JP2017028322A - Nanoimprinting template - Google Patents

Abstract

PROBLEM TO BE SOLVED: To suppress occurrence of defects in a pattern area to be transferred.SOLUTION: The nanoimprint template of the present invention comprises a base material, concavo-convex pattern to be transferred located on a first side of the substrate, and a depressed portion positioned on a second side opposite to the first side of the base material. The nanoimprint template comprises a first region defined by the recessed portion, a second region which is present around the first region and in which the thickness of the base material is larger than any part of the first region, and a pattern area that is a part of the first area and includes the concavo-convex pattern. The maximum deflection portion which is the most deflected portion of the first region is located outside the pattern region and the first region has a portion where the thickness of the base material is different.SELECTED DRAWING: Figure 2

Description

  The present invention relates to a template for nanoimprint and a method for producing a structure using the same.

  Attention has been focused on nanoimprint technology as a microfabrication technology. Nanoimprint technology uses a template for nanoimprinting (hereinafter sometimes simply referred to as a template), which is a mold member with a fine concavo-convex pattern formed on the surface of a substrate, and transfers the concavo-convex pattern to the workpiece to form a fine structure. Is a pattern formation technique for transferring the same size.

  In Patent Document 1, in order to improve the production yield and production efficiency of the nanoimprint process, a hollow portion is formed in the central portion of the substrate, and the central portion is thinned with respect to the peripheral portion. Templates have been proposed. In this template, the central portion is curved so as to be brought into contact with the material to be transferred from the center of the pattern region, and the pattern region of the template and the material to be transferred can be brought into contact while expelling gas toward the peripheral portion. Then, after the pattern region and the material to be transferred are brought into contact with each other, the material to be transferred is cured, and the template is released from the material to be transferred to pattern the material to be transferred. Normally, the center portion of this template is curved even when it is released from the mold. The pattern area is arranged so as to include the most curved position of the template.

Special table 2009-536591

  Problems with the above-described conventional template will be described with reference to FIG. FIG. 18 shows a mold release step for separating the conventional template from the cured transfer material. Generally, tensile stress tends to concentrate on the template and / or the material to be transferred at the release start position and end position. Therefore, there is an increased possibility that the template and / or the material to be transferred located at the stress concentration location will be damaged or deformed. When the conventional template 1000 is to be released from the structure 2100 formed on the transfer base material 2000, the region thinned by the depression is bent. Then, the mold release gradually proceeds from the periphery of the template 1000, and the end position of the mold release is the position G where the template 1000 is most bent. However, in the template 1000, since the position G ′ that bends most is present in the pattern area, there is a possibility that a defect is generated in the pattern area that is not desired to be originally generated.

  The present invention has been made in view of the above circumstances, and it is a main object of the present invention to provide a nanoimprint template that can suppress the occurrence of defects in a pattern region to be transferred, and a structure manufacturing method using the same. And

  A template for nanoimprinting according to an embodiment of the present invention includes a base material, a concavo-convex pattern to be transferred located on the first side of the base material, and a second facing the first side of the base material. A template for nanoimprinting having a depression portion located on the side, the first region defined by the depression portion, and existing around the first region, and any location of the first region And a pattern region that is a part of the first region and includes the concavo-convex pattern, and is the most flexible of the first region. The maximum deflection part which is a part to be removed is outside the pattern area, and the first area has a part having a different thickness of the base material.

As another aspect, the first region may be configured such that the thickness of the base material gradually increases from the first fixed end toward the second fixed end opposite to the first fixed end. Good.

  As another aspect, the pattern region may be arranged near the first fixed end.

  As another aspect, the first region has a shape in which at least one side is configured by a straight line, and a portion of the first region is more easily separated from the one side configured by the straight line. Or you may have a shape which becomes small in the whole area | region. Such a first region can be a geometric shape selected from either a triangle or a trapezoid. Furthermore, the pattern area may have a linear concavo-convex pattern extending in a direction orthogonal to one side formed by straight lines of the first area.

