JP2016070741A - Defect determination device, and defect determination method - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a technology that determines whether a detected defect is a linear defect at a low load and at a low cost from a position coordinate of the detected defect, without requiring image processing or the like.SOLUTION: A defect determination device is the device that determines a defect using a position coordinate of the defect in a two-dimensional coordinate system of an inspection object, and the device is configured to comprise: calculation means that uses the position coordinate to calculate a distance between the defects for each component; grouping means that groups one group for each of the defects in which a distance of a first component from the defect of attraction is equal to or less than a first threshold and a distance of a second component therefrom is equal to or less than a second threshold; and determination means that when the number of the defects included in the group is equal to or more than a prescribed value, determines that the defect included in the group is a linear defect.SELECTED DRAWING: Figure 12

Description

  The present invention relates to a technique for determining defects in a pattern formed on a film, and more particularly to a technique for determining linear defects.

  For products that are used for electronic circuits (drawer circuits) such as film sensors for touch panels, in which a pattern such as a circuit is formed on a film-like substrate (hereinafter referred to as an inspection target), an appearance inspection is performed at the time of manufacture, and the pattern is short-circuited. It is necessary to detect defects such as defects.

  Conventionally, in a method of detecting a fine linear defect from an image obtained by photographing an inspection object, a two-step threshold method is used when a defect is relatively large and a difference in shading is large (Patent Document 1).

  In the two-step threshold method, first, only a defective portion is extracted by binarizing with a low threshold in an image obtained by photographing an inspection object, and then noise is detected by binarizing with a high threshold. In this method, the entire defect is extracted, the extracted results are combined, and only the overlapping region is defined as a defect. However, it was not effective when the area to be extracted, such as cracks, was thin and light and shaded.

  Therefore, in Patent Document 1, after normalizing the image obtained by photographing the inspection object, a plurality of defects obtained by using the multiple multi-stage slice method are integrated and detected as linear defect candidates, and detected. A method of detecting a fine linear defect by synthesizing a linear defect extracted by a local search method and a linear defect extracted by a global search method based on the linear defect candidate is disclosed.

Japanese Patent Laid-Open No. 10-48152

  In the method of detecting a linear defect from an image obtained by photographing an inspection object, the two-step threshold method has a problem that it is not effective when a region to be extracted such as a crack is thin and light and shaded as described above. Another problem is that the load is high because image processing is performed.

  In addition, the method disclosed in Patent Document 1 has a problem in that since a linear defect candidate is extracted and a search for a linear defect is performed again, the load and cost of inspection processing are increased.

  The present invention has been made to solve such a problem, and is a linear defect at low load and low cost without requiring separate image processing from the position coordinates of the detected defect. An object is to provide a technique for determining whether or not.

In order to solve the above-described problem, a first invention is a defect determination device that determines a defect using a position coordinate of a defect to be inspected, and uses the position coordinate to determine a distance between the defects. A calculating means for calculating, a grouping means for making one group for each of the defects whose distance is less than or equal to a threshold, and if the number of the defects included in the group is equal to or greater than a predetermined value, the defects included in the group are And a determination unit that determines a linear defect.
According to the first invention, a linear defect can be determined only by calculation such as calculation of a distance and the number of defects based on the position coordinates of the defect detected in the inspection object. Therefore, since a high-load process such as image processing is not required, it is possible to easily determine and extract a linear defect at low cost.

The position coordinates are position coordinates in the two-dimensional coordinate system to be inspected, and it is preferable that the calculation unit calculates a distance between the defects for each component.
As a result, since the position coordinates in the two-dimensional coordinate system are used, a linear defect can be accurately determined, and the distance between the defects is calculated for each component. Therefore, the distance can be easily calculated only by addition / subtraction. Can do.

It is desirable that the grouping unit sets one group for each defect in which the distance of the first component is equal to or smaller than the first threshold and the distance of the second component is equal to or smaller than the second threshold.
As a result, defects that are continuous in the vertical direction and defects that are continuous in the horizontal direction can be made into one group.

It is desirable that the grouping unit sets one group for each defect whose distance from the target defect is a threshold value or less.
As a result, the defects included in the predetermined threshold can be grouped for each defect.

