JP2017213845A - Liquid jet head and liquid jet device - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a liquid jet head which inhibits electric noise resulting from stray capacitance and achieves excellent operational reliability, and to provide a liquid jet device.SOLUTION: A liquid jet head includes: a nozzle plate having nozzle arrays in which nozzle holes extending in a Z direction are arranged parallel to each other in an X direction; a head chip arranged in a +Z direction relative to the nozzle plate and having discharge channels, each of which separately communicates with the nozzle hole; a manifold 52 having a conductive passage member 72 formed with an ink passage 71 and supporting the head chip; and a drive substrate which is supported by the manifold 52 and electrically connected with the head chip. An insulation sheet 86 is disposed between the passage member 72 and the head chip.SELECTED DRAWING: Figure 6

Description

  The present invention relates to a liquid ejecting head and a liquid ejecting apparatus.

  2. Description of the Related Art Conventionally, there is an ink jet printer equipped with an ink jet head as an apparatus for recording an image or a character on a recording medium by ejecting ink droplets onto a recording medium such as recording paper. The inkjet head is configured by mounting a plurality of head modules corresponding to each color on a carriage, for example (for example, Patent Document 1 below).

The head module described above is configured, for example, by mounting on a base member a head chip that ejects ink, a manifold in which an ink flow path that supplies ink to the head chip is formed, and a drive substrate that drives the head chip.
The head chip described above includes an actuator plate having a plurality of ejection channels filled with ink. A drive electrode is formed on a drive wall of the actuator plate that defines the discharge channel. In the head chip, by applying a driving voltage to the driving electrode, the driving wall is deformed and the volume in the ejection channel is changed. Thereby, ink is ejected through the nozzle holes communicating with the ejection channel.

JP2015-120265A

  By the way, in the ink jet head, when the base member is formed of, for example, a conductive material, stray capacitance is generated between the drive electrode and the base member. For this reason, the high frequency component of the drive voltage applied to the drive electrode may be transmitted to the base member via the stray capacitance and become electrical noise. Further, when the drive board is fixed to the base member, electrical noise is transmitted to the drive board, causing malfunctions in the electric circuit. Therefore, the conventional inkjet head still has room for improvement in terms of improving the operation reliability of the head chip.

  The present invention has been made in view of such circumstances, and an object thereof is to provide a liquid ejecting head and a liquid ejecting apparatus that suppress electrical noise caused by stray capacitance and are excellent in operation reliability. It is.

  In order to solve the above-described problem, a liquid jet head according to an aspect of the present invention includes a jet hole including a plurality of jet hole arrays in which a plurality of jet holes extending in a first direction are arranged in parallel in a second direction orthogonal to the first direction. A plate, a head chip disposed in one of the first directions with respect to the ejection hole plate, and having a channel communicating with each of the ejection holes, and a flow path member formed with a liquid flow path communicating with the channel A manifold that supports the head chip, and a drive board that is supported by the manifold and electrically connected to the head chip, and is provided between the flow path member and the head chip. Is provided with an insulator.

  According to this configuration, since the insulator is interposed between the head chip and the flow path member, the head chip and the flow path member can be electrically separated. Therefore, stray capacitance generated between the head chip and the flow path member when the head chip is driven can be reduced. Thereby, electrical noise to the drive substrate can be suppressed, and the operation reliability of the liquid jet head can be ensured.

In the above aspect, the manifold includes the flow path member and a flow path cover that is superimposed on the flow path member and closes the liquid flow path, and the insulator includes the flow path cover and the head chip. Between the two.
According to this aspect, by providing the insulator separately from the manifold, unlike the case where the insulator forms a part of the manifold, it is possible to improve the degree of freedom in selecting and designing the insulator material. .

In the above aspect, the manifold may include the flow path member and a flow path cover that is superimposed on the flow path member and closes the liquid flow path, and the flow path cover may be the insulator. .
According to this aspect, since the insulator constitutes a part of the manifold, the number of parts can be reduced as compared with the case where the insulator is provided separately from the manifold.

In the above aspect, the insulator may be formed of a softer material than the flow path member and the head chip.
According to this aspect, the stress acting on the head chip and the flow path member due to the difference in thermal expansion coefficient between the head chip and the flow path member can be relaxed. Thereby, for example, it is possible to suppress the occurrence of deformation and cracking of the head chip, separation from the flow path member, displacement of the head chip relative to the manifold, and the like due to a difference in thermal expansion coefficient between the head chip and the flow path member.

In the above aspect, the insulator may be made of polyimide.
According to this aspect, the insulator excellent in workability and adhesiveness can be provided.

In the above aspect, the head chip and the insulator may be made of ceramics.
According to this aspect, since the difference in thermal expansion coefficient between the head chip and the insulator can be reduced, the relative displacement of the head chip, the manifold, and the insulator accompanying the temperature change can be suppressed. Therefore, it is possible to suppress the occurrence of, for example, deformation or cracking of the head chip, separation from the flow path member, positional displacement of the head chip with respect to the manifold due to the difference in thermal expansion coefficient between the head chip and the flow path member.

In the above aspect, the head chip and the drive substrate may be supported by a first surface of the manifold that faces a third direction orthogonal to the first direction and the second direction.
According to this aspect, since the head chip and the drive substrate are supported on the first surface of the manifold, for example, compared to a configuration in which the manifold and the drive substrate are separately disposed on both sides in the third direction with respect to the head chip. Thus, the liquid ejecting head can be downsized in the third direction.

A liquid ejecting apparatus according to one aspect of the invention includes the liquid ejecting head according to the above aspect.
According to this aspect, it is possible to provide a liquid ejecting apparatus having excellent operation reliability.

  According to one embodiment of the present invention, a liquid ejecting head and a liquid ejecting apparatus that are excellent in operation reliability can be provided.

1 is a schematic configuration diagram of an inkjet printer according to an embodiment. It is a perspective view of the ink jet head concerning an embodiment. It is a perspective view showing the state where a part of ink jet head concerning an embodiment was removed. It is a perspective view of the 1st head module concerning an embodiment. It is a disassembled perspective view of the head chip concerning an embodiment. It is a disassembled perspective view of the manifold which concerns on embodiment. It is a disassembled perspective view of the base member, nozzle plate, and nozzle guard which concern on embodiment. It is the partial bottom view which looked at the inkjet head concerning an embodiment from the -Z direction. It is sectional drawing of the head module which concerns on the modification of embodiment.

