JP2015107442A - Two-fluid nozzle - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a two-fluid nozzle that is able to jet only gas in addition to a mixture fluid of liquid and gas, by means of a simple structure.SOLUTION: A two-fluid nozzle 56 that jets a mixture fluid 92 of gas and liquid comprises: a liquid supply opening 58; a gas supply opening 62; a jetting opening 80 for jetting a mixture fluid of liquid and gas; a ventilation passage 82 for allowing communication between the gas supply opening and jetting opening; and a water passage 84 that causes liquid, supplied from the liquid supply opening by being connected to the ventilation passage, to merge with gas flowing in the ventilation passage. The ventilation passage includes: a first narrow part 86 having a cross-sectional area narrower than the area of the gas supply opening; an expanded part 88 disposed between the first narrow part and jetting opening, and the ventilation passage of which is wider than that of the first narrow part. The water passage has a second narrow part 90 having a cross-sectional area narrower than the area of the liquid supply opening. The second narrow part is connected to the ventilation passage at right angle or at an angle of ±5° larger/smaller than right angle, between the expanded part and jetting opening of the ventilation passage with the narrow cross-sectional area.

Description

  The present invention relates to a two-fluid nozzle used for cleaning a workpiece such as a semiconductor wafer.

  For example, in a semiconductor device manufacturing process, the back surface of a semiconductor wafer on which a plurality of devices such as ICs and LSIs are formed is ground with a grinding device to process the semiconductor wafer to a predetermined thickness. Thereafter, the semiconductor wafer is diced along the division lines, and individual device chips are manufactured. The device chip thus obtained is packaged by resin sealing and widely used in various electronic devices such as mobile phones and personal computers.

  As a device for dicing a semiconductor wafer, a blade-type cutting device in which a thin disk-shaped cutting blade rotating at high speed is cut into a semiconductor wafer sucked and held on a chuck table (for example, for example, (See JP-A-8-25209).

  Since a semiconductor wafer diced by a blade-type cutting device needs to be cleaned in order to remove adhering cutting waste and the like, a cutting device provided with a cleaning device is provided (for example, JP, A 2003-229382 gazette).

  As described in Patent Document 2, the cleaning device provided in the semiconductor wafer cutting device holds the semiconductor wafer by adsorbing it to the spinner table, and supplies the cleaning water from the cleaning water supply nozzle while rotating the spinner table. The semiconductor wafer is cleaned by jetting.

  After the cleaning is completed, the supply of the cleaning water is stopped, and the spinner table is rotated while air is blown from the air nozzle to remove moisture and spin dry the semiconductor wafer.

JP-A-8-25209 JP 2003-229382 A

  As the cleaning water supply nozzle, a two-fluid nozzle that mixes cleaning water and air and injects it onto the semiconductor wafer may be used. In order to blow air when the semiconductor wafer is dried, air is blown to the semiconductor wafer from an air nozzle dedicated to air.

  In the cleaning device having such a configuration, it is necessary to prepare support arms and pipes that support the nozzles according to the number of nozzles, which complicates the configuration and increases the cost of the device itself. It is desired to reduce the number of pipes. Therefore, attempts have been made to reduce the number of nozzles by jetting only the gas used during drying in addition to the liquid and gas mixed fluid from the two-fluid nozzle used for cleaning.

  However, from the structure of the conventional two-fluid nozzle, even if the supply of the liquid is stopped and only the gas is injected, the liquid remaining in the liquid pipe may be sucked and injected by the gas flow, There is a problem that injection of only gas is difficult.

  The present invention has been made in view of the above points, and the object of the present invention is to provide a two-fluid nozzle that can eject only a gas in addition to ejecting a mixed fluid of liquid and gas with a simple structure. Is to provide.

  According to the present invention, a two-fluid nozzle that ejects a mixed fluid of a gas and a liquid, wherein the liquid is supplied from the liquid supply source by the liquid supply means, and the gas is supplied from the gas supply source by the gas supply means. A gas supply port, an injection port for injecting a fluid mixture of liquid and gas, a vent passage for communicating the gas supply port and the jet port, and a gas supply port connected to the vent passage and supplied from the liquid supply port A water passage that joins the liquid to the gas flowing through the air passage, the air passage having a cross-sectional area narrower than an area of the gas supply port, and the first throttle An expansion portion that is disposed between the first portion and the jet port, and has a cross-sectional area that is narrower than an area of the liquid supply port. A second throttle part having a narrow cross-sectional area. Between the extension portion and the injection port in kilometers, two-fluid nozzles, characterized in that connected at an angle of ± 5 ° from the perpendicular to the vent path is provided.

