JP2015201661A - semiconductor device - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a technology capable of improving reliability of a semiconductor device.SOLUTION: In the present invention, a through-hole substrate (THWB), instead of a build-up substrate, is used as a wiring substrate on which a semiconductor chip is to be mounted. Accordingly, in the present invention, with the through-hole substrate, which consists of a core layer only, it becomes unnecessary to consider difference in thermal expansion coefficient between a build-up layer and the core layer, further, as there is no build-up layer, it becomes unnecessary to consider electrical disconnection of micro-vias formed on the build-up layer. According to the present invention, reliability of a semiconductor device can be improved, while reducing a cost.

Description

  The present invention relates to a semiconductor device, and more particularly to a technique effective when applied to a semiconductor device in which a semiconductor chip is mounted on a wiring board using bump electrodes (projection electrodes).

  In Japanese Patent Laid-Open No. 2002-246552 (Patent Document 1), bump electrodes which are external connection terminals are formed only on the periphery of a rectangular semiconductor chip, and the semiconductor chip is mounted on a wiring board by the bump electrodes. The technology to do is described.

JP 2002-246552 A

  2. Description of the Related Art A semiconductor device is formed of a semiconductor element such as a MOSFET (Metal Oxide Semiconductor Field Effect Transistor) and a semiconductor chip in which a multilayer wiring is formed, and a package formed so as to cover the semiconductor chip. The package includes (1) a function of electrically connecting a semiconductor element formed on the semiconductor chip and an external circuit, and (2) protection of the semiconductor chip from an external environment such as humidity and temperature, and vibration and shock. It has a function of preventing damage caused by the deterioration of the semiconductor chip characteristics. In addition, the package has (3) the function of facilitating the handling of the semiconductor chip, and (4) the function of radiating the heat generated during the operation of the semiconductor chip and maximizing the function of the semiconductor element. ing. There are various types of packages having such functions.

  Below, the structural example of a package is demonstrated. For example, there is a BGA (Ball Grid Array) package in which a bump electrode (projection electrode) as an external connection terminal is formed on the surface of a semiconductor chip, and the semiconductor chip is mounted on a wiring board by the bump electrode. In this BGA package, a build-up substrate that can easily form fine pitch (narrow pitch) wiring is used in response to high density and narrow pitch of bump electrodes formed on a semiconductor chip. An example of the structure of this build-up substrate includes a build-up layer that sandwiches a core layer, for example. Further, fine vias are formed in the build-up layer, and these vias can be freely arranged. A terminal can be disposed on the fine via. The reason will be described. A fine via formed in the build-up layer has a small via diameter, so that it is easy to embed a conductor film inside the via. As a result, it is possible to create a state in which the upper part of the via is covered with the conductor film, and thus it is possible to realize reliable electrical connection between the via and the terminal even if the terminal is arranged on the via. As described above, the build-up substrate can arrange terminals even on fine vias, so that there are few restrictions when forming the wiring and there is an advantage that it is easy to form a fine pitch wiring.

  However, as a result of studies by the present inventors, it has been newly found that the build-up board has the following problems. This problem will be described. First, the buildup substrate includes a core layer and a buildup layer formed so as to sandwich the core layer. The reason for this will be described.

  For example, when the semiconductor device operates, the semiconductor chip generates heat, and heat generated by the generated heat is transmitted from the semiconductor chip to the build-up substrate. As a result, the buildup substrate expands when heat is applied to the buildup substrate. When the expansion of the build-up substrate increases, stress is applied to the sealing resin (for example, an underfill material) that seals the gap between the build-up substrate and the semiconductor chip, for example, the interface between the semiconductor chip and the sealing resin. In addition, cracks may occur at the interface between the sealing resin and the buildup substrate, which may reduce the reliability of the semiconductor device. For this reason, the build-up substrate has a core layer containing a glass cloth, which is a woven fabric made of glass fibers, in order to make its thermal expansion coefficient (α) as small as possible (to approach the thermal expansion coefficient of the semiconductor chip). Is provided to reduce the coefficient of thermal expansion of the build-up substrate. However, if the build-up substrate is configured only from the core layer containing glass cloth, it becomes difficult to form fine vias. For this reason, normally, in a build-up substrate, a build-up layer is provided so as to sandwich a core layer, and a fine via can be formed by not including glass cloth in the build-up layer. That is, since the build-up layer is configured not to include glass cloth, it is possible to form fine vias. However, since it is necessary to reduce the thermal expansion coefficient in the build-up layer, a glass filler (granular, bead-like glass) is added instead of the glass cloth. From the above, the build-up substrate is composed of a core layer and a build-up layer formed so as to sandwich the core layer.

  Here, as described above, the core layer contains glass cloth, while the buildup layer contains glass filler instead of glass cloth. However, the thermal expansion coefficient of the buildup layer containing the glass filler is not as small as the thermal expansion coefficient of the core layer containing the glass cloth. For example, the thermal expansion coefficient of the core layer is about 17 to 20 ppm, and the thermal expansion coefficient of the buildup layer is about 40 to 60 ppm. As a result, the thermal expansion coefficient between the buildup layer and the core layer is different, and thermal stress due to the difference in thermal expansion coefficient is applied between the buildup layer and the core layer. Then, the present inventor has the possibility that fine vias formed in the buildup layer are easily cut electrically by this thermal stress, which may reduce the reliability of the semiconductor device in the future. I found.

  An object of the present invention is to provide a technique capable of improving the reliability of a semiconductor device.

  The above and other objects and novel features of the present invention will be apparent from the description of this specification and the accompanying drawings.

  Of the inventions disclosed in the present application, the outline of typical ones will be briefly described as follows.

  A semiconductor device according to a typical embodiment is characterized in that a through substrate is used as a wiring substrate on which a semiconductor chip is mounted without using a buildup substrate.

  Among the inventions disclosed in the present application, effects obtained by typical ones will be briefly described as follows.

  It is not necessary to consider the difference in thermal expansion coefficient between the buildup layer and the core layer. Furthermore, since there is no buildup layer, it is necessary to consider the electrical cutting of fine vias formed in the buildup layer. Disappears. As a result, the reliability of the semiconductor device can be improved while reducing the cost.

It is a top view which shows the external appearance structure of the semiconductor chip which this inventor examined. It is a side view which shows the structure of the semiconductor device which this inventor examined. It is a figure which shows a part of semiconductor device which this inventor examined, Comprising: It is a figure which shows the internal structure of a buildup board | substrate. It is a figure which shows the surface structure of the semiconductor chip in embodiment. It is a side view which shows the structure of the semiconductor device in embodiment. It is a figure which shows a part of semiconductor device in embodiment, Comprising: It is a figure which shows the internal structure of a penetration substrate. It is a top view which shows the partial structure of the penetration board | substrate in embodiment. It is a figure which shows the structural example which arrange | positions a terminal on a through hole. It is a figure which shows the structural example when the positional relationship of a through hole and a land has shifted | deviated. It is sectional drawing which shows the state which reduced the size of the hemispherical bump electrode which consists of solder, and mounted this bump electrode on a penetration board | substrate. It is a fragmentary sectional view which shows the state which mounts a columnar bump electrode on a penetration substrate. It is sectional drawing which shows the rewiring structure formed in the semiconductor chip which this inventor examined. It is sectional drawing which shows the bump structure formed in the semiconductor chip in embodiment. It is a side view which shows the manufacturing process of the semiconductor device in embodiment. FIG. 15 is a side view showing a manufacturing step of the semiconductor device following that of FIG. 14; FIG. 16 is a side view showing a manufacturing step of the semiconductor device following that of FIG. 15; FIG. 17 is a side view showing a manufacturing step of the semiconductor device following that of FIG. 16; It is a side view which shows another manufacturing process of the semiconductor device in embodiment. FIG. 19 is a side view showing a manufacturing step of the semiconductor device following that of FIG. 18; FIG. 20 is a side view showing a manufacturing step of the semiconductor device following that of FIG. 19; FIG. 21 is a side view showing a manufacturing step of the semiconductor device following that of FIG. 20; It is sectional drawing which shows the state which mounts the stud bump electrode which consists of gold | metal | money on a penetration board | substrate. It is a side view which shows the manufacturing process of the semiconductor device in a modification. FIG. 24 is a side view showing a manufacturing step of the semiconductor device following that of FIG. 23; FIG. 25 is a side view showing a manufacturing step of the semiconductor device following that of FIG. 24; FIG. 26 is a side view showing a manufacturing step of the semiconductor device following that of FIG. 25; It is a graph for demonstrating the positioning of this invention.

  In the following embodiments, when it is necessary for the sake of convenience, the description will be divided into a plurality of sections or embodiments. However, unless otherwise specified, they are not irrelevant to each other. There are some or all of the modifications, details, supplementary explanations, and the like.

  Further, in the following embodiments, when referring to the number of elements (including the number, numerical value, quantity, range, etc.), especially when clearly indicated and when clearly limited to a specific number in principle, etc. Except, it is not limited to the specific number, and may be more or less than the specific number.

  Further, in the following embodiments, the constituent elements (including element steps and the like) are not necessarily indispensable unless otherwise specified and apparently essential in principle. Needless to say.

  Similarly, in the following embodiments, when referring to the shape, positional relationship, etc., of components, etc., unless otherwise specified, and in principle, it is considered that this is not clearly the case, it is substantially the same. Including those that are approximate or similar to the shape. The same applies to the above numerical values and ranges.

  In all the drawings for explaining the embodiments, the same members are denoted by the same reference symbols in principle, and the repeated explanation thereof is omitted. In order to make the drawings easy to understand, even a plan view may be hatched.

<Description of issues using drawings>
First, problems of the semiconductor device studied by the present inventors will be described with reference to the drawings. FIG. 1 is a top view showing an external configuration of a semiconductor chip CHP1 examined by the present inventors. As shown in FIG. 1, the semiconductor chip CHP1 has a rectangular shape, and bump electrodes BMP that are external connection terminals are formed over the entire surface of the semiconductor chip CHP1. By packaging the semiconductor chip CHP1 configured in this way, the semiconductor device studied by the present inventor can be obtained.

  FIG. 2 is a side view showing the configuration of the semiconductor device studied by the present inventors. As shown in FIG. 2, the semiconductor device examined by the present inventor has a build-up substrate BPWB, and a plurality of solder balls SB are formed on the back surface (lower surface) of the build-up substrate BPWB. On the other hand, the semiconductor chip CHP1 is mounted on the surface (upper surface) of the build-up substrate BPWB. At this time, the semiconductor chip CHP1 is built so that the plurality of bump electrodes BMP formed on the semiconductor chip CHP1 are electrically connected to terminals (not shown) formed on the surface of the build-up substrate BPWB. Arranged on the up substrate BPWB. A gap formed between the semiconductor chip CHP1 and the buildup substrate BPWB is filled with an underfill UF that is a sealing resin. The underfill UF is often an epoxy resin, and is used to ensure the connection reliability between the semiconductor chip CHP1 and the build-up substrate BPWB. A heat sink HS is disposed on the upper surface of the semiconductor chip CHP1 via a silicone resin SCE. The heat sink HS is provided so that heat generated in the semiconductor chip CHP1 is efficiently dissipated to the outside. That is, the heat sink HS is provided in order to improve the heat dissipation efficiency of the semiconductor chip CHP1.

