JP2015173835A - guide wire - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a guide wire having a core shaft, a coil body, a bulge part formed at a tip of the core shaft, and a fixation part for fixing a tip of the coil body and the tip of the core shaft so as to cover the bulge part; where no part of Au components contained in the bulge part moves to solder for forming the fixation part.SOLUTION: The guide wire includes: a core shaft 2; a coil body 3 for covering the core shaft 2; a bulge part 5 formed at a tip of the core shaft 2 by first metal solder; a fixation part 6 formed by second metal solder which fixes a tip of the coil body 3 and the tip of the core shaft 2 so as to cover the bulge part 5; and a barrier layer 8 formed between the bulge part 5 and the fixation part 6 to cover an outer periphery of the bulge part 5 so that material transfer between the bulge part 5 and the fixation part 6 is prevented.

Description

  The present invention relates to a guide wire.

  Conventionally, various guide wires have been proposed that are inserted into tubular organs such as blood vessels, gastrointestinal tracts, and ureters and body tissues, and used to guide medical devices and the like to target sites.

  For example, in Patent Document 1, a core shaft, a coil body that covers the core shaft, a bulging portion formed at the tip of the core shaft, a tip of the coil body, and a tip of the core shaft are covered with the bulging portion. A guide wire provided with a fixing portion that is fixed to the head is described.

Here, the bulging portion is formed of a material having higher rigidity than the fixing portion, specifically, an Au-containing solder containing 80 mass% or more of an Au component, for example, an Au—Sn solder.
On the other hand, the fixing portion is formed of solder having a melting point lower than that of the solder forming the bulging portion, for example, Ag—Sn solder.

  According to the guide wire described in Patent Document 1, the tip of the core body and the tip of the core shaft are fixed by the fixing portion so as to cover the bulging portion. It is said that the fixing strength can be increased.

  Further, Patent Document 2 discloses a guide wire including a core shaft, a coil body that covers the core shaft, and a most advanced portion formed of metal solder that fixes the tip portion of the core shaft and the tip portion of the coil body. The metal solder is formed of a first metal solder and a second metal solder adjacent to the front end side of the first metal solder, and the first metal solder is more than the second metal solder. A guide wire with a high melting point and hardness is described.

  This Patent Document 2 describes Au—Sn solder as the first metal solder having a high melting point and hardness for the combination of the first metal solder and the second metal solder. An Ag—Sn solder is described as the metal solder.

  According to the guide wire described in Patent Document 2, the first metal solder can surely prevent the second metal solder from flowing out to the proximal end side of the first metal solder, so that the most distal portion of the guide wire Can be stably manufactured, and the fixing strength between the core shaft and the coil body can be secured.

JP2012-152478A JP2013-13448A

However, when the bulging portion is formed of Au-containing solder in the guide wire described in Patent Document 1, the tip of the coil body and the tip of the core shaft are soldered (for example, Ag-Sn solder) so as to cover the bulging portion. ), It is considered that a part of the Au component contained in the bulging portion moves to the solder for forming the fixing portion and is diffused into the fixing portion. It is also conceivable that the Au-containing solder that forms the bulging portion melts and mixes with the solder for forming the fixed portion. In such a case, a guide wire having a target fixing structure cannot be produced.

In the guide wire described in Patent Document 2, the distal end portion of the core shaft and the distal end portion of the coil body are fixed with a first metal solder (for example, Au—Sn solder) to form the proximal end side most advanced portion. Then, when the second metal solder (for example, Ag-Sn solder) is poured into the distal end side of the proximal end most distal portion to form the distal end distal end portion, the proximal end most distal portion (first It is conceivable that a part of the Au component contained in the first metal solder moves to the second metal solder and diffuses into the tip end side most distal part. It is also conceivable that the first metal solder that forms the proximal end side most distal end portion melts and mixes with the second metal solder. In such a case, a guide wire having a target fixing structure cannot be produced.
In general, Au has the property of being easily dissolved in other metals, and it is called gold cracking that Au is dissolved in other metals.

The present invention has been made in view of such problems.
The first object of the present invention is to provide a guide wire having a structure as described in Patent Document 1, when the tip of the coil body and the tip of the core shaft are secured to the Au component contained in the bulging portion. A part of the solder moves to the solder for forming the fixing part and is diffused in the fixing part, or the Au-containing solder forming the bulging part melts and is mixed with the solder for forming the fixing part. An object of the present invention is to provide a highly safe guide wire having an increased fixing strength between a core shaft and a coil body.

  The second object of the present invention is contained in the first metal solder in fixing the tip of the coil body and the tip of the core shaft in the guide wire having a structure as described in Patent Document 2. Part of the Au component moves to the second metal solder and is not diffused, or the first metal solder and the second metal solder are not mixed, and the bending rigidity of the tip portion is more than necessary. An object of the present invention is to provide a guide wire that can secure the fixing strength between the core shaft and the coil body without increasing the length.

