JP2016053181A - Resin composition for electronic circuit board material, prepreg, laminate sheet and metal clad laminate sheet - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a resin composition for electronic circuit board material excellent in moldability, high in glass transition temperature (Tg) of a cured article, and capable of reducing warpage when manufacturing a semiconductor package.SOLUTION: There is provided a resin composition containing (A) a novolak phenol resin of the formula (1) having two or more hydroxyl groups in a molecule and a naphthalene skeleton having at least one or more hydroxyl groups of the hydroxyl groups, (B) an epoxy resin having two or more epoxy groups in a molecule, and (C) an inorganic filler with a content of 130 to 250 pts.mass based on 100 pts.mass of the (A) and (B) components. The composition has a glass transition temperature (Tg) after curing of 220°C or more.SELECTED DRAWING: None

Description

  The present invention relates to a resin composition for electronic circuit board materials, prepregs, laminates and metal-clad laminates used in electronic / communication equipment, particularly semiconductor packages and the like.

  In order to reduce the warpage of semiconductor packages in the recent trend of downsizing, weight reduction, and high performance of electronic / communication equipment, electronic circuit board materials used in the manufacture of semiconductor packages have high glass transition temperatures ( Tg), a low thermal expansion coefficient and a high elastic modulus are strongly demanded.

  Generally, a resin composition containing an epoxy resin and a phenol resin is used as an electronic circuit board material. In such a resin composition, a high Tg can be easily achieved by increasing the crosslink density of the resin. However, there is a problem that a free volume tends to be generated in the molecular network during cooling after the curing reaction, and the thermal expansion coefficient increases due to this free volume, and the water absorption rate increases due to the hydroxyl group generated during the reaction.

  Further, when an inorganic filler is further added to the above resin composition, the coefficient of thermal expansion can be reduced. However, in this case, it is necessary to add a large amount of inorganic filler. Therefore, the fluidity of the resin composition is lowered, which causes the circuit embeddability of the prepreg to deteriorate.

  Further, when a prepreg is produced by impregnating a glass substrate with the above resin composition, if a resin having a flexible skeleton is used as an epoxy resin and a phenol resin, the inorganic filler and the thermal expansion coefficient of this resin and The thermal expansion coefficient of the glass substrate is dominant. Therefore, in the laminated board formed using such a prepreg, although a thermal expansion coefficient becomes low, there exists a problem that a glass transition temperature (Tg) and an elasticity modulus fall.

  Therefore, a resin composition containing a biphenyl type epoxy resin has been developed as a resin composition having a high glass transition temperature (Tg) and a low coefficient of thermal expansion (see, for example, Patent Document 1).

Japanese Patent Laid-Open No. 2001-151991

  However, conventional resin compositions have problems in moldability, and semiconductor packages formed using such resin compositions still have room for improvement in terms of glass transition temperature (Tg) and warpage.

  The present invention has been made in view of the above points, and is an electronic circuit board that is excellent in moldability, has a high glass transition temperature (Tg) of a cured product, and can reduce warpage when a semiconductor package is manufactured. It aims at providing the resin composition for materials, a prepreg, a laminated board, and a metal-clad laminated board.

Resin composition for electronic circuit board material according to the present invention,
(A) a phenolic resin;
(B) an epoxy resin;
(C) a resin composition for an electronic circuit board material containing an inorganic filler,
The component (A) contains a novolak phenol resin having a naphthalene skeleton having two or more hydroxyl groups in the molecule and having at least one hydroxyl group among the hydroxyl groups,
The novolak phenol resin is represented by the following formula (1):
The component (B) contains a polyfunctional epoxy resin having two or more epoxy groups in the molecule,
Content of the said (C) component with respect to 100 mass parts of said (A) and (B) component is 130-250 mass parts,
The glass transition temperature (Tg) after curing is 220 ° C. or higher.

  It is preferable that content of the novolak phenol resin with respect to the total amount of the component (A) is 50% by mass or more.

  It is preferable that 70% by mass or more of the component (C) is fused silica.

