JP2016023992A - Electronic component conveyance device and electronic component inspection device - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide an electronic component conveyance device and an electronic component inspection device that can prevent a temperature of an electronic component from changing from a predetermined temperature when a conveyance part for conveying the electronic component is stopped.SOLUTION: An electronic component conveyance device comprises a conveyance part for conveying an electronic component and a member for arranging the electronic component and either heating or cooling the electronic component. When the conveyance part is stopped, the device stops the conveyance part when the electronic component is located at a first position; the device stops the conveyance part after the electronic component is conveyed to the first position when the electronic component is located at a second position farther from the member than the first position.SELECTED DRAWING: Figure 5

Description

  The present invention relates to an electronic component conveying device and an electronic component inspection device.

  2. Description of the Related Art Conventionally, an electronic component inspection apparatus that inspects the electrical characteristics of an electronic component such as an IC device is known. This electronic component inspection apparatus includes an electronic component for transporting an IC device to a holding unit of an inspection unit. A transport device is incorporated. When inspecting the IC device, the IC device is disposed in the holding unit, and a plurality of probe pins provided in the holding unit are brought into contact with the terminals of the IC device. Such an IC device inspection may be performed by heating or cooling the IC device to a predetermined temperature.

  The electronic component conveying apparatus heats or cools the IC device in advance to adjust the IC device to a temperature suitable for inspection, and conveys the IC device whose temperature is adjusted by the soak plate to the vicinity of the inspection unit. The apparatus includes a supply shuttle, a device transfer head for transferring the IC device between the tray on which the IC device is arranged and the soak plate, and the IC device between the soak plate and the supply shuttle. In the supply shuttle, like the soak plate, the IC device can be heated or cooled to adjust the IC device to a temperature suitable for inspection.

  Patent Document 1 discloses an electronic component inspection apparatus in which an IC device is conveyed by an electronic component conveyance apparatus and inspected at a low temperature. An area in which an inspection unit is accommodated is managed at a low temperature, and the area is managed at the low temperature. And a region where the temperature is not controlled is disclosed by a shutter.

  Such an electronic component transport apparatus stops its operation immediately when, for example, a “pause button” is pressed during the operation.

JP-A-5-52904

  However, in the conventional electronic component conveying apparatus, when the IC device is being conveyed by the device conveying head, that is, when the IC device is separated from the soak plate or supply shuttle, if the device conveying head is stopped, The temperature of the IC device deviates from a temperature suitable for inspection. For this reason, when restarting the operation of the electronic component transport apparatus, the IC device must be heated or cooled again, and the IC device must be adjusted to a temperature suitable for the inspection, which takes a long time until the inspection. There is.

  An object of the present invention is to provide an electronic component transport apparatus and an electronic component inspection apparatus capable of suppressing the temperature of an electronic component from changing from a predetermined temperature when a transport unit that transports the electronic component stops. is there.

  SUMMARY An advantage of some aspects of the invention is to solve at least a part of the problems described above, and the invention can be implemented as the following forms or application examples.

[Application Example 1]
The electronic component transport apparatus of the present invention includes a transport unit that transports an electronic component,
A member that arranges the electronic component and performs at least one of heating and cooling of the electronic component,
When the transport unit is stopped, when the electronic component is positioned at the first position, the transport unit is stopped, and the electronic component is positioned at a second position farther from the member than the first position. When carrying out, the said conveyance part is stopped after conveying the said electronic component to the said 1st position, It is characterized by the above-mentioned.

  Thus, when the transport unit is stopped by setting the first position at, for example, the position of the electronic component disposed on the member or in the vicinity thereof, the transport unit is moved with the electronic component disposed on or near the member. Since it stops, it can suppress that the temperature of an electronic component changes from predetermined temperature.

[Application Example 2]
In the electronic component conveying apparatus of the present invention, it is preferable that when the conveying unit is stopped, when the electronic component is located at the first position, the conveying unit is stopped at the first position.

  Thereby, when a conveyance part stops, it can suppress that the temperature of an electronic component changes from predetermined temperature.

[Application Example 3]
In the electronic component transport device according to the aspect of the invention, it is preferable that the member includes a first member and a second member that are arranged at different positions.

  Thereby, when a conveyance part stops when conveying an electronic component between a 1st member and a 2nd member, it can suppress that the temperature of an electronic component changes from predetermined temperature.

[Application Example 4]
In the electronic component transport apparatus according to the present invention, when the transport unit stops when transporting the electronic component from the first member to the second member, the electronic component is positioned at the second position. In this case, it is preferable to stop the transport unit after transporting the electronic component to the second member.

  Thereby, compared with the case where a conveyance part is stopped after returning an electronic component to a 1st member, the conveyance efficiency of an electronic component can be improved.

[Application Example 5]
In the electronic component transport apparatus according to the present invention, when the transport unit stops when transporting the electronic component from the first member to the second member, the electronic component is positioned at the second position. In the case, the transport unit may be stopped after transporting the electronic component to the member closer to the electronic component located at the second position out of the first member and the second member. preferable.

  Accordingly, the electronic component can be quickly transported to the first member or the second member, whereby the electronic component can be transferred to the first member while the temperature of the electronic component is less changed from the predetermined temperature. It can be placed on the member or the second member.

[Application Example 6]
In the electronic component transport device of the present invention, it is preferable that the first position is a position of the electronic component disposed on the member.

  Thereby, when a conveyance part stops, a conveyance part can be stopped in the state in which the electronic component was arrange | positioned at the member, and it can suppress that the temperature of an electronic component changes from predetermined temperature.

[Application Example 7]
In the electronic component transport device of the present invention, a storage unit that stores at least one stop condition for stopping the transport unit;
A determination unit that determines whether or not any one of the stop conditions is satisfied,
If any one of the stop conditions is satisfied, it is preferable to determine that the transport unit is to be stopped.

