JP2016161311A - Heat flowmeter and electronic apparatus - Google Patents

Heat flowmeter and electronic apparatus Download PDF

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Publication number
JP2016161311A
JP2016161311A JP2015037885A JP2015037885A JP2016161311A JP 2016161311 A JP2016161311 A JP 2016161311A JP 2015037885 A JP2015037885 A JP 2015037885A JP 2015037885 A JP2015037885 A JP 2015037885A JP 2016161311 A JP2016161311 A JP 2016161311A
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Japan
Prior art keywords
heat
heat flow
surface
heat transfer
flow meter
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Pending
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JP2015037885A
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Japanese (ja)
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JP2016161311A5 (en
Inventor
陽 池田
Hiromi Ikeda
陽 池田
興子 清水
Kyoko Shimizu
興子 清水
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セイコーエプソン株式会社
Seiko Epson Corp
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Priority to JP2015037885A priority Critical patent/JP2016161311A/en
Publication of JP2016161311A publication Critical patent/JP2016161311A/en
Publication of JP2016161311A5 publication Critical patent/JP2016161311A5/ja
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    • GPHYSICS
    • G01MEASURING; TESTING
    • G01KMEASURING TEMPERATURE; MEASURING QUANTITY OF HEAT; THERMALLY-SENSITIVE ELEMENTS NOT OTHERWISE PROVIDED FOR
    • G01K13/00Adaptations of thermometers for specific purposes
    • G01K13/002Adaptations of thermometers for specific purposes for measuring body temperature
    • AHUMAN NECESSITIES
    • A61MEDICAL OR VETERINARY SCIENCE; HYGIENE
    • A61BDIAGNOSIS; SURGERY; IDENTIFICATION
    • A61B5/00Detecting, measuring or recording for diagnostic purposes; Identification of persons
    • A61B5/01Measuring temperature of body parts; Diagnostic temperature sensing, e.g. for malignant or inflamed tissue
    • AHUMAN NECESSITIES
    • A61MEDICAL OR VETERINARY SCIENCE; HYGIENE
    • A61BDIAGNOSIS; SURGERY; IDENTIFICATION
    • A61B5/00Detecting, measuring or recording for diagnostic purposes; Identification of persons
    • A61B5/68Arrangements of detecting, measuring or recording means, e.g. sensors, in relation to patient
    • A61B5/6801Arrangements of detecting, measuring or recording means, e.g. sensors, in relation to patient specially adapted to be attached to or worn on the body surface
    • A61B5/6802Sensor mounted on worn items
    • A61B5/681Wristwatch-type devices
    • GPHYSICS
    • G01MEASURING; TESTING
    • G01KMEASURING TEMPERATURE; MEASURING QUANTITY OF HEAT; THERMALLY-SENSITIVE ELEMENTS NOT OTHERWISE PROVIDED FOR
    • G01K17/00Measuring quantity of heat
    • AHUMAN NECESSITIES
    • A61MEDICAL OR VETERINARY SCIENCE; HYGIENE
    • A61BDIAGNOSIS; SURGERY; IDENTIFICATION
    • A61B2562/00Details of sensors; Constructional details of sensor housings or probes; Accessories for sensors
    • A61B2562/02Details of sensors specially adapted for in-vivo measurements
    • A61B2562/0271Thermal or temperature sensors
    • AHUMAN NECESSITIES
    • A61MEDICAL OR VETERINARY SCIENCE; HYGIENE
    • A61BDIAGNOSIS; SURGERY; IDENTIFICATION
    • A61B2562/00Details of sensors; Constructional details of sensor housings or probes; Accessories for sensors
    • A61B2562/02Details of sensors specially adapted for in-vivo measurements
    • A61B2562/0271Thermal or temperature sensors
    • A61B2562/0276Thermal or temperature sensors comprising a thermosensitive compound
    • AHUMAN NECESSITIES
    • A61MEDICAL OR VETERINARY SCIENCE; HYGIENE
    • A61BDIAGNOSIS; SURGERY; IDENTIFICATION
    • A61B2562/00Details of sensors; Constructional details of sensor housings or probes; Accessories for sensors
    • A61B2562/04Arrangements of multiple sensors of the same type

Abstract

PROBLEM TO BE SOLVED: To provide a heat flowmeter and an electronic apparatus with which it is possible to accurately measure a heat flow occurring between a biological surface and an external environment.SOLUTION: A heat flow sensor 10 comprises a heat transfer layer 11 having mutually opposing first face 11a and second face 11b and having flexibility and a temperature difference measurement unit 20 for measuring a temperature difference between the first face 11a and the second face 11b of the heat transfer layer 11. The heat transfer layer 11 includes a first member having flexibility and a second member whose coefficient of thermal conductivity is higher than that of the first member, the thickness of the heat transfer layer 11 being 0.5 mm or greater, the coefficient of thermal conductivity of the heat transfer layer 11 being 10 W/(m×K) or greater, the Shore hardness of the heat transfer layer 11 being A50 or lower.SELECTED DRAWING: Figure 6

Description

  The present invention relates to a heat flow meter and an electronic apparatus.

  The body temperature of the human body is maintained by heat released from the human body. Metabolism for maintaining this body temperature is called basal metabolism. Therefore, the amount of metabolism can be known by measuring the heat released from the human body. The path of heat released from the human body includes convective heat transfer that is transferred to the external environment by convection such as air and water, and radiant heat transfer that is transferred to the surrounding object surface by radiation of electromagnetic waves. By measuring the heat flow by heat transfer such as convection heat transfer or radiant heat transfer, the heat (heat radiation amount) released from the human body can be measured.

  For example, in Patent Document 1, an armband-shaped electronic device (sensor device) in which a heat flow sensor (heat flux sensor) is installed is mounted so that the heat flow sensor comes into contact with the wearer's skin. A technique for measuring a heat flow from a temperature difference generated in a heat flow sensor is disclosed.

JP 2011-120917 A

  By the way, in order to accurately measure the heat flow emitted from the human body, it is necessary to transfer the heat of the skin surface to the heat flow sensor without loss. In the electronic device described in Patent Document 1, since the heat flow sensor itself does not have flexibility, an attachment made of metal having flexibility and good heat conductivity is brought into contact with the skin surface, and the attachment is made. It is structured to transmit the heat of the skin surface to the heat flow sensor through the. However, in such a structure, before the heat from the skin surface is transmitted to the heat flow sensor, a part of the heat flows out to other members, and an error occurs in the measurement of the heat flow.

  In addition, in order to suppress the transmission loss due to the outflow of heat, if a heat flow sensor that does not have flexibility is brought into direct contact with a curved object such as a human body, the heat flow sensor and the skin surface An air layer is likely to occur between them. When an air layer is created between the heat flow sensor and the skin surface, the substantial contact area between the heat flow sensor and the skin surface is reduced and less heat is transferred to the heat flow sensor, so the measured heat flow is the actual heat flow. Smaller than. As a result, in the heat flow sensor that does not have flexibility, an error occurs in the measurement of the heat flow, and there is a problem that the measurement accuracy of the heat radiation amount from the human body is lowered.