  Hereinafter, embodiments according to the present invention will be described with reference to the drawings. In the following embodiments, an ink jet printer (hereinafter simply referred to as a printer) that performs recording on a recording medium using ink (liquid) will be described as an example. In the drawings used for the following description, the scale of each member is appropriately changed in order to make each member a recognizable size.

[Printer]
FIG. 1 is a schematic configuration diagram of the printer 1.
As shown in FIG. 1, the printer 1 of this embodiment includes a pair of transport mechanisms 2 and 3, an ink supply mechanism 4, inkjet heads 5 </ b> A and 5 </ b> B, and a scanning mechanism 6. In the following description, an X, Y, Z orthogonal coordinate system is used as necessary. In this case, the X direction (second direction) coincides with the transport direction (sub-scanning direction) of the recording medium P (for example, paper). The Y direction (third direction) coincides with the scanning direction (main scanning direction) of the scanning mechanism 6. The Z direction (first direction) indicates a height direction orthogonal to the X direction and the Y direction. In the following description, among the X direction, the Y direction, and the Z direction, the arrow direction in the figure is a plus (+) direction, and the direction opposite to the arrow is a minus (−) direction.

  The transport mechanisms 2 and 3 transport the recording medium P in the + X direction. Specifically, the transport mechanism 2 includes a grit roller 11 extending in the Y direction, a pinch roller 12 extending in parallel to the grit roller 11, and a drive mechanism such as a motor that rotates the grit roller 11 (not configured). (Shown). Similarly, the transport mechanism 3 includes a grit roller 13 that extends in the Y direction, a pinch roller 14 that extends in parallel to the grit roller 13, a drive mechanism (not shown) that rotates the grit roller 13, and It has.

The ink supply mechanism 4 includes an ink tank 15 that stores ink, and an ink pipe 16 that connects the ink tank 15 and the inkjet heads 5A and 5B.
In the present embodiment, a plurality of ink tanks 15 are arranged in the X direction. Each ink tank 15 contains, for example, four colors of ink of yellow, magenta, cyan, and black.
The ink pipe 16 is a flexible hose having flexibility, for example. The ink pipe 16 connects between each ink tank 15 and each inkjet head 5A, 5B.

  The scanning mechanism 6 reciprocates the inkjet heads 5A and 5B in the Y direction. Specifically, the scanning mechanism 6 includes a pair of guide rails 21 and 22 extending in the Y direction, a carriage 23 supported movably on the pair of guide rails 21 and 22, and moving the carriage 23 in the Y direction. And a drive mechanism 24 to be operated.

  The drive mechanism 24 is disposed between the guide rails 21 and 22 in the X direction. The drive mechanism 24 is a pair of pulleys 25 and 26 disposed at intervals in the Y direction, an endless belt 27 wound between the pair of pulleys 25 and 26, and a drive that rotationally drives one pulley 25. And a motor 28.

  The carriage 23 is connected to an endless belt 27. A plurality of inkjet heads 5A and 5B are mounted on the carriage 23 in a state of being arranged in the Y direction. Each inkjet head 5A, 5B is configured to be able to eject two colors of ink for each inkjet head 5A, 5B. Therefore, the printer 1 according to the present embodiment is configured such that each of the inkjet heads 5A and 5B can eject four different colors of yellow, magenta, cyan, and black by ejecting two different colors of ink. .

<Inkjet head>
FIG. 2 is a perspective view of the inkjet head 5A. The inkjet heads 5A and 5B have the same configuration except for the color of the supplied ink. Therefore, in the following description, the inkjet head 5A will be described, and the description of the inkjet head 5B will be omitted.
As shown in FIG. 2, the ink jet head 5 </ b> A of the present embodiment includes a head module 30 </ b> A to 30 </ b> D, a damper 31, a nozzle plate (injection hole plate) 32, a nozzle guard (injection hole guard) 33 and the like mounted on a base member 38. Configured. In FIG. 2, illustration of a cover and the like that covers the head modules 30 </ b> A to 30 </ b> D, the damper 31, and the like is omitted.

(Base member)
FIG. 3 is a perspective view showing a state where a part of the inkjet head 5A is removed.
As shown in FIG. 3, the base member 38 is formed in a plate shape with the Z direction as the thickness direction and the X direction as the longitudinal direction. The base member 38 includes a module holding portion 41 that holds the head modules 30A to 30D, and a carriage fixing portion 42 for fixing the base member 38 to the carriage 23 (see FIG. 1). In the present embodiment, the base member 38 is integrally formed of a metal material.

  The module holding part 41 is formed in a frame shape in a plan view viewed from the Z direction. That is, a mounting opening 44 that penetrates the base member 38 in the Z direction is formed at the center of the module holding portion 41 in the XY plane. Insertion grooves 46 are respectively formed in the pair of short side portions 45 located on both sides in the X direction in the module holding portion 41. The insertion groove 46 of the present embodiment includes a plurality of insertion grooves 46 that are opposed to each other in the X direction among the insertion grooves 46 formed in each short side portion 45, with a set in the Y direction. (For example, four sets) are formed.

  Each insertion groove 46 is recessed in the X direction with respect to the inner peripheral surface of the short side portion 45 and penetrates the short side portion 45 in the Z direction. That is, the insertion groove 46 communicates with the mounting opening 44. The head modules 30 </ b> A to 30 </ b> D can be inserted into the insertion grooves 46 of the respective sets facing each other in the X direction. Among the insertion grooves 46 of each set, a first urging member (on the inner surface of one insertion groove 46) that urges the head modules 30 </ b> A to 30 </ b> D toward one side in the X direction toward the other insertion groove 46 ( (Not shown) is provided. In the present embodiment, the first urging member is formed in a leaf spring shape.

  The carriage fixing part 42 projects from the + Z direction end of the module holding part 41 to the XY plane. The carriage fixing portion 42 is formed with an attachment hole for attaching the base member 38 to the carriage 23 (see FIG. 1).

(Head module)
As shown in FIG. 2, the head modules 30 </ b> A to 30 </ b> D are configured to be able to eject ink supplied from the ink tank 15 (see FIG. 1) toward the recording medium P. A plurality of head modules 30 </ b> A to 30 </ b> D are mounted on the base member 38 at intervals in the Y direction. In the present embodiment, four head modules of the first head module 30A, the second head module 30B, the third head module 30C, and the fourth head module 30D are mounted on the base member 38.