  Thereby, when any stop condition of the said stop conditions is satisfy | filled, a conveyance part can be stopped and it can suppress that the temperature of an electronic component changes from predetermined temperature in that case.

[Application Example 8]
In the electronic component transport device of the present invention, the electronic component transport device has a detection unit that detects that the electronic component is not arranged at a predetermined position.
The stop condition is preferably a case where the detection unit detects that the electronic component is not arranged at a predetermined position.

  Thereby, when the said electronic component is not arrange | positioned in a predetermined position by a detection part, a conveyance part can be stopped and it can suppress that the temperature of an electronic component changes from predetermined temperature in that case.

[Application Example 9]
In the electronic component conveying apparatus of the present invention, it is preferable that the stop condition is a case where a stop operation is performed.

  Thereby, when a stop operation is performed, a conveyance part can be stopped and it can suppress that the temperature of an electronic component changes from predetermined temperature in that case.

[Application Example 10]
In the electronic component transport apparatus of the present invention, a first operation mode in which the temperature is controlled by performing at least one of heating and cooling of the electronic component, and a second operation mode in which neither heating nor cooling of the electronic component is performed. And can be selected,
When the transport unit stops when the first operation mode is set, when the electronic component is located at the first position, the transport unit is stopped and the electronic component is moved to the second position. It is preferable to stop the said conveyance part, after conveying the said electronic component to the said 1st position.

  Thereby, when a conveyance part stops when an operation mode is set to the 1st operation mode, it can suppress that the temperature of an electronic component changes from predetermined temperature.

[Application Example 11]
In the electronic component transport apparatus according to the present invention, it is preferable that the electronic component transport apparatus includes a notification unit that performs notification after the transport unit is stopped.

  Thereby, the operator can grasp the present situation, such as that the conveyance part stopped, the cause of the stop, a coping method, etc., for example.

[Application Example 12]
An electronic component inspection apparatus of the present invention includes a transport unit that transports an electronic component,
A member for arranging the electronic component and performing at least one of heating and cooling of the electronic component;
An inspection unit for inspecting the electronic component,
When the transport unit is stopped, when the electronic component is positioned at the first position, the transport unit is stopped, and the electronic component is positioned at a second position farther from the member than the first position. When carrying out, the said conveyance part is stopped after conveying the said electronic component to the said 1st position, It is characterized by the above-mentioned.

  Thus, when the transport unit is stopped by setting the first position at, for example, the position of the electronic component disposed on the member or in the vicinity thereof, the transport unit is moved with the electronic component disposed on or near the member. Since it stops, it can suppress that the temperature of an electronic component changes from predetermined temperature.

It is a schematic plan view which shows 1st Embodiment of the electronic component inspection apparatus of this invention. It is a block diagram of the electronic component inspection apparatus shown in FIG. It is a figure which shows the display screen of the display part of the electronic component inspection apparatus shown in FIG. It is a figure for demonstrating operation | movement of the electronic component inspection apparatus shown in FIG. It is a flowchart which shows the control operation of the electronic component inspection apparatus shown in FIG. It is a figure for demonstrating operation | movement of 2nd Embodiment of the electronic component inspection apparatus of this invention. It is a flowchart which shows the control operation of the electronic component inspection apparatus shown in FIG.

  DESCRIPTION OF EMBODIMENTS Hereinafter, an electronic component conveying device and an electronic component inspection device of the present invention will be described in detail based on embodiments shown in the accompanying drawings.

<First Embodiment>
FIG. 1 is a schematic plan view showing a first embodiment of an electronic component inspection apparatus of the present invention. FIG. 2 is a block diagram of the electronic component inspection apparatus shown in FIG. FIG. 3 is a diagram showing a display screen of the display unit of the electronic component inspection apparatus shown in FIG. FIG. 4 is a diagram for explaining the operation of the electronic component inspection apparatus shown in FIG. FIG. 5 is a flowchart showing a control operation of the electronic component inspection apparatus shown in FIG.

  In the following, for convenience of explanation, as shown in FIG. 1, three axes orthogonal to each other are referred to as an X axis, a Y axis, and a Z axis. Further, the XY plane including the X axis and the Y axis is horizontal, and the Z axis is vertical. A direction parallel to the X axis is also referred to as “X direction”, a direction parallel to the Y axis is also referred to as “Y direction”, and a direction parallel to the Z axis is also referred to as “Z direction”. The direction of the arrow of each axis of the X axis, the Y axis, and the Z axis is referred to as a plus side, and the direction opposite to the arrow is referred to as a minus side. Further, the upstream side in the conveying direction of the electronic component is also simply referred to as “upstream side”, and the downstream side is also simply referred to as “downstream side”. In addition, “horizontal” as used in the specification of the present application is not limited to complete horizontal, and includes a state where the electronic component is slightly inclined (for example, less than about 5 °) as long as transportation of electronic components is not hindered. FIG. 4 is schematically illustrated.

  An inspection apparatus (electronic component inspection apparatus) 1 shown in FIG. 1 includes, for example, an IC device such as a BGA (Ball grid array) package and an LGA (Land grid array) package, an LCD (Liquid Crystal Display), and a CIS (CMOS Image Sensor). It is an apparatus for inspecting and testing (hereinafter simply referred to as “inspection”) electrical characteristics of electronic components such as the above. Hereinafter, for convenience of explanation, the case where an IC device is used as the electronic component to be inspected will be described as a representative, and this will be referred to as “IC device 90”.

