JP2015233087A - Housing - Google Patents

Abstract

PROBLEM TO BE SOLVED: To effectively fix a substrate in a substrate thickness direction.SOLUTION: A housing 10 includes: a substrate 40 on which a variety of electronic component types are mounted; a case 20 for housing the substrate into a cave from an opening 21; and a cover 30 for capping the opening 21 of the case 20. In each sidewall part 25 of the case 20, there are formed an opening-side guide part 101, a closing-side guide part 102 and a guide groove 103. A gap L2 between the opening-side guide part 101 of each sidewall part 25 of case 20 and the guide groove 103 is formed larger than a gap L1 between the closing-side guide part 102 and the guide groove 103. In the cover 30, by capping the opening 21 of the case 20, there is formed a gap adjustment part 200 (first adjustment part 201 and second adjustment part 202) which fills the gap between the opening-side guide part 101 of each sidewall part 25 of case 20 and the guide groove 103.

Description

  The present invention relates to a housing.

  2. Description of the Related Art Conventionally, there is a housing in which a substrate mounted with electronic components is held by positioning and fixing the width direction of the substrate. As such a case, for example, there is a case provided with a case that accommodates the substrate described in Patent Document 1 from an opening and a cover that covers the opening of the case.

  In the housing of Patent Document 1, as disclosed particularly as the third embodiment, the opening side of the case is formed wider than the closed side of the back, and the side surface and the substrate on the opening side of the case A gap is formed between the side surfaces of the two. Further, the cover is formed with a gap adjusting portion for closing a gap between the inner side surface on the opening side of the case and the side surface of the substrate. And the gap | interval adjustment part of a cover is inserted in the clearance gap between the side surface inside the opening part side of a case, and the side surface of a board | substrate, and the width direction of a board | substrate is fixed with respect to a case. Further, the vertical positioning portion formed on the cover sandwiches the thickness direction of the substrate, so that the thickness direction of the substrate is fixed on the opening side of the case.

JP 2006-19674 A (paragraphs [0085] to [0092], [FIG. 6], [FIG. 7 (a)], and [FIG. 7 (b)])

  However, in Patent Document 1, the board is fixed in the thickness direction only on the opening side of the case, and cannot be said to be sufficient in terms of fixing on the closed side of the case.

  In this regard, as shown in a cross-sectional view of the third embodiment of Patent Document 1 (particularly, [FIG. 7B] of Patent Document 1), the internal space of the case is filled to reduce the interval in the plate thickness direction of the substrate. By packing, it can be understood that the board is fixed in the thickness direction on the closed side of the case. If the internal space of the case is filled in this way, there is a concern that the electronic component mounted on the substrate may hit the inside of the case.

  This invention is made | formed in view of such a situation, The objective is to provide the housing | casing which can be effectively fixed about the plate | board thickness direction of a board | substrate.

  A housing that solves the above problems includes a substrate on which electronic components are mounted, a case in which an opening that opens in one direction and a cavity that can accommodate the substrate is formed, and a cover that covers the opening of the case. I have. Further, in the housing, the case has a closing portion located in the back of the opening, and side wall portions extending from the opening toward the closing portion on both sides in the width direction of the opening. In each side wall portion, a positioning portion is formed in the vicinity of the opening portion and the closing portion so as to position the substrate in the width direction and the thickness direction of the substrate and to sandwich the substrate from the thickness direction of the substrate. The gap in the thickness direction of the substrate of the positioning portion formed in the vicinity of the opening of each side wall portion of the case is formed larger than the gap in the thickness direction of the substrate of the positioning portion formed in the vicinity of the closing portion. The cover is formed with a gap adjusting portion that closes the gap in the thickness direction of the substrate of the positioning portion formed on the opening side of each side wall portion of the case by covering the opening of the case. .

