JP2015201456A - Led lighting device - Google Patents

Led lighting device Download PDF

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Publication number
JP2015201456A
JP2015201456A JP2015128306A JP2015128306A JP2015201456A JP 2015201456 A JP2015201456 A JP 2015201456A JP 2015128306 A JP2015128306 A JP 2015128306A JP 2015128306 A JP2015128306 A JP 2015128306A JP 2015201456 A JP2015201456 A JP 2015201456A
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JP
Japan
Prior art keywords
led
lighting device
substrate
light
led lighting
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Granted
Application number
JP2015128306A
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Japanese (ja)
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JP5993497B2 (en
Inventor
聡一 榊原
Soichi Sakakibara
聡一 榊原
勝 伊垣
Masaru Igaki
勝 伊垣
雄作 河端
Yusaku Kawabata
雄作 河端
Original Assignee
ローム株式会社
Rohm Co Ltd
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Priority to JP2008295114 priority Critical
Priority to JP2008295114 priority
Application filed by ローム株式会社, Rohm Co Ltd filed Critical ローム株式会社
Priority to JP2015128306A priority patent/JP5993497B2/en
Publication of JP2015201456A publication Critical patent/JP2015201456A/en
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    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21LIGHTING
    • F21KNON-ELECTRIC LIGHT SOURCES USING LUMINESCENCE; LIGHT SOURCES USING ELECTROCHEMILUMINESCENCE; LIGHT SOURCES USING CHARGES OF COMBUSTIBLE MATERIAL; LIGHT SOURCES USING SEMICONDUCTOR DEVICES AS LIGHT-GENERATING ELEMENTS; LIGHT SOURCES NOT OTHERWISE PROVIDED FOR
    • F21K9/00Light sources using semiconductor devices as light-generating elements, e.g. using light-emitting diodes [LED] or lasers
    • F21K9/20Light sources comprising attachment means
    • F21K9/27Retrofit light sources for lighting devices with two fittings for each light source, e.g. for substitution of fluorescent tubes
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21LIGHTING
    • F21YINDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
    • F21Y2103/00Elongate light sources, e.g. fluorescent tubes
    • F21Y2103/10Elongate light sources, e.g. fluorescent tubes comprising a linear array of point-like light-generating elements
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21LIGHTING
    • F21YINDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
    • F21Y2115/00Light-generating elements of semiconductor light sources
    • F21Y2115/10Light-emitting diodes [LED]
    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42Wire connectors; Manufacturing methods related thereto
    • H01L2224/47Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805Shape
    • H01L2224/4809Loop shape
    • H01L2224/48091Arched
    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/73Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
    • H01L2224/732Location after the connecting process
    • H01L2224/73251Location after the connecting process on different surfaces
    • H01L2224/73265Layer and wire connectors

Abstract

PROBLEM TO BE SOLVED: To provide an LED lighting device which obtains sufficient light volume.SOLUTION: An LED lighting device A6 includes: LED modules 10, each of which includes a base member 14 serving as a first mounting base, an LED chip 11 which is formed on the first mounting base and emits light, and a translucent resin package 12 which is formed on the first mounting base while covering the LED chip 11; a substrate 20 in which the LED modules 10 are mounted on a surface, the substrate 20 serving as a second mounting base; and a translucent member 30 which is formed on the second mounting base, extends from a side surface of the first mounting base to the resin package 12, and covers the LED modules 10, the translucent member 30 having an arc shape cross section and translucency.

Description

  The present invention relates to an LED lighting device used as an alternative means such as a downlight having a fluorescent lamp or an incandescent bulb.

  FIG. 16 shows a conventional LED illumination device (see, for example, Patent Document 1). The LED illumination device X shown in the figure includes a long rectangular substrate 91, a plurality of LED modules 92 mounted on the substrate 91, a tube 93 that accommodates the substrate 91, and a terminal 94. A wiring pattern (not shown) connected to the plurality of LED modules 92 and the terminals 94 is formed on the substrate 91. This LED lighting apparatus X can emit light from a plurality of LED modules 92 by fitting the terminals 94 into the sockets of the sockets of general fluorescent lamps, and is an alternative to general fluorescent lamps. It is comprised as an LED lamp which can be used as.

