JP2016225489A - Wafer processing method - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a wafer processing method capable of obtaining a wafer level chip size package with good quality.SOLUTION: A cutting groove 210 having a depth corresponding to the finished thickness of a device is formed along a planned dividing line from the front side of a wafer 2 by a cutting blade having a first thickness, a mold resin 40 is laid on the surface of the wafer and buried in a cut groove, a protective member is attached to the surface of a mold resin, the backside of the wafer is ground to expose the cut grooves, a half-cut groove 401 is formed by cutting the mold resin buried in the cut groove from the back surface side of the wafer at a depth of approximately half by a cutting blade 323 having a second thickness thinner than the first thickness, after attaching the support member to the back side of the wafer, the protective member affixed to the surface is peeled off, and an area of a mold resin buried in a cutting groove is cut from the front side of the wafer by a cutting blade having the second thickness, and the mold resin is completely cut and divided into individual devices.SELECTED DRAWING: Figure 11

Description

  In the present invention, a wafer in which a plurality of division lines are formed in a lattice shape on the surface and a device is formed in a plurality of regions partitioned by the plurality of division lines is divided into individual lines along the division lines. The present invention relates to a wafer processing method in which a device is divided and each device is coated with a resin.

  In the semiconductor device manufacturing process, a plurality of regions are partitioned by division lines arranged in a lattice pattern on the surface of a substantially disc-shaped semiconductor wafer, and devices such as ICs and LSIs are formed in the partitioned regions. . By cutting the semiconductor wafer formed in this way along the planned dividing line, the region where the device is formed is divided to manufacture individual devices.

  In recent years, a packaging technique for dividing a wafer into individual devices and coating the individual devices with a resin has been developed. A package technology called a wafer level chip size package (WLCSP), which is one of the package technologies, is disclosed in Patent Document 1 below.

  The packaging technology disclosed in Patent Document 1 below covers a resin on the back surface of a wafer, forms a cutting groove that reaches the resin along a planned dividing line from the surface of the wafer, and lays a mold resin on the surface of the wafer. After coating each device and embedding the mold resin in the cutting groove, the mold resin filled in the cutting groove is cut by a cutting blade having a thickness smaller than the width of the cutting groove, thereby obtaining individual wafer level chip size packages (WLCSP). ).

In addition, the following technology has been developed as a wafer processing method for manufacturing a wafer level chip size package (WLCSP).
(1) A cutting groove having a depth corresponding to the finished thickness of the device is formed along the planned dividing line from the surface side of the wafer.
(2) The mold resin is laid on the surface of the wafer and the mold resin is embedded in the cutting groove.
(3) A protective member is attached to the surface of the mold resin laid on the surface of the wafer, and the back surface of the wafer is ground to expose the cutting grooves.
(4) By sticking the backside of the wafer to the dicing tape and cutting the mold resin embedded in the cutting groove with a cutting blade having a thickness smaller than the width of the cutting groove, each wafer level chip size package (WLCSP) To divide.

JP 2006-1000053 A

  However, in any of the above-described processing methods, when the mold resin embedded in the cutting groove is cut by the cutting blade, the cutting blade of the cutting blade bends due to the resistance of the mold resin, thereby forming a wafer level chip size package (WLCSP). There is a problem of scratching the sides of the device.

  The present invention has been made in view of the above-mentioned facts, and a main technical problem thereof is to provide a wafer processing method capable of obtaining a wafer level chip size package (WLCSP) with good quality.

In order to solve the main technical problem, according to the present invention, a plurality of division lines are formed in a lattice pattern on the surface, and bumps are provided on the surface in a plurality of regions partitioned by the plurality of division lines. A method of processing a wafer on which a device is formed,
A cutting groove forming step of forming a cutting groove having a depth corresponding to the finished thickness of the device along the line to be divided from the front surface side of the wafer by a cutting blade having a first thickness;
A molding step of laying a mold resin on the surface of the wafer subjected to the cutting groove forming step and embedding the mold resin in the cutting groove;
A protective member attaching step of attaching a protective member to the surface of the mold resin laid on the surface of the wafer on which the molding step has been carried out;
A back surface grinding step of grinding the back surface of the wafer on which the protective member attaching step has been performed to expose the cutting groove and exposing the mold resin embedded in the cutting groove to the back surface of the wafer;
Half-cut groove formation in which a half-cut groove is formed by cutting the mold resin embedded in the cut groove from the back surface side of the wafer at a substantially half depth by a cutting blade having a second thickness that is thinner than the first thickness. Process,
A support member attaching step of attaching a support member to the back surface of the wafer on which the half-cut groove forming step has been carried out and peeling off a protective member attached to the surface of the mold resin laid on the surface of the wafer;
A region corresponding to the mold resin embedded in the cutting groove is cut from the surface side of the wafer by a cutting blade having a second thickness smaller than the first thickness, and the remaining mold resin embedded in the cutting groove is removed. A dividing step of completely cutting and dividing into individual devices,
A method for processing a wafer is provided.