  Preferably, when a gas is supplied from the gas supply source to the gas supply port and a liquid is supplied from the liquid supply source to the liquid supply port, a mixed fluid of gas and liquid is injected from the injection port. When the gas is supplied from the gas supply source to the gas supply port and the supply of the liquid from the liquid supply source is interrupted, only the gas is injected from the injection port.

  According to the two-fluid nozzle of the present invention, the water passage has the second throttle portion in which the cross-sectional area of the water passage is narrower than the area of the liquid supply port, and the second throttle portion remains in the narrow cross-sectional area. Since the connection between the expansion portion and the injection port at the right angle is ± 5 ° from the right angle with respect to the air passage, the liquid remaining in the water passage when the gas is injected from the injection port is Since the second restrictor acts as a suction resistance when the gas passes through, the liquid remaining in the water passage is not sucked by the gas flow, and only the gas can be ejected from the ejection port.

It is a perspective view of the cutting device which equipped the two fluid nozzle of this invention in the washing | cleaning apparatus. It is a perspective view of the frame unit which is the form which supported the wafer with the annular frame via the dicing tape. It is a perspective view of the spinner washing | cleaning apparatus provided with the two-fluid nozzle of this invention. It is a perspective view of a spinner cleaning device in a state where a wafer is cleaned with a two-fluid nozzle. FIG. 5A is a longitudinal sectional view of a two-fluid nozzle according to an embodiment of the present invention in a state where a mixed fluid of liquid and gas is being ejected, and FIG. 5B is a two-fluid in a state where only gas is ejected. It is a longitudinal cross-sectional view of a nozzle.

  Hereinafter, embodiments of the present invention will be described in detail with reference to the drawings. Referring to FIG. 1, a perspective view of a cutting device 2 having a two-fluid nozzle of the present invention in a spinner cleaning device is shown.

  On the front side of the cutting apparatus 2, an operation panel 4 is provided for an operator to input instructions to the apparatus such as machining conditions. In the upper part of the apparatus, a display monitor 6 such as a CRT on which a guidance screen for an operator and an image captured by an imaging unit described later are displayed is provided.

  As shown in FIG. 2, the semiconductor wafer 11 which is a cutting target of the cutting apparatus 2 is made of, for example, a silicon wafer having a thickness of 100 μm, and a plurality of streets (division lines) are formed in a lattice shape on the surface. In addition, a device 15 such as an IC or LSI is formed in each region partitioned by a plurality of streets 13.

  As shown in FIG. 2, the semiconductor wafer 11 (which may be simply abbreviated as “wafer” hereinafter) configured as described above has a back surface adhered to a dicing tape T that is an adhesive tape, and the outer peripheral portion of the dicing tape T Is attached to the annular frame F to form a frame unit 17, and a plurality of frame units 17 are accommodated in the wafer cassette 8 shown in FIG. The wafer cassette 8 is placed on a cassette elevator 9 that can move up and down.

  Behind the wafer cassette 8, a loading / unloading unit 10 is provided for unloading the wafer 11 from the wafer cassette 8 and loading the wafer after cutting into the wafer cassette 8.

  Between the wafer cassette 8 and the carry-in / out unit 10, a temporary placement area 12, which is an area on which the wafer 11 to be carried in / out, is temporarily placed, is provided. A pair of centering bars 14 are arranged to align the two at a certain position.

  A transport unit 16 having a swivel arm that sucks and transports the wafer 11 is disposed in the vicinity of the temporary placement area 12, and the wafer 11 that has been transported to the temporary placement area 12 and aligned is transported by the transport unit 16. Is sucked and conveyed onto the chuck table 18 and sucked and held by the chuck table 18.

  The chuck table 18 is configured to be rotatable and reciprocally movable in the X-axis direction by a machining feed mechanism (not shown). An area to be cut of the wafer 11 is formed above the movement path of the chuck table 18 in the X-axis direction. An alignment unit 22 for detection is provided. Reference numeral 20 denotes a clamp for clamping the annular frame F.

  The alignment unit 22 includes an imaging unit 24 that images the surface of the wafer 11, and can detect a region to be cut by image processing such as pattern matching based on an image acquired by imaging. The image acquired by the imaging unit 24 is displayed on the display monitor 6.