  According to this configuration, by accommodating the substrate in the cavity from the opening of the case, the substrate is first positioned with respect to the case by the positioning portions formed in the vicinity of the opening of the case and in the vicinity of the closing portion. . Of course, the positioning part formed near the opening of the case is larger than the positioning part formed near the closing part of the case so that the opening of the case is not covered with the cover. If so, the substrate is not positioned properly. Therefore, in the above configuration, the cover of the case is covered with the cover so as to close the gap in the plate thickness direction of the substrate of the positioning part formed in the vicinity of the opening of the case. The substrate is also positioned on the side of the opening. As a result, there is no need to provide a restriction in the cavity of the case for the positioning of the substrate, particularly the positioning of the substrate in the plate thickness direction, and the degree of freedom in selecting electronic components mounted on the substrate can be expanded. Therefore, it can fix effectively about the board thickness direction of a board | substrate.

  Moreover, according to the said structure, the frictional force in the surface of the width direction acts on not the board thickness direction but the positioning of a board | substrate. In general, since the substrate has a larger surface area in the width direction than in the plate thickness direction, a larger frictional force can be applied when the frictional force is applied to the positioning of the substrate, that is, fixing. Therefore, it can fix effectively about the board thickness direction of a board | substrate.

In such a housing, it is preferable that the gap adjusting portion is disposed so as to sandwich the substrate from the thickness direction of the substrate.
According to this configuration, when positioning the substrate, the substrate can be positioned from both sides in the thickness direction of the substrate. Therefore, it can fix effectively about the board thickness direction of a board | substrate.

Further, in such a housing, it is preferable that the opening side of the case of the gap adjusting portion is set to a size that can enter the gap of the positioning portion formed in the vicinity of the opening of the case.
According to this configuration, when the case is covered with the cover, the opening side of the case of the gap adjustment unit first enters the gap of the positioning unit formed in the vicinity of the opening of the case. That is, as long as the opening side of the case of the gap adjustment part enters the gap of the positioning part formed in the vicinity of the opening of the case, it serves as a guide for the operation of covering the case with the cover. Therefore, the working efficiency when assembling the casing can be improved.

In such a housing, it is preferable that the gap adjusting portion is fitted in the gap in the thickness direction of the substrate of the positioning portion formed in the vicinity of the opening.
According to this configuration, the board can be more firmly fixed in the thickness direction at the opening side of the case when the board is positioned. Therefore, it can fix effectively about the board thickness direction of a board | substrate.

  According to the present invention, it is possible to effectively fix the substrate in the thickness direction.

The figure which shows schematic structure of a housing | casing. The figure which shows schematic structure of the housing | casing at the time of connector fitting. FIG. 3 is a sectional view taken along line 3-3 in FIG. 2. FIG. 4 is a cross-sectional view taken along line 4-4 of FIG.

Hereinafter, an embodiment of the housing will be described.
As shown in FIG. 1, the housing 10 is used as an in-vehicle ECU case, for example. The housing 10 includes a box-shaped case 20 having an opening 21 that opens in one direction and a stepped portion 22. The housing 10 includes a box-shaped cover 30 having an opening 31 that opens in one direction and a cutout portion 32 in which a part of a wall is cut out in a square shape. The case 20 and the cover 30 are made of a synthetic resin material.

  Two engaging portions 24 penetrating the case 20 are formed in the step portion 22 of the case 20 and the flat portion 23 facing the step portion 22. The stepped portion 22 and the flat portion 23 include a closed portion 26 located in the back facing the opening portion 21 in the housing, and a side wall portion 25 extending from the opening portion 21 toward the closed portion 26 on both sides in the width direction of the opening portion 21. It is connected by. The inside of the case 20 surrounded by the step portion 22, the flat portion 23, the side wall portion 25, and the closing portion 26 is a cavity, and a substrate 40 made of a synthetic resin material is accommodated in the cavity. The side surface of the substrate 40 is accommodated to face each side wall portion 25. A positioning portion 100 for positioning the substrate 40 in the width direction and the plate thickness direction is formed inside each side wall portion 25. The positioning unit 100 will be described in detail later.