  In the inkjet head 5A of the present embodiment, one color ink is ejected by two head modules among the four head modules 30A to 30D. Specifically, the first head module 30A and the second head module 30B are configured to eject ink of the same color, and the third head module 30C and the fourth head module 30D are configured to eject ink of the same color. The number of head modules 30A to 30D mounted on the base member 38, the type of ink ejected from the head modules 30A to 30D, and the like can be changed as appropriate. Further, since each of the head modules 30A to 30D has a corresponding configuration, the following description will be given by taking the first head module 30A as an example.

FIG. 4 is a perspective view of the first head module 30A.
As shown in FIG. 4, the first head module 30 </ b> A mainly includes a head chip 51, a manifold 52, and a drive substrate 53.

(Head chip)
FIG. 5 is an exploded perspective view of the head chip 51.
As shown in FIG. 5, the head chip 51 is of a so-called edge chute type that ejects ink from an end portion in the extending direction (Z direction) of an ejection channel 57 described later. Specifically, the head chip 51 is configured by overlapping an actuator plate 55 and a cover plate 56 in the Y direction.

  The actuator plate 55 is a so-called monopole substrate in which the polarization direction is set in one direction along the thickness direction (Y direction). As the actuator plate 55, for example, a ceramic substrate made of PZT (lead zirconate titanate) or the like is preferably used. The actuator plate 55 may be formed by stacking two piezoelectric substrates having different polarization directions in the Y direction (so-called chevron type).

  A plurality of channels 57 and 58 are arranged side by side in the X direction on the surface (hereinafter referred to as “surface”) facing the + Y direction of the actuator plate 55. Each channel 57, 58 is formed linearly along the Z direction. Each channel 57, 58 opens on the end surface in the −Z direction of the actuator plate 55 and ends at the end portion in the + Z direction of the actuator plate 55. Each channel 57, 58 may be inclined and extended with respect to the Z direction.

  The plurality of channels 57 and 58 described above are the ejection channel 57 filled with ink and the non-ejection channel 58 not filled with ink. The ejection channels 57 and the non-ejection channels 58 are arranged alternately in the X direction. Each of the channels 57 and 58 is partitioned in the X direction by a drive wall 61 made of an actuator plate 55. A drive electrode (not shown) is formed on the inner surfaces of the channels 57 and 58.

  The cover plate 56 is formed in a rectangular shape when viewed from the front when viewed from the Y direction. The cover plate 56 is joined to the surface of the actuator plate 55 with the + Z direction end of the actuator plate 55 protruding.

The cover plate 56 has a common ink chamber 62 formed on a surface facing the + Y direction (hereinafter referred to as “front surface”) and a plurality of slits 63 formed on a surface facing the −Y direction (hereinafter referred to as “back surface”). And have.
The common ink chamber 62 is formed at the same position as the + Z direction end of the ejection channel 57 in the Z direction. The common ink chamber 62 is recessed in the −Y direction from the surface of the cover plate 56 and extends in the X direction. Ink flows into the common ink chamber 62 through the manifold 52 described above.
The slit 63 is formed in the common ink chamber 62 at a position facing the ejection channel 57 in the Y direction. The slit 63 communicates the inside of the common ink chamber 62 and the inside of each discharge channel 57 separately. On the other hand, the non-ejection channel 58 does not communicate with the common ink chamber 62.

  As shown in FIG. 4, a heat transfer plate 65 is attached to a surface (hereinafter referred to as “back surface”) facing the −Y direction of the actuator plate 55 described above. The heat transfer plate 65 is made of a material having excellent thermal conductivity (for example, aluminum). The heat transfer plate 65 is provided so as to cover the entire area of the channels 57 and 58 on the back surface of the actuator plate 55. In addition, the magnitude | size and position of the heat exchanger plate 65 can be changed suitably.

(Manifold)
As shown in FIG. 3, the manifold 52 has an ink channel 71 (see FIG. 6) through which ink flows toward the head chip 51 described above. The manifold 52 as a whole is formed in a plate shape whose thickness direction is the Y direction. The manifold 52 is held by the base member 38 in a standing state in the + Z direction by being inserted into the pair of insertion grooves 46 facing in the X direction among the insertion grooves 46 described above. As shown in FIG. 4, second urging members 70 are provided at both ends in the X direction at the −Z direction end of the manifold 52. The second urging member 70 is interposed between the inner surface of the insertion groove 46 and the manifold 52 in the insertion groove 46, and urges the first head module 30A in the -Y direction. In the present embodiment, the second urging member 70 is formed in a leaf spring shape.

FIG. 6 is an exploded perspective view of the manifold 52.
As shown in FIG. 6, the manifold 52 includes a flow path member 72 and a flow path cover 73 that is superimposed on the flow path member 72 in the Y direction.
The flow path member 72 is integrally formed of a material having excellent thermal conductivity. In the present embodiment, a conductive metal material (for example, aluminum) is preferably used as the material of the flow path member 72.

The flow path member 72 includes a flow path plate 75 and an inflow port 76.
The flow path plate 75 is formed in a rectangular plate shape with the Y direction as the thickness direction. An ink flow path 71 is formed on the surface of the flow path plate 75 facing the −Y direction. The ink flow path 71 is formed in a groove shape that is recessed in the + Y direction. Specifically, the ink flow path 71 has a meandering portion 79 and a communication portion 80.

The meandering portion 79 extends in the Z direction while meandering in the X direction. The + Z direction end portion of the meandering portion 79 communicates with the inflow port 76. On the other hand, the end portion in the −Z direction of the meandering portion 79 communicates with the communication portion 80 in the central portion of the flow path plate 75 in the X direction. The meandering direction of the meandering portion 79 meanders so as to be longer with respect to the straight line connecting the communicating portion between the meandering portion 79 and the inflow port 76 and the communicating portion between the meandering portion 79 and the communicating portion 80. If necessary, it can be changed as appropriate. For example, the meandering portion 79 may be configured to extend in the X direction while meandering in the Z direction.
The communication part 80 extends in the X direction at the −Z direction end of the flow path plate 75. The communicating portion 80 has the same shape as the common ink chamber 62 described above in a front view as viewed from the Y direction.

  In the first head module 30 </ b> A, the inflow port 76 is provided at the −X direction end of the + Z direction end surface of the flow path plate 75. The inflow port 76 is formed in a cylindrical shape protruding from the flow path plate 75 in the + Z direction. The −Z direction end of the inflow port 76 communicates with the meandering portion 79 described above.