  Regarding the semiconductor device examined by the present inventors configured in this way, the internal structure of the build-up substrate BPWB will be described in more detail. FIG. 3 is a diagram showing a part of the semiconductor device examined by the present inventor and showing the internal structure of the build-up substrate BPWB. As shown in FIG. 3, the build-up board BPWB is formed of a core layer CRL, and a build-up layer BPL1 and a build-up layer BPL2 arranged so as to sandwich the core layer CRL.

  Specifically, a through hole TH is formed in the core layer CRL, and a multilayer wiring (two layers in FIG. 3) connected to the through hole TH is formed in the buildup layer BPL1. The multilayer wirings are connected to each other by vias VA formed in the buildup layer BPL1. A solder resist SR is formed on the surface of the buildup layer BPL1, and terminals (land pattern, foot pattern) TE constituting the buildup layer BPL1 are exposed from an opening provided in the solder resist SR. Yes. The semiconductor chip CHP1 is mounted on the buildup substrate BPWB so that the terminal TE and the bump electrode BMP are electrically connected.

  On the other hand, the build-up layer BPL2 is also formed with a multilayer wiring (two layers in FIG. 3) connected to the through hole TH formed in the core layer CRL. A solder resist SR is formed on the surface of the buildup layer BPL2, and a back surface terminal BTE constituting the buildup layer BPL2 is exposed from an opening provided in the solder resist SR. A solder ball SB is mounted on the back terminal BTE so as to be electrically connected to the back terminal BTE. Specifically, in the build-up board BPWB shown in FIG. 3, the combined thickness of the core layer CRL (about 0.8 mm), the build-up layer BPL1, and the build-up layer BPL2 is about 1.0 mm, The diameter of the hole TH is about 150 to 250 μm, and the diameter of the via VA is about 50 μm.

  The build-up substrate BPWB configured in this way has an advantage that it is easy to form fine pitch wiring corresponding to the increase in the density of the bump electrodes BMP formed on the semiconductor chip CHP1. That is, the build-up board BPWB has, for example, the build-up layer BPL1 and the build-up layer BPL2 so as to sandwich the core layer CRL, and fine vias VA are formed in the build-up layer BPL1 and the build-up layer BPL2. The via VA can be freely arranged. Further, the terminal TE can be disposed on the fine via VA. The reason will be described. In the fine via VA formed in the buildup layer BPL1 and the buildup layer BPL2, the via diameter is fine, so that it is easy to embed a conductor film inside the via VA. As a result, it is possible to create a state in which the upper portion of the via VA is covered with a conductor film, so that even if the terminal TE is disposed on the via VA, a reliable electrical connection between the via VA and the terminal TE is realized. can do. As described above, the build-up substrate BPWB has the advantage that it is easy to form a fine pitch wiring because there are few restrictions when forming the wiring because the terminals TE can be arranged on the fine via VA.

  Further, as shown in FIG. 3, in the build-up substrate BPWB, a plating film is formed on the wall surface of the through hole TH formed in the core layer CRL. However, since the diameter of the through hole TH is large, the through hole TH No plating film is formed inside. However, as shown in FIG. 3, the hole filling resin is buried in the through hole TH, and the inside of the through hole TH is filled. For this reason, in the build-up board BPWB shown in FIG. 3, fine vias VA and wirings can be arranged also on the through holes TH. From this point as well, there are fewer restrictions when forming the wiring, and the fine pitch It is easy to form the wiring.

  However, as a result of examination by the present inventors, it has been newly found that the above-described build-up substrate BPWB has the following problems. For example, when the semiconductor device operates, the semiconductor chip CHP1 generates heat, and the heat generated by the heat generation is transmitted from the semiconductor chip CHP1 to the buildup substrate BPWB. As a result, heat is applied to the build-up substrate BPWB, so that the build-up substrate BPWB expands. When the expansion of the buildup substrate BPWB increases, stress is applied to the sealing resin (underfill UF) that seals the gap between the buildup substrate BPWB and the semiconductor chip CHP1, for example, between the semiconductor chip and the sealing resin. Cracks may occur at the interface or the interface between the sealing resin and the buildup substrate, which may reduce the reliability of the semiconductor device. For this reason, the build-up substrate BPWB has a core containing a glass cloth which is a woven fabric made from glass fibers in order to reduce its thermal expansion coefficient (α) (to approach the thermal expansion coefficient of the semiconductor chip CHP1). A layer CRL is provided to reduce the thermal expansion coefficient of the build-up substrate BPWB. However, if the build-up substrate BPWB is configured only from the core layer CRL containing glass cloth, it is difficult to form a fine via VA. Therefore, normally, in the build-up substrate BPWB, the build-up layer BPL1 (BPL2) is provided so as to sandwich the core layer CRL, and the fine via VA is formed by not including the glass cloth in the build-up layer BPL1 (BPL2). I am doing so. That is, since the build-up layer BPL1 (BPL2) is configured not to include the glass cloth, it is possible to form a fine via VA. However, in the build-up layer BPL1 (BPL2), since it is necessary to reduce the thermal expansion coefficient, glass filler (granular, bead-like glass) is added instead of glass cloth.

  Here, as described above, the core layer CRL contains a glass cloth, while the buildup layer BPL1 (BPL2) contains a glass filler instead of the glass cloth. However, the thermal expansion coefficient of the buildup layer BPL1 (BPL2) containing the glass filler is not as small as the thermal expansion coefficient of the core layer CRL containing the glass cloth. For example, the thermal expansion coefficient of the core layer is about 17 to 20 ppm, and the thermal expansion coefficient of the buildup layer is about 40 to 60 ppm. As a result, the thermal expansion coefficients of the buildup layer BPL1 (BPL2) and the core layer CRL are different, and the thermal stress due to the difference in thermal expansion coefficient is between the buildup layer BPL1 (BPL2) and the core layer CRL. Will join. Then, the present inventor tends to electrically cut the fine via VA formed in the buildup layer BPL1 (BPL2) due to the thermal stress, which may reduce the reliability of the semiconductor device. I found out. Therefore, in this embodiment, a device that can improve the reliability of the semiconductor device is taken. The semiconductor device according to the present embodiment to which this device has been applied will be described below.

<Configuration of Semiconductor Device in this Embodiment>
FIG. 4 is a diagram showing a surface structure of the semiconductor chip CHP2 in the present embodiment. As shown in FIG. 4, the semiconductor chip CHP2 in the present embodiment has a rectangular shape, and columnar bump electrodes (columnar protrusion electrodes) PLBMP1 and columnar bump electrodes PLBMP2 are formed on the surface region of the semiconductor chip CHP2. . The columnar bump electrode PLBMP1 and the columnar bump electrode PLBMP2 are composed of, for example, a columnar portion made of copper (Cu) and a connection portion made of solder formed on the columnar portion. The height of the columnar portion is, for example, about 30 μm here, and the height of the connecting portion (solder height) is about 15 μm. The shape of the columnar part is a columnar shape or a rectangular parallelepiped shape. When viewed in a plan view, the diameter when the columnar shape is about 30 to 35 μm, and the length of one side when the shape is a rectangular parallelepiped is about It is about 30 to 35 μm.

  Specifically, in the semiconductor chip CHP2 in the present embodiment, as shown in FIG. 4, the surface area of the semiconductor chip CHP2 is located in the area AR1, the area AR2 inside the area AR1, and the inside of the area AR2. When divided into a certain area AR3, a plurality of columnar bump electrodes PLBMP1 are formed in the area AR1, and a plurality of columnar bump electrodes PLBMP2 are formed in the area AR3. That is, the columnar bump electrode PLBMP1 and the columnar bump electrode PLBMP2 are arranged apart from each other with the area AR2 interposed therebetween. At this time, a plurality of columnar bump electrodes PLBMP1 are formed in a plurality of columns (two columns in FIG. 4) in the region AR1, and a plurality of columnar bump electrodes PLBMP2 are formed uniformly in the region AR3.

  Here, the minimum pitch between the bumps of the columnar bump electrode PLBMP1 arranged in the region AR1 is smaller than the minimum pitch between the bumps of the columnar bump electrode PLBMP2 arranged in the region AR2. Here, the minimum pitch between the bumps of the columnar bump electrode PLBMP1 arranged in the area AR1 is about 40 to 60 μm. However, there is no particular problem even when the minimum pitch between the bumps of the columnar bump electrode PLBMP1 is equal to or greater than the minimum pitch between the bumps of the columnar bump electrode PLBMP2.

  On the other hand, neither columnar bump electrode PLBMP1 nor columnar bump electrode PLBMP2 is formed in region AR2.

  That is, the feature of the semiconductor chip CHP2 in the present embodiment is that the columnar bump electrodes PLBMP1 (PLBMP2) are not formed on the entire surface of the semiconductor chip CHP2, but the columnar bump electrodes PLBMP1 (PLBMP2) only in the regions AR1 and AR3. ) And the columnar bump electrode PLBMP1 (PLBMP2) is not formed in the area AR2. For example, in the semiconductor chip CHP1 examined by the present inventor shown in FIG. 1, the bump electrode BMP is formed on the entire surface of the semiconductor chip CHP1, whereas in the semiconductor chip CHP2 in the present embodiment shown in FIG. It can be seen that the columnar bump electrode PLBMP1 (PLBMP2) is formed only in the region AR1 and the region AR3, and the columnar bump electrode PLBMP1 (PLBMP2) is not formed in the region AR2.

  Next, the structure of the semiconductor device in this embodiment is described. FIG. 5 is a side view showing the configuration of the semiconductor device according to the present embodiment. As shown in FIG. 5, the semiconductor device according to the present embodiment has a through-hole wiring board THWB, and a plurality of solder balls SB are formed on the back surface (lower surface) of the through-hole wiring board THWB. On the other hand, a semiconductor chip CHP2 is mounted on the surface (upper surface) of the through wiring board THWB. At this time, the plurality of columnar bump electrodes PLBMP1 and columnar bump electrodes PLBMP2 formed on the semiconductor chip CHP2 are electrically connected to terminals (not shown) formed on the surface of the through-hole wiring board THWB. The semiconductor chip CHP2 is disposed on the through wiring board THWB. A gap formed between the semiconductor chip CHP2 and the through wiring board THWB is filled with an underfill UF that is a sealing resin. This underfill UF is often an epoxy resin and is used to ensure the connection reliability between the semiconductor chip CHP2 and the through wiring board THWB.

  Regarding the semiconductor device according to the present embodiment configured as described above, in particular, the internal structure of the through wiring board THWB will be described in more detail. FIG. 6 is a diagram showing a part of the semiconductor device in the present embodiment, and is a diagram showing an internal structure of the through wiring board THWB. As shown in FIG. 6, in the present embodiment, the through wiring board THWB is formed by the core layer CRL containing glass cloth. In the through-hole wiring board THWB, through-holes TH1, TH2, and TH3 penetrating from the front surface (upper surface) to the back surface (lower surface) of the through-hole wiring board THWB are formed. A solder resist SR (first solder resist) is formed on the surface of the through-hole wiring board THWB, and the solder resist SR is also filled in the through holes TH1, TH2, and TH3. Openings are formed in the solder resist SR, and a plurality of terminals (land patterns, foot patterns) TE1 and a plurality of terminals (land patterns, foot patterns) TE2 are exposed from the openings.