  On the substrate 40, a connector 50 that enables electrical connection to various devices outside the housing 10, and various electronic components 60 such as capacitors and resistors are mounted. In the connector 50, a connection portion 51 that is electrically connected to various devices outside the housing 10 protrudes from the opening portion 21 of the case 20 to the outside.

  The cover 30 includes a wall portion 33 in which the cutout portion 32 is formed, and peripheral wall portions 34 a, 34 b, and 34 c that are erected from the wall portion 33. The cutout portion 32 is set to a size that allows the connection portion 51 to be inserted into the cutout portion. Of the peripheral wall portions 34a to 34c, the peripheral wall portion 34b facing the peripheral wall portion 34a to which the cutout portion 32 extends is engaged with the engaging protrusion 35 at a position corresponding to the step portion 22 of the case 20 and the engaging portion 24 of the flat portion 23. Are formed two by two. Further, a plate piece 38 having a cable fixing portion 37 is rotatably connected to the cutout portion 32 via a hinge portion 36. A gap adjusting portion 200 that positions and fixes the substrate 40 in cooperation with the positioning portion 100 of the case 20 is formed inside the peripheral wall portions 34 a to 34 c of the cover 30. The gap adjusting unit 200 will be described in detail later.

  As shown in FIG. 2, in a state where the substrate 40 is accommodated in the cavity of the case 20, the cover 30 is attached to the case 20 from the opening 31 side and the opening 21 of the case 20 is covered. Then, the board | substrate 40 is fixed in the cavity of case 20 by cooperation with the positioning part 100 of case 20 mentioned later and the clearance gap adjustment part 200 of the cover 30. FIG. At that time, the case 20 and the cover 30 are integrally held through the engagement of the engagement portions 24 and the engagement protrusions 35. A connector with cable 52 is connected to the connection portion 51 of the connector 50 protruding from the cutout portion 32 of the cover 30. At that time, the connector with cable 52 is held between the cable fixing portions 37.

Here, the configuration of the positioning unit 100 of the case 20 will be described in detail.
As shown in FIG. 3 and FIG. 4, in the state where the opening 21 of the case 20 is covered, each side wall 25 of the case 20 has an opening-side guide portion 101, a closing-side guide portion 102 that constitutes the positioning portion 100, And the guide groove part 103 is formed, respectively.

  Specifically, as shown in FIG. 3, a plate that protrudes inward in the vicinity of the opening 21 of each side wall 25 of the case 20 and at the corner where each side wall 25 and the opening 21 intersect. Each of the opening-side guide portions 101 is formed. The opening side guide portions 101 of the side wall portions 25 face each other between the side wall portions 25 set at substantially the same interval as the width of the substrate 40.

  Further, in the vicinity of the closing portion 26 of each side wall portion 25 of the case 20 and at the corner where each side wall portion 25 and the closing portion 26 intersect, a plate-like closing side guide portion 102 protruding toward the inside thereof is respectively provided. It is formed. The closing side guide portions 102 of the side wall portions 25 face each other between the side wall portions 25 set at substantially the same interval as the width of the substrate 40.

  Assuming that the opening side guide portion 101 and the closing side guide portion 102 of each side wall portion 25 are continuous between the virtual lines Y, the closer to the flat portion 23 the closer to the closing portion 26 from the opening portion 21 of the case 20. Make a slope.

  The length by which each opening side guide portion 101 and each closing side guide portion 102 protrude is set to a length that does not contact various electronic components 60 mounted on the substrate 40 when the substrate 40 is accommodated in the case 20. The The opening-side guide portion 101 and the closing-side guide portion 102 are stepped so that the volume of the cavity on the surface side on which the various electronic components 60 are mounted on the substrate 40 is increased when the substrate 40 is accommodated in the case 20. Compared to 22, the flat portion 23 is arranged.

