JP2017528578A - 銅張板用高ctiハロゲンフリーエポキシ樹脂組成物及びその使用方法 - Google Patents
銅張板用高ctiハロゲンフリーエポキシ樹脂組成物及びその使用方法 Download PDFInfo
- Publication number
- JP2017528578A JP2017528578A JP2017516155A JP2017516155A JP2017528578A JP 2017528578 A JP2017528578 A JP 2017528578A JP 2017516155 A JP2017516155 A JP 2017516155A JP 2017516155 A JP2017516155 A JP 2017516155A JP 2017528578 A JP2017528578 A JP 2017528578A
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- Prior art keywords
- epoxy resin
- halogen
- free
- resin composition
- copper
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
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- 239000003822 epoxy resin Substances 0.000 title claims abstract description 68
- 229920000647 polyepoxide Polymers 0.000 title claims abstract description 68
- 239000000203 mixture Substances 0.000 title claims abstract description 63
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 title claims abstract description 17
- 238000000034 method Methods 0.000 title claims abstract description 13
- 229910052802 copper Inorganic materials 0.000 title claims description 6
- 239000010949 copper Substances 0.000 title claims description 6
- OAICVXFJPJFONN-UHFFFAOYSA-N Phosphorus Chemical compound [P] OAICVXFJPJFONN-UHFFFAOYSA-N 0.000 claims abstract description 39
- 229910052698 phosphorus Inorganic materials 0.000 claims abstract description 39
- 239000011574 phosphorus Substances 0.000 claims abstract description 39
- CMLFRMDBDNHMRA-UHFFFAOYSA-N 2h-1,2-benzoxazine Chemical compound C1=CC=C2C=CNOC2=C1 CMLFRMDBDNHMRA-UHFFFAOYSA-N 0.000 claims abstract description 21
- 239000005011 phenolic resin Substances 0.000 claims abstract description 15
- 239000011889 copper foil Substances 0.000 claims abstract description 11
- 239000000945 filler Substances 0.000 claims abstract description 9
- 239000000758 substrate Substances 0.000 claims abstract description 9
- ISWSIDIOOBJBQZ-UHFFFAOYSA-N Phenol Chemical compound OC1=CC=CC=C1 ISWSIDIOOBJBQZ-UHFFFAOYSA-N 0.000 claims abstract description 8
- HECLRDQVFMWTQS-RGOKHQFPSA-N 1755-01-7 Chemical compound C1[C@H]2[C@@H]3CC=C[C@@H]3[C@@H]1C=C2 HECLRDQVFMWTQS-RGOKHQFPSA-N 0.000 claims abstract description 7
- 229920005989 resin Polymers 0.000 claims description 17
- 239000011347 resin Substances 0.000 claims description 17
- ARXJGSRGQADJSQ-UHFFFAOYSA-N 1-methoxypropan-2-ol Chemical compound COCC(C)O ARXJGSRGQADJSQ-UHFFFAOYSA-N 0.000 claims description 16
- 150000001875 compounds Chemical class 0.000 claims description 15
- JHIVVAPYMSGYDF-UHFFFAOYSA-N cyclohexanone Chemical compound O=C1CCCCC1 JHIVVAPYMSGYDF-UHFFFAOYSA-N 0.000 claims description 14
- ZWEHNKRNPOVVGH-UHFFFAOYSA-N 2-Butanone Chemical compound CCC(C)=O ZWEHNKRNPOVVGH-UHFFFAOYSA-N 0.000 claims description 13
- 239000003054 catalyst Substances 0.000 claims description 11
- RIOQSEWOXXDEQQ-UHFFFAOYSA-N triphenylphosphine Chemical group C1=CC=CC=C1P(C=1C=CC=CC=1)C1=CC=CC=C1 RIOQSEWOXXDEQQ-UHFFFAOYSA-N 0.000 claims description 10