  The channel cover 73 has an outer shape equivalent to that of the channel plate 75 when viewed from the front when viewed from the Y direction, and is formed in a rectangular plate shape whose thickness in the Y direction is thinner than that of the channel plate 75. The flow path cover 73 is fixed to a surface of the flow path plate 75 facing the −Y direction, and closes the ink flow path 71 described above from the −Y direction. A communication hole 82 that opens the communication portion 80 is formed in the flow path cover 73 at a position overlapping the communication portion 80 when viewed from the Y direction. The communication hole 82 has the same shape as the communication part 80 in a front view as viewed from the Y direction.

  In the present embodiment, the flow path cover 73 is formed of a conductive metal material (for example, stainless steel) excellent in thermal conductivity. In this embodiment, the case where the groove-like ink flow path 71 is formed only in the flow path member 72 has been described. However, the present invention is not limited to this configuration, and at least one of the flow path member 72 and the flow path cover 73 is not limited. Any ink flow path may be formed. In this case, for example, a groove portion may be formed in each of the flow path member 72 and the flow path cover 73, and the ink flow path may be formed by overlapping the groove portions of the flow path member 72 and the flow path cover 73.

  An insulating sheet (insulator) 86 is provided on the surface of the flow path cover 73 facing the −Y direction. The insulating sheet 86 is formed in a frame shape when viewed from the front when viewed from the Y direction. The insulating sheet 86 surrounds the communication hole 82 on the surface facing the −Y direction of the flow path cover 73. The insulating sheet 86 is fixed to the surface of the flow path cover 73 facing the −Y direction by bonding or the like. In this embodiment, for example, polyimide is suitably used for the insulating sheet 86. However, the material of the insulating sheet 86 has characteristics (such as a material having a low dielectric constant or a material capable of lowering the dielectric constant with a slight space distance) that can sufficiently reduce the stray capacitance, and ink resistance (resistance to resistance). As long as it is made of a material (e.g., a resin material (plastic) or a rubber material) that is more soluble (has a lower Young's modulus) than the head chip 51 and the manifold 52, it can be changed as appropriate.

  Here, as shown in FIGS. 4 and 6, the above-described head chip 51 is on the surface (first surface facing the third direction) facing the −Y direction of the flow path cover 73 with the insulating sheet 86 interposed therebetween. It is fixed to. Specifically, the head chip 51 is fixed to the insulating sheet 86 by bonding or the like with the surface of the cover plate 56 (the surface facing the manifold 52) facing the insulating sheet 86. At this time, the common ink chamber 62 of the cover plate 56 communicates with the communication portion 80 through the communication hole 82. As a result, the ink flowing through the ink flow path 71 is supplied to the head chip 51. The head chip 51 protrudes in the −Z direction with respect to the manifold 52 while being fixed to the manifold 52. In the example shown in FIG. 4, the length of the head chip 51 in the X direction is shorter than the length of the manifold 52 in the X direction.

  As shown in FIG. 2, a heater 85 is disposed on a surface facing the + Y direction (second surface facing the third direction) of the flow channel member 72 (flow channel plate 75). The heater 85 heats the inside of the ink flow path 71 through the flow path member 72, thereby holding (holding) the ink flowing through the ink flow path 71 within a predetermined temperature range.

  As shown in FIG. 4, the drive board 53 is a so-called flexible printed board, and is configured by mounting a wiring pattern and various electronic components on a base film. The drive board 53 includes a module control unit 88 supported by the manifold 52 and a chip connection unit 89 that connects the module control unit 88 and the head chip 51. The drive substrate 53 may use a rigid substrate or the like for the module control unit 88 as long as at least the chip connection unit 89 is formed of a flexible substrate.

  The module control unit 88 is formed in a rectangular shape when viewed from the front when viewed from the Y direction. Electronic components such as a driver IC are mounted on the module control unit 88. The module control unit 88 is fixed to the manifold 52 with a support plate 90 sandwiched between portions of the flow path cover 73 facing the −Y direction and positioned in the + Z direction with respect to the head chip 51. Note that the support plate 90 is formed of a material (for example, a metal material) excellent in thermal conductivity. Note that the support plate 90 may not be provided. That is, the module control unit 88 may be directly fixed to the manifold 52.

  As shown in FIG. 2, the drive board 53 is electrically connected to the external connection board 92 via a lead-out part 91 drawn out from the module control part 88 in the + Z direction. The external connection board 92 relays control signals and drive voltages to the head modules 30A to 30D (driver ICs) output from a main control board (not shown) mounted on the printer 1. Then, the drive board 53 drives the head chip 51 based on the control signal and the drive voltage relayed by the external connection board 92.

  As shown in FIG. 4, the chip connection portion 89 extends from the module control portion 88 in the −Z direction with a gap in the Y direction with respect to the flow path cover 73. The −Z direction end of the chip connecting portion 89 is fixed to the + Z direction end of the above-described actuator plate 55 by pressure bonding or the like. Thereby, the drive substrate 53 and the drive electrode of the head chip 51 are electrically connected.

  The drive board 53 includes a sensor connection portion 93 that is pulled out from the + X direction end portion of the module control portion 88. The sensor connection portion 93 is extended to a position where it overlaps with the heat transfer plate 65 described above when viewed from the Y direction. A temperature sensor 94 (for example, a thermistor) that detects the ink temperature in the ejection channel 57 is mounted on the tip of the sensor connection portion 93. The temperature sensor 94 is disposed on the back surface of the actuator plate 55 with the heat transfer plate 65 interposed therebetween.

  As shown in FIG. 3, the first head module 30 </ b> A is inserted into the attachment opening 44 with the manifold 52 inserted into the insertion groove 46 as described above. At this time, in the first head module 30A, the head chip 51 faces the -Y direction, and the end surface of the head chip 51 in the -Z direction is flush with the end surface of the base member 38 (module holding portion 41) in the -Z direction. Is held by the base member 38.

  As shown in FIGS. 2 and 3, the second head module 30B is inserted into the insertion groove 46 adjacent to the insertion groove 46 in which the manifold 52 of the first head module 30A is inserted in the −Y direction. In this state, it is inserted into the mounting opening 44. At this time, the second head module 30B is held by the base member 38 with the head chip 51 facing the head chip 51 of the first head module 30A in the Y direction. Further, the inflow ports 76 of the first head module 30A and the second head module 30B are arranged at the same position in the X direction.

  The head chips 51 of the second head module 30B are arranged with the arrangement pitch of the ejection channels 57 shifted by a half pitch (staggered) with respect to the head chips 51 of the first head module 30A. As a result, the head chips 51 of the first head module 30A and the second head module 30B cooperate to discharge one color ink, thereby enabling high density recording of characters and images recorded on the recording medium P. It has become. In the first head module 30A and the second head module 30B, the arrangement pitch of the ejection channels 57 of the head chip 51 can be changed as appropriate.

