JP2016207859A - Heat radiation structure, discharge method, heat radiation system, and information processing device - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a heat radiation structure which achieves noise reduction.SOLUTION: A heat radiation unit 101 including a heat radiation fan 103 is coupled to a GPU 11 by heat pipes 111a and 111b. A heat radiation unit 201 including a heat radiation fan 203 is coupled to a CPU by a heat pipe 211. The GPU 11 and the CPU 21 are coupled by a heat pipe 311. The heat radiation fans 103 and 203 are controlled by temperatures of temperature sensors 51a to 51d. For example, when the temperature of the GPU 11 is high, heat of the GUP 11 is also discharged from the heat radiation unit 201 via the heat pipe 311 and the heat pipe 211. Thermally coupling two systems by the heat pipe 311 allows heat of one of the systems is dispersed to the heat radiation unit of the other system and thereby reduces a rotation speed of the heat radiation fans 103, 203.SELECTED DRAWING: Figure 1

Description

  The present invention relates to a technique for discharging heat from a housing of an information processing device with a heat radiating fan.

  An information processing apparatus such as a notebook personal computer (notebook PC), a workstation, or a server is equipped with a heat dissipation system including a heat dissipation fan for discharging heat radiated from a device housed in a housing. Among the devices mounted on the computer, the central processing unit (CPU) and the graphics processing unit (GPU) have a particularly large calorific value. The heat dissipation system releases heat from the inside of the casing in order to suppress the temperature of the casing to an allowable value and suppress the temperature of the casing to a level that does not cause a problem even if the user touches it.

  In recent years, with increasing power consumption of CPUs and GPUs, a computer may be equipped with a plurality of heat dissipation fans. Patent Document 1 discloses a personal computer equipped with a CPU cooling fan that cools a CPU through a heat sink and a system cooling fan that cools other circuit elements. The CPU cooling fan is disposed in a space surrounded by the partition wall, and sends air to a heat sink that cools the CPU. The number of revolutions of the CPU cooling fan and the system cooling fan is controlled by independent temperature control systems.

JP 2004-246403 A

  In an information processing apparatus equipped with a heat dissipating fan, noise reduction is one problem. Noise decreases as the rotational speed of the heat dissipation fan decreases. Since most of the heat generated by the computer is occupied by the CPU and GPU, these heat generating elements are dissipated by one large heat dissipation fan (single fan) and two small heat dissipation fans (dual fan) Compare the case of heat dissipation with. Noise can be suppressed if a large single fan with sufficient heat dissipation is provided inside the housing and can be operated at a low rotational speed.

  However, since the heat dissipating fan needs to be housed in the housing of the information processing apparatus while avoiding interference with other devices, the realistic size, that is, the heat dissipating amount is restricted. Therefore, if it is intended to dissipate the total amount of heat generated by the CPU and GPU with a single fan that can be practically mounted on the housing, the rotational speed increases and the noise increases.

  On the other hand, if the dual fans can share the total heat generation amount of the CPU and GPU and dissipate heat, the respective rotation speeds can be made lower than those of the single fan. Since the synthesis of noise with multiple sound sources superimposed is calculated in decibels (dB), for example, the combined value of the noise of two radiating fans rotating at 50% is the value of the noise of one radiating fan rotating at 80%. It becomes smaller than noise.

  When observing the operation of the information processing apparatus, there is a case where one of the CPU and the GPU, that is, the heat generation amount, is very large and the other is very small as compared with the case where the loads are equal. In the dual fan described in Patent Document 1, since the object to be cooled and the cooling fan are thermally separated from each other, if one thermal load increases, the rotational speed of the cooling fan that cools the thermal load increases. As it rises, the noise becomes high. Further, even when the total heat generation amount of the CPU and the GPU is small enough to radiate heat even with a single radiating fan, the two radiating fans of the cooling system operate to cause a loss of power consumption.

  Therefore, an object of the present invention is to provide a heat dissipation structure that reduces noise. Another object of the present invention is to provide a heat dissipation structure capable of reducing power consumption. Furthermore, the objective of this invention is providing the heat dissipation system and information processing apparatus which employ | adopted such a heat dissipation structure.

