JP2016012603A - Plate-like member processing apparatus and processing method - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a plate-like member-processing method which can prevent an off-grade chip from appearing in the world.SOLUTION: An apparatus 10 for processing a plate-like member WF comprises: supporting means 20 for supporting a plate-like member WF stuck to an adhesive AD layer of an adhesive sheet AS having at least a base BS and the adhesive AD layer; and stacking means 40 for stacking a mask member MS on a part of the base BS of the adhesive sheet AS corresponding to each acceptable chip CP1 or off-grade chip CP2 based on a result of inspection by inspection means 30 for individually inspecting chips CP formed by dividing the plate-like member WF into pieces to classify each chip CP as an acceptable chip CP1 or an off-grade chip CP2.

Description

  The present invention relates to a processing apparatus and a processing method for a plate-like member.

  In a semiconductor manufacturing process, a plate-like member (semiconductor wafer (hereinafter sometimes simply referred to as a wafer)) to which an adhesive sheet is affixed is cut into a predetermined size into individual pieces (semiconductor chips), and the adhesive sheet is irradiated with ultraviolet rays. Thus, the adhesive strength of the adhesive sheet is weakened, and the individual piece is picked up by an appropriate pick-up device or the like and transferred (mounted) onto a placement member (lead frame). As an apparatus used for such a process, an apparatus for inspecting an individual circuit (for example, see Patent Document 1) and an apparatus for irradiating energy rays such as ultraviolet rays (for example, see Patent Document 2) are known. Yes.

In an apparatus as described in Patent Document 1, each protruding terminal formed on the contactor surface is brought into electrical contact with each electrode of a plate-like member at a time, and each circuit is inspected. In an apparatus as described in Patent Document 2, an ultraviolet blocking mask is sent to the surface of an object as necessary to select a non-exposed area of the object.
And after weakening the adhesive force of an adhesive sheet by irradiating an adhesive sheet on which an individual piece is adhered with ultraviolet rays from an apparatus as described in Patent Document 2, an apparatus as described in Patent Document 1 Based on the result of the inspection, only the acceptable piece can be picked up and transferred to the placement member.

Japanese Patent Laid-Open No. 10-223704 JP-A-6-260410

  However, in the process using the apparatus as described in Patent Documents 1 and 2 as described above, the adhesive sheet adhesion to both the acceptable piece and the unacceptable piece is weakened by the irradiation of ultraviolet rays. There is an inconvenience that the rejected piece is shifted from the position at the time of inspection, and the rejected piece is picked up and transferred to the mounting member. In addition, it is conceivable to prevent the rejected piece from being displaced by weakening only the adhesive force of the adhesive sheet to the accepted piece using an ultraviolet blocking mask as described in Patent Document 2. Since the position differs for each plate-like member, it is difficult to prevent the displacement of only the reject piece, and the above inconvenience cannot be solved.

  The objective of this invention is providing the processing apparatus and processing method of a plate-shaped member which can prevent a rejection piece | piece body from circulating in the world.

  In order to achieve the above object, the plate member processing apparatus of the present invention is a support means for supporting a plate member attached to the adhesive layer of an adhesive sheet provided with at least a base material and an adhesive layer. And inspecting each piece formed by dividing the plate-like member into pieces, and based on the inspection result of the inspection means for distinguishing each piece into a pass piece or a fail piece, A configuration is adopted in which a laminating unit capable of laminating a mask member is provided on the base material side of the adhesive sheet corresponding to the acceptable piece or the unacceptable piece.

In this case, in the plate-shaped member processing apparatus of the present invention, it is preferable that the laminating unit includes an image forming unit capable of forming an image with the mask member on the base material side of the adhesive sheet.
Moreover, in the processing apparatus of the plate-shaped member of this invention, the said lamination | stacking means is a feeding means which pays out the original fabric by which the said mask member was laminated | stacked on the sheet member, and the base material of the said adhesive sheet for the said mask member of the said original fabric It is preferable that the image forming apparatus includes transfer means for transferring and laminating to the side.

  On the other hand, the processing method of the plate-shaped member of the present invention includes a step of supporting the plate-shaped member attached to the adhesive layer of the adhesive sheet provided with at least a base material and an adhesive layer, and the plate-shaped member includes Based on the inspection results of the inspection process, inspecting each individual piece separated by cutting and distinguishing each individual piece into an acceptable piece or an unacceptable piece, the acceptable piece or the rejected piece. And a step of laminating a mask member on the base material side of the adhesive sheet corresponding to the above.