  For example, a plurality of terminals TE1 are formed on the surface of the through wiring board THWB, and some of the plurality of terminals TE1 are electrically connected to the through holes TH1 on the surface of the through wiring board THWB, and the plurality of terminals TE1. The other part is electrically connected to the through hole TH2 on the surface of the through wiring board THWB. A plurality of terminals TE2 are also formed on the surface of the through wiring board THWB, and the plurality of terminals TE2 are electrically connected to the through holes TH3 on the surface of the through wiring board THWB. At this time, the semiconductor chip CHP2 is mounted on the surface of the through wiring board THWB, and the columnar bump electrode PLBMP1 formed on the semiconductor chip CHP2 and the terminal TE1 formed on the surface of the through wiring board THWB are electrically connected. Connected. Similarly, the columnar bump electrode PLBMP2 formed on the semiconductor chip CHP2 and the terminal TE2 formed on the surface of the through wiring board THWB are electrically connected. In other words, the through-hole wiring board THWB has a structure having only one wiring layer on the front and back surfaces of the core layer CRL. In the semiconductor device according to the present embodiment, the columnar bump electrode is directly electrically connected to the wiring layer. It can be said that it is a structured.

  On the other hand, a solder resist SR (second solder resist) is also formed on the back surface of the through wiring board THWB. An opening is formed in the solder resist SR, and a plurality of back terminals BTE are exposed from the opening. These back surface terminals BTE are electrically connected to the through holes TH1, TH2, TH3 on the back surface of the through wiring board THWB, and solder balls SB are mounted on these back surface terminals BTE. Specifically, in the through-hole wiring board THWB in the present embodiment, the substrate thickness (considering the wiring thickness of the front and back surfaces) by the core layer CRL (about 0.4 mm) is about 0.5 mm, and the through-hole diameter is 150 μm. Degree.

  The present embodiment is characterized by the formation positions of the through holes TH1, TH2, and TH3 formed in the through-hole wiring board THWB and the formation positions of the terminals TE1 and TE2 formed on the surface of the through-electrode THWB. The configuration will also be described. First, in FIG. 6, the semiconductor chip CHP2 is mounted on the through-hole wiring board THWB and is divided into the following areas. That is, as shown in FIG. 6, an area outside the semiconductor chip CHP2 is defined as an area AR0 in the area on the through wiring board THWB. Then, the region on the semiconductor chip CHP2 is divided into a region AR1 of the semiconductor chip CHP2, a region AR2 of the semiconductor chip CHP2, and a region AR3 of the semiconductor chip CHP2 corresponding to the region section shown in FIG. In this way, the surface area of the through wiring board THWB can be divided into the four areas described above.

  Here, the area AR0 will be described. In the through-hole wiring board THWB, a plurality of through holes TH2 are formed in the area AR0. That is, while the plurality of through holes TH2 are formed in the area AR0 in the surface area of the through wiring board THWB, the terminals TE1 and the terminals TE2 are not formed. In particular, the through hole TH2 is electrically connected to the terminal TE1, but the terminal TE1 is not formed in the region AR0 where the through hole TH2 is formed.

  Next, the area AR1 will be described. In the through-hole wiring board THWB, a plurality of terminals TE1 are formed in the area AR1. That is, while the plurality of terminals TE1 are formed in the area AR1 in the surface area of the through wiring board THWB, the through holes TH1, TH2, and TH3 are not formed. In particular, some terminals TE1 of the plurality of terminals TE1 are electrically connected to the through hole TH1, and some other terminals TE1 of the plurality of terminals TE1 are electrically connected to the through hole TH2. However, the through hole TH1 and the through hole TH2 are not formed in the region AR1 where the terminal TE1 is formed. A plurality of columnar bump electrodes PLBMP1 are formed in the region AR1 in the semiconductor chip CHP2, and the columnar bump electrodes PLBMP1 formed in the region AR1 of the semiconductor chip CHP2 are formed in the region AR1 of the through-hole wiring board THWB. Directly connected to the terminal TE1.

  Next, the area AR2 will be described. In the through-hole wiring board THWB, a plurality of through-holes TH1 are formed in the area AR2. That is, while the plurality of through holes TH1 are formed in the area AR2 in the surface area of the through wiring board THWB, the terminals TE1 and TE2 are not formed. In particular, the through hole TH1 is electrically connected to the terminal TE1, but the terminal TE1 is not formed in the region AR2 where the through hole TH1 is formed. Note that a plurality of columnar bump electrodes PLBMP1 and columnar bump electrodes PLBMP2 are not formed in the region AR2 of the semiconductor chip CHP2.

  Further, the area AR3 will be described. In the through-hole wiring board THWB, a plurality of through holes TH3 and a plurality of terminals TE2 are formed in the region AR3. That is, a plurality of through holes TH3 and a plurality of terminals TE2 are formed in the same region in the region AR3 in the surface region of the through wiring board THWB. In particular, the through hole TH3 is electrically connected to the terminal TE2, and this terminal TE2 is also formed in the region AR3 where the through hole TH3 is formed. A plurality of columnar bump electrodes PLBMP2 are formed in the region AR3 of the semiconductor chip CHP2, and the columnar bump electrodes PLBMP2 formed in the region AR3 of the semiconductor chip CHP2 are formed in the region AR3 of the through-hole wiring board THWB. Directly connected to the terminal TE2.

  The through-hole wiring board THWB in the present embodiment is configured as described above, and further, will be described using a plan view so that the positional relationship between the through holes TH1, TH2, and TH3 and the terminals TE1 and TE2 becomes clear. FIG. 7 is a plan view showing a partial configuration of the through wiring board THWB in the present embodiment. In FIG. 7, a quarter of the entire region of the through-hole wiring board THWB is shown. In FIG. 7, an area AR0, an area AR1, an area AR2, and an area AR3 are illustrated.

  Here, from FIG. 6 and FIG. 7, the area AR0 is an area located outside the outer periphery of the semiconductor chip CHP2 in plan view. In other words, the area AR0 can be said to be an area that does not overlap with the semiconductor chip CHP in plan view. Furthermore, the region AR1, the region AR2, and the region AR3 are regions located inside the outer periphery of the semiconductor chip CHP2 in plan view. In other words, it can be said that the region AR1, the region AR2, and the region AR3 are regions that overlap with the semiconductor chip CHP in plan view.

  In FIG. 7, a plurality of terminals TE1 are formed in the area AR1. Specifically, in the area AR1, a plurality of terminals TE1 are formed over two columns. For example, the number of terminals TE1 arranged in a row close to the outside is the number of terminals TE1 arranged in a row close to the inside. More than the number of. The terminals TE1 arranged in a row close to the outside are electrically connected to the through holes TH2 formed in the area AR0. Specifically, a plurality of through holes TH2 are formed in the area AR0, and lands LND2 are formed so as to be in contact with these through holes TH2. The land LND2 is connected to the terminal TE1 arranged in a column near the outside by a wiring WIRE2.

  On the other hand, the terminal TE1 arranged in a row close to the inside is electrically connected to the through hole TH1 formed in the region AR2. Specifically, a plurality of through holes TH1 are formed in the area AR2, and lands LND1 are formed so as to be in contact with these through holes TH1. The land LND1 is connected to a terminal TE1 arranged in a row close to the inner side by a wiring WIRE1.

  Subsequently, a plurality of through holes TH3 and a plurality of terminals TE2 are formed in the region AR3. The terminal TE2 formed in the region AR3 is electrically connected to the through hole TH3 also formed in the region AR3. Specifically, a plurality of through holes TH3 are formed in the area AR3, and lands LND3 are formed so as to be in contact with these through holes TH3. The land LND3 and the terminal TE2 are connected by a wiring WIRE3. That is, the terminal TE1 and the terminal TE2 are arranged apart from each other with the area AR2 interposed therebetween.

<Characteristics of Semiconductor Device in this Embodiment>
The semiconductor device in the present embodiment is configured as described above, and the characteristic points thereof will be described in detail below. First, the first feature point in the present embodiment is that, as shown in FIG. 6, for example, a through-hole wiring board THWB is adopted as a wiring board on which the semiconductor chip CHP2 is mounted. That is, in this embodiment, the through-hole wiring board THWB as shown in FIG. 6 is used without using the build-up board BPWB as shown in FIG.

  For example, in the build-up substrate BPWB as shown in FIG. 3, the core layer CRL includes a glass cloth, and the core layer CPL is different from the build-up layer BPL1 (BPL2) containing a glass filler instead of the glass cloth. There is a difference in coefficient of thermal expansion (α) between the CRL and the buildup layer BPL1 (BPL2). When the semiconductor chip CHP1 is heated and a thermal load is applied to the buildup substrate BPWB, the buildup layer BPL1 (BPL2) is formed due to the difference in thermal expansion coefficient between the core layer CRL and the buildup layer BPL1 (BPL2). Thermal stress is applied to the fine via VA, and the fine via VA is easily cut electrically. As a result, the reliability of the semiconductor device is reduced.

  On the other hand, in the present embodiment, the through-hole wiring board THWB is used instead of the build-up board BPWB. For example, as illustrated in FIG. 6, the through wiring board THWB includes only a core layer CRL including a glass cloth, and no buildup layer BPL1 (BLP2) is provided. For this reason, in the through-hole wiring board THWB, due to the difference in thermal expansion coefficient between the core layer CRL and the build-up layer BPL1 (BPL2), it means that the fine vias formed in the build-up layer BPL1 (BPL2) are electrically cut. Does not occur. That is, in the through-hole wiring board THWB, since the buildup layer BPL1 (BPL2) does not exist in the first place, there is no fine via formed in the buildup layer BPL1 (BPL2). The problem can be avoided. As described above, in the present embodiment, by using the through-hole wiring board THWB including only the core layer CRL, it is not necessary to consider the difference in thermal expansion coefficient between the buildup layer BPL1 (BPL2) and the core layer CRL. Since there is no buildup layer BPL1 (BPL2), there is no need to consider the electrical cutting of fine vias VA formed in the buildup layer BPL1 (BPL2). As a result, according to the present embodiment, the reliability of the semiconductor device can be improved.

  Further, since the build-up layer BPL1 (BPL2) having a large thermal expansion coefficient is formed on the build-up substrate BPWB, a sealing resin (underfill UF) that seals the gap between the build-up substrate BPWB and the semiconductor chip CHP1. In addition, large thermal stress is easily applied, and the potential for cracking in the sealing resin is increased. In contrast, in the present embodiment, the build-up layer BPL1 (BPL2) having a large thermal expansion coefficient is not formed, and the through-hole wiring board THWB including only the core layer CRL having a small thermal expansion coefficient is used. . For this reason, the sealing resin (underfill UF) that seals the gap between the through-hole wiring board THWB and the semiconductor chip CHP2 is less likely to be subjected to thermal stress as much as when the build-up board BPWB is used. The potential for generating cracks can also be lowered. Therefore, also from this point, according to the present embodiment, the reliability of the semiconductor device can be improved.