  As shown in FIG. 1, the inspection apparatus 1 includes a tray supply area A1, a device supply area (hereinafter simply referred to as “supply area”) A2, an inspection area A3, and a device collection area (hereinafter simply referred to as “collection area”). Say) A4 and tray removal area A5. Each of these regions is partitioned from each other by a wall portion, a shutter, or the like (not shown). The supply area A2 is a first chamber R1 defined by walls and shutters, and the inspection area A3 is a second chamber R2 defined by walls and shutters. In addition, the collection area A4 is a third chamber R3 defined by walls and shutters. The first chamber R1 (supply region A2), the second chamber R2 (inspection region A3), and the third chamber R3 (collection region A4) are each configured to ensure airtightness and heat insulation. ing. Thereby, each of the first chamber R1, the second chamber R2, and the third chamber R3 can maintain humidity and temperature as much as possible. The interiors of the first chamber R1 and the second chamber R2 are controlled to a predetermined humidity and a predetermined temperature, respectively.

  The IC device 90 is inspected in the intermediate inspection area A3 through the respective areas in order from the tray supply area A1 to the tray removal area A5. As described above, the inspection apparatus 1 includes the electronic component transport apparatus that transports the IC device 90 in each region and has the control unit 80, the inspection unit 16 that performs inspection in the inspection region A3, and the inspection control unit (not shown). It has become. In the inspection apparatus 1, an electronic component transport apparatus is configured by a configuration excluding the inspection unit 16 and the inspection control unit.

  The tray supply area A1 is an area to which a tray 200 in which a plurality of IC devices 90 in an uninspected state are arranged is supplied. In the tray supply area A1, a large number of trays 200 can be stacked.

  The supply area A2 is an area for supplying a plurality of IC devices 90 on the tray 200 from the tray supply area A1 to the inspection area A3. A first tray transport mechanism 11A and a second tray transport mechanism 11B that transport the tray 200 one by one are provided so as to straddle the tray supply area A1 and the supply area A2.

  The supply area A2 is provided with a temperature adjustment unit (soak plate) 12, which is an arrangement unit in which the IC device 90 is arranged, a first device transfer head (transfer unit) 13, and a third tray transfer mechanism 15. ing.

  The temperature adjustment unit 12 is an apparatus that heats or cools the plurality of IC devices 90 to adjust (control) the IC devices 90 to a temperature suitable for inspection. That is, the temperature adjustment unit 12 is a temperature control member (member) that can arrange the IC device 90 and can perform both heating and cooling of the IC device 90. In the configuration shown in FIG. 1, two temperature adjusting units 12 are arranged and fixed in the Y direction. Then, the IC device 90 on the tray 200 carried (conveyed) from the tray supply area A1 by the first tray transport mechanism 11A is transported to and placed on any temperature adjustment unit 12.

  The first device transport head 13 is supported so as to be movable in the supply region A2. Thereby, the first device transport head 13 transports the IC device 90 between the tray 200 carried in from the tray supply area A1 and the temperature adjustment unit 12, the temperature adjustment unit 12, and a device supply unit 14 to be described later. And the IC device 90 can be transported between them. The first device transport head 13 has a plurality of gripping portions (not shown) that grip the IC device 90. Each gripping portion includes a suction nozzle and sucks the IC device 90. Hold it.

  The third tray transport mechanism 15 is a mechanism for transporting the empty tray 200 in a state where all the IC devices 90 are removed in the X direction. After this conveyance, the empty tray 200 is returned from the supply area A2 to the tray supply area A1 by the second tray conveyance mechanism 11B.

  The inspection area A3 is an area where the IC device 90 is inspected. In the inspection area A3, a device supply unit (supply shuttle) 14, which is a transport unit that transports the IC device 90, an inspection unit 16, a second device transport head (contact portion) 17, and a device collection unit ( A recovery shuttle) 18 is provided.

  The device supply unit 14 is a device that conveys the temperature-adjusted (temperature-controlled) IC device 90 to the vicinity of the inspection unit 16. The device supply unit 14 is supported so as to be movable along the X direction between the supply region A2 and the inspection region A3. In the configuration shown in FIG. 1, two device supply units 14 are arranged in the Y direction, and the IC device 90 on the temperature adjustment unit 12 is transported to and placed on one of the device supply units 14. . In the device supply unit 14, similarly to the temperature adjustment unit 12, the IC device 90 can be heated or cooled to adjust the IC device 90 to a temperature suitable for inspection. That is, the device supply unit 14 is a temperature control member (member) that can arrange the IC device 90 and can perform both heating and cooling of the IC device 90.

  The inspection unit 16 is a unit that inspects and tests the electrical characteristics of the IC device 90, that is, a holding unit that holds the IC device 90 when the IC device 90 is inspected. The inspection unit 16 is provided with a plurality of probe pins that are electrically connected to the terminals of the IC device 90 while holding the IC device 90. Then, the terminal of the IC device 90 and the probe pin are electrically connected (contacted), and the IC device 90 is inspected via the probe pin. The inspection of the IC device 90 is performed based on a program stored in a storage unit of an inspection control unit provided in a tester (not shown) connected to the inspection unit 16. In the inspection unit 16, similarly to the temperature adjustment unit 12, the IC device 90 can be heated or cooled to adjust the IC device 90 to a temperature suitable for the inspection. That is, the inspection unit 16 is a temperature control member (member) that can arrange the IC device 90 and can perform both heating and cooling of the IC device 90.

  The second device transport head 17 is supported so as to be movable in the inspection area A3. Accordingly, the second device transport head 17 can transport and place the IC device 90 on the device supply unit 14 carried in from the supply region A2 onto the inspection unit 16. When inspecting the IC device 90, the second device transport head 17 presses the IC device 90 toward the inspection unit 16, thereby bringing the IC device 90 into contact with the inspection unit 16. Thereby, as described above, the terminals of the IC device 90 and the probe pins of the inspection unit 16 are electrically connected. The second device transport head 17 has a plurality of gripping portions (not shown) that grip the IC device 90, and each gripping portion includes a suction nozzle and sucks the IC device 90. Hold it. In the second device transport head 17, similarly to the temperature adjustment unit 12, the IC device 90 can be heated or cooled to adjust the IC device 90 to a temperature suitable for inspection.

