JP2016197629A5 - - Google Patents
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- JP2016197629A5 JP2016197629A5 JP2015076048A JP2015076048A JP2016197629A5 JP 2016197629 A5 JP2016197629 A5 JP 2016197629A5 JP 2015076048 A JP2015076048 A JP 2015076048A JP 2015076048 A JP2015076048 A JP 2015076048A JP 2016197629 A5 JP2016197629 A5 JP 2016197629A5
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- JP
- Japan
- Prior art keywords
- reference mark
- recognition camera
- transfer tool
- origin
- die transfer
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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- 238000003384 imaging method Methods 0.000 claims 6
- 230000000007 visual effect Effects 0.000 claims 5
- 239000000758 substrate Substances 0.000 claims 3
- 230000032258 transport Effects 0.000 claims 3
- 238000006073 displacement reaction Methods 0.000 claims 2
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2015076048A JP6438826B2 (ja) | 2015-04-02 | 2015-04-02 | ボンディング装置及びボンディング方法 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2015076048A JP6438826B2 (ja) | 2015-04-02 | 2015-04-02 | ボンディング装置及びボンディング方法 |
Publications (3)
Publication Number | Publication Date |
---|---|
JP2016197629A JP2016197629A (ja) | 2016-11-24 |
JP2016197629A5 true JP2016197629A5 (he) | 2018-02-22 |
JP6438826B2 JP6438826B2 (ja) | 2018-12-19 |
Family
ID=57358533
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2015076048A Active JP6438826B2 (ja) | 2015-04-02 | 2015-04-02 | ボンディング装置及びボンディング方法 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JP6438826B2 (he) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP7292463B1 (ja) | 2022-03-29 | 2023-06-16 | キヤノンマシナリー株式会社 | 位置合わせ装置、位置合わせ方法、ボンディング装置、ボンディング方法、および半導体装置製造方法 |
Families Citing this family (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP7018341B2 (ja) | 2018-03-26 | 2022-02-10 | ファスフォードテクノロジ株式会社 | ダイボンディング装置および半導体装置の製造方法 |
JP7232071B2 (ja) * | 2019-02-12 | 2023-03-02 | 株式会社ディスコ | 加工装置におけるカメラの位置ずれ検出方法 |
DE102021105594B3 (de) * | 2021-03-09 | 2022-06-09 | Asm Assembly Systems Gmbh & Co. Kg | Verfahren zur Positionskorrektur von Bauteilen mit einer Aufnahmevorrichtung, Aufnahmevorrichtung, Computerprogrammprodukt und computerlesbares Medium |
Family Cites Families (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP4728293B2 (ja) * | 2007-06-28 | 2011-07-20 | ヤマハ発動機株式会社 | 部品移載装置 |
CH698334B1 (de) * | 2007-10-09 | 2011-07-29 | Esec Ag | Verfahren für die Entnahme und Montage von auf einem Wafertisch bereitgestellten Halbleiterchips auf einem Substrat. |
JP5344145B2 (ja) * | 2008-12-25 | 2013-11-20 | 澁谷工業株式会社 | ボンディング装置における電子部品と基板の位置合わせ方法 |
JP6259615B2 (ja) * | 2013-09-13 | 2018-01-10 | ファスフォードテクノロジ株式会社 | ダイボンダ及びダイボンディング方法 |
-
2015
- 2015-04-02 JP JP2015076048A patent/JP6438826B2/ja active Active
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP7292463B1 (ja) | 2022-03-29 | 2023-06-16 | キヤノンマシナリー株式会社 | 位置合わせ装置、位置合わせ方法、ボンディング装置、ボンディング方法、および半導体装置製造方法 |
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