  A first aspect of the present invention provides a heat dissipation structure that discharges heat inside a housing of an information processing device. The heat dissipation structure includes a first heat dissipation system including a first heat generating element and a first heat dissipation fan, a second heat dissipation system including a second heat generating element and a second heat dissipation fan, and a first heat dissipation system. And a coupling member that thermally couples the second heat dissipation system. Since the first heat dissipation system and the second heat dissipation system are thermally coupled, heat can be dissipated from the other heat dissipation system when the temperature of one heat dissipation system becomes high. Noise can be reduced by suppressing an increase in the rotational speed of the heat dissipation fan.

  The first heating element and the second heating element can be processors. Further, the first heating element can be a GPU and the second heating element can be a CPU. The heat dissipating structure includes a first heat sink that is thermally coupled to the first heat generating element and heat exchanged by the first heat dissipating fan, and a second heat dissipating fan that is thermally coupled to the second heat generating element. A second heat sink to be heat exchanged.

  The coupling member may be a heat pipe that couples the first heating element and the second heating element. By adopting the heat pipe, heat transport between the first heat dissipation system and the second heat dissipation system can be efficiently performed. The first heat sink and the first heating element can be coupled by a heat pipe, and the second heat sink and the second heating element can be coupled by a second heat pipe. The chamber of the first heat dissipation fan can be directly coupled to the first heat sink and the chamber of the second heat dissipation fan can be directly coupled to the second heat sink. The first heat radiating fan and the second heat radiating fan can each be a centrifugal heat radiating fan.

  A second aspect of the present invention provides a heat dissipation system that exhausts heat inside a housing of an information processing device. The heat dissipation system includes a first heat dissipation system including a first heat generating element and a first heat dissipation fan, a second heat dissipation system including a second heat generating element and a second heat dissipation fan, and a first heat dissipation system. A coupling member that thermally couples the second heat dissipation system, a plurality of temperature sensors that detect the temperature inside the housing, and rotation of the first heat dissipation fan and the second heat dissipation fan based on the temperature detected by the temperature sensor And a controller for controlling the speed.

  The controller can simultaneously control the rotation speeds of the first and second radiating fans stepwise. Since the two heat dissipating systems are thermally coupled, the rotational speed of the heat dissipating fan corresponding to the heating element whose temperature has increased can be suppressed. When the plurality of temperature sensors include a first temperature sensor belonging to the first heat dissipation system and a second temperature sensor belonging to the second heat dissipation system, the controller uses the temperature detected by the first temperature sensor to perform the first heat dissipation. The rotational speed of the fan can be controlled, and the rotational speed of the second heat radiating fan can be controlled by the temperature detected by the second temperature sensor.

  A third aspect of the present invention provides a method for exhausting heat inside a housing of an information processing device. The first heat radiating fan discharges heat generated by the first heat generating element to the outside of the housing, and the second heat radiating fan discharges heat generated by the second heat generating element to the outside of the housing. In the discharging step and the first discharging step, when the temperature of the first heating element is higher than the temperature of the second heating element, a part of the heat generated by the first heating element is enclosed by the second heat radiating fan. A second discharging step for discharging to the outside of the body.

  The second discharging step can be performed through a heat pipe connecting the first heating element and the second heating element. In the first discharging step, when the temperature of the second heat generating element is higher than the temperature of the first heat generating element, a part of the heat generated by the second heat generating element is transferred to the outside of the housing by the first heat radiating fan. A third discharging step for discharging may be included.

  According to the present invention, it is possible to provide a heat dissipation structure that reduces noise. Furthermore, according to the present invention, a heat dissipation structure capable of reducing power consumption can be provided. Furthermore, according to the present invention, a heat dissipation system and an information processing apparatus employing such a heat dissipation structure can be provided.

2 is a plan view schematically showing the inside of a housing of the information processing apparatus 10. FIG. It is a top view of the thermal radiation unit 101,201. It is a figure for contrasting heat radiation models 301-305, and explaining a difference in operation. 4 is a schematic functional block diagram for explaining the configuration of a heat dissipation system 350. FIG. It is a figure for demonstrating an example of TAT353. It is a figure for demonstrating the example of the other thermal radiation model.

  FIG. 1 is a plan view schematically showing the inside of a housing of an information processing apparatus 10 such as a workstation or a notebook PC. Inside the housing, as a functional component of the information processing apparatus, a GPU 11, a heat radiating unit 101, a CPU 21, a heat radiating unit 201, and a mother board (not shown) on which a large number of electronic components are mounted are arranged. FIG. 2 is a plan view of the heat dissipation units 101 and 201. In FIG. 2, the heat radiating unit 101 includes a heat radiating fan 103 and heat sinks 105a and 105b. The heat dissipating fan 103 houses a blade attached to the shaft of the fan motor in a thin chamber.