- 238000006243 chemical reaction Methods 0.000 claims description 9
- 239000004744 fabric Substances 0.000 claims description 9
- 238000002156 mixing Methods 0.000 claims description 9
- QWVGKYWNOKOFNN-UHFFFAOYSA-N o-cresol Chemical compound CC1=CC=CC=C1O QWVGKYWNOKOFNN-UHFFFAOYSA-N 0.000 claims description 8
- 239000007787 solid Substances 0.000 claims description 8
- 239000003365 glass fiber Substances 0.000 claims description 7
- 239000004593 Epoxy Substances 0.000 claims description 6
- 229920003986 novolac Polymers 0.000 claims description 6
- 239000003960 organic solvent Substances 0.000 claims description 6
- 239000002994 raw material Substances 0.000 claims description 5
- 239000002904 solvent Substances 0.000 claims description 5
- KXGFMDJXCMQABM-UHFFFAOYSA-N 2-methoxy-6-methylphenol Chemical compound [CH]OC1=CC=CC([CH])=C1O KXGFMDJXCMQABM-UHFFFAOYSA-N 0.000 claims description 4
- ZCUJYXPAKHMBAZ-UHFFFAOYSA-N 2-phenyl-1h-imidazole Chemical compound C1=CNC(C=2C=CC=CC=2)=N1 ZCUJYXPAKHMBAZ-UHFFFAOYSA-N 0.000 claims description 4
- 238000004519 manufacturing process Methods 0.000 claims description 4
- 229920001568 phenolic resin Polymers 0.000 claims description 4
- LLHKCFNBLRBOGN-UHFFFAOYSA-N propylene glycol methyl ether acetate Chemical compound COCC(C)OC(C)=O LLHKCFNBLRBOGN-UHFFFAOYSA-N 0.000 claims description 4
- LXBGSDVWAMZHDD-UHFFFAOYSA-N 2-methyl-1h-imidazole Chemical compound CC1=NC=CN1 LXBGSDVWAMZHDD-UHFFFAOYSA-N 0.000 claims description 3
- VPWNQTHUCYMVMZ-UHFFFAOYSA-N 4,4'-sulfonyldiphenol Chemical compound C1=CC(O)=CC=C1S(=O)(=O)C1=CC=C(O)C=C1 VPWNQTHUCYMVMZ-UHFFFAOYSA-N 0.000 claims description 3
- ULKLGIFJWFIQFF-UHFFFAOYSA-N 5K8XI641G3 Chemical compound CCC1=NC=C(C)N1 ULKLGIFJWFIQFF-UHFFFAOYSA-N 0.000 claims description 3
- 238000001035 drying Methods 0.000 claims description 3
- 150000002460 imidazoles Chemical class 0.000 claims description 3
- 150000004714 phosphonium salts Chemical group 0.000 claims description 3
- 238000002360 preparation method Methods 0.000 claims description 3
- 150000003242 quaternary ammonium salts Chemical class 0.000 claims description 3
- 230000002194 synthesizing effect Effects 0.000 claims description 3
- XZZNDPSIHUTMOC-UHFFFAOYSA-N triphenyl phosphate Chemical compound C=1C=CC=CC=1OP(OC=1C=CC=CC=1)(=O)OC1=CC=CC=C1 XZZNDPSIHUTMOC-UHFFFAOYSA-N 0.000 claims description 3
- 238000010438 heat treatment Methods 0.000 claims 1
- 238000010030 laminating Methods 0.000 claims 1
- 239000012776 electronic material Substances 0.000 abstract description 2
- 239000000463 material Substances 0.000 description 10
- 239000003795 chemical substances by application Substances 0.000 description 7
- 230000000052 comparative effect Effects 0.000 description 7
- WNROFYMDJYEPJX-UHFFFAOYSA-K aluminium hydroxide Chemical compound [OH-].[OH-].[OH-].[Al+3] WNROFYMDJYEPJX-UHFFFAOYSA-K 0.000 description 6