  As described above, the advantages of using the through-hole wiring board THWB have been described. However, the through-hole wiring board THWB has disadvantages in addition to the above-mentioned advantages. Hereinafter, this disadvantage will also be described, and in the present embodiment, it will be described that a device for overcoming the disadvantage of the through-hole wiring board THWB is provided. First, in the build-up substrate BPWB, for example, as shown in FIG. 3, since the inside of the fine via VA is buried with the conductor film, the terminal TE can be formed also on the fine via VA. Therefore, in the build-up substrate BPWB, for example, since there are few restrictions when forming the wiring so that the terminal TE can be arranged on the fine via VA, it is easy to form a fine pitch wiring.

  On the other hand, the through-hole wiring board THWB is composed of only the core layer CRL as shown in FIG. 6, for example, and through holes TH1, TH2, and TH3 penetrating through the core layer CRL are formed. In other words, in the through-hole wiring board THWB in the present embodiment, through holes TH1, TH2, TH3 penetrating from the front surface to the back surface are formed. The terminals TE1 and TE2 are arranged on the through holes TH1, TH2, TH3. There is a restriction that it cannot be done. The reason for this will be described. The diameters of the through holes TH1, TH2, and TH3 formed in the through-hole wiring board THWB are, for example, about 150 μm, and are larger than the diameter of a fine via (about 50 μm). Therefore, even if a plating film (conductor film) is formed in the through holes TH1, TH2, TH3, the plating film is formed only on the inner wall, and the inside of the through holes TH1, TH2, TH3 is not filled with the plating film. It becomes a hollow state.

  Of the through holes TH1, TH2, and TH3 configured in this manner, the through hole TH1 is taken as an example and the case where the terminal TE1 is disposed on the through hole TH1 is considered. FIG. 8 is a diagram showing a configuration example in which the terminal TE1 is arranged on the through hole TH1. As shown in FIG. 8, a land LND1 is formed so as to surround the upper surface of the hollow through hole TH1. The diameter of the land LND1 is about 250 μm. That is, since the through hole TH1 is hollow, by forming the land LND1 so as to surround the upper surface of the through hole TH1, the plating film formed on the side surface of the through hole TH1 and the land LND1 are electrically connected. Connected to. It is considered that the terminal TE1 can be disposed on the through hole TH1 via the land LND1 by forming the terminal TE1 on the land LND1.

  However, in actuality, as shown in FIG. 9, since the patterning accuracy in forming the through hole TH1 and the land LND1 is not high, the position of the land LND1 and the position of the through hole TH1 may be shifted. In this case, the terminal TE1 is not disposed on the land LND1, but is disposed on the hollow through hole TH1. Then, since the inside of the through hole TH1 is in a hollow state, the terminal TE1 and the through hole TH1 are not electrically connected. Thus, since the through hole TH1 formed in the through-hole wiring board THWB has a large diameter, the inside is hollow, and the positional relationship between the through hole TH1 and the land LND1 is shifted due to the problem of patterning accuracy. Due to both, if the terminal TE1 is arranged on the through hole TH1, a connection failure between the through hole TH1 and the terminal TE1 is likely to occur.

  Here, like the through hole TH formed in the build-up substrate BPWB shown in FIG. 3, it is conceivable to fill the filling resin inside the through hole TH. That is, in the build-up board BPWB, the hole filling resin is embedded in the through hole TH having a large diameter. Then, a lid plating film is formed on the through hole TH whose inside is filled with a hole filling resin, and vias VA and wirings are formed on the lid plating film. As described above, in the build-up substrate BPWB, the via VA and the wiring can be arranged also on the through-hole TH having a large diameter, so that the restrictions when forming the wiring can be reduced.

  However, the through-hole wiring board THWB (see FIG. 6) in the present embodiment does not have a structure in which a filling resin is embedded in the through-hole TH having a large diameter unlike the build-up board BPWB shown in FIG. . This is because, when a resin for filling holes is used, the cost becomes high due to the necessity of a new resin for filling holes and the trouble of filling the resin for filling holes into the through holes TH. Therefore, the through-hole wiring board THWB has a structure in which the inside of the through holes TH1, TH2, and TH3 is filled with the solder resist SR applied to the front and back surfaces of the board. In other words, the solder resist SR (first solder resist) applied to the surface of the through wiring board THWB and the solder resist SR (second solder resist) applied to the back surface of the through wiring board THWB are defined as through holes (TH1). , TH2, TH3) are connected via a solder resist SR filled therein. The solder resist SR (first solder resist) applied to the surface of the through wiring board THWB, the solder resist SR (second solder resist) applied to the back surface of the through wiring board THWB, and the through holes (TH1, TH2, TH3). The solder resists SR filled inside are all the same material. This is one of several points where the structure of the through-hole wiring board THWB is different from the structure of the build-up board BPWB.

  Also in the through-hole wiring board THWB in the present embodiment, by adopting a configuration in which a resin for filling a hole is filled in the through hole TH1 to form a lid plating film, the through hole TH1 can be reliably formed even if the terminal TE1 is formed on the through hole TH1. And the terminal TE1 can be electrically connected. However, such a configuration increases the cost of the through-hole wiring board THWB, and thus the through-hole wiring board THWB in the present embodiment does not take the above-described configuration. Therefore, in the through-hole wiring board THWB in the present embodiment, the problem that the terminal TE1 cannot be arranged on the through hole TH1 becomes obvious. Therefore, in the present embodiment, while assuming the restriction that the terminal TE1 cannot be disposed on the through hole TH1, a device is devised that performs the wiring layout on the through wiring board THWB as efficiently as possible and suppresses the cost increase. Has been given. This ingenuity is the second feature point in the present embodiment. Hereinafter, the second feature point will be described with reference to the drawings.

  First, as shown in FIG. 6, for example, the second feature point in the present embodiment is that the formation region of the through hole TH1, the formation region of the through hole TH2, and the formation region of the terminal TE1 are separated separately. The point is to devise the wiring layout. Specifically, as shown in FIG. 6, a plurality of through holes TH2 are provided in the area AR0 of the through wiring board THWB, and a plurality of terminals TE1 are provided in the area AR1 of the through wiring board THWB. A plurality of through holes TH1 are provided in the area AR2 of the through wiring board THWB. With this configuration, the through holes TH1, TH2 and the terminal TE1 can be formed in the through-hole wiring board THWB without arranging the terminals TE1 on the through hole TH1 and the through hole TH2.

  Further, a devised wiring layout configuration will be described with reference to FIG. In FIG. 7, terminals TE1 are formed in two rows in the area AR1 of the through wiring board THWB. A plurality of through holes TH2 are arranged in a region AR0 that is an outer region of the region AR1. On the other hand, a plurality of through holes TH1 are arranged in an area AR2 that is an inner area of the area AR1. At this time, of the terminals TE1 formed in two rows in the area AR1, the terminals TE1 arranged in a row near the outside are electrically connected to the through holes TH2 arranged in the region AR0. On the other hand, among the terminals TE1 formed in the region AR1 over two rows, the terminals TE1 arranged in the rows closer to the inside are electrically connected to the through holes TH1 arranged in the region AR2. Thus, in the present embodiment, the terminal TE1 that is electrically connected to the through hole TH2 formed in the region AR0 is disposed on the side close to the region AR0, and the through hole formed in the region AR2 is provided. A terminal TE1 electrically connected to TH1 is arranged on the side close to the area AR2. With this configuration, the through hole TH1 and the terminal TE1 can be efficiently connected to each other while the through hole TH1 formation region, the through hole TH2 formation region, and the terminal TE1 formation region are separated separately. Connection between the hole TH2 and the terminal TE2 can be realized.

  For example, the through hole TH2 formed in the region AR0 and the terminal TE1 arranged in a row close to the region AR2 are connected, or the through hole TH1 formed in the region AR2; In the case where the terminal TE1 arranged in a column close to the area AR0 is connected, the routing of the wiring formed in the area AR1 is complicated, and it is difficult to configure an efficient wiring layout. become.

  On the other hand, in the present embodiment, as shown in FIG. 7, the terminal TE1 that is electrically connected to the through hole TH2 formed in the region AR0 is disposed on the side close to the region AR0, and the region AR2 The terminal TE1 that is electrically connected to the through hole TH1 formed in is disposed on the side close to the area AR2.

In other words, in the region AR1, the terminal TE1 electrically connected to the through hole TH2 is arranged closer to the region AR0 than the region AR2, and the terminal TE1 electrically connected to the through hole TH1 is The terminal TE1 is electrically connected to the through holes TH1 and TH2 and the wirings WIRE1 and WIRE2, respectively, closer to the area AR2 than to the area AR0. That is, there is no wiring that connects the area AR0 and the area AR2 across the area AR1 or wiring that passes between the terminals TE1.
By connecting in this way, according to the present embodiment, wiring routing in the area AR1 becomes unnecessary, and the formation area of the through hole TH1, the formation area of the through hole TH2, and the formation area of the terminal TE1 are separated. While being separated, the through hole TH1 and the terminal TE1 can be efficiently connected, and the through hole TH2 and the terminal TE2 can be efficiently connected. The through-hole wiring board THWB has a structure in which only one wiring layer is provided on the front and back surfaces of the core layer CRL. A plurality of buildup layers (a plurality of BPL1 layers, BPL2 are formed on the front and back surfaces of the core layer CRL of the buildup substrate BPWB). Therefore, it is impossible to increase the density of the wiring compared to a structure in which a plurality of wiring layers can be formed. Therefore, the characteristic of the wiring routing described above is important in realizing the high density of wiring in the through-hole wiring board THWB, which is the same as that of the build-up board BPWB.

  Further, in the present embodiment, as shown in FIG. 7, the through hole TH1 is divided into an area AR0 which is an outer area of the area A1 where the terminal TE1 is formed and an area AR2 which is an inner area of the area A1. Another characteristic is that the through hole TH2 is formed. For example, consider that the through hole TH2 is formed only in the region AR0 that is the outer region of the region AR1 where the terminal TE1 is formed. In this case, since the through hole TH2 is formed only in the region AR0, the number of through holes TH2 formed in the region AR0 increases. Therefore, the number of wirings that electrically connect each of the plurality of through holes TH2 formed in the region AR0 and each of the plurality of terminals TE1 formed in the region AR1 increases. As a result, a fine pitch of wiring laid from the area AR0 to the area AR1 is required.

  However, in the present embodiment, not the build-up board suitable for fine pitch but the through-hole wiring board THWB which is more difficult to make fine pitch than the build-up board is used. For this reason, as described above, it can be understood that the layout configuration in which the through hole TH2 is solidly arranged only in the area AR0 is difficult to realize in the through wiring board THWB.

  Therefore, in the present embodiment, the through hole TH2 is not disposed only in the region AR0, but is divided into the region AR0 and the region AR2 sandwiching the region AR1 where the terminal TE1 is formed, and the through hole TH1 and the through hole TH2 are divided. The device has been devised to arrange. As a result, the through hole TH1 and the through hole TH2 are distributed and arranged in the area AR0 and the area AR2, so that the wiring WIRE1 that connects the through hole TH1 and the terminal TE1, and the through hole TH2 and the terminal TE1 are connected. The wirings WIRE2 to be connected can be distributed in different regions without being densely packed. As a result, even when the through-hole wiring board THWB, which is difficult to achieve a fine pitch, is used, it is possible to cope with an increase in the number of through-holes TH1 (TH2) and the number of terminals TE1 due to the higher functionality of the semiconductor device. Also from this point of view, according to the present embodiment, it can be seen that an efficient wiring layout is realized.

