JP2015177179A - Sheet sticking device and sticking method - Google Patents

Sheet sticking device and sticking method Download PDF

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JP2015177179A
JP2015177179A JP2014055153A JP2014055153A JP2015177179A JP 2015177179 A JP2015177179 A JP 2015177179A JP 2014055153 A JP2014055153 A JP 2014055153A JP 2014055153 A JP2014055153 A JP 2014055153A JP 2015177179 A JP2015177179 A JP 2015177179A
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pressing
adhesive sheet
sticking
adherend
sheet
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JP6312472B2 (en
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祐太 黒澤
Yuta Kurosawa
祐太 黒澤
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リンテック株式会社
Lintec Corp
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Abstract

PROBLEM TO BE SOLVED: To provide a sheet sticking device capable of preventing an outer edge of an adhesive sheet from being floated from an adherend, and a sticking method.SOLUTION: A sheet sticking device 10 includes: supply means 20 for supplying an adhesive sheet AS; pressing means 30 for pressing the supplied adhesive sheet AS on an adherend WF; and moving means 40 for relatively moving the pressing means 30 and the adherend WF along an adhesion face WF1 of the adherend WF. The pressing means 30 is provided to perform a pressure change operation for reducing pressure gradually from one end of the adhesive sheet AS to a central part and increasing the pressure gradually from the central part of the adhesive sheet AS to another end, and performs a first pressing operation for implementing the pressure change operation while being relatively moved in a first sticking direction by the moving means 40, and a second pressing operation for implementing the pressure change operation while being relatively moved in a second sticking direction crossing the first sticking direction.

Description

本発明は、被着体に接着シートを貼付するシート貼付装置および貼付方法に関する。   The present invention relates to a sheet sticking apparatus and a sticking method for sticking an adhesive sheet to an adherend.
従来、半導体ウエハ(以下、単に「ウエハ」という場合がある)等の被着体に接着シートを貼付するシート貼付装置が知られている(例えば、特許文献1参照)。
特許文献1に記載のシート貼付装置は、接着シートを繰り出す繰出手段と、接着シートをウエハ(被着体)の被着面に押圧する押圧手段と、被着体と押圧手段とを相対移動させる移動手段とを備え、ウエハに対する押圧手段の加圧力を調整自在とし、ウエハの部位によって加圧力を変えることで、押圧手段の押圧力を均一にして接着シートをウエハに貼付するように構成されている。
2. Description of the Related Art Conventionally, there has been known a sheet sticking apparatus for sticking an adhesive sheet to an adherend such as a semiconductor wafer (hereinafter sometimes simply referred to as “wafer”) (for example, see Patent Document 1).
The sheet sticking device described in Patent Document 1 relatively moves the feeding means for feeding out the adhesive sheet, the pressing means for pressing the adhesive sheet against the adherend surface of the wafer (the adherend), and the adherend and the pressing means. Moving means, and the pressing force of the pressing means to the wafer is adjustable, and the pressing force of the pressing means is made uniform by sticking the adhesive sheet to the wafer by changing the pressing force depending on the part of the wafer. Yes.
特開2002−134438号公報JP 2002-134438 A
しかしながら、特許文献1に記載されたような従来のシート貼付装置は、接着シート全体を均一な押圧力で押圧するため、押圧力を大きくすると、被着体に作用するストレスが大きくなってしまい、押圧力を小さくすると、接着シートの外縁部が被着体から浮いてしまうという不都合がある。   However, since the conventional sheet sticking device as described in Patent Document 1 presses the entire adhesive sheet with a uniform pressing force, when the pressing force is increased, the stress acting on the adherend increases. When the pressing force is reduced, there is a disadvantage that the outer edge portion of the adhesive sheet floats from the adherend.
本発明の目的は、被着体に作用するストレスを軽減でき、接着シートの外縁部が被着体から浮いてしまうことを防止することができるシート貼付装置および貼付方法を提供することにある。   An object of the present invention is to provide a sheet sticking apparatus and a sticking method capable of reducing stress acting on an adherend and preventing an outer edge portion of an adhesive sheet from floating from the adherend.
本発明のシート貼付装置は、接着シートを供給する供給手段と、前記供給手段から供給された接着シートを被着体に押圧して貼付する押圧手段と、前記押圧手段と前記被着体とを当該被着体の被着面に沿って相対移動させる移動手段とを備え、前記押圧手段は、前記接着シートの一端から中央部に向かうにしたがって次第に押圧力を低下させ、前記接着シートの中央部から他端に向かうにしたがって次第に押圧力を増加させる押圧力変更動作が可能に設けられ、前記移動手段により第1貼付方向に相対移動しつつ、前記押圧力変更動作を行う第1押圧動作と、第1貼付方向と交差する第2貼付方向に相対移動しつつ、前記押圧力変更動作を行う第2押圧動作とを行うことを特徴とする。   The sheet sticking apparatus of the present invention includes a supply means for supplying an adhesive sheet, a pressing means for pressing and sticking the adhesive sheet supplied from the supply means to an adherend, the pressing means and the adherend. Moving means for relatively moving along the adherend surface of the adherend, and the pressing means gradually reduces the pressing force from one end of the adhesive sheet toward the central portion, and the central portion of the adhesive sheet. A pressing force changing operation for gradually increasing the pressing force toward the other end, and a first pressing operation for performing the pressing force changing operation while relatively moving in the first sticking direction by the moving means; A second pressing operation for performing the pressing force changing operation is performed while relatively moving in a second pasting direction intersecting the first pasting direction.