  Further, plate-like guide groove portions 103 are respectively formed on the opening side guide portion 101 of each side wall portion 25 and the flat portion 23 side of the closing side guide portion 102. The guide groove portions 103 of the side wall portions 25 face each other between the side wall portions 25 set at substantially the same interval as the width of the substrate 40, and are in the vicinity of the opening 21 of the case 20. From the corner where the opening 21 intersects, it is formed continuously over the corner where the side wall 25 and the closing portion 26 intersect each other in the vicinity of the closing portion 26. Each guide groove portion 103 is inclined so as to approach the step portion 22 as it goes from the opening portion 21 of the case 20 to the closing portion 26. In the present embodiment, the vicinity of the opening 21 and the vicinity of the closing portion 26 are defined as ranges that do not hinder the positioning of the substrate 40 in the width direction and the plate thickness direction. The vicinity of the opening 21 means at least a position closer to the opening 21 than the closing part 26. Further, the vicinity of the closing portion 26 means at least a position closer to the closing portion 26 than the opening portion 21.

  The length by which each guide groove portion 103 protrudes is a length that does not contact various electronic components 60 mounted on the substrate 40 when the substrate 40 is accommodated in the case 20, and includes the opening side guide portion 101 and the closing side. It is set to be substantially the same as the length of the guide portion 102 protruding. The inclination gradient of each guide groove 103 with respect to the substrate 40 has a positive / negative relationship with the inclination of the inclination with respect to the substrate 40 when the opening side guide portion 101 and the closing side guide portion 102 are continuous between the virtual lines Y. Eggplant.

  As shown in FIGS. 3 and 4, the opening side guide portion 101, the closing side guide portion 102, and the guide groove portion 103 of each side wall portion 25 are arranged so as to sandwich the substrate 40 in the plate thickness direction. The gap L2 on the opening side guide part 101 of each side wall part 25 and the opening part 21 side of the guide groove part 103 is compared with the gap L1 between the closing side guide part 102 of each side wall part 25 and the closing part 26 side of the guide groove part 103. It is set large. The gap L1 is set to be substantially the same as the thickness of the substrate 40.

  For this reason, between the closing side guide part 102 and the guide groove part 103 of each side wall part 25 contains a part larger than the thickness of the board | substrate 40, and it becomes so small that it goes to the closing part 26 from the opening part 21 of the case 20. FIG. Is set.

As shown in FIGS. 3 and 4, the wall portion 33 of the cover 30 is formed with a first adjustment portion 201 and a second adjustment portion 202 that constitute the gap adjustment portion 200.
Specifically, as shown in FIG. 3, the wall portion 33 of the cover 30 has a plurality of claw-like (two in this embodiment) protruding from the wall portion 33 toward the case 20 (opening portion 21). The first adjustment unit 201 is formed side by side in the width direction of the substrate 40. In addition, the length that each first adjustment unit 201 protrudes is set to a length that fits in the cover 30.

  Each first adjustment portion 201 is formed such that the opening side guide portion 101 side tapers from the base end 201a toward the tip 201b. On the opening side guide part 101 side of each first adjustment part 201, an inclined part 201c is formed so as to be farther away from the opening side guide part 101 as it goes from the base end 201a to the distal end 201b. In addition, each first adjustment unit 201 abuts on the surface in the width direction in which the substrate 40 side has a larger surface area than the plate thickness direction of the substrate 40. A frictional force acts between each first adjusting portion 201 and the surface in the width direction of the substrate 40 to contribute to fixing the substrate 40.

  Further, on the flat portion 23 side of the first adjustment portion 201 on the wall portion 33 of the cover 30, a plurality of claw-like shapes (in this embodiment, protruding from the wall portion 33 toward the case 20 (opening portion 21)). Two) second adjusting portions 202 are formed side by side in the width direction of the substrate 40. Note that the length by which each second adjustment unit 202 protrudes is set to a length that fits within the cover 30.