  The wafer processing method according to the present invention includes a cutting groove forming step in which a cutting groove having a depth corresponding to the finished thickness of the device is formed from the front surface side of the wafer along a predetermined division line by a cutting blade having a first thickness. A molding process for laying a mold resin on the surface of the wafer on which the cutting groove forming process has been performed and a mold resin for burying the mold resin in the cutting groove; and a mold resin laid on the surface of the wafer on which the molding process has been performed A protective member adhering step for adhering the protective member to the surface, and grinding the back surface of the wafer on which the protective member adhering step has been performed to expose the cutting groove, and the mold resin embedded in the cutting groove is used as the wafer. A back grinding process exposed on the back surface of the wafer and a cutting blade having a second thickness smaller than the first thickness into the cutting groove from the back surface side of the wafer. A half-cut groove forming step of cutting the provided mold resin at a half depth to form a half-cut groove, and a support member is attached to the back surface of the wafer on which the half-cut groove forming step has been performed. The support member adhering step for peeling off the protective member adhering to the surface of the mold resin laid on the surface of the wafer and the cutting blade having a second thickness smaller than the first thickness from the surface side of the wafer A half-cut groove including a dividing step of cutting a region corresponding to the mold resin embedded in the groove and completely cutting the remaining mold resin embedded in the cut groove to divide into individual devices. The depth at which the mold resin embedded in the cutting groove in the forming process and the dividing process is cut by the cutting blade is approximately half the thickness of the mold resin. Compared to cutting the mold resin completely at once, the resistance of the mold resin acting on the cutting blade is halved, the cutting blade of the cutting blade is not bent, and the cutting blade of the cutting blade is bent. This eliminates the problem of scratching the sides of the device.

The perspective view of the semiconductor wafer as a wafer divided | segmented by the processing method of the wafer by this invention. The principal part perspective view of the cutting device for implementing the cutting groove formation process in the processing method of the wafer by this invention. Explanatory drawing of the cutting groove formation process in the processing method of the wafer by this invention. Explanatory drawing of the molding process in the processing method of the wafer by this invention. Explanatory drawing which shows the bump exposure process in the processing method of the wafer by this invention. Explanatory drawing of the protection member sticking process in the processing method of the wafer by this invention. Explanatory drawing of the back surface grinding process in the processing method of the wafer by this invention. The principal part perspective view of the cutting device for enforcing the half cut groove | channel formation process in the processing method of the wafer by this invention. Explanatory drawing of the half cut groove | channel formation process in the processing method of the wafer by this invention. Explanatory drawing of the support member sticking process in the processing method of the wafer by this invention. Explanatory drawing of the division | segmentation process in the processing method of the wafer by this invention. The perspective view of the device divided | segmented separately by the processing method of the wafer by this invention.

  DESCRIPTION OF EMBODIMENTS Hereinafter, preferred embodiments of a wafer processing method according to the present invention will be described in detail with reference to the accompanying drawings.

  FIG. 1 shows a perspective view of a semiconductor wafer as a wafer to be processed according to the present invention. The semiconductor wafer 2 shown in FIG. 1 is made of a silicon wafer having a thickness of, for example, 600 μm, and a plurality of division lines 21 are formed in a lattice shape on the surface 2a and are partitioned by the plurality of division lines 21. In addition, devices 22 such as IC and LSI are formed in a plurality of regions. Each device 22 has the same configuration. A plurality of bumps 23 that are protruding electrodes are formed on the surface of the device 22. Hereinafter, a method of processing a wafer in which the semiconductor wafer 2 is divided into individual devices 22 along the division line 21 and each device is coated with a resin will be described.