- 239000003063 flame retardant Substances 0.000 description 5
- 238000011161 development Methods 0.000 description 4
- 229910052736 halogen Inorganic materials 0.000 description 4
- 150000002367 halogens Chemical class 0.000 description 4
- 239000011229 interlayer Substances 0.000 description 4
- 238000000926 separation method Methods 0.000 description 4
- 239000002966 varnish Substances 0.000 description 4
- QGBSISYHAICWAH-UHFFFAOYSA-N dicyandiamide Chemical compound NC(N)=NC#N QGBSISYHAICWAH-UHFFFAOYSA-N 0.000 description 3
- 238000005259 measurement Methods 0.000 description 3
- NLXLAEXVIDQMFP-UHFFFAOYSA-N Ammonia chloride Chemical compound [NH4+].[Cl-] NLXLAEXVIDQMFP-UHFFFAOYSA-N 0.000 description 2
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 2
- 239000011190 CEM-3 Substances 0.000 description 2
- 230000015572 biosynthetic process Effects 0.000 description 2
- 238000002485 combustion reaction Methods 0.000 description 2
- 230000007613 environmental effect Effects 0.000 description 2
- 238000001879 gelation Methods 0.000 description 2
- 238000009413 insulation Methods 0.000 description 2
- 239000004850 liquid epoxy resins (LERs) Substances 0.000 description 2
- VTHJTEIRLNZDEV-UHFFFAOYSA-L magnesium dihydroxide Chemical compound [OH-].[OH-].[Mg+2] VTHJTEIRLNZDEV-UHFFFAOYSA-L 0.000 description 2
- 239000000347 magnesium hydroxide Substances 0.000 description 2
- 229910001862 magnesium hydroxide Inorganic materials 0.000 description 2
- 239000002861 polymer material Substances 0.000 description 2
- 239000011342 resin composition Substances 0.000 description 2
- 239000000126 substance Substances 0.000 description 2
- 238000003786 synthesis reaction Methods 0.000 description 2
- 238000012360 testing method Methods 0.000 description 2
- AYEKOFBPNLCAJY-UHFFFAOYSA-O thiamine pyrophosphate Chemical compound CC1=C(CCOP(O)(=O)OP(O)(O)=O)SC=[N+]1CC1=CN=C(C)N=C1N AYEKOFBPNLCAJY-UHFFFAOYSA-O 0.000 description 2
- DXZMANYCMVCPIM-UHFFFAOYSA-L zinc;diethylphosphinate Chemical compound [Zn+2].CCP([O-])(=O)CC.CCP([O-])(=O)CC DXZMANYCMVCPIM-UHFFFAOYSA-L 0.000 description 2
- RNFJDJUURJAICM-UHFFFAOYSA-N 2,2,4,4,6,6-hexaphenoxy-1,3,5-triaza-2$l^{5},4$l^{5},6$l^{5}-triphosphacyclohexa-1,3,5-triene Chemical compound N=1P(OC=2C=CC=CC=2)(OC=2C=CC=CC=2)=NP(OC=2C=CC=CC=2)(OC=2C=CC=CC=2)=NP=1(OC=1C=CC=CC=1)OC1=CC=CC=C1 RNFJDJUURJAICM-UHFFFAOYSA-N 0.000 description 1
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 1
- 150000001412 amines Chemical class 0.000 description 1
- 235000019270 ammonium chloride Nutrition 0.000 description 1
- 229910052793 cadmium Inorganic materials 0.000 description 1
- BDOSMKKIYDKNTQ-UHFFFAOYSA-N cadmium atom Chemical compound [Cd] BDOSMKKIYDKNTQ-UHFFFAOYSA-N 0.000 description 1
- 231100000357 carcinogen Toxicity 0.000 description 1
- 239000003183 carcinogenic agent Substances 0.000 description 1