  The structure manufacturing method according to an embodiment of the present invention includes a step of preparing the nanoimprint template, a step of preparing a transfer substrate, a step of supplying a material to be transferred to the transfer substrate, Arranging the nanoimprint template and the transfer base material to face each other, bending the first region of the nanoimprint template so as to be convex toward the first side, and the nanoimprint template A step of bringing the nanoimprint template and the material to be transferred into contact with each other by reducing a distance between the first substrate and the transfer substrate; and contacting the nanoimprint template with the material to be transferred, and then the first of the nanoimprint template. The step of flattening the region, the step of curing the material to be transferred, and the first region Pulling the nanoimprint template away from the material to be transferred in a direction perpendicular to one side of the first region, while being curved so as to be convex toward the first side; It is characterized by having.

  According to the present invention, it is possible to suppress the occurrence of defects in the pattern area to be transferred.

It is a top view of the template which concerns on one Embodiment of this invention. It is sectional drawing of the template which concerns on one Embodiment of this invention. It is sectional drawing of the template which concerns on one Embodiment of this invention. It is sectional drawing of the template which concerns on one Embodiment of this invention. It is a top view of the template which concerns on one Embodiment of this invention. It is a top view of the template which concerns on one Embodiment of this invention. It is a top view of the template which concerns on one Embodiment of this invention. It is a top view of the template which concerns on one Embodiment of this invention. It is a schematic diagram explaining a mode of propagation of a contact boundary line between a template and a material to be transferred generated by mold release. It is a schematic diagram explaining the relationship between a peeling direction and an uneven | corrugated pattern. It is a schematic diagram explaining the manufacturing method of the structure using the template which concerns on one Embodiment of this invention. It is a top view of the template which concerns on one Embodiment of this invention. It is sectional drawing of the template which concerns on one Embodiment of this invention. It is a schematic diagram explaining an example of an alignment mark. It is a schematic diagram explaining the manufacturing method of the structure using the template which concerns on one Embodiment of this invention. It is a schematic diagram explaining the positional relationship between the alignment mark on the template side and the alignment mark on the transfer substrate side. It is a flowchart figure explaining the manufacturing method of the structure using the template which concerns on one Embodiment of this invention. It is a schematic diagram explaining the problem of a prior art.

The present invention will be described below with reference to the drawings. However, the present invention can be implemented in many different modes and should not be construed as being limited to the description of the embodiments described below. Note that in the drawings referred to in this embodiment, the same portions or portions having similar functions are denoted by the same reference numerals, and repeated description thereof may be omitted. Also, it should be noted that for convenience of explanation, the scale is changed as compared with the actual explanation.
(First embodiment)
A nanoimprint template according to the first embodiment of the present invention will be described with reference to FIGS. FIG. 1 is a plan view of a template according to an embodiment of the present invention. As shown in FIG. 1, the template 100 includes a first region 110, a second region 120 existing around the first region 110, and a pattern that is included in and is a part of the first region 110. Region 130. The first region 110 is a flexible region having an arbitrary shape and having a base material formed thinner than the second region 120. On the other hand, the second region 120 is a fixed region in which the base material is formed thicker than the first region 110. The most bent portion of the first region 110 is shown as the maximum bent portion G. The maximum bending portion G is located outside the pattern region 130. As shown in the figure, only one pattern area may exist in the first area, and the pattern area is not limited to this, and a plurality of pattern areas may exist. Although the outer shape of the template 100 is shown as a rectangle, the shape is not limited to this and may be an arbitrary shape such as a circle.

  FIG. 2 is a cross-sectional view of a template according to an embodiment of the present invention, and is a cross-sectional view taken along line II in FIG. FIG. 2A is an example of a template. The template 100 includes a base material 101, a desired concavo-convex pattern 131 located on the first side 1a of the base material 101, and a recess portion located on the second side 1b facing the first side 1a of the base material 101. 111. The thickness of the base material in the first region 110 is smaller than that in the second region 120 due to the recess 111. The first region 110 is defined by the planar view shape of the bottom surface portion of the hollow portion 111, and the thickness of the base material is substantially constant. In addition, that the thickness of the base material is substantially constant means that 100 × (maximum thickness−minimum thickness) / (maximum thickness) is within 10 (%). The pattern region 130 is a partial region of the first region 110 and includes the uneven pattern 131. The concavo-convex pattern 131 may be composed of only the main pattern, or may be composed of a mixture of the main pattern and the dummy pattern. However, the concavo-convex pattern 131 should be transferred for the purpose of transferring the shape to the object at an equal magnification. It is a pattern. It is assumed that the concave / convex pattern 131 does not include an auxiliary pattern regardless of whether the shape is transferred to the object at the same magnification or not. That is, it means that an auxiliary pattern or the like may exist in the maximum deflection portion G or in the vicinity thereof. Examples of the auxiliary pattern include an alignment mark for alignment at the time of transfer, a pattern that accommodates an excess material to be transferred, and a maze-like pattern that slows the propagation of the material to be transferred.