  The surface of the component (C) is preferably treated with a coupling agent.

The prepreg according to the present invention is
A reinforcing fiber substrate;
And a semi-cured product of the resin composition for an electronic circuit board material impregnated in the base material of the reinforcing fiber.

  The reinforcing fibers are preferably glass fibers.

The laminate according to the present invention is
The prepreg is formed of one cured product or a cured product of a plurality of laminates.

The metal-clad laminate according to the present invention is
One cured product of the prepreg or a cured product of a plurality of laminates,
And a metal foil bonded to one or both sides of the cured product.

  According to the present invention, the moldability is excellent, the glass transition temperature (Tg) of the cured product is high, and the warpage can be reduced when a semiconductor package is manufactured.

It is sectional drawing which shows an example of a semiconductor package.

  Embodiments of the present invention will be described below.

  The resin composition for electronic circuit board materials according to the present invention (hereinafter also simply referred to as “resin composition”) contains (A) a phenol resin, (B) an epoxy resin, and (C) an inorganic filler. To do. This resin composition is used when manufacturing electronic circuit board materials such as prepregs and laminates.

  The component (A) is a novolak phenol resin having two or more hydroxyl groups in the molecule and having a naphthalene skeleton having at least one of these hydroxyl groups (hereinafter referred to as “( a1) a novolac phenolic resin ”). The component (A) may contain a phenol resin other than the (a1) novolak phenol resin. The hydroxyl group of component (A) binds to and crosslinks with the epoxy group of component (B).

  The content of the (a1) novolak phenol resin relative to the total amount of the component (A) is preferably 50% by mass or more (the upper limit is 100% by mass). Thereby, compared with the case where the content of the (a1) novolak phenol resin is less than 50% by mass, the coefficient of thermal expansion is effective while maintaining the glass transition temperature (Tg) of the cured product of the resin composition at a high level. Can be reduced.

  (A1) The novolak phenol resin is represented by the above formula (1). Thereby, compared with the case where other novolak phenol resin is used, while being able to raise the glass transition temperature (Tg) of the hardened | cured material of a resin composition, a thermal expansion coefficient can be reduced.

  The component (B) contains a polyfunctional epoxy resin having two or more epoxy groups in the molecule (hereinafter, this polyfunctional epoxy resin is referred to as “(b1) polyfunctional epoxy resin”). The component (B) may contain an epoxy resin other than the (b1) polyfunctional epoxy resin.

  The resin composition may contain a resin component other than the components (A) and (B). Examples of such resin components include cyanate resins, benzoxazine resins, unsaturated polyester resins, polyamide resins, polyimide resins, polybutadiene resins, thermosetting polyphenylene oxide resins, fluororesins, modified products thereof, and bromine What was chosen from the made flame-retardant resin etc. can be used.

  The component (C) is selected from, for example, fused silica, aluminum hydroxide, magnesium hydroxide, E glass powder, alumina, magnesium oxide, titanium dioxide, potassium titanate, calcium silicate, calcium carbonate, clay, talc and the like. Things can be used.

  In particular, 70% by mass or more (the upper limit is 100%) of the component (C) is preferably fused silica. The fused silica is preferably spherical. Fused silica has a lower coefficient of linear expansion than other inorganic fillers. For example, the linear expansion coefficient of crystalline silica is 7.0 ppm / ° C., and the linear expansion coefficient of aluminum hydroxide is 10 to 15 ppm / ° C., whereas the linear expansion coefficient of fused silica is 0.5 ppm / ° C. Therefore, when 70 mass% or more of the component (C) is fused silica, the fluidity of the resin composition, that is, the moldability is improved, the circuit embedding property is improved, and generation of voids in the cured product can be suppressed. . In addition, when 70% by mass or more of the component (C) is fused silica, it is possible to effectively achieve a high elastic modulus and a low thermal expansion coefficient of the cured product of the resin composition, and reduce the warpage of the semiconductor package. You can also.