  SUMMARY An advantage of some aspects of the invention is to solve at least a part of the problems described above, and the invention can be implemented as the following forms or application examples.

  [Application Example 1] A heat flow meter according to this application example has a first surface and a second surface facing each other, and has a flexible heat transfer portion, the first surface of the heat transfer portion, and the And a temperature difference measuring unit that measures a temperature difference with the second surface.

  According to the configuration of this application example, the heat flow meter measures the temperature difference between the first surface and the second surface of the flexible heat transfer section with the temperature difference measurement section, and generates the heat flow due to heat transfer. Can be measured. For example, when the heat flow is measured by bringing the first surface of the heat transfer portion into contact with a human body (arm) or the like, the heat transfer portion is flexible, and therefore fits on the arm surface (skin surface). Therefore, the adhesion to the skin surface is improved and an air layer is less likely to be generated between the heat transfer portion and the skin surface, so that a reduction in contact area can be suppressed. As a result, an error in measurement of the heat flow generated between the skin surface that is in contact with the first surface and the external environment that is in contact with the second surface can be reduced, so that the amount of heat released from the human body can be accurately measured.

  Application Example 2 In the heat flow meter according to the application example, the heat transfer section includes a flexible first member and a second member having a higher thermal conductivity than the first member. It is preferable that

  According to the configuration of this application example, the heat transfer unit includes a flexible first member and a second member having a higher thermal conductivity than the first member. Therefore, a heat transfer part can be comprised using the 1st member which has flexibility as a base material, and heat conductivity can be provided with the 2nd member.

  [Application Example 3] The heat flow meter according to the application example, wherein the thickness of the heat transfer part is 0.5 mm or more, and the heat conductivity of the heat transfer part is 10 W / (m × K) or more. The Shore hardness of the heat transfer part is preferably A50 or less.

  According to the configuration of this application example, since the thickness of the heat transfer portion is 0.5 mm or more, a temperature difference for measuring the heat flow is generated in the thickness direction between the first surface and the second surface. be able to. Moreover, since the heat conductivity of a heat-transfer part is 10 W / (mxK) and is larger than the conductivity of general rubber, it is suitable as a material of a heat-transfer part. And since the Shore hardness of a heat-transfer part is A50 or less, the flexibility of a heat-transfer part can be improved.

  Application Example 4 In the heat flow meter according to the application example described above, it is preferable that a thermal diffusion layer having a thermal conductivity larger than 100 W / (m × K) is disposed on the first surface.

  According to the configuration of this application example, since the thermal diffusion layer having a thermal conductivity larger than that of the heat transfer unit is disposed on the first surface of the heat transfer unit, the temperature distribution in the plane of the first surface is more uniform. Can be. Therefore, when measuring the heat flow, the heat flow can be measured in a more stable state even if there are variations due to the contact state with the skin surface or variations due to the temperature distribution on the skin surface.

  Application Example 5 In the heat flow meter according to the application example described above, it is preferable that the Shore hardness of the thermal diffusion layer is A50 or less.

  According to the configuration of this application example, since the Shore hardness of the heat diffusion layer disposed on the first surface is approximately the same as that of the heat transfer unit, the flexibility of the heat transfer unit is not impaired.

  Application Example 6 In the heat flow meter according to the application example described above, it is preferable that a protective layer made of an organic material is disposed on the surface of the heat diffusion layer.

  According to the configuration of this application example, since the protective layer is disposed on the surface of the heat diffusion layer, it is possible to protect the heat diffusion layer and the heat transfer portion against contact with an external object.

  Application Example 7 In the heat flow meter according to the application example described above, it is preferable that the Shore hardness of the protective layer is A50 or less.

  According to the configuration of this application example, since the Shore hardness of the protective layer disposed on the surface of the heat diffusion layer is approximately the same as that of the heat diffusion layer and the heat transfer portion, the flexibility of the heat transfer portion and the heat diffusion layer Will not be damaged.

  Application Example 8 In the heat flow meter according to the application example described above, it is preferable that the heat transfer portion, the heat diffusion layer, and the protective layer are joined to each other by sewing.

  According to the configuration of this application example, since the heat transfer section, the heat diffusion layer, and the protective layer are joined to each other by sewing, the joint strength can be increased without impairing the flexibility of the entire heat flow meter. .

  Application Example 9 In the heat flow meter according to the application example, the temperature difference measurement unit is based on temperature information on a plurality of points on the first surface and temperature information on a plurality of points on the second surface. It is preferable to measure the temperature difference.

  According to the configuration of this application example, since the temperature difference is measured based on the temperature information at a plurality of points on each of the first surface and the second surface, the temperature distribution in the surface of the first surface can be averaged. Therefore, when measuring the heat flow, fluctuations due to the contact state between the arm surface and the first surface, fluctuations due to the temperature distribution of the arm surface, fluctuations due to the temperature distribution in the external environment in contact with the second surface Even if there is, etc., the heat flow generated between the skin surface and the external environment can be measured in a more stable state.

  Application Example 10 An electronic apparatus according to this application example includes a heat transfer unit having a first surface and a second surface that face each other and having flexibility, the first surface of the heat transfer unit, and the first surface. A temperature difference measuring unit that measures a temperature difference between the two surfaces, a belt equipped with a heat flow meter, a housing connected to the belt, a control unit installed in the housing, The control unit controls the heat flow meter.

  According to the configuration of this application example, the electronic device includes the belt on which the heat flow meter is mounted and the housing in which the control unit that controls the heat flow meter is installed. Therefore, when the amount of heat released from the human body is measured by wearing it on the human body (arm), an air layer is unlikely to be generated between the heat flow meter and the skin surface. Therefore, an error in measurement of the heat flow generated between the skin surface and the external environment can be reduced, so that an electronic apparatus that accurately measures the amount of heat released from the human body can be provided.

  Application Example 11 In the electronic device according to the application example described above, it is preferable that the thermal conductivity of the belt is lower than the thermal conductivity of the heat transfer section.

  According to the configuration of this application example, since the thermal conductivity of the belt to which the heat flow meter is attached is lower than the heat conductivity of the heat transfer section, it occurs in the thickness direction of the heat flow meter between the skin surface and the external environment. With respect to the heat flow, heat leaking from the contact portion with the heat flow meter to the belt in a direction crossing the thickness direction of the heat flow meter can be reduced. Thereby, the error in the measurement of the heat flow generated between the skin surface and the external environment can be suppressed.