  The material of the base material 101 is, for example, glass such as quartz, soda lime glass, borosilicate glass, a semiconductor such as silicon, gallium arsenide, gallium nitride, a metal substrate, or a composite material substrate made of any combination of these materials. It may be. When the template is used for the optical imprint method, the substrate is made of a light-transmitting material, and typically quartz can be used. The depression 111 can be formed by performing processing such as polishing, grinding, and etching on the base material from the second side. The thickness of the base material in the first region 110 is particularly as long as the first region can be curved so as to be convex toward the first side by being pressurized with a fluid or the like from the second side as will be described later. There is no restriction | limiting, For example, it can set suitably in the range of 300 micrometers-2 mm. The thickness of the base material in the second region 120 is not particularly limited as long as it is larger than the thickness of the base material in the first region 110, and can be appropriately set within a range of 500 μm to 10 mm, for example.

  FIG. 2B is an example of a template, and the form of the base material 101 is different from that in FIG. The base material 101 has a base portion 101a and a convex structure portion 101b protruding from the first side 1a of the base portion 101a, and is a so-called mesa structure. The concave / convex pattern 131 is located on the convex structure portion 101b. FIG. 2B illustrates an example in which the level difference due to the convex structure portion 101b is one level, but the number of levels may be plural. Further, although the convex structure portion 1b is illustrated so as to substantially overlap the first region 110, the convex structure portion 1b may be smaller or larger than the first region 110.

  FIG. 3 is a cross-sectional view of a template according to an embodiment of the present invention, and the form of the substrate 101 is different from that of FIG. The opening of the dent 111 expands toward the second side 1b. In this case, the first region 110 is a region defined by the planar view shape of the bottom surface portion of the recess 111.

  Here, the maximum bending part G is a site | part specified by measuring flatness using flatness measuring apparatus FlatMaster-Mask300 (made by Corning Tropel). Depending on the form of the first region 110, the maximum deflection portion G can be a dot, a line, or a plane. In addition, when the thickness of the base material of the first region 110 is substantially constant, the center of gravity of the figure defined by the outline of the first region 110 is obtained by calculation, and the center of gravity is calculated as the maximum bending portion G. It may be defined. In addition, it is preferable that the space | interval of the uneven | corrugated pattern which is contained in the pattern area | region 130 and is closest to the largest bending part G, and the largest bending part G is 5 mm or more. The maximum deflection part G in the present invention is a part corresponding to one of a part specified by measurement or a part specified by calculation.

  FIG. 4 is a cross-sectional view of a template according to an embodiment of the present invention. The thickness of the base material in the first region is not limited to being substantially constant in the plane of the base material 101 as described above, and may have a portion where the thickness of the base material is different. By changing the thickness of the base material in the first region, the position of the maximum bending portion G can be controlled independently of the element of the shape of the first region. Thereby, the freedom degree of arrangement | positioning of the pattern area | region 130 in the base material 101 can be improved.

  A portion where the first region and the second region are connected can be regarded as a fixed end formed by connecting the first region that is relatively displaced with respect to the second region. Then, as shown in FIG. 4A, the first region is formed on the base 101a of the base material from the first fixed end 112a toward the second fixed end 112b opposite to the first fixed end 112a. The thickness gradually increases. In this case, the maximum bending portion G is located closer to the first fixed end 112a having a small thickness and a high flexibility. If the pattern region 130 is arranged so as to exclude the maximum bending portion G, there is no limitation on the arrangement of the pattern region. When the arrangement position of the pattern area can be selected, the pattern area can be arranged close to the first fixed end 112a side or the second fixed end 112b side. In this case, it is preferable that the pattern region 130 be on the first fixed end 112a side, so that the pattern region is easily deformed, and the uneven material is filled with the material to be transferred or the material to be transferred cured from the uneven pattern. Can be easily pulled out. The thickness of the base portion 101a of the base material in the first region may be changed stepwise.

