JP2016157700A - Light source substrate support member - Google Patents

Light source substrate support member Download PDF

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Publication number
JP2016157700A
JP2016157700A JP2016090074A JP2016090074A JP2016157700A JP 2016157700 A JP2016157700 A JP 2016157700A JP 2016090074 A JP2016090074 A JP 2016090074A JP 2016090074 A JP2016090074 A JP 2016090074A JP 2016157700 A JP2016157700 A JP 2016157700A
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Japan
Prior art keywords
led
light source
portion
support member
side
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JP2016090074A
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JP6407915B2 (en
Inventor
野口 卓志
Takushi Noguchi
卓志 野口
広巳 村松
Hiroshi Muramatsu
広巳 村松
昌寛 石田
Masahiro Ishida
昌寛 石田
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三菱電機照明株式会社
Mitsubishi Electric Corp
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Abstract

PROBLEM TO BE SOLVED: To efficiently radiate heat which is emitted by a light source by flowing air in a direction crossing a fin.SOLUTION: An LED substrate support member 110 includes a metal heat sink 112 formed on the opposite side from an LED 210, with a flat surface part on which an LED substrate 200 having the LED 210 is mounted being a reference. The metal heat sink 112 has a heat radiation fin 1121 formed on a back surface side, which is the opposite side from the irradiation side on which the light from the LED 210 is radiated. On the radiation fin 1121, a notch part 1123 which is partially cut is formed.SELECTED DRAWING: Figure 1

Description

  The present invention relates to an LED module including an LED substrate, and more particularly to an LED line module including a line-shaped LED substrate including a plurality of LEDs.

As a conventional technique, there is a linear light source device in which a plurality of LED chips are arranged on a metal base substrate at a predetermined interval (see Patent Document 1).
Further, there is an LED line module on which an LED substrate is mounted, and there is an LED line module in which a heat sink and a reflective surface are configured as individual independent parts (see Patent Document 2).

Japanese Patent Laid-Open No. 2007-150080 Japanese Patent No. 4328379 Registered Utility Model No. 3134432 Registered Utility Model No. 3148721 International Publication No. 2009/61124 Registered Utility Model No. 3150997 Japanese Patent No. 476960 JP 2003-92022 A US Patent Application Publication No. 2005/0270774

  The prior art is an LED line module that assumes an LED backlight. Since a plurality of LED chips are installed on a metal base to form a metal base substrate, there is a problem that a line-type LED substrate cannot be mounted.

  Moreover, in the LED line module in which the heat sink and the reflective surface are configured as individual independent parts, there is a problem that the number of parts increases and costs increase.

  The present invention has been made to solve the above-described problems, and provides an LED line module in which a reflective surface and a heat sink are integrally formed and an LED line substrate can be detachably attached. Objective.

  The light source substrate supporting member according to the present invention is a light source substrate supporting member having a heat radiating portion formed on the opposite side of the light source with reference to a plane portion on which a light source substrate having a light source is mounted. The part has a fin formed on the back side opposite to the irradiation side irradiated with light from the light source, and the fin has a notch part that is partially cut out.

  According to the light source substrate support member according to the present invention, the heat radiating portion has fins formed on the back side of the light source, and the fins are formed with partially cutout portions. Air can flow in the direction across the fins, and the heat generated by the light source can be efficiently radiated.

1A is a plan view of the LED line module according to Embodiment 1 (a view seen from the irradiation direction side of the light source, as viewed from the arrow A), and FIG. FIG. 1B is a side view of the LED line module, and FIG. 1B-1 is an end view of the LED line module according to the first embodiment, and FIG. 1C is the first embodiment. It is a rear view (C arrow line view) of the LED line module which concerns on. It is a figure which shows the detail of the end elevation of the LED line module which concerns on Embodiment 1. FIG. 3 is a plan view of an LED substrate support member provided in the LED line module according to Embodiment 1. FIG. FIG. 3 is a plan view showing a state in which the LED substrate is mounted on the LED substrate support member according to Embodiment 1. FIG. 3 is a diagram illustrating a dimensional relationship of each part of an end face of the LED line module according to Embodiment 1.