  First, a cutting groove forming step is performed in which a cutting groove having a depth corresponding to the finished thickness of the device is formed along the division line 21 from the surface side of the semiconductor wafer 2 by the cutting blade having the first thickness. This cutting groove forming step is performed using the cutting device 3 shown in FIG. 2 in the illustrated embodiment. A cutting apparatus 3 shown in FIG. 2 includes a chuck table 31 that holds a workpiece, a cutting means 32 that cuts the workpiece held on the chuck table 31, and a workpiece held on the chuck table 31. An image pickup means 33 for picking up images is provided. The chuck table 31 is configured to suck and hold a workpiece. The chuck table 31 is moved in a cutting feed direction indicated by an arrow X in FIG. 2 by a cutting feed means (not shown) and is indicated by an arrow Y by an index feed means (not shown). It can be moved in the index feed direction shown.

  The cutting means 32 includes a spindle housing 321 arranged substantially horizontally, a rotating spindle 322 rotatably supported by the spindle housing 321, and an annular cutting blade 323 a mounted on the tip of the rotating spindle 322. The rotary spindle 322 is rotated in the direction indicated by the arrow 322a by a servo motor (not shown) disposed in the spindle housing 321. The annular cutting edge 323a of the cutting blade 323 is set to a first thickness of 50 μm in the illustrated embodiment. The imaging means 33 is composed of optical means such as a microscope and a CCD camera, and sends the captured image signal to a control means (not shown).

  In order to perform the cutting groove forming process using the cutting device 3 described above, the back surface 2b side of the semiconductor wafer 2 is placed on the chuck table 31 as shown in FIG. The semiconductor wafer 2 is sucked and held on the chuck table 31. Therefore, the surface 2a of the semiconductor wafer 2 held on the chuck table 31 is on the upper side. In this way, the chuck table 31 that sucks and holds the semiconductor wafer 2 is positioned directly below the imaging means 33 by a cutting feed means (not shown).

  When the chuck table 31 is positioned immediately below the image pickup means 33, an alignment operation for detecting a cutting region in which a division groove is to be formed along the division line 21 of the semiconductor wafer 2 is executed by the image pickup means 33 and a control means (not shown). . That is, the imaging unit 33 and a control unit (not shown) execute image processing such as pattern matching for aligning the planned dividing line 21 formed in a predetermined direction of the semiconductor wafer 2 with the cutting blade 323, Align the cutting area (alignment process). In addition, the alignment of the cutting region is similarly performed on the division line 21 that is formed in the semiconductor wafer 2 and extends in a direction orthogonal to the predetermined direction.

  If the alignment for detecting the cutting area of the semiconductor wafer 2 held on the chuck table 31 is performed as described above, the chuck table 31 holding the semiconductor wafer 2 is moved to the cutting start position in the cutting area. To do. At this time, as shown in FIG. 3A, in the semiconductor wafer 2, one end of the division line 21 (the left end in FIG. 3A) is on the right side by a predetermined amount from directly below the annular cutting edge 323b of the cutting blade 323. Positioned to be located. Next, the cutting blade 323 is cut and sent downward from the standby position indicated by a two-dot chain line in FIG. 3A as indicated by an arrow Z1, and a predetermined cut and sent as indicated by a solid line in FIG. 3A. Position to position. As shown in FIGS. 3A and 3C, the cutting feed position is such that the lower end of the annular cutting edge 323b of the cutting blade 323 is a depth corresponding to the finished thickness of the device from the surface of the semiconductor wafer 2. It is set to the position (for example, 200 μm).

  Next, the cutting blade 323 is rotated at a predetermined rotational speed in the direction indicated by the arrow 322a in FIG. 3A, and the chuck table 31 is rotated at the predetermined cutting feed speed in the direction indicated by the arrow X1 in FIG. Move with. Then, the movement of the chuck table 31 is stopped when the other end of the division line 21 (the right end in FIG. 3B) reaches a position that is a predetermined amount to the left of the cutting blade 323 directly below the annular cutting edge 323a. To do. By cutting and feeding the chuck table 31 in this way, as shown in FIG. 3D, the semiconductor wafer 2 has a depth corresponding to the finished thickness of the device from the surface along the scheduled division line 21 (for example, 200 μm) and a cutting groove 210 having a width of 50 μm is formed (cutting groove forming step).