  As shown in FIG. 4B, in the first region, the thickness of the base portion 101a of the base material gradually decreases from the first fixed end 112a and the second fixed end 112b toward the center. In other words, the recess 111 has a so-called mortar shape. By changing the position where the thickness of the base portion 101a of the base material in the first region becomes the smallest, the position of the maximum bending portion G can be controlled. The thickness of the base portion 101a of the base material in the first region may be changed stepwise.

  As shown in FIG. 4C, in the first region, the thickness of the base portion 101a of the base material gradually increases from the first fixed end 112a and the second fixed end 112b toward the center. In other words, the depression 111 has a so-called top (top) shape. By changing the position where the thickness of the base portion 101a of the base material in the first region becomes the largest, the position of the maximum bending portion G can be controlled. The thickness of the base portion 101a of the base material in the first region may change stepwise. The thickness of the base portion 101a of the base material in the first region may be changed stepwise.

  5 to 8 are plan views of the template according to the embodiment of the present invention. The first region 110 may take any shape, but may be a geometric shape selected from a group of circles, ellipses, rectangles, trapezoids, rhombuses, triangles as shown in FIGS. Good. By changing the shape of the first region, the position of the maximum bending portion G can be controlled independently of the thickness of the base material in the first region. Thereby, the freedom degree of arrangement | positioning of the pattern area | region 130 in the base material 101 can be improved. In the following description, it is assumed that the thickness of the base material in the first region is substantially constant. However, the present invention is not limited to this, and the thickness of the base material may be changed.

  FIG. 5 is a plan view of a template according to an embodiment of the present invention, in which the first region 110 is circular. When the first region 110 is circular, the maximum deflection portion G corresponds to the center of the circle. The maximum deflection portion G exists outside the pattern region 130. The pattern region 130 may be arranged in an island shape in the first region (see FIG. 5A), or may be arranged in an annular shape so as to exclude the maximum bending portion G (see FIG. 5B). ). FIG. 6 is a plan view of a template according to an embodiment of the present invention, in which the first region 110 is oval. When the first region 110 is elliptical, the maximum deflection portion G corresponds to the center of the ellipse. The maximum deflection portion G exists outside the pattern region 130.

  When the mold release is started uniformly from the outer periphery, if the first region 110 is circular or elliptical, the contact boundary line between the template and the transfer material is a concentric circle centered on the maximum deflection position G or It occurs in an elliptical shape, and the mold release proceeds toward the maximum deflection position G. Since the contact boundary line between the template and the material to be transferred generated by mold release propagates in a concentric circle or ellipse that does not include corners, a dot-shaped uneven pattern such as a circle or rectangle exists in the pattern area. In this case, it is possible to suppress the occurrence of steep stress in the uneven pattern.

  FIG. 7 is a plan view of a template according to an embodiment of the present invention, in which the first region 110 is rectangular. When the first region 110 is rectangular, the maximum deflection portion G corresponds to the intersection (center of gravity) of the diagonal lines of the rectangle. The maximum deflection portion G exists outside the pattern region 130.

  FIG. 8 is a plan view of a template according to an embodiment of the present invention. In FIG. 8A, the first region 110 is trapezoidal. The maximum deflection portion G corresponds to the center of gravity of the trapezoid. In FIG. 8B, the first region 110 has a triangular shape. The maximum deflection portion G corresponds to the center of gravity of the triangle. In FIG. 8C, the first region 110 has a rhombus shape. The maximum deflection portion G corresponds to the center of gravity of the rhombus. In the above example, the maximum deflection portion G exists outside the pattern region 130.

  A trapezoid having a long side on the first fixed end side 112a, a triangle in which one apex angle of the first region 110 faces the second fixed end 112b side, or a pair of apex angles of the first fixed end 112a and It can be said that the rhombus located on the second fixed end side 112b side is a figure in which the ease of bending of the first region gradually changes when mold release is started from the first fixed end 112a side. According to such a figure, since the ease of bending of the first region gradually changes, it is possible to suppress the occurrence of steep stress.

  In particular, the first region has a shape in which at least one side is constituted by a straight line so that a contact boundary line between the template and the material to be transferred is linear when release from one side is started, and It is particularly preferable that the region 1 has a shape such that the ease of bending of the region 1 becomes smaller in a partial region or the entire region as the distance from one side formed by the straight line increases. For example, the embodiment shown in FIGS. 8A and 8B is a particularly preferable example in the above case.