  Each second adjusting portion 202 is formed such that the guide groove portion 103 side is tapered from the base end 202a toward the tip end 202b. On each guide groove 103 side of each second adjusting portion 202, an inclined portion 202c is formed so as to be further away from the guide groove 103 as it goes from the base end 202a to the distal end 202b. In addition, each second adjustment unit 202 abuts on the surface in the width direction in which the substrate 40 side has a larger surface area than the plate thickness direction of the substrate 40. A frictional force acts between the second adjusting portions 202 and the width direction surface of the substrate 40 to contribute to fixing the substrate 40.

  Also, as shown in FIG. 4, each first adjustment portion 201 is provided between each peripheral wall portion 34 c and each side wall portion 25 of the case 20 so as to be positioned between each opening-side guide portion 101 and the substrate 40. Only spaced apart. In addition, the first adjustment units 201 are set so that their mutually facing surfaces are flush with each other's facing surfaces in each opening-side guide portion 101.

  In addition, each second adjustment portion 202 is formed to be spaced from each peripheral wall portion 34 c by the thickness of each side wall portion 25 of the case 20 so as to be positioned between each guide groove portion 103 and the substrate 40. In addition, the second adjustment portions 202 are formed such that the opposing surfaces thereof are flush with the opposing surfaces of the guide groove portions 103.

  As shown in FIGS. 3 and 4, each of the adjustment units 201 and 202 is disposed so as to sandwich the substrate 40 in the thickness direction. A gap L3 between the tips 201b and 202b of the adjustment parts 201 and 202 is a gap L1 between the closing side guide part 102 and the guide groove part 103, and is set to be substantially the same as the plate thickness of the substrate 40. In addition, the distance L4 between the base ends 201a and 202a of the adjustment portions 201 and 202 is set to be substantially the same as the gap L2 between the opening side guide portion 101 and the guide groove portion 103.

  Therefore, the inclination of the inclined portion 201c of the first adjustment unit 201 with respect to the substrate 40 is inclined with respect to the substrate 40 when the opening side guide portion 101 and the closing side guide portion 102 are connected between the virtual lines Y. The slope is set steeper than the slope of. In addition, the gradient of the inclination of the inclined portion 202c of the second adjustment unit 202 with respect to the substrate 40 is set to be steeper than the gradient of the inclination of the guide groove 103 with respect to the substrate 40.

  3 and 4, the gap L3 ′ between the tips 201b and 202b of the adjustment portions 201 and 202 is the opening portion of the case 20 in a state where the opening portion 21 of the case 20 is not covered. It is set to be larger than the gap L3 in a state in which 21 is covered and larger than the thickness of the substrate 40. In addition, in the state where the opening 21 of the case 20 is not covered, the distance L4 ′ between the base ends 201a, 202a of the adjustment parts 201, 202 is larger than the distance L4 in the state where the opening 21 of the case 20 is covered, It is set larger than the gap between the opening side guide portion 101 and the guide groove portion 103. That is, the base end 201 a of the first adjustment unit 201 has a larger thickness in the plate thickness direction of the substrate 40 than the gap between the opening-side guide unit 101 and the substrate 40. Further, the base end 202 a of the second adjustment unit 202 has a thickness in the plate thickness direction of the substrate 40 that is larger than the gap on the guide groove portion 103 and the opening 21 side of the substrate 40.

  Further, in a state in which the opening 21 of the case 20 is not covered, the gap L3 ′ between the tips 201b and 202b of the adjustment portions 201 and 202 is larger than the plate thickness of the substrate 40, and the opening side guide portion 101 of the case 20 and It is set to be smaller than the gap L2 of the guide groove 103.