  The general-use fluorescent lamp luminaire is a luminaire widely used mainly for indoor general illumination. For example, in Japan, a commercial 100V or 200V power supply is used, and a straight tube fluorescent lamp defined in JIS C7617 or A lighting fixture to which a ring-shaped fluorescent lamp defined in JIS C7618 is attached.

  However, when the LED lighting device X is turned on, heat is generated from the LED chip (not shown) of the LED module 92. The sealing resin that covers the LED chip is relatively difficult to transfer heat. Further, in the case where the pin terminal (not shown) of the LED module 92 is soldered to the substrate 91, heat from the LED chip is not easily transmitted to the substrate 91. For this reason, the LED module 92 has a problem that heat is easily trapped. Further, when the number of LED modules 92 mounted is small, each LED module 92 is visually recognized as a bright spot. Such an appearance is remarkably different from fluorescent lamps, and gives a strange impression to consumers.

  Further, in the conventional LED lighting device X, there is a space between the tube 93 that forms the cover and the LED module 92, and a part of the light is reflected by the inner surface of the tube 93 due to the difference in refractive index. Therefore, in order to obtain a sufficient amount of light as a lamp, it is necessary to increase the number of LED modules 92 or increase the current supplied to the LEDs.

Japanese Utility Model Publication No. 6-54103

  The present invention has been conceived under the circumstances described above, and an object thereof is to provide an LED lighting device capable of obtaining a sufficient amount of light.

  The LED illumination device provided by the present invention is an LED illumination device comprising a plurality of LED light sources and a substrate on which the plurality of LED light sources are mounted in a row, wherein the substrate has a long rectangular shape having a longitudinal direction. Each of the plurality of LED light sources is an LED module in which an LED chip is sealed with a resin package, and is mounted in a row along the longitudinal direction of the substrate. A pair of bases each having a pair of terminal pins and fitted into an insertion port of a general fluorescent lamp luminaire are provided at both ends in the direction, and the plurality of LED light sources are provided on the substrate. A translucent member having a semicircular cross section extending in the longitudinal direction of the substrate is provided so as to collectively cover the substrate, and a translucent cover is provided on the entire outer surface of the translucent member.

  In a preferred embodiment of the present invention, the surface opposite to the mounting surface of the substrate on which the plurality of LED light sources are mounted has a plurality of fin portions spaced from each other in the width direction of the substrate. A heat dissipation member is provided.

  In a preferred embodiment of the present invention, some of the plurality of fins are shorter in the thickness direction dimension of the substrate than the other plurality of fins.

  In a preferred embodiment of the present invention, as the plurality of fins are closer to the center in the width direction of the substrate, the dimension in the thickness direction of the substrate is longer.

  In a preferred embodiment of the present invention, the translucent member contains a fluorescent material.

  In a preferred embodiment of the present invention, the translucent member covers the plurality of LED light sources in close contact with each other.

  In preferable embodiment of this invention, the said translucent cover is provided so that it may closely_contact | adhere to the whole outer surface of the said translucent member.

  Other features and advantages of the present invention will become more apparent from the detailed description given below with reference to the accompanying drawings.

It is a top view which shows the LED lighting apparatus based on 1st Embodiment of this invention. It is sectional drawing which follows the II-II line | wire of FIG. It is a principal part expanded sectional view which shows the LED chip of the LED lighting apparatus shown in FIG. It is a principal part expanded sectional view which shows the other example of the LED chip of the LED lighting apparatus shown in FIG. It is a principal part expanded sectional view which shows the other example of the LED chip of the LED lighting apparatus shown in FIG. It is sectional drawing which shows the LED lighting apparatus based on 2nd Embodiment of this invention. It is a principal part expanded sectional view which shows the LED chip of the LED lighting apparatus shown in FIG. It is a top view which shows the LED lighting apparatus based on 3rd Embodiment of this invention. It is sectional drawing which follows the IX-IX line of FIG. It is a top view which shows the LED lighting apparatus based on 4th Embodiment of this invention. It is sectional drawing which follows the XI-XI line of FIG. It is a top view which shows the LED lighting apparatus based on 5th Embodiment of this invention. It is a partially cutaway perspective view of the LED lighting device shown in FIG. It is sectional drawing which shows the LED lighting apparatus based on 6th Embodiment of this invention. It is sectional drawing which shows the LED lighting apparatus based on 7th Embodiment of this invention. It is sectional drawing which shows an example of the conventional LED lighting apparatus.