1 is a side view showing a schematic configuration of an electronic apparatus according to a first embodiment. FIG. 2 is a plan view showing the configuration of the electronic apparatus according to the first embodiment. FIG. 2 is a plan view showing the configuration of the electronic apparatus according to the first embodiment. 1 is a side view illustrating a configuration of an electronic device according to a first embodiment. 1 is a block diagram showing a schematic functional configuration of an electronic device according to a first embodiment. The perspective view which shows typically the structure of the heat flow sensor which concerns on 1st Embodiment. Sectional drawing which shows typically the structure of the heat flow sensor which concerns on 1st Embodiment. The perspective view which shows typically the structure of the heat flow sensor which concerns on 2nd Embodiment. Sectional drawing which shows typically the structure of the heat flow sensor which concerns on 2nd Embodiment.

  DESCRIPTION OF EXEMPLARY EMBODIMENTS Hereinafter, embodiments of the invention will be described with reference to the drawings. The drawings to be used are appropriately enlarged, reduced or exaggerated so that the part to be described can be recognized. In addition, illustrations of components other than those necessary for the description may be omitted.

  In the following embodiments, as an example of an electronic device, a wearable biological information acquisition device that is mounted on a user's arm and measures the amount of heat released from the human body will be described as an example.

(First embodiment)
<Electronic equipment>
First, a schematic configuration of the electronic apparatus according to the first embodiment will be described with reference to FIGS. 1, 2, 3, and 4. FIG. 1 is a side view illustrating a schematic configuration of the electronic apparatus according to the first embodiment. 2 and 3 are plan views showing the configuration of the electronic apparatus according to the first embodiment. FIG. 4 is a side view showing the configuration of the electronic apparatus according to the first embodiment. Specifically, FIG. 2A is a front view of the electronic device, and FIG. 2B is a rear view of the electronic device. 3 is a rear view showing a state in which the belts 8a and 8b are removed from the housing 2, and FIG. 4 corresponds to a side view of the state of FIG. 3 viewed from the side.

  FIG. 1 is a diagram schematically illustrating a state in which the electronic apparatus 1 according to the first embodiment is mounted on a user's arm (human body) M. As shown in FIG. 1, the electronic device 1 according to the first embodiment includes a housing 2 and a pair of belts 8 a and 8 b connected to the housing 2. A buckle 9a is attached to the belt 8a, and a plurality of holes 9b (see FIG. 2A) that engage with the buckle 9a are provided in the belt 8b.

  In FIG. 1, a cross section of the arm M is schematically shown by a two-dot chain line. The electronic device 1 is a wristwatch-type wearable device that is mounted by winding the casing 2 around the user's arm M in a ring shape with a pair of belts 8a and 8b and measures the amount of heat released from the human body. In the present embodiment, the side (inner side) of the casing 2 and the belts 8a and 8b that contacts the surface of the arm M (hereinafter referred to as the skin surface) is referred to as the back surface, and the side opposite to the back surface (outside) is referred to as the front surface. The electronic device 1 is attached to the user's arm M in a state where the back surface of the housing 2 and the back surfaces of the belts 8a and 8b are in contact with the skin surface.

  The normal direction of the front surface of the housing 2 is a Z-axis direction with the upper side in FIG. Moreover, it is a direction which cross | intersects a Z-axis direction, Comprising: Let the length direction of the arm M be the X-axis direction which makes the near side in FIG. 1 positive. The width direction of the arm M, that is, the extending direction of the belts 8a and 8b, which intersects the Z-axis direction and the X-axis direction, is defined as a Y-axis direction in which the belt 8a side is positive.

  FIG. 2A is a plan view showing a state in which the electronic device 1 is removed from the arm M and placed on a flat surface with the front side facing up. FIG. 2B is a plan view showing a state in which the electronic device 1 is removed from the arm M and placed on a flat surface with the back side facing up.

  As shown in FIG. 2A, the housing 2 includes a display 3 on the front side. Although not shown in detail, the display 3 includes a display device and a touch panel laminated on the display device integrally or separately. Therefore, the display 3 has a function as a display unit 35 (see FIG. 5) for displaying information such as an image to the user, and a function as an operation unit 34 (see FIG. 5) for the user to input various operations. have.

  The housing 2 has an operation button 4 that functions as the operation unit 34 on the side (+ X direction). The number, shape, and location of the operation buttons 4 are not particularly limited. The user can input various operations such as a measurement start operation using the display 3 (touch panel) and the operation buttons 4.

  As shown in FIGS. 2A and 2B, the housing 2 includes a rechargeable battery 5, a control board 6, and a storage medium 7. In addition, the housing 2 may be appropriately provided with a communication device for transmitting the heat flow measurement results to an external device, a reader / writer device for reading and writing the heat flow measurement results to the memory card, and the like. . The charging method for the battery 5 may be, for example, a configuration in which an electrical contact is separately provided on the back side of the housing 2 and charged via a cradle via the electrical contact, or non-contact wireless charging.

  Although not shown, the control board 6 is equipped with a CPU (Central Processing Unit) and an IC (Integrated Circuit). In addition, necessary electronic components such as an ASIC (Application Specific Integrated Circuit) and various integrated circuits can be appropriately mounted on the control board 6. As the storage medium 7, a memory, a hard disk, or the like is used. The electronic device 1 implements various functions such as heat flow measurement by the CPU mounted on the control board 6 executing a program stored in the storage medium 7.

  The belts 8a and 8b extend along the Y-axis direction. The belt 8a is connected to one end side (+ Y direction side) of the housing 2, and the belt 8b is connected to the other end side (−Y direction side) of the housing 2. The belts 8a and 8b are made of a soft resin such as silicone or polyurethane, or a flexible material such as leather or synthetic leather.

  A buckle 9a is attached to the end of the belt 8a opposite to the side connected to the housing 2 (+ Y direction side). A plurality of holes 9b to be engaged with the buckle 9a are provided on the side (−Y direction side) opposite to the side connected to the housing 2 of the belt 8b. One of the plurality of holes 9b engages with the buckle 9a, whereby the belt 8a and the belt 8b are connected. By appropriately selecting the hole 9b that engages with the buckle 9a, the substantial length of the belt 8a, 8b in the mounted state can be adjusted, thereby adjusting the tightening force of the belt 8a, 8b against the arm M. it can.

  Each of the belts 8a and 8b is provided with a heat flow sensor 10 as a heat flow meter. The heat flow sensor 10 is embedded in each of the belts 8a and 8b. In other words, the heat flow sensor 10 penetrates the belts 8a and 8b in the Z-axis direction, the side surfaces (the surfaces in the ± X direction and the surface in the ± Y directions) are joined to the belts 8a and 8b, and the front surface (the surface in the + Z direction). ) And the back surface (surface in the −Z direction) are exposed to the front surface side of the belts 8a and 8b. The heat flow sensor 10 may be attached to the belts 8a and 8b by bonding the side surfaces of the heat flow sensor 10 to the belts 8a and 8b with an adhesive. The heat flow sensor 10 and the belts 8a and 8b are joined together by sewing. May be.