  Here, as shown in FIG. 7, since the area of the region AR0 is larger than the area of the region AR2, the number of through holes TH2 formed in the region AR0 is the number of through holes TH1 formed in the region AR2. It is more than Therefore, the number of terminals TE1 electrically connected to the through hole TH2 formed in the region AR0 is also larger than the number of terminals TE1 electrically connected to the through hole TH1 formed in the region AR2. ing. From this, among the terminals TE1 formed in the area AR1 over two rows, the number of terminals TE1 arranged on the side close to the area AR0 is larger than the number of terminals TE1 arranged on the side close to the area AR2. It can be said that it is also increasing. For example, a power supply line for supplying a power supply potential or a reference potential (GND potential) is supplied to the wiring connecting the through hole TH2 formed in the region AR0 and the terminal TE1 formed in the region AR1. Or a signal line for transmitting a signal (signal voltage). Similarly, for example, a power supply line for supplying a power supply potential or a reference potential (GND potential) is also applied to the wiring connecting the through hole TH1 formed in the region AR2 and the terminal TE1 formed in the region AR1. A GND line to be supplied or a signal line for transmitting a signal (signal voltage) is included.

  Subsequently, as shown in FIG. 6, the third feature point in the present embodiment is that a plurality of through holes TH3 and a plurality of terminals TE2 are formed in the area AR3. That is, as described in the second feature point, the basic technical idea of the present embodiment is that the through hole TH1, the through hole TH2, and the terminal TE1 are separated separately. However, the through hole TH1 and the terminal TE1 may be efficiently connected, and the through hole TH2 and the terminal TE2 may be efficiently connected. However, in the present embodiment, as a further third feature point, there is a feature that a plurality of through holes TH3 and a plurality of terminals TE2 are formed in the area AR3.

  Specifically, as shown in FIG. 7, a plurality of through holes TH3 and a plurality of terminals TE2 are formed in the area AR3, but the terminals TE2 are not arranged on the through holes TH3. That is, as shown in FIG. 7, the land LND3 is formed so as to surround the through hole TH3, but the terminal TE2 is not disposed on the land LND3, and the land LND3 and the terminal TE2 are connected to the wiring WIRE3. Connected by. The wiring WIRE3 connecting the through hole TH3 and the terminal TE2 formed in the region AR3 is composed of, for example, only a power supply line for supplying a power supply potential and a GND line for supplying a reference potential (GND potential). . That is, the wiring WIRE3 connecting the through hole TH3 and the terminal TE2 formed in the area AR3 does not include a signal line for transmitting a signal (signal voltage).

  Thereby, according to the present embodiment, not only the power supply potential and the reference potential are supplied to the semiconductor chip CHP2 from a part of the terminal TE1 formed in the region AR1, but also from the terminal TE2 formed in the region AR3. Also, the power supply potential and the reference potential can be supplied to the semiconductor chip CHP2. That is, since the power supply potential and the reference potential can be supplied not only from the area AR1 of the semiconductor chip CHP2 but also from the area AR3, the power drop (IR drop) in the semiconductor chip CHP2 can be reduced.

  For example, when the through hole TH3 and the terminal TE2 constituting the power supply wiring and the reference wiring are not formed in the area AR3, the power supply potential and the reference potential are supplied to the inside of the semiconductor chip CHP2 only from the terminal TE1 formed in the area AR1. Can not do. In this case, in order to supply the power supply potential and the reference potential to the integrated circuit formed in the region AR3 of the semiconductor chip CHP2, it is necessary to route the internal wiring of the semiconductor chip CHP2 from the region AR1 of the semiconductor chip CHP2 to the region AR3. At this time, the resistance component due to the routing of the internal wiring causes a drop in the power supply potential (power supply drop).

  On the other hand, in the present embodiment, the through hole TH3 and the terminal TE2 constituting the power supply wiring and the reference wiring are formed in the area AR3 of the through wiring board THWB, and the power supply potential and the reference are supplied from the terminal TE2 to the area AR3 of the semiconductor chip CHP2. Electric potential is supplied. For this reason, according to the present embodiment, not only the power supply potential and the reference potential are supplied to the semiconductor chip CHP2 from a part of the terminal TE1 formed in the region AR1, but also from the terminal TE2 formed in the region AR3. Also, the power supply potential and the reference potential can be supplied to the semiconductor chip CHP2. That is, since the power supply potential and the reference potential can be supplied not only from the area AR1 of the semiconductor chip CHP2 but also from the area AR3, the power drop (IR drop) in the semiconductor chip CHP2 can be reduced.

  Note that the power supply potential and the reference potential supplied from some of the plurality of terminals TE1 formed in the region AR1 can be supplied to an I / O circuit (external interface circuit) formed in the semiconductor chip CHP2. On the other hand, the power supply potential and the reference potential supplied from a part of the plurality of terminals TE2 formed in the region AR3 can be supplied to the core circuit (internal circuit) formed in the semiconductor chip CHP2. That is, the power supply potential and the reference potential are supplied to the I / O circuit from the plurality of terminals TE1 formed in the region AR1, and the terminal TE2 formed in the region AR3 is more than the I / O circuit. It is desirable to supply a power supply potential and a reference potential to a core circuit driven at a low voltage. In other words, the power supply potential supplied from the plurality of terminals TE1 formed in the region AR1 is higher than the power supply potential supplied from the plurality of terminals TE2 formed in the region AR3.

  By configuring in this way, for example, the columnar bump electrode PLBMP1 of the semiconductor chip CHP2 to which the terminal TE1 is connected is a bump electrode including input / output signal pins. Therefore, the power supply potential for the I / O circuit and the reference are connected to the terminal TE1. By supplying the potential, the power supply potential and the reference potential can be efficiently supplied for the I / O circuit in the shortest distance. On the other hand, the columnar bump electrode PLBMP2 of the semiconductor chip CHP2 to which the terminal TE2 is connected is a bump electrode that does not include an input / output signal pin, and therefore a core that drives an internal circuit (core circuit) disposed in the center of the semiconductor chip CHP2. By supplying the power supply potential and the reference potential for the circuit, the power supply potential and the reference potential can be efficiently supplied for the core circuit in the shortest distance.

  Furthermore, in the present embodiment, the through hole TH3 disposed in the region AR3 of the through wiring board THWB has the through hole TH3 for supplying the power supply potential and the through hole TH3 for supplying the reference potential alternately disposed. Is desirable. In this case, the power supply potential and the reference potential can be supplied uniformly over the entire area AR3 of the semiconductor chip CHP2. Specifically, an internal circuit (core circuit) is formed in the area AR3 that is the central portion of the semiconductor chip CHP2, but the through hole TH3 that supplies the power supply potential and the through hole TH3 that supplies the reference potential are alternately arranged. By disposing the power supply potential, the power supply potential and the reference potential can be evenly supplied to the core circuit. That is, for example, when the through hole TH3 for supplying the power supply potential and the through hole TH3 for supplying the reference potential are arranged in a biased manner, the power supply potential and the reference potential are evenly supplied to the core circuit formed in the region AR3. However, by alternately arranging the through-hole TH3 for supplying the power supply potential and the through-hole TH3 for supplying the reference potential, the power supply potential and the reference potential can be evenly supplied to the core circuit. The operational stability of the core circuit can be improved.

  From the above, the through wiring board THWB in the present embodiment has the above-described second characteristic point and third characteristic point, and as shown in FIG. 6, the terminal TE1 is provided in the region AR1 of the through wiring board THWB. And the terminal TE2 is formed in the region AR3 of the through wiring board THWB. That is, in the present embodiment, since the terminals (terminals TE1 and TE2) do not exist in all of the regions AR1, AR2 and AR3 of the through wiring board THWB on which the semiconductor chip CHP2 is mounted, the terminals are mounted on the through wiring board THWB. The arrangement position of the bump electrode formed on the semiconductor chip CHP2 to be formed is also changed. Specifically, as shown in FIG. 1, the bump electrode BMP is formed on the entire surface of the rectangular semiconductor chip CHP1, so that the region of the rectangular semiconductor chip CHP2 as shown in FIG. The configuration is changed so that the columnar bump electrodes PLBMP1 (PLBMP2) are formed only in the AR1 and the area AR3.

  Hereinafter, features of the semiconductor chip CHP2 mounted on the through wiring board THWB in the present embodiment will be described. The fourth feature point in the present embodiment is the bump structure of the semiconductor chip CHP2 mounted on the through wiring board THWB. Specifically, as shown in FIG. 4, the semiconductor chip CHP2 in the present embodiment has an area AR1, an area AR2 inside the area AR1, and an area AR3 inside the area AR2. ing. The columnar bump electrode PLBMP1 is formed in the region AR1, and the columnar bump electrode PLBMP2 is formed in the region AR3, while the columnar bump electrode PLBMP1 and the columnar bump electrode PLBMP2 are not formed in the region AR2.

  FIG. 6 shows a state in which the semiconductor chip CHP2 thus configured is mounted on the through wiring board THWB. As shown in FIG. 6, the columnar bump electrode PLBMP1 formed in the region AR1 of the semiconductor chip CHP2 is directly connected to the terminal TE1 formed in the region AR1 of the through-hole wiring board THWB and formed in the region AR3 of the semiconductor chip CHP2. It can be seen that the columnar bump electrode PLBMP2 formed is directly connected to the terminal TE2 formed in the region AR3 of the through wiring board THWB. That is, the portion where the columnar bump electrode PLBMP1 and the terminal TE1 are connected and the portion where the columnar bump electrode PLBMP2 and the terminal TE2 are connected are separated from each other across the region AR2 of the semiconductor chip CHP2 (through-hole substrate THWB). Has been placed.

  Here, a problem when the bump structure of the semiconductor chip CHP1 shown in FIG. 1 is changed to the bump structure of the semiconductor chip CHP2 shown in FIG. 4 will be described. For example, the bump structure of the semiconductor chip CHP1 shown in FIG. 1 is changed to the bump structure of the semiconductor chip CHP2 shown in FIG. 4 without changing the number of bump electrodes formed on the semiconductor chip CHP1 shown in FIG. Think. In this case, in the semiconductor chip CHP1 shown in FIG. 1, the bump electrode BMP is arranged over the entire surface area, whereas in the semiconductor chip CHP2 shown in FIG. 4, a part of the surface area (area AR1 and area AR3) is formed. Only bump electrodes will be arranged. This means that the area for arranging the bump electrodes in the semiconductor chip CHP2 shown in FIG. 4 is smaller than the area for arranging the bump electrodes BMP in the semiconductor chip CHP1 shown in FIG. Therefore, when the number of bump electrodes of the semiconductor chip CHP1 shown in FIG. 1 is the same as the number of bump electrodes of the semiconductor chip CHP2 shown in FIG. 4, the size of the bump electrode BMP of the semiconductor chip CHP1 shown in FIG. It is necessary to reduce the size of the bump electrode of the semiconductor chip CHP2 shown in FIG.