  According to the present invention as described above, by laminating the mask member corresponding to the reject piece, it is possible to weaken only the adhesive force to the pass piece while maintaining the adhesive force to the fail piece. . Accordingly, the rejected piece is not shifted from the position at the time of inspection and transferred to the mounting member, and the rejected piece can be prevented from circulating around the world. On the other hand, by laminating the mask member in correspondence with the acceptable piece body, only the adhesive force with respect to the unacceptable piece body can be weakened while maintaining the adhesive force with respect to the acceptable piece body. Therefore, before transferring the acceptable piece to the placement member, only the failed piece can be removed from the adhesive sheet, and the failure piece can be transferred to the placement member. It is possible to prevent the unsuccessful piece from circulating around the world.

  At this time, if an image forming unit or a transfer unit is used as the stacking unit, the mask member can be stacked by a simple method of forming an image with the mask member or a simple method of transferring the mask member.

(A) is a side view of the wafer processing apparatus according to the first embodiment of the present invention, (B) is a bottom view of (A). The side view of the processing apparatus of the wafer which concerns on 2nd Embodiment of this invention.

[First Embodiment]
DESCRIPTION OF EXEMPLARY EMBODIMENTS Hereinafter, a first embodiment of the invention will be described with reference to the drawings.
Detailed description of the same configuration in each embodiment is omitted.
In the first and second embodiments, the X axis, the Y axis, and the Z axis are orthogonal to each other, the X axis and the Y axis are axes within a predetermined plane, and the Z axis is the predetermined plane. The axis is orthogonal to Furthermore, in the first and second embodiments, when viewed from a direction parallel to the Y-axis, when indicating the direction, “up” is the Z-axis arrow direction and “down” is the opposite direction, “ “Left” is the arrow direction of the X axis, “Right” is the opposite direction, “Front” is the arrow direction of the Y axis, and the “Rear” is the opposite direction in the front direction perpendicular to the paper surface in FIG.

  In FIG. 1, a processing device 10 for a wafer WF as a plate-like member is a support means for supporting a wafer WF attached to an adhesive AD layer of an adhesive sheet AS provided with at least a base material BS and an adhesive AD layer. 20 and each chip CP as each piece formed by dividing the wafer WF into individual pieces, and each chip CP is accepted as a pass piece CP1 or as a fail piece as a fail piece. Based on the inspection means 30 for distinguishing between CP2 and the inspection result of the inspection means 30, the laminating means 40 capable of laminating the mask member MS on the base material BS side of the adhesive sheet AS corresponding to the acceptable chip CP1 or the unacceptable chip CP2. And. In the case of this embodiment, an adhesive AD layer whose adhesive strength is reduced by electromagnetic waves such as ultraviolet rays, infrared rays, microwaves, X-rays, and gamma rays is adopted. The upper surface of the wafer WF is a circuit formation surface WF1.

  The support means 20 includes a table 21 having a recess 21B that is recessed from the support surface 21A, and an integrated object WK in which the wafer WF is integrated with the ring frame RF through the adhesive sheet AS, such as a decompression pump and a vacuum ejector. It is configured to be capable of being adsorbed and held by a decompression means that does not.

  The inspection means 30 includes an inspection head 31 having a probe (not shown) that can inspect the circuit for each chip CP, and an arm 32 that is supported by a driving device (not shown) and can move the inspection head 31. The circuit can be inspected collectively.

The stacking means 40 is supported by a first linear motor 41 serving as a driving device extending in the X-axis direction in the recess 21B and a slider 41A of the first linear motor 41, and the driving device extending in the Y-axis direction. As a second linear motor 42 and image forming means 43 supported by a slider 42A of the second linear motor 42.
The image forming unit 43 is configured by a printing machine, an ink jet printer, or the like using a system such as letterpress printing, intaglio printing, planographic printing, screen printing, flexographic printing, and the like so that an image can be formed on the base material BS with the mask member MS. It has become. The mask member MS may be any member that does not transmit electromagnetic waves that reduce the adhesive force of the adhesive AD layer. For example, resin, rubber, ink, varnish, or the like can be used.