The inspection object is a film on which a wiring pattern is formed, and the defect is preferably a defect in the wiring pattern.
Thereby, the linear defect of the wiring pattern formed in the film can be determined.

2nd invention is the defect determination method performed with the defect determination apparatus which determines a defect using the position coordinate of the defect of a test object, Comprising: The step which calculates the distance between the said defects using the said position coordinate; , A step of making one group for each of the defects whose distance is equal to or less than a threshold value, and a step of determining that the defect included in the group is a linear defect if the number of the defects included in the group is equal to or greater than a predetermined value. The defect determination method characterized by including these.
According to the second invention, a linear defect can be determined only by calculation such as calculation of the distance between defects and the number of defects based on the position coordinates of the defect detected in the inspection object. Therefore, since a high-load process such as image processing is not required, it is possible to easily determine and extract a linear defect at low cost.

  According to the present invention, a linear defect can be determined only by calculation such as calculating the distance and the number based on the position coordinates of the defect detected in the inspection object. Accordingly, since no separate image processing or the like is required, it is possible to determine and extract a linear defect with low load and low cost.

Diagram showing the outline of the defect inspection system The figure which shows the hardware constitutions of an inspection apparatus and a defect determination apparatus The figure which shows the example of the wiring pattern of inspection object Diagram showing examples of linear defects and isolated defects The figure which shows the example of the position coordinate in a defect range The figure which shows the example of the merge function of the inspection device The flowchart which shows the flow of the defect determination process which concerns on 1st Embodiment. The flowchart which shows the flow of the grouping process which concerns on 1st Embodiment. The flowchart which shows the flow of the determination process which concerns on 1st Embodiment. The figure which shows the example of the grouping process which concerns on 1st Embodiment The figure which shows the example of the determination process which concerns on 1st Embodiment The flowchart which shows the flow of the defect determination process which concerns on 2nd Embodiment. The flowchart which shows the example of the defect determination process which concerns on 2nd Embodiment. Flow chart showing the flow of display processing of linear defects

  Hereinafter, embodiments of the present invention will be described in detail with reference to the drawings.

[Outline of Defect Inspection System 1]
FIG. 1 is a diagram showing an outline of a defect inspection system 1 according to an embodiment of the present invention. A defect inspection system 1 shown in FIG. 1 performs an appearance inspection while conveying an inspection object 3 with a roller 5, and includes a light source 7, an imaging device 9, an inspection device 11, a defect determination device 13 (13a, 13b), and the like. Composed.

The inspection object 3 will be described later.
The light source 7 is disposed above the inspection target 3 conveyed by the roller 5 and irradiates light toward the inspection target 3. As the light source 7, for example, an LED lamp can be used.

  The imaging device 9 is arranged above the inspection target 3, images the inspection target 3 illuminated by the light source 7, and sends the captured image to the inspection device 11. The imaging device 9 is, for example, a line sensor including a CCD (Charge Coupled Device) camera or a lens, but is not limited thereto.

  The inspection device 11 performs image processing or the like on the image sent from the imaging device 9 to detect a defect of the inspection object 3 and outputs at least the position coordinates thereof. As the inspection apparatus 11, a general defect inspection apparatus or the like having a computer function can be used. The outline of the function of the inspection apparatus 11 will be described later.

The defect determination device 13 (13a, 13b) determines whether or not the plurality of defects are linear defects based on the position coordinates of the defect input from the inspection device 11. As the defect inspection apparatus 11, a general computer can be used.
Note that the inspection apparatus 11 and the defect determination apparatus 13 may be configured as an integrated computer.

[Hardware Configuration of Defect Determination Device 13 and Inspection Device 11]
FIG. 2 is a block diagram showing a hardware configuration of the defect determination device 13 (13a, 13b). The defect determination device 13 can be realized by, for example, a general computer configured by connecting the control unit 15, the storage unit 17, the communication unit 19, the input unit 21, the display unit 23, and the like via the bus 25.
Since the inspection apparatus 11 can be realized with the same configuration, the description thereof is omitted.

