体402などより、水または水素などの不純物が透過しにくい絶縁性材料を用いて形成することが好ましい。
導電体404、導電体310、導電体416a1、導電体416a2、導電体108a、導電体108bとしては、アルミニウム、クロム、銅、銀、金、白金、タンタル、ニッケル、チタン、モリブデン、タングステン、ハフニウム、バナジウム、ニオブ、マンガン、マグネシウム、ジルコニウム、ベリリウム、インジウムなどから選ばれた金属元素を1種以上含む材料を用いることができる。また、リン等の不純物元素を含有させた多結晶シリコンに代表される、電気伝導度が高い半導体、ニッケルシリサイドなどのシリサイドを用いてもよい。
以下では、本発明の一態様に係る図20に示すトランジスタの作製方法を図21および図22を用いて説明する。図21および図22では、図20(B)に示す一点鎖線A1−A2の断面に対応する断面図と、図20(C)に示す一点鎖線A3−A4の断面に対応する断面図と、を示している。
本実施の形態に示すトランジスタは図20に示すものに限られるものではない。以下では、図23から図25を用いて、本実施の形態に示すトランジスタの変形例について説明する。図23から図25は、図20と同様に、(A)が本発明の一態様に係るトランジスタの上面図である。また、(B)は、(A)にA1−A2の一点鎖線で示す部位の断面図である。また、(C)は、(A)にA3−A4の一点鎖線で示す部位の断面図である。(A)の上面図では、図の明瞭化のために一部の要素を省いて図示している。また、以下において、トランジスタ400aと同一の符号を付した構成については、トランジスタ400aの対応する記載を参酌することができる。
本実施の形態では、半導体装置の一形態として、記憶装置として機能する半導体装置について、図27乃至図29を用いて説明する。
図27に示す半導体装置は、トランジスタ300と、トランジスタ200、トランジスタ345および容量素子360を有している。ここで、トランジスタ200および容量素子360として、上記実施の形態に示すトランジスタ400(トランジスタ400a、トランジスタ400b、およびトランジスタ400cなども含む)と、容量素子100を用いることができる。また、トランジスタ345としてトランジスタ400dなどを用いることができる。
本発明の一態様の半導体装置は、図27に示すようにトランジスタ300、トランジスタ200、トランジスタ345および容量素子360を有する。トランジスタ200およびトランジスタ345はトランジスタ300の上方に設けられ、容量素子360はトランジスタ300、トランジスタ200およびトランジスタ345の上方に設けられている。
次に、本実施の形態のメモリセルアレイの一例を、図29に示す。図27に示す記憶装置をメモリセルとして、マトリクス状に配置することで、メモリセルアレイを構成することができる。なお、図29には、図27に示すトランジスタ345は省略する。図29は、図27に示す記憶装置を、マトリクス状に配置した場合における、行の一部を抜き出した断面図である。
本実施の形態では、表示コントローラIC、およびソースドライバICなどに用いることができる、本発明の一態様に係る半導体装置を含むフレームメモリについて説明する。
DOSRAM1400は、コントローラ1405、行回路1410、列回路1415、メモリセルおよびセンスアンプアレイ1420(以下、「MC−SAアレイ1420」と呼ぶ。)を有する。
MC−SAアレイ1420は、メモリセルアレイ1422をセンスアンプアレイ1423上に積層した積層構造をもつ。グローバルビット線GBLL、GBLRはメモリセルアレイ1422上に積層されている。DOSRAM1400では、ビット線の構造に、ローカルビット線とグローバルビット線とで階層化された階層ビット線構造が採用されている。例えば、図28に示す半導体装置をDOSRAM1400に用いる場合、メモリセルアレイ1422をトランジスタ200および容量素子360を含む層で構成し、センスアンプアレイ1423をトランジスタ300を含む層で構成することができる。
コントローラ1405は、DOSRAM1400の動作全般を制御する機能を有する。コントローラ1405は、外部からの入力されるコマンド信号を論理演算して、動作モードを決定する機能、決定した動作モードが実行されるように、行回路1410、列回路1415の制御信号を生成する機能、外部から入力されるアドレス信号を保持する機能、内部アドレス信号を生成する機能を有する。