A procedure for processing the wafer WF in the processing apparatus 10 will be described.
First, a dicing device (not shown) forms a plurality of chips CP by forming notches CL reaching the adhesive sheet AS from the circuit forming surface WF1 side with respect to the wafer WF in the integrated object WK. Next, in a state where the inspection head 31 is retracted from the support surface 21 </ b> A, a conveyance means (not shown) such as a human hand or an articulated robot or a belt conveyor places the integrated object WK on the support surface 21 </ b> A of the support means 20. evacuate. Next, after the support means 20 drives the decompression means (not shown) and sucks and holds the integrated object WK, the inspection means 30 drives the drive equipment (not shown) to move the inspection head 31 so as to face each chip CP. Then, the inspection means 30 drives the inspection head 31 to inspect the circuits of all the chips CP at a time, so that the chip CP is distinguished into the acceptable chip CP1 and the unacceptable chip CP2, and the position data thereof is stored in a computer or sequencer. Etc. are stored in control means (not shown). In FIG. 1B, the acceptable chip CP1 is shown in white and the unacceptable chip CP2 is hatched. In addition, those which are located at the outer peripheral edge of the wafer WF and do not have a predetermined chip shape, or those which have a predetermined chip shape and no circuit is formed are regarded as end material EC and inspected. With or without inspection, it is identified as a failed chip CP2.

  Then, the laminating unit 40 drives the first and second linear motors 41 and 42 based on the inspection result of the inspection unit 30, and the image forming unit 43 at the initial position indicated by the two-dot chain line in FIG. Is made to face the reject chip CP2. Thereafter, the stacking unit 40 drives the image forming unit 43 to stack the mask member MS on the whole or a part of the region corresponding to the rejected chip CP2 to form an image. When the stacking means 40 finishes stacking the mask members MS at positions corresponding to all the rejected chips CP2, the inspection means 30 drives a driving device (not shown) to retract the inspection head 31 from the support surface 21A. Next, after the stacking unit 40 drives the first and second linear motors 41 and 42 to return the image forming unit 43 to the initial position, the support unit 20 stops driving the decompression unit (not shown). Thereafter, a conveying means (not shown) conveys the integrated object WK to the pickup process, and thereafter the same operation is repeated.

  When transferring (mounting) the acceptable chip CP1 from the integrated object WK processed by the processing apparatus 10 onto a lead frame as a mounting member, first, an electromagnetic wave that does not pass through the mask member MS is irradiated from the base material BS side. By doing so, the adhesive force of the adhesive material AD layer with respect to the acceptable chip CP1 is weakened. At this time, the adhesive material AD layer with respect to the rejected chip CP2 is maintained by the mask member MS so that the whole or a part of the adhesive force is maintained by the electromagnetic wave being blocked by the mask member MS. Then, the pick-up device not shown is based on the inspection result of the inspection means 30, or based on the detection result by the detection means not shown which can detect the presence or absence of the mask member MS, only the pass chip CP1 is integrated into the integrated object WK. Pick up from and transfer to the lead frame. At this time, the reject chip CP2 is adhered to the adhesive sheet AS by the adhesive material AD layer in which the adhesive force is maintained. Therefore, the reject chip CP2 is not displaced from the position at the time of inspection, and the pickup device Will not be picked up by.

  According to the first embodiment as described above, the failed chip CP2 is not shifted from the position at the time of inspection and transferred to the lead frame, and it is possible to prevent the rejected chip CP2 from going out to the world. In addition, it is possible to prevent the rejected chip CP2 from being lost from the adhesive sheet AS.

[Second Embodiment]
In FIG. 2, the processing apparatus 10 </ b> A is different from the processing apparatus 10 of the first embodiment in that the shape of the recess 51 </ b> B of the support means 50 is different from the recess 21 </ b> B of the support means 20. The difference is that the inspection means 60 and the lamination means 70 are provided.

  The inspection means 60 includes an inspection head 61 having a probe (not shown) that can inspect the circuit for each chip CP, and is configured to inspect the circuits of the chip CP one by one.