  Hereinafter, preferred embodiments of the present invention will be specifically described with reference to the drawings.

1 and 2 show an LED lighting device according to a first embodiment of the present invention. The LED lighting device A1 of the present embodiment includes a plurality of LED chips 11, a substrate 20, a translucent member 30, a translucent cover 40, a heat radiating member 50, and a base 80, and is formed in an elongated cylindrical shape as a whole. Yes. This LED illumination device A1 is configured as a so-called LED lamp that is used by being attached to a general fluorescent lamp illuminator, for example, as an alternative to a straight tube fluorescent lamp.

The substrate 20 has a long rectangular shape and includes a main body 21, an insulating film 22, and a wiring pattern 23 as shown in FIG. The main body 21 is made of, for example, Al. The insulating film 22 covers a part of the main body 21 and is made of, for example, Al 2 O 3 or SiO 2 . Wiring pattern 2
3 is made of Au, Cu, Ni, or an alloy thereof, and is patterned on the insulating film 22.

  The plurality of LED chips 11 are arranged in a staggered pattern on the substrate 20. As shown in FIG. 3, the LED chip 11 has an n-type semiconductor layer 11a, an active layer 11b, a p-type semiconductor layer 11c, and a p-side electrode 11d, and a wiring pattern with the n-type semiconductor layer 11a on the lower side. 23 is die-bonded. N-type semiconductor layer 11a and p-type semiconductor layer 11c are made of, for example, a GaN-based semiconductor. The active layer 11b is sandwiched between the n-type semiconductor layer 11a and the p-type semiconductor layer 11c and has a multiple quantum well (MQW) structure. Such an LED chip 11 emits blue light, for example. The p-side electrode 11d is formed in the p-type semiconductor layer 11c. The p-side electrode 11 d and the wiring pattern 23 are connected by a wire 13. The LED chip 11 has a plan view dimension of, for example, about 0.46 mm × 0.26 mm.

  In the present embodiment, the plurality of LED chips 11 are mounted at a relatively high density. Thereby, these LED chips 11 are not visually recognized as a set of point light sources depending on the naked eye, but constitute a planar light source unit 11A that is visually recognized as a light emitting surface that emits uniform light.

  The translucent member 30 covers the plurality of LED chips 11 and includes a first layer 31 and a second layer 32. The first layer 31 directly covers the substrate 20 and the plurality of LED chips 11 and is made of a substantially colorless and transparent epoxy resin or silicone resin. The second layer 32 is laminated on the first layer 31 and is made of a material in which a fluorescent material is mixed in a substantially colorless and transparent epoxy resin or silicone resin. This fluorescent material emits yellow light when excited by blue light from the LED chip 11. White light is obtained by mixing the blue light from the LED chip 11 and the yellow light from the fluorescent material. As the fluorescent material, in addition to a material that emits yellow light, a material that emits red light and a material that emits green light when excited by blue light may be used.

  As shown in FIG. 2, the translucent member 30 is surrounded by a weir 35. The weir 35 is formed in a rectangular frame shape on the substrate 20 and is made of, for example, resin. The dam 35 plays a role of preventing the liquid resin material from being unreasonably spread when pouring a liquid resin material for forming the translucent member 30 so as to cover the plurality of LED chips 11, for example.

  The translucent cover 40 is provided for diffusing the light transmitted from the LED chip 11 through the translucent member 30. The translucent cover 40 has a circular cross section and is made of, for example, polycarbonate resin.

  The heat dissipating member 50 is made of Al, for example, of the same material as the main body 21 of the substrate 20 and is bonded to the substrate 20. The heat dissipation member 50 includes a plate-like portion joined to the substrate 20 and a plurality of fin portions extending perpendicularly from the plate-like portion.