行回路1410は、MC−SAアレイ1420を駆動する機能を有する。デコーダ1411はアドレス信号をデコードする機能を有する。ワード線ドライバ回路1412は、アクセス対象行のワード線WLを選択する選択信号を生成する。
列回路1415は、データ信号WDA[31:0]の入力を制御する機能、データ信号RDA[31:0]の出力を制御する機能を有する。データ信号WDA[31:0]は書き込みデータ信号であり、データ信号RDA[31:0]は読み出しデータ信号である。
本実施の形態では、本発明の一態様に係る酸化物を半導体に用いたトランジスタ(OSトランジスタ)が適用されている半導体装置の一例として、FPGA(フィールドプログラマブルゲートアレイ)について説明する。本実施の形態のFPGAは、コンフィギュレーションメモリ、およびレジスタにOSメモリが適用されている。ここでは、このようなFPGAを「OS−FPGA」と呼ぶ。
“H”の信号storeがOS−FF3140に入力されると、シャドウレジスタ3142はFF3141のデータをバックアップする。ノードN36は、ノードQのデータが書き込まれることで、“L”となり、ノードNB36は、ノードQBのデータが書き込まれることで、“H”となる。しかる後、パワーゲーティングが実行され、パワースイッチ3127をオフにする。FF3141のノードQ、QBのデータは消失するが、電源オフであっても、シャドウレジスタ3142はバックアップしたデータを保持する。
パワースイッチ3127をオンにし、PLE3121に電源を供給する。しかる後、“H”の信号loadがOS−FF3140に入力されると、シャドウレジスタ3142はバックアップしているデータをFF3141に書き戻す。ノードN36は“L”であるので、ノードN37は“L”が維持され、ノードNB36は“H”であるので、ノードNB37は“H”となる。よって、ノードQは“H”になり、ノードQBは“L”になる。つまり、OS−FF3140はバックアップ動作時の状態に復帰する。
本実施の形態においては、上述した記憶装置など、本発明の一態様に係る半導体装置を含むCPUの一例について説明する。
図36に示す半導体装置5400は、CPUコア5401、パワーマネージメントユニット5421および周辺回路5422を有する。パワーマネージメントユニット5421は、パワーコントローラ5402、およびパワースイッチ5403を有する。周辺回路5422は、キャッシュメモリを有するキャッシュ5404、バスインターフェース(BUS I/F)5405、及びデバッグインターフェース(Debug I/F)5406を有する。CPUコア5401は、データバス5423、制御装置5407、PC(プログラムカウンタ)5408、パイプラインレジスタ5409、パイプラインレジスタ5410、ALU(Arithmetic logic unit)5411、及びレジスタファイル5412を有する。CPUコア5401と、キャッシュ5404等の周辺回路5422とのデータのやり取りは、データバス5423を介して行われる。
本実施の形態では、本発明の一態様に係る半導体装置の一形態を、図38、および図39を用いて説明する。
図38(A)は、ダイシング処理が行なわれる前の基板711の上面図を示している。基板711としては、例えば、半導体基板(「半導体ウエハ」ともいう。)を用いることができる。基板711上には、複数の回路領域712が設けられている。回路領域712には、本発明の一態様に係る半導体装置などを設けることができる。
チップ715を用いた電子部品の一例について、図39(A)および図39(B)を用いて説明する。なお、電子部品は、半導体パッケージ、またはIC用パッケージともいう。電子部品は、端子取り出し方向、端子の形状などに応じて、複数の規格、名称などが存在する。
<電子機器>
本発明の一態様に係る半導体装置は、様々な電子機器に用いることができる。図40に、本発明の一態様に係る半導体装置を用いた電子機器の具体例を示す。
100a 容量素子
100b 容量素子
108a 導電体
108aa 導電体
108ab 導電体
108b 導電体
108ba 導電体
108bb 導電体
109a 絶縁体
109b 絶縁体
110 導電体
110A 導電体
112 絶縁体
114 絶縁体
115 開口