According to the casing 10 described above, the following operations and effects shown in (1) to (5) are achieved.
(1) When assembling the housing 10, the substrate 40 is inserted into the cavity of the case 20 by inserting the substrate 40 from the opening 21 of the case 20 toward the closing portion 26. That is, the substrate 40 reaches the closing portion 26 and is sandwiched between the closing side guide portion 102 and the guide groove portion 103. At that time, the board 40 is inserted with the connector 50 facing the opening 21 side.

  As a result, the substrate 40 is accommodated between the closed side guide portion 102 and the guide groove portion 103 on the closed portion 26 side of each side wall portion 25 without a gap. On the other hand, on the side of the opening portion 21 of each side wall portion 25, the substrate 40 is accommodated with a gap between the opening side guide portion 101 and the guide groove portion 103, and the cover 30 does not cover the opening portion 21 of the case 20. The board | substrate 40 is accommodated so that operation | movement (vibration) is possible in a plate | board thickness direction. The positioning of the substrate 40 in the width direction is performed by each side wall portion 25 of the case 20.

  Therefore, first, the substrate 40 is positioned with respect to the case 20 by the respective opening side guide portions 101, the respective closing side guide portions 102, and the respective guide groove portions 103 of the case 20. In particular, on the closed portion 26 side of the case 20, the substrate 40 is sandwiched and fixed between the closed side guide portions 102 and the guide groove portions 103.

  However, since the gap L2 on the opening portion 21 side of the case 20 is larger than the gap L1 on the closing portion 26 side of the case 20, the closing portion 26 side of the substrate 40 is not covered with the opening portion 21 of the case 20. The substrate 40 is not fixed and is free, and the substrate 40 is not sufficiently positioned and fixed.

  Then, by subsequently covering the opening 21 of the case 20 with the cover 30, the tip 201 b of each first adjustment unit 201 enters (inserts) between the opening-side guide unit 101 and the substrate 40, and each first (2) The tip 202b of the adjusting unit 202 enters (inserts) between the guide groove 103 and the substrate 40. That is, each first adjustment portion 201 closes the gap between the opening side guide portion 101 and the substrate 40, and each second adjustment portion 202 closes the gap between the guide groove portion 103 and the substrate 40, so that the closing portion 26 side of the case 20 is closed. In addition, the substrate 40 is positioned not only on the opening 21 side of the case 20. In addition, since each of the adjustment units 201 and 202 is disposed so as to sandwich the substrate 40 in the thickness direction, positioning is performed from both sides of the substrate 40 in the thickness direction.

  As a result, there is no need to provide a restriction in the cavity of the case 20 with respect to the positioning of the substrate 40, particularly the positioning of the substrate 40 in the thickness direction, and the degree of freedom in selecting various electronic components 60 mounted on the substrate 40 is increased. Be able to. Accordingly, the substrate 40 can be more effectively fixed in the thickness direction.

  (2) Moreover, according to the said structure, with respect to positioning of the board | substrate 40, the frictional force in the surface of the width direction of the board | substrate 40 acts instead of the plate | board thickness direction. In general, since the substrate has a larger surface area in the width direction than in the plate thickness direction, a larger frictional force can be applied when a frictional force is applied to the positioning of the substrate 40, that is, fixation. Therefore, the substrate 40 can be effectively fixed in the thickness direction.

  (3) The gap L3 ′ between the tips 201b and 202b of the adjustment parts 201 and 202 is set to be larger than the plate thickness of the substrate 40 and smaller than the gap L2 between the opening side guide part 101 and the guide groove part 103 of the case 20. The Accordingly, the tip 201b of each first adjustment unit 201 is set so as to be able to enter the gap between the opening-side guide unit 101 and the substrate 40. Further, the tip 202b of each second adjustment unit 202 is set so as to be able to enter the gap between the guide groove 103 and the substrate 40.