  The device collection unit 18 is an apparatus that conveys the IC device 90 that has been inspected by the inspection unit 16 to the collection area A4. The device collection unit 18 is supported so as to be movable along the X direction between the inspection area A3 and the collection area A4. In the configuration shown in FIG. 1, two device collection units 18 are arranged in the Y direction, like the device supply unit 14, and the IC device 90 on the inspection unit 16 is connected to any one of the device collection units 18. Transported and placed. This transport is performed by the second device transport head 17.

  The collection area A4 is an area where the IC device 90 that has been inspected is collected. In the collection area A4, a collection tray 19, a third device transport head (transport section) 20, and a sixth tray transport mechanism 21 are provided. An empty tray 200 is also prepared in the collection area A4.

  The collection trays 19 are fixed in the collection area A4, and in the configuration shown in FIG. 1, three collection trays 19 are arranged along the X direction. Three empty trays 200 are also arranged along the X direction. Then, the IC device 90 on the device recovery unit 18 that has moved to the recovery area A4 is transported and placed in one of the recovery tray 19 and the empty tray 200. As a result, the IC device 90 is collected and classified for each inspection result.

  The third device transport head 20 is supported so as to be movable in the collection area A4. Accordingly, the third device transport head 20 can transport the IC device 90 from the device recovery unit 18 to the recovery tray 19 or the empty tray 200. The third device transport head 20 has a plurality of gripping portions (not shown) that grip the IC device 90, and each gripping portion includes a suction nozzle and sucks the IC device 90. Hold it.

  The sixth tray transport mechanism 21 is a mechanism for transporting the empty tray 200 carried in from the tray removal area A5 in the X direction. Then, after this conveyance, the empty tray 200 is arranged at a position where the IC device 90 is collected, that is, it can be one of the three empty trays 200.

  The tray removal area A5 is an area where the tray 200 in which a plurality of inspected IC devices 90 are arranged is collected and removed. In the tray removal area A5, a large number of trays 200 can be stacked.

  In addition, a fourth tray transport mechanism 22A and a fifth tray transport mechanism 22B that transport the tray 200 one by one are provided so as to straddle the collection area A4 and the tray removal area A5. The fourth tray transport mechanism 22A is a mechanism for transporting the tray 200 on which the inspected IC device 90 is placed from the collection area A4 to the tray removal area A5. The fifth tray transport mechanism 22B is a mechanism for transporting an empty tray 200 for collecting the IC device 90 from the tray removal area A5 to the collection area A4.

  The test control unit of the tester, for example, inspects the electrical characteristics of the IC device 90 arranged in the test unit 16 based on a program stored in a storage unit (not shown).

  Further, the control unit 80 includes, for example, the first tray transport mechanism 11A, the second tray transport mechanism 11B, the temperature adjustment unit 12, the first device transport head 13, the device supply unit 14, and the third supply unit. Tray transport mechanism 15, inspection unit 16, second device transport head 17, device collection unit 18, third device transport head 20, sixth tray transport mechanism 21, and fourth tray transport mechanism The drive of each part of 22A and the 5th tray conveyance mechanism 22B is controlled.

  As shown in FIG. 2, the inspection apparatus 1 includes a temperature sensor 41 that detects temperature, a humidity sensor 42 that detects humidity, an optical sensor (detection unit) 43 that is used to detect jamming, and heating that heats. A mechanism (heating unit) 51, a cooling mechanism (cooling unit) 52 for cooling, a dry air supply mechanism (dry air supply unit) 53 for supplying dry air, and an operation unit 6 for performing each operation of the inspection apparatus 1, And an alarm 71. In FIG. 2, for example, only one of the temperature sensor 41, the humidity sensor 42, the optical sensor 43, and the heating mechanism 51 is provided as a representative. In addition, the control unit 80 includes a storage unit 801 that stores each information and a determination unit 803 that performs each determination (discrimination), and includes a heating mechanism 51, a cooling mechanism 52, a dry air supply mechanism 53, a display unit 62, and Controls the driving of each part such as the alarm 71.

  The temperature sensor 41 and the humidity sensor 42 are respectively disposed in predetermined portions inside the inspection apparatus 1, in this embodiment, the first chamber R 1 and the second chamber R 2, and the temperature sensor 41 and the humidity sensor 42 are arranged. Thus, the temperature and humidity in the first chamber R1 and the second chamber R2 can be detected, respectively. In the present embodiment, each humidity is a relative humidity.

  The optical sensor 43 has a light emitting unit and a light receiving unit. The optical sensor 43 is disposed in each predetermined part inside the inspection apparatus 1, in this embodiment, the temperature adjustment unit 12, the device supply unit 14, the inspection unit 16, and the device collection unit 18. The control unit 80 detects a jam in each of the temperature adjustment unit 12, the device supply unit 14, the inspection unit 16, and the device collection unit 18 based on the detection result of the optical sensor 43. The jam is, for example, that the IC device 90 is not arranged at a predetermined position (appropriate position).

  The operation unit 6 includes an input unit 61 that performs each input and a display unit 62 that displays an image. The input unit 61 is not particularly limited, and examples thereof include a keyboard and a mouse. The display unit 62 is not particularly limited, and examples thereof include a liquid crystal display panel and an organic EL display panel. For example, the operator (operator) operates the operation unit 6 by operating the input unit 61, moving the cursor to the position of each operation button (icon) displayed on the display unit 62, and selecting (clicking). In the following, this operation is also referred to as “pressing the operation button”.

  Note that some or all of the operation buttons displayed on the display unit 62 may be provided as mechanical operation buttons such as push buttons.

Further, the operation unit 6 is not limited to the one having the above-described configuration, and examples thereof include a device such as a touch panel that can input and display an image.
The notification unit is configured by the display unit 62 and the alarm 71 of the operation unit 6.