116 絶縁体
117 開口
118 絶縁体
120 導電体
120a 導電体
120aA 導電体
120b 導電体
120bA 導電体
120bB 導電体
122 ハードマスク
122A 導電体
124 ハードマスク
124A 絶縁体
126 充填剤
128 膜
130 絶縁体
132 ハードマスク
132A 絶縁体
150 絶縁体
160 接続部
162 導電体
162a 導電体
162b 導電体
200 トランジスタ
210 絶縁体
212 絶縁体
214 絶縁体
216 絶縁体
218 導電体
219 導電体
220 絶縁体
222 絶縁体
224 絶縁体
230 絶縁体
232 絶縁体
246 導電体
248 導電体
280 絶縁体
282 絶縁体
286 絶縁体
288 絶縁体
290 絶縁体
292 絶縁体
294 絶縁体
296 導電体
298 導電体
300 トランジスタ
301 絶縁体
302 絶縁体
303 絶縁体
310 導電体
310a 導電体
310b 導電体
311 基板
313 半導体領域
314a 低抵抗領域
314b 低抵抗領域
315 絶縁体
316 導電体
320 絶縁体
322 絶縁体
324 絶縁体
326 絶縁体
328 導電体
330 導電体
345 トランジスタ
350 絶縁体
352 絶縁体
354 絶縁体
356 導電体
360 容量素子
400 トランジスタ
400a トランジスタ
400b トランジスタ
400c トランジスタ
400d トランジスタ
401 絶縁体
402 絶縁体
404 導電体
404a 導電体
404b 導電体
404c 導電体
406 酸化物
406a 酸化物
406a1 酸化物
406a2 酸化物
406A 酸化膜
406b 酸化物
406b1 酸化物
406b2 酸化物
406B 酸化膜
406c 酸化物
406C 酸化膜
408a 絶縁体
408b 絶縁体
409 絶縁体
410 絶縁体
412 絶縁体
412A 絶縁膜
416a1 導電体
416a2 導電体
417a1 バリア膜
417a2 バリア膜
418 バリア膜
419a 絶縁体
419b 絶縁体
420 絶縁体
422 絶縁体
426a 領域
426b 領域
426c 領域
500 構造
600a メモリセル
600b メモリセル
711 基板
712 回路領域
713 分離領域
714 分離線
715 チップ
750 電子部品
752 プリント基板
754 実装基板
755 リード
1400 DOSRAM
1405 コントローラ
1410 行回路
1411 デコーダ
1412 ワード線ドライバ回路
1413 列セレクタ
1414 センスアンプドライバ回路
1415 列回路
1416 グローバルセンスアンプアレイ
1417 入出力回路
1420 MC−SAアレイ
1422 メモリセルアレイ
1423 センスアンプアレイ
1425 ローカルメモリセルアレイ
1426 ローカルセンスアンプアレイ
1444 スイッチアレイ
1445 メモリセル
1446 センスアンプ
1447 グローバルセンスアンプ
2910 情報端末
2911 筐体
2912 表示部
2913 カメラ
2914 スピーカ部
2915 操作スイッチ
2916 外部接続部
2917 マイク
2920 ノート型パーソナルコンピュータ
2921 筐体
2922 表示部
2923 キーボード
2924 ポインティングデバイス
2940 ビデオカメラ
2941 筐体
2942 筐体
2943 表示部
2944 操作スイッチ
2945 レンズ
2946 接続部
2950 情報端末
2951 筐体
2952 表示部
2960 情報端末
2961 筐体
2962 表示部
2963 バンド
2964 バックル
2965 操作スイッチ
2966 入出力端子
2967 アイコン
2980 自動車
2981 車体
2982 車輪
2983 ダッシュボード
2984 ライト
3001 配線
3002 配線
3003 配線
3004 配線
3005 配線
3006 配線
3007 配線
3008 配線
3009 配線
3010 配線
3011 配線
3110 OS−FPGA
3111 コントローラ
3112 ワードドライバ
3113 データドライバ
3115 プログラマブルエリア
3117 IOB
3119 コア
3120 LAB
3121 PLE
3123 LUTブロック
