JP2015157386A - Bonding method, manufacturing apparatus of bonding body and bonding body - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a bonding method capable of efficiently manufacturing a bonded body bonded by being selectively imparted with a bonding material to a target place.SOLUTION: A bonding method includes: a vapor deposition film P3 formation step of volatilizing curable resin, curing agents and primer from different deposition sources M11, M12 and M13 and forming a vapor deposition film P3 on a first member P1; and a bonding processing step of bringing the first member P1 formed with the vapor deposition film P3 into contact with a second member P2 and bonding the first member P1 and the second member P2 together. It is preferable that the bonding processing step be performed by applying heat treatment with a heating temperature of 60°C or more and 160°C or less and heating time of 5 minutes or more and 8 hours or less in a state of the vapor deposition film P3 interposed between the first member P1 and the second member P2.

Description

  The present invention relates to a joining method, a joined body manufacturing apparatus, and a joined body.

Adhesives are widely used for joining various members, but when joining a member having a fine structure, such as a component of an inkjet head, if the adhesive protrudes from the target site, the joined body This has a major negative impact on the performance of the product.
For the purpose of solving such a problem, a method of transferring an adhesive to a member to be bonded after applying the adhesive to a film is used (for example, see Patent Document 1).
However, the conventional method cannot sufficiently prevent the problems described above.

JP 2009-136762 A

  An object of the present invention is to provide a bonding method capable of efficiently producing a bonded body bonded by selectively applying a bonding material to a target site, and selectively bonding a material to the target site. To provide a bonded body manufacturing apparatus capable of efficiently manufacturing a bonded body bonded by applying a bonding material, and bonding bonded by selectively applying a bonding material to a target site To provide a body.

Such an object is achieved by the present invention described below.
The bonding method of the present invention includes a vapor deposition film forming step of volatilizing a curable resin, a curing agent, and a primer from different vapor deposition sources to form a vapor deposition film on the first member,
It has the joining process process which makes the said 1st member in which the said vapor deposition film was formed contact a 2nd member, and joins the said 1st member and the said 2nd member.
Thereby, the joining method which can manufacture efficiently the joined_body | zygote joined by selectively providing a joining material to the target site | part can be provided.

In the joining method of the present invention, the joining process step includes a heating temperature of 60 ° C. or more and 160 ° C. or less and a heating time of 5 minutes with the vapor deposition film sandwiched between the first member and the second member. It is preferable to perform the heat treatment for 8 hours or less.
Thereby, in the joined body finally obtained, the joint strength in the joined body can be made particularly excellent while reliably preventing deterioration of the constituent materials of the first member and the second member. Further, the productivity of the joined body can be made particularly excellent.

In the bonding method of the present invention, in the vapor deposition film forming step, the primer is deposited to form a first region, and the curable resin and the curing agent are mixed after the first treatment. It is preferable to perform the second treatment for forming the second region by vapor deposition as a body.
Thereby, while making the adhesiveness (bonding strength) between the first member and the bonded portion particularly excellent, the physical properties (for example, elastic modulus, etc.) of the bonded portion as a whole are adjusted to be suitable. Can do.

In the bonding method according to the aspect of the invention, it is preferable that the vapor deposition film forming step performs a third treatment for vapor-depositing the primer and forming a third region after the second treatment.
As a result, the physical properties of the entire joint portion are improved while the adhesion between the first member and the joint (joint strength) and the adhesion between the second member and the joint (joint strength) are both particularly excellent. (For example, elastic modulus etc.) can be adjusted to be suitable.

In the bonding method of the present invention, a fourth region is formed by vapor-depositing the primer, the curable resin, and the curing agent as a mixture between the first treatment and the second treatment. It is preferable to perform the process.
This prevents abrupt compositional changes in the deposited film (bonded part), and even when a relatively large environmental change (temperature change) or impact is applied to the finally obtained bonded body. In addition, it is possible to more effectively prevent, for example, in-layer destruction of the bonded portion and peeling at the interface between the first member and the bonded portion, and the reliability of the bonded body can be made particularly excellent.

In the bonding method of the present invention, the fourth region is a region where the primer content gradually decreases from the surface side facing the first region toward the surface side facing the second region. It is preferable to form it as having.
Thereby, the reliability of the joined body can be further improved.

In the bonding method of the present invention, the fifth region is formed by vapor-depositing the primer, the curable resin, and the curing agent as a mixture between the second treatment and the third treatment. It is preferable to perform the process.
This prevents abrupt compositional changes in the deposited film (bonded part), and even when a relatively large environmental change (temperature change) or impact is applied to the finally obtained bonded body. In addition, it is possible to more effectively prevent in-layer destruction of the bonded portion, separation at the interface between the second member and the bonded portion, and the reliability of the bonded body can be particularly improved.

In the bonding method of the present invention, the fifth region is a region where the primer content gradually increases from the surface side facing the second region toward the surface side facing the third region. It is preferable to form it as having.
Thereby, the reliability of the joined body can be further improved.

In the joining method of the present invention, it is preferable that a primer is applied to a joining portion of the second member with the first member prior to the joining treatment step.
As a result, the bonding strength between the first member and the second member can be made particularly surely excellent.

The bonding method of the present invention may have a deactivation process step of deactivating a portion of the vapor deposition film that should not contribute to the bonding with the second member prior to the bonding process step. preferable.
As a result, it is possible to effectively prevent inconvenience due to an unintended reaction when using the finally obtained joined body.

In the bonding method of the present invention, it is preferable that the deactivation process step is performed in a state where a portion of the vapor deposition film that should contribute to the bonding with the second member is masked.
As a result, while making sure that the bonding strength between the first member and the second member is excellent, the inconvenience caused by an unintentional reaction when using the finally obtained bonded body is effective. Can be prevented.

In the bonding method of the present invention, the deactivation treatment step is preferably performed by one or more selected from the group consisting of plasma treatment, ultraviolet irradiation and electron beam irradiation.
Thereby, a deactivation process can be performed efficiently and productivity of a joined body can be made especially excellent. In addition, while making sure that the bonding strength between the first member and the second member is more excellent, it is possible to more effectively prevent the inconvenience caused by an unintentional reaction when using the finally obtained bonded body. Can be prevented.

In the bonding method of the present invention, it is preferable that the thickness of the deposited film is 2.0 μm or more and 15.0 μm or less.
Thereby, in the finally obtained joined body, it is possible to more effectively prevent the joint portion from protruding from the target portion, and the joint strength in the joined body can be made particularly excellent. Further, it has been extremely difficult to form such a relatively thin bonding material layer with a stable film thickness and pattern by the conventional coating method and transfer method. On the other hand, in the present invention, even such a relatively thin bonding material layer can be stably formed. Therefore, when the thickness of the bonding material layer (deposited film) is a value within the above range, the effect of the present invention is more remarkably exhibited.