(1) The guide wire of the present invention (the first invention) includes a core shaft, a coil body that covers the core shaft, a bulge portion that is formed of a first metal solder at the tip of the core shaft, and the coil A fixing portion formed of a second metal solder for fixing the tip of the body and the tip of the core shaft so as to cover the bulging portion; and the bulging portion and the fixing so as to cover an outer periphery of the bulging portion. And a barrier layer formed between the two portions.

(2) The guide wire of the present invention (second invention) includes a core shaft, a coil body that covers the core shaft, and a forefront portion that fixes the tip of the core shaft and the tip of the coil body. The guide wire, wherein the most distal end portion is a proximal end most distal portion made of a first metal solder, and a distal end side made of a second metal solder located on the distal end side of the proximal end most distal portion. It is formed from the most advanced part and the barrier layer formed between the said proximal end most advanced part and the said front end most advanced part.

(3) In the guide wire of the present invention, it is preferable that the first metal solder is an Au-containing solder, and the second metal solder is a solder having a melting point lower than that of the first metal solder.

(4) In the guide wire of the present invention, it is preferable that the first metal solder is Au—Sn solder and the second metal solder is Ag—Sn solder.

(5) In the guide wire of the present invention, the barrier layer is preferably made of a resin material that can be used at a temperature higher than the melting point of the second metal solder.
(6) In the guide wire of the present invention, the barrier layer is preferably a sputtered layer made of a metal having a melting point higher than that of the second metal solder.

(7) In the guide wire of the present invention (second invention), the barrier layer is preferably a plate material made of a metal having a melting point higher than that of the second metal solder.

(1) The guide wire of the present invention (first invention) includes a bulging portion and a fixing portion between a bulging portion formed of the first metal solder and a fixing portion formed of the second metal solder. Since a barrier layer that prevents mass transfer between the coil body and the tip of the core shaft is fixed, a part of the Au component contained in the bulging portion forms a fixing portion. The first metal solder that moves to the second metal solder to be diffused and diffused into the fixing part or melts and mixes with the second metal solder to form the fixing part by melting. There is nothing to do.
Therefore, the guide wire of the present invention (first invention) has a high safety because the fixing strength between the core shaft and the coil body is reliably increased.

(2) In the guide wire of the present invention (second invention), the most distal end portion that fixes the distal end of the core shaft and the distal end of the coil body is formed on the proximal end side most distal end portion formed of the first metal solder, Since a barrier layer for preventing mass transfer between the proximal end side distal end portion and the distal end side distal end portion is provided between the distal end side distal end portion formed of the second metal solder, the coil body When fixing the tip of the core and the tip of the core shaft, a part of the Au component contained in the proximal end side most distal portion moves to the second metal solder for forming the distal end side most distal portion. Thus, the first metal solder that forms the proximal end side most distal portion and the second metal solder that forms the distal end most distal portion are not mixed in the fixing portion. .
Therefore, the guide wire of the present invention (the second invention) can secure the fixing strength between the core shaft and the coil body without increasing the bending rigidity more than necessary with respect to the tip portion thereof.

1 is an overall view of a guide wire showing an embodiment of the present invention (embodiment of the first invention). It is a general view of the guide wire which shows other embodiment (embodiment of 2nd invention) of this invention.

<First Embodiment>
FIG. 1 is an overall view showing a guide wire according to a first embodiment of the present invention.
The guide wire 1 of the present embodiment includes a core shaft 2, a coil body 3 that covers the core shaft 2, a bulging portion 5 that is formed of a first metal solder that is Au-containing solder at the tip of the core shaft 2, A fixing portion 6 formed of a second metal solder having a melting point lower than that of the first metal solder, which fixes the tip of the coil body 3 and the tip of the core shaft 2 so as to cover the bulging portion 5, and a bulging portion 5 is formed between the bulging portion 5 and the fixing portion 6 so as to cover the outer periphery of the bulge 5, and the mass transfer between the bulging portion 5 and the fixing portion 6 (for example, Au from the bulging portion 5 to the fixing portion 6). And a barrier layer 8 for preventing movement of components.

  A guide wire 1 according to this embodiment shown in FIG. 1 includes a core shaft 2 and a coil body 3 that covers the tip of the core shaft 2.

  The core shaft 2 includes a large-diameter portion 2a, a tapered portion 2b that is located at the distal end of the large-diameter portion 2a and whose outer diameter decreases in the distal direction, and a small-diameter portion 2c that is located at the distal end of the tapered portion 2b. have.

  A bulging portion 5 and a barrier layer 8 that covers the outer periphery of the bulging portion 5 are provided at the distal end portion of the small diameter portion 2 c of the core shaft 2, and the distal end of the small diameter portion 2 c of the core shaft 2 and the coil body 3 are provided. Is fixed by the fixing portion 6 so as to cover the bulging portion 5 via the barrier layer 8.