  The heat flow sensor 10 has flexibility and flexibility. The back surface of the heat flow sensor 10 is a surface 10a (FIG. 2B), and the front surface of the heat flow sensor 10 is a surface 10b (see FIG. 2A). The heat flow sensor 10 is curved along the curved surface of the arm M together with the belts 8a and 8b when the electronic device 1 is mounted on the user's arm M, and the surface 10a exposed to the inside of the belts 8a and 8b is the arm M. The surface 10b that is in contact with the surface and exposed to the outside of the belts 8a and 8b is disposed so as to be in contact with the external environment (see FIG. 1).

  The heat flow sensor 10 includes a temperature difference measurement unit 20. Although details will be described later, the temperature difference measuring unit 20 has a function of measuring a temperature difference between the living body surface (in this embodiment, the skin surface of the user) and the outside environment. The electronic device 1 measures the heat flow generated between the skin surface and the external environment based on the measurement result of the temperature difference measurement unit 20 included in the heat flow sensor 10, and measures the amount of heat released from the human body.

  As shown in FIGS. 3 and 4, recesses 2 a that are recessed from the back side to the front side of the housing 2 are provided at both ends in the Y-axis direction of the housing 2. Connection portions 41 for connecting the belts 8a and 8b are provided at both ends of the recess 2a in the X-axis direction. The connection part 41 is comprised with materials, such as a metal which has electroconductivity. The connection part 41 is electrically connected to the control board 6 by the wiring part 43 (see FIG. 3). In addition to the wiring part 43 shown in FIG. 3, a wiring part is provided inside the housing 2. The connection part 41 has a hollow tubular shape, for example.

  The belts 8 a and 8 b have an overhang portion 8 c at an end portion on the side connected to the housing 2. The belts 8a and 8b are connected to the housing 2 in a state where the protruding portions 8c of the belts 8a and 8b are inserted into the recesses 2a of the housing 2 (see FIG. 2B). Connection portions 42 for connecting to the housing 2 are provided at both ends in the X-axis direction of the overhang portion 8c. The connection part 42 is comprised with materials, such as a metal which has electroconductivity. The connection part 42 is electrically connected to the temperature difference measurement part 20 of the heat flow sensor 10 by the wiring part 44 (see FIG. 3). The connection part 42 is, for example, a rod shape, and is configured to be expandable and contractable in the X-axis direction by biasing a spring or the like.

  The housing 2 and the belts 8a and 8b are mechanically connected and electrically connected by the connecting portion 41 and the connecting portion 42. That is, from the state shown in FIGS. 3 and 4, the connecting portion 42 of the belts 8a and 8b is inserted into the protruding portion 8c so that the protruding portion 8c is inserted into the recessed portion 2a of the housing 2, and the connecting portion 42 is The belts 8 a and 8 b are mechanically connected to the housing 2 by being fitted to the tubular connection portion 41.

  Further, the connecting portion 42 is fitted into the connecting portion 41, whereby the connecting portion 42 and the connecting portion 41 are electrically connected. Then, the temperature difference measuring unit 20 of the heat flow sensor 10 provided in the belts 8 a and 8 b is electrically connected to the control board 6 built in the housing 2 through the connection unit 42 and the connection unit 41. .

  The means for mechanically and electrically connecting the housing 2 and the belts 8a and 8b is not limited to the configuration via the connection portion 41 and the connection portion 42 described above. For example, means for electrically connecting with means for mechanically connecting, such as a configuration in which the belts 8a and 8b are fixed to the housing 2 with screws or the like and the flexible boards provided on each are electrically connected to each other. May be configured differently.

  Next, a schematic functional configuration of the electronic apparatus 1 according to the first embodiment will be described with reference to FIG. FIG. 5 is a block diagram illustrating a schematic functional configuration of the electronic apparatus according to the first embodiment. As shown in FIG. 5, the electronic apparatus 1 includes two heat flow sensors 10 provided on the pair of belts 8a and 8b, an operation unit 34, a display unit 35, a control unit 30, and a storage unit provided on the housing 2. 32.

  The operation unit 34 is realized by various switches such as a button switch, a lever switch, and a dial switch, and an input device such as a touch panel, and outputs an operation signal corresponding to the operation input to the control unit 30. In the present embodiment, for example, the operation buttons 4 and the touch panel of the display 3 shown in FIG.

  The display unit 35 is realized by a display device such as a liquid crystal device (LCD) or an organic EL device (Electroluminescence Display), and displays various screens based on display signals input from the control unit 30. indicate. In the present embodiment, for example, the display device of the display 3 shown in FIG.

  The display unit 35 displays the heat flow measurement result and the like. In the present embodiment, for example, the measurement result of the heat flow is a current heat flow display screen or a heat flow change display screen in which the heat flow change is graphed based on past logging data according to the display mode switching operation on the operation unit 34. Is displayed.

  The control unit 30 is a control device and an arithmetic device that collectively control each unit of the electronic device 1. The control unit 30 is realized by a microprocessor such as a CPU (Central Processing Unit) or a GPU (Graphic Processing Unit), an ASIC (Application Specific Integrated Circuit), an FPGA (Field-Programmable Gate Array), or an IC (Integrated Circuit) memory. Is done. In the present embodiment, for example, a CPU mounted on the control board 6 shown in FIG. The control unit 30 includes a heat flow measurement unit 31 that measures the heat flow of the human body based on the measurement result of the heat flow sensor 10.

  The storage unit 32 is realized by various IC memories such as a ROM (Read Only Memory), a flash ROM, and a RAM (Random Access Memory), and a storage medium such as a hard disk. In the present embodiment, for example, the storage medium 7 shown in FIG. The storage unit 32 stores in advance a program for operating the electronic device 1 and realizing various functions provided in the electronic device 1, data used during the execution of the program, etc. Stored temporarily. The storage unit 32 stores a heat flow measurement program 33 for causing the control unit 30 to function as the heat flow measurement unit 31 and executing the heat flow measurement process.

<Measurement principle of heat flow>
Here, the measurement principle of the heat flow performed by the electronic device 1 will be described. In general, an object existing in the atmosphere exchanges heat with surrounding substances and other objects. At this time, the amount of heat per unit time that a certain object emits or flows into the object is called heat flow, and is expressed using units such as [W (= J / s)] and [kcal / min]. .

The heat flow measurement of an object is performed, for example, by installing heat flow sensors at a plurality of locations on the target object and measuring a temperature difference (temperature gradient) generated in the heat flow sensor. This is based on the Fourier law that the heat flow conducted through the object is proportional to the temperature difference existing in the object (the following equation (1)). In the following formula (1), Q represents the heat flow [W (J / s)], A represents the area [m 2 ] of the object, λ represents the thermal conductivity [W / (m × K)], d represents the thickness [m] of the object, and ΔT represents the temperature difference [K] existing in the object.

  Therefore, when targeting the human body, a heat flow sensor is installed on the skin surface, and the temperature difference generated in the heat flow sensor due to heat transfer between the skin surface and the outside environment, for example, due to the heat transfer described above The heat flow can be measured by measuring the temperature difference generated in the heat flow sensor due to heat being taken away from the surface of the heat flow sensor (side facing the outside environment of the heat flow sensor).