In the bonding method of the present invention, the primer is preferably a silane coupling agent.
Thereby, the joint strength in the finally obtained joined body can be made particularly excellent. Further, the productivity of the joined body can be made particularly excellent, and the deterioration of the constituent materials of the first member and the second member can be more reliably prevented. In addition, the above materials are not easily decomposed or deteriorated when evaporated in the vapor deposition film forming process.

In the bonding method of the present invention, the curable resin is preferably an epoxy resin.
Thereby, especially the joint strength of the 1st member and the 2nd member in the joined object finally obtained can be made excellent. Further, the productivity of the joined body can be made particularly excellent.

In the bonding method of the present invention, the curing agent is preferably one or more selected from the group consisting of diethylenetriamine, polyamidoamine, and phthalic anhydride.
Thereby, the joint strength in the finally obtained joined body can be made particularly excellent. Further, the productivity of the joined body can be made particularly excellent, and the deterioration of the constituent materials of the first member and the second member can be more reliably prevented. In addition, the above materials are not easily decomposed or deteriorated when evaporated in the vapor deposition film forming process.

In the bonding method of the present invention, it is preferable that the first member has a width of 5 μm or more and 20 μm or less where the vapor deposition film is to be formed.
Thus, when the width of the portion to which the bonding material is applied (the portion to be bonded) is small, conventionally, problems such as protrusion of the bonding material have occurred particularly noticeably. As described above, even when the width of the portion to which the bonding material is applied (the portion to be bonded) is sufficiently small, the occurrence of the above-described problem can be effectively prevented. That is, the effect of the present invention is more remarkably exhibited when the width of the portion where the vapor deposition film (bonding material layer) of the first member is to be formed is a value within the above range.

In the bonding method of the present invention, it is preferable that the portion of the first member where the vapor deposition film is to be formed is adjacent to a portion having a tube structure.
In the case of joining members having such a structure, in the past, problems such as protrusion of the joining material occurred due to the capillary phenomenon (capillary effect). In the present invention, such a structure is used. Even when the members having the above are joined, the occurrence of the above problems can be effectively prevented. That is, the effect of the present invention is more remarkably exhibited when the portion where the vapor deposition film (bonding material layer) of the first member is to be formed is adjacent to the portion having the tube structure.

In the bonding method of the present invention, the bonded body is preferably an ink jet head.
The ink-jet head has a fine structure and is particularly susceptible to the influence of protrusion of the bonding material (bonding portion) from the target portion. In particular, if the bonding material (bonding portion) protrudes from the target site in the ink flow path of the ink jet head, the bonding strength of the bonding portion may decrease due to the ink swelling or the like. Due to this deformation, problems such as a decrease in the stability of ink ejection occur. Further, even when the bonding material is a liquid repellent material and there is no problem of swelling due to ink, if the bonding material (bonding portion) protrudes from the target site in the ink flow path of the inkjet head, That part repels ink, and there is still a problem that the stability of ink ejection is lowered. On the other hand, in the present invention, since the joint portion can be selectively provided at the target site, the occurrence of the above problem can be effectively prevented even when applied to an ink jet head. From the above, the effects of the present invention are more remarkably exhibited when applied to an inkjet head.

The joined body manufacturing apparatus of the present invention is characterized by performing the method of the present invention.
Thereby, the manufacturing apparatus of the conjugate | zygote which can manufacture efficiently the conjugate | zygote joined by selectively providing a joining material to the target site | part can be provided.

The manufacturing apparatus of the joined body of the present invention includes a vapor deposition film forming unit that volatilizes a curable resin, a curing agent, and a primer from different vapor deposition sources, and forms a vapor deposition film on the first member,
The first member on which the vapor deposition film is formed is brought into contact with a second member, and a joining processing unit that joins the first member and the second member is provided.
Thereby, the manufacturing apparatus of the conjugate | zygote which can manufacture efficiently the conjugate | zygote joined by selectively providing a joining material to the target site | part can be provided.

The joined body of the present invention is manufactured using the joining method of the present invention.
Thereby, it is possible to provide a bonded body bonded by selectively applying a bonding material to a target portion.

The joined body of the present invention is manufactured using the manufacturing apparatus of the present invention.
Thereby, it is possible to provide a bonded body bonded by selectively applying a bonding material to a target portion.

It is sectional drawing which shows typically suitable embodiment of the manufacturing apparatus of the conjugate | zygote of this invention. It is sectional drawing which shows typically suitable embodiment of the inkjet head to which this invention is applied. It is sectional drawing which shows typically other suitable embodiment of the inkjet head to which this invention is applied. It is a bottom view of the case of the inkjet head shown in FIG.

  Hereinafter, preferred embodiments of the present invention will be described in detail with reference to the accompanying drawings.

《Joint manufacturing apparatus and joining method》
First, an apparatus for manufacturing a joined body and a joining method according to the present invention will be described.

FIG. 1 is a cross-sectional view schematically showing a preferred embodiment of the joined body manufacturing apparatus of the present invention.
As shown in FIG. 1, the manufacturing apparatus M100 of the joined body P10 uses a curable resin, a curing agent, and a primer as different vapor deposition sources (first vapor deposition source M11, second vapor deposition source M12, and third vapor deposition source M13). The vapor deposition film forming part (film forming part) M1 that forms a vapor deposition film (bonding material layer) P3 on the first member P1 and the second member P2 of the vapor deposition film P3 should be contributed to The deactivation processing part M2 for deactivating the non-destructive part, the first member P1 on which the deposited film P3 is formed are brought into contact with the second member P2, and the first member P1 and the second member P2 are brought into contact with each other. And a joining processing unit M3 for joining.

  Then, a vapor deposition film forming step (film forming step) is performed in the vapor deposition film forming portion (film forming portion) M1, a deactivation processing step is performed in the deactivation processing portion M2, and a bonding processing step is performed in the bonding processing portion M3. .

The film forming part (deposited film forming part) M1 is an area for performing a film forming process (deposited film forming process).
The film forming unit (deposited film forming unit) M1 includes a container (first container) M14 that houses a first deposition source (curable resin) M11 and a container that houses a second deposition source (curing agent) M12. (Second container) M15, a container (third container) M16 for storing the third vapor deposition source (primer) M13, a chamber M10 for storing these, and a pump M17 for exhausting the gas in the chamber M10 It has.

  The first member P1 on which the deposited film (bonding material layer) P3 is to be formed is attached to the holder M4.