  The base 80 is a part that fits into the insertion port of the general fluorescent lamp luminaire, and holds a terminal pin 81 for energization. The base 80 is attached to both ends in the longitudinal direction of the substrate 20, and each terminal pin 81 communicates with the wiring pattern 23. By fitting each terminal pin 81 into the insertion port of the fluorescent lamp lighting fixture, power is supplied to the plurality of LED chips 11 and the LED chips 11 are caused to emit light.

  Next, the operation of the LED lighting device A1 will be described.

  According to the present embodiment, heat from the LED chip 11 is directly transmitted to the substrate 20. For this reason, compared with the structure mounted in the board | substrate 91 with the form of the LED module 92 like the example shown in FIG. 16, the thermal radiation from the LED chip 11 can be accelerated | stimulated.

  Since the plurality of LED chips 11 are directly mounted on the substrate 20 which is a conduction support member, there are no parts such as sealing resin and pin terminals for configuring the LED module 92 shown in the example of FIG. 16 in this embodiment. . For this reason, it is possible to remarkably reduce the interval between the LED chips 11. Accordingly, the planar light source unit 11A that emits planar light that cannot be visually recognized by a naked eye as a set of point light sources can be configured. Thereby, there is little possibility of giving a strange impression when used as an alternative means of the conventional fluorescent lamp.

  Moreover, the current flowing through each LED chip 11 can be reduced as the number of the plurality of LED chips 11 increases. The smaller this current is, the higher the luminous efficiency of the LED chip 11 can be, and the energy consumed as heat can be reduced.

  The light from the LED chip 11 passes through the first layer 31 and then passes through the second layer 32. Since the second layer 32 is located on the surface layer of the translucent member 30, the light emitted obliquely upward from the LED chip 11 is transmitted through the first layer 31 for a relatively long time, and then compared in the second layer 32. Transparent. For this reason, there is little possibility that the light emitted diagonally upward will excite a large amount of fluorescent material. This is advantageous for obtaining clear white light by appropriate color mixing.

  4 to 15 show other embodiments of the present invention. In these drawings, the same or similar elements as those in the above embodiment are denoted by the same reference numerals as those in the above embodiment.

  FIG. 4 shows another example of the translucent member 30. The translucent member 30 shown in the same figure is mixed with a fluorescent material. Also according to such an embodiment, it is possible to promote heat dissipation of the LED chip 11 and realize an appropriate planar light source unit 11A. Moreover, it is good also as a structure which obtains white light by using what emits red light, green light, and blue light as several LED chip 11. FIG. In this case, the translucent member 30 may not be mixed with a fluorescent material.

  FIG. 5 shows another example of the LED chip 11. The LED chip 11 shown in the figure is a so-called flip chip type LED chip, and includes a substrate 11e, an n-type semiconductor layer 11a, an active layer 11b, a p-type semiconductor layer 11c, an n-side electrode 11f, and a p-side electrode 11d. have. The substrate 11e is made of sapphire, for example, and serves as a base for the LED chip 11. The n-type semiconductor layer 11a is bonded to the substrate 11e via, for example, a buffer layer, and is made of, for example, an n-GaN-based semiconductor. The active layer 11b is a layer having an MQW structure, and is a layer for amplifying light emitted by recombination of electrons supplied from the n-side electrode 11f and holes supplied from the p-side electrode 11d. It is. In the active layer 11b, for example, a plurality of InGaN layers and a plurality of GaN layers are alternately stacked. The p-type semiconductor layer 11c is formed on the opposite side to the n-type semiconductor layer 11a with the active layer 11b interposed therebetween, and is made of, for example, a p-GaN-based semiconductor. The n-side electrode 11f is electrically connected to the n-type semiconductor layer 11a, and the p-side electrode 11d is electrically connected to the p-type semiconductor layer 11c. The n-side electrode 11f and the p-side electrode 11d are made of, for example, a structure in which Al and Ni are stacked or a metal layer containing W, Zr, and Pt. Such an LED chip 11 emits, for example, blue light from the active layer 11 b and is eutectic bonded to the wiring pattern 23, for example.