  It is preferable that mass ratio of (A) component and (B) component is 30: 70-60: 40. The content of the component (C) with respect to 100 parts by mass of the components (A) and (B) is 130 to 250 parts by mass. As a result, the thermal expansion coefficient can be greatly reduced while maintaining the glass transition temperature (Tg) and the elastic modulus of the cured product of the resin composition in a high state, and the warpage of the semiconductor package is also greatly reduced. It is something that can be done. However, when the content of the component (C) is less than 130 parts by mass, it is impossible to achieve a high elastic modulus and a low thermal expansion coefficient, and it is not possible to reduce the warpage of the semiconductor package. On the other hand, when the content of the component (C) exceeds 250 parts by mass, the fluidity, that is, the moldability of the resin composition is lowered, the circuit embedding property is deteriorated, and a void is generated in the cured product.

  The surface of the component (C) is preferably treated with a coupling agent. As the coupling agent, for example, those selected from γ-glycidoxypropyltrimethoxysilane, γ-aminopropyltriethoxysilane, N-phenyl-γ-aminopropyltrimethoxysilane and the like can be used. When the surface of the component (C) is treated with such a coupling agent, the components (A) and (B), which are organic components, and the component (C), which is an inorganic component, are adhered and become familiar by the coupling agent. Will be better. Then, the low thermal expansion coefficient of the component (C) can be effectively reflected in the thermal expansion coefficient of the components (A) and (B), and the thermal expansion coefficient of the cured product of the resin composition is further reduced. It can be made to.

  The resin composition can contain a curing catalyst (curing accelerator) as necessary. Examples of the curing catalyst include imidazoles such as 2-ethyl-4-methylimidazole, 2-methylimidazole, 2-phenyl-4-methylimidazole, dimethylbenzylamine, triethylenediamine, benzyldimethylamine, and triethanolamine. Amines, organic phosphines such as triphenylphosphine, diphenylphosphine, phenylphosphine, tetrasubstituted phosphonium / tetrasubstituted borates such as tetraphenylphosphonium / ethyltriphenylborate, 2-ethyl-4-methylimidazole / tetraphenylborate, etc. Those selected from tetraphenyl boron salts and the like can be used. When using a curing catalyst, the content is preferably 0.01 to 0.1 parts by mass with respect to 100 parts by mass of the components (A) and (B).

  The component (A) is a curing agent, but the resin composition can contain other curing agents as necessary. Examples of other curing agents include those selected from dicyandiamide, acid anhydrides, aliphatic amines, and the like.

  The resin composition can contain a flame retardant as necessary. Although it does not specifically limit as a flame retardant, The phosphate ester type compound shown by following formula (2), Formula (3), Formula (4), Formula (5), and Formula (6) and its It is preferable to use those selected from phosphorus-based flame retardants such as derivatives. Since such a phosphorus flame retardant is halogen-free, the adverse effects of halogen on the human body can be suppressed, and good flame retardancy and heat resistance can be ensured over a long period of time.

  And a resin composition mix | blends (A) phenol resin, (B) epoxy resin, and (C) inorganic filler, and also mix | blends other components, such as a curing catalyst, as needed. It can be prepared as a varnish by mixing uniformly with a blender or the like. When preparing the resin composition, the resin composition is diluted by blending a solvent selected from methyl ethyl ketone (MEK), methoxypropanol (MP), dimethylformamide (DMF), acetone and the like as necessary. May be.

  The glass transition temperature (Tg) after curing of the resin composition obtained as described above is 220 ° C. or higher (the upper limit is 300 ° C.). Thus, resin prepared using (a1) component (A) containing novolak phenol resin, (b1) component (B) containing polyfunctional epoxy resin, and a predetermined amount of component (C) In the composition, the glass transition temperature (Tg) of the cured product can be increased to 220 ° C. or higher. Moreover, since (a1) novolak phenol resin has a low stress and rigid skeleton, the coefficient of thermal expansion between components (A) and (B), which are organic components, and component (C), which is an inorganic component. The stress resulting from the difference (ΔCTE) is relaxed, and the coefficient of thermal expansion of the cured product of the resin composition can be greatly reduced while maintaining a high glass transition temperature (Tg). The glass transition temperature (Tg) can be measured by the DMA method (dynamic viscoelastic analysis).