  Further, as shown in FIG. 2, the third head module 30C and the fourth head module 30D are the same as the first head module 30A and the second head module 30B described above with the head chips 51 facing each other. It is held by the base member 38 by a method. The head modules 30 </ b> A to 30 </ b> D are fixed to the base member 38 via stays (not shown) that are erected from the base member 38 in the + Z direction. The inflow ports 76 of the third head module 30C and the fourth head module 30D are opposite to the inflow ports 76 of the first head module 30A and the second head module 30B in the X direction (the + X direction in the flow path plate 75). At the end).

(damper)
The damper 31 is provided corresponding to the color of the ink in the + Z direction with respect to the head modules 30A to 30D. That is, one damper 31 of the present embodiment is provided for two head modules (for example, head modules 30A and 30B). Each damper 31 is provided side by side in the Y direction. Each damper 31 has the same configuration except for the color of the supplied ink. Therefore, in the following description, one damper 31 (the damper for the head modules 30A and 30B) will be described, and the description of the other damper 31 will be omitted.

  The damper 31 is attached to the head modules 30 </ b> A and 30 </ b> B in the + Z direction via a stay (not shown) fixed to the base member 38. The damper 31 has an inlet port 100, a pressure buffer unit 101, and an outlet port 102. The damper 31 may be provided separately from the inkjet head 5A.

The inlet port 100 is formed in a cylindrical shape protruding from the pressure buffering portion 101 in the + Z direction. The ink pipe 16 (see FIG. 1) described above is connected to the inlet port 100. The ink in the ink tank 15 flows into the inlet port 100 through the ink pipe 16.
The pressure buffer 101 is formed in a box shape. The pressure buffer unit 101 is configured by accommodating a movable film or the like therein. The pressure buffer unit 101 is disposed between the ink tank 15 (FIG. 1) and the head modules 30 </ b> A and 30 </ b> B, and absorbs pressure fluctuations of ink supplied to the damper 31 through the inlet port 100.
The outlet port 102 is formed in a cylindrical shape protruding from the pressure buffering portion 101 in the −X direction. Ink discharged from the pressure buffer 101 flows into the outlet port 102.

  A filter unit 110 is connected to the outlet port 102. The filter unit 110 houses therein a filter (not shown). The filter unit 110 removes bubbles, foreign matters, and the like contained in the ink discharged from the damper 31 with a filter. The filter unit 110 has branch portions 111 and 112 that split the ink discharged from the damper 31 into two parts. One branch portion 111 is connected to the inflow port 76 of the first head module 30 </ b> A via the connection tube 113. The other branch part 112 is connected to the inflow port 76 of the second head module 30 </ b> B via the connection tube 114. The filter unit 110 is fixed to the base member 38 via a stay (not shown). Further, the above-described external connection substrate 92 is disposed between the dampers 31 facing each other in the Y direction.

FIG. 7 is an exploded perspective view of the base member 38, the nozzle plate 32, and the nozzle guard 33.
As shown in FIG. 7, the spacer 120 is fixed to the −Z direction end surface (plate arrangement surface) of the module holding portion 41 in the base member 38 described above. The spacer 120 is made of polyimide, SUS, or the like. The spacer 120 is bonded to the end surface of the module holding portion 41 in the −Z direction using a soft adhesive. As the soft adhesive, a silicone-based adhesive (for example, 1211 manufactured by Three Bond Co.) is preferably used.

  The spacer 120 covers the end surface of the module holding portion 41 in the −Z direction from the −Z direction. A spacer opening 121 that exposes the head chip 51 in the −Z direction is formed in the spacer 120 at a position overlapping the head chip 51 of each of the head modules 30 </ b> A to 30 </ b> D when viewed from the Z direction. In the present embodiment, the spacer opening 121 exposes the head chips 51 for each color (for example, the head chips 51 of the first head module 30A and the second head module 30B) collectively. The spacer opening 121 may expose the head chips 51 of the head modules 30 </ b> A to 30 </ b> D together, or may expose the head chips 51.

(Nozzle plate)
The nozzle plate 32 described above is formed of a resin material such as polyimide. The nozzle plate 32 has a + Z direction end surface (a surface facing the base member 38) fixed to the above-described spacer 120 and the −Z direction end surface of the head chip 51 with a hard adhesive. The hard adhesive is formed of, for example, a material harder with a Shore hardness than the above-described soft adhesive. As such a material, an epoxy-based adhesive (for example, 931-1T1N1 manufactured by Able Stick Co., Ltd.) is preferably used. The nozzle plate 32 may be directly bonded to the base member 38 using a soft adhesive.

As shown in FIGS. 2 and 7, the nozzle plate 32 collectively covers the head chips 51 of the head modules 30 </ b> A to 30 </ b> D from the −Z direction. A plurality of nozzle rows (first nozzle row 130A to fourth nozzle row 130D) extending in the X direction are formed in the nozzle plate 32 at intervals in the Y direction.
Each nozzle row (injection hole row) 130A to 130D is formed in the nozzle plate 32 at a position facing the head chip 51 of the corresponding head module 30A to 30D in the Z direction.

FIG. 8 is a partial bottom view of the inkjet head 5A as viewed from the −Z direction.
As shown in FIG. 8, each of the nozzle rows 130A to 130D has a nozzle hole (first nozzle hole 131A to fourth nozzle hole 131D) that penetrates the nozzle plate 32 in the Z direction. For example, the first nozzle holes (ejection holes) 131A are separately formed in the nozzle plate 32 at positions facing the ejection channels 57 of the head chip 51 in the first head module 30A in the Z direction. That is, the plurality of first nozzle holes 131A are formed in a straight line at intervals in the X direction, thereby constituting the first nozzle row 130A.
The second nozzle hole 131B, the third nozzle hole 131C, and the fourth nozzle hole 131D are similar to the first nozzle hole 131A described above, of the head chip 51 in the corresponding head modules 30B to 30D in the nozzle plate 32. Each is formed at a position facing the discharge channel 57 in the Z direction.

  As shown in FIG. 7, a slit 135 penetrating the nozzle plate 32 in the Z direction is formed in a portion of the nozzle plate 32 positioned between the second nozzle row 130B and the third nozzle row 130C in the Y direction. Has been. In this embodiment, the slits 135 are formed in two rows at intervals in the Y direction. The slit 135 extends in parallel with the nozzle rows 130A to 130D along the X direction. Further, the length of the slit 135 in the X direction is longer than that of the nozzle rows 130A to 130D. However, the length of the slit 135 can be appropriately changed as long as it is shorter than the length of the nozzle plate 32 in the X direction. Further, the number of slits 135 is not limited to two rows and can be changed as appropriate.