Embodiment 1 FIG.
FIG. 1A is a plan view of the LED line module 100 according to the present embodiment (a view seen from the irradiation direction side of the light source, a view from the arrow A), and FIG. FIG. 1B is a side view of the LED line module 100 (B arrow view), FIG. 1B-1 is an end view of the LED line module 100, and FIG. 1C is a rear view of the LED line module 100. (Arrow view). FIG. 2 is a diagram showing details of an end view of the LED line module 100 according to the present embodiment. FIG. 3 is a plan view of the LED substrate support member 110 included in the LED line module 100 according to the present embodiment. FIG. 4 is a plan view showing a state in which the LED substrate 200 is mounted on the LED substrate support member 110 according to the present embodiment. FIG. 5 is a diagram showing the relationship of dimensions of each part of the end face of the LED line module 100 according to the present embodiment.

  The configuration of the LED line module 100 according to the present embodiment will be described with reference to FIGS. Here, the end view shown in FIG. 2 is substantially line symmetric with respect to the irradiation direction substantially center line 1138. Moreover, the cross section orthogonal to the longitudinal direction of the LED line module 100 which concerns on this Embodiment shall be substantially the same as the end elevation shown in FIG.

  The LED line module 100 is an example of a light source module including an LED substrate support member 110 (an example of a light source substrate support member) that supports an LED substrate 200 (an example of a light source substrate) having LEDs 210 (an example of a light source). In the present embodiment, a line-type LED substrate including a plurality of LEDs 210 is assumed as the LED substrate 200. Therefore, the LED line module 100 is an LED module on which a line-shaped LED substrate 200 can be mounted.

  As shown in FIGS. 1A to 1C, the LED line module 100 has a substantially cylindrical shape that is long in the longitudinal direction. FIG. 2 is a diagram showing details of an end view of the LED line module 100 shown in FIG.

  As shown in FIG. 2, the LED line module 100 includes an LED board support member 110, an LED board 200 housed in the LED board support member 110, and an LED 210 installed (mounted) on the LED board 200. And a resin cover 120 attached to the substrate support member 110.

  The LED substrate support member 110 is a substrate storage portion 113 (an example of a groove) that opens on the irradiation direction P side of the LED 210, and a pair of guide portions 1137 that store the substrate side portions 201 that are the side portions on both sides of the LED substrate 200. A substrate storage portion 113 having

  The LED substrate support member 110 includes a reflecting portion 111 formed on the irradiation direction P side from an edge portion 1133 of an opening (hereinafter referred to as an opening portion 1131) of the substrate housing portion 113. The LED board support member 110 is formed on the opposite side of the irradiation direction P side (the back side of the LED board 200, hereinafter referred to as the back side Q), and the metal heat sink 112 (dissipates heat generated by the LED board 200). An example of a heat radiating part is provided.

  The LED substrate support member 110 is integrally formed of a metal such as aluminum, for example. The LED substrate support member 110 has a substantially semi-cylindrical shape (kamaboko shape) in a cross section perpendicular to the longitudinal direction (slide direction (see FIGS. 1 and 3)). The LED substrate support member 110 has a semi-cylindrical arc-shaped portion on the back surface direction Q side, and heat radiation fins 1121 constituting the metal heat sink 112 are formed radially. The metal heat sink 112 will be described later.

  In addition, the LED substrate support member 110 is a planar portion (hereinafter also referred to as a plane portion) having a semi-cylindrical shape on the irradiation direction P side. A reflecting portion 111 that reflects is formed. FIG. 3 is a view of the LED substrate support member 110 viewed from the irradiation direction P. That is, FIG. 3 is a diagram showing a planar portion of the LED substrate support member 110. The planar portion of the LED substrate support member 110 in FIG. 3 is a substantially rectangular shape that is long in the longitudinal direction and short in the lateral direction. A side portion along the longitudinal direction is referred to as a member side portion.

  The resin cover will be described. The material of the resin cover 120 is an acrylic resin or the like that is lighter than glass and is hard to break. As shown in FIG. 2, the resin cover 120 has a substantially semi-cylindrical shape that covers the planar portion of the LED substrate support member 110. The resin cover 120 is attached to the LED board support member 110 such that the opening part of the resin cover 120 (opening part facing the arc-shaped part) is covered with the flat part of the LED board support member 110. Cover protrusions 121 that engage with cover attachment portions 114 (an example of a cover attachment guide portion) formed on the LED substrate support member 110 are formed on the side edges 122 on both sides of the resin cover 120. The cover protrusion 121 is a protrusion formed to bend the ends of the side edges 122 on both sides of the resin cover inward. The resin cover 120 is attached to the LED substrate support member 110 by fitting the cover protrusion 121 to the cover attachment portion 114 which is a groove provided on the member side portion of the LED substrate support member 110.