  The first vapor deposition source (curable resin) M11, the second vapor deposition source (curing agent) M12, and the third vapor deposition source (primer) M13 are heated by a heating source (not shown) and evaporated, respectively. A vapor deposition film P3 is formed on the member P1. In FIG. 1, for the sake of clarity, the vapor deposition film P <b> 3 is shown as being selectively formed only on the target portion.

In this way, by forming the bonding material layer P3 by vapor deposition, it is possible to effectively prevent unintentional variations in the thickness of the bonding material layer P3.
Further, even if the curable resin or the curing agent is a liquid or solid having a high viscosity, these components can be suitably mixed without using a solvent, and the uneven composition of the bonding material layer P3 is uneven. Generation | occurrence | production can be prevented effectively.

  Further, by using the primer M13 in addition to the curable resin M11 and the curing agent M12 as a vapor deposition source, the adhesion between the first member P1 and the joint P5 in the finally obtained joined body P10, the second The adhesion between the member P2 and the joint P5 can be made particularly excellent.

  Further, by using a plurality of vapor deposition sources corresponding to the constituent components of the bonding material layer P3, by controlling the heating conditions and the like for each vapor deposition source, the ratio of the content of each component in the bonding material layer P3, The distribution of each component in each part (particularly each part in the thickness direction) of the bonding material layer P3 can be suitably controlled.

  By controlling the distribution of each component in each part (particularly, each part in the thickness direction) of the bonding material layer P3, for example, according to the types of the first member P1 and the second member P2, the first The composition and the like of the contact portion with the member P1 and the contact portion with the second member P2 can be adjusted, and the bonding strength and the like can be optimized. Also, the primer content may be lower in the vicinity of the central portion in the thickness direction of the bonding material layer P3 than in the contact portion with the first member P1 or the contact portion with the second member P2. it can. Thereby, for example, in the finally obtained bonded body P10, the elastic modulus and the like of the bonded portion P5 can be adjusted to be suitable.

In particular, the deposited film forming step includes depositing the curable resin M11 and the curing agent M12 as a mixture after the first process of depositing the primer M13 to form the first region and the first process, It is preferable to perform the second treatment for forming the region.
As a result, the physical properties (for example, elastic modulus, etc.) of the entire joint P5 are suitable while the adhesion (joint strength) between the first member P1 and the joint P5 is particularly excellent. Can be adjusted.

The thickness of the first region is preferably 0.2 μm or more and 3.0 μm or less.
The thickness of the second region is preferably 0.5 μm or more and 10.0 μm or less.
Moreover, it is preferable to perform the 3rd process which vapor-deposits the primer M13 and forms a 3rd area | region after a 2nd process.
Thereby, the adhesiveness (joining strength) between the first member P1 and the joining part P5 and the adhesiveness (joining strength) between the second member P2 and the joining part P5 are both particularly excellent, and the joining part The physical properties (for example, elastic modulus, etc.) as a whole of P5 can be adjusted to be suitable.

The thickness of the third region is preferably 0.2 μm or more and 3.0 μm or less.
Moreover, it is preferable to perform the 4th process which deposits the primer M13, curable resin M11, and the hardening | curing agent M12 as a mixture between a 1st process and a 2nd process, and forms a 4th area | region. .
As a result, it is possible to prevent an abrupt change in composition in the bonding material layer P3 (bonding portion P5), and a relatively large environmental change (temperature change) or impact is applied to the finally obtained bonded body P10. Even in cases, it is possible to more effectively prevent in-layer destruction of the joint P5, separation at the interface between the first member P1 and the joint P5, and the reliability of the joined body P10 is particularly excellent. Can be.

In the case where the vapor deposition film P3 is formed as having the fourth region, the primer is contained in the fourth region from the surface side facing the first region toward the surface side facing the second region. It is preferable to form it as a region having a gradually decreasing rate.
Thereby, the effect mentioned above is exhibited more notably and the reliability of the joined body P10 can be further improved.
The thickness of the fourth region is preferably 0.2 μm or more and 10.0 μm or less.

Moreover, it is preferable to perform the 5th process which vapor-deposits the primer M13, curable resin M11, and the hardening | curing agent M12 as a mixture between a 2nd process and a 3rd process, and forms a 5th area | region. .
As a result, it is possible to prevent an abrupt change in composition in the bonding material layer P3 (bonding portion P5), and a relatively large environmental change (temperature change) or impact is applied to the finally obtained bonded body P10. Even in cases, it is possible to more effectively prevent in-layer destruction of the joint P5, peeling at the interface between the second member P2 and the joint P5, and the reliability of the joined body P10 is particularly excellent. Can be.

In the case of forming the vapor deposition film P3 as having the fifth region, the content rate of the primer from the surface side facing the second region toward the surface side facing the third region is changed to the fifth region. It is preferable to form it as having a gradually increasing region.
Thereby, the effect mentioned above is exhibited more notably and the reliability of the joined body P10 can be further improved.

The thickness of the fifth region is preferably 0.2 μm or more and 10.0 μm or less.
As a heating method of the first vapor deposition source (curable resin) M11, the second vapor deposition source (curing agent) M12, and the third vapor deposition source (primer) M13, for example, resistance heating method, electron beam method, laser ablation And high frequency induction heating method. Moreover, you may employ | adopt sputtering ring method.

The curable resin M11 may be anything as long as it has curability, and for example, a thermosetting resin, a photocurable resin, or the like can be used.
More specifically, examples of the curable resin M11 include silicone rubbers; addition type and condensation type silicone resins; epoxy resins such as bisphenol A type epoxy resins and cresol novolac type epoxy resins; urethane resins; acrylic resins and the like. Among them, an epoxy resin is preferable.

  Thereby, the joint strength between the first member P1 and the second member P2 in the joined body P10 finally obtained can be made particularly excellent. Moreover, the epoxy resin has a curing reaction that proceeds promptly by heat treatment, and the reaction in the bonding process can be performed in a relatively short time. Therefore, the productivity of the joined body P10 can be made particularly excellent.

  The 1st vapor deposition source M11 should just contain curable resin at least, and may contain components other than curable resin. Examples of such components include polymerization inhibitors, colorants, antioxidants, preservatives, antifungal agents, curing agents, crosslinking agents, catalysts, polymerization initiators, primers, and the like.

  In particular, by including a polymerization inhibitor, it is effective that the unintended polymerization reaction proceeds in the state of the first vapor deposition source M11 before the vapor deposition film P3 is formed or in the state where the first vapor deposition source M11 is evaporated. Can be prevented.

As the curing agent M12, for example, diethylenetriamine, polyamidoamine, phthalic anhydride and the like can be used, but it is preferable that the curing agent M12 be one or more selected from the group consisting of diethylenetriamine, polyamidoamine and phthalic anhydride. .
Thereby, the joint strength in the finally obtained joined body P10 can be made particularly excellent. Further, the processing conditions in the bonding process can be made milder, the productivity of the bonded body P10 can be made particularly excellent, and the first member P1 and the second member P2 Deterioration of the constituent materials can be prevented more reliably. In addition, the above materials are not easily decomposed or deteriorated when evaporated in this step.