The distal end of the large-diameter portion 2 a of the core shaft 2 and the proximal end of the coil body 3 are fixed by a proximal end bonding portion 9.
Further, the intermediate part of the small diameter part 2 c of the core shaft 2 and the intermediate part of the coil body 3 are fixed via an intermediate bonding part 7.

  As described above, the guide wire 1 has the bulging portion 5 formed at the tip of the small-diameter portion 2 c of the core shaft 2, the barrier layer 8 is formed so as to cover the outer periphery of the bulging portion 5, and the thinness of the core shaft 2. The distal end of the diameter portion 2 c and the distal end of the coil body 3 are fixed by the fixing portion 6 so as to cover the bulging portion 5 through the barrier layer 8.

  The material for forming the core shaft 2 is not particularly limited. For example, a material such as stainless steel (SUS304), a superelastic alloy such as a Ni—Ti alloy, or a piano wire can be used.

  As a material for forming the coil body 3, a wire having radiopacity or a wire having radiolucency can be used.

The material of the wire having radiopacity is not particularly limited. For example, gold, platinum, tungsten, or an alloy containing these elements (for example, platinum-nickel alloy) is used. Can do.
Further, the material of the wire having radiation transparency is not particularly limited, but for example, stainless steel (SUS304, SUS316, etc.), super elastic alloy such as Ni-Ti alloy, piano wire, or the like is used. be able to.

Moreover, you may form the coil body 3 from a radiopaque strand and a radiation transparent strand. In this case, for example, the coil body 3 on the distal end side with respect to the intermediate bonding portion 7 is formed with a radiopaque element wire, and the coil body 3 on the proximal end side with respect to the intermediate bonding portion 7 is formed with a radiation transmission element wire. Can be formed. The radiopaque strand and the radiolucent strand may contact each other's end surfaces and be fixed by welding, or may be fixed by covering the contacted portion with the intermediate adhesive portion 7. May be.
Thereby, the visibility of the coil body 3 on the distal end side of the intermediate bonding portion 7 under radioscopy is improved, so that the position of the distal end portion of the guide wire 1 can be grasped. As a result, the surgeon can safely operate the guide wire 1.

The bulging portion 5 is formed of first metal solder that is Au-containing solder. The Au-containing solder here is a solder containing even a little, and may contain an element other than Au.
The Au-containing solder can easily produce the bulging portion 5 while ensuring the fixing strength of the bulging portion 5 to the small diameter portion 2 c of the core shaft 2.

  Examples of the first metal solder forming the bulging portion 5 include Au solder, pure gold solder, Au—Ge solder, Au—Si solder, Au—In solder, Au—Sb solder, Au—Sn solder, and the like. Au-Pb solder, Au-Ag-Sn solder, Au-Sn-Pb solder, Au-Cu-Pd solder, Au-Sn-Wo solder, Au-Sn-Mo solder, Au- Sn—Co—P solder, Au—Sn—Co—Ge solder, Au—Sn—Bi—In solder, Au—Cu—Pd—Ag solder, Au—Ag—Cu—Sn—In solder, Including three or more metal components such as Au-Ag-Cu-Sn-Ga solder, Au-Cu-Ni-Ag-In-Sn solder, Au-Pd-In-Cu-Zn-Re-Ag solder Solder etc. Rukoto can may be used in combination alone, or two or more kinds.

The first metal solder in which the content ratio of the Au component is 60% by mass or more can form the bulging portion 5 that has high rigidity and is difficult to be deformed, so that the tip of the small-diameter portion 2c of the core shaft 2 and the coil body 3 can be formed. It is possible to strongly fix the tip of the.
Thereby, it can further prevent that the coil body 3 of the guide wire 1 detaches | leaves from the small diameter part 2c of the core shaft 2, and can improve the safety | security of the guide wire 1 further.

In addition, since the first metal solder in which the content ratio of the Au component is 60% by mass or more also has high radiopacity, the distal end of the guide wire 1 is clearly imaged by radiographic imaging. Therefore, it becomes easy for the surgeon to visually recognize the position of the guide wire 1, and the surgeon can safely operate the guide wire 1.
It is preferable that melting | fusing point of the 1st metal solder which forms the bulging part 5 is 280-370 degreeC.

  In addition, when forming the bulging part 5 in the small diameter part 2c of the core shaft 2 using the first metal solder, the flux is previously applied to the part where the bulging part 5 of the small diameter part 2c of the core shaft 2 is formed. By applying it, the fixing strength between the core shaft 2 and the bulging portion 5 formed from the first metal solder can be increased.

As the second metal solder for forming the fixing portion 6, Ag-Sn solder, Ag-In solder, In-Sn solder, Ag-Pb solder, Pb-Sn solder, In-Sb solder Solder, Sn—Sb solder and Pb—In solder, Sn—Pb—Ag solder, Pb—Ag—Sn solder, Pb—Ag—In solder, In—Sn—Pb—Ag solder, Examples of the solder include three or more metal components such as Ag-Cu-Ni-P solder. Among these, Ag-Sn solder is preferably used.
In the Ag—Sn solder for forming the fixing portion 6, the mass ratio of the Ag component to the Sn component is preferably 2 to 5:98 to 95.

