JP2015168886A - メッキ装置 - Google Patents
メッキ装置 Download PDFInfo
- Publication number
- JP2015168886A JP2015168886A JP2015043673A JP2015043673A JP2015168886A JP 2015168886 A JP2015168886 A JP 2015168886A JP 2015043673 A JP2015043673 A JP 2015043673A JP 2015043673 A JP2015043673 A JP 2015043673A JP 2015168886 A JP2015168886 A JP 2015168886A
- Authority
- JP
- Japan
- Prior art keywords
- plating
- plated
- unit
- plating solution
- stirring
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 238000007747 plating Methods 0.000 title claims abstract description 120
- 239000000243 solution Substances 0.000 claims description 54
- 238000003756 stirring Methods 0.000 claims description 40
- 238000002347 injection Methods 0.000 claims description 6
- 239000007924 injection Substances 0.000 claims description 6
- 230000007423 decrease Effects 0.000 claims description 4
- 239000000758 substrate Substances 0.000 claims 1
- 238000013019 agitation Methods 0.000 abstract description 9
- 239000007788 liquid Substances 0.000 abstract description 4
- 239000010949 copper Substances 0.000 description 10
- JPVYNHNXODAKFH-UHFFFAOYSA-N Cu2+ Chemical compound [Cu+2] JPVYNHNXODAKFH-UHFFFAOYSA-N 0.000 description 8
- 229910001431 copper ion Inorganic materials 0.000 description 8
- 238000000034 method Methods 0.000 description 7
- 230000007547 defect Effects 0.000 description 3
- 238000009713 electroplating Methods 0.000 description 3
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 238000012217 deletion Methods 0.000 description 1
- 230000037430 deletion Effects 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000005868 electrolysis reaction Methods 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 230000002265 prevention Effects 0.000 description 1
- 239000010409 thin film Substances 0.000 description 1
Images
Classifications
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D21/00—Processes for servicing or operating cells for electrolytic coating
- C25D21/10—Agitating of electrolytes; Moving of racks
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Electrochemistry (AREA)
- Materials Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Electroplating Methods And Accessories (AREA)
Abstract
Description
11 メッキ領域
13 ダム
20 メッキ液
100 陽極部
200 撹拌部
210 単位体
211 貫通孔
300 メッキ槽
400 噴射部
1000 メッキ装置
Claims (5)
- メッキ液中で被メッキ体をメッキするための電流を提供する陽極部と、
複数の貫通孔が形成された格子構造に形成され、前記被メッキ体と前記陽極部との間に介在されて、前記メッキ液がそれぞれの前記貫通孔を介して撹拌されるように、前記被メッキ体と平行な平面上で回動する撹拌部と、
前記メッキ液、前記陽極部及び前記撹拌部を収容するメッキ槽と、
を含むメッキ装置。 - 前記撹拌部は、
6つの四角形で取り囲まれた多面体に四角形状の前記貫通孔が形成された単位体を複数含む請求項1に記載のメッキ装置。 - それぞれの前記単位体の前記貫通孔は、一方向に行くほど断面積が減少する形状に形成される請求項2に記載のメッキ装置。
- 前記撹拌部を介して前記被メッキ体の方向に前記メッキ液を噴射するために、前記メッキ槽に設けられる噴射部をさらに含む請求項1から請求項3のいずれか1項に記載のメッキ装置。
- 前記撹拌部は、回動半径及び回動速度のうちの少なくとも一つを調整できる請求項1から請求項3のいずれか1項に記載のメッキ装置。
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
KR1020140026657A KR102194716B1 (ko) | 2014-03-06 | 2014-03-06 | 도금 장치 |
KR10-2014-0026657 | 2014-03-06 |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2015168886A true JP2015168886A (ja) | 2015-09-28 |
JP6497982B2 JP6497982B2 (ja) | 2019-04-10 |
Family
ID=54201899
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2015043673A Active JP6497982B2 (ja) | 2014-03-06 | 2015-03-05 | メッキ装置 |
Country Status (2)
Country | Link |
---|---|
JP (1) | JP6497982B2 (ja) |
KR (1) | KR102194716B1 (ja) |
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN110184640A (zh) * | 2018-12-27 | 2019-08-30 | 新阳硅密(上海)半导体技术有限公司 | 搅拌装置及含其的电镀设备 |
CN110219038A (zh) * | 2018-03-01 | 2019-09-10 | 株式会社荏原制作所 | 搅拌器、镀覆装置及镀覆方法 |
CN111118584A (zh) * | 2018-10-30 | 2020-05-08 | 台湾积体电路制造股份有限公司 | 镀覆装置及镀覆方法 |
Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2000129496A (ja) * | 1998-10-29 | 2000-05-09 | Tdk Corp | 電気めっき方法、電気めっき装置および電子部品 |
JP2005097732A (ja) * | 2003-08-21 | 2005-04-14 | Ebara Corp | めっき装置 |
JP2007527948A (ja) * | 2003-06-06 | 2007-10-04 | セミトゥール インコーポレイテッド | 流れ攪拌器及び/又は複数電極を用いて微小特徴加工物を処理する方法及びシステム |