  According to such an embodiment, unlike the embodiment shown in FIGS. 3 and 4, it is not necessary to secure an area for bonding the wire 13 on the substrate 20. For this reason, it is possible to further reduce the interval between the LED chips 11. This is advantageous for high-density mounting of the LED chip 11.

  6 and 7 show an LED lighting device according to a second embodiment of the present invention. The LED lighting device A2 of this embodiment does not include the substrate 20 in the above-described embodiment, and a plurality of LED chips 11 are mounted on the heat dissipation member 50. As shown in FIG. 7, the heat dissipation member 50 of the present embodiment includes a main body 51 made of, for example, aluminum, an insulating film 52 covering the main body 51, and a wiring pattern 53 formed on the insulating film 52. The LED chip 11 is bonded to the wiring pattern 53.

  According to such an embodiment, heat from the LED chip 11 can be directly transmitted to the heat dissipation member 50. Therefore, the heat dissipation of the LED chip 11 can be further enhanced.

  8 and 9 show an LED lighting device according to a third embodiment of the present invention. The LED illumination device A3 of this embodiment includes a substrate 20, a plurality of LED chips 11, a reflector 60, a housing 51, a connector 71, and a holder 72. The LED illumination device A3 is used as a so-called downlight by being installed in an open space provided on the ceiling in a posture in which the top and bottom are reversed in the vertical direction of FIG.

  The substrate 20 is circular and has a diameter of about 66 mm. The region where the plurality of LED chips 11 are mounted is a circular region having a diameter of about 50 to 60 mm. A plurality of LED chips 11 are mounted on the substrate 20 in the same form as the above-described embodiment. 8 and 9, the translucent member 30 is omitted. A circular area on which the plurality of LED chips 11 are mounted constitutes a planar light source unit 11A.

  The reflector 60 has openings 61 and 62 and has a cone shape whose sectional dimension increases as the distance from the substrate 20 increases, and is made of, for example, aluminum. The reflector 60 surrounds the plurality of LED chips 11 and reflects light emitted from them. The inner surface of the reflector 60 is, for example, an uneven Al plated surface.

  The casing 51 is made of, for example, aluminum and supports the substrate 20 and the reflector 60. When the LED chip 11 emits light, heat from the LED chip 11 is transmitted to the reflector 40 and the housing 50 via the substrate 20. Thereby, the heat dissipation promotion of the LED chip 11 is aimed at. The connector 71 is connected to a building-side connector (not shown) when the LED lighting device A3 is installed on the ceiling. The holder 72 is formed by bending a stainless steel (SUS301) plate, for example. The holder 72 holds the LED lighting device A3 by engaging with a part of the ceiling when the LED lighting device A3 is attached to the ceiling.

  Also in the LED illumination device A3 used as such a downlight, the planar light source unit 11A that emits uniform planar light can be configured while improving the heat dissipation of the LED chip 11.

  10 and 11 show an LED lighting device according to a fourth embodiment of the present invention. The LED illumination device A4 of the present embodiment includes a plurality of LED modules 10 serving as light sources, a substrate 20, a translucent member 30, a translucent cover 40, a heat radiating member 50, and a base 80, and is formed into an elongated cylindrical shape as a whole. Is formed. This LED illumination device A4 is used as an LED lamp that is attached to and used in a general fluorescent lamp illuminator, for example, as an alternative to a straight tube fluorescent lamp.

  A plurality of LED modules 10 are mounted on the substrate 20 so as to form a row at a predetermined interval. As shown in FIG. 11, each LED module 10 includes an LED chip 11, a resin package 12 that protects the LED chip 11, and a base member 14 that supports the LED chip 11 while being electrically connected to the LED chip 11 by wires 13. The LED chip 11 is made of, for example, a GaN-based semiconductor and emits blue light. The resin package 12 is made of, for example, a silicone resin having translucency. The resin package 12 includes a fluorescent material that emits yellow light when excited by blue light, for example. For example, the base member 14 is joined to the substrate 20 in a state of being conductively connected to a wiring pattern (not shown) of the substrate 20.

  The substrate 20 is made of, for example, Al and has a long rectangular shape. The mounting surface 20 a of the substrate 20 on which the plurality of LED modules 10 are mounted is covered with a light transmissive member 30. A heat radiating member 50 is provided on the back surface 20 b opposite to the mounting surface 20 a of the substrate 20.

  The translucent member 30 is for efficiently diffusing light from the LED module 10 outward, and is provided so as to cover the plurality of LED modules 10 in close contact with each other. The translucent member 30 has a semicircular cross section and is made of, for example, the same material as the base material of the resin package 12 of the LED module 10. Thereby, for example, blue light emitted from the LED chip 11 of the LED module 10 is radiated outward through the resin package 12 and the translucent member 30 of the LED module 10. A translucent cover 40 is provided in close contact with the entire curved outer surface of the translucent member 30. Thus, the translucent member 30 is provided so that there is no gap between the LED module 10 and the translucent cover 40. Therefore, the light from the LED module 10 is less likely to be reflected due to the relatively small difference in the refractive index of each medium, and is efficiently guided outward through the translucent member 30.

  The translucent cover 40 is provided for diffusing the light guided from the LED module 10 through the translucent member 30, and is provided so as to cover the translucent member 30 in close contact with the translucent member 30. . The translucent cover 40 has a semicircular cross section and is made of, for example, polycarbonate resin.

  The heat radiating member 50 is made of, for example, Al made of the same material as that of the substrate 20 and is formed so as to have a plurality of fin portions extending in the vertical direction from the back surface 20 b of the substrate 20. These fin portions are provided so as to be arranged at predetermined intervals in the short direction of the substrate 20 so as to come into contact with the outside air. Thereby, the heat radiating member 50 plays a role of efficiently dissipating heat generated by light emission of the LED module 10 to the outside air.

  The base 80 is a part that fits into the insertion port of the general fluorescent lamp luminaire, and holds a terminal pin 81 for energization. The bases 80 are attached to both ends of the substrate 20 in the longitudinal direction, and each terminal pin 81 communicates with a wiring pattern (not shown) on the substrate 20. By fitting each terminal pin 81 into the insertion port of the fluorescent lamp lighting fixture, power is supplied to the plurality of LED modules 10 and the LED chip 11 is caused to emit light.

  Next, the operation of the LED lighting device A4 of the present embodiment will be described.

  In each LED module 10 of the LED lighting device A4, the blue light emitted from the LED chip 11 is partially converted into yellow light by the fluorescent material contained in the resin package 12, and the yellow light and the remaining blue light are generated. When mixed, it becomes white light. The white light is emitted from the resin package 12 to the translucent member 30, diffuses inside the translucent member 30, and then radiates outward from the outer surface of the translucent member 30 through the translucent cover 40. . In order to emit white light, the light emitting color of the LED chip 11 may be blue, and the fluorescent material as described above may be included in the light transmitting member 30 instead of the resin package 12. Alternatively, a red, green, and blue LED chip 11 collectively sealed with a resin package 12 is used as an LED module 10, and white light is emitted from the resin package 12 to the light guide by additive color mixing of these lights. You may do it.

  At this time, the resin package 12 and the translucent member 30 of the LED module 10 made of the same material are in close contact, and light passes from the resin package 12 to the translucent member 30 with almost no change in refractive index. Further, since the translucent member 30 and the translucent cover 40 are in close contact with each other and the difference in refractive index is relatively small, the light is transmitted in a state where the refractive index change is small from the translucent member 30 to the translucent cover 40. Pass through. That is, the light from the LED module 10 is efficiently radiated outward with almost no reflection due to the change in the refractive index on the inner surface side of the translucent cover 40.

  Therefore, according to LED lighting apparatus A4 of this embodiment, the translucent member 30 is provided in the state closely_contact | adhered to the LED module 10 and the translucent cover 40, and the air layer from which a refractive index differs is not interposed among these. Therefore, the light from the LED module 10 is efficiently guided outward through the translucent member 30. Thereby, in the LED lighting device A4, it is possible to obtain a sufficient amount of light while reducing the number of the LED modules 10 as much as possible and reducing the component cost. In addition, a sufficient amount of light can be obtained while suppressing the current supplied to the LED module 10 and reducing the power consumption.

  The LED illumination device A5 shown in FIGS. 12 and 13 is formed in an annular shape as a whole, and is attached to, for example, a general fluorescent lamp illuminator as an alternative to an annular fluorescent lamp. The translucent cover 40 is formed in an annular shape as a whole, and has a semicircular arc shape when viewed in cross section, similar to the embodiment described above. The long side portion of the substrate 20 is curved according to the shape of the translucent cover 40, and a plurality of substrates 20 are arranged along the translucent cover 40. In addition, between the board | substrate 20 and the board | substrate 20, and between the board | substrate 20 and the nozzle | cap | die 80, you may provide a cross-sectional semicircle shape or a plate-shaped spacer so that these may be filled. The heat radiating member 50 is curved according to the shape of the translucent cover 40 for each substrate 20. The translucent member 30 is provided in close contact with the LED module 10 between the mounting surface 20a of the substrate 20 and the translucent cover 40, as in the above-described embodiment.

  Even with such an LED lighting device A5, there is no air layer having a significantly different refractive index between the translucent member 30 and the LED module 10 or between the translucent member 30 and the translucent cover 40, and the LED module. The light from 10 is efficiently guided outward through the translucent member 30. As a result, even in the LED lighting device A5, the number of the LED modules 10 can be reduced as much as possible to reduce the component cost, and a sufficient amount of light can be obtained while suppressing the current supplied to the LED module 10 and reducing the power consumption. it can.

  In the LED illumination device A6 shown in FIG. 14, the light transmission cover is not provided, and the LED module 10 is covered only by the light transmission member 30. According to such an LED lighting device A6, further cost reduction can be achieved by reducing the number of components, and light from the LED module 10 can be guided to the outside more efficiently.

  In the LED illumination device A7 shown in FIG. 15, the LED chip 11 is directly mounted on the substrate 20, and this LED chip 11 is an LED light source. The translucent member 30 is provided so as to cover these in close contact with the LED chip 11. In order to irradiate white light with such an LED illumination device A7, the light-emitting color of the LED chip 11 may be blue, and the above-described fluorescent material may be contained in the translucent member 30. Alternatively, red light, green, and blue LED bare chips may be alternately arranged, and white light may be irradiated by additive mixing of these lights. Even with such an LED lighting device A7, it is possible to further reduce the cost by reducing the number of components, and to more efficiently guide the light from the LED chip 11 outward.

  The LED lighting device according to the present invention is not limited to the embodiment described above. The specific configuration of each part of the LED lighting device according to the present invention can be varied in design in various ways.

A1 to A7 LED lighting device 10 LED module (LED light source)
11 LED chip (LED light source)
12 Resin package 20 Substrate (conductive support member)
20a Substrate mounting surface 20b Substrate back surface 21 Main body 22 Insulating film 23 Wiring pattern 30 Translucent member 31 First layer 32 Second layer 35 Weir 40 Translucent cover 50 Heat radiating member (conducting support member)
51 Body 52 Insulating film 53 Wiring pattern

Claims (6)

  1. A first mounting table; an LED chip that emits light formed on the first mounting table; and a translucent resin formed on the first mounting table so as to cover the LED chip. LED module with
    A second mounting table on which the LED module is mounted;
    On the second mounting table, a translucent member having a cross-sectional arc shape and a light-transmitting property, extending from the side surface of the first mounting table to the resin and covering the LED module;
    LED lighting device characterized by having.
  2.   The LED lighting device according to claim 1, wherein the resin has a surface parallel to a surface of the first mounting table.
  3.   The LED lighting device according to claim 1, further comprising a heat dissipating member provided on a back surface side of the second mounting base.
  4.   4. The LED lighting device according to claim 3, wherein the heat dissipating member has an uneven shape with a continuous surface.
  5.   5. The LED lighting device according to claim 1, wherein no member is brought into close contact with the curved front portion of the translucent member.
  6.   5. The LED lighting device according to claim 1, further comprising a translucent cover provided to cover the translucent member.
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