  Moreover, it does not specifically limit as the heating mechanism 51, For example, the heater etc. which have a heating wire are mentioned. Moreover, the heating mechanism 51 may further include an air source such as a fan, and may be configured to blow warm air (hot air) from the air source. In this embodiment, the heating mechanism 51 is arrange | positioned at the temperature adjustment part 12, the device supply part 14, the test | inspection part 16, and the 2nd device conveyance head 17, and these can be heated now. Note that when the temperature adjustment unit 12, the device supply unit 14, the inspection unit 16, and the second device transport head 17 are heated, the temperature adjustment unit 12, the device supply unit 14, and the inspection unit 16 according to the heating, respectively. The temperature of the chamber in which the second device transport head 17 is disposed also rises.

  In addition, the cooling mechanism 52 is not particularly limited, and examples thereof include a device that cools by flowing a refrigerant (for example, a low-temperature gas) through a tube disposed in the vicinity of the object to be cooled, a Peltier element, and the like. In the present embodiment, the cooling mechanism 52 uses a device that cools the refrigerant by flowing it into a pipe disposed in the vicinity of the object to be cooled, and uses nitrogen gas obtained by vaporizing liquid nitrogen as the refrigerant. In the present embodiment, the cooling mechanism 52 can cool the temperature adjustment unit 12, the device supply unit 14, the inspection unit 16, and the second device transport head 17, respectively. Note that when the temperature adjustment unit 12, the device supply unit 14, the inspection unit 16, and the second device transport head 17 are cooled, the temperature adjustment unit 12, the device supply unit 14, and the inspection unit 16 according to the cooling. And the temperature of the chamber in which the second device transport head 17 is disposed also decreases.

  The dry air supply mechanism 53 is configured to be able to supply (flow) low-humidity air or a gas such as nitrogen (hereinafter also referred to as dry air) to each predetermined part inside the inspection apparatus 1. ing. When the IC device 90 is cooled to a predetermined temperature and inspected, each necessary part is cooled accordingly, but by supplying dry air to each necessary part, condensation and icing (freezing) can be prevented. it can. In this embodiment, the dry air supply mechanism 53 can supply dry air to the temperature adjustment unit 12, the device supply unit 14, the inspection unit 16, and the device collection unit 18, that is, dry air is supplied to the first chamber R1 and the second chamber R2. Air can be supplied.

  In the present embodiment, the dry air used in the dry air supply mechanism 53 is a mixed gas of nitrogen gas after use in the cooling mechanism 52 and air having low humidity when cooled by the cooling mechanism 52. When the cooling is stopped, only the low humidity air is used.

  The inspection apparatus 1 includes, as an operation mode (temperature mode), a first operation mode (temperature management mode) in which the temperature is managed by performing at least one of heating and cooling of the IC device 90, and heating and cooling of the IC device 90. The second operation mode (temperature non-management mode) is not performed (the temperature is not managed), and the first operation mode and the second operation mode can be selected. Yes.

  The first operation mode includes a high temperature mode and a low temperature mode, and the second operation mode includes a normal temperature mode, a normal temperature control mode, and a dehumidification mode. The inspection apparatus 1 is configured to be able to selectively set the high temperature mode, the low temperature mode, the normal temperature mode, the normal temperature control mode, and the dehumidification mode. Hereinafter, each operation mode will be described.

  The high temperature mode is an operation mode in which the heating mechanism 51 is driven and the IC device 90 is conveyed in a heated state. In the high temperature mode, dehumidification by the dry air supply mechanism 53 is not performed.

  The room temperature mode is an operation mode in which neither heating by the heating mechanism 51 nor cooling by the cooling mechanism 52 is performed. Further, in the room temperature mode, dehumidification by the dry air supply mechanism 53 is not performed.

  In the normal temperature control mode, neither heating by the heating mechanism 51 nor cooling by the cooling mechanism 52 is performed, but the temperature is detected by the temperature sensor 41 and predetermined control is performed based on the detection result of the temperature. It is. Further, in the room temperature control mode, dehumidification by the dry air supply mechanism 53 is not performed. In addition, as an example of the control when this room temperature control mode is set, for example, the operation is stopped when the temperature exceeds 30 ° C., and the operation is performed when the temperature is 30 ° C. or less.

  The low temperature mode is an operation mode in which the dry air supply mechanism 53 is driven to perform dehumidification and the cooling mechanism 52 is driven to perform cooling.

  The dehumidifying mode is an operation mode in which the dry air supply mechanism 53 is driven to perform dehumidification. In the dehumidifying mode, cooling by the cooling mechanism 52 is not performed. This dehumidification mode is used, for example, when the inside of the apparatus is kept in a dry state to shorten the dehumidification time after shifting to the low temperature mode.

  The selection (setting) of the operation mode is performed using the input unit 61 and a predetermined image displayed on the screen 620 of the display unit 62. Hereinafter, an example of the image will be described.

  As shown in FIG. 3, in the image, “stopped” is displayed in the upper left frame 621 in FIG. 3 of the screen 620.

  Also, in the frame 621, a plurality of selection buttons (operation buttons) for selecting an operation mode, that is, a high temperature mode selection button 622 for selecting a high temperature mode, a normal temperature mode selection button 623 for selecting a normal temperature mode, and a normal temperature control mode A room temperature control mode selection button 624 for selecting, a low temperature mode selection button 625 for selecting a low temperature mode, and a dehumidification mode selection button 626 for selecting a dehumidification mode are displayed.

  When the high temperature mode selection button 622 is pressed, the operation mode is set to the high temperature mode. When the normal temperature mode selection button 623 is pressed, the operation mode is set to the normal temperature mode. When the normal temperature control mode selection button 624 is pressed, the operation mode is the normal temperature. When the control mode is set and the low temperature mode selection button 625 is pressed, the operation mode is set to the low temperature mode, and when the dehumidification mode selection button 626 is pressed, the operation mode is set to the dehumidification mode.