  That is, the LED substrate support member 110 is a cover attachment portion 114 (cover attachment guide portion) to which the resin cover 120 is attached, and slides the cover protrusions 121 formed on both sides (side sides 122) of the resin cover 120. The cover attaching part 114 to be attached is provided.

  When the resin cover 120 is attached to the LED substrate support member 110, the cross section (end face) orthogonal to the longitudinal direction becomes substantially circular as shown in FIG. 2, and the LED line module 100 becomes substantially cylindrical. Thus, since the cross section orthogonal to the substrate storage part 113 (groove part) is substantially circular, it can be used as a line-type LED illumination that replaces a conventional line-type fluorescent lamp.

  In FIG. 2, the resin cover 120 has a substantially semicircular shape, and the side edges 122 on both sides are disposed on the plane portion of the LED substrate support member 110. For example, the shape of the resin cover 120 may be a shape in which the side edges 122 on both sides of the resin cover 120 are arranged closer to the back surface Q side than the surface of the planar portion of the LED substrate support member 110. That is, the side 122 on both sides of the resin cover 120 is shaped to reach the vicinity of the radiation fins 1121a and 1121e (see FIG. 5). The semicircular shape has an arc shape with a central angle of about 180 °, but in this case, it has an arc shape of about 240 ° (or about 190 ° or more and about 250 ° or less). Thereby, a part of the metal heat sink 112 is covered in the vicinity of the side edges 122 on both sides of the resin cover 120, the aesthetic appearance is improved, and the usability is further improved as an alternative to a fluorescent lamp.

  Next, the substrate storage unit 113 will be described. The substrate storage portion 113 formed on the LED substrate support member 110 is a groove portion that opens on the irradiation direction P side, and has a pair of guide portions 1137 for storing the substrate side portions 201 that are the side portions on both sides of the LED substrate 200. It is a groove. Moreover, the board | substrate storage part 113 is extended to the both end surfaces (end surface 115 of both sides) of the LED board support member 110. FIG. In other words, the substrate storage portion 113 is a through-hole formed so as to penetrate to both end faces of the LED substrate support member 110, and is an opening portion 1131 that opens linearly along the longitudinal direction on the irradiation direction P side (FIG. 3). A through hole having a reference).

  The substrate storage portion 113 includes a bottom surface 1134 of the groove portion, a pair of side walls 1135 that are side walls on both sides of the groove portion, and a pair of top surfaces formed on both sides of the opening 1131 with the upper surface portion 1136 facing the bottom surface 1134. Part 1136. In the substrate storage portion 113, a portion surrounded by the bottom surface 1134, one side wall 1135, and one upper surface portion 1136 is a guide portion 1137. The guide part 1137 exists on both sides of the opening 1131 and is an example of a pair of guide parts.

  When the LED substrate 200 is accommodated in the substrate accommodating portion 113 of the LED substrate supporting member 110, the side portions (substrate side portion 201) on both sides of the LED substrate 200 are slid on the guide portions 1137 of the substrate accommodating portion 113. The LED substrate 200 is accommodated in the substrate accommodating portion 113.

  Since the board storage portion 113 extends to the end faces 115 (both end faces) on both sides of the LED board support member 110, end face openings opened by the board storage section 113 on the both end faces 115 of the LED board support member 110. A portion 1151 (an example of a guide opening) is formed (see FIG. 2). That is, the pair of guide portions 1137 of the substrate storage portion 113 extends to both end surfaces 115 to form a pair of end surface openings 1151 on the both end surfaces 115. The board side parts 201 on both sides of the LED board 200 are inserted from the end face opening parts 1151 formed on either one of the end faces 115 of both sides, and slide the guide part 1137, whereby the board storage part 131. It is stored in a pair of guide portions 1137.