  FIG. 9 schematically shows a state of propagation of a contact boundary line between a template and a material to be transferred, which is generated by mold release, in the embodiment shown in FIGS. 8 (A) and 8 (B). The dotted line in the figure represents the position of the contact boundary line at certain intervals in a contour line manner. The direction orthogonal to the contact boundary line can be regarded as being parallel to the peeling direction. When mold release is performed in one direction from one side (first fixed end side) toward the opposite side or opposite vertex (second fixed end) so as to be orthogonal to the side, it is substantially parallel to the side where mold release starts. Then, a contact boundary line is generated, and then the contact boundary line proceeds toward the maximum bending portion G. When the contour line of the pattern area is substantially parallel to the contact boundary line, the contact between the contact boundary line and the pattern area is not a point contact but a line contact, which causes a large tensile stress on the uneven pattern that begins to peel off. Is suppressed, and mold release can be performed stably.

FIG. 10 schematically shows a preferable arrangement of the uneven pattern with respect to the peeling direction. When the uneven pattern of the pattern region 130 includes a linear pattern, it is preferable that the direction in which the linear pattern extends and the peeling direction substantially coincide. By making the peeling direction and the direction in which the linear pattern extends substantially coincide with each other, the linear pattern and the material to be transferred are smoothly separated from each other, so that defects generated at the time of mold release can be reduced. Note that “the direction in which the linear pattern extends and the peeling direction substantially coincide with each other” means that the angle formed by both directions is within 5 °.
(Second Embodiment)
A method of manufacturing a structure according to the second embodiment of the present invention using the template 100 will be described with reference to FIG. FIG. 11 is a schematic diagram illustrating a method for manufacturing a structure using a template according to an embodiment of the present invention. Below, the case where it applies to pattern formation by the optical imprint method is demonstrated. Not limited to this, it can be applied to a known imprint method such as heat.
(1) Template and transfer substrate preparation step (1-a) Template preparation step A light-transmissive template 100 is prepared. For example, the template 100 is prepared by preparing a base material made of quartz and having a hollow portion, and forming a convex structure portion on the first side of the base material by wet etching or the like to produce a mesa structure. A resist is formed thereon, the resist is patterned by lithography using an electron beam or light, or lithography using a master template to form a mask pattern, and the substrate can be etched through the mask pattern.
(1-b) Substrate Preparation Step The transfer substrate 500 is prepared. The material of the transfer substrate may be substantially the same as the material that can be used for the template. The transfer substrate 500 may have a structure formed in advance. The thickness of the transfer substrate can be set in consideration of the shape of the concavo-convex pattern, material strength, handleability, and the like. Further, the outer shape of the transfer substrate 500 may be the same as or different from that of the template 100. When transferring the concave / convex pattern of the template to the transfer substrate by the step-and-repeat method, the transfer substrate 500 is usually larger than the template 100.
2. Transfer process (2-a) Transfer material supply process (see FIG. 11A)
The transfer material M is supplied to the transfer substrate 500. The transfer material M is a photocurable resin. As a method for supplying the transfer material, for example, a spin coating method, a spray method, an ink jet method, or the like can be used, and an ink jet method is more preferably used. One or more droplets of the material to be transferred M are formed on the transfer substrate 500 by an inkjet method.
(2-b) Template contact process (see FIG. 11B)
The template 100 and the transfer substrate 500 are made to face each other, and a fluid is introduced from the second side of the template 100 into the recess, so that the first region is curved so as to be convex toward the first side. The template 100 whose first region is curved is brought into contact with the material to be transferred M.
(2-c) Transfer material forming process (see FIG. 11C)
The introduction of the fluid into the recess is stopped, and the curved state of the first region is solved and flattened. With the material to be transferred having fluidity, the template 100 and the transfer substrate 500 are aligned as necessary. If necessary, magnification is corrected by applying stress from the side of the template with an actuator or the like. Then, in a state where the transfer material M is interposed between the transfer substrate 500 and the template 100, the transfer material M is cured by irradiating ultraviolet rays. As a result, the transfer material M is formed.
(2-d) Mold release process (refer to FIG. 11D)
After the transfer material M is cured, the mold 100 is released from the transfer material M. Thereby, the structure 510 can be formed on the transfer substrate 500. Since the first region is formed in a thin shape and has flexibility, when the template 100 is pulled up, the mold release proceeds from the outer peripheral portion, and finally the maximum bending portion G is separated from the structure 510. When the template 100 is used, since the maximum deflection portion G is outside the pattern region, it is possible to suppress the occurrence of defects that occur in the pattern region to be transferred. Based on the structure 510, a replica template, a semiconductor device, a magnetic recording medium, or the like can be manufactured.