  The electronic circuit board material can be manufactured using the above resin composition. Examples of the electronic circuit board material include a prepreg and a laminated board. The laminate includes a metal-clad laminate such as CCL.

  The prepreg can be produced by impregnating a base material of a reinforcing fiber with a resin composition, and drying and semi-curing it by heating. As the reinforcing fiber, for example, those selected from glass fiber, aromatic polyamide, liquid crystal polyester, poly (paraphenylenebenzobisoxazole) (PBO), polyphenylene sulfide resin (PPS) and the like can be used. In particular, the reinforcing fiber is preferably glass fiber. That is, it is preferable that the reinforcing fiber base material is a glass fiber base material (for example, glass cloth). Thereby, the prepreg excellent in drill workability and moisture absorption characteristics can be obtained. The surface of the reinforcing fiber is preferably treated with a coupling agent. As a coupling agent, the thing similar to what is used for the surface treatment of the above-mentioned (C) component can be used. When the surface of the reinforcing fiber is treated with such a coupling agent, the resin composition and the base material of the reinforcing fiber are bonded to each other by the coupling agent, so that the familiarity is improved. If it does so, the low thermal expansion coefficient of the base material of a reinforced fiber can be effectively reflected also in the thermal expansion coefficient of a resin composition, and the thermal expansion coefficient of a semiconductor package can further be reduced.

  A laminated board can be manufactured by heat-press-molding one or more prepregs obtained as described above. A metal-clad laminate such as CCL can be produced by stacking a metal foil such as a copper foil on one or both sides of a single prepreg or a laminate of a plurality of prepregs and heating and pressing them. Since the resin composition of the prepreg is excellent in fluidity, that is, moldability even when remelted, it is possible to suppress the generation of voids in the laminated sheet that is a cured product. Further, since the laminate is formed by combining the resin composition and the base material of the reinforcing fiber, the thermal expansion coefficient, particularly heat in the XY direction (plane direction) is maintained while maintaining a high glass transition temperature (Tg). The expansion coefficient can be greatly reduced. This effect is maintained even if the laminated board is processed into a printed wiring board.

  When a circuit pattern is formed on the metal-clad laminate obtained as described above, a printed wiring board (including a multilayer printed wiring board) can be manufactured. Then, after the semiconductor chip 3 (IC chip or the like) is bonded and fixed to the printed wiring board 1 with the die attach film 2 and the semiconductor chip 5 is bonded and fixed to the semiconductor chip 3 with the die attach film 4 as shown in FIG. The semiconductor package 7 (PKG) can be manufactured by sealing the semiconductor chips 3 and 5 with the resin material 6.

  In the semiconductor package 7 obtained as described above, since the difference in coefficient of thermal expansion (ΔCTE) between the semiconductor chip 3 and the printed wiring board 1 is reduced, the warpage can be reduced. It is.

  Hereinafter, the present invention will be specifically described by way of examples.

[A] Materials Used The materials used in preparing the resin composition are shown below.

(1) (A) phenol resin phenol resin 1: novolak phenol resin represented by formula (1) (average hydroxyl group equivalent 155)
Phenol resin 2: “TD-2090” manufactured by DIC Corporation (average hydroxyl group equivalent of 105)
Phenol resin 3: “MEH-7600” manufactured by Meiwa Kasei Co., Ltd. (average hydroxyl group equivalent: 100)
Phenol resin 4: “MEH-7500” manufactured by Meiwa Kasei Co., Ltd. (average hydroxyl equivalent weight 110)
Phenol resin 5: “GPH-103” manufactured by Nippon Kayaku Co., Ltd. (average hydroxyl group equivalent 230)
Only phenol resin 1 is (a1) novolak phenol resin.