  In the inspection apparatus 1, when the operation mode is set to the first operation mode, that is, when the high-temperature mode or the low-temperature mode is set, the first device transport head 13 is stopped (first When the first device transport head 13 is stopped), the first device transport head 13 is not immediately stopped immediately, but the following control is performed.

  In addition, when the second device transport head 17 and the third device transport head 20 are stopped, the control described below is not performed, for example, immediately stopped. The second device transport head 17 and the third device transport head 20 may also perform the control described below.

  When the operation mode is set to the second operation mode, that is, when the operation mode is set to any one of the normal temperature mode, the normal temperature control mode, and the dehumidification mode, the first device transport head 13, the first When the second device transport head 17 and the third device transport head 20 are stopped, they are immediately stopped.

  Hereinafter, control when the operation mode is set to the high temperature mode or the low temperature mode and the first device transport head 13 is stopped will be described.

  When the inspection device 1 stops the first device transport head 13 and the IC device 90 is positioned at the first position, the inspection apparatus 1 stops the first device transport head 13 and the IC device 90 moves to the first position. If the IC device 90 is transported to the first position, the first device transport head 13 is stopped when the IC device 90 is transported to the first position.

  Although the number of the temperature control members may be one or plural, in the present embodiment, the number of the temperature control members is two, and the temperature control member is a temperature adjusting unit (first temperature). A case in which the control member (first member) 12 and the device supply unit (second temperature control member) (second member) 14 are configured will be described as a representative.

  In the present embodiment, as shown in FIG. 4, the IC device 90 disposed (in contact with) the temperature adjusting unit 12 is supplied from the temperature adjusting unit 12 by the first device transport head 13. Control in the case of stopping the first device transport head 13 in the transport work (operation) transported to the unit 14 and disposed in the device supply unit 14 will be described.

  Here, the first position is the position of the IC device 90 disposed on the temperature control member (the position at which the IC device 90 contacts the temperature control member), that is, the temperature adjustment shown in FIGS. 4 (a) and 4 (b). The position of the IC device 90 arranged in the unit 12 or the position of the IC device 90 arranged in the device supply unit 14 shown in FIG.

  The second position is a position farther from the temperature control member than the first position, that is, a position of the IC device 90 that is not arranged in any of the temperature adjustment unit 12 and the device supply unit 14. As an example, the position of the IC device 90 shown in FIG.

  Note that the first position is not limited to the above position, for example, a position where the IC device 90 can be heated or cooled by the temperature adjustment unit 12, such as the vicinity of the IC device 90 arranged in the temperature adjustment unit 12, or a figure. It may be a position where the IC device 90 can be heated or cooled by the device supply unit 14, such as the vicinity of the IC device 90 arranged in the device supply unit 14 shown in 4 (d).

  First, when the first device transport head 13 is stopped, as shown in FIGS. 4A, 4B, and 4D, when the IC device 90 is located at the first position, the first device transport head 13 is immediately The device transport head 13 is stopped. In this case, since the first device transport head 13 stops in a state where the IC device 90 is disposed in the temperature adjustment unit 12 or the device supply unit 14, the IC device 90 is heated by the temperature adjustment unit 12 or the device supply unit 14. Or it can cool and it can control that the temperature of IC device 90 changes from the temperature suitable for inspection.

  Further, when the first device transport head 13 is stopped, as shown in FIG. 4C, when the IC device 90 is located at the second position, the IC device 90 is transported to the device supply unit 14, Thereafter, the first device transport head 13 is stopped. As a result, the first device transport head 13 stops in a state where the IC device 90 is disposed in the temperature adjustment unit 12 or the device supply unit 14, so that the IC device 90 is heated by the temperature adjustment unit 12 or the device supply unit 14. Or it can cool and it can control that the temperature of IC device 90 changes from the temperature suitable for inspection.

  In addition, the IC device 90 can be transported more efficiently than when the IC device 90 is returned to the temperature adjustment unit 12 and then the first device transport head 13 is stopped.

  Next, a control operation when the IC device 90 is transported from the temperature adjustment unit 12 to the device supply unit 14 by the first device transport head 13 in the inspection apparatus 1 will be described.

  As shown in FIG. 5, first, it is determined whether or not to stop the first device transport head 13 (step S101).

  In the inspection apparatus 1, a stop condition (condition) for stopping the first device transport head 13 is stored in the storage unit 801 of the control unit 80 in advance. In step S101, the determination unit 803 determines whether any stop condition of the stop condition is satisfied. When any stop condition of the stop condition is satisfied, the first device transport head 13 is stopped. If it is determined that none of the stop conditions is satisfied, it is determined that the first device transport head 13 is not stopped.

The stop conditions are the following (1) to (3).
(1) When an operation button for stopping at least the first device transport head 13 such as a pause button is pressed (when a stop operation is performed).

  The operator presses the pause button or the like to stop the operation, for example, when a jam occurs and when the work for eliminating the jam is performed, or when a predetermined member arranged in the inspection apparatus 1 is adjusted. Etc. Further, as the adjustment of the predetermined member, for example, adjustment of the position, posture, light receiving sensitivity and the like of the optical sensor 43, the first device transport head 13, the second device transport head 17 and the third device transport head 20 are possible. Adjustment of the gripping force (adsorption force) of the gripping part.

  (2) When a jam is detected by the optical sensor 43, that is, when the control unit 80 detects a jam based on the detection result of the optical sensor 43.

  (3) When the ratio (yield) of non-defective products is less than a predetermined (specified) value as a result of the inspection of the IC device 90.

  If it is determined in step S101 that the first device transport head 13 is not stopped, the transport of the IC device 90 is continued (step S102), whether the transport of the IC device 90 is completed, that is, the IC device 90. Is determined in the device supply unit 14 (step S103).