  Next, the cutting blade 323 is raised as shown by an arrow Z2 in FIG. 3B and positioned at a standby position shown by a two-dot chain line, and the chuck table 31 is moved in the direction shown by an arrow X2 in FIG. Move to return to the position shown in FIG. Then, the chuck table 31 is indexed and fed in the direction perpendicular to the paper surface (index feed direction) by an amount corresponding to the interval between the scheduled division lines 21, and the next scheduled division line 21 to be cut is placed at a position corresponding to the cutting blade 323. Position. Thus, if the division | segmentation scheduled line 21 which should be cut next is located in the position corresponding to the cutting blade 323, the cutting groove formation process mentioned above will be implemented. Then, the above-described cutting groove forming step is performed on all the division lines 21 formed on the semiconductor wafer 2.

  If the above-described cutting groove forming process is performed, a molding process is performed in which the mold resin is laid on the surface of the semiconductor wafer 2 and the molding resin is embedded in the cutting groove 210. In this molding process, as shown in FIG. 4A, the back surface 2b side of the semiconductor wafer 2 on which the above-mentioned cutting groove forming process has been performed is placed on the holding surface which is the upper surface of the holding table 41 of the resin coating apparatus 4. To do. Then, the semiconductor wafer 2 is sucked and held on the holding surface of the holding table 41 by operating a suction means (not shown). Therefore, the surface 2a of the semiconductor wafer 2 held on the holding table 41 is on the upper side. If the semiconductor wafer 2 is held on the holding table 41 in this way, the ejection port 421 of the resin supply nozzle 42 is placed on the holding table 41 as shown in FIG. Positioned at the center, a resin supply means (not shown) is operated to drop a predetermined amount of the mold resin 40 from the jet port 421 of the resin supply nozzle 42 onto the central region of the semiconductor wafer 2 held on the holding table 41. If a predetermined amount of mold resin 40 is dropped onto the central region of the surface 2a of the semiconductor wafer 2, the holding table 41 is rotated in the direction indicated by the arrow 41a at a predetermined rotation speed for a predetermined time as shown in FIG. As a result, the mold resin 40 is laid on the surface 2a of the semiconductor wafer 2 and the mold resin 40 is embedded in the cutting groove 210 as shown in FIGS. In the illustrated embodiment, the mold resin 40 is a thermosetting liquid resin (epoxy resin), and is laid on the surface 2 a of the semiconductor wafer 2 and embedded in the cutting groove 210. It can be cured by heating at about 150 ° C.

  Next, the mold resin 40 laid on the surface 2 a of the semiconductor wafer 2 is polished, and a bump exposure process is performed to expose the bumps 23 formed on the surface of the device 22. This bump exposure process is performed using a polishing apparatus 5 shown in FIG. A polishing apparatus 5 shown in FIG. 5A includes a chuck table 51 that holds a workpiece, and a polishing means 52 that polishes the workpiece held on the chuck table 51. The chuck table 51 is configured to suck and hold the workpiece on the upper surface, and is rotated in a direction indicated by an arrow 51a in FIG. 5A by a rotation driving mechanism (not shown). The polishing means 52 includes a spindle housing 521, a rotating spindle 522 that is rotatably supported by the spindle housing 521 and rotated by a rotation driving mechanism (not shown), a mounter 523 mounted on the lower end of the rotating spindle 522, and the mounter And a polishing tool 524 attached to the lower surface of 523. The polishing tool 524 includes a circular base 525 and a polishing pad 526 attached to the lower surface of the base 525, and the base 525 is attached to the lower surface of the mounter 523 with fastening bolts 527. . In the illustrated embodiment, the polishing pad 526 is mixed with abrasive grains made of silica as an abrasive in the felt.

In order to perform the bump exposing process using the polishing apparatus 5 described above, the back surface of the semiconductor wafer 2 on which the molding process is performed on the upper surface (holding surface) of the chuck table 51 as shown in FIG. Place the 2b side. Then, the semiconductor wafer 2 is sucked and held on the chuck table 51 by operating a suction means (not shown) (wafer holding step). Accordingly, in the semiconductor wafer 2 held on the chuck table 51, the mold resin 40 laid on the surface 2a is on the upper side. When the semiconductor wafer 2 is sucked and held on the chuck table 51 in this way, the polishing tool of the polishing means 52 is rotated while rotating the chuck table 51 in the direction indicated by the arrow 51a in FIG. The mold 524 is rotated at a predetermined rotational speed in the direction indicated by the arrow 524a in FIG. 5A, and the polishing pad 526 is laid on the surface 2a that is the work surface as shown in FIG. 5B. The polishing tool 524 is brought into contact with the upper surface of the resin 40 and moved downward (perpendicular to the holding surface of the chuck table 51) at a predetermined polishing feed rate as indicated by an arrow 524b in FIGS. 5 (a) and 5 (b). Direction). As a result, as shown in FIG. 5C, the mold resin 40 laid on the surface 2a is polished, and the bumps 23 formed on the surface of the device 22 are exposed.
If the molding resin 40 is laid on the surface 2a of the semiconductor wafer 2 without covering the bumps 23 in the molding process, the bump exposure process described above is not necessarily required.