The laminating means 70 includes a feeding means 80 for feeding out the original fabric RS in which the mask member MS is laminated on the sheet member ST, and a transfer means for transferring and laminating the mask member MS of the original fabric RS to the base material BS side of the adhesive sheet AS. 90.
The feeding means 80 is rotatably provided by a rotation motor 81A as a drive device, and supports a support roller 81 that supports the original fabric RS, and a drive roller 82 rotatably provided by a rotation motor 82A as a drive device. The mask member MS is transferred to the adhesive sheet AS between the pinch roller 83 that sandwiches the original fabric RS and the drive roller 84 that is rotatably provided by a rotation motor 84A as a drive device. A pinch roller 85 that sandwiches the US and a collection roller 86 that is rotatably provided by a rotation motor 86A as a drive device and collects the unnecessary raw fabric US are provided.
The transfer unit 90 includes a first linear motor 41 similar to the image forming unit 43 of the first embodiment, a second linear motor 42, and a transfer head 91 supported by a slider 42A of the second linear motor 42. Yes.
The transfer head 91 is configured by a printing machine such as a thermal printer or a dot impact printer, a pressure transfer device, a thermal transfer device, or the like, and can transfer the mask member MS to the base material BS. The mask member MS may be any member that does not transmit electromagnetic waves that reduce the adhesive force of the adhesive AD layer. For example, a metal foil, resin, rubber, ink, varnish, or the like can be used.

A procedure for processing the wafer WF in the above processing apparatus 10A will be described.
First, as in the first embodiment, when the integrated object WK on which the plurality of chips CP are formed is placed on the support surface 21A of the support means 50, the support means 50 holds the integrated object WK. Thereafter, the inspection head 61 is moved so that the inspection means 60 faces each chip CP, and the inspection head 61 is driven to inspect each chip CP one by one, so that the chip CP fails the pass chip CP1. It is distinguished from the chip CP2, and the data is stored in a control means (not shown). When the inspection of all the chips CP is completed, the inspection head 61 is retracted from the support surface 21A.

  Thereafter, the laminating unit 70 drives the first and second linear motors 41 and 42 based on the inspection result of the inspection unit 60 to make the transfer head 91 face the reject chip CP2. Thereafter, the stacking unit 70 drives the transfer head 91 to stack the mask member MS of the original fabric RS over the whole or a part of the region corresponding to the rejected chip CP2. When the stacking means 70 finishes stacking the mask members MS at positions corresponding to all the rejected chips CP2, the transfer means 91 is returned to the initial position in the same manner as in the first embodiment, and then the support means 50 is integrated. Release the holding of WK. Thereafter, after a transfer means (not shown) transfers the integrated object WK to the pickup process, the stacking means 70 drives the rotation motors 81A, 82A, 84A, 86A so that the unused portion of the original fabric RS faces the wafer WF. The original fabric RS is fed out for a predetermined length, and thereafter the same operation as described above is repeated.

  Even in the second embodiment as described above, the same effects as in the first embodiment can be obtained.

  As described above, the best configuration, method and the like for carrying out the present invention have been disclosed in the above description, but the present invention is not limited to this. That is, the invention has been illustrated and described with particular reference to certain specific embodiments, but without departing from the spirit and scope of the invention, Various modifications can be made by those skilled in the art in terms of material, quantity, and other detailed configurations. In addition, the description of the shape, material, and the like disclosed above is exemplary for ease of understanding of the present invention, and does not limit the present invention. The description by the name of the member which remove | excluded the limitation of some or all of such restrictions is included in this invention.

  For example, the mask member MS may be stacked corresponding to the acceptable chip CP1. In this case, before transferring the acceptable chip CP1 to the lead frame, an electromagnetic wave that does not pass through the mask member MS is irradiated from the base BS side to weaken the adhesive force of the adhesive material AD layer to the unacceptable chip CP2, and appropriately The reject chip CP2 is removed from the adhesive sheet AS with a simple removing device. As a result, the reject chip CP2 does not exist when the pass chip CP1 is transferred to the lead frame, and the reject chip CP2 can be prevented from being transferred to the world by being transferred to the lead frame. In such a configuration, when transferring the acceptable chip CP1 to the lead frame, the mask member MS is peeled from the adhesive sheet AS by a scraping means such as a spatula or a scraper, or the mask peeling sheet is placed on the mask member MS. The mask member MS may be peeled from the adhesive sheet AS together with the mask peeling sheet, and the adhesive force may be weakened by irradiating the previous electromagnetic wave. In addition, a chip peeling sheet having a stronger adhesive strength than the adhesive sheet AS is attached to the circuit forming surface WF1 side of the acceptable chip CP1, and the acceptable chip CP1 is peeled off from the adhesive sheet AS together with the chip peeling sheet. The adhesive force may be weakened by irradiating the sheet with an electromagnetic wave or the like whose adhesive strength is reduced. Furthermore, in a state where the acceptable chip CP1 and the mask member MS are adhered to the adhesive sheet AS, an electromagnetic wave that can pass through both the base material BS and the mask member MS is irradiated to bond the adhesive AD to the acceptable chip CP1. You may weaken your power.