  The 2nd vapor deposition source M12 should just contain a hardening | curing agent at least, and may contain components other than a hardening | curing agent. Examples of such components include polymerization inhibitors, colorants, antioxidants, antiseptics, antifungal agents, resin materials, crosslinking agents, catalysts, polymerization initiators, primers, and the like.

As the primer M13, for example, a silane coupling agent having a functional group such as a vinyl group, an epoxy group, a methacryl group, or an amino group (for example, 3-aminopropyltrimethoxysilane) or the like can be used.
Thereby, the joint strength in the finally obtained joined body P10 can be made particularly excellent. Further, the processing conditions in the bonding process can be made milder, the productivity of the bonded body P10 can be made particularly excellent, and the first member P1 and the second member P2 Deterioration of the constituent materials can be prevented more reliably. In addition, the above materials are not easily decomposed or deteriorated when evaporated in this step.

The 3rd vapor deposition source M13 should just contain a primer at least, and may contain components other than a primer. Examples of such components include polymerization inhibitors, colorants, antioxidants, preservatives, antifungal agents, resin materials, curing agents, crosslinking agents, catalysts, polymerization initiators, and the like.
The width of the portion where the vapor deposition film (bonding material layer) P3 of the first member P1 is to be formed (the portion to be in contact with the bonding portion P5) is preferably 5.0 μm or more and 20 μm or less, and is 7.0 μm or more. More preferably, it is 18 μm or less.

  Thus, when the width of the portion to which the bonding material is applied (the portion to be bonded) is small, conventionally, problems such as protrusion of the bonding material have occurred particularly noticeably. As described above, even when the width of the portion to which the bonding material is applied (the portion to be bonded) is sufficiently small, the occurrence of the above-described problem can be effectively prevented. That is, the effect of the present invention is more remarkably exhibited when the width of the portion where the vapor deposition film (bonding material layer) P3 of the first member P1 is to be a value within the above range.

Moreover, it is preferable that the site | part (site which should contact the junction part P5) where the vapor deposition film (bonding material layer) P3 of the 1st member P1 should be adjacent to the site | part which has a pipe structure.
In the case of joining members having such a structure, in the past, problems such as protrusion of the joining material occurred due to the capillary phenomenon (capillary effect). In the present invention, such a structure is used. Even when the members having the above are joined, the occurrence of the above problems can be effectively prevented. That is, the effect of the present invention is more remarkably exhibited when the portion where the vapor deposition film (bonding material layer) P3 of the first member P1 is to be formed is adjacent to the portion having the tube structure.

The thickness of the bonding material layer (deposited film) P3 is preferably 2.0 μm or more and 15.0 μm or less, and more preferably 3.0 μm or more and 13.0 μm or less.
Thereby, in the joined body P10 finally obtained, the protrusion of the joined portion P5 from the target portion can be more effectively prevented, and the joining strength in the joined body P10 is particularly excellent. Can do. Further, it has been extremely difficult to form such a relatively thin bonding material layer with a stable film thickness and pattern by the conventional coating method and transfer method. On the other hand, in the present invention, even such a relatively thin bonding material layer can be stably formed. Therefore, when the thickness of the bonding material layer (deposited film) is a value within the above range, the effect of the present invention is more remarkably exhibited.

The first member P1 on which the vapor deposition film P3 is formed in the vapor deposition film forming unit (film forming unit) M1 is transported to the deactivation processing unit M2 by the transport unit M5.
The deactivation process part M2 is an area | region which performs the deactivation process process of deactivating the part which should not contribute to joining with the 2nd member P2 among the vapor deposition films P3.

By performing the deactivation treatment step, it is possible to effectively prevent inconvenience due to an unintended reaction occurring when using the finally obtained joined body P10.
The deactivation processing unit M2 includes a deactivation processing apparatus M21.

In the illustrated configuration, the deactivation process is preferably performed in a state where a portion of the vapor deposition film P3 that should contribute to the bonding with the second member P2 is masked by a mask member (not shown).
Thereby, while making the joining strength of the 1st member P1 and the 2nd member P2 more reliable, it is inconvenience by unintentional reaction occurring at the time of use of joined body P10 finally obtained. Can be effectively prevented.

As the mask member, for example, the substrate has a base material made of a material such as polyester, quartz glass, low expansion glass, or soda glass, and a film made of a material such as chromium, nickel, silicon, or iron oxide. A thing etc. can be used.
As the deactivation processing apparatus M21, for example, an apparatus that performs plasma processing (plasma processing apparatus), an ultraviolet irradiation (ultraviolet irradiation apparatus), an apparatus that performs electron beam irradiation (electron beam irradiation apparatus), or the like can be used. .

By using such an inactivation processing apparatus M21, the inactivation processing can be performed efficiently, and the productivity of the joined body P10 can be made particularly excellent. In addition, since it is possible to reliably deactivate the portion not masked while preventing inactivation of the portion masked by the mask member, the bonding strength between the first member P1 and the second member P2 is increased. Furthermore, it is possible to more effectively prevent inconvenience caused by an unintentional reaction when using the finally obtained joined body P10, etc. while making it excellent.
The first member P1 subjected to the deactivation process in the deactivation process part M2 is transported to the joining process part M3 by the transport means M5.

The joining process part M3 is an area | region which performs a joining process process.
By the joining process, the curable resin constituting the joining material layer (deposition film) P3 is cured, and the joining portion P5 is formed. As a result, a joined body P10 in which the first member P1 and the second member P2 are joined via the joint portion P5 is obtained.

  The bonding material layer (deposited film) P3 that comes into contact with the second member P2 is formed by the vapor deposition method as described above. For this reason, in the present invention, the thickness of the bonding material layer (evaporated film) is thin (for example, a film thickness in the above-described range) that is difficult to form with a stable film thickness by the conventional coating method and transfer method. Even in this case, the bonding material layer (deposition film) P3 can be stably formed. Therefore, at the time of joining the first member P1 and the second member P2 (joining process step), it is possible to effectively prevent unintentional protrusion of the joining material, and to selectively join the target portion. Part P5 can be provided. Moreover, even if the bonding material layer P3 and the second member P2 are brought into close contact with each other with a relatively strong pressure, the occurrence of the above problem can be reliably prevented. Accordingly, the adhesion between the second member P2 and the joint portion P5 can be made particularly excellent, and it is effective that an unintentional gap or the like is generated between the second member P2 and the joint portion P5. Can be prevented. Therefore, the durability and reliability of the joined body P10 as a whole can be made particularly excellent.

