JP2017136740A - Laminate, member for housing, electronic equipment and method for manufacturing member for housing - Google Patents

Laminate, member for housing, electronic equipment and method for manufacturing member for housing Download PDF

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Publication number
JP2017136740A
JP2017136740A JP2016018993A JP2016018993A JP2017136740A JP 2017136740 A JP2017136740 A JP 2017136740A JP 2016018993 A JP2016018993 A JP 2016018993A JP 2016018993 A JP2016018993 A JP 2016018993A JP 2017136740 A JP2017136740 A JP 2017136740A
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Japan
Prior art keywords
fiber reinforced
reinforced resin
intermediate layer
resistor
thermoplastic resin
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JP2016018993A
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Japanese (ja)
Inventor
文武 溝口
Fumitake Mizoguchi
文武 溝口
大谷 哲也
Tetsuya Otani
哲也 大谷
武仁 山内
Takehito Yamauchi
武仁 山内
賢 堂薗
Masaru Dosono
賢 堂薗
Original Assignee
レノボ・シンガポール・プライベート・リミテッド
Lenovo Singapore Pte Ltd
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Priority to JP2016018993A priority Critical patent/JP2017136740A/en
Publication of JP2017136740A publication Critical patent/JP2017136740A/en
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Abstract

Provided are a laminate and a casing member that can be reduced in weight, an electronic device using the casing member, and a method of manufacturing the casing member. A laminated board 30 is provided with an intermediate layer 42 between a pair of fiber reinforced resin boards 40 and 41, and a thermoplastic resin 32a is joined to at least a part of a peripheral edge 30a of the casing. The member 10 is configured. In the laminated plate 30, a resistor 44 is interposed in the intermediate layer 42 that is resistant to the penetration of the thermoplastic resin 32 a into the intermediate layer 42 from between the pair of fiber reinforced resin plates 40 and 41. As a result, when the thermoplastic resin 32a is injection-molded, the resistor 44 becomes a resistance, the amount of the thermoplastic resin 32a entering the intermediate layer 42 is appropriately controlled, and an increase in the weight is suppressed. [Selection] Figure 3

Description

  The present invention relates to a laminated plate and a casing member that can be used in a casing of an electronic device such as a notebook PC, an electronic device using the casing member, and a method of manufacturing the casing member.

  The casings of various electronic devices such as notebook personal computers (notebook PCs), tablet personal computers (tablet PCs), smartphones, and mobile phones need to be lightweight, thin, and high in strength. Therefore, the case of electronic equipment is a plate with a prepreg plate (fiber reinforced resin plate) in which a reinforcing fiber such as carbon fiber is impregnated with a thermosetting resin such as an epoxy resin, and an intermediate layer made of foamed material is sandwiched between them. It is widely used to use a laminated board.

  When such a laminated plate is used for a housing such as a notebook PC, it is necessary to perform a desired shape processing such as a wall portion at least on the peripheral edge thereof. However, since the laminate is composed of a hard fiber reinforced resin plate, the degree of freedom of shape processing such as bending is poor.

  Therefore, the present applicant has proposed a configuration in which a thermoplastic resin is injection-molded and joined to the peripheral edge portion of the laminate (see Patent Document 1). In this configuration, an anchor effect is produced by allowing the thermoplastic resin injection-molded at the peripheral edge of the laminated plate to enter the intermediate layer sandwiched between the fiber-reinforced resin plates, thereby obtaining a high bonding strength. Therefore, since this casing member can secure the degree of freedom of shape processing at the thermoplastic resin portion bonded to the laminate, the laminate can be widely used as casing members of various shapes.

JP2013-232052A

  By the way, there is a great demand for weight reduction of portable electronic devices such as notebook PCs, and further weight reduction is also demanded for the above-described housing members.

  In view of this, for example, it is conceivable to increase the porosity by increasing the foaming ratio of the foam material forming the intermediate layer of the laminate, thereby reducing the weight. However, in such a configuration, since the density of the foam material itself forming the intermediate layer is reduced, the amount of the injection-molded thermoplastic resin entering the intermediate layer is greatly increased. As a result, the amount of the thermoplastic resin used increases, and as a result, the housing member becomes heavy, and it may not be possible to achieve the target weight reduction.