The support means 20 and 50 may be configured to support the integrated object WK by chuck means such as a mechanical chuck or a chuck cylinder, or by an adhesive or magnetic force.
The supporting means 20 and 50 only need to be able to support the wafer WF so that the masking member MS can be laminated on the base material BS by the laminating means 40 and 70. For example, the adhesive sheet AS that protrudes outside the wafer WF is removed from the adhesive layer side. The wafer WF may be supported without contact or contact with the circuit forming surface WF1 side (for example, Bernoulli adsorption), whether or not the adhesive sheet AS protrudes outside the wafer WF. Also good.

The inspection means 30 and 60 are for inspecting the surface and appearance of the individual piece, for inspecting the pattern, code, character, etc. formed on the surface of the individual piece, and for the volume and weight of the individual piece. Measure the size or the like.
The inspection means 30 and 60 may apply the inspection head 61 of the second embodiment instead of the inspection head 31 of the first embodiment, or may replace the inspection head 61 of the second embodiment. The inspection head 31 may be applied.
The probe of the inspection head 61 may be provided so that two or more circuits of the chip CP can be inspected.
The processing devices 10 and 10A are not provided with the inspection means 30 and 60, but the circuit of the chip CP is inspected by another apparatus, and the mask member MS is applied to the adhesive sheet AS by the laminating means 40 and 70 based on the inspection result. May be laminated. In this case, the processing devices 10 and 10A may obtain the position data of at least one of the acceptable chip CP1 and the unacceptable chip CP2 from another device.
The inspection process by the inspection means 30 and 60 and the lamination process by the lamination means 40 and 70 may be performed simultaneously or substantially simultaneously.
The inspection head 31 of the inspection means 30 and the arm 32 of the inspection means 30 and 60 may be provided with holding means such as suction or a mechanical chuck so that the wafer WF can be supported, and the inspection means 30 and 60 may be used as the support means.

The stacking means 40 and 70 may not stack the mask member MS on the end material EC.
The stacking means 40 and 70 may stack the mask member MS on the plate-shaped member before being singulated.
The laminating units 40 and 70 may move the integrated member WK while the image forming unit 43 and the transfer head 91 are stopped, or move both the image forming unit 43 and the transfer head 91 and the integrated member WK. You may let them.
The laminating means may have a configuration in which a mask adhesive sheet as a mask member is attached and laminated on the base material side of the adhesive sheet corresponding to the accepted piece or the reject piece. In this case, for example, an original sheet supporting means such as a support roller or a cradle for supporting the original sheet of the adhesive sheet temporarily attached to the strip-shaped release sheet with the mask adhesive sheet having one surface as an adhesive layer; A peeling means such as a peeling plate or a peeling roller that folds the peeling sheet from the peeling sheet and peels the masking adhesive sheet from the peeling sheet, and a pressure roller or compressed air that presses and adheres the masking adhesive sheet to the substrate BS side of the adhesive sheet AS. It is possible to employ one having a pinch roller that sandwiches a release sheet between a pressing means such as a driving roller driven by a rotation motor as a driving device.
The stacking means 40 may be configured to stack the mask member MS after the inspection head 31 is retracted from the support surface 21A.

  The shape of the mask member MS on which the image forming unit 43 and the transfer unit 90 are stacked may correspond to the shape of the chip CP, or may not correspond to the shape of the chip CP, for example, a circle, an ellipse, a triangle, or a rectangle It may be a polygon such as, or other shapes.

The feeding unit 80 may feed the original sheet so as to face the position corresponding to the wafer WF.
The feeding means 80 may have a configuration in which a masking adhesive sheet having an adhesive layer provided thereon is supported and fed on the sheet member ST.
The feeding unit may be provided integrally with the transfer unit, and the transfer unit and the feeding unit may integrally move relative to the integrated object WK.

  The transfer head 91 may be a pressing roller or a blade material that can transfer by pressing the mask member MS on the sheet member ST.