  The nozzle plate 32 is not limited to a resin material, and may be formed of a metal material (stainless steel or the like), or may be a laminated structure of a resin material and a metal material. However, the nozzle plate 32 is preferably made of a material having a thermal expansion coefficient equivalent to that of the spacer 120. Further, the end surface of the nozzle plate 32 in the −Z direction is subjected to a liquid repellent treatment. In the present embodiment, the configuration in which one nozzle plate 32 covers the head modules 30A to 30D together has been described. However, the configuration is not limited to this configuration, and each head module 30A to 30D is individually provided by a plurality of nozzle plates 32. It may be configured to cover. The nozzle plate 32 may not be subjected to the liquid repellent treatment.

(Nozzle guard)
The nozzle guard 33 is formed by pressing a plate material such as stainless steel. The nozzle guard 33 covers the module holding portion 41 from the −Z direction with the nozzle plate 32 and the spacer 120 interposed therebetween.

  In the nozzle guard 33, exposure holes 141 that expose the nozzle rows 130A to 130D to the outside are formed at positions facing the nozzle rows 130A to 130D described above in the Z direction. The exposure hole 141 is formed in a slit shape that penetrates the nozzle guard 33 in the Z direction and extends in the X direction. The exposure holes 141 of this embodiment are formed in two rows at intervals in the Y direction corresponding to the nozzle rows 130A to 130D that discharge the same color ink. That is, the one exposure hole 141 exposes the first nozzle row 130A and the second nozzle row 130B to the outside. The other exposure hole 141 exposes the third nozzle row 130C and the fourth nozzle row 130D to the outside.

  As shown in FIG. 8, the nozzle guard 33 is fixed to the spacer 120 described above by adhesion or the like. Specifically, the nozzle guard 33 is bonded to a portion of the spacer 120 located outside the nozzle plate 32 in a plan view as viewed from the Z direction (hereinafter referred to as “first bonding region 150”). The first adhesion region 150 is set in a frame shape that surrounds the entire circumference of the nozzle plate 32. The first adhesion region 150 may be adhered to the outer peripheral edge of the nozzle plate 32 as long as it is adhered to the spacer 120 at least outside the nozzle plate 32.

  Further, the nozzle guard 33 is bonded to a portion of the spacer 120 exposed through the above-described slit 135 of the nozzle plate 32 (hereinafter referred to as “second bonding region 151”). That is, the second adhesion region 151 extends in parallel with the nozzle rows 130A to 130D along the X direction. Thereby, the 2nd adhesion field 151 partitions off between the nozzle rows of different colors (between the 2nd nozzle row 130B and the 3rd nozzle row 130C) among each nozzle rows 130A-130D.

[How the printer works]
Next, a method for recording information on the recording medium P using the printer 1 described above will be described.
As shown in FIG. 1, when the printer 1 is operated, the grit rollers 11 and 13 of the transport mechanisms 2 and 3 rotate, so that the recording medium P is interposed between the grit rollers 11 and 13 and the pinch rollers 12 and 14. It is conveyed in the + X direction. At the same time, the drive motor 28 rotates the pulley 26 to run the endless belt 27. As a result, the carriage 23 reciprocates in the Y direction while being guided by the guide rails 21 and 22.
During this time, a driving voltage is applied to the driving electrode of the head chip 51 in each of the inkjet heads 5A and 5B. As a result, a thickness-slip deformation is caused in the drive wall 61, and a pressure wave is generated in the ink filled in the ejection channel 57. Due to this pressure wave, the internal pressure of the ejection channel 57 increases, and ink is ejected through the nozzle holes 131A to 131D. Various types of information are recorded on the recording medium P by the ink landing on the recording medium P.

Here, in the present embodiment, for example, in the first head module 30A, the head chip 51 and the drive substrate 53 are supported by the manifold 52 having the ink flow path 71.
According to this configuration, the member that supports the head chip 51 and the drive substrate 53 and the ink flow path 71 are integrated with the manifold 52 that is disposed on one side in the Y direction with respect to the head chip 51. As a result, a member for supporting the head chip and the drive substrate is arranged on one side in the Y direction with respect to the head chip, and a member having an ink flow path is arranged separately on the other side in the Y direction with respect to the head chip. The first head module 30A can be downsized in the Y direction (main scanning direction) as compared with the configuration to be performed. Thereby, the inkjet head 5A can be downsized in the Y direction.
Further, heat generated in the head chip 51 and the drive substrate 53 is radiated to the outside through the manifold 52. Thereby, the heat dissipation performance of the head chip 51 and the drive substrate 53 can be ensured.
Further, since the head chip 51 and the drive substrate 53 are supported by the manifold 52 having the ink flow path 71, the ink flow path is generated using the exhaust heat generated in the head chip 51 and the drive substrate 53 and transmitted to the manifold 52. The ink flowing through 71 can be heated (heat-retained). Thereby, ink can be supplied to the head chip 51 at a desired temperature (viscosity), and excellent printing characteristics can be obtained.
In addition, in the present embodiment, the head modules 30A to 30D can be downsized in the Y direction, so that each head chip 51 can be provided with a manifold 52. Therefore, in order to achieve high density recording, the heat dissipation performance of each head chip 51 can be ensured as compared with the configuration in which a plurality of head chips 51 are mounted on one head module 30A to 30D.

  In the present embodiment, since the damper 31 is disposed in the + Z direction with respect to the manifold 52, the size of the inkjet head 5A in the Y direction can be reduced as compared with the configuration in which the damper 31 and the manifold 52 are provided side by side in the Y direction. Can be achieved.

  In the present embodiment, since the ink flow path 71 extends in a meandering manner, the exhaust heat of the head chip 51 and the drive substrate 53 can be effectively transmitted to the ink in the ink flow path 71. Thereby, ink can be supplied to the head chip 51 at a desired temperature (viscosity), and excellent printing characteristics can be obtained.

In the present embodiment, the heater 85 is disposed on the surface of the manifold 52 that faces the + Y direction (the surface opposite to the surface that supports the drive substrate 53).
According to this configuration, the ink flowing through the ink flow path 71 can be heated by the heater 85 in addition to the exhaust heat of the head chip 51 and the drive substrate 53, so that the ink can be reliably transferred to the head chip 51 at a desired temperature. Can supply.