The second metal solder for forming the fixing portion 6 has a lower melting point than the first metal solder for forming the bulging portion 5.
Here, the melting point of the second metal solder for forming the fixing portion 6 is preferably 221 to 250 ° C.

  Since the melting point of the second metal solder for forming the fixing part 6 is lower than the melting point of the first metal solder forming the bulging part 5, the fixing part 6 is prevented from being deformed. Can be formed. Further, the distal end of the small diameter portion 2c of the core shaft 2 and the distal end of the coil body 3 are firmly fixed while suppressing the thermal influence on the small diameter portion 2c of the core shaft 2 and the coil body 3 by the second metal solder. be able to.

  In addition, when forming the fixing | fixed part 6 using a 2nd metal solder, a flux is previously apply | coated to the location which forms the small diameter part 2c of the core shaft 2, and the fixing | fixed part 6 of the coil body 3. FIG. Is preferred. Thereby, the adhering strength between the tip of the small diameter portion 2c of the core shaft 2 and the tip of the coil body 3 can be increased.

  As shown in FIG. 1, the barrier layer 8 is formed so as to cover the outer periphery of the bulging portion 5, and the outer periphery of the barrier layer 8 is covered with the fixing portion 6. That is, the barrier layer 8 is interposed between the bulging portion 5 and the fixing portion 6 so that the fixing portion 6 (second metal solder) does not directly contact the outer periphery of the bulging portion 5 (first metal solder). Is formed.

The barrier layer 8 has a function of preventing mass transfer between the bulging portion 5 (first metal solder) and the fixing portion 6 (second metal solder).
The barrier layer 8 can prevent mass transfer between the bulging portion 5 and the fixing portion 6 even under a temperature condition equal to or higher than the melting point of the second metal solder.

  Specifically, when the tip of the coil body 3 and the tip of the core shaft 2 are fixed, a second metal solder for forming a fixed portion 6 by a part of the Au component contained in the bulging portion 5 The first metal solder for forming the bulging portion 5 and the second metal solder for forming the fixing portion 6 are prevented from being mixed with each other.

  The barrier layer 8 is required to have good adhesion to the solder material and heat resistance that can withstand the temperature conditions when the tip of the coil body 3 and the tip of the core shaft 2 are fixed.

As a constituent material of the barrier layer 8, a resin material that can be used at a temperature higher than the melting point of the second metal solder, preferably higher than the melting point of the first metal solder can be suitably used. That is, the barrier layer 8 can use a material that does not melt at the melting point of the second metal solder.
Examples of such a resin material include a thermosetting resin typified by an epoxy resin. As a commercial product of such a resin material, a heat-resistant epoxy adhesive “Duralco 4460 (usable temperature: 315 ° C.)” , “Same 4700 (Usable temperature: 315 ° C.)”, “Same 4703 (Usable temperature: 370 ° C.)” (Taiyo Gold Steel Co., Ltd.).

  By using the above resin material as the constituent material of the barrier layer 8, the movement of the Au component from the bulging portion 5 (first metal solder) to the fixing portion 6 (second metal solder) is completely achieved. Can be blocked.

The barrier layer 8 is formed by sputtering a metal having a melting point higher than that of the second metal solder, preferably a metal having a melting point higher than that of the first metal solder, on the outer periphery of the bulging portion 5. It may be a sputter layer to be formed.
Here, Ni, Mo, and W can be mentioned as suitable metals for forming the barrier layer 8 (sputter layer).

  Here, the first metal solder for forming the bulging portion 5, the second metal solder for forming the fixing portion 6, and the barrier layer 8 positioned between the bulging portion 5 and the fixing portion 6 are formed. As an example of a preferable combination with the material, a combination in which the first metal solder is Au—Sn solder, the second metal solder is Ag—Sn solder, and the barrier layer is an epoxy resin can be cited. .

  A proximal end bonding portion 9 for fixing the distal end of the large diameter portion 2a of the core shaft 2 and the proximal end of the large diameter portion 3a of the coil body 3, an intermediate portion of the small diameter portion 2c of the core shaft 2 and an intermediate portion of the coil body 3 The material for forming the intermediate bonding portion 7 that adheres to each other is not particularly limited. For example, aluminum alloy brazing, silver brazing, gold brazing, zinc, Ag—In alloy, In—Sn alloy, Ag— Synthetic resins such as metal solder such as Sn alloy, Au—Sn alloy, Au—Si alloy, polyethylene, polypropylene, polyamide, various elastomer materials, or adhesives such as epoxy resin can be used.

  Moreover, when assembling each component with metal solder, it is preferable to apply a flux in advance to the position where the fixing is performed. Thereby, the wettability between the metal solder and each component becomes good, and the fixing strength increases.