  The bonding processing unit M3 includes a heating unit (bonding unit) M31 that heats the bonding material layer (deposition film) P3 sandwiched between the first member P1 and the second member P2, and a bonding material layer (deposition film). ) The pressing member M32 that presses the first member P1 provided with the vapor deposition film P3 so that the P3 and the second member P2 are in contact with each other, and the first member P1 is supported in a pressing state by the pressing unit M32. And a support member M33.

  Thus, in the configuration shown in the figure, the heating means M31 is provided as means for curing the curable resin (joining means). As described above, when the bonding process is performed by heating, for example, the bonding material layer (deposition film) P3 sandwiched between the first member P1 and the second member P2 is disposed at a site where light does not easily reach. Even if it exists, the polymerization reaction of curable resin can be performed suitably and the intensity | strength and reliability of joined body P10 can be made especially excellent.

In the illustrated configuration, the joining means M31 is provided integrally with the support member M33 and is heated from the second member P2 side, but the installation site of the joining means M31 is not particularly limited, and for example, support It may be provided independently of the member M33. Moreover, the joining means M31 may be provided on the side where the pressing means M32 is provided, for example.
Further, as the joining unit M31, a unit other than the heating unit, for example, a light irradiation unit may be used.

The pressure (pressing force) when the bonding material layer (deposited film) P3 and the second member P2 are brought into close contact with each other is preferably 0.01 MPa or more and 10 MPa or less, and more preferably 1 MPa or more and 5 MPa or less.
Thus, by making a pressing force comparatively large, the adhesiveness of the joining material layer (deposition film) P3 and the 2nd member P2 can be made especially excellent. Accordingly, the bonding strength of the bonded body P10 can be made particularly excellent.

The heating temperature in the bonding process is preferably 60 ° C. or higher and 160 or lower, and more preferably 90 ° C. or higher and 150 ° C. or lower.
Thereby, the joint strength in the joined body P10 can be made particularly excellent while reliably preventing deterioration of the constituent materials of the first member P1 and the second member P2. Moreover, since the processing time of the joining process can be made relatively short, the productivity of the joined body P10 can be made particularly excellent.

Further, the heating time in the bonding treatment is preferably 5 minutes or more and 8 hours or less, and more preferably 7 minutes or more and 60 minutes or less.
Thereby, the joint strength in the joined body P10 can be made particularly excellent while reliably preventing deterioration of the constituent materials of the first member P1 and the second member P2. Further, the productivity of the joined body P10 can be made particularly excellent.

Note that the joining process may be performed under certain conditions, or the conditions may be changed during the process. For example, in the bonding process, after performing the first step at a temperature: T ₁ [° C.] and a pressure: P ₁ [Pa], a temperature higher than T ₁ : T ₂ [° C.] and a pressure P higher than P ₁ The second step may be performed at ₂ [Pa].
Thereby, the reliability of the bonding between the second member P2 and the bonding portion P5 in the bonded body P10, the first member, while preventing the unintentional deformation of the bonding material layer P3 (bonding portion P5) more effectively. The joining reliability between P1 and the joint portion P5 can be made particularly excellent, and the durability and reliability of the joined body P10 as a whole can be made particularly excellent.

In addition, the second member P2 provided for this step may be a member in which a primer is previously applied to a bonding portion with the first member P1 (a portion to be in contact with the bonding material layer P3). .
As a result, the bonding strength between the first member P1 and the second member P2 can be made particularly surely excellent.
For example, the application of the primer to the second member P2 may be performed within the manufacturing apparatus M100 or may be performed outside the manufacturing apparatus M100.

When applying the primer to the second member P2 (primer treatment step) in the manufacturing apparatus M100, for example, in the state where the second member P2 is attached to the holder M4 in the vapor deposition film forming unit M1 described above. Can do. Further, the manufacturing apparatus M100 may include a primer processing unit (not shown) that applies a primer to the second member P2.
According to the joined body manufacturing apparatus and joining method of the present invention as described above, a joined body can be efficiently manufactured by selectively applying a joining material to a target portion.

《Joint body》
Next, the joined body of the present invention will be described.
The joined body of the present invention is manufactured using the joining method of the present invention as described above and the joined body manufacturing apparatus of the present invention.
Thereby, it is possible to provide a bonded body bonded by selectively applying a bonding material to a target portion.

The joined body of the present invention may be any material, but is preferably an ink jet head.
The ink-jet head has a fine structure and is particularly susceptible to the influence of protrusion of the bonding material (bonding portion) from the target portion.
In particular, if the bonding material (bonding portion) protrudes from the target site in the ink flow path of the ink jet head, the bonding strength of the bonding portion may decrease due to the ink swelling or the like. Due to this deformation, problems such as a decrease in the stability of ink ejection occur.

  Further, even when the bonding material is a liquid repellent material and there is no problem of swelling due to ink, if the bonding material (bonding portion) protrudes from the target site in the ink flow path of the inkjet head, That part repels ink, and there is still a problem that the stability of ink ejection is lowered.

  On the other hand, in the present invention, since the joint portion can be selectively provided at the target site, the occurrence of the above problem can be effectively prevented even when applied to an ink jet head.

  From the above, the effects of the present invention are more remarkably exhibited when applied to an inkjet head.

Hereinafter, a specific example in which the present invention is applied to an ink jet will be described in detail.
2 is a cross-sectional view schematically showing a preferred embodiment of an inkjet head to which the present invention is applied, and FIG. 3 is a cross-sectional view schematically showing another preferred embodiment of the inkjet head to which the present invention is applied. FIG. 4 is a bottom view of the case of the inkjet head shown in FIG.
It is.

  2 includes a silicon substrate 81 on which an ink reservoir 87 is formed, a vibration plate 82 formed on the silicon substrate 81, a lower electrode 83 formed at a desired position on the vibration plate 82, A piezoelectric thin film 84 formed on the lower electrode 83 at a position corresponding to the ink reservoir 87, an upper electrode 85 formed on the piezoelectric thin film 84, and a second bonded to the lower surface of the silicon substrate 81. Board 86. The second substrate 86 is provided with an ink discharge nozzle 86 </ b> A communicating with the ink reservoir 87.

  In the inkjet head 100, ink is supplied to the ink reservoir 87 via an ink flow path (not shown). Here, when a voltage is applied to the piezoelectric thin film 84 via the lower electrode 83 and the upper electrode 85, the piezoelectric thin film 84 is deformed to create a negative pressure in the ink reservoir 87 and apply pressure to the ink. With this pressure, ink is ejected from the nozzle, and ink jet recording is performed.