本発明のシート貼付装置は、前記接着シートの外縁部の接着力を増大させる接着力増大手段を備えていることが好ましい。   It is preferable that the sheet sticking device of the present invention includes an adhesive force increasing means for increasing the adhesive force of the outer edge portion of the adhesive sheet.
本発明のシート貼付方法は、接着シートを供給する工程と、供給された接着シートを被着体に押圧して貼付する押圧手段と前記被着体とを前記被着体の被着面に沿って第1貼付方向に相対移動させつつ、前記接着シートの一端から中央部に向かうにしたがって次第に前記押圧手段の押圧力を低下させ、前記接着シートの中央部から他端に向かうにしたがって次第に前記押圧力を増加させる押圧力変更動作を行う第1押圧工程と、前記押圧手段と前記被着体とを前記被着面に沿って第1貼付方向と交差する第2貼付方向に相対移動させつつ、前記押圧力変更動作を行う第2押圧工程とを実施することを特徴とする。   The sheet sticking method of the present invention includes a step of supplying an adhesive sheet, a pressing means for pressing the supplied adhesive sheet against the adherend, and the adherend along the adherend surface of the adherend. The pressing force of the pressing means is gradually decreased from one end of the adhesive sheet toward the central portion while being relatively moved in the first sticking direction, and the pressing force is gradually decreased toward the other end from the central portion of the adhesive sheet. A first pressing step for performing a pressing force changing operation for increasing the pressure, and the relative movement of the pressing means and the adherend along the adherend surface in a second pasting direction intersecting the first pasting direction, A second pressing step for performing the pressing force changing operation is performed.
以上のような本発明によれば、押圧力変更動作を行う貼付動作を複数の異なる方向に行うため、接着シートの中央部の押圧力を小さくしたままで、接着シートの外縁部全体の押圧力を大きくすることができる。このため、被着体に作用するストレスを軽減することができ、接着シートの外縁部が被着体から浮いてしまうことを防止することができる。   According to the present invention as described above, since the pasting operation for performing the pressing force changing operation is performed in a plurality of different directions, the pressing force of the entire outer edge portion of the adhesive sheet is kept small while the pressing force of the central portion of the adhesive sheet is kept small. Can be increased. For this reason, the stress which acts on a to-be-adhered body can be reduced, and it can prevent that the outer edge part of an adhesive sheet floats from an to-be-adhered body.
また、接着力増大手段を設ければ、接着シートの外縁部を被着体に密着させることができるので、接着シートの外縁部が被着体から浮いてしまうことをより確実に防止することができる。   Further, if the adhesion increasing means is provided, the outer edge portion of the adhesive sheet can be brought into close contact with the adherend, so that the outer edge portion of the adhesive sheet can be more reliably prevented from floating from the adherend. it can.
本発明の一実施形態に係るシート貼付装置の側面図。The side view of the sheet sticking apparatus which concerns on one Embodiment of this invention. シート貼付装置の動作説明図。Operation | movement explanatory drawing of a sheet sticking apparatus.
以下、本発明の一実施形態を図面に基づいて説明する。
なお、本実施形態において、基準となる図を挙げることなく、例えば、上、下、左、右、または、手前、奥といった方向を示した場合は、全て図1を正規の方向(付した番号が適切な向きとなる方向)から観た場合を基準とし、上、下、左、右方向が紙面に平行な方向であり、前が紙面に直交する手前方向、後が紙面に直交する奥側方向とする。
Hereinafter, an embodiment of the present invention will be described with reference to the drawings.
In the present embodiment, for example, when a direction such as up, down, left, right, front, or back is shown without giving a reference figure, all of FIG. The direction from which the image is viewed in the appropriate direction) is the direction in which the top, bottom, left, and right directions are parallel to the page, the front is the front direction perpendicular to the page, and the back is the back side orthogonal to the page. The direction.
図1において、シート貼付装置10は、接着シートASを供給する供給手段20と、供給手段20から供給された接着シートASを被着体としてのウエハWFに押圧して貼付する押圧手段30と、押圧手段30とウエハWFとをウエハWFの被着面WF1に沿って相対移動させる移動手段40と、接着シートASの外縁部の接着力を増大させる接着力増大手段50と、接着シートASの外縁部よりも内側の接着力を低減させる接着力低減手段60とを備えている。なお、被着面WF1には、複数のバンプや回路等のパターンWF2が設けられている。   In FIG. 1, a sheet sticking apparatus 10 includes a supply means 20 for supplying an adhesive sheet AS, a pressing means 30 for pressing and sticking the adhesive sheet AS supplied from the supply means 20 to a wafer WF as an adherend, Moving means 40 for relatively moving the pressing means 30 and the wafer WF along the adherend surface WF1 of the wafer WF, an adhesive force increasing means 50 for increasing the adhesive force of the outer edge portion of the adhesive sheet AS, and the outer edge of the adhesive sheet AS And an adhesive strength reducing means 60 for reducing the adhesive strength inside the portion. Note that a pattern WF2 such as a plurality of bumps and circuits is provided on the adherend surface WF1.