  The present invention has been made in consideration of the above-described problems of the prior art, and can provide a laminated plate and casing member that can be reduced in weight, an electronic device using the casing member, and the casing member. It aims at providing the manufacturing method of.

  The laminated board according to the present invention is a laminated board in which an intermediate layer is disposed between a pair of fiber reinforced resin plates, and a thermoplastic resin is bonded to at least a part of the peripheral portion thereof, and is between the pair of fiber reinforced resin plates. The intermediate layer is provided with a resistor that provides resistance to the thermoplastic resin from entering the intermediate layer.

  According to such a configuration, when the thermoplastic resin is injection-molded on the peripheral edge of the laminated plate, the thermoplastic resin penetrates into the intermediate layer while melting the intermediate layer, but the resistor becomes a resistance and further Infiltration into the back side is restricted. Thereby, for example, even when the intermediate layer has a structure in which the porosity is increased and the weight is reduced, the intrusion amount of the thermoplastic resin can be controlled by the resistor. For this reason, it is possible to avoid an increase in the weight of the casing member in which the thermoplastic resin is bonded to the laminated plate as a result of an increase in the amount of penetration of the thermoplastic resin into the intermediate layer, thereby reducing the weight. It is done.

  The resistor may be constituted by a part of at least one fiber reinforced resin plate. If it does so, formation of a resistor is easy, and since it is not necessary to provide a resistor as a separate member, an increase in the weight of the laminate can be avoided.

  A part of the fiber reinforced resin plate may have a configuration in which a tip portion thereof faces a direction toward the peripheral portion. Then, when the thermoplastic resin enters the intermediate layer, the thermoplastic resin also enters the cut portion and is caught by the end surface of the fiber reinforced resin plate formed by the cut. As a result, the bonding strength of the thermoplastic resin to the laminate is improved, and the effect of preventing the separation in the direction in which both are separated is improved.

  A part of the fiber reinforced resin plate may have a configuration in which a tip portion thereof faces a direction away from the peripheral edge.

  A part of the fiber-reinforced resin plate may have a shape that gradually becomes wider toward the tip. Then, since the resistor enters the wedge shape and is bonded to the injected thermoplastic resin, higher bonding strength can be obtained.

  A configuration in which a plurality of the resistors are arranged in parallel along the peripheral edge may be employed. If it does so, the penetration | invasion amount of the thermoplastic resin to an intermediate | middle layer can be controlled more reliably.

  The plurality of resistors include a first row of resistor groups in which the resistors are arranged in parallel along the peripheral portion at a predetermined interval, and the peripheral portion side with respect to the first row of resistor groups And a second row of resistor groups in which the resistors are arranged in parallel at positions corresponding to the gaps between the resistors of the first row of resistor groups. May be. Then, the penetration of the thermoplastic resin from the gap between the first row resistor groups can be reliably regulated by the second row resistor group, and the amount of the thermoplastic resin intruded into the intermediate layer can be further ensured. Can be controlled.

  The fiber reinforced resin plate may include carbon fibers.

  The intermediate layer may be formed of a foam material having a void portion containing air.

  Further, the housing member according to the present invention is a housing member in which an intermediate layer is disposed between a pair of fiber reinforced resin plates, and a thermoplastic resin member is bonded to at least a part of the peripheral portion thereof. An intrusion part that is a part of the thermoplastic resin member disposed in a state of entering at least a part between the pair of fiber reinforced resin plates, and opposed to a direction in which the intrusion part enters between the fiber reinforced resin plates And a resistor arranged as described above. According to such a configuration, since the penetration of the thermoplastic resin into the intermediate layer is controlled by the resistor, the weight can be reduced.

  An electronic apparatus according to the present invention includes a casing using the casing member having the above-described configuration. Thereby, weight reduction of a housing | casing can be achieved.

  In the method for manufacturing a housing member according to the present invention, a thermoplastic resin is injection-molded on at least a part of a peripheral portion of a laminated plate formed by disposing and pressing an intermediate layer between a pair of fiber reinforced resin plates. A member for a housing to be joined, wherein a resistor serving as a resistance against the penetration of the thermoplastic resin into the intermediate layer from between the pair of fiber reinforced resin plates is interposed in the intermediate layer. The injection molding of the thermoplastic resin is performed. Then, when the thermoplastic resin is injection-molded on the peripheral edge of the laminated plate, the penetration of the thermoplastic resin into the intermediate layer is controlled by the resistor. As a result, the weight of the housing member can be reduced.