  On the left side of the alignment unit 22, a cutting unit 26 for cutting the wafer 11 held on the chuck table 18 is disposed. The cutting unit 26 is configured integrally with the alignment unit 22, and both move together in the Y-axis direction and the Z-axis direction.

  The cutting unit 26 is configured by mounting a cutting blade 30 having a cutting edge on the outer periphery of the end of a rotatable spindle 28 and is movable in the Y-axis direction and the Z-axis direction. The cutting blade 30 is located on the extended line of the imaging unit 24 in the X-axis direction. The movement of the cutting unit 26 in the Y-axis direction is achieved by an index feed mechanism (not shown).

  Reference numeral 34 denotes a spinner cleaning device that cleans the wafer 11 that has been cut, and the wafer 11 that has been cut is transported to the spinner cleaning device 34 by the transport unit 32, and is subjected to spin cleaning and spin drying by the spinner cleaning device 34. .

  Referring to FIG. 3, a perspective view of a spinner cleaning device 34 having a two-fluid nozzle according to an embodiment of the present invention is shown. The spinner cleaning device 34 includes a spinner table 36 and a cleaning receptacle 38 disposed so as to surround the spinner table 36. The cleaning receptacle 38 is supported by three support legs 54 (only two are shown in FIGS. 3 and 5).

  The spinner table 36 includes a suction holding unit 40 made of a porous material such as porous ceramics, and a metal frame 42 surrounding the suction holding unit 40. The suction holding unit 40 is selectively communicated with suction means (not shown).

  Accordingly, the spinner table 36 sucks and holds the wafer 11 on the suction holding portion 40 via the dicing tape T by placing the frame unit 17 on the spinner table 36 and applying a negative pressure by suction means (not shown). To do. The annular frame F is fixed by a clamp (not shown).

  The spinner table 36 is connected to the output shaft 46 of the electric motor 44. The support mechanism 48 includes a plurality of support legs 50 and a plurality of air cylinders 52 connected to the support legs 50 and attached to the electric motor 44.

  The support mechanism 48 configured as described above operates the air cylinder 52 to move the electric motor 44 and the spinner table 36 to the wafer loading / unloading position, which is the raised position, and the lowered position shown in FIGS. 3 and 4. It can be positioned at the cleaning position.

  The spinner cleaning device 34 includes a two-fluid nozzle 56 that cleans the semiconductor wafer 11 after cutting. The two-fluid nozzle 56 is disposed so as to be swingable between a retracted position shown in FIG. 3 and a cleaning position above the wafer 11 shown in FIG. The two-fluid nozzle 56 ejects a mixed fluid of washing water and pressurized air.

  Next, the operation of the two-fluid nozzle 56 according to the embodiment of the present invention will be described with reference to FIG. 5A is a longitudinal sectional view of the two-fluid nozzle 56 in a state where a mixed fluid of liquid and air is ejected, and FIG. 5B is a longitudinal section of the two-fluid nozzle 56 in a state where only gas is ejected. FIG.

  The two-fluid nozzle 56 includes a liquid supply port 58 to which a liquid is supplied from a liquid supply source 66 by a liquid supply means 60, a gas supply port 62 to which a gas is supplied from a gas supply source 74 by a gas supply means 64, and a liquid. An injection port 80 for injecting a mixed fluid of gas, an air passage 82 for communicating the gas supply port 62 and the injection port 80, and a liquid supplied from the liquid supply port 58 connected to the air passage 82 through the air passage 82. And a water passage 84 that joins the flowing gas.

  The liquid supply means 60 includes a liquid supply source 66, a liquid supply path 68 that connects the liquid supply source 66 and the liquid supply port 58 of the two-fluid nozzle 56, and a liquid supply path 68 that opens and closes the liquid supply path 68. And a pump 72 that sends liquid from the liquid supply source 66 to the liquid supply port 58 of the two-fluid nozzle 56.

  The gas supply means 64 includes a gas supply source 74, a gas supply path 76 that connects the gas supply source 74 and the gas supply port 62 of the two-fluid nozzle 56, and a gas supply path 76 that opens and closes the gas supply path 76. And an electromagnetic valve 78 that performs the operation.

  The liquid supply source 66 supplies a liquid such as pure water, but is not limited to pure water as long as it is a liquid that can clean the wafer 11. The gas supply source 74 is composed of, for example, a compressed air source, and supplies the compressed air to the gas supply port 62 of the two-fluid nozzle 56.