- JOPOVCBBYLSVDA-UHFFFAOYSA-N chromium(6+) Chemical compound [Cr+6] JOPOVCBBYLSVDA-UHFFFAOYSA-N 0.000 description 1
- 238000009841 combustion method Methods 0.000 description 1
- 150000004826 dibenzofurans Chemical class 0.000 description 1
- 150000002013 dioxins Chemical class 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 239000003792 electrolyte Substances 0.000 description 1
- 239000010793 electronic waste Substances 0.000 description 1
- 230000003203 everyday effect Effects 0.000 description 1
- 239000000835 fiber Substances 0.000 description 1
- 125000002485 formyl group Chemical class [H]C(*)=O 0.000 description 1
- 239000007789 gas Substances 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 230000009477 glass transition Effects 0.000 description 1
- 239000000383 hazardous chemical Substances 0.000 description 1
- 238000007731 hot pressing Methods 0.000 description 1
- 239000012433 hydrogen halide Substances 0.000 description 1
- 229910000039 hydrogen halide Inorganic materials 0.000 description 1
- 239000011810 insulating material Substances 0.000 description 1
- 239000000155 melt Substances 0.000 description 1
- QSHDDOUJBYECFT-UHFFFAOYSA-N mercury Chemical compound [Hg] QSHDDOUJBYECFT-UHFFFAOYSA-N 0.000 description 1
- 229910052753 mercury Inorganic materials 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 229910052757 nitrogen Inorganic materials 0.000 description 1
- QJGQUHMNIGDVPM-UHFFFAOYSA-N nitrogen group Chemical group [N] QJGQUHMNIGDVPM-UHFFFAOYSA-N 0.000 description 1
- -1 nitrogen-containing phenol compound Chemical class 0.000 description 1
- 239000004843 novolac epoxy resin Substances 0.000 description 1
- 239000004033 plastic Substances 0.000 description 1
- 229920003023 plastic Polymers 0.000 description 1
- 239000004848 polyfunctional curative Substances 0.000 description 1
- 238000000197 pyrolysis Methods 0.000 description 1
- 238000012827 research and development Methods 0.000 description 1
- 230000004044 response Effects 0.000 description 1
- 238000010583 slow cooling Methods 0.000 description 1
- 239000000779 smoke Substances 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
- 230000002195 synergetic effect Effects 0.000 description 1
Classifications
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- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
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- B32B37/00—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding
- B32B37/14—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by the properties of the layers
- B32B37/15—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by the properties of the layers with at least one layer being manufactured and immediately laminated before reaching its stable state, e.g. in which a layer is extruded and laminated while in semi-molten state
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- C08G59/504—Amines containing an atom other than nitrogen belonging to the amine group, carbon and hydrogen