(2) (B) Epoxy resin Epoxy resin 1: Nippon Kayaku Co., Ltd. "EPPN-502H" (average epoxy equivalent 170)
Epoxy resin 2: “NC-3000” manufactured by Nippon Kayaku Co., Ltd. (average epoxy equivalent 275)
Epoxy resin 3: “NC-7000L” (average epoxy equivalent 230) manufactured by Nippon Kayaku Co., Ltd.
Epoxy resin 4: DIC Corporation “N-690” (average epoxy equivalent 215)
The epoxy resins 1 to 4 are all (b1) polyfunctional epoxy resins.

(3) (C) Inorganic filler Inorganic filler 1: Fused silica "SC-2500SEJ" manufactured by Admatex Co., Ltd.
Inorganic filler 2: Aluminum hydroxide “CL-303” manufactured by Sumitomo Chemical Co., Ltd.
Inorganic filler 3: Firing talc “ST100” manufactured by Fuji Talc Kogyo Co., Ltd.
Only the inorganic filler 1 is treated with the coupling agent.

(4) Curing catalyst 2-ethyl-4-methylimidazole (5) Solvent methyl ethyl ketone (MEK)
[B] Preparation of Resin Composition The resin compositions of Examples 1 to 7 and Comparative Examples 1 to 3 were prepared as follows (see Table 1).

(Example 1)
A mixture of phenol resin 1 (25 parts by mass), phenol resin 3 (15 parts by mass), epoxy resin 1 (40 parts by mass), and epoxy resin 3 (20 parts by mass) was stirred in a solvent, and then a curing catalyst (0. (05 parts by mass) was added and further stirred to obtain a uniform resin solution. Thereafter, the inorganic filler 1 (110 parts by mass), the inorganic filler 2 (25 parts by mass) and the inorganic filler 3 (5 parts by mass) surface-treated with a coupling agent are added to the resin solution and stirred again. Thus, a resin composition was obtained.

(Example 2)
A mixture of phenol resin 1 (25 parts by mass), phenol resin 4 (15 parts by mass), epoxy resin 1 (40 parts by mass), and epoxy resin 3 (20 parts by mass) was stirred in a solvent, and then a curing catalyst (0. (05 parts by mass) was added and further stirred to obtain a uniform resin solution. Thereafter, inorganic filler 1 (140 parts by mass), inorganic filler 2 (30 parts by mass) and inorganic filler 3 (10 parts by mass) surface-treated with a coupling agent are added to this resin solution and stirred again. Thus, a resin composition was obtained.

(Example 3)
A mixture of phenol resin 1 (25 parts by mass), phenol resin 3 (15 parts by mass), epoxy resin 1 (45 parts by mass), and epoxy resin 2 (15 parts by mass) was stirred in a solvent, and then a curing catalyst (0. (05 parts by mass) was added and further stirred to obtain a uniform resin solution. Thereafter, inorganic filler 1 (180 parts by mass), inorganic filler 2 (40 parts by mass) and inorganic filler 3 (10 parts by mass) surface-treated with a coupling agent are added to this resin solution and stirred again. Thus, a resin composition was obtained.

Example 4
A mixture of phenolic resin 1 (35 parts by mass), phenolic resin 5 (15 parts by mass), epoxy resin 1 (40 parts by mass) and epoxy resin 4 (10 parts by mass) was stirred in a solvent, and then a curing catalyst (0 (.05 parts by mass) was added and stirred to obtain a uniform resin solution. Thereafter, inorganic filler 1 (200 parts by mass), inorganic filler 2 (35 parts by mass) and inorganic filler 3 (5 parts by mass) surface-treated with a coupling agent are added to this resin solution and stirred again. Thus, a resin composition was obtained.

(Example 5)
After stirring a mixture of phenolic resin 1 (35 parts by mass), phenolic resin 2 (10 parts by mass), and epoxy resin 1 (55 parts by mass) in a solvent, a curing catalyst (0.05 parts by mass) is added, and A uniform resin solution was obtained by stirring. Thereafter, inorganic filler 1 (150 parts by mass), inorganic filler 2 (40 parts by mass) and inorganic filler 3 (10 parts by mass) surface-treated with a coupling agent are added to this resin solution and stirred again. Thus, a resin composition was obtained.