  When assembling the housing 10, each tip 201 b enters between each opening side guide portion 101 and the substrate 40, and each tip 202 b enters between each guide groove portion 103 and the substrate 40. That is, as long as the tips 201b and 202b of the respective adjustment portions 201 and 202 are inserted into the respective gaps related to the respective opening side guide portions 101 or the respective guide groove portions 103, the cover 30 covers the opening portion 21 of the case 20. It will be a guide to work. Therefore, the working efficiency when assembling the housing 10 can be improved.

  (4) In the present embodiment, the thickness of the base end 201 a of the first adjustment unit 201 in the plate thickness direction of the substrate 40 is made larger than the gap between the opening side guide unit 101 and the substrate 40. In the present embodiment, the thickness of the base end 202 a of the second adjustment unit 202 in the plate thickness direction of the substrate 40 is made larger than the gap on the guide groove 103 and the opening 21 side of the substrate 40. Further, in the present embodiment, the inclination of the inclined parts 201c and 202c of the adjusting parts 201 and 202 with respect to the substrate 40 is made steeper than the inclination of the positioning part 100 facing each other with respect to the substrate 40.

  Accordingly, the cover 21 covers the opening 21 of the case 20, so that the base end 201 a of each first adjustment unit 201 is tightly fitted between the opening-side guide unit 101 and the substrate 40, and each second The base end 202a of the adjustment portion 202 is fit between the guide groove portion 103 and the opening 21 side of the substrate 40. In other words, the base ends 201 a and 202 a of the respective adjustment units 201 and 202 are tightly fitted with the substrate 40 sandwiched between the opening side guide unit 101 and the guide groove 103. For this reason, when the substrate 40 is positioned, the fixing of the substrate 40 in the plate thickness direction on the opening 21 side of the case 20 can be made stronger. Therefore, the substrate 40 can be effectively fixed in the thickness direction.

  (5) As described above, the substrate 40 may be further pressed against the closing portion 26 side when the interference fit is performed. Thereby, a larger frictional force can be applied to the surface in the width direction of the substrate 40 for positioning the substrate 40. Accordingly, the substrate 40 can be more effectively fixed in the thickness direction.

In addition, the said embodiment can also be implemented with the following forms which changed this suitably.
-Each adjustment part 201,202 should just be pressed by the board | substrate 40 side by the opening side guide part 101 and the guide groove part 103 by covering the opening part 21 of case 20, and each member is interposed between each. It is also possible to press the adjustment portions 201 and 202 against the substrate 40 side by the opening side guide portion 101 and the guide groove portion 103.

  In a state where the opening 21 of the case 20 is not covered, the gap L3 ′ between the tips 201b and 202b of the respective adjustment portions 202 and 202 is made smaller than the plate thickness of the substrate 40, so that the fixing of the substrate 40 can be maintained. Also good.

  In the state where the opening 21 of the case 20 is not covered, the gap L3 ′ between the tips 201b and 202b of the adjustment parts 201 and 202 is larger than the gap L2 between the opening side guide part 101 and the guide groove part 103 of each side wall part 25. May be. When the opening portion 21 of the case 20 is covered, it is only necessary to cause elastic deformation so that the tips 201b and 202b of the adjustment portions 201 and 202 are close to each other.

  In the present embodiment, any gap between the opening side guide part 101 or the guide groove part 103 and the substrate 40 is filled with the gap adjusting part 200, but only one of these gaps is filled with the gap adjusting part 200. Also good. That is, it is sufficient to form only one of the adjustment units 201 and 202.

  -Each adjustment part 201,202 can also be set as the structure which protrudes from the cover 30 with the method in which the cover 30 covers the opening part 21 of the case 20. FIG. For example, as a method for the cover 30 to cover the opening 21 of the case 20, there is a method in which only the wall 33 is provided as the cover 30 and the periphery of the wall 33 is fixed to the periphery of the opening 21 with an adhesive or the like. Conceivable.