供給手段20は、基材BS一方の面に接着剤AD層を有する接着シートASが当該接着剤AD層を介して剥離シートRLの一方の面に仮着された原反RSを支持する支持ローラ21と、原反RSを案内する複数のガイドローラ22と、剥離シートRLを折り返して当該剥離シートRLから接着シートASを剥離する剥離手段としての剥離板23と、駆動機器としての回動モータ24Aによって駆動される駆動ローラ24との間に剥離シートRLを挟み込むピンチローラ25と、剥離シートRLを回収する回収ローラ26とを備え、その全体がフレーム27に支持されている。   The supply means 20 is a support roller that supports an original fabric RS in which an adhesive sheet AS having an adhesive AD layer on one surface of the base material BS is temporarily attached to one surface of the release sheet RL via the adhesive AD layer. 21, a plurality of guide rollers 22 for guiding the raw fabric RS, a peeling plate 23 as a peeling means for folding the peeling sheet RL and peeling the adhesive sheet AS from the peeling sheet RL, and a rotation motor 24A as a driving device Are provided with a pinch roller 25 that sandwiches the release sheet RL between the drive roller 24 and the recovery roller 26 that recovers the release sheet RL, and the whole is supported by the frame 27.
押圧手段30は、押圧力を調整する押圧力調整手段であって、駆動機器としての直動モータ31と、直動モータ31の出力軸31Aにブラケット32を介して支持された押圧部材としての押圧ローラ33と、押圧ローラ33の押圧力を検知する図示しない圧力センサやロードセル等の検知手段とを備えている。なお、押圧ローラ33の回転軸心は、ウエハWFと押圧ローラ33との相対移動方向と直行する方向に向けられている。   The pressing means 30 is a pressing force adjusting means for adjusting the pressing force, and is a linear motion motor 31 as a driving device and a pressure member as a pressing member supported by an output shaft 31A of the linear motion motor 31 via a bracket 32. A roller 33 and a detection means (not shown) such as a pressure sensor and a load cell for detecting the pressing force of the pressing roller 33 are provided. The rotational axis of the pressing roller 33 is directed in a direction perpendicular to the relative movement direction of the wafer WF and the pressing roller 33.
移動手段40は、駆動機器としてのリニアモータ41と、リニアモータ41のスライダ41Aに支持された駆動機器としての回動モータ42と、回動モータ42の出力軸42Aに支持され、減圧ポンプや真空エジェクタ等の図示しない減圧手段によってウエハWFを吸着保持可能な保持面43Aを有するテーブル43とを備えている。   The moving means 40 is supported by a linear motor 41 as a driving device, a rotating motor 42 as a driving device supported by a slider 41A of the linear motor 41, and an output shaft 42A of the rotating motor 42, and is used as a decompression pump or a vacuum. And a table 43 having a holding surface 43A capable of sucking and holding the wafer WF by decompression means (not shown) such as an ejector.
接着力増大手段50は、テーブル43内の外縁部に設けられたコイルヒータや赤外線ヒータ等の加熱手段51を備え、ウエハWFに貼付される接着シートASの外縁部に対応する位置に環状に配置されている。   The adhesive force increasing means 50 includes a heating means 51 such as a coil heater or an infrared heater provided at the outer edge of the table 43, and is annularly arranged at a position corresponding to the outer edge of the adhesive sheet AS attached to the wafer WF. Has been.
接着力低減手段60は、加熱手段51の内側に設けられたペルチェ素子やヒートパイプの冷却側等の冷却手段61を備え、パターンWF2が形成された領域に対応する位置に配置されている。   The adhesive force reducing means 60 includes a cooling means 61 such as a Peltier element provided on the inner side of the heating means 51 or the cooling side of the heat pipe, and is disposed at a position corresponding to the region where the pattern WF2 is formed.
以上のシート貼付装置10において、ウエハWFに接着シートASを貼付する手順を説明する。
先ず、原反RSを図1に示すようにセットする。そして、図示しない操作パネルやパーソナルコンピュータ等の入力手段を介して運転開始の信号を入力すると、供給手段20が回動モータ24Aを駆動し、原反RSを繰り出す。次いで、剥離板23上に位置する先頭の接着シートASが所定位置に到達したことを光学センサや撮像手段等の図示しない検知手段が検知すると、供給手段20が回動モータ24Aの駆動を停止し、シート貼付装置10がスタンバイ状態となる。その後、人手または多関節ロボットやベルトコンベア等の図示しない搬送手段が、図1中二点鎖線で示すように、被着面WF1が上になるようにウエハWFをテーブル43上に載置すると、移動手段40が図示しない減圧手段を駆動し、保持面43AでウエハWFを吸着保持する。そして、接着力増大手段50が加熱手段51を駆動し、ウエハWFの外縁部を加熱し、接着力低減手段60が冷却手段61を駆動し、ウエハWFの中央部を冷却する。
In the sheet sticking apparatus 10 described above, a procedure for sticking the adhesive sheet AS to the wafer WF will be described.
