JP2018056361A5 - - Google Patents

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Publication number
JP2018056361A5
JP2018056361A5 JP2016191485A JP2016191485A JP2018056361A5 JP 2018056361 A5 JP2018056361 A5 JP 2018056361A5 JP 2016191485 A JP2016191485 A JP 2016191485A JP 2016191485 A JP2016191485 A JP 2016191485A JP 2018056361 A5 JP2018056361 A5 JP 2018056361A5
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JP
Japan
Prior art keywords
opening
layer
wiring
solder resist
carrier
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2016191485A
Other languages
English (en)
Japanese (ja)
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JP6637864B2 (ja
JP2018056361A (ja
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Publication date
Application filed filed Critical
Priority to JP2016191485A priority Critical patent/JP6637864B2/ja
Priority claimed from JP2016191485A external-priority patent/JP6637864B2/ja
Priority to TW106132009A priority patent/TWI767939B/zh
Priority to KR1020170120982A priority patent/KR102394215B1/ko
Priority to US15/714,307 priority patent/US10340214B2/en
Publication of JP2018056361A publication Critical patent/JP2018056361A/ja
Publication of JP2018056361A5 publication Critical patent/JP2018056361A5/ja
Application granted granted Critical
Publication of JP6637864B2 publication Critical patent/JP6637864B2/ja
Active legal-status Critical Current
Anticipated expiration legal-status Critical

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JP2016191485A 2016-09-29 2016-09-29 キャリア基材付き配線基板、キャリア基材付き配線基板の製造方法 Active JP6637864B2 (ja)

Priority Applications (4)

Application Number Priority Date Filing Date Title
JP2016191485A JP6637864B2 (ja) 2016-09-29 2016-09-29 キャリア基材付き配線基板、キャリア基材付き配線基板の製造方法
TW106132009A TWI767939B (zh) 2016-09-29 2017-09-19 添加載體基材的佈線基板和製造添加載體基材的佈線基板的方法
KR1020170120982A KR102394215B1 (ko) 2016-09-29 2017-09-20 캐리어 기재 부착 배선 기판 및 캐리어 기재 부착 배선 기판의 제조 방법
US15/714,307 US10340214B2 (en) 2016-09-29 2017-09-25 Carrier base material-added wiring substrate

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2016191485A JP6637864B2 (ja) 2016-09-29 2016-09-29 キャリア基材付き配線基板、キャリア基材付き配線基板の製造方法

Publications (3)

Publication Number Publication Date
JP2018056361A JP2018056361A (ja) 2018-04-05
JP2018056361A5 true JP2018056361A5 (https=) 2019-04-25
JP6637864B2 JP6637864B2 (ja) 2020-01-29

Family

ID=61686666

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2016191485A Active JP6637864B2 (ja) 2016-09-29 2016-09-29 キャリア基材付き配線基板、キャリア基材付き配線基板の製造方法

Country Status (4)

Country Link
US (1) US10340214B2 (https=)
JP (1) JP6637864B2 (https=)
KR (1) KR102394215B1 (https=)
TW (1) TWI767939B (https=)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR102450598B1 (ko) * 2017-11-09 2022-10-07 삼성전기주식회사 지지체 부착 인쇄회로기판 및 지지체 부착 인쇄회로기판의 제조방법
JP7007882B2 (ja) 2017-12-08 2022-01-25 新光電気工業株式会社 配線基板及びその製造方法
CN112312681B (zh) * 2019-07-24 2022-05-17 宏启胜精密电子(秦皇岛)有限公司 电路板的制作方法

Family Cites Families (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH11238831A (ja) * 1997-12-16 1999-08-31 Shinko Electric Ind Co Ltd テープキャリア及びその製造方法
CN1477703A (zh) * 2002-08-02 2004-02-25 ǧס������ҵ��ʽ���� 焊球组件及其生产方法，形成焊块的方法
JP3727939B2 (ja) * 2003-01-08 2005-12-21 新光電気工業株式会社 半導体装置の製造方法
US20090002059A1 (en) * 2007-06-29 2009-01-01 Kwang Tatt Loo Rail to rail full complementary CMOS isolation gate
JP4895936B2 (ja) * 2007-07-19 2012-03-14 新光電気工業株式会社 導電性ボールの搭載方法
JP5290017B2 (ja) * 2008-03-28 2013-09-18 日本特殊陶業株式会社 多層配線基板及びその製造方法
JP5356876B2 (ja) * 2008-03-28 2013-12-04 日本特殊陶業株式会社 多層配線基板及びその製造方法
JP5179920B2 (ja) * 2008-03-28 2013-04-10 日本特殊陶業株式会社 多層配線基板
WO2011060508A1 (en) * 2009-11-23 2011-05-26 Buchanan Brands Pty Ltd An activity recordal method and system
US20130244377A1 (en) * 2012-03-13 2013-09-19 Nitto Denko Corporation Heat-resistant pressure-sensitive adhesive tape for production of semiconductor device and method for producing semiconductor device using the tape
JP2016048768A (ja) * 2014-08-28 2016-04-07 日立化成株式会社 配線板及び半導体装置の製造方法

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