The control unit 15 is a CPU (Central
A processing unit (ROM), a read only memory (ROM), a random access memory (RAM), and the like. The CPU calls a program stored in the storage unit 17, ROM, recording medium, etc. to a work memory area on the RAM, executes it, controls the drive of each unit connected via the bus 25, and determines the defect determination device 13 (inspection). The processing to be described later performed by the apparatus 11) is realized. The ROM is a non-volatile memory and permanently stores programs, data, and the like. The RAM is a volatile memory, and temporarily stores a program, data, and the like loaded from the storage unit 17, ROM, recording medium, and the like, and includes a work area used by the control unit 15 to perform various processes.

  The storage unit 17 is a hard disk drive or the like, and stores a program executed by the control unit 15 and data necessary for program execution. The program or the like is read by the control unit 15 as necessary, transferred to the RAM, and executed.

The input unit 21 inputs data and includes an input device such as a touch panel and keys. An operation instruction, an operation instruction, data input, and the like can be performed on the computer via the input unit 21.
The display unit 23 includes a display device such as a liquid crystal panel, and a logic circuit (a video adapter or the like) for realizing a display function in cooperation with the display device.

The communication unit 19 is a communication interface that mediates communication via a network, and communicates with other devices.
The bus 25 is a path that mediates transmission / reception of control signals, data signals, and the like between the units.

[Inspection object 3]
In the present embodiment, the inspection target 3 is a wiring pattern 31 (hereinafter also referred to as a pattern 31) made of metal or the like on a film-like base material 32 used for an electronic circuit (drawer circuit) such as a film sensor for a touch panel. A circuit-forming film formed with

  In FIG. 3, the example (simplified thing) of the wiring pattern 31 of the circuit formation film used as the test object 3 is shown. The wiring pattern 31 includes, for example, a vertical wiring pattern 31 as shown in FIG. 3A, a horizontal wiring pattern 31 as shown in FIG. 3B, and as shown in FIG. There are various types such as a broken wiring pattern 31 and a spiral wiring pattern 31 (not shown). Hereinafter, as illustrated in FIG. 3A, the inspection target 3 is described as an example of the wiring pattern 31 in the horizontal direction, but is not limited thereto.

In the present embodiment, as shown in FIG. 1, a predetermined range of the inspection object 3 is imaged by the imaging device 9 while the inspection object 3 is conveyed in the left-right direction by the roller 5, and the appearance inspection of the defect included in the pattern 31 is performed. Shall. FIG. 4 is a diagram illustrating an example of an image obtained by photographing a predetermined range of the inspection object 3 by the photographing apparatus 9.
FIG. 4A is an example of an image in which the pattern 31 has no defect.
FIG. 4B is an example of an image including a linear defect 34a that is long in one direction typified by a scratch or the like and extends over a plurality of patterns 31. FIG.
FIG. 4C is an example of an image including an isolated defect 34b that does not extend over a plurality of patterns 31 typified by chipping of the pattern 31 or foreign matter.

[Outline of the defect detection function of the inspection apparatus 11]
Next, an outline of the defect detection function of the inspection apparatus 11 will be described. As the inspection apparatus 11, a general defect inspection apparatus having the functions described below can be used.

The inspection device 11 performs image processing or the like on the image sent from the imaging device 9 to detect a defect in the inspection object 3 and outputs its position coordinates.
Specifically, as shown in FIG. 5A, the inspection apparatus 11 detects a defect 34 c in a defect range 36 that is a rectangle of a predetermined size in the image of the inspection target 3, and a center 37 a of the defect range 36. The position coordinates (indicated by x) are output as the position coordinates of the defect 34c.

  The position coordinates of the defect 34c are not limited to the center 37a of the defect range 36, and a predetermined position of the defect range 36 such as the upper left 37b (indicated by x) of the defect range 36 as shown in FIG. 5B. Any place is acceptable.

  Further, the position coordinates at this time are position coordinates in a two-dimensional coordinate system (orthogonal coordinate system) set with the predetermined position as the origin in the inspection object 3. As shown in FIGS. 5A and 5B, for example, the axis of the two-dimensional coordinate system has an X axis in a direction parallel to the pattern 31 and a Y axis in a direction perpendicular to the pattern 31.