The mold release is performed in one direction from the first fixed end side to the second fixed end side in accordance with conditions such as the shape of the first region and the thickness distribution of the base material in the first region. May be. For example, release can proceed in one direction by controlling a plurality of actuators attached to a template or a chuck of a transfer substrate.
(Third embodiment)
A nanoimprint template according to a third embodiment of the present invention will be described with reference to FIGS. FIG. 12 is a plan view of a template according to an embodiment of the present invention. As illustrated in FIG. 12, the template 200 includes a first region 110, a second region 120 existing around the first region 110, a pattern region 130 that is a part of the first region, and a pattern And an alignment mark region 140 disposed outside the region 130. The pattern region 130 may be arranged in an island shape so as to exclude the maximum deflection portion G and the alignment mark region 140, or may be arranged in an annular shape. The alignment mark region 140 overlaps with the maximum deflection portion G or exists in the vicinity thereof. In addition, that the alignment mark area | region 140 exists in the vicinity of the largest bending part G means that the space | interval of the alignment mark nearest to the largest bending part G and the largest bending part G is less than 1 mm.

  13 is a cross-sectional view of a template according to an embodiment of the present invention, and is a cross-sectional view taken along the line II-II of FIG. As shown in FIG. 13, the template 200 includes a base material 101, a desired concavo-convex pattern 131 positioned on the first side 1 a of the base material 101, an alignment mark 141 disposed adjacent to the concavo-convex pattern 131, and a base And a recess 111 located on the second side 1b opposite the first side 1a of the material 101.

  Examples of the alignment mark 141 include those having one or more graphic structures such as an annular shape, a rectangular shape, and a cross shape, and those having a periodic structure such as a diffraction grating. For example, the alignment mark 141 may be configured such that the dimension, depth, and the like are set larger than the concave / convex pattern 131 and the filling speed of the material to be transferred is slower than the concave / convex pattern 131. Thus, even if the uneven pattern 131 is filled with the material to be transferred, the alignment mark 141 is not completely filled with the material to be transferred, so that the mark can be visually recognized. Moreover, since the surface of the alignment mark 141 is formed so that the height position is aligned with the surface of the uneven pattern 131, the alignment accuracy can be improved.