  The guide groove portion 103 may not be formed continuously, may be divided at some places, and the opening portion 21 and the closing portion 26 like the opening side guide portion 101 and the closing side guide portion 102. One may be formed on each side. On the other hand, about the opening side guide part 101 and the closing side guide part 102, these may be formed continuously.

  -As for the arrangement of the opening side guide part 101 and the closing side guide part 102, assuming that they are continuous between the virtual lines Y, they may be arranged parallel to the substrate 40, or may be partially inclined or They may be arranged in parallel or arranged in a curve. Further, the guide groove portion 103 may be formed in parallel to the substrate 40, may be partially arranged in an inclined or parallel manner, or may be arranged in a curved line. The arrangement of the opening side guide portion 101 and the closing side guide portion 102 and the guide groove portion 103 may be different combinations.

  -The opening side guide part 101 should just be formed in the vicinity of the opening part 21 of each side wall part 25 of the case 20, and may be formed in the position recessed from the opening part 21. FIG. Moreover, the closing side guide part 102 should just be formed in the closing part 26 vicinity of each side wall part 25 of case 20, and may be formed in the position before this closing part 26. FIG. Similarly to these, the guide groove 103 may be continuously formed from a position recessed from the opening 21 to a position in front of the closing portion 26. However, the opening side guide portion 101, the closing side guide portion 102, and the guide groove portion 103 need to satisfy a positional relationship that does not hinder the positioning of the substrate 40 in the width direction and the plate thickness direction.

Next, a technical idea that can be grasped from the above-described embodiment and another example (modification) will be additionally described below.
(A) The gap of the positioning portion formed in the vicinity of the closing portion of the case is formed to be substantially the same as the plate thickness of the substrate or to include a portion having a thickness equal to or less than the plate thickness. According to this configuration, when the board is positioned, the board thickness direction can be more firmly fixed on the closed side of the case, and the board thickness direction can be effectively fixed. Can do.

  DESCRIPTION OF SYMBOLS 10 ... Housing | casing, 20 ... Case, 21 ... Opening part, 25 ... Side wall part, 26 ... Closure part, 30 ... Cover, 40 ... Board | substrate, 60 ... Electronic component, 100 ... Positioning part, 101 ... Opening side guide part, 102 ... Close side guide part, 103 ... Guide groove part, 200 ... Gap adjustment part, 201 ... First adjustment part, 201b ... Tip (opening side of the first adjustment part), 202 ... Second adjustment part, 202b ... Tip (first) 2 Opening side of adjustment part).

Claims (4)

A substrate on which electronic components are mounted;
A case formed with an opening that opens in one direction and a cavity that can accommodate the substrate;
In a housing provided with a cover that covers the opening of the case,
The case has a closing portion positioned in the back of the opening, and side walls extending from the opening toward the closing portion on both sides in the width direction of the opening,
Positioning portions arranged so as to position the substrate in the width direction and the plate thickness direction of the substrate and sandwich the substrate from the plate thickness direction of the substrate are located in the vicinity of the opening portion and the closing portion on each side wall portion. Formed in each of the neighborhoods,
The gap in the plate thickness direction of the substrate of the positioning portion formed in the vicinity of the opening of each side wall portion of the case is the gap in the plate thickness direction of the substrate of the positioning portion formed in the vicinity of the closing portion. Formed larger than
The cover is formed with a gap adjusting portion that closes the gap in the thickness direction of the substrate of the positioning portion formed in the vicinity of the opening of each side wall portion of the case by covering the opening of the case. Enclosure.   The housing according to claim 1, wherein the gap adjustment unit is disposed so as to sandwich the substrate from a thickness direction of the substrate.   The housing according to claim 2, wherein the opening side of the case of the gap adjusting portion is set to a size that can enter a gap of the positioning portion formed in the vicinity of the opening of the case.   4. The housing according to claim 1, wherein the gap adjusting portion is fitted into a gap in the plate thickness direction of the substrate of the positioning portion formed in the vicinity of the opening. 5. .