  When the laminate is formed by disposing and pressing an intermediate layer between the pair of fiber reinforced resin plates, a bent piece is obtained by cutting and bending a part of at least one of the fiber reinforced resin plates to the intermediate layer side. The said resistor may be formed. If it does so, a resistor can be formed simultaneously with manufacture of a laminated board, and manufacturing efficiency is good.

  According to the present invention, for example, even when the intermediate layer has a structure in which the porosity is increased and the weight is reduced, the intrusion amount of the thermoplastic resin can be controlled by the resistor. For this reason, it is possible to avoid an increase in the weight of the casing member in which the thermoplastic resin is bonded to the laminated plate as a result of an increase in the amount of penetration of the thermoplastic resin into the intermediate layer, thereby reducing the weight. It is done.

FIG. 1 is a perspective view of an electronic device including a casing using a casing member according to an embodiment of the present invention. FIG. 2 is a plan view schematically showing a configuration example of the back cover of the housing. FIG. 3 is a cross-sectional view schematically showing a cross-sectional shape along the line III-III in FIG. FIG. 4 is a cross-sectional view for explaining the manufacturing process of the laminated plate, and FIG. 4 (A) is a view showing a state in which a cut is formed in one fiber reinforced resin plate of the laminated plate. FIG. 4B is a diagram illustrating a state in which a resistor is formed from the state illustrated in FIG. FIG. 5 is a plan view showing a state in which a notch for forming the resistor is formed in one of the fiber reinforced resin plates. FIG. 6 is a plan view showing a state in which cuts forming two rows of resistor groups are formed in one fiber reinforced resin plate. FIG. 7 is a cross-sectional view for explaining the method for manufacturing the housing member according to the present embodiment. FIG. 8 is a cross-sectional view of the housing member in the configuration using the resistor according to the first modification. FIG. 9 is a plan view showing a state in which a notch for forming a resistor according to the second modification is formed in one of the fiber reinforced resin plates. FIG. 10 is a plan view showing a state in which cuts forming two rows of resistor groups shown in FIG. 9 are formed in one fiber-reinforced resin plate. FIG. 11 is a cross-sectional view of a housing member having a configuration using a resistor according to a third modification. FIG. 12 is a plan view of a fiber-reinforced resin plate on which the resistor shown in FIG. 11 is formed. FIG. 13 is a cross-sectional view of a housing member having a configuration using a resistor according to a fourth modification.

  DESCRIPTION OF EMBODIMENTS Hereinafter, a laminated plate according to the present invention will be described in detail with reference to the accompanying drawings by giving preferred embodiments in relation to a casing member using the laminated plate and a manufacturing method thereof.

  FIG. 1 is a perspective view of an electronic device 14 including a housing 12 using a housing member 10 according to an embodiment of the present invention. In the present embodiment, a configuration in which the housing 12 using the housing member 10 is used as the lid 16 of the electronic device 14 that is a notebook PC is exemplified. However, the housing member 10 is used for the device main body 20. Also good. The casing member 10 can be used as a casing member for various electronic devices such as a tablet PC, a desktop PC, a smartphone, or a mobile phone, other than a notebook PC.

  As shown in FIG. 1, the electronic device 14 includes a device main body 20 having a keyboard device 18 and a rectangular flat plate-shaped lid body 16 having a display device 22 composed of a liquid crystal display or the like. The electronic device 14 is a clamshell type in which the lid 16 is connected to the device body 20 by left and right hinges 24 so as to be opened and closed.

  The device main body 20 is a flat box-shaped housing, and houses various electronic components such as a substrate, an arithmetic processing device, a hard disk device, and a memory (not shown). The keyboard device 18 is disposed on the upper surface of the device main body 20.

  The lid body 16 includes a housing 12 in which a back cover 12 a and a front cover 12 b are overlapped and fastened, and is electrically connected to the device body 20 by a cable (not shown) that has passed through a hinge 24. The back cover 12 a is a cover member that covers the side surface and the back surface of the lid body 16. In the present embodiment, the back cover 12 a is constituted by the housing member 10. The front cover 12b is a resin cover member that covers the front surface of the lid body 16, and an opening for exposing the display device 22 made of, for example, a liquid crystal display is provided in most of the front cover 12b.