  In the electronic device 1 according to the present embodiment, as described above, the belt 8a, 8b in which the heat flow sensor 10 is embedded is wound around the arm M of the human body and attached to the surface 10a exposed to the inside of the belt 8a, 8b. Is in contact with the skin surface, and the surface 10b exposed to the outside of the belts 8a and 8b is disposed in contact with the external environment (see FIG. 1). And the heat flow of a human body can be measured by measuring the temperature difference produced between the surface 10a (skin surface) and the surface 10b (external environment) of the heat flow sensor 10.

<Heat flow sensor>
Next, the configuration of the heat flow sensor according to the first embodiment will be described with reference to FIGS. 6 and 7. FIG. 6 is a perspective view schematically showing the configuration of the heat flow sensor according to the first embodiment. FIG. 7 is a cross-sectional view schematically showing the configuration of the heat flow sensor according to the first embodiment. 6 and 7 show the heat flow sensor 10 in a state in which the electronic device 1 is removed from the arm M and placed on a flat surface, as in FIGS. 2 to 4.

  As shown in FIGS. 6 and 7, the heat flow sensor 10 according to the first embodiment includes a first protective layer 12, a first heat diffusion layer 15, and a conductive layer that are sequentially stacked in the + Z direction from the surface 10 a side. A heat transfer layer 11 as a heat part, a second heat diffusion layer 16, and a second protective layer 13 are provided. The heat flow sensor 10 includes a temperature difference measurement unit 20 incorporated in the heat transfer layer 11.

  The heat transfer layer 11 has a flat plate shape. A surface on the back side (−Z direction side) of the heat transfer layer 11 is defined as a first surface 11a, and a surface on the front side (+ Z direction side) of the heat transfer layer 11 is defined as a second surface 11b. In the heat flow sensor 10, the first heat diffusion layer 15 and the first protective layer 12 are sequentially disposed on the first surface 11 a side of the heat transfer layer 11, and the second heat diffusion layer is disposed on the second surface 11 b side of the heat transfer layer 11. 16 and the second protective layer 13 are arranged in order.

  Between the first protective layer 12 and the first heat diffusion layer 15, between the first heat diffusion layer 15 and the heat transfer layer 11, between the heat transfer layer 11 and the second heat diffusion layer 16, and the second heat. An adhesive layer 14 is disposed and bonded between the diffusion layer 16 and the second protective layer 13. In addition, each layer from the first protective layer 12 to the second protective layer 13 is sewn with a suture thread 17 and adjacent layers are joined to each other.

  The surface of the first protective layer 12 is the surface 10a of the heat flow sensor 10, and the surface of the second protective layer 13 is the surface 10b of the heat flow sensor 10. When the electronic device 1 is mounted on the user's arm M, the heat flow sensor 10 is arranged so that the surface 10a is in contact with the surface (skin surface) of the arm M and the surface 10b is exposed to the external environment. 12 contacts the skin surface and the second protective layer 13 is exposed to the outside environment.

  Hereinafter, the configuration of each part of the heat flow sensor 10 will be described. The heat transfer layer 11 is made of a member having flexibility and good thermal conductivity. More specifically, the heat transfer layer 11 includes a flexible first member and a second member having a higher thermal conductivity than the first member. In the heat transfer layer 11, the second member is dispersed in the first member, and the volume ratio of the second member is smaller than the volume ratio of the first member. Therefore, the heat transfer layer 11 has both flexibility and thermal conductivity.

  As a 1st member used as the base material of the heat-transfer layer 11, materials which have flexibility and a softness | flexibility like rubbers, such as natural rubber and a synthetic rubber, or soft resins, such as a polyurethane and silicone, are used, for example. be able to. As a 2nd member disperse | distributed in the base material of the heat-transfer layer 11, heat conductive fillers, such as carbon black powder, carbon fiber, diamond powder, silicon carbide powder, metal powder, can be used, for example.

  In order to give the heat transfer layer 11 good flexibility and flexibility, the shore hardness of the heat transfer layer 11 (first member) is preferably A50 or less. Shore hardness is measured with a type A durometer defined by JIS K 6253. And in order to generate the temperature difference for measuring a heat flow between the 1st surface 11a and the 2nd surface 11b of the heat-transfer layer 11, the thickness of the heat-transfer layer 11 (1st member) is 0.5 mm. Above, it is preferable that it is 3 mm or less, and it is more preferable that it is 1.0 mm or more and 1.5 mm or less.

  It is desirable that the thickness of the heat transfer layer 11 be as thin as possible within a range where a temperature difference capable of measuring the heat flow can be generated. When the heat transfer layer 11 is thick, the heat flow generated in the thickness direction (Z-axis direction) between the first surface 11a and the second surface 11b leaks in the intersecting direction (X-axis direction and Y-axis direction). There is a risk that heat will increase and errors will occur in the measurement of heat flow.

  Moreover, in order to obtain favorable responsiveness in the measurement of heat flow, the heat conductivity of the heat transfer layer 11 is preferably 10 W / (m × K) or more. The heat conductivity of a general rubber or resin is about 0.1 W / (m × K) to 0.5 W / (m × K), and the heat conductivity of the above-described heat conductive filler is usually 100 W / (m × K) or more. Dispersing the second member (thermal conductive filler) in the first member (base material) made of rubber or resin increases the thermal conductivity of the heat transfer layer 11 and increases the responsiveness when measuring the heat flow. It is done. For example, if the second member is dispersed at a rate of 10% or more with respect to the first member, the heat conductivity of the heat transfer layer 11 can be set to 10 W / (m × K) or more.

  The first heat diffusion layer 15 and the second heat diffusion layer 16 are for making uniform the temperature distribution in each of the first surface 11a and the second surface 11b of the heat transfer layer 11. The thermal conductivity of the first thermal diffusion layer 15 and the second thermal diffusion layer 16 is preferably larger than 100 W / (m × K). When the heat flow is measured by making the temperature distribution in each of the first surface 11a and the second surface 11b of the heat transfer layer 11 more uniform in the first heat diffusion layer 15 and the second heat diffusion layer 16. The heat flow can be measured in a more stable state even if there is a variation caused by the contact state between the heat flow sensor 10 and the skin surface or a variation caused by the temperature distribution on the skin surface.

  Further, the shore hardness of the first heat diffusion layer 15 and the second heat diffusion layer 16 is preferably A50 or less so that the flexibility and flexibility of the heat transfer layer 11 are not impaired. The thickness of the diffusion layer 15 and the second thermal diffusion layer 16 is preferably about 0.1 mm to 0.5 mm. As the material of the first heat diffusion layer 15 and the second heat diffusion layer 16, for example, a carbon-based heat conductive sheet such as a graphite sheet or a carbon sheet, or a metal thin film such as an aluminum sheet or a copper foil can be used. .