First, the raw fabric RS is set as shown in FIG. Then, when an operation start signal is input via an input unit such as an operation panel or a personal computer (not shown), the supply unit 20 drives the rotation motor 24A to feed out the original fabric RS. Next, when a detection unit (not shown) such as an optical sensor or an imaging unit detects that the leading adhesive sheet AS positioned on the peeling plate 23 has reached a predetermined position, the supply unit 20 stops driving the rotation motor 24A. The sheet sticking device 10 is in a standby state. Then, when a wafer WF is placed on the table 43 such that a transfer means (not shown) such as a manual or multi-joint robot or a belt conveyor places the adherend surface WF1 upward as shown by a two-dot chain line in FIG. The moving means 40 drives a decompression means (not shown), and holds the wafer WF by suction with the holding surface 43A. Then, the adhesion increasing means 50 drives the heating means 51 to heat the outer edge of the wafer WF, and the adhesion reducing means 60 drives the cooling means 61 to cool the central part of the wafer WF.
次いで、移動手段40がリニアモータ41を駆動し、テーブル43を左方向に移動させる。そして、ウエハWFが供給手段20の下方所定位置に到達したことが光学センサや撮像手段等の図示しない検知手段に検知されると、供給手段20がテーブル43の移動に同期して回動モータ24Aを駆動し、原反RSを繰り出す。これにより、接着シートASが剥離板23で剥離シートRLから剥離され、図2(A)に示すように、ウエハWFが第1貼付方向WXである左方向に移動しつつ、押圧ローラ33が当該ウエハWFに接着シートASを押圧して貼付する第1押圧動作を行う。なお、次の接着シートASが所定位置に到達したことを図示しない検知手段が検知すると、供給手段20が回動モータ24Aの駆動を停止し、シート貼付装置10が再度スタンバイ状態となる。   Next, the moving means 40 drives the linear motor 41 to move the table 43 leftward. When the detection means (not shown) such as an optical sensor or an imaging means detects that the wafer WF has reached a predetermined position below the supply means 20, the supply means 20 synchronizes with the movement of the table 43 and rotates the motor 24 </ b> A. To feed out the original fabric RS. As a result, the adhesive sheet AS is peeled off from the release sheet RL by the release plate 23, and as shown in FIG. 2A, the wafer WF moves in the left direction, which is the first sticking direction WX, and the pressing roller 33 A first pressing operation for pressing and adhering the adhesive sheet AS to the wafer WF is performed. Note that when a detection unit (not shown) detects that the next adhesive sheet AS has reached a predetermined position, the supply unit 20 stops driving the rotation motor 24A, and the sheet sticking device 10 is again in a standby state.
ここで、第1押圧動作では、押圧手段30が直動モータ31を駆動し、接着シートASの一端(左端)から中央部に向かうにしたがって次第に押圧力を低下させ、接着シートASの中央部における押圧力を当該接着シートASの一端における第1押圧力よりも小さい第2押圧力となるようにし、次いで、接着シートASの中央部から他端(右端)に向かうにしたがって次第に押圧力を増加させ、接着シートASの他端における押圧力を第1押圧力とする押圧力変更動作を行う(図2(A)中黒色部分は押圧力が高い部分)。   Here, in the first pressing operation, the pressing means 30 drives the linear motion motor 31 to gradually reduce the pressing force from one end (left end) of the adhesive sheet AS toward the central portion, and in the central portion of the adhesive sheet AS. The pressing force is set to a second pressing force that is smaller than the first pressing force at one end of the adhesive sheet AS, and then the pressing force is gradually increased from the central portion to the other end (right end) of the adhesive sheet AS. Then, a pressing force changing operation is performed in which the pressing force at the other end of the adhesive sheet AS is the first pressing force (the black portion in FIG. 2A is a portion where the pressing force is high).
