JP2017128020A - Memsデバイス、液体噴射ヘッド、液体噴射装置、および、memsデバイスの製造方法 - Google Patents
Memsデバイス、液体噴射ヘッド、液体噴射装置、および、memsデバイスの製造方法 Download PDFInfo
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- H—ELECTRICITY
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- H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
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- H10N30/204—Piezoelectric or electrostrictive devices with electrical input and mechanical output, e.g. functioning as actuators or vibrators using bending displacement, e.g. unimorph, bimorph or multimorph cantilever or membrane benders
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Abstract
Description
前記各第1電極端子と前記各第2電極端子とが1対1で電気的に接合されたMEMSデバイスであって、
前記第1基板と対向する前記第2基板の実装面における前記第1電極端子に対応する位置に凸部が形成され、
前記第2電極端子は、前記凸部と当該凸部を被覆した導電性材料とを有することを特徴とする。
前記第2基板の実装面に異方性エッチングにより前記凸部を形成する凸部形成工程を有することを特徴とする。
Claims (10)
- 複数の第1電極端子が設けられた第1基板と、前記各第1電極端子にそれぞれ対応する複数の第2電極端子が設けられた結晶性基板からなる第2基板と、を備え、
前記各第1電極端子と前記各第2電極端子とが1対1で電気的に接合されたMEMSデバイスであって、
前記第1基板と対向する前記第2基板の実装面における前記第1電極端子に対応する位置に凸部が形成され、
前記第2電極端子は、前記凸部と当該凸部を被覆した導電性材料とを有することを特徴とするMEMSデバイス。 - 前記第2電極端子の前記第1電極端子との接合面の端子並設方向における寸法が、前記第1電極端子の前記第2電極端子との接合面の端子並設方向における寸法よりも小さいことを特徴とする請求項1に記載のMEMSデバイス。
- 前記凸部および隣り合う凸部の間の凹部が、端子並設方向に交差する方向に延在していることを特徴とする請求項1または請求項2の何れかに記載のMEMSデバイス。
- 前記導電性材料と前記凸部との間にシリコン酸化膜が設けられていることを特徴とする請求項1から請求項3の何れか一項に記載のMEMSデバイス。
- 請求項1から請求項4の何れか一項に記載のMEMSデバイスの一形態であることを特徴とする液体噴射ヘッド。
- 請求項5に記載の液体噴射ヘッドを備えることを特徴とする液体噴射装置。
- 請求項1から請求項4の何れか一項に記載のMEMSデバイスを製造する製造方法であって、
前記第2基板の実装面に異方性エッチングにより前記凸部を形成する凸部形成工程を有することを特徴とするMEMSデバイスの製造方法。 - 前記凸部形成工程により形成された前記凸部を導電性材料で覆う導電層形成工程を含むことを特徴とする請求項7に記載のMEMSデバイスの製造方法。
- 端子並設方向において前記第2電極端子の接合面が対応する前記第1電極端子の接合面の範囲内に配置されるように、前記第1基板と前記第2基板とをアライメントするアライメント工程を含むことを特徴とする請求項7または請求項8に記載のMEMSデバイスの製造方法。
- 前記凸部形成工程の後に前記第2基板の実装面にシリコン酸化膜を形成する酸化膜形成工程を含む請求項7から請求項9の何れか一項に記載のMEMSデバイスの製造方法。
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JP2016008506A JP6769034B2 (ja) | 2016-01-20 | 2016-01-20 | Memsデバイス、液体噴射ヘッド、および液体噴射装置 |
US15/405,540 US10207503B2 (en) | 2016-01-20 | 2017-01-13 | MEMS device, liquid ejecting head, liquid ejecting apparatus, and MEMS device manufacturing method |
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Cited By (2)
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JP2019067933A (ja) * | 2017-09-29 | 2019-04-25 | ブラザー工業株式会社 | 複合基板 |
JP2020069770A (ja) * | 2018-11-02 | 2020-05-07 | キヤノン株式会社 | 液体吐出ヘッドとその製造方法 |
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JP6926647B2 (ja) * | 2017-05-09 | 2021-08-25 | セイコーエプソン株式会社 | 実装構造体、超音波デバイス、超音波探触子、超音波装置、及び電子機器 |
JP2020001201A (ja) * | 2018-06-26 | 2020-01-09 | セイコーエプソン株式会社 | 液体噴射ヘッド、液体噴射装置および配線基板 |
Citations (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH05129304A (ja) * | 1991-11-05 | 1993-05-25 | Seiko Epson Corp | 突起電極の構造及びその製造方法 |