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- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
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- C08G59/5046—Amines heterocyclic
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- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
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- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
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- C08G59/62—Alcohols or phenols
- C08G59/621—Phenols
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- C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
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- C08J5/0405—Reinforcing macromolecular compounds with loose or coherent fibrous material with inorganic fibres
- C08J5/043—Reinforcing macromolecular compounds with loose or coherent fibrous material with inorganic fibres with glass fibres
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- C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
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- C08J5/04—Reinforcing macromolecular compounds with loose or coherent fibrous material
- C08J5/10—Reinforcing macromolecular compounds with loose or coherent fibrous material characterised by the additives used in the polymer mixture
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Abstract
Description
本発明の別の目的は、上記ハロゲンフリーエポキシ樹脂組成物の使用方法を提供することである。
1).配合に準じて各原料を秤量し、配合は、質量%で、原料として、エポキシ樹脂55〜75%、反応型リン含有化合物25〜45%を含み、そのうち、エポキシ樹脂は直鎖型エポキシ樹脂であり
2).ハロゲンフリーリン含有エポキシ樹脂の調製:反応槽に直鎖型エポキシ樹脂及び反応型含有化合物を投入し、昇温し溶解させ、110〜130℃で触媒を投入し、その後に170〜190℃に昇温し、2〜4時間反応させ、降温し溶媒を加えて溶解させ、固形分が65〜75%、リン含有量が2.5〜4.5%、エポキシ当量が500〜1000g/eqのハロゲンフリーリン含有エポキシ樹脂を得る。
使用方法において、有機溶媒で上記エポキシ樹脂組成物を調整し、固形分が50〜70%の組成物とし、ガラス繊維布をエポキシ樹脂組成物に浸漬し、更に加熱焼成を経て、浸漬されたガラス繊維布を乾燥させてプリプレグとし、該プリプレグのいずれか片面又は両面に銅箔を載せ、1つ又は複数のプリプレグを積層し、積層体を加熱加圧して銅箔基板を得、積層体の硬化温度範囲は50〜250℃である。
1).配合に準じて各原料を秤量し、配合は、質量%で、原料として、エポキシ樹脂55〜75%、反応型リン含有化合物25〜45%を含み、そのうち、エポキシ樹脂は直鎖型エポキシ樹脂であり、2).ハロゲンフリーリン含有エポキシ樹脂の調製:反応槽に直鎖型エポキシ樹脂及び反応型リン含有化合物を投入し、昇温し溶解させ、110〜130℃で触媒を投入し、その後に170〜190℃に昇温し、2〜4時間反応させ、降温し溶媒を加えて溶解させ、固形分が65〜75%のものを得る。そのうち、触媒と反応型リン含有化合物との質量比は0.05〜0.15:100であり、質量比は好ましくは0.1〜100である。触媒は、トリフェニルホスフィン、トリフェニルホスフェート、4級アンモニウム塩又は4級ホスホニウム塩から選択される1種又は2種以上の混合物である。上記工程2)の溶媒は、ブタノン、プロピレングリコールメチルエーテル、シクロヘキサノンから選択される1種又は2種以上の混合物である。
硬化剤2:フェノール樹脂GERH833K65、宏昌電子材料股▲ふん▼有限公司製品。
硬化剤3:ジシアンジアミド、10wt%でDMFに溶解した。
硬化促進剤2PI:2−フェニルイミダゾール、1wt%でPMに溶解した。
ガラス繊維布は7628布である。
本発明の成分(A1+7200HHH)を主樹脂として使用し、硬化剤であるDDM型ベンゾオキサジン及びフェノール樹脂GERH833K65を組み合わせて、充填材は水酸化アルミニウムを使用し、その配合組成の詳細を表1に示し、ブタノン(MEK)、プロピレングリコールメチルエーテル(PM)又はプロピレングリコールメチルエーテルアセテートで固形分が55%のワニス組成物に調整し、7628ガラス繊維布を上記ワニス樹脂液に浸漬し、その後に含浸機温度170〜180℃で、数分間乾燥させ、乾燥後のプリプレグの溶融粘度が800〜1800Pa.sの範囲にあるように、調整により乾燥時間を制御し、最後に8枚のシートを2枚の厚さ35μmの銅箔の間に積層し、25Kg/cm2の圧力で、温度を下記の通りに制御して、
90℃ → 90℃ → 200℃ → 200℃ → 50℃
20min 60min 70min ゆっくり冷却