  For example, the inkjet head 100 is formed by integrally forming a thin film piezoelectric element including a lower electrode 83, a piezoelectric thin film 84, and an upper electrode 85 by a thin film process using a Si thermal oxide film as a vibration plate 82, and an upper portion thereof. A chip made of a single crystal silicon substrate 81 in which a cavity (ink reservoir) 87 is formed, and a stainless steel nozzle plate (second substrate) 86 provided with an ink discharge nozzle 86A for discharging ink are included in the present invention. According to the joining method, a joined structure can be obtained.

  Here, the piezoelectric thin film 84 is composed of, for example, a three-component PZT in which lead magnesium niobate is added as a third component as a material having a high piezoelectric strain constant d31 so that a larger displacement amount can be obtained. Can be used. The thickness of the piezoelectric thin film 84 can be about 2 μm.

  When the present invention is applied to the joining of the constituent members of the ink jet head having such a structure, a joining material can be selectively applied to a target portion, and the reliability of the obtained ink jet head (joined body) is It will be expensive.

  3 and 4 includes a flow path forming substrate 10 having a pressure generation chamber 11, a nozzle plate 20 in which a plurality of nozzles 21 communicating with each pressure generation chamber 11 are perforated, and a flow path. A vibration member 15 joined to a surface of the path forming substrate 10 opposite to the nozzle plate 20 is provided. In addition, the inkjet head 100 according to the present embodiment includes the piezoelectric element unit 30 having a plurality of piezoelectric elements 35 provided in a region corresponding to each pressure generation chamber 11 on the vibration member 15, and the flow path forming substrate 10 via the vibration member 15. And a case 40 joined to one side of the. In this embodiment, a reservoir 13 serving as a common liquid chamber for the pressure generation chambers 11 is formed on the flow path forming substrate 10, and the flow path forming substrate 10 is also a reservoir forming substrate.

  In the flow path forming substrate 10, a plurality of pressure generating chambers 11 are partitioned by a partition wall and arranged in parallel in the width direction on the surface layer portion on one surface side. In the present embodiment, two rows composed of a plurality of pressure generating chambers 11 arranged side by side are formed. Further, outside the row of the pressure generation chambers 11, a reservoir 13 to which ink is supplied through an ink introduction path 41 which is a liquid introduction path of the case 40 penetrates the flow path forming substrate 10 in the thickness direction. Each one is provided.

  The reservoir 13 and each pressure generation chamber 11 communicate with each other via an ink supply path 12, and ink is supplied to each pressure generation chamber 11 via an ink introduction path 41, the reservoir 13, and the ink supply path 12. Supplied. In this embodiment, the ink supply path 12 is formed with a width narrower than that of the pressure generation chamber 11, and plays a role of maintaining a constant flow path resistance of ink flowing from the reservoir 13 into the pressure generation chamber 11.

  Further, a nozzle communication hole 14 penetrating the flow path forming substrate 10 is formed on the end side of the pressure generating chamber 11 opposite to the reservoir 13. That is, in the present embodiment, a reservoir 13, an ink supply path 12, a pressure generation chamber 11, and a nozzle communication hole 14 are provided as liquid channels in the channel forming substrate 10. In this embodiment, the flow path forming substrate 10 is made of a silicon single crystal substrate, and the pressure generating chamber 11 and the reservoir 13 provided on the flow path forming substrate 10 are formed by etching the flow path forming substrate 10. Is formed by.

  A nozzle plate 20 having a plurality of nozzles 21 for ejecting ink is joined to one surface of the flow path forming substrate 10, and each nozzle 21 is connected via a nozzle communication hole 14 provided in the flow path forming substrate 10. The pressure generation chambers 11 communicate with each other.

  A vibrating member 15 is bonded to the other surface of the flow path forming substrate 10, that is, the opening surface of the pressure generating chamber 11 with an adhesive layer 17, and each pressure generating chamber 11 is sealed by the vibrating member 15. Yes. In addition, the vibration member 15 has an area approximately equal to the area of the other surface of the flow path forming substrate 10 as illustrated, and is joined so as to cover the entire other surface of the flow path forming substrate 10.

  The vibration member 15 is formed of a composite plate of, for example, an elastic film 15a made of an elastic member such as a resin film and a support plate 15b made of, for example, a metal material that supports the elastic film 15a. The film 15 a side is bonded to the flow path forming substrate 10. In the present embodiment, the elastic film 15a is made of a polyphenylene sulfide (PPS) film having a thickness of about several μm, and the support plate 15b is made of a stainless steel plate (SUS) having a thickness of about several tens of μm.

  Further, the region of the vibration member 15 that faces the peripheral edge of each pressure generating chamber 11 is a thin portion 15d that is substantially composed only of the elastic film 15a with the support plate 15b removed. This thin portion 15 d defines one surface of the pressure generating chamber 11. Further, inside the thin portion 15d, island portions 15c made of a part of the support plate 15b with which the tips of the respective piezoelectric elements 35 abut are provided. In addition, the region of the vibration member 15 that faces the reservoir 13 is a vibration unit 16 that includes only the elastic film 15a with the support plate 15b removed. When the pressure change in the reservoir 13 occurs, the vibration part 16 absorbs the pressure change by being deformed, and plays a role of constantly maintaining the pressure in the reservoir 13. The case 40 is bonded to the vibrating member 15 with the adhesive layer 18. That is, the case 40 of this embodiment is joined to the flow path forming substrate 10 via the vibration member 15.

  As shown in FIG. 3, the case 40 is provided with a space portion 42 formed of a recess at a position facing the vibrating portion 16. The space portion 42 has a height that does not hinder the deformation of the vibration portion 16, and communicates with the external space through a case through hole 44 that is an air opening hole that penetrates the case 40. Thereby, the pressure in the space part 42 is always kept constant with the external space. Further, the case 40 is provided with a piezoelectric element housing portion 43 including a through portion that penetrates the case 40 at a position facing the thin portion 15d. Further, a step 45 is provided on the ink introduction path 41 side of the piezoelectric element housing portion 43, and a fixed substrate 36 of the piezoelectric element unit 30 described later is joined to the step 45.

  Further, a wiring board 70 provided with a plurality of conductive pads 71 to which each wiring layer 51 of a flexible printed board 50 to be described later is connected is fixed to the surface of the case 40 opposite to the flow path forming board 10 side. Has been. In the wiring substrate 70, a slit-like opening 72 is formed in a region of the case 40 facing the piezoelectric element housing portion 43, and the piezoelectric element housing portion 43 communicates with the external space through the opening 72. . And in this piezoelectric element accommodating part 43, the piezoelectric element unit 30 provided with the piezoelectric element 35 is accommodated.