  Next, a configuration example of the back cover 12a of the housing 12 constituting the lid 16 and the housing member 10 forming the back cover 12a will be described.

  First, a configuration example of the back cover 12a will be described. FIG. 2 is a plan view schematically showing a configuration example of the back cover 12a of the housing 12, and is a view of the back cover 12a serving as the back surface of the lid body 16 as viewed from the inner surface side.

  As described above, the back cover 12 a is formed by the housing member 10. As shown in FIG. 2, the housing member 10 is obtained by joining a thermoplastic resin to a laminated plate 30 that is light and high-strength with a three-layer structure, and a peripheral portion (outer end face) 30 a of the laminated plate 30. And a frame portion 32 formed of The back cover 12 a is formed by a frame portion 32 of the housing member 10, and a wall portion 34 that forms a peripheral portion and side surfaces of the four sides, and a plate-like portion that supports the back surface of the display device 22 by the laminated plate 30. Is formed.

  The housing 12 is fastened to the hinge 24 via a pair of right and left fastening portions 36 on one edge side (lower edge in FIG. 2) of the frame portion 32 of the back cover 12a. A pair of left and right antennas 38 for wireless communication are disposed on the frame portion 32 on the other edge side (upper edge in FIG. 2) of the back cover 12a.

  Next, a specific configuration of the housing member 10 constituting the back cover 12a will be described. 3 is a cross-sectional view schematically showing a cross-sectional shape along the line III-III in FIG. 2, and a cross-sectional view in the thickness direction at a portion including the laminated plate 30 and the frame portion 32 of the housing member 10. It is.

  As shown in FIG. 3, the housing member 10 is joined to a laminated plate 30 in which an intermediate layer 42 is disposed between a pair of upper and lower fiber reinforced resin plates 40 and 41, and a peripheral portion 30 a of the laminated plate 30. Frame portion 32.

  Each of the fiber reinforced resin plates 40 and 41 is a prepreg obtained by impregnating a reinforced fiber with a thermosetting resin such as an epoxy resin, and has a plate thickness of, for example, about 0.3 mm. In this embodiment, carbon fiber reinforced resin (CFRP) using carbon fibers is used as reinforcing fibers. The reinforcing fibers may be other than carbon fibers, and various materials such as metal fibers such as stainless fibers and inorganic fibers such as glass fibers may be used.

  The intermediate layer 42 is a soft spacer that is provided between the pair of fiber reinforced resin plates 40 and 41 and separates the hard fiber reinforced resin plates 40 and 41, and has a thickness of about 0.6 mm, for example. By providing the intermediate layer 42, the section modulus in the thickness direction of the laminated plate 30 is increased, and a light-weight and high-strength structure is obtained. The intermediate layer 42 is formed of a foam layer having a void portion containing air by being formed of a foam material such as polypropylene.

  The frame portion 32 is joined to the laminated plate 30 by injection molding a thermoplastic resin 32a on the peripheral edge portion 30a of the laminated plate 30. As the thermoplastic resin 32a forming the frame portion 32, for example, polyethylene resin or polypropylene resin may be used, and fiber reinforced resin (for example, GFRP) in which reinforcing fibers such as glass fiber are contained in these resins is used. Also good. In the case of the present embodiment, an anchor effect is produced by injection molding so that the thermoplastic resin 32a forming the frame portion 32 enters the intermediate layer 42 sandwiched between the fiber reinforced resin plates 40 and 41, and high bonding is achieved. Strength is secured.

  By joining such a frame part 32, desired shape processing of the wall part 34 etc. can be given to the peripheral part of the laminated board 30 with few degrees of freedom of processing, such as a bending and a cutting | disconnection. In addition, it is possible to improve the degree of design freedom such as installing the antenna 38 on the frame portion 32 of the nonconductive material at a position away from the fiber reinforced resin plates 40 and 41 which are conductive materials (see FIG. 2). Although FIG. 2 illustrates a configuration in which the frame portion 32 is provided on the entire periphery of the peripheral edge portion 30a of the laminated plate 30, the frame portion 32 may be joined only to a part of the peripheral edge portion 30a.