  Further, the inspection apparatus 11 is long in the vertical or horizontal direction, such as a linear defect, and a defect extending over a plurality of patterns 31 is often detected as a plurality of defects instead of a single defect. Therefore, some inspection apparatuses 11 have a merge function that regards a plurality of defects that are close to each other as one defect. When the inspection apparatus 11 has a merge function, the threshold of the merge function is set so that there are at least two linear defects to be extracted and about one isolated defect, and the defect detection by the inspection apparatus 11 is detected. I do.

FIG. 6 is a diagram illustrating an example of the merge function. As shown in FIG. 6, when appropriately setting a threshold merge function, the inspection device 11 detects a defect 34p ₁ and the defect 34p ₂ is a linear defect as a defect 34p, predetermined position of the defect range 36a Output coordinates. The same applies to the linear defect 34q ₁ and the linear defect 34q ₂ , the linear defect 34r ₁ and the linear defect 34r ₂ , and the linear defect 34s ₁ and the linear defect 34s ₂ . Further, the inspection apparatus 11 detects the defect 34t that is an isolated defect as one defect, and outputs predetermined position coordinates of the defect range 36b.

  Note that the inspection apparatus 11 outputs a list of position coordinates of each defect as a defect list.

[Defect Determination Process of Defect Determination Device 13a of First Embodiment]
Subsequently, the defect determination process of the defect determination apparatus 13a (13) according to the first embodiment will be described with reference to FIGS. FIG. 7 is a flowchart showing the flow of the defect determination process of the defect determination device 13a.

First, the control unit 15 of the defect determination device 13a reads the position coordinates P _i (x _i , y _i ) of each defect from the defect list output from the inspection device 11 (step S11). The position coordinates here are position coordinates in a two-dimensional coordinate system (each axis is assumed to be an X axis and a Y axis) set on the image of the inspection object 3.

Next, the control part 15 of the defect determination apparatus 13a calculates the distance between each defect using a position coordinate (step S12). Specifically, the control unit 15 of the defect determination device 13a determines the distance d _x = X-axis direction for each defect pair P _i (x _i , y _i ), P _j (x _j , y _j ). | x _j -x _i | and the distance d _y = | y _j -y _i | in the Y-axis direction are calculated.

  Next, the control part 15 of the defect determination apparatus 13a performs a grouping process (step S13). FIG. 8 is a flowchart showing the flow of the grouping process of the defect determination device 13a.

  The control unit 15 of the defect determination device 13a arbitrarily selects one initial defect and sets it as one group (step S21).

Next, the control unit 15 of the defect determination device 13a determines whether there is a defect that is not yet included in the group (step S22).
If there is any (Yes in Step S22), the control unit 15 of the defect determination device 13a proceeds to Step S23. If not (No in Step S22), the control unit 15 ends the grouping process.

  Next, the control unit 15 of the defect determination device 13a selects one defect P that is not yet included in the group (step S23).

Next, the control unit 15 of the defect determination device 13a determines whether there is a defect Q whose distance from the defect P satisfies a threshold among defects included in any group (step S24).
Specifically, the control unit 15 of the defect determination apparatus 13a determines that the distance d _x in the X-axis direction between each defect included in each group and the defect P satisfies the threshold th _x in the X-axis direction (d _x ≦ th _x ) and whether the distance d _y in the Y-axis direction satisfies the threshold th _y in the Y-axis direction (d _y ≦ th _y ).

  If there is a defect Q that satisfies the threshold (Yes in step S24), the control unit 15 of the defect determination device 13a includes the defect P in the group that includes the defect Q. In addition, when there are a plurality of defects Q that satisfy the threshold and there are a plurality of groups that include the defect Q, the controller 15 of the defect determination device 13a merges them into one group (step S25). That is, when merged, the defect P is included in the merged group.

On the other hand, when there is no defect Q that satisfies the threshold (No in step S24), the control unit 15 of the defect determination apparatus 13a sets the defect P as a new group (step S26).
After step S25 and after step S26, the control unit 15 of the defect determination device 13a returns to step S22.

  Returning to FIG. 7, next, the control unit 15 of the defect determination device 13a executes a determination process (step S14). FIG. 9 is a flowchart showing a flow of determination processing of the defect determination device 13a.