  The bump electrode BMP formed on the semiconductor chip CHP1 shown in FIG. 1 is a hemispherical bump electrode BMP made of, for example, solder. First, consider reducing the size of the bump electrode BMP.

  FIG. 10 is a cross-sectional view showing a state in which the size of the hemispherical bump electrode BMP made of solder is reduced and the bump electrode BMP is mounted on the through wiring board THWB. As shown in FIG. 10, the terminal TE1 is formed on the through wiring board THWB, and the bump electrode BMP is mounted on the terminal TE1. The bump electrode BMP is formed in an opening OP formed in a passivation film (surface protective film) PAS made of, for example, a silicon nitride film, and the bump electrode BMP is formed on the pad PD exposed from the opening OP. Has been. The pad PD is formed on the interlayer insulating film IL.

  At this time, if the size of the hemispherical bump electrode BMP is reduced, the gap (standoff) A1 between the semiconductor chip and the through-hole wiring board THWB is also reduced. As described above, when the gap (standoff) A1 between the semiconductor chip and the through-hole wiring board THWB is narrowed, the filling property of the underfill filled in the gap is lowered, and voids (bubbles) may be generated in the underfill. is there. When a void is generated in the underfill, moisture enters the void, and the moisture in the void expands due to high-temperature reflow (for example, about 240 to 260 ° C.) during solder mounting on the mounting substrate, and the underfill starts from the void. Cracks may occur inside. Further, when a void is adjacent to the bump electrode, moisture penetrates into the void, so that the connection portion between the bump electrode BMP and the terminal TE1 is corroded, and the connection reliability between the semiconductor chip and the through wiring board THWB is lowered. There is a fear. That is, when the hemispherical bump electrode BMP formed on the semiconductor chip CHP1 shown in FIG. 1 is simply reduced, the gap (standoff) A1 between the semiconductor chip and the through-hole wiring board THWB is reduced. The reliability of the semiconductor device is reduced.

  As a result of investigation by the present inventor, in order to ensure the filling property of the underfill, the gap (standoff) A1 between the semiconductor chip and the through-hole wiring board THWB needs to be about 20 μm or more. Therefore, in the present embodiment, the columnar bump electrode PLBMP1 as shown in FIG. 11 is adopted instead of the hemispherical bump electrode BMP as shown in FIG. FIG. 11 is a partial cross-sectional view showing a state in which the columnar bump electrode PLBMP1 is mounted on the through wiring board THWB. As shown in FIG. 11, a terminal TE1 is formed on the through-hole wiring board THWB, and a columnar bump electrode PLBMP1 is mounted on the terminal TE1. The columnar bump electrode BMP includes, for example, a columnar portion made of copper (Cu) and a connection portion made of solder formed on the columnar portion. In other words, it can be said that the columnar bump electrode PLBMP1 includes a first portion made of solder and a second portion (copper) having a melting point higher than that of the first portion (solder). The columnar bump electrode PLBMP1 is formed, for example, in an opening OP formed in a passivation film (surface protective film) PAS made of a silicon nitride film, and the columnar bump electrode PLBMP1 is formed on the pad PD exposed from the opening OP. Is formed. The pad PD is formed on the interlayer insulating film IL.

  In the columnar bump electrode PLBMP1 configured in this way, even if the size of the columnar bump electrode PLBMP1 is reduced, a gap (standoff) A2 between the semiconductor chip and the through-hole wiring board THWB is formed by the columnar portion made of copper. The gap (standoff) A1 when connected by the hemispherical bump electrode BMP shown in FIG. 10 does not become smaller (A2> A1). That is, the columnar bump electrode BMP is composed of a first portion made of solder and a second portion (copper) having a melting point higher than that of the first portion (solder). For this reason, the semiconductor chip is mounted on the through-hole wiring board THWB, the columnar bump electrode PLBMP1 of the semiconductor chip and the terminal TE1 on the through-hole wiring board THWB, and the first portion (solder) of the columnar bump electrode PLBMP1 are heated to a high temperature (eg, 240 to 260 ° C. The melting point of the second part (copper) of the bump electrode PLBMP1 is higher than the melting point of the first part (solder), so that it does not melt when the temperature is raised. Therefore, the gap (standoff) A2 between the semiconductor chip and the through-hole wiring board THWB does not become smaller than the height of the second portion (copper) of the columnar bump electrode PLBMP1. As described above, the gap (standoff) A2 between the semiconductor chip and the through-hole wiring board THWB is required to be about 20 μm or more in order to ensure the filling property of the underfill, but the second portion of the columnar bump electrode PLBMP1. Since the height of (copper) is about 30 μm, it is sufficiently satisfied.

  As a result, when the columnar bump electrode PLBMP1 as shown in FIG. 11 is used, the standoff can be ensured even if the size of the columnar bump electrode PLBMP1 itself is reduced. And the connection reliability between the through-hole wiring board THWB can be suppressed. Therefore, in the semiconductor chip CHP2 in the present embodiment, for example, as shown in FIGS. 5 and 6, the columnar bump electrode PLBMP1 and the columnar bump electrode PLBMP2 are used.

  Here, the case where the second part of the columnar bump electrode PLBMP1 is copper has been described as an example, but there is no problem as long as it is a (metal) material having a higher melting point than the solder of the first part. The second portion may be gold (Au) or the like as a material other than copper. When the second portion is made of copper, the cost (material cost) can be suppressed compared to gold. Further, the second portion of the columnar bump electrode PLBMP1 can be easily formed high when stacked and formed by plating.

  Further, as the solder of the first portion of the columnar bump electrode PLBMP1, it is preferable to use Sn-Ag or Sn-Ag-Cu lead-free solder.

  From the above, the fourth feature point in the present embodiment is that, for example, as shown in FIG. 4, the columnar bump electrodes PLBMP1 (PLBMP2) are provided only in part of the surface region (region AR1 and region AR3) of the semiconductor chip CHP2. It can be said that it is in the point of forming. Thereby, the semiconductor chip CHP2 corresponding to the through wiring board THWB including the second feature point and the third feature point can be configured. Then, by mounting the semiconductor chip CHP2 having the fourth feature point on the through wiring board THWB having the second feature point and the third feature point, the reliability of the semiconductor device can be improved and the cost can be reduced.

  Furthermore, in the semiconductor chip CHP2 in the present embodiment, the following effects can be obtained by providing the fourth feature point described above. That is, in the semiconductor chip CHP2 in the present embodiment, for example, as shown in FIG. 4, the columnar bump electrode PLBMP1 is formed in the region AR1, and the columnar bump electrode is formed in the region AR3 sandwiching the region AR2 between the region AR1. PLBMP2 is formed. This means that the columnar bump electrode PLBMP1 formed in the region AR1 and the columnar bump electrode PLBMP2 formed in the region AR3 are separated by a space corresponding to the region AR2 formed between the region AR1 and the region AR3. It means that it is formed. Here, the columnar bump electrode PLBMP2 formed in the region AR3 is connected to a power supply line and has a function of supplying a power supply potential or a reference potential to an integrated circuit formed in the semiconductor chip CHP2. Is. On the other hand, the columnar bump electrode PLBMP1 formed in the region AR1 may be connected to the signal line in addition to the one connected to the power supply line. Accordingly, when the columnar bump electrode PLBMP1 formed in the region AR1 is disposed adjacent to the columnar bump electrode PLBMP2 formed in the region AR3, mutual interference ( (Cross coupling) is likely to occur, and noise is likely to occur in the power supply voltage and the reference voltage supplied to the columnar bump electrode PLBMP2 connected to the power supply line. On the other hand, in the semiconductor chip CHP2 in the present embodiment, there is a region AR2 where no bump electrode is formed between the region AR1 and the region AR3, and the columnar bump electrode formed in the region AR3 by this region AR2. The distance between PLBMP2 and the columnar bump electrode PLBMP1 formed in the area AR1 can be increased. This is because the semiconductor chip CHP2 in the present embodiment is connected to the power supply line connected to the columnar bump electrode PLBMP2 formed in the region AR3 and the columnar bump electrode PLBMP1 formed in the region AR1. This means that cross coupling with the signal line can be suppressed. As a result, according to the present embodiment, the stability of the power supply voltage applied to the power supply line connected to the columnar bump electrode PLBMP2 formed in the area AR3 or the reference voltage can be improved, and the semiconductor The operational reliability of the integrated circuit formed on the chip CHP2 can be improved.

  Next, the fifth feature point in the present embodiment will be described. The fifth feature point in this embodiment relates to the structure of the semiconductor chip. Specifically, the fifth feature point in this embodiment is the semiconductor chip CHP1 examined by the present inventor shown in FIG. In contrast to the so-called rewiring structure, the semiconductor chip CHP2 in the present embodiment shown in FIG. 4 does not have a rewiring structure. As a result, in the semiconductor device according to the present embodiment, it is not necessary to form a rewiring structure in the semiconductor chip, so that there is an advantage that the design of the semiconductor chip can be simplified.

  For example, in the semiconductor chip CHP1 examined by the present inventor shown in FIG. 1, it is necessary to form the bump electrode BMP over the entire surface region, so a so-called rewiring structure is required. The rewiring structure will be described below. FIG. 12 is a cross-sectional view showing the rewiring structure formed in the semiconductor chip CHP1. As shown in FIG. 12, in the semiconductor chip CHP1, a pad PD is formed on the uppermost interlayer insulating film IL, and a passivation film PAS made of, for example, a silicon nitride film is formed so as to cover the pad PD. ing. An opening is formed in the passivation film PAS, and the pad PD is exposed from the opening. Further, on the passivation film PAS, for example, a resin film PI1 made of a polyimide resin film is formed, and an opening is formed in the resin film PI1. A rewiring RW is formed so as to be electrically connected to the pad PD and to extend on the resin film PI1. Next, a resin film PI2 made of, for example, a polyimide resin film is formed so as to cover the rewiring RW, and an opening OP1 is formed in the resin film PI2. A bump electrode BMP is formed on the rewiring RW exposed from the opening OP1. As described above, the rewiring structure is formed in the semiconductor chip CHP1 examined by the present inventor shown in FIG. Thus, in the semiconductor chip CHP1 in which the rewiring structure is formed, it is necessary to design a layout of the rewiring RW that connects the pad PD and the bump electrode BMP, so that the design of the semiconductor chip CHP1 is complicated. . In addition, when the rewiring RW enters between the pad PD and the bump electrode BMP, wiring resistance and inductance are added to the transmission path, which affects high-speed operation of the semiconductor device.