  By the way, in order to reduce the weight of the housing member 10, it is important to reduce the weight of the intermediate layer 42 as described above. Therefore, for example, there is a method of increasing the ratio of the voids by increasing the expansion ratio of the foam material forming the intermediate layer 42 to increase the void ratio. However, in this method, since the density of the foam material itself of the intermediate layer 42 is reduced, the thermoplastic resin 32a injection-molded to form the frame portion 32 penetrates deeply while easily melting the intermediate layer 42. . If it does so, the usage-amount of the thermoplastic resin 32a will increase, and it will result in causing a weight increase on the contrary.

  Therefore, in the housing member 10, as shown in FIG. 3, a resistor (resistor portion) 44 that serves as resistance against the penetration of the thermoplastic resin into the intermediate layer 42 from between the pair of fiber reinforced resin plates 40 and 41 is provided. By interposing it in the vicinity of the peripheral edge portion 30a of the intermediate layer 42 of the laminated plate 30, the amount of the thermoplastic resin 32a forming the frame portion 32 entering the intermediate layer 42 can be appropriately suppressed. For example, a plurality of resistors 44 are arranged in a line at regular intervals along the peripheral edge of the laminate 30 (see FIG. 2).

  As shown in FIGS. 2 and 3, the resistor 44 includes a U-shaped or rectangular cut 44 a in a part of a fiber reinforced resin plate 41 disposed on the inner surface side of the housing member 10, for example, It is a bent piece-like portion formed so as to be bent toward the layer 42 side. The resistor 44 has its tip end directed toward the peripheral edge 30a. The thermoplastic resin 32a is cured in a state where the thermoplastic resin 32a enters the intermediate layer 42 from between the pair of fiber reinforced resin plates 40 and 41, contacts the resistor 44, and is dammed. That is, the resistor 44 has an intrusion portion 32b which is a part of the thermoplastic resin 32a disposed in at least a part between the pair of fiber reinforced resin plates 40 and 41. It arrange | positions so that it may oppose with respect to the direction which has entered between.

  As a procedure of the manufacturing method of such a housing member 10, first, a pair of planar fiber reinforced resin plates 40 and 41 are prepared, and a planar intermediate layer 42 is sandwiched therebetween, and the whole is laminated in the stacking direction. The laminated board 30 is formed by pressing the sheet. During this pressing, a notch 44a is formed with a cutter at a desired position on one of the fiber reinforced resin plates 41 as shown in FIG. 4A (see FIG. 5), and as shown in FIG. 4B. The inner side of 44a is pressed and bent with a mold. As a result, as shown in FIG. 4B, the laminated plate 30 in a state in which the bent piece-like resistor 44 is formed at a desired position is formed.

  Therefore, the laminated plate 30 thus formed is set in a mold 46 (see FIG. 7), and the molten thermoplastic resin 32a is filled in the cavity 46a of the mold 46. Thereby, the thermoplastic resin 32a is injection-molded so as to come into contact with the peripheral edge portion 30a of the laminated plate 30, and the frame portion 32 is formed. At this time, as shown in FIG. 3, the injected thermoplastic resin 32a penetrates into the intermediate layer 42 while melting the intermediate layer 42, but the resistors 44 arranged in a line along the peripheral edge 30a It becomes resistance, and the penetration | invasion to the back side from each resistor 44 is mostly controlled. As a result, as shown in FIG. 3, the casing member 10 is formed in which the frame portion 32 is joined to the laminated plate 30 with the thermoplastic resin 32 a entering the intermediate layer 42 from the peripheral portion 30 a to the vicinity of the resistor 44. Is done.

  By the way, as shown in FIG.2 and FIG.5, in the structure which arranged the several resistor 44 in 1 row at equal intervals along the peripheral part 30a of the laminated board 30, the clearance gap between each resistor 44 is thermoplastic resin. There is also a possibility that 32a passes and enters the intermediate layer 42 further into the back side than the resistor 44. Therefore, as shown in FIG. 6, the inner side of the resistor group A in the first row in which the resistors 44 are arranged along the peripheral portion 30a, that is, the peripheral portion 30a side with respect to the resistor group A in the first row. On the opposite side, the second row resistor group B in which the resistors 44 are arranged in one row is provided at a position corresponding to the gap between the resistors 44 in the first row resistor group A. Also good. Then, the penetration of the thermoplastic resin 32a from the gaps between the resistors 44 constituting the first row of resistor groups A can be reliably regulated by the resistors 44 of the second row of resistor groups B. The amount of penetration of the plastic resin 32a into the intermediate layer 42 can be controlled more reliably.

