JP2015088757A - 低温工程を使用した高温半導体デバイスパッケージ及び構造のための方法及び装置 - Google Patents
低温工程を使用した高温半導体デバイスパッケージ及び構造のための方法及び装置 Download PDFInfo
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- JP2015088757A JP2015088757A JP2014221769A JP2014221769A JP2015088757A JP 2015088757 A JP2015088757 A JP 2015088757A JP 2014221769 A JP2014221769 A JP 2014221769A JP 2014221769 A JP2014221769 A JP 2014221769A JP 2015088757 A JP2015088757 A JP 2015088757A
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Abstract
Description
本発明の実施形態は、銀を使用して結合されている、セラミック材料、有機材料、及び金属材料の組合せを組み込む半導体デバイスパッケージを提供する。銀は、圧力及び低温(たとえば、250℃における焼結)下で微粒子(たとえば、ナノ粒子銀)の形態で被着される。被着後、銀は、一般的な銀の融点(すなわち、約962℃)を有する固体を形成し、それゆえ、完成したパッケージは、製造温度よりも大幅に高い温度に耐えることができる。さらに、銀は、様々な組合せ材料の間の界面材料であるため、熱膨張係数などの、セラミック、有機、及び金属の構成要素の間の異なる材料特性の影響は、銀の接合の温度が低いこと及び展性に起因して低減される。他の実施形態において、銀は、ヒートシンク又は大型貫通バイアの取り付けのためにプリント回路基板内で銅スラグの代わりに又は銅スラグとともに使用することができる。そのような実施形態は、銅スラグが含まれている場合に一般的であるよりも薄いPCBを提供する。
さらに、本明細書において使用される場合、「1つ(“a” or “an”)」という用語は、1つ又は2つ以上として定義される。さらに、特許請求の範囲における「少なくとも1つの」及び「1つ以上の」のような前置きの語句の使用は、不定冠詞「1つの (“a” or “an”)」による別の請求項要素の導入が、このように導入された請求項要素を含む任意の特定の請求項を、たとえ同じ請求項が前置きの語句「1つ以上の」又は「少なくとも1つの」及び「1つの (“a” or “an”)」のような不定冠詞を含む場合であっても、1つだけのこのような要素を含む発明に限定することを暗示するように解釈されるべきではない。同じことが、定冠詞の使用にも当てはまる。
Claims (6)
- 半導体デバイスパッケージにおいて、
前記半導体デバイスパッケージの第1の材料部分であって、前記第1の材料はセラミック又は有機材料のうちの一方を含んでなる、第1の材料部分と、
前記半導体デバイスパッケージの第2の材料部分であって、前記第2の材料は金属材料を含んでなる、第2の材料部分と、
前記半導体デバイスパッケージの前記第1の材料部分及び第2の材料部分を結合するように配置されている焼結銀領域とを備える、半導体デバイスパッケージ。 - 前記半導体デバイスパッケージは空洞パッケージからなり、
前記第1の材料部分は金属化セラミック・ウィンドウ・フレームからなり、
前記第2の材料部分は導電性金属ベースプレートからなる、請求項1に記載の半導体デバイスパッケージ。 - 前記半導体デバイスパッケージは空洞パッケージからなり、
前記第1の材料部分は金属化セラミック・ウィンドウ・フレームからなり、
前記第2の材料部分は導電性金属リードからなる、請求項1に記載の半導体デバイスパッケージ。 - 前記第1の材料部分はプリント回路基板からなり、
前記焼結銀領域は前記プリント回路基板内に形成されている孔の中に配置されている、請求項1に記載の半導体デバイスパッケージ。 - 前記第2の材料部分は、前記焼結銀領域内に配置されている金属スラグである、請求項8に記載の半導体デバイスパッケージ。
- 前記半導体デバイスパッケージは、前記金属スラグに熱的に結合されている半導体デバイスダイをさらに備え、前記金属スラグは銅を備える、請求項9に記載の半導体デバイスパッケージ。
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US9837328B2 (en) | 2017-12-05 |
US20160293508A1 (en) | 2016-10-06 |
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CN108807194B (zh) | 2022-04-12 |
CN104600054B (zh) | 2019-05-07 |
US9312231B2 (en) | 2016-04-12 |
US9837327B2 (en) | 2017-12-05 |
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US20160293568A1 (en) | 2016-10-06 |
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