その後、テーブル43が図1中実線で示す位置に移動すると、移動手段40がリニアモータ41の駆動を停止した後、回動モータ42を駆動し、図2(B)に示すように、テーブル43を所定角度θ(本実施形態の場合90度)反時計回りに回転させる。そして、移動手段40がリニアモータ41を駆動し、テーブル43を第1貼付方向WXと交差する第2貼付方向WYである右方向に移動させつつ、押圧手段30が直動モータ31を駆動し、上記と同様の押圧力変更動作を行い、押圧ローラ33がウエハWFに接着シートASを再度押圧して貼付する第2押圧動作を行う(図2(B)中黒色部分は押圧力が高い部分)。これにより、剥離シートRLから剥離された接着シートASは、図2(B)中右側の黒色部分で示すように、中央部から外縁部にかけて次第に大きくなる押圧力でウエハWFに押圧されることになる。このとき、ウエハWFの外縁部が加熱手段51により加熱されているため、接着シートASの外縁部の接着力が増大する。これにより、接着シートASの外縁部をウエハWFに密着させることができるので、接着シートASの外縁部がウエハWFから浮いてしまうことを確実に防止することができる。また、ウエハWFにおけるパターンWF2が形成された領域が冷却手段61により冷却されているため、当該領域に対応する接着シートASの接着力が低下する。これにより、接着シートASがパターンWF2に密着することを抑制でき、接着シートASをウエハWFから剥離する際に、パターンWF2を剥ぎとってしまうことや、パターンWF2に接着剤AD層の糊残りが生じることを抑制することができる。   Thereafter, when the table 43 moves to the position indicated by the solid line in FIG. 1, the moving means 40 stops driving the linear motor 41, and then drives the rotation motor 42. As shown in FIG. Is rotated counterclockwise by a predetermined angle θ (90 degrees in this embodiment). Then, the moving means 40 drives the linear motor 41 and the pressing means 30 drives the linear motor 31 while moving the table 43 in the right direction which is the second pasting direction WY intersecting the first pasting direction WX. The same pressing force changing operation as described above is performed, and the pressing roller 33 performs the second pressing operation of pressing the adhesive sheet AS again on the wafer WF to stick (the black portion in FIG. 2B is a portion where the pressing force is high). . As a result, the adhesive sheet AS peeled from the release sheet RL is pressed against the wafer WF with a pressing force that gradually increases from the center to the outer edge as shown by the black part on the right side in FIG. Become. At this time, since the outer edge portion of the wafer WF is heated by the heating means 51, the adhesive force of the outer edge portion of the adhesive sheet AS increases. Thereby, since the outer edge part of adhesive sheet AS can be stuck to wafer WF, it can prevent reliably that the outer edge part of adhesive sheet AS floats from wafer WF. Further, since the region where the pattern WF2 is formed on the wafer WF is cooled by the cooling means 61, the adhesive force of the adhesive sheet AS corresponding to the region is reduced. As a result, the adhesive sheet AS can be prevented from sticking to the pattern WF2, and when the adhesive sheet AS is peeled from the wafer WF, the pattern WF2 is peeled off, or the adhesive residue of the adhesive AD layer is left on the pattern WF2. It is possible to suppress the occurrence.
そして、テーブル43が図1中二点鎖線で示す位置まで移動し、移動手段40がリニアモータ41および図示しない減圧手段の駆動を停止した後、人手または図示しない搬送手段がウエハWFを次工程に搬送し、以降上記同様の動作が繰り返される。   Then, after the table 43 has moved to the position indicated by the two-dot chain line in FIG. 1 and the moving means 40 has stopped driving the linear motor 41 and the decompressing means (not shown), the manual or conveying means (not shown) moves the wafer WF to the next process. Thereafter, the same operation is repeated.
以上のような実施形態によれば、押圧力変更動作を行う貼付動作を複数の異なる方向に行うため、接着シートASの中央部の押圧力を小さくしたままで、接着シートASの外縁部全体の押圧力を大きくすることができる。このため、ウエハWFに作用するストレスを軽減することができ、接着シートASの外縁部がウエハWFから浮いてしまうことを防止することができる。   According to the embodiment as described above, since the pasting operation for performing the pressing force changing operation is performed in a plurality of different directions, the pressing force at the central portion of the adhesive sheet AS is kept small, and the entire outer edge portion of the adhesive sheet AS is reduced. The pressing force can be increased. For this reason, the stress which acts on the wafer WF can be reduced, and the outer edge portion of the adhesive sheet AS can be prevented from floating from the wafer WF.
以上のように、本発明を実施するための最良の構成、方法等は、前記記載で開示されているが、本発明は、これに限定されるものではない。すなわち、本発明は、主に特定の実施形態に関して特に図示され、かつ説明されているが、本発明の技術的思想および目的の範囲から逸脱することなく、以上述べた実施形態に対し、形状、材質、数量、その他の詳細な構成において、当業者が様々な変形を加えることができるものである。また、上記に開示した形状、材質などを限定した記載は、本発明の理解を容易にするために例示的に記載したものであり、本発明を限定するものではないから、それらの形状、材質などの限定の一部もしくは全部の限定を外した部材の名称での記載は、本発明に含まれる。   As described above, the best configuration, method and the like for carrying out the present invention have been disclosed in the above description, but the present invention is not limited to this. That is, the invention has been illustrated and described with particular reference to certain specific embodiments, but without departing from the spirit and scope of the invention, Various modifications can be made by those skilled in the art in terms of material, quantity, and other detailed configurations. In addition, the description of the shape, material, and the like disclosed above is exemplary for ease of understanding of the present invention, and does not limit the present invention. The description by the name of the member which remove | excluded the limitation of some or all of such restrictions is included in this invention.
例えば、押圧手段30は、図1中AAで示すように、直動モータ31と、押圧ローラ33と、移動手段40の一部を構成する駆動機器としてのリニアモータ44のスライダ44Aに支持された駆動機器としての直動モータ34と、直動モータ34の出力軸34Aにブラケット35を介して支持された押圧部材としての押圧ローラ36とを備えてもよい。この場合、回動モータ42を省略することができる。また、押圧ローラ36の回転軸心は、ウエハWFと押圧ローラ36との相対移動方向と平行な方向に向けられてもよいし、相対移動方と斜めに交わる方向に向けられてもよい。
さらに、押圧手段30は、ブレード材、ゴム、樹脂、スポンジ等による押圧部材を採用することができる。
For example, as shown by AA in FIG. 1, the pressing unit 30 is supported by a linear motor 31, a pressing roller 33, and a slider 44 </ b> A of a linear motor 44 as a driving device that constitutes a part of the moving unit 40. A linear motion motor 34 as a drive device and a pressing roller 36 as a pressing member supported by an output shaft 34A of the linear motion motor 34 via a bracket 35 may be provided. In this case, the rotation motor 42 can be omitted. Further, the rotational axis of the pressing roller 36 may be directed in a direction parallel to the relative movement direction of the wafer WF and the pressing roller 36, or may be directed in a direction obliquely intersecting the relative movement direction.
Furthermore, the pressing means 30 can employ a pressing member made of a blade material, rubber, resin, sponge, or the like.
また、移動手段40は、テーブル43を固定しておいて供給手段20および押圧手段30を移動させてもよいし、テーブル43、供給手段20、および押圧手段30を移動させてもよい。さらに、テーブル43を所定角度θ回転させた後、テーブル43を固定しておいて、供給手段20および押圧手段30を左方向に移動させてもよい。
また、テーブル43を回転させる所定角度θは、例えば、1度、30度、45度、60度等、任意に決定することができ、押圧手段30が所定角度θに合わせて接着シートASの貼付動作を3回以上行ってもよい。例えば、第2押圧動作の後、テーブル43を45度反時計回りに回転させて第3押圧動作を行い、その後、テーブル43を90度時計回りに回転させて第4押圧動作を行えば、図2(C)に示すように、接着シートASの外縁部に沿って押圧力を高くすることができる(図2(C)中黒色部分は押圧力が高い部分)。このように、所定角度θを細かく設定し、押圧動作を増やせば、接着シートASの接着力が増大した領域を当該接着シートASの外縁部に沿って形成することができる。
さらに、テーブル43は、例えば、保持面43Aに凹部を設け、ウエハWFの外縁部のみを保持可能な所謂中空テーブルや、ウエハWF外縁部を保持する外縁テーブルと中央部を保持する中央テーブルとを備えた分割テーブルであってもよく、接着シートASが貼付される前のウエハWFの外縁部が中央部よりも押圧部材側に位置するようにウエハWFを撓ませた状態で上記の押圧動作を行ってもよい。
The moving means 40 may move the supply means 20 and the pressing means 30 while fixing the table 43, or may move the table 43, the supply means 20, and the pressing means 30. Furthermore, after rotating the table 43 by a predetermined angle θ, the table 43 may be fixed and the supply unit 20 and the pressing unit 30 may be moved in the left direction.
Further, the predetermined angle θ for rotating the table 43 can be arbitrarily determined, for example, 1 degree, 30 degrees, 45 degrees, 60 degrees, etc., and the pressing means 30 applies the adhesive sheet AS in accordance with the predetermined angle θ. The operation may be performed three times or more. For example, after the second pressing operation, the table 43 is rotated 45 degrees counterclockwise to perform the third pressing operation, and then the table 43 is rotated 90 degrees clockwise to perform the fourth pressing operation. As shown in FIG. 2 (C), the pressing force can be increased along the outer edge portion of the adhesive sheet AS (the black portion in FIG. 2 (C) is a portion where the pressing force is high). Thus, if the predetermined angle θ is set finely and the pressing operation is increased, a region where the adhesive force of the adhesive sheet AS is increased can be formed along the outer edge portion of the adhesive sheet AS.
Further, the table 43 includes, for example, a so-called hollow table that is provided with a recess in the holding surface 43A and can hold only the outer edge portion of the wafer WF, an outer edge table that holds the outer edge portion of the wafer WF, and a central table that holds the center portion. The above-described pressing operation may be performed in a state where the wafer WF is bent so that the outer edge portion of the wafer WF before the adhesive sheet AS is attached is located closer to the pressing member than the center portion. You may go.
また、接着力増大手段50、接着力低減手段60は、テーブル43とは別体に設けられたものであってもよく、例えば、押圧ローラ33、36内に設けられていてもよい。
さらに、接着力増大手段50、接着力低減手段60は、接着シートASの特性を考慮して紫外線、赤外線、マイクロ波などのエネルギー線を照射する照射手段や、バイブレータや超音波振動装置等で構成してもよい。なお、接着力増大手段50を冷却手段61で構成してもよいし、接着力低減手段60を加熱手段51で構成してもよい。
また、接着力低減手段60は、接着シートASの外縁部よりも内側における一部の接着力を低下させるものであってもよく、テーブル43内の中央部に設けることなく外縁部近傍のみに設けてもよいし、外縁部近傍に設けることなく中央部のみに設けてもよい。
Further, the adhesive force increasing means 50 and the adhesive force reducing means 60 may be provided separately from the table 43, for example, may be provided in the pressing rollers 33 and 36.
Further, the adhesive force increasing means 50 and the adhesive force reducing means 60 are configured by irradiation means for irradiating energy rays such as ultraviolet rays, infrared rays, and microwaves in consideration of the characteristics of the adhesive sheet AS, vibrators, ultrasonic vibration devices, and the like. May be. The adhesive force increasing means 50 may be constituted by the cooling means 61, and the adhesive force reducing means 60 may be constituted by the heating means 51.
Further, the adhesive force reducing means 60 may reduce a part of the adhesive force inside the outer edge portion of the adhesive sheet AS, and is provided only in the vicinity of the outer edge portion without being provided in the central portion in the table 43. Alternatively, it may be provided only in the central portion without being provided in the vicinity of the outer edge portion.