The control unit 15 of the defect determination device 13a determines whether there is a group that has not been determined yet (step S31).
If there is a group that is not determined (Yes in step S31), the control unit 15 of the defect determination device 13a proceeds to step S32, and if all groups are determined (No in step S31), the determination is made. The process ends.

  Next, the control part 15 of the defect determination apparatus 13a selects one group (step S32).

Next, the control unit 15 of the defect determination device 13a determines that the maximum value of the distance in the X-axis direction between the defects in the selected group satisfies the first condition, and the maximum value of the distance in the Y-axis direction is the second condition. It is determined whether it is satisfied (step S33).
Specifically, the control section 15 of the defect judging device 13a satisfies example, between the defect in the selected group, the maximum value Max_d _x threshold th _mx distance in the X-axis direction (max_d _x ≧ th _mx), In addition, it is determined whether the maximum value max_d _y of the distance in the Y-axis direction satisfies the threshold th _my (max_d _y ≧ th _my ). The other conditions may be described later.

If satisfied (Yes in step S33), the control unit 15 of the defect determination device 13a proceeds to step S34, and determines whether the number of defects in the selected group is equal to or greater than the threshold th _N (step S34).

If there is a threshold th _N or more (Yes in step S34), the control unit 15 of the defect determination device 13a proceeds to step S35, determines that the defect included in the selected group is a linear defect, and the linear in the defect list. A group (group number or the like) is recorded for the defect determined to be a defect (step S35).

On the other hand, the control part 15 of the defect determination apparatus 13a progresses to step S36, when not satisfy | filling in step S33 (No in step S33), and when not exceeding the threshold th _{N in} step S34 (No in step S34), Defects included in the selected group are determined as other defects (defects that are not linear defects) (step S36).

After step S35 and after step S36, the control unit 15 of the defect determination device 13a returns to step S31.
Above, the defect determination process of the defect determination apparatus 13a which concerns on 1st Embodiment is completion | finish.

  In addition, the defect determination process of this embodiment is not restricted to the above-mentioned thing, It can change in the range which does not deviate from the meaning.

  For example, in the grouping process shown in FIG. 8, a general Euclidean distance or the like may be used as the distance between defects.

Further, for example, in the determination process shown in FIG. 9, the first condition and the second condition in step S33 can be arbitrarily set according to the shape and size of the linear defect to be determined. If it is a vertically long line defect, th _mx <th _my may be set, and if it is a horizontally long line defect, th _mx > th _my may be set. The conditions may be such that max_d _x ≤ th _mx and max_d _y ≤ th _my , max_d _x ≤ th _mx and max_d _y ≥ th _my , max_d _x ≥ th _mx and max_d _y ≤ th _my It may be. Alternatively, each of the X-axis direction and the Y-axis direction may be determined based on whether or not they fall within a predetermined range (th _mx1 ≦ max_d _x ≦ th _mx2 and th _my1 ≦ max_d _y ≦ th _my2 ).

  Further, it may be determined whether or not the defect is a linear defect only by the number of defects in the group in step S34 without executing the process in step S33 of FIG.

Here, an example of the grouping process shown in FIG. 8 will be described with reference to FIG.
As shown in FIG. 10A, the threshold value th _x in the X-axis direction and the threshold value th _{y in the} Y-axis direction are set, and the defect P not yet included in the group selected in step S23 is set to 34f. The defects 34d and 34e are included in the group 35a.

At this time, the controller 15 of the defect determination device 13a determines that the defect P (34f) and the defect 34e included in the group 35a satisfy the threshold (d _x ≦ th _x and d _y ≦ th _y ) in the determination in step S24. Therefore, in step S25, the defect P (34f) is included in the group 35a including the defect 34e.

Further, as shown in FIG. 10 (b), the optionally threshold th _y threshold th _x and Y-axis direction of the X-axis direction is set, it has been still a 34f defects P that is not included in the group selected in step S23 The defects 34d and 34e are included in the group 35a, and the defects 34g and 34h are included in the group 35b.

At this time, the controller 15 of the defect determination device 13a determines that the defect P (34f) and the defect 34e included in the group 35a satisfy the threshold (d _x ≦ th _x and d _y ≦ th _y ) in the determination in step S24. ), Since the defect 34g included in the group 35b similarly satisfies the threshold value, the defect P (34f) is included in the group 35a including the defect 34e and the defect P is included in the group 35b including the defect 34g in step S25. (34f) is included.