  Further, when the core shaft 2 and the coil body 3 are fixed by the fixing portion 6, the intermediate bonding portion 7, and the proximal end bonding portion 9, the coil body 3 corresponding to a place where each fixing point is formed. By forming a gap between each of the coil wires in advance, a resin member or metal solder can enter, and the fixing strength of the core shaft 2 to the coil body 3 can be increased.

The guide wire 1 of this embodiment can be produced by the following method.
First, a coil element wire constituting the coil body 3 is wound around a core body for producing a coil body to form the coil body 3 on the outer periphery of the core metal. Then, the coil body 3 is produced by pulling out the cored bar.
In addition, after winding the wire of the coil body 3 around the core metal for coil body production, in order to maintain the shape of the coil body 3, heat treatment is performed, so that the wire of the coil body 3 is for coil body production. You may relieve the stress which generate | occur | produces when it winds around the metal core.

  Next, the core shaft 2 is formed by grinding the large diameter portion 2a, the tapered portion 2b, and the small diameter portion 2c using a centerless polishing machine or the like.

  Next, the distal end of the small diameter portion 2 c of the core shaft 2 is inserted from the proximal end side of the coil body 3 so that the distal end of the small diameter portion 2 c of the core shaft 2 is positioned in the distal direction relative to the distal end of the coil body 3. The coil body 3 is disposed on the side.

  Next, a flux is applied to the tip of the small diameter portion 2c of the core shaft 2, and then the first metal solder is applied using a soldering iron to the tip of the small diameter portion 2c of the core shaft 2 to which the flux is applied. The bulging part 5 is formed by hitting the part.

  Next, a thermosetting resin (barrier layer forming material) is applied so as to cover the outer periphery of the bulging portion 5 formed at the tip of the small-diameter portion 2c of the core shaft 2, and the coating film is heated and cured. The barrier layer 8 is formed.

  Next, the coil body 3 is moved in the distal direction so that flux is applied to the proximal end of the coil body 3 and the distal end of the large-diameter portion 2a of the core shaft 2, and a proximal end adhesive portion composed of metal solder. 9, the proximal end of the coil body 3 and the distal end of the large-diameter portion 2 a of the core shaft 2 are fixed.

  Next, flux is applied to the intermediate portion of the small-diameter portion 2c of the core shaft 2 and the intermediate portion of the coil body 3, and then the small-diameter of the core shaft 2 is formed by the intermediate bonding portion 7 made of metal solder. The intermediate part of the part 2c and the intermediate part of the coil body 3 are fixed.

  Finally, flux is applied to the tip of the small-diameter portion 2c of the core shaft 2 provided with the barrier layer 8 and the bulging portion 5 and the tip of the coil body 3, and thereafter, using a soldering iron, By fixing the tip of the small-diameter portion 2c of the core shaft 2 and the tip of the coil body 3 so as to cover the bulging portion 5 via the barrier layer 8 with the metal solder 2, the fixing portion 6 is formed. The wire 1 can be produced.

  When the bulging portion 5 is smaller than the coil inner diameter of the coil body 3, the bulging portion 5 may be formed before the core shaft 2 is inserted into the coil body 3.

According to the guide wire 1 of the present embodiment, the bulging portion 5 and the fixing portion 6 are provided between the bulging portion 5 formed of the first metal solder and the fixing portion 6 formed of the second metal solder. Since the barrier layer 8 that prevents mass transfer between the coil body 3 and the core shaft 2 is fixed, the Au component (first metal) contained in the bulging portion 5 is secured. A part of the Au component derived from the solder moves to the second metal solder for forming the fixing portion 6 and diffuses into the fixing portion 6 or forms the bulging portion 5. Does not melt and mix with the second metal solder for forming the fixing portion 6.
Therefore, the guide wire 1 of the present embodiment has a high safety because the fixing strength between the core shaft 2 and the coil body 3 is reliably increased.

In addition, this invention (1st invention) is not limited to embodiment mentioned above, A various change by those skilled in the art is possible within the technical thought of this invention.
For example, in FIG. 1, the end surface of the tip of the small-diameter portion 2 c of the core shaft 2 is coincident with the tip of the bulging portion 5. The bulging portion 5 may be provided so as to cover the end surface, and the bulging portion 5 may be provided at a position shifted in the proximal direction from the end surface of the distal end of the small diameter portion 2 c of the core shaft 2.

Second Embodiment
FIG. 2 is an overall view showing a guide wire according to a second embodiment of the present invention.
The guide wire 21 of the present embodiment is a guide wire that includes a core shaft 22, a coil body 23 that covers the core shaft 22, and a leading end portion 25 that fixes the tip of the core shaft 22 and the tip of the coil body 23. The most distal end portion 25 includes a proximal end most distal end portion 25a made of the first metal solder and a lower melting point than the first metal solder located on the distal end side of the proximal end most distal end portion 25a. The distal end side most distal end portion 25b made of two metal solders, and the proximal end most distal end portion 25a and the distal end side most distal end portion 25b. And a barrier layer 25c for preventing mass transfer between them.