  The piezoelectric element unit 30 is provided to face each pressure generating chamber 11, and includes a plurality of piezoelectric elements 35 that vary the pressure in the liquid flow path including the pressure generating chamber 11 and the reservoir 13, and the piezoelectric elements 35 are disposed in the case. 40 and a fixed substrate 36 attached to 40.

  Each piezoelectric element 35 is integrally formed in one piezoelectric element unit 30 in this embodiment. That is, a piezoelectric element forming member 34 in which the piezoelectric material 31 and the electrode forming materials 32 and 33 are vertically sandwiched and laminated is formed to correspond to each pressure generating chamber 11. Each piezoelectric element 35 is formed by cutting into comb teeth. That is, in the present embodiment, the plurality of piezoelectric elements 35 are integrally formed. The piezoelectric element 35 is bonded to the fixed substrate 36 at the base end side which is an inactive region that does not contribute to vibration while the tip end portion is bonded to the island portion 15c of the vibration member 15 by an adhesive (bonding agent). Has been. The fixed substrate 36 to which the piezoelectric element 35 is fixed in this manner is joined to the case 40 at the step 45 of the piezoelectric element housing portion 43. Accordingly, the piezoelectric element unit 30 is accommodated and fixed in the piezoelectric element accommodating portion 43 of the case 40.

  The fixed substrate 36 is provided integrally with the piezoelectric element 35 as described above, thereby constituting the piezoelectric element unit 30, and the piezoelectric element unit 30 is positioned and fixed to the case 40. At this time, the positioning of the piezoelectric element 35 with respect to the vibration member 15 (island portion 15 c) is performed by the outer peripheral surface of the fixed substrate 36 and the inner surface of the piezoelectric element housing portion 43 of the case 40. Thereby, it is possible to perform alignment easily and with high accuracy compared to directly gripping and aligning the piezoelectric element 35 that is a brittle material.

  Although the material which comprises the fixed board | substrate 36 is not specifically limited, For example, it can comprise suitably with aluminum, copper, iron, stainless steel, etc. In the vicinity of the base end of the piezoelectric element 35 of the piezoelectric element unit 30, a flexible print having a wiring layer 51 for supplying a signal for driving each piezoelectric element 35 on the surface opposite to the fixed substrate 36. A substrate 50 is connected.

  The flexible printed circuit board 50 includes a flexible printing circuit (FPC), a tape carrier package (TCP), or the like. Specifically, the flexible printed circuit board 50 includes, for example, a terminal layer connected to the piezoelectric element 35 of the wiring layer 51 by forming a wiring layer 51 of a predetermined pattern on a surface of a base film 52 such as polyimide with a thin copper film or the like. A region other than a region connected to another wiring is covered with an insulating material such as a resist.

  Such a wiring layer 51 of the flexible printed board 50 is connected to the electrode forming materials 32 and 33 constituting the piezoelectric element 35 by, for example, solder, anisotropic conductive material or the like on the base end side.

  On the other hand, on the tip end side, each wiring layer 51 is electrically connected to the conductive pads 71 of the wiring board 70 provided on the case 40. The flexible printed board 50 is pulled out of the opening 72 of the wiring board 70 to the outside of the piezoelectric element housing portion 43, and the drawn area is bent and connected to the conductive pad 71.

  In the inkjet head 100 of the present embodiment, as shown in FIG. 4, the piezoelectric element housing portion 43 and the space portion 42 are communicated with each other through a communication path 46.

  The communication passage 46 is a passage that communicates the piezoelectric element housing portion 43 and the space portion 42. In this embodiment, the communication passage 46 removes a part of the surface of the case 40 on the flow path forming substrate 10 side to remove the case 40. It is formed on the bottom.

  Further, the communication path 46 of the present embodiment is provided at a position that does not overlap with the flow path including the pressure generation chamber 11 in the stacking direction of the flow path forming substrate 10, the vibration member 15, and the case 40. Specifically, the communication passage 46 is provided in a region outside the both ends of the space portion 42 and the piezoelectric element housing portion 43 in the juxtaposition direction of the pressure generation chambers 11.

  The communication path 46 includes a first communication part 46a that is continuous with the space part 42 and extends outward from the longitudinal end of the space part 42 along the direction in which the pressure generation chambers 11 are arranged, and the first communication part 46a. A second communication portion 46b extending in the longitudinal direction of the pressure generation chamber 11 and a piezoelectric element housing portion 43 extending inward along the direction in which the pressure generation chambers 11 are arranged in succession to the second communication portion 46b. And a third communication portion 46c that is continuous with the third communication portion 46c. The piezoelectric element housing portion 43 and the space portion 42 are communicated with each other through such a communication path 46. In the present embodiment, the communication path 46 is formed on the surface of the case 40 on the flow path forming substrate 10 side. That is, the communication path 46 is provided as a recess on the surface of the case 40 on the flow path forming substrate 10 side.

  By providing such a communication passage 46, the piezoelectric element housing portion 43 and the space portion 42 constitute a flow path through which air flows, and the volatile gas in the space portion 42 can be relatively easily removed from the external space. To be discharged.

In such an ink jet head 100, ink droplets are ejected from each nozzle 21 by changing the volume of each pressure generating chamber 11 by deformation of the piezoelectric element 35 and the vibration member 15. Specifically, when ink is supplied to the reservoir 13 from the liquid storage means (not shown) via the ink introduction path 41 which is a liquid introduction path, the ink is distributed to each pressure generating chamber 11 via the ink supply path 12. The Then, a voltage is applied to and released from a predetermined piezoelectric element 35 by a drive signal from a drive circuit (not shown), whereby the piezoelectric element 35 is contracted and expanded to cause a pressure change in the pressure generating chamber 11, and the ink is discharged from the nozzle 21. To discharge.
The present invention can be applied to the formation of a joint portion for joining the constituent members of the ink jet head as described above.

  As mentioned above, although preferred embodiment of this invention was described, this invention is not limited to these.

For example, in the joined body manufacturing apparatus of the present invention, the configuration of each part can be replaced with any configuration that exhibits the same function, and any configuration can be added.
Further, in the manufacturing apparatus of the present invention, the arrangement of each component is not limited to that described above.

In the above-described embodiment, the bonding material layer (deposition film) is formed on the first member that is one of the members to be bonded (first member, second member). In the present invention, a bonding material layer (deposition film) may be formed on both the first member and the second member.
Moreover, although embodiment mentioned above demonstrated the case where it applied to joining of two members, this invention may be applied to joining of three or more members.

  Moreover, although the case where three vapor deposition sources were used was demonstrated in embodiment mentioned above, you may use four or more vapor deposition sources in this invention. For example, in addition to a curable resin vapor deposition source, a curing agent vapor deposition source, and a primer vapor deposition source, vapor deposition sources of components other than these may be used. Further, for example, two or more kinds of vapor deposition sources may be used for at least one of the curable resin, the curing agent, and the primer.