(Example 6)
After stirring a mixture of phenolic resin 1 (30 parts by mass), phenolic resin 3 (15 parts by mass), and epoxy resin 1 (55 parts by mass) in a solvent, a curing catalyst (0.05 parts by mass) is added, and A uniform resin solution was obtained by stirring. Thereafter, inorganic filler 1 (150 parts by mass), inorganic filler 2 (40 parts by mass) and inorganic filler 3 (10 parts by mass) surface-treated with a coupling agent are added to this resin solution and stirred again. Thus, a resin composition was obtained.

(Example 7)
A mixture of phenol resin 1 (15 parts by mass), phenol resin 2 (25 parts by mass), epoxy resin 1 (30 parts by mass), and epoxy resin 2 (30 parts by mass) was stirred in a solvent, and then a curing catalyst (0. (05 parts by mass) was added and further stirred to obtain a uniform resin solution. Thereafter, inorganic filler 1 (150 parts by mass), inorganic filler 2 (40 parts by mass) and inorganic filler 3 (10 parts by mass) surface-treated with a coupling agent are added to this resin solution and stirred again. Thus, a resin composition was obtained.

(Comparative Example 1)
A mixture of phenol resin 1 (30 parts by mass), phenol resin 2 (10 parts by mass), epoxy resin 1 (30 parts by mass), and epoxy resin 2 (30 parts by mass) was stirred in a solvent, and then a curing catalyst (0. (05 parts by mass) was added and further stirred to obtain a uniform resin solution. Thereafter, inorganic filler 1 (85 parts by mass), inorganic filler 2 (30 parts by mass) and inorganic filler 3 (5 parts by mass) surface-treated with a coupling agent are added to this resin solution and stirred again. Thus, a resin composition was obtained.

(Comparative Example 2)
A mixture of phenol resin 1 (30 parts by mass), phenol resin 2 (10 parts by mass), epoxy resin 1 (30 parts by mass), and epoxy resin 2 (30 parts by mass) was stirred in a solvent, and then a curing catalyst (0. (05 parts by mass) was added and further stirred to obtain a uniform resin solution. Thereafter, inorganic filler 1 (240 parts by mass), inorganic filler 2 (40 parts by mass) and inorganic filler 3 (5 parts by mass) surface-treated with a coupling agent are added to this resin solution and stirred again. Thus, a resin composition was obtained.

(Comparative Example 3)
A mixture of phenol resin 1 (30 parts by mass), phenol resin 2 (10 parts by mass), epoxy resin 1 (20 parts by mass), and epoxy resin 2 (40 parts by mass) was stirred in a solvent, and then a curing catalyst (0. (05 parts by mass) was added and further stirred to obtain a uniform resin solution. Thereafter, inorganic filler 1 (150 parts by mass), inorganic filler 2 (40 parts by mass) and inorganic filler 3 (10 parts by mass) surface-treated with a coupling agent are added to this resin solution and stirred again. Thus, a resin composition was obtained.

[C] Production of prepreg (Examples 1 to 7)
A glass cloth (“1280 S199” manufactured by Nitto Boseki Co., Ltd., thickness 60 μm), which is a glass fiber substrate treated with a coupling agent, was used as the reinforcing fiber substrate.

  A prepreg was produced by impregnating the base material (100 parts by mass) with a resin composition (110 parts by mass), followed by drying at 150 ° C. and semi-curing.

(Comparative Example 1)
A prepreg was produced in the same manner as in Examples 1 to 7, except that a reinforcing fiber base material (“1280” manufactured by Nitto Boseki Co., Ltd.) that was not treated with a coupling agent was used.

(Comparative Examples 2 and 3)
Prepregs were produced in the same manner as in Examples 1-7.