  And the control part 15 of the defect determination apparatus 13a combines the group 35a and the group 35b containing the defect P (34f) into one. That is, the group (not shown) after step S25 is a group including the defects 34d, 34e, 34f, 34g, and 34h.

Further, as shown in FIG. 10 (c), the optionally threshold th _y threshold th _x and Y-axis direction of the X-axis direction is set, has been still a 34i defects P that is not included in the group selected in step S23 Further, it is assumed that the defects 34d and 34e are included in the group 35a.

  At this time, the controller 15 of the defect determination device 13a determines that the defect P (34i) and the defects 34d and 34e included in the group 35a do not satisfy the threshold in the determination of step S24. Let 34i) be a new group.

Next, an example of the determination process shown in FIG. 9 will be described with reference to FIG.
As shown in FIG. 11A, it is assumed that the threshold th _mx in the X-axis direction and the threshold th _{my in the} Y-axis direction are set and the threshold number th _N = 4 is set. The group selected in step S32 is defined as 35c (including defects 34j, 34k, 34l, and 34m).

At this time, the control section 15 of the defect determination unit 13a is determined in step S33, the maximum value Max_d _x distance in the X-axis direction of the group 35c selected (the distance d _x in the X-axis direction of the defect 34j and defect 34m) , The threshold is satisfied (max_d _x ≧ th _mx ), and the maximum value max_d _y of the distance in the Y-axis direction (distance d _{y of the} defect 34j and the defect 34m in the Y-axis direction) satisfies the threshold (max_d _y ≧ th _my Therefore, the process proceeds to the determination of step S34, and the number of defects 4 in the selected group 35c is equal to or greater than the threshold th _N = 4. Therefore, the process proceeds to step S35, and the defects included in the selected group 35c are determined to be linear defects.

On the other hand, as shown in FIG. 11B, it is assumed that a threshold th _mx in the X-axis direction and a threshold th _{my in the} Y-axis direction are set. The group selected in step S32 is defined as 35c (including defects 34j, 34k, 34l, and 34m).

At this time, the control section 15 of the defect determination unit 13a is determined in step S33, the maximum value Max_d _x distance in the X-axis direction of the group 35c selected (the distance d _x in the X-axis direction of the defect 34j and defect 34m) Since the threshold value is not satisfied (max_d _x <th _mx ), the process proceeds to step S36, and the defect included in the selected group 35c is determined as another defect.

[Effect of the first embodiment]
1. The defect determination apparatus according to the first embodiment can determine a linear defect only by calculation such as calculation of the distance between defects and the number of defects based on the position coordinates of the defect detected in the inspection target. In particular, since the distance is calculated using only the components in the X-axis and Y-axis directions, the linear defect can be determined only by adding / subtracting and calculating the number. Therefore, since a high-load process such as image processing is not required, it is possible to easily determine and extract a linear defect at low cost.
2. By appropriately setting threshold values th _mx , th _my , th _{N and the} like by the defect determination device according to the first embodiment, a linear defect can be determined by designating the shape and size.

[Defect Determination Process of Defect Determination Device 13b of Second Embodiment]
Then, the defect determination process of the defect determination apparatus 13b (13) which concerns on 2nd Embodiment is demonstrated using FIG. FIG. 12 is a flowchart showing the flow of the defect determination process of the defect determination device 13b.

First, the control unit 15 of the defect determination device 13b reads the position coordinates P _i (x _i , y _i ) (1 ≦ i ≦ N) of each defect from the defect list output from the inspection device 11 (step S41). . The position coordinates here are position coordinates in a two-dimensional coordinate system (each axis is assumed to be an X axis and a Y axis) set on the image of the inspection object 3.

Next, the control unit 15 of the defect determination device 13b sets the variable i to 1 (step S42). The defect P _i means a defect that becomes a center when the defects are grouped.

Next, the control part 15 of the defect determination apparatus 13b sets the variable j to 1 (step S43). The defect P _j means a defect to be examined whether it is in the same group as the defect P _i .

Next, the control unit 15 of the defect determination device 13b determines that the distance between the defect P _i (x _i , y _i ) and the defect P _j (x _j , y _j ) is a preset threshold th _x in the X-axis direction. Whether or not the threshold value th _y in the Y-axis direction is satisfied is determined. That is, the control unit 15 of the defect determination device 13b determines whether or not | x _i −x _j | ≦ th _x and | y _i −y _j | ≦ th _y are satisfied (step S44).

If satisfied (Yes in step S44), the control section 15 of the defect determination unit 13b include, but are defective P _j is the same group as the defect P _i, attached to the line defect flag G _i in the defect P _j (step S45 ).
On the other hand, when not satisfy | filling (No in step S44), the control part 15 of the defect determination apparatus 13b progresses to step S46.

Next, the control unit 15 of the defect determination device 13b increases j by 1 (step S46) and determines whether j ≦ N is satisfied (step S47).
If j ≦ N (Yes in step S47), the control unit 15 of the defect determination device 13b returns to step S44. If j> N, the control unit 15 proceeds to step S48.

Next, the control section 15 of the defect determination unit 13b, either the number of defects with a line defect flag G _i is, is preset threshold value th _N or more, it determines (step S48).
If more than the threshold th _N (Yes in step S48), the control section 15 of the defect determination unit 13b determines defects with the line defect flag G _i and linear defects, determining a linear defect in the defect list against defects, record the line defect flag G _i (step S49).

On the other hand, if it is less than the threshold value th _N (No in step S48), the control section 15 of the defect determination unit 13b erases the line defect flag G _i (step S50).

Next, the control unit 15 of the defect determination apparatus 13b increases i by 1 to move the defect at the center when grouping to the next defect (step S51), and determines whether i ≦ N. (Step S52).
If i ≦ N (Yes in step S52), the control unit 15 of the defect determination device 13b returns to step S43, and if i> N, ends the defect determination process.

Above, the defect determination process of the defect determination apparatus 13b which concerns on 2nd Embodiment is completion | finish.
In addition, the defect determination process of this embodiment is not restricted to the above-mentioned thing, It can change in the range which does not deviate from the meaning.

For example, in the increment of step S46 or step 51, the defect already determined to be a linear defect in step S49 may be skipped.
Further, as in the first embodiment, the distance between the defects may be calculated first, and the defect determination process may be performed using the distance.

Note that the thresholds th _x , th _y , and th _N can be arbitrarily set according to the shape and size of the linear defect to be determined. If it is a vertically long linear defect, th _x <th _y may be set, and if it is a horizontally long linear defect, th _x > th _y may be set.

Here, an example of the defect determination process according to the second embodiment shown in FIG. 12 will be described with reference to FIG.
In Fig. 13 (a), though the threshold th _y threshold th _x and Y-axis direction of the X-axis direction is set, and is set as the threshold value th _N = 4 number. Then, i is incremented in step S51, in front of the step S43, it is assumed that P _i is pointing to the defect 34k.

At this time, the control section 15 of the defect determination unit 13b, in the repetition of step S44～S47, defect defect P _j respectively 34j, 34k, 34l, when referring to 34m, the threshold distance between P _i and P _j satisfied because (entering the dashed line indicated by 35d), defects 34j, 34k, 34l, with respect to 34m, giving a line defect flag G _i according to 34k (the same group).

Next, the control section 15 of the defect determination unit 13b, in step S48, the since the number of defects with a line defect flag G _i of the 34k 4 is a threshold value th _N = 4 or higher, in step S49, the defect list, the defect 34j, 34k, 34l, against 34m, recording the line defect flag G _i according to 34k (the linear defects).

On the other hand, in FIG. 13A, it is assumed that the threshold value th _x in the X-axis direction and the threshold value th _{y in the} Y-axis direction are set, and the threshold value th _{N of} the number is set to 4. Then, i is incremented in step S51, in front of the step S43, it is assumed that P _i is pointing to the defect 34n.

At this time, the control section 15 of the defect determination unit 13b, in the repetition of step S44～S47, defect defect P _j respectively 34n, when referring to 34o, the distance between P _i and P _j satisfies the threshold (in 35e since entering the dashed line) indicating the defect 34n, with respect to 34o, giving a line defect flag G _i according to 34n to (same group).