  If it is determined in step S103 that the IC device 90 has not been transported, the process returns to step S101, and step S101 and subsequent steps are executed again. If it is determined that the IC device 90 has been transported, Move to the step. The description of the subsequent operation is omitted.

  If it is determined in step S101 that the first device transport head 13 is to be stopped, the stop of the first device transport head 13 is determined (step S104), and the IC device 90 is positioned at the second position. Whether or not (step S105).

  If it is determined in step S105 that the IC device 90 is located at the second position, the IC device 90 continues to be transported (step S106), that is, whether the IC device 90 has been transported, that is, the IC device 90. Is determined in the device supply unit 14 (step S107).

  If it is determined in step S107 that the IC device 90 has not been transported, the process returns to step S106, and step S106 and subsequent steps are executed again. If it is determined that the IC device 90 has been transported, step S108 is performed. Migrate to

  If it is determined in step S105 that the IC device 90 is not located at the second position, that is, if it is determined that the IC device 90 is located at the first position, the process proceeds to step S108.

  Next, notification is performed (step S108), and the first device transport head 13 is stopped (step S109).

  In step S108, a predetermined image is displayed on the display unit 62, an alarm 71 is activated, and a warning sound is generated. In the image, “stopped” is displayed, and messages such as the cause of the first device transport head 13 being stopped, the current situation, and a countermeasure are displayed. Thereby, the operator grasps that the first device transport head 13 has stopped, and grasps the cause of the stop, the current situation, the handling method, and the like from the image displayed on the display unit 62. Can do.

  Note that the notification method in step S108 is not limited to the above method, and other examples include lighting and flashing of a light emitting unit such as a lamp.

  As described above, according to the inspection apparatus 1, when the first device transport head 13 stops, the first device transport head 13 is stopped in a state where the IC device 90 is disposed in the device supply unit 14. Therefore, it can suppress that the temperature of IC device 90 changes from the temperature suitable for a test | inspection.

  In the present embodiment, when the first device transport head 13 stops, or when the IC device 90 is positioned at the second position, the first device transport is performed after the IC device 90 is transported to the device supply unit 14. The head 13 is stopped. However, the present invention is not limited to this. For example, the first device transport head 13 is stopped after the IC device 90 is transported (returned) to the temperature adjustment unit 12. Also good.

  In the present embodiment, the temperature adjustment unit 12, the device supply unit 14, and the inspection unit 16 can both heat and cool the IC device 90, respectively. Only one of heating and cooling of the device 90 may be possible.

Second Embodiment
FIG. 6 is a diagram for explaining the operation of the second embodiment of the electronic component inspection apparatus of the present invention. FIG. 7 is a flowchart showing a control operation of the electronic component inspection apparatus shown in FIG. FIG. 6 is schematically illustrated.

  Hereinafter, although the second embodiment will be described, the description will focus on the differences from the first embodiment described above, and the description of the same matters will be omitted.

  As shown in FIG. 6, in the inspection apparatus 1 of the second embodiment, when the IC device 90 is transported from the temperature adjustment unit 12 to the device supply unit 14 by the first device transport head 13, the first device transport head. 13 is stopped, when the IC device 90 is located at the second position, the temperature adjustment unit 12 and the device supply unit 14 are connected to the member closer to the IC device 90 located at the second position. After transporting 90, the first device transport head 13 is stopped.

  That is, the distance L1 between the IC device 90 located at the second position and the position where the IC device 90 of the temperature adjustment unit 12 is arranged, and the position and the second position where the IC device 90 of the device supply unit 14 is arranged. When the distance L1 is smaller than the distance L2, the first device transport head 13 is stopped after the IC device 90 is transported (returned) to the temperature adjustment unit 12. Let If the distance L2 is smaller than the distance L1, the first device transport head 13 is stopped after the IC device 90 is transported to the device supply unit 14. When the distance L1 and the distance L2 are equal, the first device transport head 13 is stopped after the IC device 90 is transported to either the temperature adjustment unit 12 or the device supply unit 14. In this case, it is preferable to transport the IC device 90 to the device supply unit 14 that is the original transport destination.

  As a result, when the first device transport head 13 is stopped, the IC device 90 can be quickly transported to the temperature adjustment unit 12 or the device supply unit 14, which is suitable for the inspection of the temperature of the IC device 90. The IC device 90 can be disposed in the temperature adjustment unit 12 or the device supply unit 14 while the change from the temperature is small.

  When the first device transport head 13 is stopped, if the IC device 90 is located at the first position, the first device transport head 13 is immediately stopped.

  Next, a control operation when the IC device 90 is transported from the temperature adjustment unit 12 to the device supply unit 14 by the first device transport head 13 in the inspection apparatus 1 will be described.

  As shown in FIG. 7, first, it is determined whether or not to stop the first device transport head 13 (step S201).

  If it is determined in step S201 that the first device transport head 13 is not stopped, the transport of the IC device 90 is continued (step S202), whether or not the transport of the IC device 90 is completed, that is, the IC device 90. Is determined in the device supply unit 14 (step S203).

  If it is determined in step S203 that the transport of the IC device 90 has not been completed, the process returns to step S201, and step S201 and subsequent steps are executed again. If it is determined that the transport of the IC device 90 has been completed, Move to the step. The description of the subsequent operation is omitted.

  If it is determined in step S201 that the first device transport head 13 is to be stopped, the stop of the first device transport head 13 is determined (step S204), and the IC device 90 is positioned at the second position. Whether or not (step S205).

  If it is determined in step S205 that the IC device 90 is located at the second position, the distance L1 between the IC device 90 located at the second position and the position where the IC device 90 of the temperature adjustment unit 12 is disposed; The position where the IC device 90 of the device supply unit 14 is arranged is compared with the distance L2 of the IC device 90 located at the second position, and it is determined whether or not the distance L2 is less than or equal to the distance L1 (step S206). .