ホットプレスを経た後、厚さ1.6mmの銅箔基板が得られた。この組成物のCTIが500V以上に達し、Tgが150℃以上に達し、耐熱性に優れ、難燃性がV0級に達した。機能の詳細を表1に示す。
成分A1及び7200HHHの配合比を変更して、実施例1を繰り返し、得られた組成物のCTIが500V以上に達し、Tgが150℃以上に達し、耐熱性に優れ、難燃性がV0級に達した。機能の詳細を表1に示す。
本発明の成分(A2+7200HHH)を主樹脂として使用し、硬化剤であるDDM型ベンゾオキサジン及びフェノール樹脂GERH833K65を組み合わせて、充填材は水酸化アルミニウムを使用し、その配合組成の詳細を表1に示し、実施例1の基板製造過程を繰り返した。得られた組成物のCTIが500V以上に達し、Tgが150℃以上に達し、耐熱性に優れ、難燃性がV0級に達した。機能の詳細を表1に示す。
成分A2及び7200HHHの配合比を変更して、実施例3を繰り返し、得られた組成物のCTIが500V以上に達し、Tgが150℃以上に達し、耐熱性に優れ、難燃性がV0級に達した。機能の詳細を表1に示す。
成分704で7200HHHを代替して、実施例4を繰り返し、得られた組成物の耐熱性が優れるが、CTI値が400V未満であり、難燃性がV1級しか達しなかった。機能の詳細を表1に示す。
GEBR589K75を主樹脂として使用し、硬化剤であるジシアンジアミドを組み合わせて、実施例1の銅箔基板製造工程を繰り返し、得られた組成物の耐熱性が劣る(PCT試験において6min未満で層間分離し、T288が60min未満)。機能の詳細を表1に示す。
硬化剤をDDM型ベンゾオキサジン及びフェノール樹脂GERH833K65に変更して、比較例2を繰り返し、得られた組成物のCTI及び難燃性が劣り、具体的には、そのCTI値が400V未満であり、難燃性がV1級しか達しなかった。機能の詳細を表1に示す。
1)ワニスゲル化時間(sec):
0.3ml樹脂ワニスを170℃のゲル化試験機に取り、そのゲル化時間を測定した。
2)ガラス転移温度(Tg、℃):
IPC−TM−650の2.4.25に準じて測定した。
3)剥離強度(lb/in):
IPC−TM−650の2.4.8に準じて測定した。
4)PCT試験の層間分離(min):
2気圧で、120℃の圧力鍋にて、2時間蒸煮し、更にサンプルを288℃のスズストーブに浸し、層間分離時間を観察した。
5)CTI値(V、50D):
GB/T 4207−2003に準じて測定した。
6)T288測定(min)
TMA法でサンプルの層間分離時間を測定した。
7)耐燃性:
UL94垂直燃焼法に準じて測定した。
表1の実施例1〜4及び比較例1〜3の性能測定結果から、本発明の高CTIハロゲンフリーリン含有エポキシ樹脂を使用し、硬化剤であるベンゾオキサジン及びフェノール樹脂を組み合わせた場合、製造された板材は高CTI、高耐熱性などの特徴を有することが分かる。
Claims (10)
- 重量部基準で、配合の成分として、
ハロゲンフリーリン含有エポキシ樹脂 100〜140部、
ジシクロペンタジエン系フェノールエポキシ樹脂 10〜35部、
フェノール樹脂 1〜5部、
ベンゾオキサジン 32〜60部、
促進剤 0.05〜0.5部、
充填材 25〜70部
からなることを特徴とする銅張板用高CTIハロゲンフリーエポキシ樹脂組成物。 - 前記ハロゲンフリーリン含有エポキシ樹脂の合成方法は、
1).配合に準じて各原料を秤量し、前記配合は、質量%で、原料として、
エポキシ樹脂 55〜75%、
反応型リン含有化合物 25〜45%を含み、そのうち、
前記エポキシ樹脂は直鎖型エポキシ樹脂であり、
2).ハロゲンフリーリン含有エポキシ樹脂の調製:反応槽に前記直鎖型エポキシ樹脂及び反応型リン含有化合物を投入し、昇温し溶解させ、110〜130℃で触媒を投入し、その後に170〜190℃に昇温し、2〜4時間反応させ、降温し溶媒を加えて溶解させ、固形分が65〜75%、リン含有量が2.5〜4.5%、エポキシ当量が500〜1000g/eqのハロゲンフリーリン含有エポキシ樹脂を得る、
ことを特徴とする請求項1に記載の銅張板用高CTIハロゲンフリーエポキシ樹脂組成物。 - 前記触媒と反応型リン含有化合物との質量比は、0.05〜0.15:100であり、前記触媒は、トリフェニルホスフィン、トリフェニルホスフェート、4級アンモニウム塩又は4級ホスホニウム塩から選択されることを特徴とする請求項2に記載の銅張板用高CTIハロゲンフリーエポキシ樹脂組成物。
- 前記直鎖型エポキシ樹脂は、BPA型、BPF型、ビスフェノールS型直鎖エポキシ樹脂から選択される1種又は2種以上の混合物であり、前記反応型リン含有化合物は、DOPO−HQ、DOPO−NQから選択される1種又は2種の混合物であることを特徴とする請求項1〜3のいずれか1項に記載の銅張板用高CTIハロゲンフリーエポキシ樹脂組成物。
- 前記ベンゾオキサジンは、BPA型ベンゾオキサジン、BPF型ベンゾオキサジン、DDM型ベンゾオキサジンから選択される1種又は2種以上の混合物であることを特徴とする請求項1〜3のいずれか1項に記載の銅張板用高CTIハロゲンフリーエポキシ樹脂組成物。
- 前記フェノール樹脂は、ノボラック樹脂、オルソクレゾールノボラック樹脂、BPA型フェノール樹脂から選択される1種又は2種以上の混合物であることを特徴とする請求項1〜3のいずれか1項に記載の銅張板用高CTIハロゲンフリーエポキシ樹脂組成物。
- 前記促進剤は、イミダゾール系化合物である2−メチルイミダゾール、2−エチル−4−メチルイミダゾール、2−フェニルイミダゾールから選択される1種又は2種以上の混合物であることを特徴とする請求項1〜3のいずれか1項に記載の銅張板用高CTIハロゲンフリーエポキシ樹脂組成物。
- プリント回路積層板を製造するための、請求項1〜7のいずれか1項に記載の銅張板用高CTIハロゲンフリーエポキシ樹脂組成物の使用方法。
- 有機溶媒で前記エポキシ樹脂組成物を調整し、固形分が50〜70%の組成物とし、ガラス繊維布を前記エポキシ樹脂組成物に浸漬し、更に加熱焼成を経て、浸漬されたガラス繊維布を乾燥させてプリプレグとし、該プリプレグのいずれか片面又は両面に銅箔を載せ、1つ又は複数のプリプレグを積層し、積層体を加熱加圧して銅箔基板を得、積層体の硬化温度範囲は50〜250℃であることを特徴とする請求項8に記載の使用方法。
- 前記有機溶媒は、ブタノン、プロピレングリコールメチルエーテル、シクロヘキサノン、プロピレングリコールメチルエーテルアセテートから選択される1種又は2種以上の混合物であることを特徴とする請求項9に記載の使用方法。
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