  As described above, in the laminated plate 30 according to the present embodiment, the intermediate layer 42 is disposed between the pair of fiber reinforced resin plates 40 and 41, and the thermoplastic resin 32a is bonded to at least a part of the peripheral edge portion 30a. In the configuration, the intermediate layer 42 is provided with a resistor 44 that provides resistance to the thermoplastic resin 32a from entering between the pair of fiber reinforced resin plates 40 and 41 into the intermediate layer 42. In other words, in the configuration in which the laminated plate 30 is provided with the intermediate layer 42 between the pair of fiber reinforced resin plates 40 and 41 and the thermoplastic resin 32a is joined to at least a part of the peripheral edge portion 30a, A resistor 44 formed by cutting and bending a part of at least one fiber reinforced resin plate 41 toward the intermediate layer 42 is disposed on the layer 42.

  Therefore, when the thermoplastic resin 32a is injection-molded on the peripheral edge portion 30a of such a laminate 30, the thermoplastic resin 32a penetrates into the intermediate layer 42 while melting the intermediate layer 42, but the resistor 44 has resistance. As a result, intrusion into the back side is restricted. Thereby, for example, even when the intermediate layer 42 has a structure in which the porosity is increased and the weight is reduced, the intrusion amount of the thermoplastic resin 32 a can be controlled by the resistor 44. For this reason, the amount of penetration of the thermoplastic resin 32a into the intermediate layer 42 is increased, and as a result, it is possible to avoid an increase in the weight of the housing member 10 in which the thermoplastic resin 32a is joined to the laminated plate 30. As a result, the weight reduction of the laminated board 30 and the housing member 10 can be achieved.

  In the laminated plate 30, the resistor 44 is formed by a part of one fiber reinforced resin plate 41. For this reason, not only the formation of the resistor 44 is easy, but there is no need to provide a separate resistor, so that an increase in the weight of the laminate 30 can be avoided.

  In this case, the resistor 44 is oriented in the direction in which the tip end is directed toward the peripheral edge 30a. Therefore, when the thermoplastic resin 32a enters the intermediate layer 42, the thermoplastic resin 32a also enters the notch 44a, and the end face corresponding to the thickness of the fiber reinforced resin plate 41 formed by the notch 44a (reference numeral 44a in FIG. 3). The part indicated by As a result, the bonding strength of the frame part 32 to the laminated plate 30 is further improved, and the effect of preventing the removal in the direction in which both are separated is improved.

  FIG. 8 is a cross-sectional view of the housing member 10 having a configuration using the resistor 48 according to the first modification. As shown in FIG. 8, the resistor 48 has a shape in which the direction of the cut 48 a is symmetrical with the cut 44 a of the resistor 44. For this reason, the resistor 48 is oriented in the direction opposite to the direction in which the cut and bent distal end portion is directed toward the peripheral edge portion 30a, that is, in the direction away from the peripheral edge portion 30a. Of course, such a resistor 48 may also be configured to include the resistor group A in the first row and the resistor group B in the second row.

  FIG. 9 is a plan view showing a state in which a cut 50a for forming the resistor 50 according to the second modification is formed in one of the fiber reinforced resin plates 41. FIG. The resistors 44 and 48 described above are bent piece-like portions formed in a rectangular plate shape by bending the U-shaped or rectangular cuts 44a and 48a, but the resistor 50 shown in FIG. This is a bent piece-like portion obtained by bending a substantially trapezoidal cut 50a that gradually becomes wider from the proximal end portion toward the distal end portion. Naturally, such a resistor 50 may also be configured to include a resistor group A in the first row and a resistor group B in the second row as shown in FIG. The resistor 50 may also be configured in a symmetric shape like the resistor 48 shown in FIG.