The integrated object WK may not have the ring frame RF, or may be one in which the wafer WF is integrated with another member other than the ring frame RF via the adhesive sheet AS.
The sheet member ST may be made of resin, paper, rubber, cloth, metal foil, or the like.
The shape of the individual piece may be other shapes such as a circle, an ellipse, a polygon such as a triangle or a quadrangle.
The original fabric RS is, for example, a single layer having only a mask member MS, a layer having an intermediate layer between the sheet member ST and the mask member MS, or a layer having three or more layers, such as having a cover layer on the upper surface of the mask member MS. It may be. In addition, what is necessary is just to provide the cover layer peeling means which peels a cover layer from mask member MS, when original fabric RS has a cover layer on the upper surface of mask member MS.
The placement member is not limited to a substrate, a tray, a resin plate, paper, rubber, cloth, metal foil, stone, wood, or the like.

  Further, the material, type, shape and the like of the adhesive sheet AS in the present invention are not particularly limited. For example, the adhesive sheet AS may be a circle, an ellipse, a polygon such as a triangle or a rectangle, and other shapes. Also, the adhesive sheet AS is, for example, a single layer having only an adhesive layer, having an intermediate layer between the base material and the adhesive layer, or having a cover layer on the upper surface of the base material. Further, it may be a so-called double-sided adhesive sheet that can peel the substrate from the adhesive layer, and the double-sided adhesive sheet has a single-layer or multi-layer intermediate layer, It may be a single layer or multiple layers without any. Furthermore, as a plate-shaped member, for example, a semiconductor wafer such as a silicon semiconductor wafer or a compound semiconductor wafer, an information recording substrate such as a circuit board or an optical disk, a glass plate, a steel plate, a ceramic, a wooden plate, a resin plate, or any other member And articles can also be targeted, and the individual pieces only need to be separated into pieces. Note that the adhesive sheet AS may be replaced with a functional or application reading, and may be any sheet such as a protective sheet, a dicing tape, a die attach film, a die bonding tape, a film, a tape, or the like.

The means and steps in the present invention are not limited in any way as long as they can perform the operations, functions, or steps described with respect to those means and steps. The process is not limited at all. For example, if the supporting means supports the plate-like member attached to the adhesive layer of the adhesive sheet provided with at least the base material and the adhesive layer, the technology is compared with the common general technical knowledge at the time of filing. There is no limitation as long as it is within the range (the description of other means and steps is omitted).
The drive device in the embodiment includes an electric device such as a rotation motor, a linear motion motor, a linear motor, a single axis robot, an articulated robot, an actuator such as an air cylinder, a hydraulic cylinder, a rodless cylinder, and a rotary cylinder. In addition to these, a combination of them directly or indirectly may be employed (some of them overlap with those exemplified in the embodiment).

DESCRIPTION OF SYMBOLS 10, 10A ... Processing apparatus 20, 50 ... Supporting means 30, 60 ... Inspection means 40, 70 ... Laminating means 43 ... Image forming means 80 ... Feeding means 90 ... Transfer means AD ... Adhesive AS ... Adhesive sheet BS ... Base material CP ... chip (individual piece)
CP1 ... Acceptable chip (accepted piece)
CP2 ... rejected chip (failed piece)
MS ... Mask member RS ... Original fabric ST ... Sheet member WF ... Wafer (plate-like member)

Claims (4)

A support means for supporting a plate-like member attached to the adhesive layer of an adhesive sheet provided with at least a base material and an adhesive layer;
The plate-shaped member is inspected for each individual piece formed, and the acceptable piece is based on the inspection result of the inspection means for distinguishing each individual piece into an acceptable piece or an unacceptable piece. A processing apparatus for a plate-like member, comprising: a laminating unit capable of laminating a mask member on a base material side of the adhesive sheet corresponding to a body or a reject piece.   The plate member processing apparatus according to claim 1, wherein the laminating unit includes an image forming unit capable of forming an image with the mask member on a substrate side of the adhesive sheet.   The laminating unit includes a feeding unit that feeds an original fabric in which the mask member is laminated on a sheet member, and a transfer unit that transfers the mask member of the original fabric to the base material side of the adhesive sheet and laminates the original material. The processing apparatus of the plate-shaped member of Claim 1 characterized by the above-mentioned. Supporting a plate-like member attached to the adhesive layer of the adhesive sheet provided with at least a base material and an adhesive layer;
The plate-like member is inspected for each individual piece that is separated into pieces by cutting, and based on the inspection result of the inspection process that distinguishes each individual piece into an acceptable piece or an unacceptable piece, the acceptable piece. Or a step of laminating a mask member on the substrate side of the adhesive sheet corresponding to the reject piece.

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