JP2014080674A (ja) * | 2012-09-27 | 2014-05-08 | Tdk Corp | 異方性めっき方法および薄膜コイル |
Family Cites Families (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP3169771B2 (ja) * | 1994-06-22 | 2001-05-28 | グンゼ株式会社 | プラスチック成形物用加工装置 |
DE19717489B4 (de) | 1997-04-25 | 2008-04-10 | Sms Demag Ag | Anordnung zur elektrogalvanischen Metallbeschichtung eines Bandes |
JP5184308B2 (ja) * | 2007-12-04 | 2013-04-17 | 株式会社荏原製作所 | めっき装置及びめっき方法 |
KR20100068737A (ko) * | 2008-12-15 | 2010-06-24 | 삼성전기주식회사 | 차폐판 및 전해도금장치 |
JP3169771U (ja) * | 2011-05-06 | 2011-08-18 | 億鴻工業股▲ふん▼有限公司 | 噴流ハウジング |
-
2014
- 2014-03-06 KR KR1020140026657A patent/KR102194716B1/ko active IP Right Grant
-
2015
- 2015-03-05 JP JP2015043673A patent/JP6497982B2/ja active Active
Patent Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2000129496A (ja) * | 1998-10-29 | 2000-05-09 | Tdk Corp | 電気めっき方法、電気めっき装置および電子部品 |
JP2007527948A (ja) * | 2003-06-06 | 2007-10-04 | セミトゥール インコーポレイテッド | 流れ攪拌器及び/又は複数電極を用いて微小特徴加工物を処理する方法及びシステム |
JP2005097732A (ja) * | 2003-08-21 | 2005-04-14 | Ebara Corp | めっき装置 |
JP2014080674A (ja) * | 2012-09-27 | 2014-05-08 | Tdk Corp | 異方性めっき方法および薄膜コイル |
Cited By (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN110219038A (zh) * | 2018-03-01 | 2019-09-10 | 株式会社荏原制作所 | 搅拌器、镀覆装置及镀覆方法 |
CN110219038B (zh) * | 2018-03-01 | 2021-07-27 | 株式会社荏原制作所 | 搅拌器、镀覆装置及镀覆方法 |
CN111118584A (zh) * | 2018-10-30 | 2020-05-08 | 台湾积体电路制造股份有限公司 | 镀覆装置及镀覆方法 |
CN111118584B (zh) * | 2018-10-30 | 2022-01-07 | 台湾积体电路制造股份有限公司 | 镀覆装置及镀覆方法 |
CN110184640A (zh) * | 2018-12-27 | 2019-08-30 | 新阳硅密(上海)半导体技术有限公司 | 搅拌装置及含其的电镀设备 |
Also Published As
Publication number | Publication date |
---|---|
JP6497982B2 (ja) | 2019-04-10 |
KR20150104823A (ko) | 2015-09-16 |
KR102194716B1 (ko) | 2020-12-23 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
CN103060871B (zh) | 电镀装置及电镀方法 | |
JP6497982B2 (ja) | メッキ装置 | |
WO2011027528A1 (ja) | メッキ装置 | |
JP6000473B2 (ja) | 基板上への電解金属の垂直堆積装置 | |
US20190112728A1 (en) | Plating apparatus and plating method | |
US20180221835A1 (en) | Paddle, plating apparatus equipped with the paddle, and plating method | |
JP7073332B2 (ja) | 半導体ウェハ上の均一な厚さの金属層の電着 | |
US20150275390A1 (en) | Anode unit and plating apparatus having such anode unit | |
TWI607118B (zh) | 用於電鍍槽的高電阻虛擬陽極、電鍍槽及處理基板表面的方法 | |
KR101723991B1 (ko) | 웨이퍼 도금장치 | |
JP4579306B2 (ja) | 円形めっき槽 | |
KR100990029B1 (ko) | 기판도금장치 | |
JP6601979B2 (ja) | めっき装置 | |
JP5822212B2 (ja) | 電解メッキ装置 | |
KR20140035571A (ko) | 기판 도금 장치 | |
EP3733934A1 (en) | Electroplating assembly mechanism | |
KR101103442B1 (ko) | 기판도금장치 | |
CN110184640B (zh) | 搅拌装置及含其的电镀设备 | |
JP6552485B2 (ja) | めっき装置及び収容槽 | |
CN203474939U (zh) | 电镀装置 | |
JP2012025975A (ja) | メッキ装置 | |
US1411657A (en) | Circulation for electrodeposit systems | |
JP2008297586A (ja) | 電解めっき装置 | |
JP2012126966A (ja) | カップ型めっき装置及びめっき方法 | |
JP2009185334A (ja) | めっき装置 |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
A621 | Written request for application examination |
Free format text: JAPANESE INTERMEDIATE CODE: A621 Effective date: 20171108 |
|
A977 | Report on retrieval |
Free format text: JAPANESE INTERMEDIATE CODE: A971007 Effective date: 20181026 |
|
A131 | Notification of reasons for refusal |
Free format text: JAPANESE INTERMEDIATE CODE: A131 Effective date: 20181106 |
|
A521 | Request for written amendment filed |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20190124 |
|
TRDD | Decision of grant or rejection written | ||
A01 | Written decision to grant a patent or to grant a registration (utility model) |
Free format text: JAPANESE INTERMEDIATE CODE: A01 Effective date: 20190212 |
|
A61 | First payment of annual fees (during grant procedure) |
Free format text: JAPANESE INTERMEDIATE CODE: A61 Effective date: 20190312 |
|
R150 | Certificate of patent or registration of utility model |
Ref document number: 6497982 Country of ref document: JP Free format text: JAPANESE INTERMEDIATE CODE: R150 |
|
R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |