JP2017038061A - 保護膜形成フィルム、保護膜形成用シート、保護膜形成用複合シートおよび検査方法 - Google Patents
保護膜形成フィルム、保護膜形成用シート、保護膜形成用複合シートおよび検査方法 Download PDFInfo
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Abstract
Description
〔保護膜形成フィルム〕
本実施形態に係る保護膜形成フィルムは、ワークまたは当該ワークを加工して得られる加工物に保護膜を形成するためのものである。この保護膜は、保護膜形成フィルム、好ましくは硬化した保護膜形成フィルムから構成される。ワークとしては、例えば半導体ウエハ等が挙げられ、当該ワークを加工して得られる加工物としては、例えば半導体チップが挙げられるが、本発明はこれらに限定されるものではない。なお、ワークが半導体ウエハの場合、保護膜は、半導体ウエハの裏面側(バンプ等の電極が形成されていない側)に形成される。
本実施形態に係る保護膜形成フィルムは、波長1600nmの光線透過率が72%以上であり、波長550nmの光線透過率が20%以下であるものである。なお、本明細書における光線透過率は、積分球を使用せずに測定した値とし、測定器具としては分光光度計を使用する。
保護膜形成フィルムは、未硬化の硬化性接着剤からなることが好ましい。この場合、保護膜形成フィルムに半導体ウエハ等のワークを重ね合わせた後、保護膜形成フィルムを硬化させることにより、保護膜をワークに強固に接着することができ、耐久性を有する保護膜をチップ等に形成することができる。
図1は本発明の一実施形態に係る保護膜形成用シートの断面図である。図1に示すように、本実施形態に係る保護膜形成用シート2は、保護膜形成フィルム1と、保護膜形成フィルム1の一方の面(図1では下側の面)に積層された剥離シート21とを備えて構成される。ただし、剥離シート21は、保護膜形成用シート2の使用時に剥離されるものである。
図2は本発明の一実施形態に係る保護膜形成用複合シートの断面図である。図2に示すように、本実施形態に係る保護膜形成用複合シート3は、基材41の一方の面に粘着剤層42が積層されてなる粘着シート4と、粘着シート4の粘着剤層42側に積層された保護膜形成フィルム1と、保護膜形成フィルム1における粘着シート4とは反対側の周縁部に積層された治具用粘着剤層5とを備えて構成される。治具用粘着剤層5は、保護膜形成用複合シート3をリングフレーム等の治具に接着するための層である。
本実施形態に係る保護膜形成用複合シート3の粘着シート4は、基材41と、基材41の一方の面に積層された粘着剤層42とを備えて構成される。
粘着シート4の基材41は、ワークの加工、例えば半導体ウエハのダイシングおよびエキスパンディングに適するものであれば、その構成材料は特に限定されず、通常は樹脂系の材料を主材とするフィルム(以下「樹脂フィルム」という。)から構成される。
本実施形態に係る保護膜形成用複合シート3の粘着シート4が備える粘着剤層42は、非エネルギー線硬化性粘着剤から構成されてもよいし、エネルギー線硬化性粘着剤から構成されてもよい。非エネルギー線硬化性粘着剤としては、所望の粘着力および再剥離性を有するものが好ましく、例えば、アクリル系粘着剤、ゴム系粘着剤、シリコーン系粘着剤、ウレタン系粘着剤、ポリエステル系粘着剤、ポリビニルエーテル系粘着剤等を使用することができる。これらの中でも、保護膜形成フィルム1との密着性が高く、ダイシング工程等にてワークまたは加工物の脱落を効果的に抑制することのできるアクリル系粘着剤が好ましい。
保護膜形成用複合シート3は、好ましくは、保護膜形成フィルム1を含む第1の積層体と、粘着シート4を含む第2の積層体とを別々に作製した後、第1の積層体および第2の積層体を使用して、保護膜形成フィルム1と粘着シート4とを積層することにより製造することができるが、これに限定されるものではない。
本実施形態に係る保護膜形成用複合シート3を用いて、一例としてワークとしての半導体ウエハから保護膜付きチップを製造する方法を以下に説明する。
図3は本発明の他の実施形態に係る保護膜形成用複合シートの断面図である。図3に示すように、本実施形態に係る保護膜形成用複合シート3Aは、基材41の一方の面に粘着剤層42が積層されてなる粘着シート4と、粘着シート4の粘着剤層42側に積層された保護膜形成フィルム1とを備えて構成される。実施形態における保護膜形成フィルム1は、面方向にてワークとほぼ同じか、ワークよりも少し大きく形成されており、かつ粘着シート4よりも面方向に小さく形成されている。保護膜形成フィルム1が積層されていない部分の粘着剤層42は、リングフレーム等の治具に貼付することが可能となっている。
次の各成分を表1に示す配合比(固形分換算)で混合し、固形分濃度が61質量%となるようにメチルエチルケトンで希釈して、保護膜形成フィルム用塗布剤を調製した。
(A−1)バインダーポリマー:n−ブチルアクリレート10質量部、メチルアクリレート70質量部、グリシジルメタクリレート5質量部および2−ヒドロキシエチルアクリレート15質量部を共重合してなる(メタ)アクリル酸エステル共重合体(重量平均分子量:80万,ガラス転移温度:−1℃)
(A−2)バインダーポリマー:メチルアクリレート85質量部および2−ヒドロキシエチルアクリレート15質量部を共重合してなる(メタ)アクリル酸エステル共重合体(重量平均分子量:40万,ガラス転移温度:4℃)
(B−1)ビスフェノールA型エポキシ樹脂(三菱化学社製,jER828,エポキシ当量184〜194g/eq)
(B−2)ビスフェノールA型エポキシ樹脂(三菱化学社製,jER1055,エポキシ当量800〜900g/eq)
(B−3)ジシクロペンタジエン型エポキシ樹脂(大日本インキ化学工業社製,エピクロンHP−7200HH,エポキシ当量255〜260g/eq)
(C−1)熱活性潜在性エポキシ樹脂硬化剤:ジシアンジアミド(ADEKA社製,アデカハードナーEH−3636AS,活性水素量21g/eq)
(C−2)熱活性潜在性エポキシ樹脂硬化剤:ジシアンジアミド(三菱化学社製,DICY7,活性水素量21g/eq)
(D)硬化促進剤:2−フェニル−4,5−ジヒドロキシメチルイミダゾール(四国化成工業社製,キュアゾール2PHZ−PW)
(E−1)シリカフィラー(アドマテックス社製,SC2050MA,平均粒径0.5μm)
(E−2)シリカフィラー(アドマテックス社製,SC1050−MLQ,平均粒径0.3μm)
(F)シランカップリング剤(信越化学工業社製,KBM403)
(G)着色剤:カーボンブラック(三菱化学社製,#MA650,平均粒径28nm)
(H)有機系の着色剤:フタロシアニン系青色顔料(Pigment Blue 15:3を3倍の質量のスチレン−アクリル樹脂で固着したもの)とイソインドリノン系黄色顔料(Pigment Yellow 139を3倍の質量のスチレン−アクリル樹脂で固着したもの)およびジケトピロロピロール系赤色顔料(Pigment Red264を3倍の質量のスチレン−アクリル樹脂で固着したもの)を、38:18:44(青:黄:赤、質量比)で混合した顔料
保護膜形成フィルムを構成する各成分の種類および配合量を表1に示すように変更するとともに、保護膜形成フィルムの厚さを10μmとする以外、実施例1と同様にして保護膜形成用シートを製造した。
保護膜形成フィルムを構成する各成分の種類および配合量を表1に示すように変更する以外、実施例1と同様にして保護膜形成用シートを製造した。
実施例および比較例で得られた保護膜形成用シートから第2の剥離シートを剥離し、オーブン内において、大気雰囲気下、130℃で2時間加熱し、保護膜形成フィルムを熱硬化させて保護膜とした。その後、第1の剥離シートを剥離した。
実施例および比較例で得られた保護膜形成用シートから第2の剥離シートを剥離し、保護膜形成用フィルムを露出させた。#2000研磨したシリコンウエハ(直径200mm,厚さ350μm)の研磨面に、上記保護膜形成用フィルムを、テープマウンター(リンテック社製 Adwill RAD−3600 F/12)を用いて70℃に加熱しながら貼付し、次いで、第1の剥離シートを剥離した。その後、130℃で2時間加熱して保護膜形成用フィルムを硬化させて保護膜とし、保護膜付きシリコンウエハを得た。
試験例2で得られた保護膜付きシリコンウエハの保護膜面側に、ダイシングテープ(リンテック社製,Adwill D−175)を貼付した。そして、当該保護膜付きシリコンウエハを3mm×3mmのサイズにダイシングし、ピックアップして、保護膜付きシリコンチップを得た。得られた保護膜付きシリコンチップの保護膜側を赤外線顕微鏡(オリンパス社製,BX−IR)で観察し、保護膜を通してシリコンチップの研削跡およびチッピングが観察できるかどうかを確認し、以下の基準で赤外線検査適性を評価した。結果を表1に示す。
A:研削跡が明確に観察できた。また、チップ側面からの距離が2μm以上5μm未満の大きさのチッピング(欠け)も明確に観察できた。
B:研削跡が明確に観察できた。しかしながら、チップ側面からの距離が2μm以上5μm未満の大きさのチッピングについては明確に観察できなかった。
D:研削跡が観察できず、チッピングも大きさによらず観察できなかった。
2…保護膜形成用シート
21…剥離シート
3,3A…保護膜形成用複合シート
4…粘着シート
41…基材
42…粘着剤層
5…治具用粘着剤層
6…半導体ウエハ
7…リングフレーム
Claims (26)
- 波長1600nmの光線透過率が72%以上であり、
波長550nmの光線透過率が20%以下であり、
着色剤として有機系顔料を含有する
ことを特徴とする保護膜形成フィルム。 - 前記保護膜形成フィルムは、未硬化の硬化性接着剤から構成される単層であることを特徴とする請求項1に記載の保護膜形成フィルム。
- 前記硬化性接着剤は、平均粒径0.01〜3μmのフィラーを含有することを特徴とする請求項2に記載の保護膜形成フィルム。
- 前記保護膜形成フィルムの厚さは3〜15μmである、請求項1〜3のいずれか一項に記載の保護膜形成フィルム。
- 請求項1〜4のいずれか一項に記載の保護膜形成フィルムと、
前記保護膜形成フィルムの一方の面または両面に積層された剥離シートと
を備えたことを特徴とする保護膜形成用シート。 - 基材の一方の面側に粘着剤層が積層されてなる粘着シートと、
前記粘着シートの前記粘着剤層側に積層された保護膜形成フィルムと
を備えた保護膜形成用複合シートであって、
前記保護膜形成フィルムの波長1600nmの光線透過率は、72%以上であり、
前記保護膜形成フィルムの波長550nmの光線透過率は、20%以下であり、
前記保護膜形成フィルムは着色剤として有機系顔料を含有する
ことを特徴とする保護膜形成用複合シート。 - 前記保護膜形成フィルムは、未硬化の硬化性接着剤から構成される単層であることを特徴とする請求項6に記載の保護膜形成用複合シート。
- 前記硬化性接着剤は、平均粒径0.01〜3μmのフィラーを含有することを特徴とする請求項7に記載の保護膜形成用複合シート。
- 請求項1〜4のいずれか一項に記載の保護膜形成フィルム、請求項5に記載の保護膜形成用シートまたは請求項6〜8のいずれか一項に記載の保護膜形成用複合シートを使用してワークに保護膜を形成することにより、保護膜付きワークを製造し、
前記保護膜付きワークまたは前記保護膜付きワークを加工して得られた加工物について、赤外線を利用し、前記保護膜を介して検査を行う
ことを特徴とする検査方法。 - 前記ワークは半導体ウエハであり、前記加工物は半導体チップであることを特徴とする請求項9に記載の検査方法。
- 請求項9又は10に記載の検査方法に基づいて、良品と判断された保護膜付きワーク。
- 請求項9又は10に記載の検査方法に基づいて、良品と判断された加工物。
- 波長1600nmの光線透過率が72%以上であり、
波長550nmの光線透過率が20%以下であり、
未硬化の硬化性接着剤からなり、
前記硬化性接着剤の硬化性成分として、常態で液状のエポキシ樹脂と、常温で固体のエポキシ樹脂とを含むことを特徴とする保護膜形成フィルム。 - 前記常態で液状のエポキシ樹脂の分子量が330〜400であり、前記常温で固体のエポキシ樹脂の分子量が400〜2500である請求項13に記載の保護膜形成フィルム。
- 前記保護膜形成フィルムは、未硬化の硬化性接着剤から構成される単層であることを特徴とする請求項13又は14に記載の保護膜形成フィルム。
- 前記硬化性接着剤は、着色剤および平均粒径0.01〜3μmのフィラーを含有することを特徴とする請求項15に記載の保護膜形成フィルム。
- 前記保護膜形成フィルムの厚さは3〜15μmである、請求項13〜16のいずれか一項に記載の保護膜形成フィルム。
- 請求項13〜17のいずれか一項に記載の保護膜形成フィルムと、
前記保護膜形成フィルムの一方の面または両面に積層された剥離シートと
を備えたことを特徴とする保護膜形成用シート。 - 基材の一方の面側に粘着剤層が積層されてなる粘着シートと、
前記粘着シートの前記粘着剤層側に積層された保護膜形成フィルムと
を備えた保護膜形成用複合シートであって、
前記保護膜形成フィルムの波長1600nmの光線透過率は、72%以上であり、
前記保護膜形成フィルムの波長550nmの光線透過率は、20%以下であり、
前記保護膜形成フィルムは未硬化の硬化性接着剤からなり、
前記硬化性接着剤の硬化性成分として、常態で液状のエポキシ樹脂と、常温で固体のエポキシ樹脂とを含むことを特徴とする保護膜形成用複合シート。 - 前記常態で液状のエポキシ樹脂の分子量が330〜400であり、前記常温で固体のエポキシ樹脂の分子量が400〜2500である請求項19に記載の保護膜形成用複合シート。
- 前記保護膜形成フィルムは、未硬化の硬化性接着剤から構成される単層であることを特徴とする請求項19又は20に記載の保護膜形成用複合シート。
- 前記硬化性接着剤は、着色剤および平均粒径0.01〜3μmのフィラーを含有することを特徴とする請求項21に記載の保護膜形成用複合シート。
- 請求項13〜17のいずれか一項に記載の保護膜形成フィルム、請求項18に記載の保護膜形成用シートまたは請求項19〜22のいずれか一項に記載の保護膜形成用複合シートを使用してワークに保護膜を形成することにより、保護膜付きワークを製造し、
前記保護膜付きワークまたは前記保護膜付きワークを加工して得られた加工物について、赤外線を利用し、前記保護膜を介して検査を行う
ことを特徴とする検査方法。 - 前記ワークは半導体ウエハであり、前記加工物は半導体チップであることを特徴とする請求項23に記載の検査方法。
- 請求項23又は24に記載の検査方法に基づいて、良品と判断された保護膜付きワーク。
- 請求項23又は24に記載の検査方法に基づいて、良品と判断された加工物。
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JP6097871B2 (ja) | 2017-03-15 |
US10559505B2 (en) | 2020-02-11 |
TW201535629A (zh) | 2015-09-16 |
WO2015111632A1 (ja) | 2015-07-30 |
TWI664688B (zh) | 2019-07-01 |
PH12016501423B1 (en) | 2016-08-31 |
JPWO2015111632A1 (ja) | 2017-03-23 |
JP2019080066A (ja) | 2019-05-23 |
CN112563181A (zh) | 2021-03-26 |
JP2017106028A (ja) | 2017-06-15 |
TWI631674B (zh) | 2018-08-01 |
PH12016501423A1 (en) | 2016-08-31 |
KR102324338B1 (ko) | 2021-11-09 |
KR20210134829A (ko) | 2021-11-10 |
JP6453773B2 (ja) | 2019-01-16 |
TW201838055A (zh) | 2018-10-16 |
KR20160111928A (ko) | 2016-09-27 |
KR102427944B1 (ko) | 2022-08-01 |
JP6399665B2 (ja) | 2018-10-03 |
CN106415819A (zh) | 2017-02-15 |
US20170005016A1 (en) | 2017-01-05 |
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