  The first protective layer 12 and the second protective layer 13 are for protecting the heat transfer layer 11, the first heat diffusion layer 15, and the second heat diffusion layer 16 from damage due to unexpected contact with other objects. It is. The first protective layer 12 and the second protective layer 13 are made of an organic material such as silicone rubber, for example, and the heat transfer layer 11, the first heat diffusion layer 15, and the second heat diffusion layer 16 are flexible and soft. It is preferable to use those having a Shore hardness of A50 or less so as not to impair the properties. The material of the first protective layer 12 and the second protective layer 13 may be leather or synthetic leather. The thicknesses of the first protective layer 12 and the second protective layer 13 are about 0.1 mm to 0.5 mm so that the first thermal diffusion layer 15 and the second thermal diffusion layer 16 can be protected from damage. preferable.

  As the adhesive layer 14, for example, a known adhesive that can maintain flexibility even after bonding, such as a nitrile rubber adhesive or an acrylic adhesive, can be used. Moreover, you may use the well-known adhesive agent which disperse | distributed heat conductive fillers, such as a metal powder and carbon fiber, to these adhesive agents as the adhesive bond layer 14. FIG. The thickness of the adhesive layer 14 is preferably 0.1 mm or less. The thickness of the adhesive layer 14 is preferably as thin as possible within a range where the adhesive force can be maintained so as not to impair the flexibility and softness of the entire heat flow sensor 10.

  The suture thread 17 includes a heat transfer layer 11, a first heat diffusion layer 15 and a first protective layer 12 that are bonded and laminated on the first surface 11 a side of the heat transfer layer 11 with an adhesive layer 14, and the heat transfer layer 11. The second heat diffusion layer 16 and the second protective layer 13 which are bonded and laminated with the adhesive layer 14 on the second surface 11b side are penetrated and stitched. By stitching with the suture thread 17, the bonding between the layers by the adhesive layer 14 becomes difficult to peel off. As the suture thread 17, for example, synthetic fibers such as polyester and nylon, or natural fibers such as cotton and hemp can be used.

  By stitching with the suture thread 17, it is possible to mechanically reinforce the bonding between the respective layers without impairing the flexibility and flexibility of the entire heat flow sensor 10. In order to avoid the temperature difference measuring unit 20 incorporated in the heat transfer layer 11, the position where the suture 17 in the heat flow sensor 10 is sewn is preferably the outer edge portion of the heat flow sensor 10 (see FIG. 6). Note that the adhesive layer 14 may be omitted when reliable adhesion and adhesion of each layer of the heat flow sensor 10 is ensured by sewing with the suture thread 17.

  The temperature difference measurement unit 20 is a temperature difference output element embedded in the heat transfer layer 11 and is configured by, for example, a thermopile. A thermocouple (thermocouple) 24 in which both ends of two different kinds of metal conductors 22 and 23 are joined, the hot junction and the cold junction are the first surface 11a (skin surface side) and the second surface of the heat transfer layer 11, respectively. The temperature difference measuring unit 20 (thermopile) is configured by connecting a plurality of the terminals in series so as to be positioned at 11b (external environment side). As the metal conductors 22 and 23, for example, alumel and chromel, copper and constantan, or the like can be used.

  The heat of the skin surface is transmitted to the first surface 11a of the heat transfer layer 11 via the first heat diffusion layer 15 and the first protective layer 12, and the second heat diffusion layer is transmitted from the second surface 11b of the heat transfer layer 11. Heat is released to the outside environment through 16 and the second protective layer 13. The temperature difference measuring unit 20 outputs the temperature difference between the first surface 11a and the second surface 11b of the heat transfer layer 11, that is, between the hot junction and the cold junction as a voltage signal. Therefore, the voltage value detected by the voltmeter 25 is output to the control unit 30 as a measurement result of the temperature difference measurement unit 20 (see FIG. 7). In the control unit 30, the heat flow measurement unit 31 (see FIG. 5) performs a process of measuring the heat flow released from the human body (skin surface) based on the measurement result of the temperature difference measurement unit 20.

  The temperature difference measuring unit 20 according to the present embodiment is composed of a thermopile in which a plurality of thermocouples 24 are connected in series. Therefore, the temperature difference measuring unit 20 measures the temperature difference based on the temperature information at a plurality of points on the first surface 11a of the heat transfer layer 11 and the temperature information at the plurality of points on the second surface 11b. Thus, since the temperature difference can be measured at a plurality of locations in the surface 10a where the heat flow sensor 10 contacts the skin surface, a more average value can be obtained as compared with the case where the temperature difference is measured at only one location. . Then, by connecting a plurality of thermocouples 24 in series, a larger voltage signal can be output as compared with the case where there is only one thermocouple 24, so the heat flow can be measured more accurately.

  By the way, in order to accurately measure the heat (heat radiation amount) released from the human body, it is necessary to transfer the heat of the skin surface to the heat flow sensor without loss. In the electronic device described in Patent Document 1, since the heat flow sensor itself does not have flexibility, an attachment made of metal having flexibility and good heat conductivity is brought into contact with the skin surface, and the attachment is made. It is structured to transmit the heat of the skin surface to the heat flow sensor through the. However, in such a structure, since a part of the heat flows out to other members before the heat from the skin surface is transmitted to the heat flow sensor, an error occurs in the measurement of the heat flow, and the amount of heat released from the human body. The measurement accuracy will be reduced.

  Therefore, in order to measure the heat flow so as not to cause an error, it is desirable to suppress the heat transfer loss by directly contacting the heat flow sensor with the skin surface. However, since the conventional heat flow sensor is configured with a hard material as a base material, the heat flow sensor does not have flexibility, and such a heat flow sensor that does not have flexibility is like a human body (arm M). When contacting with an object formed of a curved surface, an air layer is easily generated between the heat flow sensor and the skin surface.

  Here, in general, the heat flow sensor outputs a heat flow (temperature difference) detected over the entire area in contact with the object (skin surface) as one voltage signal. As shown in the above formula (1), the heat flow Q is proportional to the area A of the object. Therefore, when the contact area between the heat flow sensor and the object decreases, the heat flow measured by the heat flow sensor also decreases.

  For this reason, when an air layer is formed in a portion between the heat flow sensor and the skin surface, the substantial contact area between the heat flow sensor and the skin surface is reduced only in the portion where the air layer is formed, and less heat is transferred to the heat flow sensor. Therefore, the heat flow measured by the heat flow sensor is smaller than the heat flow actually generated. Also, if the contact area between the heat flow sensor and the skin surface changes when the wearer moves or moves the arm due to the air layer, the heat flow measured by the heat flow sensor also changes. . As a result, in the heat flow sensor that does not have flexibility, an error occurs in the measurement of the heat flow, and the measurement accuracy of the heat radiation amount from the human body is lowered.