  If the bump exposure process mentioned above is implemented, the protection member sticking process which sticks a protection member on the surface of the mold resin 40 laid by the surface of the semiconductor wafer 2 will be implemented. That is, as shown in FIG. 6, the protective tape 6 as a protective member is attached to the surface of the mold resin 40 laid on the surface 2a of the semiconductor wafer 2. In the illustrated embodiment, the protective tape 6 has an acrylic resin-based paste applied to the surface of a sheet-like base material made of polyvinyl chloride (PVC) having a thickness of 100 μm to a thickness of about 5 μm.

  Next, a back surface grinding step is performed in which the back surface of the semiconductor wafer 2 on which the protective member attaching step has been performed is ground to expose the cutting groove 210 and the mold resin embedded in the cutting groove 210 is exposed on the back surface of the semiconductor wafer 2. carry out. This back grinding process is performed using a grinding apparatus 7 shown in FIG. A grinding apparatus 7 shown in FIG. 7A includes a chuck table 71 that holds a workpiece and a grinding unit 72 that grinds the workpiece held on the chuck table 71. The chuck table 71 is configured to suck and hold a workpiece on the upper surface, which is a holding surface, and is rotated in a direction indicated by an arrow 71a in FIG. The grinding means 72 includes a spindle housing 721, a rotating spindle 722 that is rotatably supported by the spindle housing 721 and rotated by a rotation driving mechanism (not shown), a mounter 723 attached to the lower end of the rotating spindle 722, and the mounter And a grinding wheel 724 attached to the lower surface of 723. The grinding wheel 724 includes an annular base 725 and a grinding wheel 726 that is annularly attached to the lower surface of the base 725, and the base 725 is attached to the lower surface of the mounter 723 with fastening bolts 727. ing.

  In order to perform the back surface grinding process using the grinding apparatus 7 described above, as shown in FIG. 7A, a semiconductor wafer in which the protective member attaching process is performed on the upper surface (holding surface) of the chuck table 71. 2 of the protective tape 6 is placed. Then, the semiconductor wafer 2 is sucked and held on the chuck table 71 via the protective tape 6 by operating a suction means (not shown). Therefore, the back surface 2b of the semiconductor wafer 2 held on the chuck table 71 is on the upper side. If the semiconductor wafer 2 is sucked and held on the chuck table 71 via the protective tape 6 in this way, the grinding means is rotated while rotating the chuck table 71 in the direction indicated by the arrow 71a in FIG. 72, the grinding wheel 724 is rotated in the direction indicated by the arrow 724a in FIG. 7A at, for example, 6000 rpm, and the grinding wheel 726 is processed on the back surface of the semiconductor wafer 2 which is the work surface as shown in FIG. 7B. 2b, and the grinding wheel 724 is moved downward (perpendicular to the holding surface of the chuck table 71) at a grinding feed rate of 1 μm / second, for example, as indicated by an arrow 724b in FIGS. 7 (a) and 7 (b). Direction). As a result, the back surface 2b of the semiconductor wafer 2 is ground, and as shown in FIG. 7C, the cutting groove 210 is exposed to the back surface 2b of the semiconductor wafer 2, and the mold resin 40 embedded in the cutting groove 210 is transferred to the semiconductor wafer. 2 is exposed on the back surface 2b of the substrate.

  If the back grinding process described above is performed, the mold resin 40 embedded in the cutting groove 210 from the back side of the semiconductor wafer 2 by the cutting blade having a second thickness smaller than the first thickness is approximately half the depth. A half-cut groove forming step of forming a half-cut groove by cutting is performed. This half-cut groove forming step is performed using a cutting device 30 shown in FIG. 8 in the illustrated embodiment. The cutting device 30 shown in FIG. 8 has the same configuration except for the cutting device 3 and the annular cutting edge 323a of the cutting blade 323 shown in FIG. Omitted. The annular cutting edge 323b of the cutting blade 323 in the cutting apparatus 30 shown in FIG. 8 is set to 20 μm, which is a second thickness that is thinner than the first thickness (50 μm) of the annular cutting edge 323a.