  The air passage 82 of the two-fluid nozzle 56 is disposed between the first restrictor 86 having a cross-sectional area narrower than the area of the gas supply port 62, and between the first restrictor 86 and the injection port 80. The path 82 has an expansion portion 88 that expands more than the first throttle portion 86.

  The water passage 84 has a second throttle portion 90 in which the cross-sectional area of the water passage 84 is narrower than the area of the liquid supply port 58, and the second throttle portion 90 remains in the narrowed cross-sectional area. The expansion portion 88 and the injection port 80 are connected to the air passage 82 at a substantially right angle. Here, the approximate right angle is preferably within a range of ± 5 ° with respect to the right angle.

  As shown in FIG. 5A, when the solenoid valve 78 is switched to the open position, gas (compressed air) is supplied from the gas supply source 74 to the gas supply port 62 of the two-fluid nozzle 56, and the solenoid valve 70 is opened. When the pump 72 is operated by switching to the above, a liquid such as pure water is supplied from the liquid supply source 66 to the liquid supply port 58 of the two-fluid nozzle 56. Accordingly, a mixed fluid 92 of gas and liquid is ejected from the ejection port 80 of the two-fluid nozzle 56.

  On the other hand, as shown in FIG. 5B, when the electromagnetic valve 70 is switched to the closed position while the electromagnetic valve 78 is maintained in the open position, the supply of liquid from the liquid supply source 66 is stopped, but the two-fluid nozzle The liquid 96 remains in the 56 water passages 84.

  Since the water passage 84 is connected at a right angle between the expansion portion 88 and the injection port 80 in the air passage 82, a gas such as compressed air passes through the air passage 82 including the first throttle portion 86 and the expansion portion 88. Even if it has passed, the second throttle portion 90 acts as a suction resistance, so that the liquid 96 in the water passage 84 is not sucked by the gas flow, and only the gas 94 is jetted from the jet port 80 of the two-fluid nozzle 56. Is done.

  The water passage 84 is preferably connected at right angles to the air passage between the expansion portion 88 and the injection port 80 in the air passage 82, but is connected within a range of ± 5 ° with respect to the right angle. If so, it was confirmed that the liquid 96 in the water passage 84 was not sucked by the gas flow passing through the air passage 82.

  Although not particularly illustrated, when the electromagnetic valve 78 is switched to the closed position, the electromagnetic valve 70 is opened, and the pump 72 is operated, it is possible to inject liquid such as pure water from the liquid supply source 66 from the injection port 80 of the two-fluid nozzle 56. confirmed.

2 Cutting device 11 Semiconductor wafer 17 Frame unit 18 Chuck table 30 Cutting blade 34 Spinner cleaning device 36 Spinner table 44 Electric motor 56 Two-fluid nozzle 58 Liquid supply port 60 Liquid supply port 62 Gas supply port 64 Gas supply unit 66 Liquid supply source 72 Pump 74 Gas supply source 80 Injection port 82 Ventilation channel 84 Water channel 86 First throttle unit 88 Expansion unit 90 Second throttle unit

Claims (2)

A two-fluid nozzle for injecting a mixed fluid of gas and liquid,
A liquid supply port through which liquid is supplied from a liquid supply source by liquid supply means;
A gas supply port through which gas is supplied from a gas supply source by gas supply means;
An injection port for injecting a fluid mixture of liquid and gas;
An air passage for communicating the gas supply port and the injection port;
A water passage that is connected to the air passage and merges the liquid supplied from the liquid supply port with the gas flowing through the air passage,
The air passage is disposed between the first throttle portion having a cross-sectional area narrower than the area of the gas supply port, and between the first throttle portion and the injection port. An expansion portion that extends from the throttle portion of
The water passage has a second throttle part having a cross-sectional area narrower than the area of the liquid supply port, and the second throttle part remains in the narrow cross-sectional area and the extension part in the vent path and the A two-fluid nozzle characterized by being connected to the air passage at an angle of ± 5 ° from a right angle to the air inlet. When a gas is supplied from the gas supply source to the gas supply port and a liquid is supplied from the liquid supply source to the liquid supply port, a mixed fluid of gas and liquid is injected from the injection port,
The gas is supplied from the gas supply source to the gas supply port, and when the supply of the liquid from the liquid supply source is interrupted, only the gas is injected from the injection port. Two-fluid nozzle.

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