JP2015082217A - Fingerprint sensor and authentication card using the same - Google Patents

Fingerprint sensor and authentication card using the same Download PDF

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Publication number
JP2015082217A
JP2015082217A JP2013219892A JP2013219892A JP2015082217A JP 2015082217 A JP2015082217 A JP 2015082217A JP 2013219892 A JP2013219892 A JP 2013219892A JP 2013219892 A JP2013219892 A JP 2013219892A JP 2015082217 A JP2015082217 A JP 2015082217A
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Japan
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fingerprint
fingerprint sensor
sensor element
main surface
authentication
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JP2013219892A
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Japanese (ja)
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井上 仁
Hitoshi Inoue
仁 井上
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セイコーエプソン株式会社
Seiko Epson Corp
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Abstract

PROBLEM TO BE SOLVED: To reduce a thickness of a fingerprint sensor and also reduce a cost of the fingerprint sensor.SOLUTION: A fingerprint sensor comprises: a fingerprint sensor element which has a detection surface for detecting a fingerprint and a plurality of external connection terminals on its principal surface; and a sensor substrate which has a first principal surface on which the fingerprint sensor element is mounted via the external connection terminals, an opening formed at a part opposite to an area including the detection surface of the fingerprint sensor element, and an electrode for detecting a finger around the opening on a second principal surface opposite to the first principal surface.

Description

  The present invention relates to a fingerprint sensor for detecting a fingerprint, and an authentication card using such a fingerprint sensor.

  The fingerprint sensor is used to detect a fingerprint pattern in fingerprint authentication. As a method for detecting a fingerprint by the fingerprint sensor, there are a capacitance method for sensing the amount of electric charge, a heat sensitive method for sensing heat, an optical method for photographing a fingerprint pattern, and the like. Among them, the electrostatic capacity method is most suitable for miniaturization and is a general method.

  In the manufacture of a fingerprint sensor, when the fingerprint sensor element is mounted on a sensor substrate, the detection surface of the fingerprint sensor element is generally arranged so as to face away from the sensor substrate. Further, since the plurality of external connection terminals of the fingerprint sensor element also face the opposite side of the sensor substrate in the same manner as the detection surface, the external connection terminals are connected to the wiring electrodes of the sensor substrate, for example, by wire bonding. The wire protrudes about 100 μm to 150 μm outside the detection surface of the fingerprint sensor element.

  Further, when a conductive frame for detecting a finger that is a target for fingerprint detection is provided in the fingerprint sensor, the conductive frame is mounted on the sensor substrate so as to cover the fingerprint sensor element. The conductive frame has a top plate at a position higher than the height of the detection surface of the fingerprint sensor element, and the top plate has an opening at a portion facing a region including the detection surface of the fingerprint sensor element. Furthermore, when wire bonding is used to connect the external connection terminals of the fingerprint sensor element, it is necessary to raise the position of the top plate by about 100 μm to 150 μm in consideration of the space for the wire.

  The thickness of the fingerprint sensor configured in this way is mainly the sum of the thickness of the sensor substrate and the height of the conductive frame, and the height of the conductive frame is higher than the height of the detection surface of the fingerprint sensor element. It was difficult to reduce the thickness of the entire fingerprint sensor. In addition, the cost of the fingerprint sensor has increased due to the provision of the conductive frame.

  As a related technique, Japanese Patent Application Laid-Open No. 2004-228561 is intended to solve the problem that the apparatus is enlarged by providing a biometric detection unit that prevents a collation process using illegally acquired fingerprint information from being executed. A fingerprint collation apparatus that can execute a reliable fingerprint collation process with a simple apparatus configuration is disclosed. This fingerprint collation apparatus is a fingerprint collation apparatus that has a semiconductor fingerprint sensor that detects fingerprint information by an electrostatic capacity method and performs collation processing of the detected fingerprint information, and a measurement electrode pair in contact with a subject, Based on the object signal generating means for generating an object signal having a frequency corresponding to the capacitance of the object when the object is in contact with the measurement electrode pair, and the object signal generated by the object signal generating means And determining means for determining whether or not the subject is a living body, and providing the measurement electrode pair in a mold part formed at the periphery of the sensor part of the semiconductor fingerprint sensor when the semiconductor fingerprint sensor is sealed with the mold It is characterized by.