  In order to perform the half-cut groove forming process using the cutting device 30 shown in FIG. 8, the protective tape 6 side of the semiconductor wafer 2 on which the back grinding process has been performed is placed on the chuck table 31. The semiconductor wafer 2 is sucked and held on the chuck table 31 via the protective tape 6 by operating a suction means (not shown). Therefore, the back surface 2b of the semiconductor wafer 2 held on the chuck table 31 is on the upper side. In this way, the chuck table 31 that sucks and holds the semiconductor wafer 2 is positioned directly below the imaging means 33 by a cutting feed means (not shown).

  When the chuck table 31 is positioned directly below the image pickup means 33, the mold resin 40 embedded in the cutting groove 210 formed in the semiconductor wafer 2 is cut by the image pickup means 33 and a control means (not shown) to form a half cut groove. An alignment operation for detecting a cutting area to be performed is executed. That is, the imaging unit 33 and a control unit (not shown) execute image processing for aligning the cutting groove 210 formed in a predetermined direction of the semiconductor wafer 2 and the cutting blade 323, and align the cutting region. Perform (alignment process). Further, the alignment of the cutting region is similarly performed on the cutting groove 210 formed in the direction orthogonal to the predetermined direction formed in the semiconductor wafer 2.

  If the alignment for detecting the cutting area of the semiconductor wafer 2 held on the chuck table 31 is performed as described above, the chuck table 31 holding the semiconductor wafer 2 is moved to the cutting start position in the cutting area. To do. At this time, as shown in FIG. 9A, in the semiconductor wafer 2, one end of the cutting groove 210 in which the mold resin 40 to be cut is embedded (the left end in FIG. 9A) is an annular cut of the cutting blade 323. It is positioned so as to be located a predetermined amount on the right side from directly below the blade 323b.

  When the semiconductor wafer 2 held on the chuck table 31 of the cutting device 3 is positioned at the cutting start position in the cutting region in this way, the cutting blade 323 is indicated by a two-dot chain line in FIG. It cuts and feeds downward from the standby position as indicated by an arrow Z1, and is positioned at a predetermined cutting and feeding position as shown by a solid line in FIG. As shown in FIGS. 9A and 9C, the cutting feed position is set such that the lower end of the annular cutting edge 323 b of the cutting blade 323 is an intermediate position in the thickness direction of the semiconductor wafer 2.

  Next, the cutting blade 323 is rotated at a predetermined rotational speed in the direction indicated by an arrow 322a in FIG. 9A, and the chuck table 31 is rotated at a predetermined cutting feed speed in the direction indicated by an arrow X1 in FIG. 9A. Move with. When the other end (the right end in FIG. 9B) of the cutting groove 210 in which the mold resin 40 is embedded reaches a position located to the left by a predetermined amount from directly below the annular cutting edge 323b of the cutting blade 323, the chuck The movement of the table 31 is stopped. By cutting and feeding the chuck table 31 in this way, as shown in FIG. 9D, the mold resin 40 embedded in the cutting groove 210 is cut at a substantially half depth and a half cut groove 401 having a width of 20 μm. Is formed (half-cut groove forming step). In this half-cut groove forming step, cutting is performed at a depth that is approximately half the thickness of the mold resin 40 embedded in the cutting groove 210, so that it acts on the cutting blade 323 compared to the case of completely cutting the mold resin 40. The resistance of the mold resin 40 to be cut is halved, the annular cutting edge 323b of the cutting blade 323 is not bent, and the problem of scratching the side surface of the device due to the bending of the annular cutting edge 323b is solved. .

  Next, the cutting blade 323 is raised as shown by the arrow Z2 in FIG. 9B and positioned at the standby position shown by the two-dot chain line, and the chuck table 31 is moved in the direction shown by the arrow X2 in FIG. 9B. It moves and returns to the position shown in FIG. Then, the chuck table 31 is indexed and fed in the direction perpendicular to the paper surface (index feed direction) by an amount corresponding to the interval between the cutting grooves 210 in which the mold resin 40 is embedded (interval between the division lines 21), and then cut. The mold resin 40 embedded in the power cutting groove 210 is positioned at a position corresponding to the cutting blade 323. In this way, when the mold resin 40 embedded in the cutting groove 210 to be cut next is positioned at a position corresponding to the cutting blade 323, the above-described half-cut groove forming step is performed. Then, the above-described half cut groove forming step is performed on the mold resin 40 embedded in all the cutting grooves 210 formed in the semiconductor wafer 2.