  The heat sinks 105a and 105b are directly attached to the chamber so that their positions are aligned with the openings formed in the side surfaces of the chamber. When the fan / motor is rotated, the heat dissipating unit 101 discharges the ambient air taken in from the suction ports formed on the upper and lower surfaces of the chamber through the plurality of fins of the heat sinks 105a and 105b. Exchange heat. The heat dissipating unit 201 has the same structure as the heat dissipating unit 101, and includes a heat dissipating fan 203 including a fan motor having blades mounted in a chamber, and heat sinks 205a and 205b.

  The air exhausted by the heat dissipating units 101 and 201 is discharged from an exhaust port formed on the side surface of the housing. The housing 10 is formed with an air inlet (not shown) for taking in ambient air. The GPU 11 is a processor dedicated to drawing processing, and the CPU 21 is a processor that executes general processing by executing application programs. Here, as an example, a case where the heat generation amount of the GPU 11 is larger than the heat generation amount of the CPU 21 and the heat dissipation unit 101 has a larger heat dissipation amount than the heat dissipation unit 201 will be described as an example. However, in the present invention, the relative relationship between the heat generation amount of the GPU 11 and the CPU 21 and the heat dissipation amount of the heat radiation units 101 and 201 need not be particularly limited.

  The GPU 11 and the CPU 21 are thermally coupled to heat receiving plates 113 and 213 provided on the lower surface, respectively. The heat receiving plate 113 and the heat sinks 105a and 105b are thermally coupled by the two heat pipes 111a and 111b. The heat receiving plate 213 is thermally coupled to the heat sinks 205 a and 205 b by the heat pipe 211. The heat receiving plate 113 and the heat receiving plate 213 are thermally coupled to each other by a heat pipe 311. The heat receiving plates 113 and 213 can be thermally coupled directly to each other, or can be thermally coupled with another heat receiving plate interposed therebetween. However, in this method, the heat transport amount is smaller than that of the heat pipe 311. Therefore, the effect of the present invention to equalize the heat radiation amount as described below is limited.

  Temperature sensors 51a to 51d are arranged in the housing. The positions and number of the temperature sensors 51a to 51d are illustrated for explaining the present invention. The temperature sensors 51a to 51d are arranged in the vicinity of the target electronic device as an external type, or are formed in the die of the electronic device as an embedded type. The temperature sensors 51a and 51b for monitoring the GPU 11 and the CPU 21, respectively, are embedded types, and the temperature sensors 51c and 51d for monitoring other electronic devices and the housing surface are external types. The external temperature sensors 51c and 51d are mounted on the motherboard. The detected temperatures of the temperature sensors 51a to 51d are used to control the heat radiation units 101 and 201 for monitoring the temperature of the corresponding device and maintaining the surface temperature of the housing within a predetermined value.

  FIG. 3A shows a heat dissipation model 301 corresponding to the heat dissipation structure according to the present embodiment shown in FIG. FIGS. 3B and 3C show virtual heat dissipation models prepared for comparison with the heat dissipation structure according to the present embodiment. The heat dissipation model 301 includes a first heat dissipation system configured by the GPU 11, the heat pipe 111 and the heat dissipation unit 101, and a second heat dissipation system configured by the CPU 21, the heat pipe 211 and the heat dissipation unit 201. In the two heat radiation systems, the heat source GPU 11 and the CPU 21 are coupled by a heat pipe 311.

  The heat dissipation model 303 in FIG. 3B is obtained by removing the heat pipe 311 from the heat dissipation model 301 and separating the two heat dissipation systems. A heat dissipation model 305 in FIG. 3C is obtained by connecting the CPU 21 to the heat dissipation unit 101 with a heat pipe 351 with respect to the heat dissipation model 303. In the heat dissipation model 305, two heat dissipation systems are coupled by a heat dissipation unit 101 which is a heat dissipation source of the first heat dissipation system.

  Here, in the three heat radiation models 301 to 303, noises are compared when it is assumed that the GPU 11 and the CPU 21 have generated heat to some extent to operate both the heat radiation units 101 and 201. In order to simplify the thermal balance, it is assumed that the GPU 11 and the CPU 21 have the same allowable temperature at the maximum load, and the rotation speeds of the heat radiation units 101 and 201 for maintaining the allowable temperature are the same. Moreover, when the temperature of GPU11 and CPU21 rises or falls, the thermal radiation units 101 and 201 shall raise or lower a rotational speed at the same timing.