KR100481900B1 (ko) * | 1999-12-10 | 2005-04-11 | 후지 샤신 필름 가부시기가이샤 | 잉크젯 헤드 및 인쇄 장치 |
JP2005260103A (ja) * | 2004-03-15 | 2005-09-22 | Sharp Corp | フレキシブルプリント回路基板と硬質基板との接続構造 |
JP2006253452A (ja) * | 2005-03-11 | 2006-09-21 | Canon Inc | 回路基板の樹脂接合構造 |
US20120167823A1 (en) * | 2010-12-29 | 2012-07-05 | Gardner Deane A | Electrode configurations for piezoelectric actuators |
JP2012199262A (ja) * | 2011-03-18 | 2012-10-18 | Seiko Epson Corp | 回路基板、接続構造体及び回路基板の接続方法 |
JP2014188782A (ja) * | 2013-03-27 | 2014-10-06 | Seiko Epson Corp | 液体噴射ヘッド及び液体噴射装置 |
Family Cites Families (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2001203229A (ja) | 2000-01-18 | 2001-07-27 | Seiko Epson Corp | 半導体装置及びその製造方法、回路基板並びに電子機器 |
JP4438374B2 (ja) | 2003-10-21 | 2010-03-24 | コニカミノルタホールディングス株式会社 | インクジェットヘッド組立体 |
JP4281608B2 (ja) | 2004-04-22 | 2009-06-17 | ブラザー工業株式会社 | 記録ヘッドの製造方法及び記録ヘッド |
JP2006251281A (ja) | 2005-03-10 | 2006-09-21 | Seiko Epson Corp | 電気光学装置およびその製造方法、ならびに画像形成装置および画像読み取り装置 |
JP4155289B2 (ja) * | 2005-08-08 | 2008-09-24 | エプソンイメージングデバイス株式会社 | 電気光学装置及び電子機器 |
JP4618368B2 (ja) | 2008-12-01 | 2011-01-26 | ブラザー工業株式会社 | 記録ヘッドの製造方法及び記録ヘッド |
JP2010260187A (ja) | 2009-04-30 | 2010-11-18 | Brother Ind Ltd | 配線ユニット、配線ユニットの製造方法、液体吐出ヘッド、および液体吐出ヘッドの製造方法 |
JP2011023510A (ja) | 2009-07-15 | 2011-02-03 | Sharp Corp | 基板の接続構造、及び表示装置 |
JP2013135116A (ja) | 2011-12-27 | 2013-07-08 | Seiko Epson Corp | 回路基板、及び接続構造体 |
-
2016
- 2016-01-20 JP JP2016008506A patent/JP6769034B2/ja active Active
-
2017
- 2017-01-13 US US15/405,540 patent/US10207503B2/en active Active
Patent Citations (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH05129304A (ja) * | 1991-11-05 | 1993-05-25 | Seiko Epson Corp | 突起電極の構造及びその製造方法 |
KR100481900B1 (ko) * | 1999-12-10 | 2005-04-11 | 후지 샤신 필름 가부시기가이샤 | 잉크젯 헤드 및 인쇄 장치 |
JP2005260103A (ja) * | 2004-03-15 | 2005-09-22 | Sharp Corp | フレキシブルプリント回路基板と硬質基板との接続構造 |
JP2006253452A (ja) * | 2005-03-11 | 2006-09-21 | Canon Inc | 回路基板の樹脂接合構造 |
US20120167823A1 (en) * | 2010-12-29 | 2012-07-05 | Gardner Deane A | Electrode configurations for piezoelectric actuators |
JP2012199262A (ja) * | 2011-03-18 | 2012-10-18 | Seiko Epson Corp | 回路基板、接続構造体及び回路基板の接続方法 |
JP2014188782A (ja) * | 2013-03-27 | 2014-10-06 | Seiko Epson Corp | 液体噴射ヘッド及び液体噴射装置 |
Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2019067933A (ja) * | 2017-09-29 | 2019-04-25 | ブラザー工業株式会社 | 複合基板 |
JP7056059B2 (ja) | 2017-09-29 | 2022-04-19 | ブラザー工業株式会社 | 複合基板 |
JP2020069770A (ja) * | 2018-11-02 | 2020-05-07 | キヤノン株式会社 | 液体吐出ヘッドとその製造方法 |
JP7237531B2 (ja) | 2018-11-02 | 2023-03-13 | キヤノン株式会社 | 液体吐出ヘッドとその製造方法 |
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