In the present embodiment, since the insulating sheet 86 is interposed between the head chip 51 and the manifold 52, the head chip 51 and the manifold 52 can be electrically separated. Therefore, stray capacitance generated between the head chip 51 and the manifold 52 when the head chip 51 is driven can be reduced. Thereby, the electrical noise to the drive board | substrate 53 can be suppressed and the operation | movement reliability of 5 A of inkjet heads can be ensured.
Further, by using a material having ink resistance such as polyimide for the insulating sheet 86, it is possible to suppress the insulating sheet 86 from being eluted by the ink and to suppress ejection failure. Moreover, the insulating sheet 86 which was excellent in workability and adhesiveness can be provided by forming the insulating sheet 86 with a polyimide.

Further, by using a soft material such as polyimide for the insulating sheet 86, stress acting on the head chip 51 and the manifold 52 due to the difference in thermal expansion coefficient between the head chip 51 and the manifold 52 can be reduced. Thereby, it is possible to suppress, for example, the deformation and cracking of the head chip 51, the separation from the manifold 52, and the positional deviation of the head chip 51 with respect to the manifold 52.
In addition, by providing the insulating sheet 86 separately from the manifold 52, unlike the case where the insulating sheet 86 forms a part of the manifold 52, the degree of freedom in material selection and design of the insulating sheet 86 can be improved. it can. An insulator may be interposed between the drive substrate 53 and the manifold 52.

In the present embodiment, the nozzle plate 32 having the nozzle rows 130A to 130D corresponding to the head modules 30A to 30D is arranged on the end surface of the base member 38 in the −Z direction.
According to this configuration, the positional accuracy of the nozzle holes 131A to 131D can be improved as compared with the configuration in which the nozzle plate 32 is attached to each of the head modules 30A to 30D.

In this embodiment, since the spacer 120 is interposed between the nozzle plate 32 and the base member 38, the nozzle plate 32 and the base member 38 are caused by the difference in thermal expansion coefficient between the nozzle plate 32 and the base member 38. The stress acting on can be relieved.
Furthermore, in this embodiment, since the spacer 120 is bonded to the base member 38 with a soft adhesive, it acts on the spacer 120 and the base member 38 due to the difference in thermal expansion coefficient between the spacer 120 and the base member 38. Stress can be relieved reliably.
Thereby, it can suppress that the nozzle plate 32 peels from the head chip 51. FIG.

In the present embodiment, the first adhesion region 150 between the nozzle guard 33 and the spacer 120 is arranged so as to surround the nozzle plate 32.
According to this configuration, when the ink adhering to the −Z direction end faces of the nozzle plate 32 and the nozzle guard 33 attempts to enter the inkjet head 5A through the gap between the nozzle plate 32 and the nozzle guard 33, The ink can be blocked by one adhesive region 150. Thereby, it can suppress that an ink approachs the inside of 5 A of inkjet heads.

In the present embodiment, the second adhesion region 151 between the nozzle guard 33 and the spacer 120 is arranged between the nozzle rows 130B and 130C from which different color inks are ejected among the nozzle rows 130A to 130D. did.
According to this configuration, the different color ink adhering to the −Z direction end surface of the nozzle plate 32 is blocked by the second adhesion region 151. Thereby, it is possible to prevent the different color inks from being mixed and leaking outside the inkjet head 5A.

In the present embodiment, a first urging member and a second urging member that urge the base member 38 and the head modules 30A to 30D in one of the X direction and the Y direction between the base member 38 and the head modules 30A to 30D. The force member 70 is interposed.
According to this configuration, the head modules 30 </ b> A to 30 </ b> D are held by the base member 38 in a state where they are pressed in one of the X direction and the Y direction. Therefore, the head modules 30 </ b> A to 30 </ b> D can be positioned with high accuracy with respect to the base member 38. Thereby, the assembly property at the time of fixing head module 30A-30D to the base member 38 via a stay etc. can be improved after that.

In the present embodiment, since the temperature sensor 94 is disposed on the back surface of the actuator plate 55, the ink temperature of the ejection channel 57 can be detected more accurately than when the temperature sensor 94 is disposed at a position separated from the actuator plate 55. .
In particular, in the present embodiment, a heat transfer plate 65 is provided between the temperature sensor 94 and the actuator plate 55 so as to cover the entire area of the channels 57 and 58. Therefore, the average ink temperature in all the ejection channels 57 can be detected.

  And since the printer 1 of this embodiment is provided with the inkjet head 5A mentioned above, after achieving size reduction of a Y direction, the printer 1 excellent in reliability can be provided.

In the above-described embodiment, the case where the insulating sheet 86 is formed of a relatively soft material has been described. However, the insulating sheet 86 is not limited to this configuration, and the material having a thermal expansion coefficient close to that of the head chip 51 or the manifold 52 is used. May be formed. As such a material, ceramics (particularly machinable ceramics) or the like can be employed.
According to this configuration, the difference in thermal expansion coefficient between the head chip 51, the manifold 52, and the insulating sheet 86 can be reduced, so that relative displacement of the head chip 51, the manifold 52, and the insulating sheet 86 due to temperature change can be suppressed. Therefore, due to differences in thermal expansion coefficients among the head chip 51, the manifold 52, and the insulating sheet 86, for example, deformation or cracking of the head chip 51, separation from the manifold 52, displacement of the head chip 51 with respect to the manifold 52, and the like occur. Can be suppressed.

  In the above-described embodiment, the case where the manifold 52 has conductivity has been described. However, the present invention is not limited to this configuration, and the manifold 52 may be formed of an insulating material. Even when a conductive member is attached to the insulating manifold 52, electrical noise to the drive substrate may occur due to the stray capacitance described above. Therefore, similarly to the above-described embodiment, by interposing the insulating sheet 86 between the head chip 51 and the manifold 52, electrical noise can be suppressed, and the operation reliability of the inkjet head 5A can be ensured.

In the above-described embodiment, the configuration in which the insulating sheet 86 is provided separately from the manifold 52 has been described. However, the configuration is not limited to this configuration. Like the manifold 252 of the head module 230 shown in FIG. 9, the flow path cover 273 itself may be formed of an insulator.
According to this configuration, since the insulator constitutes a part of the manifold 252, the number of parts can be reduced as compared with the case where the insulator is provided separately from the manifold 252.

  The technical scope of the present invention is not limited to the embodiments described above, and various modifications can be made without departing from the spirit of the present invention.

  For example, in the above-described embodiment, the ink jet printer 1 is described as an example of the liquid ejecting apparatus, but the present invention is not limited to the printer. For example, a fax machine or an on-demand printer may be used.