3124 レジスタブロック
3125 セレクタ
3126 CM
3127 パワースイッチ
3128 CM
3130 SAB
3131 SB
3133 PRS
3135 CM
3137 メモリ回路
3137B メモリ回路
3140 OS−FF
3141 FF
3142 シャドウレジスタ
3143 メモリ回路
3143B メモリ回路
3188 インバータ回路
3189 インバータ回路
5400 半導体装置
5401 CPUコア
5402 パワーコントローラ
5403 パワースイッチ
5404 キャッシュ
5405 バスインターフェース
5406 デバッグインターフェース
5407 制御装置
5408 PC
5409 パイプラインレジスタ
5410 パイプラインレジスタ
5411 ALU
5412 レジスタファイル
5421 パワーマネージメントユニット
5422 周辺回路
5423 データバス
5500 半導体装置
5501 記憶回路
5502 記憶回路
5503 記憶回路
5504 回路
5509 トランジスタ
5510 トランジスタ
5512 トランジスタ
5513 トランジスタ
5515 トランジスタ
5517 トランジスタ
5518 トランジスタ
5519 容量素子
5520 容量素子
5540 配線
5541 配線
5542 配線
5543 配線
5544 配線
Claims (15)
- 第1の絶縁体と、
前記第1の絶縁体を貫通するように配置された第1の導電体と、
前記第1の絶縁体の上に配置され、前記第1の絶縁体および前記第1の導電体に達する開口が形成された、第2の絶縁体と、
前記開口の内壁、前記第1の絶縁体、および前記第1の導電体に接して配置された第2の導電体と、
前記第2の導電体の上に配置された、第3の絶縁体と、
前記第3の絶縁体の上に配置された、第4の導電体と、を有し、
前記第1の絶縁体の前記第2の導電体と接する領域の膜厚は、前記第1の絶縁体の該領域以外の膜厚より薄く、
前記第1の導電体は、前記第1の絶縁体の、前記第2の導電体と接する領域の上面より上の部分において、湾曲面を有する、ことを特徴とする容量素子。 - トランジスタと、容量素子と、を有し、
前記トランジスタは、
金属酸化物と、
前記金属酸化物と電気的に接続された、第1の導電体と、を有し、
前記容量素子は、
前記金属酸化物の上に配置され、前記第1の導電体が貫通している第1の絶縁体と、
前記第1の絶縁体の上に配置され、前記第1の絶縁体および前記第1の導電体に達する開口が形成された、第2の絶縁体と、
前記開口の内壁、前記第1の絶縁体、および前記第1の導電体に接して配置された第2の導電体と、
前記第2の導電体の上に配置された、第3の絶縁体と、
前記第3の絶縁体の上に配置された、第4の導電体と、を有し、
前記第1の絶縁体は、前記第2の絶縁体より、水素の透過を抑制する機能が高い、ことを特徴とする半導体装置。 - 請求項2において、
前記第1の導電体は、前記第1の絶縁体の、前記第2の導電体と接する領域の上面より上の部分において、湾曲面を有する、ことを特徴とする半導体装置。 - 請求項2または請求項3のいずれかにおいて、
前記第1の導電体は、前記第1の絶縁体の、前記第2の導電体と接する領域の上面より下の部分において、底面と側面のなす角が90°以上である、ことを特徴とする半導体装置。 - 請求項2乃至請求項4のいずれか一項において、
前記第1の絶縁体の前記第2の導電体と接する領域の膜厚は、前記第1の絶縁体の該領域以外の膜厚より薄い、ことを特徴とする半導体装置。 - 請求項2乃至請求項5のいずれか一項において、
前記第1の絶縁体は、アルミニウムおよび酸素を含む、ことを特徴とする半導体装置。 - 請求項2乃至請求項6のいずれか一項において、
前記第2の絶縁体は、第5の絶縁体と、該第5の絶縁体の上に配置された第6の絶縁体と、を有し、
前記第5の絶縁体および前記第6の絶縁体の一方は、圧縮応力を有し、
前記第5の絶縁体および前記第6の絶縁体の他方は、引っ張り応力を有する、ことを特徴とする半導体装置。 - 請求項2乃至請求項7のいずれか一項において、
前記第4の導電体は、前記開口を埋め込むように形成され、
前記第4の導電体は、前記第2の絶縁体と重なる領域を有し、
前記第4の導電体の当該領域の上面の平均面粗さが2nm以下である、ことを特徴とする半導体装置。 - 請求項2乃至請求項8のいずれか一項において、