  That is, when any one of the temperatures of the GPU 11 and the CPU 21 exceeds a threshold value for the current rotation speed, the heat dissipation units 101 and 201 simultaneously increase the rotation speed, and both the temperatures of the GPU 11 and the CPU 21 are the current rotation speed. At the same time, the rotational speed is lowered when the value falls below the threshold.

  For example, when both of the heat generation amounts of the first heat dissipation system and the second heat dissipation system are 50%, each of the heat dissipation models 301 to 303 can make the rotation speeds of the heat dissipation units 101 and 201 substantially the same. The noise level will be the same. Next, a case where the heat generation amount of the GPU 11 becomes 100% and the heat generation amount of the CPU 21 becomes 20% will be considered. In the heat dissipation model 301, the heat of the GPU 11 is radiated by the heat radiating unit 101 and the heat of the CPU 21 is radiated by the heat radiating unit 201, but the temperature of the GPU 11 is higher than the temperature of the CPU 21. Since the GPU 11 and the CPU 21 are coupled to each other by the heat pipe 311, the heat of the GPU 11 is also conveyed to the heat radiating unit 201 via the CPU 21.

  Therefore, since the heat of the first heat dissipation system is also dissipated from the second heat dissipation system, the rotation speed of the heat dissipation unit 101 is reduced as compared with the case where there is no heat dissipation from the second heat dissipation system. On the contrary, the second heat dissipation system has a higher rotational speed of the heat dissipation unit 201 than the case where the heat of the first heat dissipation system is not dissipated, but the synthesized noise is dominated by the first heat dissipation system. The one that dissipates heat also goes down from the heat dissipation system.

  On the other hand, in the heat dissipation model 303 in which the two heat dissipation systems are separated, since the heat dissipation unit 101 rotates at the maximum rotation speed, the synthesized noise is generated even if the rotation speed of the heat dissipation unit 201 is lower than that of the heat dissipation model 301. It becomes higher than the heat dissipation model 301. In the heat dissipation model 305, the heat of the GPU 11 is carried to the heat dissipation unit 201 via the heat pipe 351, the CPU 21, and the heat pipe 211, and the rotation speed of the heat dissipation unit 101 can be suppressed. Since the transport efficiency is reduced by the increase in the length, the degree of suppression of the rotation speed of the heat dissipation unit 101 is reduced.

  Next, a case where the heat generation amount of the CPU 21 becomes 100% and the heat generation amount of the GPU 11 becomes 20% will be considered. In the heat dissipation model 301, the heat dissipation unit 101 dissipates the heat of the CPU 21 and suppresses the rotation speed of the heat dissipation unit 201. In the heat dissipation model 303, since the heat dissipation unit 201 rotates at the maximum rotation speed, the synthesized noise is higher than that of the heat dissipation model 301 even if the rotation speed of the heat dissipation unit 301 is lower than that of the heat dissipation model 301. In the heat dissipation model 305, since the heat of the CPU 21 is efficiently transferred to the heat dissipation unit 101, the rotation speed of the heat dissipation unit 201 can be suppressed. Although the heat dissipation model 303 in which the first heat dissipation system and the second heat dissipation system are thermally separated is excluded from the scope of the present invention, the first heat dissipation system and the second heat dissipation system are thermally coupled. The heat dissipation model 305 is included in the scope of the present invention.

  FIG. 4 is a schematic functional block diagram of a heat dissipation system 350 configured with the heat dissipation model 301. The heat dissipation system 350 includes a control unit 351, a first heat dissipation system 150, and a second heat dissipation system 250. The first heat radiation systems 150 and 250 include drive circuits 151 and 251 and heat radiation fans 103 and 203, respectively.

  The first heat dissipation system 150 includes temperature sensors 51a and 51c, and the second heat dissipation system 25 includes temperature sensors 51b and 51d. Here, it is assumed that the temperature sensor 51c arranged around the GPU 11 receives the heat dissipation effect of the heat dissipation unit 101 strongly, and the temperature sensor 51d arranged around the CPU 21 receives the heat dissipation effect of the heat dissipation unit 201 strongly.