Japanese Patent Laying-Open No. 2004-234245 (paragraphs 0004-0008, FIG. 12)

  However, when manufacturing an authentication card using such a semiconductor fingerprint sensor, it is necessary to prepare a wiring board (sensor board) on which the semiconductor fingerprint sensor is mounted. If it is connected to the wiring electrode of the sensor substrate by bonding, the thickness of the authentication card or the like will be increased by the space for the wire.

  Moreover, in the fingerprint collation apparatus of Patent Document 1, since the measurement electrode pair is provided only in a part of the mold part, when the subject's finger contacts the detection surface of the semiconductor fingerprint sensor, the measurement electrode pair May not touch. On the other hand, if the measurement electrode pair is provided over the periphery of the mold part, the cost of the semiconductor fingerprint sensor increases.

  Accordingly, one object of the present invention is to reduce the thickness of the fingerprint sensor and reduce the cost of the fingerprint sensor. Another object of the present invention is to provide an authentication card or the like using such a fingerprint sensor.

  In order to solve the above problems, a fingerprint sensor according to one aspect of the present invention includes a fingerprint sensor element having a detection surface for detecting a fingerprint and a plurality of external connection terminals on a main surface, and the fingerprint sensor element having an external connection terminal. An opening is formed in a portion facing the region including the detection surface of the fingerprint sensor element, and an opening is formed in the second main surface facing the first main surface. And a sensor substrate provided with an electrode for detecting a finger in the periphery of the unit.

  According to one aspect of the present invention, the fingerprint sensor element is mounted on the first main surface of the sensor substrate via the external connection terminal, and an electrode for detecting a finger is provided on the second main surface of the sensor substrate. By providing, the thickness of the fingerprint sensor is mainly the sum of the thickness of the sensor substrate and the thickness of the fingerprint sensor element, so that the thickness of the fingerprint sensor can be reduced. Further, since a conductive frame for detecting a finger is not required, the cost of the fingerprint sensor can be reduced.

  Here, a plurality of external connection terminals of the fingerprint sensor element may be arranged on one end side of the main surface of the fingerprint sensor element, and may include gold (Au) bumps. By providing gold (Au) bumps on the external connection terminals arranged on the main surface of the fingerprint sensor element, the fingerprint sensor element is sensord with the detection surface of the fingerprint sensor element facing the sensor substrate (face down). It can be mounted on the substrate via an external connection terminal.

  In that case, the fingerprint sensor may further include a resin-containing layer provided in accordance with the thickness of the bump on one end side and the other end side of the main surface of the fingerprint sensor element. As a result, the gap length between the sensor substrate at both ends of the main surface of the fingerprint sensor element is adjusted, and the fingerprint sensor element is fixed to the sensor substrate so that the detection surface of the fingerprint sensor element is substantially parallel to the sensor substrate. As a result, the connection reliability of the bumps is increased.

  The resin-containing layer contains at least one of ACF (anisotropic conductive film), ACP (anisotropic conductive paste), NCF (non-conductive film), and NCP (non-conductive paste). You may make it. Since these films or pastes have low fluidity, there is no possibility of flowing out to the detection surface of the fingerprint sensor element.

  In the above, the sensor substrate may include a base material and a wiring layer provided on the first main surface, and the electrode, the base material, the wiring layer, and the fingerprint sensor element may be sequentially stacked. As a result, since the electrode protrudes from the detection surface of the fingerprint sensor element, when the finger to be subjected to fingerprint detection touches the detection surface of the fingerprint sensor element, the finger can easily touch the electrode.

  The electrode may have a laminated structure including a copper (Cu) base layer, a nickel (Ni) plating layer, and a gold (Au) plating layer in this order. Thereby, the corrosion resistance of an electrode can be improved.