  In the electronic device 1 according to the present embodiment, the heat flow sensor 10 directly contacts the skin surface. Since the heat flow sensor 10 has flexibility and flexibility, when the electronic device 1 is attached to an object formed of a curved surface such as a human body, the heat flow sensor 10 is bent along the surface of the arm M. Fits the skin surface. Therefore, the adhesion to the skin surface is improved and an air layer is less likely to be generated between the heat flow sensor 10 and the skin surface, so that the reduction of the contact area can be suppressed and the fluctuation of the contact area can also be suppressed. As a result, an error in measurement of the heat flow generated between the skin surface and the external environment can be reduced, so that the heat flow of the human body can be accurately measured.

  In order to measure the heat flow of the human body with high accuracy by the heat flow sensor 10, the belts 8a and 8b in which the heat flow sensor 10 is embedded are made of a material having lower thermal conductivity than the heat flow sensor 10 (heat transfer layer 11). It is desirable. This is because the heat transmitted in the thickness direction of the heat flow sensor 10 flows out from the contact portion with the heat flow sensor 10 to the belts 8a and 8b in the direction intersecting the thickness direction of the heat flow sensor 10 to measure the heat flow. This is to prevent an error from occurring. The thermal conductivity of the belts 8a and 8b is preferably smaller than 1 W / (m × K).

  The belts 8a and 8b are preferably made of a material that is the same as or more flexible than the heat flow sensor 10. This is because when the electronic device 1 is mounted on the human body (arm M) by the belts 8a and 8b, the heat flow sensor 10 is brought into good contact with an object formed of a curved surface such as the human body (arm M). . The Shore hardness of the belts 8a and 8b is preferably A50 or less.

(Second Embodiment)
In the second embodiment, the overall configuration of the electronic device 1 is substantially the same as that of the first embodiment, but the configuration of the temperature difference measurement unit in the heat flow sensor is different. Here, the difference between the configuration of the heat flow sensor (temperature difference measurement unit) according to the second embodiment and the first embodiment will be described.

<Heat flow sensor>
A heat flow sensor according to the second embodiment will be described with reference to FIGS. 8 and 9. FIG. 8 is a perspective view schematically showing the configuration of the heat flow sensor according to the second embodiment. FIG. 9 is a cross-sectional view schematically showing the configuration of the heat flow sensor according to the second embodiment. The same components as those of the first embodiment are denoted by the same reference numerals, and description thereof is omitted.

  As shown in FIGS. 8 and 9, the heat flow sensor 50 according to the second embodiment has a surface 50 a that contacts the skin surface and a surface 50 b that contacts the external environment. The heat flow sensor 50 includes a first protective layer 12, a first thermal diffusion layer 15, a heat transfer layer 11, a second thermal diffusion layer 16, and a second protective layer, which are sequentially stacked in the + Z direction from the surface 50a side. 13. The heat flow sensor 50 includes a temperature difference measurement unit 20 </ b> A incorporated in the heat transfer layer 11.

  The temperature difference measurement unit 20A is opposed to the temperature element 26 disposed on the first surface 11a (skin surface side) of the heat transfer layer 11 and the temperature element 26 on the second surface 11b (external environment side) of the heat transfer layer 11. And a differential amplifier 28 (see FIG. 9) that differentially amplifies the output temperature of the temperature element 26 and the output temperature of the temperature element 27. The temperature difference measurement unit 20A outputs the temperature difference between the first surface 11a and the second surface 11b of the heat transfer layer 11 to the control unit 30 (see FIG. 9) as a measurement result. For the temperature elements 26 and 27, a thermistor, a thermocouple, or the like can be used.

In the control unit 30, the heat flow measurement unit 31 (see FIG. 5) performs a process of measuring the heat flow of the human body according to the following equation (2) using the measurement result from the temperature difference measurement unit 20A. In the following formula (2), Q represents the heat flow [W (J / s)], A represents the area [m 2 ] of the object, λ represents the thermal conductivity [W / (m × K)], d represents the thickness [m] of the object. Ta represents the output temperature [K] of the temperature element 26, and Tb represents the output temperature [K] of the temperature element 27.

  Even when the heat flow sensor 50 according to the second embodiment is embedded in the belts 8a and 8b and used in the electronic apparatus 1, the heat flow sensor 50 having flexibility and flexibility is applied to the skin as in the first embodiment. Direct contact with the surface. Therefore, since the heat flow generated between the skin surface and the external environment can be measured with high accuracy, the heat flow of the human body can be measured with high accuracy.

  When the heat flow sensor 10 (temperature difference measurement unit 20) according to the first embodiment is compared with the heat flow sensor 50 (temperature difference measurement unit 20A) according to the second embodiment, the heat flow sensor 10 (temperature) using a thermopile. The difference measuring unit 20) can be made thinner and easier to process. Further, since the heat flow sensor 10 (temperature difference measuring unit 20) can measure temperature differences at a plurality of locations and can output a large output signal (voltage signal), the heat flow can be measured more accurately.

  The above-described embodiments merely show one aspect of the present invention, and can be arbitrarily modified and applied within the scope of the present invention. As modifications, for example, the following can be considered.

(Modification 1)
In the above embodiment, the heat flow sensors 10 and 50 are embedded in a part of the extending direction of the belts 8a and 8b. However, the heat flow sensors 10 and 50 are embedded in the entire extending direction of the belts 8a and 8b. It is good also as a structure. With such a configuration, the area in which the heat flow sensors 10 and 50 are in contact with the peripheral surface of the arm M becomes larger, so that the measurement accuracy of the heat flow of the human body can be further improved.

(Modification 2)
In the above embodiment, in order to attach the electronic device 1 to the arm M of the human body, the belts 8a and 8b for engaging the buckle 9a and the hole 9b are used. Instead of the belts 8a and 8b, a belt or a Velcro tape (registered trademark) that does not have a hole and is fixed with a buckle may be used.

(Modification 3)
In the above embodiment, the electronic device 1 is mounted on the arm M of the human body, but the portion on which the electronic device 1 is mounted is not limited to the arm M. For example, it is good also as a structure mounted | worn to parts, such as an upper arm, abdomen, a thigh, a calf, an ankle, a neck, a head. In that case, the belts 8a and 8b may be elongated, or a part of the belts 8a and 8b may be made of a stretchable material. In addition, the belts 8a and 8b in which the heat flow sensors 10 and 50 are embedded may be used by being removed from the electronic apparatus 1, or the heat flow sensors 10 and 50 having a length and width suitable for the measurement site are separately prepared. It is good. Note that the measurement target is not limited to the human body, and may be, for example, an animal body, a trunk or branch of a plant, another artificial object such as a utility pole or pole, and the like.

(Modification 4)
In the said embodiment, although the heat flow meter which measures the heat flow of a human body was illustrated as the electronic device 1, this invention is not limited to such a form. For example, the present invention may be applied to a calorimeter, calorie consumption meter, metabolic meter, metabolic function measuring device, autonomic nerve function measuring device, or the like. Further, the present invention may be applied to sports equipment that measures the amount of heat generated by muscles, watching equipment for climbers, elderly people, children, and the like, toys that reflect the measurement result of biological information in events in a virtual space, and the like.