また、供給手段20は、剥離シートRLに仮着された接着シートASの中央部に凹部を形成する凹部形成手段を備えていてもよく、当該凹部手段は、例えば、基材BS及び/又は接着剤AD層側から接着シートASを研削または押圧し、当該接着シートASに凹部を形成するものであってもよい。   Moreover, the supply means 20 may be provided with the recessed part formation means which forms a recessed part in the center part of adhesive sheet AS temporarily attached to peeling sheet RL, and the said recessed part means is the base material BS and / or adhesion | attachment, for example. The adhesive sheet AS may be ground or pressed from the agent AD layer side to form a recess in the adhesive sheet AS.
また、本発明における接着シートASおよび被着体の材質、種別、形状等は、特に限定されることはない。例えば、接着シートASは、円形、楕円形、三角形や四角形等の多角形、その他の形状であってもよいし、感圧接着性、感熱接着性等の接着形態のものであってもよく、感熱接着性の接着シートASが採用された場合は、当該接着シートASを加熱する適宜なコイルヒータやヒートパイプ等の加熱手段を設けるといった適宜な方法で接着されればよい。また、接着シートASは、例えば、接着剤AD層だけの単層のもの、基材BSと接着剤AD層との間に中間層を有するもの、パターンWF2に対応する位置の接着剤AD層の一部または全部が除去されたもの、基材BSの上面にカバー層を有する等3層以上のもの、更には、基材BSを接着剤AD層から剥離することのできる所謂両面接着シートのようなものであってもよく、両面接着シートは、単層又は複層の中間層を有するものや、中間層のない単層又は複層のものであってよい。また、被着体としては、例えば、食品、樹脂容器、シリコン半導体ウエハや化合物半導体ウエハ等の半導体ウエハ、回路基板、光ディスク等の情報記録基板、ガラス板、鋼板、陶器、木板または樹脂板等、任意の形態の部材や物品なども対象とすることができるし、半導体ウエハと環状フレームとで被着体を構成してもよい。なお、接着シートASを機能的、用途的な読み方に換え、例えば、情報記載用ラベル、装飾用ラベル、保護シート、ダイシングテープ、ダイアタッチフィルム、ダイボンディングテープ、記録層形成樹脂シート等の任意の形状の任意のシート、フィルム、テープ等を前述のような任意の被着体に貼付することができる。   Further, the material, type, shape and the like of the adhesive sheet AS and the adherend in the present invention are not particularly limited. For example, the adhesive sheet AS may be a circle, an ellipse, a polygon such as a triangle or a quadrangle, or other shapes, or may be of an adhesive form such as pressure sensitive adhesive or heat sensitive adhesive, When the heat-sensitive adhesive sheet AS is employed, it may be bonded by an appropriate method such as providing a heating means such as an appropriate coil heater or heat pipe for heating the adhesive sheet AS. Also, the adhesive sheet AS is, for example, a single layer having only an adhesive AD layer, an adhesive layer having an intermediate layer between the base material BS and the adhesive AD layer, or an adhesive AD layer at a position corresponding to the pattern WF2. Three or more layers such as a part or all of which is removed, a cover layer on the upper surface of the base material BS, and a so-called double-sided adhesive sheet that can peel the base material BS from the adhesive AD layer The double-sided adhesive sheet may have a single layer or a multi-layer intermediate layer, or may be a single layer or a multi-layer without an intermediate layer. Examples of the adherend include, for example, foods, resin containers, semiconductor wafers such as silicon semiconductor wafers and compound semiconductor wafers, circuit board, information recording substrates such as optical disks, glass plates, steel plates, ceramics, wood plates or resin plates, Arbitrary forms of members and articles can be targeted, and the adherend may be composed of a semiconductor wafer and an annular frame. In addition, the adhesive sheet AS is replaced with a functional and intended reading, for example, any information label, decorative label, protective sheet, dicing tape, die attach film, die bonding tape, recording layer forming resin sheet, etc. Arbitrary sheets, films, tapes and the like can be attached to any adherend as described above.
本発明における手段および工程は、それら手段および工程について説明した動作、機能または工程を果たすことができる限りなんら限定されることはなく、まして、前記実施形態で示した単なる一実施形態の構成物や工程に全く限定されることはない。例えば、供給手段は、接着シートを供給可能なものであれば、出願当初の技術常識に照らし合わせ、その技術範囲内のものであればなんら限定されることはない(他の手段および工程についての説明は省略する)。
また、前記実施形態における駆動機器は、回動モータ、直動モータ、リニアモータ、単軸ロボット、多関節ロボット等の電動機器、エアシリンダ、油圧シリンダ、ロッドレスシリンダおよびロータリシリンダ等のアクチュエータ等を採用することができる上、それらを直接的又は間接的に組み合せたものを採用することもできる(実施形態で例示したものと重複するものもある)。
The means and steps in the present invention are not limited in any way as long as they can perform the operations, functions, or steps described with respect to those means and steps. The process is not limited at all. For example, the supply means is not limited insofar as it can supply an adhesive sheet in light of the common general technical knowledge at the time of filing, and is within the technical scope (for other means and processes). (Description is omitted).