In FIG. 2, the guide wire 21 includes a core shaft 22 and a coil body 23 that covers the tip of the core shaft 22.
The core shaft 22 and the coil body 23 are fixed by the most distal end portion 25, the intermediate fixing portion 27, and the proximal end fixing portion 29.

  The most advanced portion 25 is a proximal end most distal portion 25a formed of a first metal solder that is an Au-containing solder, and the first metal solder so as to be positioned on the distal end side of the proximal end most distal portion 25a. Formed between the distal-end most distal portion 25b formed of the second metal solder having a lower melting point and the proximal-end most distal portion 25a and the distal-end most distal portion 25b. And a barrier layer 25c that prevents mass transfer between the tip end most distal portion 25b.

The first metal solder that forms the proximal end most distal end portion 25a is an Au-containing solder.
Specific examples of the first metal solder include Au solder (gold solder), pure gold solder, Au—Ge solder, Au—Si solder, Au—In solder, Au—Sb solder, Au—Sn solder. And Au-Pb solder, Au-Ag-Sn solder, Au-Sn-Pb solder, Au-Cu-Pd solder, Au-Sn-Wo solder, Au-Sn-Mo solder, Au -Sn-Co-P solder, Au-Sn-Co-Ge solder, Au-Sn-Bi-In solder, Au-Cu-Pd-Ag solder, Au-Ag-Cu-Sn-In solder , Au-Ag-Cu-Sn-Ga solder, Au-Cu-Ni-Ag-In-Sn solder, Au-Pd-In-Cu-Zn-Re-Ag solder, etc. Including solder Rukoto can may be used in combination alone, or two or more kinds.

  The second metal solder forming the distal end side most distal portion 25b is a solder having a melting point lower than that of the first metal solder.

  Specific examples of the second metal solder include Ag-Sn solder, Ag-In solder, In-Sn solder, Ag-Pb solder, Pb-Sn solder, In-Sb solder, Sn-Sb. Solder and Pb-In solder, Sn-Pb-Ag solder, Pb-Ag-Sn solder, Pb-Ag-In solder, In-Sn-Pb-Ag solder, Ag-Cu-Ni Examples thereof include solder containing three or more metal components such as -P based solder, and among these, Ag-Sn based solder is preferably used.

  In general, the first metal solder having a high melting point and hardness tends to decrease the fluidity after melting as compared with the second metal solder having a low melting point and hardness. Thereby, as the order of forming the most distal end portion 25, the proximal end most distal end portion 25a composed of the first metal solder is formed, and then the distal end side most distal portion 25b composed of the second metal solder is formed. In order.

  As shown in FIG. 2, the barrier layer 25c is formed between the proximal end side most distal end portion 25a and the distal end side most distal end portion 25b, and this barrier layer 25c causes the proximal end most distal end portion 25a (first end). It is possible to avoid direct contact between the distal end of the first metal solder) and the proximal end of the distal end side most distal portion 25b (second metal solder).

The barrier layer 25c has a function of preventing mass transfer between the proximal end side most distal portion 25a (first metal solder) and the distal end side most distal portion 25b (second metal solder).
Specifically, the tip of the coil body 3 and the tip of the core shaft 2 are fixed with the first metal solder to form the proximal end most distal portion 25a, and then the distal end of the proximal end most distal portion 25a. Au component contained in the proximal end side most advanced portion (first metal solder) when the second metal solder is poured into the side (the distal end side of the barrier layer 25c) to form the distal end side most advanced portion 25b Is prevented from moving to the second metal solder, and the first metal solder and the second metal solder are prevented from being mixed.

  The barrier layer 25c is required to have good adhesion to the solder material and heat resistance that can withstand the temperature conditions when the tip of the coil body 3 and the tip of the core shaft 2 are fixed.

As a constituent material of the barrier layer 25c, a resin material that can be used at a temperature higher than the melting point of the second metal solder, preferably higher than the melting point of the first metal solder can be suitably used. That is, the barrier layer 25c can use a material that does not melt at the melting point of the second metal solder.
Examples of such resin materials include thermosetting resins typified by epoxy resins. As commercially available products of such resin materials, heat-resistant epoxy adhesives “Duralco 4460”, “4700”, “same” 4703 "(above, manufactured by Taiyo Gold Steel Co., Ltd.).

  According to the use of the above resin material as the constituent material of the barrier layer 25c, the proximal end side most distal portion 25a (first metal solder) to the distal end side most distal portion 25b (second metal solder). The movement of the Au component to can be completely blocked.

The constituent material of the barrier layer 25c is a metal having a melting point higher than the melting point of the second metal solder, preferably a metal having a melting point higher than the melting point of the first metal solder, and the tip of the proximal end side most distal portion 25a. It may be a sputtered layer formed by sputtering on the side.
Examples of suitable metals for forming the barrier layer 25c (sputter layer) include Ni, Mo, and W.