  DESCRIPTION OF SYMBOLS 1 ... Electronic device, 2 ... Case, 8a, 8b ... Belt, 10, 50 ... Heat flow sensor (heat flow meter), 11 ... Heat transfer layer (heat transfer part), 11a ... 1st surface, 11b ... 2nd surface, DESCRIPTION OF SYMBOLS 12 ... 1st protective layer (protective layer), 13 ... 2nd protective layer (protective layer), 15 ... 1st thermal diffusion layer (thermal diffusion layer) 16 ... 2nd thermal diffusion layer (thermal diffusion layer), 20, 20A ... temperature difference measurement unit, 30 ... control unit.

Claims (11)

  1. A heat transfer section having a first surface and a second surface facing each other and having flexibility;
    A heat flow meter, comprising: a temperature difference measurement unit that measures a temperature difference between the first surface and the second surface of the heat transfer unit.
  2. The heat flow meter according to claim 1,
    The heat transfer section includes a flexible first member and a second member having a higher thermal conductivity than the first member.
  3. The heat flow meter according to claim 1 or 2,
    The thickness of the heat transfer part is 0.5 mm or more, the thermal conductivity of the heat transfer part is 10 W / (m × K) or more, and the Shore hardness of the heat transfer part is A50 or less. Characteristic heat flow meter.
  4. The heat flow meter according to claim 3,
    A heat flow meter having a thermal diffusion layer having a thermal conductivity greater than 100 W / (m × K) disposed on the first surface.
  5. The heat flow meter according to claim 4,
    A heat flow meter characterized in that the Shore hardness of the heat diffusion layer is A50 or less.
  6. The heat flow meter according to claim 4 or 5,
    A heat flow meter, wherein a protective layer made of an organic material is disposed on the surface of the heat diffusion layer.
  7. The heat flow meter according to claim 6,
    The protective layer has a Shore hardness of A50 or less.
  8. The heat flow meter according to claim 6 or 7,
    The heat flow meter, wherein the heat transfer section, the heat diffusion layer, and the protective layer are joined together by sewing.
  9. A heat flow meter according to any one of claims 1 to 8,
    The temperature difference measuring unit measures a temperature difference based on temperature information on a plurality of points on the first surface and temperature information on a plurality of points on the second surface.
  10. Temperature difference measurement for measuring the temperature difference between the first surface and the second surface of the heat transfer portion, and the heat transfer portion having the first surface and the second surface facing each other and having flexibility. A belt fitted with a heat flow meter comprising:
    A housing connected to the belt, and a control unit installed in the housing,
    The electronic device, wherein the control unit controls the heat flow meter.
  11. The electronic device according to claim 10,
    The electronic device according to claim 1, wherein a thermal conductivity of the belt is lower than a thermal conductivity of the heat transfer section.
JP2015037885A 2015-02-27 2015-02-27 Heat flowmeter and electronic apparatus Pending JP2016161311A (en)

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US15/053,531 US10260965B2 (en) 2015-02-27 2016-02-25 Heat flow meter and electronic device
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Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
RU169152U1 (en) * 2016-10-27 2017-03-07 Федеральное государственное автономное образовательное учреждение высшего образования "Сибирский федеральный университет" Stand for modeling heat exchange of hot materials transported by conveyors

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2017120224A (en) * 2015-12-28 2017-07-06 セイコーエプソン株式会社 Internal temperature measurement device, list wearable device and internal temperature measurement method

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS57183832A (en) * 1981-05-01 1982-11-12 Terumo Corp Heat stream density measuring apparatus of live doby surface
JPS61135239U (en) * 1985-02-13 1986-08-23
JPS61165436U (en) * 1985-04-01 1986-10-14
JP2007208262A (en) * 2006-02-03 2007-08-16 Samsung Electronics Co Ltd Micro heat flux sensor array

Family Cites Families (17)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4541728A (en) * 1983-07-25 1985-09-17 Ray L. Hauser Device and method for measuring heat flux and method for forming such a device
US5524618A (en) 1993-06-02 1996-06-11 Pottgen; Paul A. Method and apparatus for measuring heat flow
CN1255078C (en) * 1996-06-12 2006-05-10 精工爱普生株式会社 Thermometer
US6238354B1 (en) * 1999-07-23 2001-05-29 Martin A. Alvarez Temperature monitoring assembly
JP5051767B2 (en) 2004-03-22 2012-10-17 ボディーメディア インコーポレイテッド Device for monitoring human condition parameters
US7020508B2 (en) 2002-08-22 2006-03-28 Bodymedia, Inc. Apparatus for detecting human physiological and contextual information
CA2538940A1 (en) * 2006-03-03 2006-06-22 James W. Haslett Bandage with sensors
US7765811B2 (en) * 2007-06-29 2010-08-03 Laird Technologies, Inc. Flexible assemblies with integrated thermoelectric modules suitable for use in extracting power from or dissipating heat from fluid conduits
RU2506890C2 (en) 2008-05-23 2014-02-20 Конинклейке Филипс Электроникс Н.В. Substrate for support of sensors, executive elements or electric components
US7942825B2 (en) * 2008-06-09 2011-05-17 Kimberly-Clark Worldwide Inc. Method and device for monitoring thermal stress
US20100198322A1 (en) * 2009-02-05 2010-08-05 Disney Enterprises, Inc. Personal temperature regulator
BRPI1006559A2 (en) 2009-04-06 2019-09-17 Koninl Philips Electronics Nv temperature sensor for body temperature measurement and clothing
US20130087180A1 (en) * 2011-10-10 2013-04-11 Perpetua Power Source Technologies, Inc. Wearable thermoelectric generator system
JP6081983B2 (en) * 2012-02-14 2017-02-15 テルモ株式会社 Thermometer and body temperature measurement system
JP2016057198A (en) 2014-09-10 2016-04-21 セイコーエプソン株式会社 Heat flow measurement device and metabolism measurement device
US20160163949A1 (en) * 2014-12-03 2016-06-09 Perpetua Power Source Technologies Flexible thermoelectric generator
JP2016133484A (en) 2015-01-22 2016-07-25 セイコーエプソン株式会社 Heat flow sensor and electronic apparatus

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS57183832A (en) * 1981-05-01 1982-11-12 Terumo Corp Heat stream density measuring apparatus of live doby surface
JPS61135239U (en) * 1985-02-13 1986-08-23
JPS61165436U (en) * 1985-04-01 1986-10-14
JP2007208262A (en) * 2006-02-03 2007-08-16 Samsung Electronics Co Ltd Micro heat flux sensor array

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
RU169152U1 (en) * 2016-10-27 2017-03-07 Федеральное государственное автономное образовательное учреждение высшего образования "Сибирский федеральный университет" Stand for modeling heat exchange of hot materials transported by conveyors

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