  On the other hand, in the semiconductor chip CHP2 in the present embodiment shown in FIG. 4, it is not necessary to form the columnar bump electrode PLBMP1 (PLBMP2) over the entire surface of the semiconductor chip CHP2, and the columnar bump electrode PLBMP1 only in the regions AR1 and AR3. Since (PLBMP2) may be formed, there is no need to use a rewiring structure. FIG. 13 is a cross-sectional view showing a bump structure formed on the semiconductor chip CHP2. As shown in FIG. 13, in the semiconductor chip CHP2, a pad PD is formed on the uppermost interlayer insulating film IL, and a passivation film PAS made of, for example, a silicon nitride film is formed so as to cover the pad PD. ing. Further, an opening is formed in the passivation film PAS, and the pad PD is exposed from the opening. A columnar bump electrode PLBMP1 is directly formed on the pad PD. Thus, according to the semiconductor chip CHP2 in the present embodiment, it can be seen that no rewiring is formed above the pad PD. In other words, in the semiconductor chip CHP2 in the present embodiment, the rewiring is formed above the passivation film (surface protective film) PAS (or polyimide resin film when the polyimide resin film is formed on the passivation film PAS). It can be said that there is no fifth feature point in the present embodiment. As described above, according to the present embodiment, it is not necessary to form a rewiring structure in the semiconductor chip, so that there is an advantage that the design of the semiconductor chip can be simplified. Further, since the rewiring RW is not formed, the wiring resistance and inductance of the transmission path can be reduced as compared with the above-described rewiring structure, and as a result, the semiconductor device can be operated at high speed.

  Next, the sixth feature point in the present embodiment will be described. For example, as shown in FIGS. 6 and 7, in the semiconductor device according to the present embodiment, a plurality of through holes TH1 and through holes TH3 are formed in the regions AR2 and AR3 of the through wiring board THWB. This means that when the semiconductor chip CHP2 is mounted on the through-hole wiring board THWB, there are a large number of through-holes TH1 and through-holes TH3 in the area (area AR2 and area AR3) of the through-hole wiring board THWB that overlaps the semiconductor chip CHP2 in plan view. Means that. Then, since a plating film made of, for example, copper having good thermal conductivity is formed on the inner walls of the through hole TH1 and the through hole TH3, the heat generated in the semiconductor chip CHP2 is formed immediately below the semiconductor chip CHP2. It is possible to efficiently dissipate from the many through holes TH1 and through holes TH3. Therefore, according to the semiconductor device in the present embodiment, it is possible to improve the heat dissipation characteristics of the heat generated in the semiconductor chip CHP2. As a result, the heat sink HS shown in FIG. 2 may be unnecessary. If the heat sink HS is not necessary, the material cost can be reduced accordingly.

  As described above, the present embodiment includes at least the first feature point to the sixth feature point. The first feature point to the sixth feature point are summarized as follows.

  (1) The first feature of the present embodiment is that the through-hole wiring board THWB as shown in FIG. 6 is used as the wiring board on which the semiconductor chip CHP2 is mounted without using the build-up board BPWB as shown in FIG. It is in use. Thereby, in the present embodiment, by using the through wiring board THWB including only the core layer CRL, it is not necessary to consider the difference in thermal expansion coefficient between the buildup layer BPL1 (BPL2) and the core layer CRL. Since there is no buildup layer BPL1 (BPL2), there is no need to consider the electrical cutting of fine vias VA formed in the buildup layer BPL1 (BPL2). As a result, according to the present embodiment, it is possible to improve the reliability of the semiconductor device while reducing the cost.

  (2) The second feature point in the present embodiment is that, for example, as shown in FIG. 6, the formation region of the through hole TH1, the formation region of the through hole TH2, and the formation region of the terminal TE1 are separated separately. The point is to devise the wiring layout. Specifically, as shown in FIG. 6, a plurality of through holes TH2 are provided in the area AR0 of the through wiring board THWB, and a plurality of terminals TE1 are provided in the area AR1 of the through wiring board THWB. A plurality of through holes TH1 are provided in the area AR2 of the through wiring board THWB. In the present embodiment, as shown in FIG. 7, the terminal TE1 electrically connected to the through hole TH2 formed in the region AR0 is disposed on the side close to the region AR0 and is formed in the region AR2. The terminal TE1 that is electrically connected to the through hole TH1 is disposed on the side close to the area AR2. Thereby, according to the present embodiment, it is not necessary to route the wiring in the area AR1, and the formation area of the through hole TH1, the formation area of the through hole TH2, and the formation area of the terminal TE1 can be separated separately. The through hole TH1 and the terminal TE1 can be efficiently connected, and the through hole TH2 and the terminal TE2 can be efficiently connected.

  (3) A third feature point of the present embodiment is that, as shown in FIG. 6, a plurality of through holes TH3 and a plurality of terminals TE2 are formed in the area AR3, and the through holes TH3 formed in the area AR3 The wiring that connects the terminal TE2 includes, for example, only a power supply line that supplies a power supply potential and a GND line that supplies a reference potential (GND potential). Thereby, according to the present embodiment, not only the power supply potential and the reference potential are supplied to the semiconductor chip CHP2 from a part of the terminal TE1 formed in the region AR1, but also from the terminal TE2 formed in the region AR3. Also, the power supply potential and the reference potential can be supplied to the semiconductor chip CHP2. That is, since the power supply potential and the reference potential can be supplied not only from the area AR1 of the semiconductor chip CHP2 but also from the area AR3, the power drop (IR drop) in the semiconductor chip CHP2 can be reduced.

  (4) The fourth feature point in the present embodiment is that, for example, as shown in FIG. 4, the columnar bump electrodes PLBMP1 (PLBMP2) are formed only in a part of the surface region (region AR1 and region AR3) of the semiconductor chip CHP2. There is in point to do. As a result, even if the size of the columnar bump electrode PLBMP1 (PLBMP2) itself is reduced, the standoff can be obtained, so that deterioration of underfill filling and connection reliability between the semiconductor chip and the through wiring board THWB are suppressed. can do. Furthermore, it is possible to configure the semiconductor chip CHP2 corresponding to the through wiring board THWB including the second feature point and the third feature point. Furthermore, according to the fourth feature point in the present embodiment, there is an area AR2 in which no bump electrode is formed between the area AR1 and the area AR3, and the columnar bump formed in the area AR3 by this area AR2. The distance between the electrode PLBMP2 and the columnar bump electrode PLBMP1 formed in the area AR1 can be increased. As a result, according to the present embodiment, the power line connected to the columnar bump electrode PLBMP2 formed in the area AR3 and the signal line connected to the columnar bump electrode PLBMP1 formed in the area AR1. Cross coupling can be suppressed. Therefore, according to the present embodiment, the stability of the power supply voltage applied to the power supply line connected to the columnar bump electrode PLBMP2 formed in the area AR3 or the reference voltage can be improved, and the semiconductor chip The operational reliability of the integrated circuit formed in the CHP 2 can be improved.

  (5) The fifth feature point in the present embodiment is that, for example, the semiconductor chip CHP2 in the present embodiment shown in FIG. 4 does not have a rewiring structure. As a result, in the semiconductor device according to the present embodiment, it is not necessary to form a rewiring structure in the semiconductor chip, so that there is an advantage that the design of the semiconductor chip can be simplified.

  (6) The sixth feature of the present embodiment is that when the semiconductor chip CHP2 is mounted on the through-hole wiring board THWB, a large number of areas are formed in the through-hole wiring board THWB (area AR2 and area AR3) overlapping the semiconductor chip CHP2. There is a through hole TH1 and a through hole TH3. Thereby, according to the semiconductor device in this Embodiment, the heat dissipation characteristic of the heat which generate | occur | produced in semiconductor chip CHP2 can be improved.

<Method for Manufacturing Semiconductor Device in Embodiment>
The semiconductor device in the present embodiment is configured as described above, and an example of a manufacturing method thereof will be described below with reference to the drawings.

  First, as shown in FIG. 14, the through-hole wiring board THWB in the present embodiment is prepared. In the through-hole wiring board THWB, for example, terminals TE1 and TE2 and through holes TH1 and TH2 are formed in a layout configuration as shown in FIG.

  Then, as shown in FIG. 15, an underfill UF is applied to the chip mounting area on the surface of the through wiring board THWB. Note that as the underfill UF used here, a fast-curing resin NCP (Non-Conductive Paste) may be used.

  Thereafter, as shown in FIG. 16, the semiconductor chip CHP2 is mounted on the through wiring board THWB. For example, a columnar bump electrode PLBMP1 and a columnar bump electrode PLBMP2 as shown in FIG. 4 are formed on the surface (main surface) of the semiconductor chip CHP2 mounted at this time. Then, the semiconductor chip CHP2 is mounted on the through-hole wiring board THWB so that the columnar bump electrode PLBMP1 (PLBMP2) formed on the semiconductor chip CHP2 is in direct contact with a terminal (not shown) formed on the through-hole wiring board THWB. Heat to high temperature. As a result, the solder of the columnar bump electrode PLBMP1 (PLBMP2) is melted, and the terminal TE1 (TE2) on the through wiring board THWB and the copper of the columnar bump electrode PLBMP1 (PLBMP2) are electrically connected. At this time, the underfill UF is spread and filled in the gap between the semiconductor chip CHP2 and the through-hole wiring board THWB. In addition, since the fast curing resin NCP is used as the underfill UF, the underfill UF is cured. In this embodiment, since the columnar bump electrode PLBMP1 (PLBMP2) that can secure the height even when the size is reduced is used for the connection between the semiconductor chip CHP2 and the through-hole wiring board THWB, the underfill UF is wet. Spreading is not hindered.

  Subsequently, as shown in FIG. 17, the solder balls SB are mounted on the back surface (surface opposite to the chip mounting surface) of the through-hole wiring board THWB. As described above, the semiconductor device in this embodiment can be manufactured.

  Next, another method for manufacturing the semiconductor device in the present embodiment will be described. First, as shown in FIG. 18, the through-hole wiring board THWB in the present embodiment is prepared. In the through-hole wiring board THWB, for example, terminals TE1 and TE2 and through holes TH1 and TH2 are formed in a layout configuration as shown in FIG.

  Subsequently, as shown in FIG. 19, the semiconductor chip CHP2 is mounted on the through wiring board THWB. For example, a columnar bump electrode PLBMP1 and a columnar bump electrode PLBMP2 as shown in FIG. 4 are formed on the surface (main surface) of the semiconductor chip CHP2 mounted at this time. Then, the semiconductor chip CHP2 is mounted on the through wiring board THWB so that the columnar bump electrodes PLBMP1 (PLBMP2) formed on the semiconductor chip CHP2 are in direct contact with terminals (not shown) formed on the through wiring board THWB. . Thereafter, the solder is heated to a high temperature to melt the solder of the columnar bump electrode PLBMP1 (PLBMP2), and the terminal TE1 (TE2) on the through wiring board THWB and the copper of the columnar bump electrode PLBMP1 (PLBMP2) are electrically connected.

  Then, as shown in FIG. 20, the underfill UF is filled in the gap between the semiconductor chip CHP2 and the through wiring board THWB. Here, in the present embodiment, the columnar bump electrode PLBMP1 (PLBMP2) that can ensure the height even when the size is reduced is used for the connection between the semiconductor chip CHP2 and the through-hole wiring board THWB. Sex can be secured.

  After that, as shown in FIG. 21, the solder balls SB are mounted on the back surface (surface opposite to the chip mounting surface) of the through wiring board THWB. As described above, the semiconductor device in this embodiment can be manufactured.

<Modification>
Next, a modification of the present embodiment will be described. In the above embodiment, the example in which the bump electrode formed on the semiconductor chip CHP2 is configured by the columnar bump electrode PLBMP1 (PLBMP2) has been described. However, in this modification, the bump electrode formed on the semiconductor chip CHP2 is configured by the stud bump electrode. An example will be described.