  Since the resistor 50 has a distal end portion bent in the intermediate layer 42 wider than the proximal end portion, the resistor 50 enters the wedged shape and is joined to the injected thermoplastic resin 32a, and has a high bonding strength. can get. Further, since the thermoplastic resin 32a and the fiber reinforced resin plate 41 are joined together by the wedge-shaped resistor 50, when the thermoplastic resin 32a is injection-molded by the mold 46, it is at a high temperature immediately after it is taken out. It is possible to prevent the laminated plate 30 from expanding due to the injection pressure of the remaining thermoplastic resin 32a. That is, the laminate 30 can use the intermediate layer 42 having a high porosity for weight reduction, but the adhesive force between the fiber reinforced resin plates 40 and 41 is reduced in such an intermediate layer 42. There is a tendency. For this reason, for example, the adhesion between the intermediate layer 42 and the fiber reinforced resin plate 41 may be peeled off due to the injection pressure of the thermoplastic resin 32a remaining when the mold 46 is opened, and the laminate 30 may swell. . In this respect, when the resistor 50 is used, the thermoplastic resin 32a and the fiber reinforced resin plate 41 are firmly bonded to each other, so that such swelling of the laminated plate 30 can be suppressed.

  FIG. 11 is a cross-sectional view of the housing member 10 in a configuration using the resistor 52 according to the third modification, and FIG. 12 shows the fiber reinforced resin plate 41 on which the resistor 52 shown in FIG. 11 is formed. It is a top view. The above-described resistors 44, 48, and 50 are bent piece-like portions formed by cutting and bending a part of the fiber reinforced resin plate 41. However, like the resistor 52, a separate member from the fiber reinforced resin plate 41 is used. The configuration used may be used. The resistor 52 is formed by press-fitting a plate-like member made of metal or resin into an elongated slit 52a cut into a part of the fiber-reinforced resin plate 41, for example, and intervenes up to the intermediate layer 42. Instead of the slit 52a, a circular hole may be formed in the fiber reinforced resin plate 41, and a pile-shaped member may be press-fitted into the hole to form the resistor 52.

  FIG. 13 is a cross-sectional view of the housing member 10 having a configuration using the resistor 54 according to the fourth modification. The above-described resistors 44, 48, and 50 are bent piece-like portions formed by bending a part of the fiber reinforced resin plate 41 once. However, like the resistor 54, the resistors 44, 48, and 50 are bent twice or three times or more. You may use the formed bending piece. In the case of this configuration, for example, the distal end portion has a shape parallel to the fiber reinforced resin plate 41 and is pressed by the thermoplastic resin 32a, so that the bonding strength with the thermoplastic resin 32a is improved. As a result, the effect of suppressing the swelling of the laminated plate 30 can be obtained as in the case of the resistor 50. The resistor 54 may also be configured in a symmetric shape like the resistor 48 shown in FIG.

  It should be noted that the present invention is not limited to the above-described embodiment, and it is needless to say that the present invention can be freely changed without departing from the gist of the present invention.

  In the above embodiment, the configuration in which the resistors 44, 48, 50, 52, 54 are formed on the one fiber reinforced resin plate 41 side is illustrated, but the resistors 44, 48, 50, 52, 54 are the other fiber reinforced resin. It may be provided on the resin plate 40 or may be provided on both.

DESCRIPTION OF SYMBOLS 10 Case member 12 Case 12a Back cover 12b Front cover 14 Electronic device 16 Lid 20 Device body 30 Laminated board 30a Peripheral part 32 Frame part 32a Thermoplastic resin 32b Intrusion part 40, 41 Fiber reinforced resin board 42 Intermediate layer 44 , 48, 50, 52, 54 Resistor 44a, 48a, 50a Notch 52a Slit

Claims (13)