前記金属酸化物は、Inと、元素M(MはAl、Ga、Y、またはSn)と、Znと、を含む、ことを特徴とする半導体装置。 - 金属酸化物を有するトランジスタの上に第1の絶縁体を形成する工程と、
前記第1の絶縁体の上に第2の絶縁体を形成する工程と、
前記第1の絶縁体および前記第2の絶縁体に、前記トランジスタのソースおよびドレインの一方に達する第1の開口と、前記トランジスタのソースおよびドレインの他方に達する第2の開口を形成する工程と、
前記第1の開口に第1の導電体を埋め込み、前記第2の開口に第2の導電体を埋め込む工程と、
前記第2の絶縁体、前記第1の導電体、および前記第2の導電体の上に第3の絶縁体を形成する工程と、
ドライエッチング処理を行い、前記第1の絶縁体および前記第1の導電体に達する第3の開口を形成する工程と、
前記第3の開口の内壁、前記第1の絶縁体、および前記第1の導電体に接して、第3の導電体を形成する工程と、
前記第3の導電体の上に第4の絶縁体を形成する工程と、
前記第4の絶縁体の上に第4の導電体を形成する工程と、を有し、
前記第1の絶縁体として、前記第2の絶縁体より、水素の透過を抑制する機能が高い絶縁体を用い、
前記ドライエッチング処理において、少なくとも前記第1の導電体の上面が露出した段階で、エッチングガスに、炭素とフッ素を含み、かつ該炭素の原子数比が該フッ素の原子数比の50%以上であるガスを含む、ことを特徴とする半導体装置の作製方法。 - 請求項10において、
前記第3の絶縁体を形成する工程において、
PECVD法を用いて第1の酸化シリコンを成膜し、
前記第1の酸化シリコンの上に、APCVD法を用いて第2の酸化シリコンを成膜する、ことを特徴とする半導体装置の作製方法。 - 請求項10または請求項11のいずれかにおいて、
前記第4の導電体を形成する工程において、
前記第4の導電体を成膜し、
前記第4の導電体の上に第5の絶縁体を成膜し、
前記第4の導電体が露出するようにCMP処理を行う、ことを特徴とする半導体装置の作製方法。 - 請求項10乃至請求項12のいずれか一項において、
前記ドライエッチング処理において、前記エッチングガスにアルゴンを含み、
前記アルゴンの流量が、エッチングガス全体の流量の90%以上である、ことを特徴とする半導体装置の作製方法。 - 請求項10乃至請求項13のいずれか一項において、
前記第1の絶縁体は、アルミニウムを含むターゲットを用いて、酸素を含む雰囲気でスパッタリング法で成膜する、ことを特徴とする半導体装置の作製方法。 - 請求項10乃至請求項14のいずれか一項において、
前記金属酸化物は、Inと、元素M(MはAl、Ga、Y、またはSn)と、Znと、を含むターゲットを用いてスパッタリング法で成膜する、ことを特徴とする半導体装置の作製方法。
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Also Published As
Publication number | Publication date |
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US12041765B2 (en) | 2024-07-16 |
US11380688B2 (en) | 2022-07-05 |
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TWI839677B (zh) | 2024-04-21 |
US20200043931A1 (en) | 2020-02-06 |
TWI755475B (zh) | 2022-02-21 |
KR20240055166A (ko) | 2024-04-26 |
US20240090194A1 (en) | 2024-03-14 |
KR20230041843A (ko) | 2023-03-24 |
US20220359523A1 (en) | 2022-11-10 |
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JP7045865B2 (ja) | 2022-04-01 |
TW202230718A (zh) | 2022-08-01 |
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