  The drive circuits 151 and 251 perform PWM control of the rotational speeds of the heat radiating fans 103 and 203 in steps as an example in accordance with an instruction from the control unit 351. The control unit 351 is a controller that includes a processor, RAM, ROM, and firmware. The control unit 351 has a thermal action table (TAT) 353 and refers to the TAT 353 with respect to the temperature of the temperature sensors 51a to 51d and sets the rotation speed in the drive circuits 151 and 251.

  FIG. 5 is a diagram for explaining an example of the configuration of the TAT 353. In TAT353, the rotation stage from the highest speed (HH) to the lowest speed (LL) is defined. Corresponding to the rotation stage, the rotation speeds r1 to r5 are set for the heat dissipation fan 103, and the rotation speeds s1 to s5 are set for the heat dissipation fan 203. For example, in the temperature sensor 51a, temperatures T1a to T5a are set in order from the highest temperature. Similarly, the temperatures T1b to T5d are set for the other temperature sensors 51b to 51d in correspondence with the rotary stage. The temperatures T1a to T5d have a hysteresis between the control for increasing the rotation speed and the control for decreasing the rotation speed.

  Next, a method in which the control unit 351 controls the rotational speed of the heat dissipation fans 103 and 203 with reference to the TAT 353 will be described. The first control method is a method of controlling the temperature sensors 51a to 51d without dividing them into a first heat dissipation system and a second heat dissipation system. When any of the temperature sensors 51a to 51d exceeds the temperature T5a to T5d corresponding to the lowest speed (LL) rotation stage when the heat dissipation fans 103 and 203 are stopped, the control unit 351 causes the heat dissipation fans 103 and 203 to be dissipated. Are simultaneously driven at rotational speeds r5 and s5, respectively, to control the drive circuits 151 and 251. Similarly, when one of the temperature sensors 51a to 51d exceeds the temperature T4a to T4d corresponding to the low speed (L) rotary stage while rotating on the lowest speed (LL) rotary stage, the controller 351 dissipates heat. The drive circuits 151 and 251 are controlled so that the fans 103 and 203 are simultaneously rotated at the rotation speeds r4 and s4, respectively.

  In this way, when the temperature detected by the temperature sensors 51a to 51d rises, the rotary stage reaches the highest speed (HH). When all the temperature sensors 51a to 51d are below the temperatures T1a to T1d corresponding to the highest speed (HH) rotating stage when rotating at the highest speed (HH), the control unit 351 causes the radiating fans 103 and 203 to simultaneously The drive circuits 151 and 251 are controlled to rotate on a high-speed (H) rotary stage. In this way, the heat radiation fans 103 and 203 are controlled at the same time when the temperature rises and falls. At this time, since the first heat dissipation system 150 and the second heat dissipation system 250 are thermally coupled, even if the difference in heat generation between the GPU 11 and the CPU 21 is increased, the heat generation amount of the rotation stage of the heat dissipation system is increased. The opportunity to go up can be reduced and noise can be suppressed.

  The second control method is a method of controlling the temperature sensors 51a to 51d by dividing them into a first heat dissipation system and a second heat dissipation system. The control unit 351 controls the rotation speed of the heat dissipation fan 103 using only the temperature sensors 51a and 51c, and controls the rotation speed of the heat dissipation fan 203 using only the temperature sensors 51b and 51d. The two heat dissipation systems are controlled individually, but when the amount of heat generated in one control system increases, heat is also dissipated from the other control system. Can be suppressed.

  In this case, one of the heat dissipating fans can be stopped when the temperature falls to reach the lowest speed (LL) rotary stage, for example. Although the temperature of the heat dissipation system in which the heat dissipation fan is stopped rises, since both are thermally coupled, heat can be radiated from the other heat dissipation fan. By stopping one of the heat dissipating fans, the power consumption when the heat load is small can be reduced.

  Although the heat dissipation model constituted by two heat dissipation systems has been described so far, the present invention can also be applied to a heat dissipation model including three or more heat dissipation systems. FIG. 6 is a diagram for explaining a heat dissipation model 400 configured by three heat dissipation systems. In the heat dissipation model 400, a third heat dissipation system constituted by the CPU 41, the heat dissipation unit 401, and the heat pipes 411a to 411c is added to the heat dissipation model 301.

  The CPU 41 is thermally coupled to the GPU 11 of the first heat dissipation system via the heat pipe 411a, and is thermally coupled to the CPU 21 of the second heat dissipation system via the heat pipe 411b. The CPU 41 is thermally coupled to the heat radiating unit 401 by a heat pipe 411c. In the heat dissipation structure 400, the heat of any heat dissipation system that has generated a large amount of heat can be dissipated from the other two heat dissipation systems, so even if the amount of heat dissipation varies, the increase in the rotational speed of the heat dissipation fan is suppressed. Noise can be reduced.