  As shown in FIGS. 2 and 4, when the LED substrate 200 is accommodated in the substrate accommodating portion 113 of the LED substrate supporting member 110, the LED 210 attached to the LED substrate 200 is exposed from the opening portion 1131 to the irradiation direction P side. Is located. When the LED substrate 200 is accommodated in the substrate accommodating portion 113, a plurality of LEDs 210 (six LEDs 210 in FIG. 4) are arranged in the opening portion 1131 in the longitudinal direction. As shown in FIG. 2, the LED 210 is located in the vicinity of a portion sandwiched between the edge portions 1133 on both sides of the opening portion 1131 of the substrate storage portion 113. Or LED210 is located in the irradiation direction P side a little rather than the part pinched | interposed into the edge part 1133 of the both sides of the opening part 1131. FIG. That is, it is preferable that the LED 210 is disposed at a position where the edge 1133 of the opening 1131 does not block the light emitted by the LED 210. Therefore, the LED board support member 110 designs the board storage part 113 in consideration of the height of the LED board 200, the height of the LED 210 (LED chip), the width of the LED 210 (LED chip), and the like. It is preferable to determine dimensions (width, height, thickness, length, etc.) of the bottom surface 1134, the side wall 1135, the top surface portion 1136, the opening portion 1131, the edge portion 1133, and the like.

  As shown in FIG. 4, the LED substrate 200 is configured such that the distance between the two LEDs 210 (distance connecting the approximate center of one LED 210 to the approximate center of the other LED 210) is 2L, The distance from the end portion (end surface 115) of the substrate support member 110 is preferably L. This is because even when a plurality of LED line modules 100 are connected, the distance between the LEDs 10 is uniform.

  Next, the reflection unit 111 will be described. As shown in FIG. 2, the reflection portion 111 is a reflection surface formed on the irradiation direction P side from the edge portions 1133 on both sides of the opening portion 1131. The surface of the reflecting portion 111 is inclined so as to gradually go in the irradiation direction P from the edge 1133 side (center side) toward the outside (resin cover 120 side). That is, the reflecting portion 111 has an inverted eight-shaped cross section. Thereby, the light emitted from the LED 210 is reflected by the reflecting portion 111 and irradiated in the irradiation direction P. Thus, since the reflection part 111 is integrally formed with the LED board support member 110, the light extraction efficiency can be improved with a small number of components.

  Next, the metal heat sink 112 (heat radiation part) will be described. The metal heat sink 112 (heat dissipating part) includes a plurality of heat dissipating fins 1121 extending on the opposite side of the irradiation direction P side (back surface direction Q side). The radiation fins 1121 are formed to extend to the end surfaces 115 on both sides of the LED substrate support member 110 (see FIGS. 1B and 1C).

  Each radiating fin 1121 of the plurality of radiating fins extends in a substantially radial direction with a substantially central line 1132 (see FIGS. 2 and 3) in the width direction of the bottom surface 1134 of the substrate housing portion 113 as a central axis.

  FIG. 5 is a diagram showing the relationship of the dimensions of each part of the end face of the LED line module 100 of the present embodiment. In the present embodiment, as shown in FIG. 5, five radiating fins 1121 a to 1121 e are formed to extend radially about the center line 1132 as a central axis. Further, the five heat dissipating fins 1121a to 1121e have substantially the same length L5.

  The angle between the plane portion of the LED substrate support member 110 and the radiation fin 1121a is θ1, the angle between the radiation fin 1121a and the radiation fin 1121b is θ2, the angle between the radiation fin 1121b and the radiation fin 1121c is θ3, and the radiation fin 1121c. The angle between the heat dissipating fin 1121d is θ4, the angle between the heat dissipating fin 1121d and the heat dissipating fin 1121e is θ5, and the angle between the heat dissipating fin 1121e and the plane portion of the LED substrate support member 110 is θ6. Here, it is preferable to make the angles of θ1 to θ6 substantially uniform. That is, θ1 (≈θ2≈θ3≈θ4≈θ5≈θ6) ≈30 ° is preferable. This is because the heat dissipation efficiency of the metal heat sink 112 becomes uniform, leading to an improvement in the heat dissipation efficiency. However, the heat radiation efficiency can be further improved by changing the angles of θ1 to θ6 depending on the flow of the air current in the vicinity of the metal heat sink 112 due to the installation location of the LED line module 100 or the like. For example, θ1≈θ6≈50 ° may be set, and θ2≈θ3≈θ4≈θ5≈20 ° may be set. Alternatively, θ1≈50 ° and θ2≈θ3≈θ4≈θ5≈θ6≈26 ° may be set. Further, the number of the radiation fins 1121 may not be five. For example, the number of radiating fins 1121 may be three, seven, or other number.

  The cross section of the LED line module 100 is the same as the end view shown in FIG. Here, as shown in FIG. 2, the radius L1 of the semi-cylindrical resin cover 120 and 1/2 of the width of the LED substrate support member 110, that is, the distance (shortest distance) from the substantially center line to the side of the member. L2 and the distance (shortest distance) L3 from the substantially center line 1132 to the tip of the radiation fin 1121 are substantially equal. Thereby, the cross section of the LED line module 100 becomes a substantially circular shape with a radius L1 (≈L2≈L3).