  If it is determined in step S206 that the distance L2 is less than or equal to the distance L1, the IC device 90 continues to be transported (step S208).

  If it is determined in step S206 that the distance L2 is not less than or equal to the distance L1, that is, if it is determined that the distance L1 is less than the distance L2, the transport destination of the IC device 90 is changed to the temperature adjustment unit 12 ( In step S207, the IC device 90 is continuously transported (step S208).

  Next, it is determined whether or not the IC device 90 has been transported, that is, whether or not the IC device 90 has been placed in the device supply unit 14 (step S209).

  If it is determined in step S209 that the transport of the IC device 90 has not been completed, the process returns to step S208, and step S208 and subsequent steps are executed again. If it is determined that the transport of the IC device 90 has been completed, step S210 is performed. Migrate to

  If it is determined in step S205 that the IC device 90 is not located at the second position, that is, if it is determined that the IC device 90 is located at the first position, the process proceeds to step S210.

  Next, notification is performed (step S210), and the first device transport head 13 is stopped (step S211).

  According to the second embodiment as described above, the same effect as that of the first embodiment described above can be exhibited.

  As mentioned above, although the electronic component conveyance apparatus and electronic component inspection apparatus of this invention were demonstrated based on embodiment of illustration, this invention is not limited to this, The structure of each part has the same function. Any configuration can be substituted. Moreover, other arbitrary components may be added.

  Further, the present invention may be a combination of any two or more configurations (features) of the above embodiments.

  Moreover, although the said embodiment demonstrated the case where an electronic component was conveyed from one of the two temperature control members (member) to the other, this invention is not restricted to this, For example, neither heating nor cooling is performed. The same can be applied to the case where the electronic component is transported between the member and the temperature control member.

1 ... Inspection equipment (electronic parts inspection equipment)
11A... First tray transport mechanism 11B... Second tray transport mechanism 12... Temperature adjustment unit (soak plate)
13 …… First device transfer head 14 …… Device supply unit (supply shuttle)
15 …… Third tray transport mechanism 16 …… Inspection unit 17 …… Second device transport head 18 …… Device recovery unit (recovery shuttle)
19... Collection tray 20... Third device transport head 21... Sixth tray transport mechanism 22 A... Fourth tray transport mechanism 22 B. Humidity sensor 43 …… Light sensor 51 …… Heating mechanism 52 …… Cooling mechanism 53 …… Dry air supply mechanism 6 …… Operation section 61 …… Input section 62 …… Display section 620 …… Screen 621 …… Frame 622 …… High temperature mode selection button 623 …… Normal temperature mode selection button 624 …… Normal temperature control mode selection button 625 …… Low temperature mode selection button 626 …… Dehumidification mode selection button 71 …… Alarm 80 …… Control unit 801 …… Storage unit 803 …… Discriminating unit 90 …… IC device 200 …… Tray A1 …… Tray supply area A2 …… Device supply area (supply area)
A3: Inspection area A4: Device collection area (collection area)
A5 …… Tray removal area R1 …… First chamber R2 …… Second chamber R3 …… Third chamber S101 to S109 …… Step S201 to S211 …… Step

Claims (12)

A transport unit for transporting electronic components;
A member that arranges the electronic component and performs at least one of heating and cooling of the electronic component,
When the transport unit is stopped, when the electronic component is positioned at the first position, the transport unit is stopped, and the electronic component is positioned at a second position farther from the member than the first position. When carrying out, the electronic component conveyance apparatus which stops the said conveyance part, after conveying the said electronic component to the said 1st position.   The electronic component transport apparatus according to claim 1, wherein when the transport unit is stopped, and when the electronic component is located at a first position, the transport unit is stopped at the first position.   The electronic component transport apparatus according to claim 1, wherein the member includes a first member and a second member that are arranged at different positions.   When transporting the electronic component from the first member to the second member, when the transport unit stops, when the electronic component is located at the second position, the electronic component is moved to the second member. The electronic component conveying apparatus according to claim 3, wherein the conveying unit is stopped after being conveyed to the second member.   When transporting the electronic component from the first member to the second member, when the transport unit stops, when the electronic component is located at the second position, The electronic component transport apparatus according to claim 3, wherein the transport unit is stopped after transporting the electronic component to the member closer to the electronic component located at the second position among the second members.   The electronic component transport apparatus according to claim 1, wherein the first position is a position of the electronic component disposed on the member. A storage unit for storing at least one stop condition for stopping the transport unit;
A determination unit that determines whether or not any one of the stop conditions is satisfied,
The electronic component transport apparatus according to claim 1, wherein when the stop condition of any one of the stop conditions is satisfied, it is determined to stop the transport unit. A detection unit for detecting that the electronic component is not disposed at a predetermined position;
The electronic component conveying apparatus according to claim 7, wherein the stop condition is a case where the detection unit detects that the electronic component is not disposed at a predetermined position.   The electronic component conveying apparatus according to claim 7, wherein the stop condition is a case where a stop operation is performed. A first operation mode in which temperature is controlled by performing at least one of heating and cooling of the electronic component and a second operation mode in which neither heating nor cooling of the electronic component is performed can be selected.
When the transport unit stops when the first operation mode is set, when the electronic component is located at the first position, the transport unit is stopped and the electronic component is moved to the second position. 10. The electronic component transport apparatus according to claim 1, wherein the transport unit is stopped after transporting the electronic component to the first position.   The electronic component transport apparatus according to claim 1, further comprising a notification unit that performs notification after the transport unit is stopped. A transport unit for transporting electronic components;
A member for arranging the electronic component and performing at least one of heating and cooling of the electronic component;
An inspection unit for inspecting the electronic component,
When the transport unit is stopped, when the electronic component is positioned at the first position, the transport unit is stopped, and the electronic component is positioned at a second position farther from the member than the first position. In this case, the electronic component inspection apparatus stops the conveyance unit after conveying the electronic component to the first position.

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