  Moreover, in the joining method of this invention, you may perform a pre-processing process, an intermediate processing process, and a post-processing process as needed. For example, you may have the temporary hardening process which advances partially the hardening reaction (polymerization reaction) of curable resin which comprises a vapor deposition film between a vapor deposition film formation process and a joining process. Thereby, the stability of the shape of the vapor-deposited film (bonding material layer) in the bonding process is particularly excellent, and the protrusion of the bonding portion from the target portion can be more effectively prevented.

Moreover, although embodiment mentioned above demonstrated the case where a deactivation process process was performed prior to a joining process process, the deactivation process may be performed after a joining process process.
In the present invention, the deactivation process may be omitted.
In the above description, the inkjet head is representatively described as a bonded body. However, the bonded body of the present invention may be other than the inkjet head, and is suitably applied to, for example, a MEMS, an optical element, and the like. can do. Since these also have a fine structure, the effect of applying the present invention is remarkably exhibited.

  P10: bonded body P1: first member P2: second member P3: vapor deposition film (bonding material layer) P5: bonding portion M100: manufacturing apparatus M1: vapor deposition film formation portion (film formation portion) M10: chamber M11: first 1 vapor deposition source (curable resin) M12 ... 2nd vapor deposition source (curing agent) M13 ... 3rd vapor deposition source (primer) M14 ... container (first container) M15 ... container (second container) M16 ... Container (third container) M17 ... Pump M2 ... Deactivation processor M21 ... Deactivation processor M3 ... Joint processor M31 ... Joint means (heating means) M32 ... Pressing means M33 ... Support member M4 ... Holder M5 ... Conveying means 100 ... inkjet head 10 ... flow path forming substrate 11 ... pressure generating chamber 12 ... ink supply path 13 ... reservoir 14 ... nozzle communication hole 15 ... vibrating member 15a ... elastic membrane 5b ... Support plate 15c ... Island part 15d ... Thin part 16 ... Vibrating part 17 ... Adhesive layer 18 ... Adhesive layer 20 ... Nozzle plate 21 ... Nozzle 30 ... Piezoelectric element unit 31 ... Piezoelectric material 32 ... Electrode forming material 33 ... Electrode forming material 34 ... Piezoelectric element forming member 35 ... Piezoelectric element 36 ... Fixed substrate 40 ... Case 41 ... Ink introduction path 42 ... Space part 43 ... Piezoelectric element housing part 44 ... Case through-hole 45 ... Step part 46 ... Communication path 46a ... First Communication part 46b ... 2nd communication part 46c ... 3rd communication part 50 ... Flexible printed circuit board 51 ... Wiring layer 52 ... Base film 70 ... Wiring board 71 ... Conductive pad 72 ... Opening part 81 ... Silicon substrate 82 ... Diaphragm 83 ... lower electrode 84 ... piezoelectric thin film 85 ... upper electrode 86 ... second substrate (nozzle plate) 86A ... discharge nozzle 8 ... ink reservoir (cavity)

Claims (23)

A vapor deposition film forming step of volatilizing a curable resin, a curing agent, and a primer from different vapor deposition sources to form a vapor deposition film on the first member;
A joining method comprising: a joining process step of bringing the first member on which the deposited film is formed into contact with a second member and joining the first member and the second member.   In the bonding process, a heat treatment is performed at a heating temperature of 60 ° C. or more and 160 ° C. or less and a heating time of 5 minutes or more and 8 hours or less with the vapor deposition film sandwiched between the first member and the second member. The joining method according to claim 1, wherein the joining method is performed.   In the vapor deposition film forming step, after the first treatment for vapor-depositing the primer and forming the first region, and after the first treatment, the curable resin and the curing agent are vapor-deposited as a mixture, The bonding method according to claim 1, wherein the second processing for forming the region is performed.   The bonding method according to claim 3, wherein, in the vapor deposition film forming step, after the second treatment, a third treatment for vapor-depositing the primer to form a third region is performed.   4. The fourth process for forming a fourth region is performed by vapor-depositing the primer, the curable resin, and the curing agent as a mixture between the first process and the second process. Or the joining method of 4.   The said 4th area | region is formed as what has the area | region where the content rate of the said primer decreases gradually from the surface side facing the said 1st area | region toward the surface side facing the said 2nd area | region. 5. The joining method according to 5.   5. The fifth treatment for forming a fifth region is performed by depositing the primer, the curable resin, and the curing agent as a mixture between the second treatment and the third treatment. 7. The joining method according to any one of items 6 to 6.   The said 5th area | region is formed as what has the area | region where the content rate of the said primer increases gradually from the surface side facing the said 2nd area | region toward the surface side facing the said 3rd area | region. 8. The joining method according to 7.   The joining method according to any one of claims 1 to 8, wherein a primer is applied to a joining portion of the second member with the first member prior to the joining treatment step.   Prior to the joining treatment step, there is provided a deactivation treatment step of deactivating a portion of the vapor deposition film that should not contribute to the joining with the second member. The joining method according to item.   The bonding method according to claim 10, wherein the deactivation process step is performed in a state in which a portion of the vapor deposition film that should contribute to the bonding with the second member is masked.   The bonding method according to claim 10 or 11, wherein the deactivation treatment step is performed by one or more selected from the group consisting of plasma treatment, ultraviolet irradiation, and electron beam irradiation.   The bonding method according to claim 1, wherein the deposited film has a thickness of 2.0 μm to 15.0 μm.   The joining method according to claim 1, wherein the primer is a silane coupling agent.   The joining method according to claim 1, wherein the curable resin is an epoxy resin.   The bonding method according to claim 1, wherein the curing agent is one or more selected from the group consisting of diethylenetriamine, polyamidoamine, and phthalic anhydride.   The joining method according to any one of claims 1 to 16, wherein the first member has a width of a portion where the deposited film is to be formed in a range of 5 µm to 20 µm.   The joining method according to any one of claims 1 to 17, wherein a portion of the first member where the vapor deposition film is to be formed is adjacent to a portion having a tube structure.   The joining method according to claim 1, wherein the joined body is an inkjet head.   An apparatus for manufacturing a joined body, which performs the method according to any one of claims 1 to 19. A vapor deposition film forming unit that volatilizes a curable resin, a curing agent, and a primer from different vapor deposition sources, and forms a vapor deposition film on the first member;
A bonded body comprising: a bonding processing unit configured to bring the first member on which the deposited film is formed into contact with a second member and to bond the first member and the second member. manufacturing device.   A joined body manufactured using the joining method according to any one of claims 1 to 19.   A joined body manufactured using the manufacturing apparatus according to claim 20 or 21.

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