Next, the control section 15 of the defect determination unit 13b, in step S48, the since the number 2 of the defects with a line defect flag G _i according to 34n is less than the threshold value th _N = 4, in step S50, the defect 34n, from 34o erases the line defect flag G _i according to 34n (not linear defects).

As shown in FIG. 13B, when the wiring pattern of the inspection object 3 is in the vertical direction, if th _x > th _y is set in advance, the horizontal linear defect is similarly determined ( Detection). For example, as shown in FIG. 13 (b), the optionally threshold th _y threshold th _x and Y-axis direction of the X-axis direction is set in front of the step S43, if P _i is pointing to the defect 34k is The rectangle serving as the threshold is 35f.

[Effects of Second Embodiment]
1. The defect determination apparatus according to the second embodiment can determine a linear defect only by calculation such as calculation of the distance between defects and the number of defects based on the position coordinates of the defect detected in the inspection object. In particular, since the distance is calculated using only the components in the X-axis and Y-axis directions, the linear defect can be determined only by adding / subtracting and calculating the number. Therefore, since a high-load process such as image processing is not required, it is possible to easily determine and extract a linear defect at low cost.
2. By appropriately setting threshold _values th _x , th _y , th _{N and the} like by the defect determination device according to the second embodiment, a linear defect can be determined by designating the shape and size.

[Linear defect display processing]
Next, the display process of the linear defect of the defect determination apparatus 13 (13a, 13b) is demonstrated using FIG.

  The control unit 15 of the defect determination device 13 reads a defect list in which group information (group number or the like or a line defect flag) is recorded and a captured image of the inspection object 3 (step S61).

  Next, the control unit 15 of the defect determination device 13 displays a captured image of the inspection target 3 and displays the position of the defect included in the information of each group as a linear defect in a superimposed manner on the captured image.

Thus, the linear defect display process of the defect determination apparatus 13 is completed.
Thereby, the operator of the defect determination apparatus 13 can easily recognize whether or not the inspection target 3 has a linear defect.

  The preferred embodiments of the defect determination device and the like according to the present invention have been described above with reference to the accompanying drawings, but the present invention is not limited to such examples. It will be apparent to those skilled in the art that various changes or modifications can be conceived within the scope of the technical idea disclosed in the present application, and these naturally belong to the technical scope of the present invention. Understood.

1 ... ………………………… Defect inspection system 3 ……………………………… Inspection target 5 …………………………… Roller 7 ………………… ………… Light source 9 ……………………………… Photographing device 11 ………………………… Inspection device 13 (13a, 13b)… Defect determination device 15 ………………… ……… Control unit 31 ………………………… Pattern 32 ………………………… Film-like substrate 34 ………………………… Defect 35 ………… ……………… Group 36 ………………………… Defect range

Claims (6)

A defect determination device that determines a defect using position coordinates of a defect to be inspected,
Calculating means for calculating a distance between the defects using the position coordinates;
Grouping means for grouping each defect with the distance below a threshold;
If the number of the defects included in the group is equal to or greater than a predetermined value, a determination unit that determines the defects included in the group as linear defects;
A defect determination apparatus comprising: The position coordinates are position coordinates in the two-dimensional coordinate system to be inspected,
The defect determination apparatus according to claim 1, wherein the calculation unit calculates a distance between the defects for each component. The grouping means sets one group for each of the defects whose first component distance is equal to or smaller than a first threshold value and whose second component distance is equal to or smaller than a second threshold value. The defect determination apparatus described in 1. The defect according to any one of claims 1 to 3, wherein the grouping unit sets one group for each defect whose distance from the defect of interest is a threshold value or less. Judgment device. The defect determination apparatus according to any one of claims 1 to 4, wherein the inspection object is a film on which a wiring pattern is formed, and the defect is a defect in the wiring pattern. . A defect determination method performed by a defect determination apparatus that determines a defect using the position coordinates of the defect to be inspected,
Calculating a distance between the defects using the position coordinates;
Grouping each defect with a distance less than or equal to a threshold;
If the number of defects included in the group is greater than or equal to a predetermined value, determining the defects included in the group as a linear defect;
A defect determination method comprising:

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