The alignment mark is generally arranged at the peripheral portion of the template. However, in the template according to the embodiment of the present invention, the alignment mark is arranged at the maximum deflection portion G and its vicinity. When the first region 100 of the template 200 is curved, the maximum deflection portion G and the vicinity thereof have a large amount of displacement toward the first side, but the amount of displacement in the surface direction is small compared to other parts, and the position shift It can be said that it is a site where it is difficult to generate. By utilizing this property, it can be estimated that a considerable amount of positional deviation has occurred in other parts if the amount of positional deviation in a part where the amount of positional deviation is small is equal to or greater than a predetermined allowable value. In this way, by using the alignment mark on the template side and the alignment mark on the transfer substrate side, manufacturing management at the time of mold release can be performed. Details will be described later.
(Fourth embodiment)
A method for manufacturing a structure according to the fourth embodiment of the present invention using the template 200 will be described with reference to FIGS. Below, the case where it applies to pattern formation by the optical imprint method is demonstrated. Not limited to this, it can be applied to a known imprint method such as heat.
(1) Template and transfer substrate preparation step (1-a) Template preparation step In S11, a light-transmissive template 200 is prepared. For example, the template 200 is prepared by preparing a base material made of quartz in which a hollow portion is formed, and forming a mesa structure by forming a convex structure portion on the first side of the base material by wet etching or the like. A resist is formed thereon, the resist is patterned by lithography using an electron beam or light, or lithography using a master template to form a mask pattern, and the substrate can be etched through the mask pattern. The alignment mark 141 on the template 200 side can be produced by etching in the same process as the uneven pattern or in another process. As shown in FIG. 14A, the alignment mark 141 on the template 200 side is, for example, an annular pattern.
(1-b) Substrate Preparation Step In S11, the transfer substrate 500 is prepared. The material of the transfer substrate may be substantially the same as the material that can be used for the template. The alignment mark 541 on the transfer substrate 500 side can be produced by etching the transfer substrate. As shown in FIG. 14B, the alignment mark 541 on the transfer substrate 500 side is, for example, a rectangular pattern that fits within the alignment mark 141. Further, the outer shape of the transfer substrate 500 may be the same as or different from the template 200. When transferring the concave / convex pattern of the template to the transfer base material by the step-and-repeat method, the transfer base material 500 is usually larger than the template 200.
2. Transfer Step (2-a) Transferred Material Supply Step In step S12, the transfer target material M is supplied to the transfer substrate 500. The transfer material M is a photocurable resin. As a method for supplying the transfer material, for example, a spin coating method, a spray method, an ink jet method, or the like can be used, and an ink jet method is more preferably used. One or more droplets of the material to be transferred M are formed on the transfer substrate 500 by an inkjet method.
(2-b) Template contact process (see FIG. 15A)
In S13, the template 200 and the transfer substrate 500 are opposed to each other, and a fluid is introduced from the second side of the template 200 into the recess, so that the first region is curved so as to be convex toward the first side. The template 200 in which the first region is curved is brought into contact with the material to be transferred M.
(2-c) Positioning process (see FIG. 15B)
The introduction of the fluid into the recess is stopped, the curved state of the first region is solved and flattened, and the template 200 and the transfer substrate 500 are aligned. In S14, the template-side alignment mark 141 and the transfer substrate-side alignment mark 541 are imaged by the imaging unit 600 such as a camera, and information on the positional relationship between the two patterns is acquired.

In S15, the amount of positional deviation between the alignment mark 141 and the alignment mark 541 is measured. As shown in FIG. 16A, when the alignment mark 541 is within the alignment mark 141 and the centers of both patterns are substantially coincident, it can be determined that the alignment between the template 200 and the transfer substrate 500 has been performed satisfactorily. . On the other hand, as shown in FIG. 16B, when it is confirmed that the center C1 of the alignment mark 141 and the center C2 of the alignment mark 541 are misaligned, the alignment between the template 200 and the transfer substrate 500 is performed. Can be judged as not being performed well. In this case, the template 200 is moved relative to the transfer substrate 500 in the surface direction and adjusted so as to be in the state shown in FIG.
(2-c) Transfer material forming process (see FIG. 15C)
In step S <b> 16, after the alignment is completed, the transfer material M is cured by irradiation with ultraviolet rays in a state where the transfer material M is interposed between the transfer substrate 500 and the template 100. As a result, the transfer material M is formed.

After the ultraviolet irradiation, the imaging unit 600 may be disposed again at a position where the alignment marks 141 and 241 can be visually recognized, and information regarding the positional relationship between the two patterns may be acquired. If the alignment state before curing is maintained after curing of the material to be transferred, the relationship shown in FIG. 16A is satisfied even after curing. However, if the alignment state before curing is not maintained after the material to be transferred is cured, the relationship shown in FIG. When the amount of positional deviation between the center C1 of the alignment mark 141 and the center C2 of the alignment mark 541 is larger than a predetermined allowable value, the structure 510 may be determined as a defective product at this point.
(2-d) Mold release process (see FIG. 15D)
After the material to be transferred M is cured, in S <b> 17, the mold 200 is separated from the material to be transferred M while visually confirming the alignment marks 141 and 241 with the imaging unit 600. When the mold is unintentionally twisted or rubbed in one or both of the template and the transfer substrate, the structure 510 may be deformed or damaged in some cases. The alignment marks 141 and 241 overlap with the maximum bending portion G or are arranged in the vicinity thereof. The displacement of the first region in the maximum bending portion G is limited to the vertical direction with respect to the transfer base material 500 and hardly occurs in the horizontal direction with respect to the transfer base material 500. When this is used, the alignment marks 141 and 241 are visually recognized while the mold release is in progress, so that whether or not the template and the transfer substrate are twisted or slid unintentionally is determined based on the misalignment of both patterns. Judgment can be made.