The drive device in the embodiment includes an electric device such as a rotation motor, a linear motion motor, a linear motor, a single axis robot, an articulated robot, an actuator such as an air cylinder, a hydraulic cylinder, a rodless cylinder, and a rotary cylinder. In addition to these, a combination of them directly or indirectly may be employed (some of them overlap with those exemplified in the embodiment).
10 シート貼付装置
20 供給手段
30 押圧手段
40 移動手段
AS 接着シート
WF ウエハ(被着体)
WF1 被着面
WX 第1貼付方向
WY 第2貼付方向
DESCRIPTION OF SYMBOLS 10 Sheet sticking apparatus 20 Supply means 30 Press means 40 Moving means AS Adhesive sheet WF Wafer (Substrate)
WF1 Adhering surface WX First application direction WY Second application direction

Claims (3)

  1. 接着シートを供給する供給手段と、
    前記供給手段から供給された接着シートを被着体に押圧して貼付する押圧手段と、
    前記押圧手段と前記被着体とを当該被着体の被着面に沿って相対移動させる移動手段とを備え、
    前記押圧手段は、前記接着シートの一端から中央部に向かうにしたがって次第に押圧力を低下させ、前記接着シートの中央部から他端に向かうにしたがって次第に押圧力を増加させる押圧力変更動作が可能に設けられ、
    前記移動手段により第1貼付方向に相対移動しつつ、前記押圧力変更動作を行う第1押圧動作と、
    第1貼付方向と交差する第2貼付方向に相対移動しつつ、前記押圧力変更動作を行う第2押圧動作とを行うことを特徴とするシート貼付装置。
    Supply means for supplying an adhesive sheet;
    A pressing unit that presses and adheres the adhesive sheet supplied from the supplying unit to the adherend;
    A moving means for relatively moving the pressing means and the adherend along the adherend surface of the adherend;
    The pressing means can perform a pressing force changing operation that gradually decreases the pressing force from one end of the adhesive sheet toward the central portion and gradually increases the pressing force from the central portion to the other end of the adhesive sheet. Provided,
    A first pressing operation for performing the pressing force changing operation while relatively moving in the first sticking direction by the moving means;
    A sheet pasting apparatus that performs a second pressing operation for performing the pressing force changing operation while relatively moving in a second pasting direction that intersects the first pasting direction.
  2. 前記接着シートの外縁部の接着力を増大させる接着力増大手段を備えていることを特徴とする請求項1に記載のシート貼付装置。   The sheet sticking apparatus according to claim 1, further comprising: an adhesive force increasing unit that increases an adhesive force of an outer edge portion of the adhesive sheet.
  3. 接着シートを供給する工程と、
    供給された接着シートを被着体に押圧して貼付する押圧手段と前記被着体とを前記被着体の被着面に沿って第1貼付方向に相対移動させつつ、前記接着シートの一端から中央部に向かうにしたがって次第に前記押圧手段の押圧力を低下させ、前記接着シートの中央部から他端に向かうにしたがって次第に前記押圧力を増加させる押圧力変更動作を行う第1押圧工程と、
    前記押圧手段と前記被着体とを前記被着面に沿って第1貼付方向と交差する第2貼付方向に相対移動させつつ、前記押圧力変更動作を行う第2押圧工程とを実施することを特徴とするシート貼付方法。
    Supplying an adhesive sheet;
    One end of the adhesive sheet while relatively moving the pressing means for pressing and feeding the supplied adhesive sheet to the adherend and the adherend along the adherend surface of the adherend in the first sticking direction A first pressing step of performing a pressing force changing operation for gradually decreasing the pressing force of the pressing means as it goes from the central portion to the other end, and gradually increasing the pressing force from the central portion to the other end of the adhesive sheet;
    Performing a second pressing step of performing the pressing force changing operation while relatively moving the pressing means and the adherend in a second sticking direction intersecting the first sticking direction along the adherend surface. The sheet sticking method characterized by this.
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* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2021193910A1 (en) * 2020-03-27 2021-09-30 リンテック株式会社 Semiconductor device manufacturing sheet

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH02142156A (en) * 1988-11-22 1990-05-31 Takatori Haitetsuku:Kk Tape sticking apparatus for wafer tray
JP2001244317A (en) * 2000-02-25 2001-09-07 Seiko Epson Corp Apparatus for method for sticking protection tape
JP2003197723A (en) * 2001-12-26 2003-07-11 Nec Kyushu Ltd Device and method for pasting substrate surface protective sheet
JP2012209303A (en) * 2011-03-29 2012-10-25 Lintec Corp Sheet sticking device and sticking method

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH02142156A (en) * 1988-11-22 1990-05-31 Takatori Haitetsuku:Kk Tape sticking apparatus for wafer tray
JP2001244317A (en) * 2000-02-25 2001-09-07 Seiko Epson Corp Apparatus for method for sticking protection tape
JP2003197723A (en) * 2001-12-26 2003-07-11 Nec Kyushu Ltd Device and method for pasting substrate surface protective sheet
JP2012209303A (en) * 2011-03-29 2012-10-25 Lintec Corp Sheet sticking device and sticking method

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2021193910A1 (en) * 2020-03-27 2021-09-30 リンテック株式会社 Semiconductor device manufacturing sheet

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