The constituent material of the barrier layer 25c may be a plate material made of a metal having a melting point higher than that of the second metal solder, preferably a metal having a melting point higher than that of the first metal solder.
Here, stainless steel can be used as a suitable metal for forming the barrier layer 25c (plate material).

  Here, a preferred combination of the first metal solder that forms the proximal end side most distal portion 25a, the second metal solder that forms the distal end side most distal portion 25b, and the material that forms the barrier layer 25c. As an example, a combination in which the first metal solder is Au—Sn solder, the second metal solder is Ag—Sn solder, and the barrier layer is an epoxy resin can be cited.

  In the guide wire 21 of the present embodiment, the most distal end portion 25 for fixing the core shaft 22 and the coil body 23 includes a proximal end distal end portion 25a made of a first metal solder, and a proximal end distal end portion 25a. The barrier layer 25c adjacent to the tip end side and the tip end side most distal end portion 25b made of the second metal solder adjacent to the tip end side of the barrier layer 25c, and the first metal solder is the second metal solder. Since the melting point is higher than that of the first metal solder, it is possible to reliably prevent the second metal solder from flowing out to the base end side of the first metal solder. Thus, the fixing strength between the core shaft 22 and the coil body 23 can be ensured. Further, since the fixing strength between the core shaft 22 and the coil body 23 can be ensured, the length of the guide wire 21 in the long axis direction at the most distal end portion 25 can be shortened, whereby the bending rigidity of the distal end of the guide wire 21 can be reduced. It is also possible to prevent an increase in.

  Further, the proximal end side most distal portion 25a and the distal end side are disposed between the proximal end side most distal portion 25a formed of the first metal solder and the distal end side most distal portion 25b formed of the second metal solder. Since the barrier layer 25c that prevents mass transfer between the distal end portion 25b and the distal end of the coil body 3 and the distal end of the core shaft 2 is fixed, it is contained in the proximal end side distal end portion 25a. A part of the Au component (Au component derived from the first metal solder) moves to the second metal solder for forming the tip-side most distal portion 25b and diffuses to the tip-side most distal portion 25b In other words, the first metal solder forming the proximal end side most distal portion 25a is not melted and mixed with the second metal solder for forming the distal end side most distal portion 25b.

  Examples of the material for forming the core shaft 22 include materials such as stainless alloys (SUS302, SUS304, SUS316, etc.), superelastic alloys such as Ni-Ti alloys, piano wires, nickel-chromium alloys, cobalt alloys, and tungsten. It can be used, and other known materials can also be used.

  As a material for forming the coil body 23, for example, a stainless steel alloy (SUS302, SUS304, SUS316, etc.), a superelastic alloy such as a Ni—Ti alloy, a piano wire, a nickel-chromium alloy, a radiation transparent alloy such as a cobalt alloy, etc. Radiopaque alloys such as metal gold, platinum, tungsten, or alloys containing these elements (for example, platinum-nickel alloys) can be used, and other known materials can also be used.

The intermediate fixing part 27 and the base end fixing part 29 are formed of metal solder.
Examples of the metal solder material include Sn—Zn—Al alloy solder (melting point: about 200 ° C.), Sn—Ag—Cu alloy solder (melting point: about 210 ° C.), Sn—Ag alloy solder (melting point: about 220 ° C.). ° C), Sn-Cu alloy solder (melting point: about 230 ° C), Au-Sn alloy solder (melting point: about 300-380 ° C), Au-Si alloy solder (melting point: about 360 ° C), Ag-Cu-In alloy Examples thereof include wax (melting point: about 580 ° C.), silver wax (melting point: about 600 to 700 ° C.), and the like. In addition, known materials can be used.

Since the hardness of metal solder having a high melting point tends to be generally higher than that of metal solder having a low melting point, the hardness of the first metal solder having a higher melting point than that of the second metal solder is The hardness of the second metal solder is higher than that of the second metal solder, so that the fixing strength between the core shaft 22 and the coil body 23 can be secured.
Further, when the core shaft 22 and the coil body 23 are fixed using the first metal solder or the second metal solder, a flux is previously applied to the fixed portion of the core shaft 22 and the coil body 23, By applying flux to the first metal solder and the second metal solder, the wettability of the first metal solder with respect to the core shaft 22 and the coil body 23 and the second metal solder with respect to the core shaft 22 and the coil body 23 And the adhesion strength between the core shaft 22 and the coil body 23 can be improved.

  In addition, since the most distal portion 25 of the guide wire 21 of the present embodiment forms the distal most distal portion 25b with the second metal solder having a low melting point and hardness, a heat source such as a soldering iron, or The shape of the most distal portion 25 (the distal end most distal portion 25b) can be easily adjusted by a grinding / polishing tool such as a leuter. Thereby, the productivity of the most advanced portion 25 of the guide wire 21 can be improved.