In the above-described embodiment, the configuration in which the four head modules 30A to 30D are mounted on the base member 38 has been described. However, the configuration is not limited thereto. The number of head modules mounted on the base member 38 may be one or more.
In the above-described embodiment, the configuration in which ink of one color is ejected by two head modules has been described. However, the configuration is not limited to this configuration, and ink of one color may be ejected by three or more head modules. One head module may eject one color ink.

In the embodiment described above, the edge chute head chip has been described, but the present invention is not limited to this. For example, the present invention may be applied to a so-called side shoot type head chip that ejects ink from the central portion of the ejection channel in the extending direction.
Further, the present invention may be applied to a so-called roof chute type head chip in which the direction of pressure applied to the ink and the direction of ink droplet ejection are the same.

  In the above-described embodiment, the configuration in which the head chip 51 and the drive substrate 53 are supported on the same surface of the manifold has been described. However, the configuration is not limited thereto. For example, the head chip 51 and the drive substrate 53 may be supported on different surfaces of the manifold 52 (for example, both surfaces facing the Y direction).

  In addition, in the range which does not deviate from the meaning of this invention, it is possible to replace suitably the component in the embodiment mentioned above by a known component, and you may combine each modification mentioned above suitably.

(1) A damper that is connected to the liquid channel on the side opposite to the injection hole plate in the first direction with respect to the manifold and absorbs pressure fluctuations of the liquid supplied to the liquid channel. A liquid ejecting head, wherein:

(2) The liquid ejecting head, wherein the liquid flow path extends in a meandering manner.

(3) The liquid ejecting head, wherein a heater is disposed on a second surface of the manifold facing the third direction.

(4) An insulating sheet is interposed between the first surface of the manifold and a surface of the head chip that faces the first surface of the manifold facing the third direction. A liquid ejecting head.

(5) The head chip, the manifold, and the drive substrate constitute a head module, and a plurality of the head modules are mounted on the base member in a state of being aligned in the third direction. The liquid ejecting device having a plurality of the ejection hole arrays corresponding to the head chips in the head module, and disposed on a plate arrangement surface facing the other of the first direction among the base members. head.

(6) A spacer is interposed between the plate arrangement surface of the base member and a surface of the injection hole plate facing the plate arrangement surface of the base member facing the first direction. A liquid jet head characterized by that.

(7) The spacer is bonded to the base member with a soft adhesive, and the injection hole plate is bonded to the spacer with a hard adhesive formed of a harder material than the soft adhesive. A liquid ejecting head characterized by the above.

(8) An injection hole guard that has an exposure hole that exposes the injection hole array to the outside in the other of the first direction with respect to the injection hole plate and covers the injection hole plate from the other of the first direction. The injection hole plate is formed smaller than the outer shape of the spacer in a plan view viewed from the first direction, and the injection hole guard is the injection hole plate in a plan view viewed from the first direction. The liquid ejecting head according to claim 1, wherein the liquid ejecting head is bonded to the spacer in an outer region, and an adhesion portion between the ejection hole guard and the spacer surrounds the periphery of the ejection hole plate.

(9) The plurality of head modules include: a first head module capable of ejecting a first liquid; and a second head module capable of ejecting a second liquid having a different color from the first liquid. A portion of the hole plate located between the first injection hole array corresponding to the first head module and the second injection hole array corresponding to the second head module is provided with the injection hole plate. A slit that penetrates in the first direction and partitions the first injection hole array and the second injection hole array is formed, and the injection hole guard is bonded to the spacer through the slit. Liquid jet head.

(10) The base member is formed with an attachment opening that penetrates the base member in the first direction and into which the head module is inserted, and between the head module and the base member, A liquid ejecting head, comprising: a biasing member that biases the head module and the base member in at least one of the second direction and the third direction.

1 ... Inkjet printer (liquid ejecting device)
5A, 5B ... Inkjet head (liquid jet head)
30A ... 1st head module (head module)
30B ... 2nd head module (head module, 1st head module)
30C ... Third head module (head module, second head module)
30D ... Fourth head module (head module)
31 ... Damper 32 ... Nozzle plate (injection hole plate)
33 ... Nozzle guard (spray hole guard)
38 ... Base member 44 ... Mounting opening 51 ... Head chip 52 ... Manifold 53 ... Drive substrate 57 ... Discharge channel (channel)
70: Second urging member (urging member)
71: Ink channel (liquid channel)
72 ... Channel member 73 ... Channel cover 79 ... Meandering part 85 ... Heater 86 ... Insulating sheet (insulator)
252 ... Manifold 273 ... Flow path cover (insulator)
120: Spacer 130A: First nozzle row (injection hole row)
130B ... second nozzle row (injection hole row, first injection hole row)
130C ... third nozzle row (injection hole row, second injection hole row)
130D ... 4th nozzle row (jet hole row)
131A ... 1st nozzle hole (injection hole)
131B ... Second nozzle hole (injection hole)
131C ... Third nozzle hole (injection hole)
131D ... Fourth nozzle hole (injection hole)
141 ... exposed hole 150 ... first adhesion region (adhesion portion)

Claims (8)

An injection hole plate having an injection hole array in which a plurality of injection holes extending in the first direction are arranged in parallel in a second direction orthogonal to the first direction;
A head chip disposed on one side in the first direction with respect to the ejection hole plate and having a channel communicating with the ejection hole separately;
Having a flow path member in which a liquid flow path communicating with the channel is formed, and a manifold for supporting the head chip;
A drive substrate supported by the manifold and electrically connected to the head chip,
A liquid ejecting head, wherein an insulator is interposed between the flow path member and the head chip. The manifold is
The flow path member;
A flow path cover that is superimposed on the flow path member and closes the liquid flow path,
The liquid ejecting head according to claim 1, wherein the insulator is interposed between the flow path cover and the head chip. The manifold is
The flow path member;
A flow path cover that is superimposed on the flow path member and closes the liquid flow path,
The liquid jet head according to claim 1, wherein the flow path cover is the insulator.   The liquid ejecting head according to claim 1, wherein the insulator is made of a material softer than the flow path member and the head chip.   The liquid ejecting head according to claim 4, wherein the insulator is made of polyimide.   4. The liquid jet head according to claim 1, wherein the head chip and the insulator are made of ceramics. 5.   7. The head chip and the driving substrate are supported by a first surface of the manifold that faces a third direction orthogonal to the first direction and the second direction. The liquid ejecting head according to claim 1.   A liquid ejecting apparatus comprising the liquid ejecting head according to claim 1.

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