  Although the present invention has been described with the specific embodiments shown in the drawings, the present invention is not limited to the embodiments shown in the drawings, and is known so far as long as the effects of the present invention are achieved. It goes without saying that any configuration can be adopted.

10 Information processing equipment 11 GPU
21, 41 CPU
51a-51d Temperature sensor 101, 201 Heat radiation unit 103, 203 Heat radiation fan 105a, 105b, 205a, 205b Heat sink 111, 111a, 111b, 211, 311, 351, 411a-411c Heat pipe 113, 213 Heat receiving plate 150 No. 1 heat dissipation system 250 second heat dissipation system 301, 303, 305, 400 heat dissipation model 350 heat dissipation system 353 thermal action table (TAT)

Claims (15)

A heat dissipation structure that exhausts heat inside the housing of the information processing device,
A first heat dissipation system including a first heating element and a first heat dissipation fan;
A second heat dissipation system including a second heating element and a second heat dissipation fan;
A heat dissipation structure having a coupling member that thermally couples the first heat dissipation system and the second heat dissipation system.   The heat dissipation structure according to claim 1, wherein the first heating element and the second heating element are processors.   The heat dissipation structure according to claim 1, wherein the first heating element is a GPU and the second heating element is a CPU.   A first heat sink that is thermally coupled to the first heating element and is heat-exchanged by the first radiating fan; and a thermal sink that is thermally coupled to the second heating element and the second radiating fan. The heat dissipating structure according to claim 1, further comprising a second heat sink to be heat exchanged.   The heat dissipation structure according to claim 4, wherein the coupling member is a heat pipe that couples the first heating element and the second heating element.   The first heat sink and the first heating element are coupled by a heat pipe, and the second heat sink and the second heating element are coupled by a second heat pipe. The heat dissipation structure described.   5. The heat dissipation structure according to claim 4, wherein the chamber of the first heat dissipation fan is directly coupled to the first heat sink, and the chamber of the second heat dissipation fan is directly coupled to the second heat sink.   The heat dissipation structure according to claim 1, wherein each of the first heat dissipation fan and the second heat dissipation fan is a centrifugal heat dissipation fan.   An information processing apparatus equipped with the heat dissipation structure according to any one of claims 1 to 8. A heat dissipation system that exhausts heat inside the housing of the information processing apparatus,
A first heat dissipation system including a first heating element and a first heat dissipation fan;
A second heat dissipation system including a second heating element and a second heat dissipation fan;
A coupling member that thermally couples the first heat dissipation system and the second heat dissipation system;
A plurality of temperature sensors for detecting the temperature inside the housing;
A heat dissipation system comprising: a controller that controls a rotation speed of the first heat dissipation fan and the second heat dissipation fan based on a temperature detected by the temperature sensor.   11. The heat dissipation system according to claim 10, wherein the controller simultaneously controls stepwise rotation speeds of the first heat dissipation fan and the second heat dissipation fan.   The plurality of temperature sensors includes a first temperature sensor belonging to the first heat dissipation system and a second temperature sensor belonging to the second heat dissipation system, and the controller detects the temperature at the temperature detected by the first temperature sensor. The heat dissipation system according to claim 10, wherein the rotation speed of the first heat dissipation fan is controlled, and the rotation speed of the second heat dissipation fan is controlled by a temperature detected by the second temperature sensor. A method for exhausting heat from the inside of a housing of an information processing device,
The first heat radiating fan discharges heat generated by the first heat generating element to the outside of the casing, and the second heat radiating fan discharges heat generated by the second heat generating element to the outside of the casing. 1 discharging step;
In the first discharging step, when the temperature of the first heat generating element is higher than the temperature of the second heat generating element, the second heat radiating fan uses a part of the heat generated by the first heat generating element. A second discharging step of discharging to the outside of the housing.   The method of claim 13, wherein the second discharging step is performed through a heat pipe connecting the first heating element and the second heating element.   In the first discharging step, when the temperature of the second heat generating element is higher than the temperature of the first heat generating element, the first heat radiating fan uses a part of the heat generated by the second heat generating element. The method according to claim 13, further comprising a third discharging step of discharging outside the housing.

Images