  As shown in FIG. 5, the ratio of L1: L2: L3 is about 1: 1: 1. For example, by setting the ratio of L1: L2: L3 to about 2: 3: 2, the LED line module 100 having a substantially elliptical cross section can be obtained.

  The metal heat sink 112 includes a thick portion 1122 having a substantially semicircular inverted kamaboko shape with a radius L4 in cross section. The radiation fins 1121a to 1121e extend radially from the surface of the thick portion 1122, and have a length of L5 (= L3-L4). Since the radiation fins 1121a to 1121e are made of aluminum or the like, they are easily deformed. By providing the thick portion 1122, the metal heat sink 112 has a structure that is not easily deformed, and the heat dissipation efficiency can be improved.

  As shown in FIG. 5, the ratio of the radius L4 of the thick portion 1122 to the length L5 of the radiating fin 1121 is L5: L5 is about 5: 6. L4: L5 may be changed in consideration of heat dissipation efficiency, the installation location of the LED line module 100, and the like. For example, L4: L5 may be about 1: 1, alternatively about 1: 2, alternatively about 2: 3, or other ratios.

  Moreover, in this Embodiment, the radiation fin 1121 demonstrated as what extends to the end surface 115 of the both sides of the LED board support member 110. As shown in FIG. However, as shown in FIG. 1C, a notch 1123 may be formed by notching the radiating fin 1121 at a predetermined position in the longitudinal direction. A notch 1123 shown in FIG. 1C indicates that a portion of the heat radiation fin 1121 existing between the dotted lines is cut (notched). Thereby, the metal heat sink 112 can let the air flow of a transversal direction pass, and can improve heat dissipation efficiency. The notch 1123 may be formed substantially orthogonal to the longitudinal direction, or may be formed inclined with respect to the longitudinal direction. Further, it is preferable that the plurality of cutout portions 1123 are formed so as to be evenly arranged in the longitudinal direction. For example, five notch portions 1123, 10 notch portions, 20 notch portions, or other number of notch portions 1123 may be formed. Further, the notch 1123 may not be formed.

  As described above, according to the LED line module 100 in the present embodiment, in the light source module including the LED substrate support member 110 that supports the LED substrate 200 having the LEDs 210, the LED substrate support member 110 is arranged on the irradiation direction P side. A substrate housing portion 113 (groove portion) having an opening 1131 and a pair of guide portions 1137 for housing the substrate side portions 201 on both sides of the LED substrate 200, and gradually from the edge 1133 of the opening 1131 to the irradiation direction P side. And a metal heat sink 112 (heat dissipating part) that dissipates heat generated by the LED substrate 200 and is formed on the substrate back surface direction Q side. Even the line-shaped LED substrate 200 can be accommodated.

  In addition, according to the LED line module 100 in the present embodiment, the LED substrate support member 110 is integrally formed, so that the LED line module 100 with high LED light extraction efficiency can be provided without increasing the number of components. The cost can be reduced.

  Further, according to the LED line module 100 in the present embodiment, a pair of end surface openings 1151 (guide openings) are formed on both end surfaces 115 of the LED substrate support member 110, and the substrate side portion 201 of the LED substrate 200 is The LED board is housed in the pair of guide parts 1137 of the board housing part 113 by sliding through the guide part 1137 inserted from the end face opening 1151 formed on one of the end faces 115 of the both end faces 115. Can be stored detachably.

  In addition, according to the LED line module 100 in the present embodiment, the metal heat sink 112 includes the heat radiation fins 1121 extending to the substrate back surface direction Q side and extending to the end surfaces 115 on both sides. A plurality of heat radiation fins 1121a to 1121e are provided, and each heat radiation fin 1121 extends in a substantially radial direction from a substantially center line 1132 in the width direction of the bottom surface 1134. Therefore, heat radiation efficiency can be improved.

  In addition, according to the LED line module 100 in the present embodiment, the semi-cylindrical resin cover 120 that covers the opening 1131 is provided, and the LED substrate support member 110 has a cover mounting portion 114 (cover mounting guide) for mounting the resin cover 120. The cover mounting portion 114 (cover mounting guide portion) is mounted by sliding the cover protrusions 121 (side side portions) formed on both sides 122 of the resin cover 120 without increasing the number of parts. A resin cover 120 can be attached.