The guide wire 21 of this embodiment can be manufactured by the following method.
First, the outer periphery of the tip of the core shaft 22 is ground by a centerless grinder to produce the core shaft 22 with the outer diameter of the tip reduced.
Next, the metal wire used as the material of the coil body 23 is wound around the core metal for the coil, and then, the metal wire is wound around the core metal for the coil to produce the coil body 23. Moreover, you may heat-process after winding as needed.
Next, the distal end of the core shaft 22 is inserted from the proximal end side of the coil body 23, and the proximal end of the coil body 23 and the core shaft 22 are secured by metal solder to form the proximal end securing portion 29.

  Next, the distal end portion of the core shaft 22 and the distal end portion of the coil body 23 are fixed with a first metal solder (eg, Au—Sn solder) to form the proximal end side most distal end portion 25a.

  Next, a barrier layer 25c is formed by pouring a thermosetting resin (a material for forming a barrier layer) into the distal end side of the proximal end side most distal end portion 25a and heat-curing the formed resin layer.

  Next, a second metal solder (eg, Ag—Sn solder) is poured into the front end side of the barrier layer 25c to form the front end side most distal portion 25b.

Next, the core shaft 22 and the intermediate portion of the coil body 23 are fixed with metal solder to form an intermediate fixing portion 27. Finally, each of the most distal end portion 25, the intermediate fixing portion 27, and the proximal end fixing portion 29 is formed. The guide wire 21 can be produced by adjusting the shape of the fixing portion with a polishing tool such as a leuter.
The guide wire 21 is not limited to this manufacturing method, and may be manufactured using a known method and means.

DESCRIPTION OF SYMBOLS 1 Guide wire 2 Core shaft 2a Large diameter part 2b Tapered part 2c Small diameter part 3 Coil body 5 Bulging part 6 Adhering part 8 Barrier layer 7 Intermediate adhesion part 9 Base end adhesion part 21 Guide wire 22 Core shaft 23 Coil body 25 Most advanced Part 25a Base end side most advanced part 25b Tip side most advanced part 25c Barrier layer 27 Intermediate fixing part 29 Base end fixing part

Claims (15)

A core shaft;
A coil body covering the core shaft;
A bulge portion formed of a first metal solder that is Au-containing solder at the tip of the core shaft;
A fixing portion formed of a second metal solder having a melting point lower than that of the first metal solder, which fixes the tip of the coil body and the tip of the core shaft so as to cover the bulging portion;
A guide wire comprising a barrier layer formed of a material that is formed between the bulging portion and the fixing portion so as to cover the outer periphery of the bulging portion and does not melt at the melting point of the second metal solder. The guide wire according to claim 1, wherein the material is a material that does not melt at a melting point of the first metal solder. A core shaft;
A coil body covering the core shaft;
A guide wire having a leading edge for fixing the tip of the core shaft and the tip of the coil body;
The most advanced part is a proximal end most advanced part made of a first metal solder which is Au-containing solder,
A distal-end most distal portion made of a second metal solder having a melting point lower than that of the first metal solder, located on the distal end side of the proximal-end most distal portion;
A guide wire including a barrier layer formed between the proximal end side most distal portion and the distal end side most distal portion and formed of a material that does not melt at the melting point of the second metal solder. The guide wire according to claim 3, wherein the material is a material that does not melt at a melting point of the first metal solder. A core shaft;
A coil body covering the core shaft;
A bulging portion formed of a first metal solder at the tip of the core shaft;
A fixing portion formed of a second metal solder for fixing the tip of the coil body and the tip of the core shaft so as to cover the bulging portion;
A guide wire comprising: a barrier layer formed between the bulging portion and the fixing portion so as to cover an outer periphery of the bulging portion. A core shaft;
A coil body covering the core shaft;
A guide wire having a leading edge for fixing the tip of the core shaft and the tip of the coil body;
The most advanced portion is a proximal end most advanced portion made of a first metal solder,
A distal-end most distal portion made of a second metal solder, located on the distal-end side of the proximal-end most distal portion;
A guide wire formed from the proximal end side most distal end portion and the distal end side most distal end portion.   The guide wire according to claim 6, wherein the barrier layer is formed of a metal plate.   The guide wire according to claim 5 or 6, wherein the barrier layer is formed of a sputter layer made of metal.   The guide wire according to claim 5 or 6, wherein the barrier layer is formed of a resin.   The guide wire according to claim 5, wherein the first metal solder is Au-containing solder.   The guide wire according to any one of claims 5 to 10, wherein the second metal solder is solder having a melting point lower than that of the first metal solder.   The guide wire according to any one of claims 5 to 11, wherein the first metal solder is Au-Sn solder.   The guide wire according to any one of claims 5 to 12, wherein the second metal solder is an Ag-Sn solder.   The guide wire according to claim 5, wherein the barrier layer is made of a resin material that does not melt at the melting point of the first metal solder. The guide wire according to any one of claims 5 to 14, wherein the barrier layer is formed of a resin material that does not melt at a melting point of the second metal solder.

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