  If the above-described half-cut groove forming step is performed, a support member is attached to the back surface of the semiconductor wafer 2 and the protective member is attached to the surface of the mold resin 40 laid on the surface of the semiconductor wafer 2. The support member sticking process which peels the protective tape 6 is implemented. That is, as shown in FIG. 10, a semiconductor wafer in which the above-described half-cut groove forming step is performed on the surface of a dicing tape T as a support member having an outer peripheral portion mounted so as to cover the inner opening of the annular frame F. 2 back surface 2b is stuck. Then, the protective tape 6 attached to the surface of the mold resin 40 laid on the surface of the semiconductor wafer 2 is peeled off. Accordingly, in the semiconductor wafer 2 adhered to the surface of the dicing tape T, the mold resin 40 laid on the surface is on the upper side.

  Next, an area corresponding to the mold resin 40 embedded in the cutting groove 210 is cut from the surface side of the semiconductor wafer 2 by a cutting blade having a second thickness smaller than the first thickness and embedded in the cutting groove 210. Then, a dividing process is performed in which the remaining mold resin 40 is completely cut and divided into individual devices. This dividing step is performed using the cutting device 30 shown in FIG.

  In order to perform the dividing process using the cutting device 30 shown in FIG. 8, the dicing tape T side as a support member having the semiconductor wafer 2 on which the support member application process has been applied on the chuck table 31 is attached. Place. Then, by operating a suction means (not shown), the semiconductor wafer 2 is sucked and held on the chuck table 31 via the dicing tape T (wafer holding step). Therefore, the semiconductor wafer 2 held on the chuck table 31 has the mold resin 40 laid on the surface on the upper side as shown in FIG. In FIG. 11A, the annular frame F on which the dicing tape T is mounted is omitted, but the annular frame F is held by an appropriate frame holding means disposed on the chuck table 31. The In this way, the chuck table 31 that sucks and holds the semiconductor wafer 2 is positioned directly below the imaging means 33 by a cutting feed means (not shown).

  When the chuck table 31 is positioned immediately below the image pickup means 33, a cutting region in which the remaining mold resin 40 embedded in the cutting groove 210 formed in the semiconductor wafer 2 is completely cut by the image pickup means 33 and a control means (not shown). Execute alignment work to detect. That is, the imaging unit 33 and a control unit (not shown) execute image processing for aligning the cutting groove 210 in which the mold resin 40 formed in a predetermined direction of the semiconductor wafer 2 is embedded and the cutting blade 323. Then, alignment of the cutting area is performed (alignment process). In the illustrated embodiment, since the mold resin 40 is laid on the surface of the semiconductor wafer 2 on which the cutting grooves 210 are formed, the image pickup means 33 is formed on the adjacent device 22 with the division planned line 21 in between. The bump 23 exposed from the surface of the mold resin 40 is imaged and sent to a control means (not shown). Then, a control means (not shown) determines the intermediate position between the bump 23 and the bump 23 formed in the adjacent device 22 as the intermediate position in the width direction in the cutting groove 210 formed in the planned division line 21. Thus, if the alignment with respect to the cutting groove 210 in which the mold resin 40 formed in the predetermined direction of the semiconductor wafer 2 is embedded is performed, the alignment is orthogonal to the predetermined direction formed in the semiconductor wafer 2. The cutting region alignment is similarly performed on the cutting grooves 210 formed in the direction.

  If the alignment for detecting the cutting area of the semiconductor wafer 2 held on the chuck table 31 is performed as described above, the chuck table 31 holding the semiconductor wafer 2 is moved to the cutting start position in the cutting area. To do. At this time, as shown in FIG. 11A, the semiconductor wafer 2 has one end of the cutting groove 210 in which the mold resin 40 to be cut is embedded (the left end in FIG. 11A) is an annular cut of the cutting blade 323. It is positioned so as to be located a predetermined amount on the right side from directly below the blade 323b.

  When the semiconductor wafer 2 held on the chuck table 31 of the cutting device 30 is positioned at the cutting start position in the cutting region in this way, the cutting blade 323 is indicated by a two-dot chain line in FIG. Cut from the standby position as indicated by arrow Z1, and is positioned at a predetermined cut feed position as indicated by the solid line in FIG. This cutting feed position is set to a position where the lower end of the annular cutting edge 323b of the cutting blade 323 reaches the half-cut groove 401 as shown in FIGS. 11 (a) and 11 (c).