  In addition, according to the LED line module 100 in the present embodiment, the cross section orthogonal to the substrate housing portion 113 (groove portion) is substantially circular, so that it can be used as a line-type LED illumination that replaces a conventional line-type fluorescent lamp. Can do.

  In the present embodiment, in the light source module including a light source substrate supporting member that supports a light source substrate having a light source, the light source substrate supporting member is a groove portion that is open on an irradiation direction side of the light source, and on both sides of the light source substrate. A groove part having a pair of guide parts for storing the part, a reflection part formed on the irradiation direction side from the edge of the opening of the groove part, and formed on the opposite side of the irradiation direction side, and emitted from the light source substrate An example of a light source module including a heat radiating unit that radiates heat has been described.

  In the present embodiment, an example of a light source module in which a light source substrate support member is integrally formed has been described.

  In the present embodiment, the light source substrate support member has both end surfaces, and the pair of guide portions of the groove portion extends to both end surfaces to form a pair of guide openings on both end surfaces, and the side portions on both sides of the light source substrate. Has described an example of a light source module that is inserted from a guide opening formed on one of the two end faces and is slid on the guide part to be accommodated in the pair of guide parts of the groove part.

  In the present embodiment, the heat radiating portion includes a plurality of heat radiating fins that extend to the opposite ends of the irradiation direction side and extend to both end surfaces. An example of the light source module extending in the substantially radial direction from the substantially center line in the width direction of the bottom surface of the groove has been described.

  In the present embodiment, a semi-cylindrical resin cover that covers the opening is further provided, and the light source substrate support member is a cover mounting guide portion for attaching the resin cover, and slides on both sides that are both sides of the resin cover. An example of a light source module provided with a cover mounting guide portion to be mounted in the above manner has been described.

  In the present embodiment, an example of a light source module having a substantially circular cross section perpendicular to the groove has been described.

  DESCRIPTION OF SYMBOLS 100 LED line module, 110 LED board support member, 111 Reflection part, 112 Metal heat sink, 113 Board storage part, 114 Cover attachment part, 115 End surface, 120 Resin cover, 121 Cover projection part, 122 Side, 200 LED board, 201 Substrate side, 210 LED, 210h end LED, 1121, 1121a, 1121b, 1121c, 1121d, 1121e Radiation fin, 1122 Thick part, 1123 Notch part, 1131 opening part, 1132 substantially center line, 1133 edge part, 1134 Bottom surface, 1135 side wall, 1136 upper surface portion, 1137 guide portion, 1138 Irradiation direction substantially center line, 1151 end surface opening portion.

Claims (4)

  1. A light source substrate supporting member provided with a heat radiating portion formed on the side opposite to the light source with reference to a plane portion on which a light source substrate having a light source is mounted,
    The heat dissipation part is
    Having fins formed on the back side opposite to the irradiation side irradiated with light from the light source;
    The fin is
    A light source substrate support member in which a cutout portion that is partially cutout is formed.
  2. The fin is
    The light source substrate support member according to claim 1, wherein a plurality of the notches are formed.
  3. The fin is
    The light source substrate support member according to claim 1 or 2, wherein the notches are arranged uniformly.
  4. The fin is
    4. The light source substrate support member according to claim 1, wherein a distance between the planar portion and the tip end portion of the fin is gradually shortened from a central portion to a side portion of the planar portion.
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Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2008243498A (en) * 2007-03-27 2008-10-09 First System Co Ltd Led lighting device
US20090290334A1 (en) * 2008-05-23 2009-11-26 Altair Engineering, Inc. Electric shock resistant l.e.d. based light
JP2010073649A (en) * 2008-09-22 2010-04-02 San Buraito:Kk Lighting device
CN201475698U (en) * 2009-06-18 2010-05-19 帝闻企业股份有限公司 Improved LED fluorescent lamp

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2008243498A (en) * 2007-03-27 2008-10-09 First System Co Ltd Led lighting device
US20090290334A1 (en) * 2008-05-23 2009-11-26 Altair Engineering, Inc. Electric shock resistant l.e.d. based light
JP2010073649A (en) * 2008-09-22 2010-04-02 San Buraito:Kk Lighting device
CN201475698U (en) * 2009-06-18 2010-05-19 帝闻企业股份有限公司 Improved LED fluorescent lamp

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