[D] Manufacture of laminated board (Examples 1-7 and Comparative Examples 1-3)
A 12 μm thick copper foil is laminated on both sides of the prepreg, and this is heated and pressed under the conditions of 200 ° C., 4.0 MPa, 90 minutes to form a 0.06 mm thick laminate (copper clad laminate). Manufactured.

[E] Measurement The following measurements were performed for each laminate.

(1) Glass transition temperature (Tg)
The glass transition temperature (Tg) was measured by the DMA method using a sample obtained by heating and press-molding and curing a prepreg as a sample. The maximum value of (loss elastic modulus / storage elastic modulus) was defined as the glass transition temperature (Tg).

(2) Formability After removing the copper foils on both sides of the laminate by etching, the surface was observed visually and the cross section was observed by SEM. And the quality of the moldability was judged by the presence or absence of a void. That is, “◯” indicates that there is no void, and “X” indicates that there is a void.

(3) Warpage of semiconductor package (PKG) A printed wiring board 1 is manufactured by forming a circuit pattern on a laminated board, and a die attach film 2 ("FH900" manufactured by Hitachi Chemical Co., Ltd., thickness) The semiconductor chip 3 (10 mm × 10 mm × thickness 0.15 mm) is adhered and fixed by a thickness of 0.03 mm), and the semiconductor chip 3 is sealed with a resin material 6 (“CV8710MLE” manufactured by Panasonic Electric Works Co., Ltd.) An FBGA type semiconductor package 7 (14 mm × 14 mm × thickness 430 μm) as shown in FIG. 1 was manufactured. In Comparative Example 2, the semiconductor package was not manufactured because the moldability of the resin composition was poor. And the curvature displacement amount of the semiconductor package in 30-260 degreeC by the three-dimensional shape measurement using a shadow moire was measured. It can be said that a semiconductor package having a warp displacement amount of ± 150 μm at 30 to 260 ° C. can be used in a general mounting process.

  Table 1 shows the results of (1) to (3).

  The warp displacement amount of the semiconductor packages of Examples 1 to 7 at 30 to 260 ° C. is 150 μm or less (particularly, Examples 1 to 6 are 100 μm or less), which are good values.

  The warp displacement amount of the semiconductor packages of Comparative Examples 1 and 3 at 30 to 260 ° C. is as large as 150 to 200 μm.

Claims (8)

(A) a phenolic resin;
(B) an epoxy resin;
(C) a resin composition for an electronic circuit board material containing an inorganic filler,
The component (A) contains a novolak phenol resin having a naphthalene skeleton having two or more hydroxyl groups in the molecule and having at least one hydroxyl group among the hydroxyl groups,
The novolak phenol resin is represented by the following formula (1):
The component (B) contains a polyfunctional epoxy resin having two or more epoxy groups in the molecule,
Content of the said (C) component with respect to 100 mass parts of said (A) and (B) component is 130-250 mass parts,
A resin composition for an electronic circuit board material, wherein a glass transition temperature (Tg) after curing is 220 ° C. or higher.

The resin composition for an electronic circuit board material according to claim 1, wherein the content of the novolak phenol resin with respect to the total amount of the component (A) is 50% by mass or more. The resin composition for an electronic circuit board material according to claim 1, wherein 70% by mass or more of the component (C) is fused silica. The surface of said (C) component is processed with the coupling agent, The resin composition for electronic circuit board | substrate materials as described in any one of Claim 1 thru | or 3 characterized by the above-mentioned. A reinforcing fiber substrate;
A prepreg comprising: the resin composition for an electronic circuit board material according to any one of claims 1 to 4, which is impregnated in a base material of the reinforcing fiber. The prepreg according to claim 5, wherein the reinforcing fiber is a glass fiber. It forms with the hardened | cured material of 1 sheet | seat of the prepreg of Claim 5 or 6, or several laminated body, The laminated board characterized by the above-mentioned. One cured product of the prepreg according to claim 5 or 6, or a cured product of a plurality of laminates;
A metal-clad laminate, comprising: a metal foil bonded to one or both sides of the cured product.

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