  Next, the cutting blade 323 is rotated at a predetermined rotational speed in the direction indicated by an arrow 322a in FIG. 11A, and the chuck table 31 is rotated at a predetermined cutting feed speed in the direction indicated by an arrow X1 in FIG. Move with. When the other end (the right end in FIG. 11B) of the cutting groove 210 in which the mold resin 40 is embedded reaches a position located to the left by a predetermined amount from directly below the annular cutting edge 323b of the cutting blade 323, the chuck The movement of the table 31 is stopped. By cutting and feeding the chuck table 31 in this way, as shown in FIG. 11D, the remaining mold resin 40 embedded in the cutting groove 210 is divided by a dividing groove 402 having a width of 20 μm reaching the half-cut groove 401. Completely cut (division process). In this division step, the remaining mold resin 40 embedded in the cutting groove 210 (substantially half the thickness of the mold resin 40 embedded in the cutting groove 210) is cut, so that the mold resin 40 is completely cut at once. Compared with the case, the resistance of the mold resin 40 acting on the cutting blade 323 is halved, the annular cutting edge 323b of the cutting blade 323 is not bent, and the annular cutting edge 323b bends, so that the device The problem of scratching the sides is resolved.

  Next, the cutting blade 323 is raised as shown by the arrow Z2 in FIG. 11B and positioned at the standby position shown by the two-dot chain line, and the chuck table 31 is moved in the direction shown by the arrow X2 in FIG. It moves and returns to the position shown in FIG. Then, the chuck table 31 is indexed and fed in the direction perpendicular to the paper surface (index feed direction) by an amount corresponding to the interval between the cutting grooves 210 in which the mold resin 40 is embedded (interval between the division lines 21), and then cut. The mold resin 40 embedded in the power cutting groove 210 is positioned at a position corresponding to the cutting blade 323. In this way, when the mold resin 40 embedded in the cutting groove 210 to be cut next is positioned at a position corresponding to the cutting blade 323, the above-described dividing step is performed. Then, the above-described dividing step is performed on the mold resin 40 embedded in all the cutting grooves 210 formed in the semiconductor wafer 2. As a result, the semiconductor wafer 2 is divided into individual devices along the mold resin 40 embedded in the cutting groove 210 formed by the division line 21. The devices 22 individually divided in this way constitute a wafer level chip size package (WLCSP) whose surface and side surfaces are covered with a mold resin 40 as shown in FIG.

2: Semiconductor wafer 21: Scheduled division line 22: Device 3, 30: Cutting device 31: Chuck table 32 of cutting device: Cutting means 323: Cutting blade 4: Resin coating device 40: Mold resin 5: Polishing device 51: Polishing device Chuck table 52: polishing means 524: polishing tool 6: protective tape 7: grinding device 71: grinding device chuck table 72: grinding means 76: grinding wheel F: annular frame T: dicing tape

Claims (1)

A wafer processing method in which a plurality of division lines are formed in a lattice shape on the surface and a device having bumps on the surface is formed in a plurality of regions partitioned by the plurality of division lines,
A cutting groove forming step of forming a cutting groove having a depth corresponding to the finished thickness of the device along the line to be divided from the front surface side of the wafer by a cutting blade having a first thickness;
A molding step of laying a mold resin on the surface of the wafer subjected to the cutting groove forming step and embedding the mold resin in the cutting groove;
A protective member attaching step of attaching a protective member to the surface of the mold resin laid on the surface of the wafer on which the molding step has been carried out;
A back surface grinding step of grinding the back surface of the wafer on which the protective member attaching step has been performed to expose the cutting groove and exposing the mold resin embedded in the cutting groove to the back surface of the wafer;
Half-cut groove formation in which a half-cut groove is formed by cutting the mold resin embedded in the cut groove from the back surface side of the wafer at a substantially half depth by a cutting blade having a second thickness that is thinner than the first thickness. Process,
A support member attaching step of attaching a support member to the back surface of the wafer on which the half-cut groove forming step has been carried out and peeling off a protective member attached to the surface of the mold resin laid on the surface of the wafer;
A region corresponding to the mold resin embedded in the cutting groove is cut from the surface side of the wafer by a cutting blade having a second thickness smaller than the first thickness, and the remaining mold resin embedded in the cutting groove is removed. A dividing step of completely cutting and dividing into individual devices,
A method for processing a wafer.