  FIG. 22 is a cross-sectional view showing a state where the stud bump electrode SDBMP1 made of, for example, gold is mounted on the through wiring board THWB. As shown in FIG. 22, a terminal TE1 is formed on the through-hole wiring board THWB. A stud bump electrode SDBMP1 is mounted on the terminal TE1, and a connection portion between the terminal TE1 and the stud bump electrode SDBMP1 is covered. Solder S is formed. The stud bump electrode SDBMP1 is formed, for example, in an opening OP formed in a passivation film (surface protection film) PAS made of a silicon nitride film, and the stud bump electrode SDBMP1 is formed on the pad PD exposed from the opening OP. Is formed. The pad PD is formed on the interlayer insulating film IL.

  In the stud bump electrode SDBMP1 configured as described above, a gap (standoff) A3 (> A1) between the semiconductor chip and the through-hole wiring board THWB is ensured even if the size of the stud bump electrode SDBMP1 is reduced. Can do. That is, the stud bump electrode SDBMP1 (second portion) has a melting point higher than that of the solder S (first portion). Thus, when the stud bump electrode SDBMP1 (second portion) is electrically connected by melting the terminal TE1 on the through-hole wiring board THWB and the solder S (first portion) at a high temperature, the stud bump electrode SDBMP1 (second portion) Since the melting point is higher than the melting point of the solder S (first portion), it does not melt when the temperature is raised. Therefore, the gap (standoff) A3 between the semiconductor chip and the through-hole wiring board THWB does not become smaller than the height of the stud bump electrode SDBMP1 (second portion, gold).

  As a result, when the stud bump electrode SDBMP1 as shown in FIG. 22 is used, the stand-off can be secured even if the size of the stud bump electrode SDBMP1 itself is reduced. And the connection reliability between the through-hole wiring board THWB can be suppressed. Thus, instead of the columnar bump electrode PLBMP1 (PLBMP2) described in the above embodiment, the stud bump electrode SDBMP1 described in this modification can be used.

  Here, the case where gold is used for the stud bump electrode SDBMP1 has been described as an example. However, for example, a copper stud bump electrode formed using a copper wire may be used.

  The semiconductor device in this modification is configured as described above, and an example of a manufacturing method thereof will be described below.

  First, as shown in FIG. 23, a through-hole wiring board THWB in this modification is prepared. In the through-hole wiring board THWB, for example, terminals TE1 and TE2 and through holes TH1 and TH2 are formed in a layout configuration as shown in FIG.

  Subsequently, as shown in FIG. 24, the semiconductor chip CHP2 is mounted on the through wiring board THWB. For example, stud bump electrodes SDBMP1 and SDBMP2 are formed on the surface (main surface) of the semiconductor chip CHP2 mounted at this time. The stud bump electrodes SDBMP1 and SDBMP2 formed on the semiconductor chip CHP2 are in direct contact with terminals (not shown) formed on the through-hole wiring board THWB so as to cover the terminal TE1 and the stud bump electrodes SDBMP1 and SDBMP2. Solder S is melted to form a connection portion. In this way, the semiconductor chip CHP2 is mounted on the through wiring board THWB. Note that the solder S can be applied to the terminal TE1 in advance (solder pre-coating) to facilitate assembly.

  Then, as shown in FIG. 25, the underfill UF is filled in the gap between the semiconductor chip CHP2 and the through wiring board THWB. Here, in this modification, the stud bump electrodes SDBMP1 and SDBMP2 that can secure the height even when the size is reduced are used for the connection between the semiconductor chip CHP2 and the through-hole wiring board THWB. Can be secured.

  Thereafter, as shown in FIG. 26, the solder balls SB are mounted on the back surface (surface opposite to the chip mounting surface) of the through wiring board THWB. As described above, the semiconductor device according to this modification can be manufactured.

  Although the manufacturing method (assembly method) in which the underfill UF is filled after the semiconductor chip CHP2 is mounted on the through wiring board THWB has been described here, the present invention is not limited to this. An underfill UF (fast-curing resin NCP) may be applied in advance to the aforementioned through-hole wiring board THWB, and then assembled by a manufacturing method in which the semiconductor chip CHP2 is mounted.

<Position of the present invention>
Finally, the positioning of the present invention will be described with reference to the drawings. FIG. 27 is a graph for explaining the positioning of the present invention. In FIG. 27, the horizontal axis indicates the chip size, and the vertical axis indicates the number of pads (the number of bump electrodes) formed on the chip.

  First, the structure of the semiconductor device used in the region indicated by the region (1) will be described. The form of the semiconductor device used in the region (1) uses a build-up board as a wiring board, and hemispherical bump electrodes formed on the semiconductor chip have an area bump arrangement (for example, the arrangement shown in FIG. 1). It is a form.

  Next, the structure of the semiconductor device used in the region indicated by the region (2) will be described. The form of the semiconductor device used in the region (2) is a form in which a through substrate is used as the wiring board, and pads are formed on the peripheral edge of the semiconductor chip instead of the bump electrodes. Specifically, it refers to a wire bonding structure.

  Subsequently, the structure of the semiconductor device used in the region indicated by the region (3) will be described. The form of the semiconductor device used in the region (3) is a form in which a build-up board is used as a wiring board, a columnar bump electrode is formed on a semiconductor chip, and this columnar bump electrode is in an area bump arrangement.

  Finally, the structure of the semiconductor device used in the region indicated by the region (4) will be described. The form of the semiconductor device used in the region (4) is a form of the present invention in which a through substrate is used as a wiring board and columnar bump electrodes are formed on a semiconductor chip.

  Here, the advantage of changing from the form of the semiconductor device shown in the region (1) to the form of the semiconductor device shown in the region (4) (the form of the present invention) is that the through substrate is used without using the build-up substrate. By using it, the reliability of the semiconductor device can be improved. That is, reliability can be improved by not using fine vias and build-up layers. Furthermore, the cost of the semiconductor device can be reduced by changing from an expensive build-up substrate to an inexpensive through substrate. In particular, among the semiconductor device forms shown in the region (1), since the number of bump electrodes is relatively small, wiring layout on a build-up board increases wasteful areas on the board. In the case of a product in which wiring layout is possible even with a through-hole substrate by using the features of the invention, the utility of changing to the form of the semiconductor device shown in the region (4) (the form of the present invention) is increased.

  On the other hand, the advantage of changing from the form of the semiconductor device shown in the region (2) to the form of the semiconductor device shown in the region (4) (the form of the present invention) is not only from the peripheral portion of the semiconductor chip but also from the semiconductor chip. By supplying the power supply voltage and the reference voltage also from the central portion of the semiconductor device, the performance of the semiconductor device can be improved. That is, in the form of the semiconductor device shown in the region (2), power can be supplied to the inside of the semiconductor chip only from the pad formed on the peripheral portion of the semiconductor chip, but the form of the semiconductor device shown in the region (4). In the embodiment of the present invention, power can be supplied not only from the peripheral region of the semiconductor chip but also from the central region, so that power drop (IR drop) in the semiconductor chip can be reduced. In particular, in the case of a product having a relatively low power supply voltage among the semiconductor device forms shown in the region (2), the utility of changing to the semiconductor device form (the embodiment of the present invention) shown in the region (4). Becomes larger.

  The form of the semiconductor device shown in the region (2) is specifically a wire bonding structure. When the number of pins (the number of pads) increases, if the pads are arranged without increasing the chip size, the pads are provided near the center of the semiconductor chip. In this case, the wire length is longer than that of the wire stretched on the pad on the periphery of the semiconductor chip, and therefore, wire bonding can be performed for the reason that a wire flow easily occurs when sealing with a sealing resin. It becomes difficult. Even in such a case, it is possible to arrange the bump electrodes not only in the peripheral area of the semiconductor chip but also in the central area by using the features of the present invention described so far. As a result, the size of the semiconductor chip may be equal to or smaller than that of the wire bonding structure, so that the semiconductor device is changed to the form of the semiconductor device shown in the region (4) (the form of the present invention). Usefulness increases.

  As mentioned above, the invention made by the present inventor has been specifically described based on the embodiment. However, the present invention is not limited to the embodiment, and various modifications can be made without departing from the scope of the invention. Needless to say.

  Note that the MOSFET described above is not limited to the case where the gate insulating film is formed from an oxide film, but is assumed to include a MISFET (Metal Insulator Semiconductor Field Effect Transistor) that forms the gate insulating film widely from an insulating film. ing. That is, in this specification, the term MOSFET is used for convenience, but this MOSFET is used herein as a term intended to include a MISFET.

  Furthermore, the BGA package structure in which the solder balls SB are mounted on the back surface (the surface opposite to the chip mounting surface) of the through wiring board THWB has been described as an example. However, the LGA (Land Grid Array) in which the solder balls SB are not mounted. ) Package may be used. By not mounting the solder ball SB, the material cost can be reduced accordingly.

  The present invention can be widely used in the manufacturing industry for manufacturing semiconductor devices.

AR0 area AR1 area AR2 area AR3 area A1 gap A2 gap A3 gap A3 gap BMP bump electrode BPL1 buildup layer BPL2 buildup layer BPWB buildup substrate BTE backside terminal CHP1 semiconductor chip CHP2 semiconductor chip CRL core layer HS heat sink semiconductor layer CRL core layer HS heat sink Land LND3 Land OP Opening OP1 Opening PAS Passivation Film PD Pad PI1 Resin Film PI2 Resin Film PLBMP1 Columnar Bump Electrode PLBMP2 Columnar Bump Electrode RW Rewiring S Solder SB Solder Ball SCE Silicone Resin SDBMP1 MP Stud Bump Electrode TE terminal TE1 terminal TE2 terminal TH1 through hole TH2 through hole H3 through-hole THWB the through-hole substrate UF underfill VA via WIRE1 wiring WIRE2 wiring WIRE3 wiring

Claims (3)

A semiconductor chip having a main surface on which a plurality of pad electrodes are disposed;
A first main surface on which a plurality of terminals are arranged and the semiconductor chip is mounted; and a second main surface on a side opposite to the first main surface and on which a plurality of external terminals are arranged. A wiring board with a core layer having,
The semiconductor chip is mounted on the first main surface of the core layer such that the main surface and the first main surface of the core layer face each other.
Each of the plurality of pad electrodes of the semiconductor chip is electrically connected to each of the plurality of terminals of the core layer via a columnar bump electrode made of copper and solder,
Between the main surface of the semiconductor chip and the first main surface of the core layer is filled with a sealing resin,
The core layer includes a glass cloth, penetrates from the first main surface to the second main surface, and is electrically connected to each of the plurality of terminals and each of the plurality of external terminals. Through-holes are formed,
A semiconductor device, wherein a buildup layer is not formed between the main surface of the semiconductor chip and the first main surface of the core layer. The semiconductor device according to claim 1,
A first solder resist is formed on the first main surface of the core layer,
A plurality of openings are formed in the first solder resist, and portions of the plurality of terminals connected to the plurality of columnar bump electrodes by the solder are exposed from the plurality of openings. apparatus. The semiconductor device according to claim 2,
The inside of the plurality of through holes is filled with the first solder resist,
A semiconductor device connected to the first solder resist formed on the first main surface of the core layer.

Images