  The amount of positional deviation obtained by the imaging unit 600 is compared with a predetermined allowable value in S18. The predetermined allowable value is set in advance according to the presence / absence of a defect and the degree thereof theoretically or experimentally in relation to the amount of displacement of the alignment marks 141 and 241 and the defect. By comparing the displacement amount with a predetermined allowable value, the state of the structure 510 when a certain displacement amount occurs can be inferred. In S <b> 19-1, when the amount of positional deviation between the center C <b> 1 of the alignment mark 141 and the center C <b> 2 of the alignment mark 541 is equal to or less than a predetermined allowable value, it is determined as a non-defective product. On the contrary, if it is larger than the predetermined allowable value, the structure 510 is determined as a defective product in S19-2.

  Thereby, the structure 510 can be formed on the transfer substrate 500. Since the first region is formed in a thin shape and has flexibility, when the template 200 is pulled up, the mold release proceeds from the outer peripheral portion, and finally the maximum bending portion G is separated from the structure 510. When the template 200 is used, since the maximum bending portion G is outside the pattern region, it is possible to avoid stress concentration in the pattern region. Thereby, it can suppress that a defect generate | occur | produces in the pattern area | region which should be transcribe | transferred. Based on the structure 510, a replica template, a semiconductor device, a magnetic recording medium, or the like can be manufactured.

  In addition, according to conditions, such as the shape of a 1st area | region and the thickness distribution of the base material of a 1st area | region, a mold release may be performed from the perimeter of an outer periphery toward an inner side, or 1st. It may be performed in one direction from the fixed end side to the second fixed end side. For example, release can proceed in one direction by controlling a plurality of actuators attached to a template or a chuck of a transfer substrate.

DESCRIPTION OF SYMBOLS 100,200 ... Template, 101 ... Base material, 101a ... Base part, 101b ... Convex structure part, 110 ... 1st area | region, 111 ... Recessed part, 112a ... 1st fixed end, 112b ... 2nd fixed end, 120 ... Second region, 130 ... pattern region, 131 ... uneven pattern, 140 ... alignment mark region, 141 ... alignment mark, 500 ... transfer substrate, 510 ... structure, 541 ... alignment mark, 600 ... imaging unit, 1000 ... conventional Template, 2000 ... transfer substrate, 2100 ... structure

Claims (7)

Nanoimprint template comprising: a base material; a concavo-convex pattern to be transferred located on the first side of the base material; and a recess portion located on a second side facing the first side of the base material. Because
A first region defined by the recess,
A second region present around the first region and having a thickness of the base material greater than any portion of the first region;
A pattern region that is a part of the first region and includes the concave-convex pattern,
The maximum bending portion that is the most bent portion of the first region is outside the pattern region,
The template for nanoimprinting, wherein the first region has a portion where the thickness of the substrate is different.   2. The nanoimprint template according to claim 1, wherein the thickness of the base material gradually increases from the first fixed end toward the second fixed end opposite to the first fixed end. .   The nanoimprint template according to claim 2, wherein the pattern region is disposed closer to the first fixed end.   The first region has a shape in which at least one side is configured by a straight line, and the ease of bending of the first region decreases in a part of the region or the entire region as the distance from the one side configured by the straight line increases. The template for nanoimprinting according to claim 1, which has a shape as follows.   The nanoimprint template according to claim 4, wherein the first region has a geometric shape selected from any one of a triangle and a trapezoid.   6. The nanoimprint template according to claim 4, wherein the pattern region has a linear concavo-convex pattern extending in a direction orthogonal to one side constituted by straight lines of the first region. Preparing the nanoimprint template according to any one of claims 4 to 6, and
Preparing a transfer substrate;
Supplying a transfer material to the transfer substrate;
Arranging the nanoimprint template and the transfer substrate to face each other;
Curving the first region of the nanoimprint template to be convex toward the first side;
Reducing the distance between the nanoimprint template and the transfer substrate and bringing the nanoimprint template into contact with the material to be transferred;
Flattening the first region of the nanoimprint template after contacting the nanoimprint template and the material to be transferred;
Curing the material to be transferred;
For the nanoimprint from the material to be transferred toward the direction perpendicular to one side of the first region, the first region being curved so as to be convex toward the first side. And a step of separating the template.

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