  1. An intermediate layer is disposed between a pair of fiber reinforced resin plates, and a laminated plate in which a thermoplastic resin is bonded to at least a part of the peripheral portion thereof,
    A laminate comprising a resistance element interposed between the pair of fiber reinforced resin plates and having resistance to penetration of the thermoplastic resin into the intermediate layer.
  2. The laminate according to claim 1, wherein
    The resistive element is a part of at least one fiber-reinforced resin sheet.
  3. In the laminate according to claim 2,
    A part of the fiber reinforced resin plate has a front end directed in a direction toward the peripheral portion.
  4. In the laminate according to claim 2,
    A part of the fiber reinforced resin plate has a front end portion facing a direction away from the peripheral edge portion.
  5. In the laminated board of any one of Claims 2-4,
    A part of said fiber reinforced resin board has a shape which becomes wide gradually toward the front-end | tip part, The laminated board characterized by the above-mentioned.
  6. In the laminated board of any one of Claims 1-5,
    A laminate comprising a plurality of the resistors arranged in parallel along the peripheral edge.
  7. The laminate according to claim 6, wherein
    The plurality of resistors include a first row of resistor groups in which the resistors are arranged in parallel along the peripheral portion at a predetermined interval, and the peripheral portion side with respect to the first row of resistor groups And a second row of resistor groups in which the resistors are arranged in parallel at positions corresponding to the gaps between the resistors of the first row of resistor groups. A laminated board characterized.
  8. In the laminated board of any one of Claims 1-7,
    The fiber reinforced resin plate includes a carbon fiber, and is a laminated plate.
  9. In the laminated board of any one of Claims 1-8,
    The said intermediate | middle layer is formed with the foaming material which has the space | gap part containing air, The laminated board characterized by the above-mentioned.
  10. A housing member in which an intermediate layer is disposed between a pair of fiber reinforced resin plates, and a thermoplastic resin member is joined to at least a part of the peripheral edge thereof,
    An intrusion part that is a part of the thermoplastic resin member disposed in a state of entering at least a part between the pair of fiber reinforced resin plates;
    A resistor disposed so as to face the direction in which the intrusion part enters between the fiber-reinforced resin plates;
    A housing member characterized by comprising:
  11.   An electronic apparatus comprising a casing using the casing member according to claim 10.
  12. A method for manufacturing a casing member in which a thermoplastic resin is injection-molded and joined to at least a part of a peripheral portion of a laminated board formed by arranging and pressing an intermediate layer between a pair of fiber reinforced resin boards. And
    The thermoplastic resin is injection-molded in a state in which a resistor serving as resistance to the thermoplastic resin entering the intermediate layer from between the pair of fiber reinforced resin plates is interposed in the intermediate layer. Manufacturing method of member for cases.
  13. In the manufacturing method of the member for cases according to claim 12,
    When the laminate is formed by disposing and pressing an intermediate layer between the pair of fiber reinforced resin plates, a bent piece is obtained by cutting and bending a part of at least one of the fiber reinforced resin plates to the intermediate layer side. A method for manufacturing a casing member, wherein the resistor is formed in a shape.
JP2016018993A 2016-02-03 2016-02-03 Laminate, member for housing, electronic equipment and method for manufacturing member for housing Pending JP2017136740A (en)

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Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2009034906A1 (en) * 2007-09-11 2009-03-19 Toray Industries, Inc. Composite shaped article and process for manufacturing the same
JP2013232052A (en) * 2012-04-27 2013-11-14 Lenovo Singapore Pte Ltd Casing material, manufacturing method of said casing material, electronic apparatus casing using said casing material, manufacturing method of said electronic apparatus casing, and electronic apparatus using said electronic apparatus casing
JP2014065274A (en) * 2012-09-27 2014-04-17 Lenovo Singapore Pte Ltd Material for housing and housing, and methods of making thereof
JP2015085613A (en) * 2013-10-31 2015-05-07 東レ株式会社 Integrally molded body and method for producing the same
JP2016136586A (en) * 2015-01-23 2016-07-28 レノボ・シンガポール・プライベート・リミテッド Material for housing, electronic apparatus and manufacturing method of material for housing

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2009034906A1 (en) * 2007-09-11 2009-03-19 Toray Industries, Inc. Composite shaped article and process for manufacturing the same
JP2013232052A (en) * 2012-04-27 2013-11-14 Lenovo Singapore Pte Ltd Casing material, manufacturing method of said casing material, electronic apparatus casing using said casing material, manufacturing method of said electronic apparatus casing, and electronic apparatus using said electronic apparatus casing
JP2014065274A (en) * 2012-09-27 2014-04-17 Lenovo Singapore Pte Ltd Material for housing and housing, and methods of making thereof
JP2015085613A (en) * 2013-10-31 2015-05-07 東レ株式会社 Integrally molded body and method for producing the same
JP2016136586A (en) * 2015-01-23 2016-07-28 レノボ・シンガポール・プライベート・リミテッド Material for housing, electronic apparatus and manufacturing method of material for housing

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