  An authentication card according to one aspect of the present invention provides any one of the above fingerprint sensors, a data storage unit for storing pre-registered authentication fingerprint data, and fingerprint data based on a detection signal output from the fingerprint sensor element. And an authentication unit that performs an authentication operation by creating and comparing the fingerprint data with the authentication fingerprint data. According to one aspect of the present invention, by using a thin fingerprint sensor, the thickness of an authentication card that performs an authentication operation based on a detection signal output from the fingerprint sensor can be reduced.

  Here, the authentication card further includes a timer unit that measures time and outputs time data representing the current time, and a display unit that displays a password, and the data storage unit converts the time data representing a plurality of times into time data. Correspondingly, a plurality of passwords are further stored, and when the authentication unit determines that the fingerprint represented by the fingerprint data created based on the detection signal matches the fingerprint represented by the authentication fingerprint data, the data storage unit The password corresponding to the time data output by the timekeeping unit may be read from the plurality of passwords stored in the password, and the password may be displayed on the display unit. Thus, the authentication card can display a one-time password that changes according to the time when the user's fingerprint matches a pre-registered authentication fingerprint.

  In this case, the authentication card is disposed on the first main surface of the sensor substrate and on the second main surface of the sensor substrate, and at least one of the detection surface of the fingerprint sensor element and the electrode. An opening may be formed in a portion facing the region including the portion, and a second protective sheet having an opening formed in a portion facing the region including the display surface of the display portion may be further included. By providing the first and second protective sheets, the internal circuit of the personal identification card can be protected.

The top view of the authentication card | curd using the fingerprint sensor which concerns on one Embodiment of this invention. The figure which shows a part of fingerprint sensor element and authentication card | curd shown in FIG. FIG. 3 is a schematic diagram illustrating a configuration example of a fingerprint sensor element illustrated in FIG. 2. The block diagram which shows the structural example of the authentication card | curd shown in FIG.

Hereinafter, embodiments of the present invention will be described in detail with reference to the drawings. In addition, the same referential mark is attached | subjected to the same component and the overlapping description is abbreviate | omitted.
The fingerprint sensor according to the present invention is used by being incorporated in, for example, an authentication card (security IC card) that detects an individual's fingerprint and performs an authentication operation. In the following, as an example, an embodiment will be described in which a fingerprint sensor is incorporated in an authentication card that displays a password when a fingerprint of a person is detected and the fingerprint is authenticated.

  FIG. 1 is a plan view of an authentication card using a fingerprint sensor according to an embodiment of the present invention. In FIG. 1, the protective sheet is omitted and the inside of the authentication card is shown. As shown in FIG. 1, the authentication card includes a sensor substrate 10 provided with an electrode 18 for detecting a finger to be subjected to fingerprint detection, a fingerprint sensor element 20 having a detection surface 20a for detecting a fingerprint, And a display unit 30 having a display surface 30a for displaying a password when the fingerprint is authenticated. Here, the fingerprint sensor element 20 and at least a part of the sensor substrate 10 constitute a fingerprint sensor.

  FIG. 2 is a diagram showing a part of the fingerprint sensor element and the authentication card shown in FIG. 2A is a plan view of the fingerprint sensor element, and FIG. 2B is a partial cross-sectional view of the authentication card around the fingerprint sensor element. The fingerprint sensor element 20 is configured as a semiconductor integrated circuit (IC), and includes a detection surface 20a for detecting a fingerprint and a plurality of external connection terminals 21 on the main surface of the fingerprint sensor element 20 (an upper surface in FIG. 2B). ).

  As shown in FIG. 2B, the sensor substrate 10 has a first main surface (lower surface in the figure) on which the fingerprint sensor element 20 is mounted via flip-chip bonding via an external connection terminal 21, and the fingerprint sensor An opening 10a is formed in a portion of the element 20 that faces the region including the detection surface 20a. In addition, on the second main surface (upper surface in the drawing) facing the first main surface of the sensor substrate 10, an electrode 18 for detecting a finger to be subjected to fingerprint detection is provided around the opening 10a. ing. As shown in FIG. 1, the electrode 18 is desirably provided around the opening 10a.

  The sensor substrate 10 includes a base material 11, a first wiring layer 12 and a first solder resist layer 13 provided on the first main surface, and a second wiring layer 14 provided on the second main surface. And a second solder resist layer 15. The base material 11 is comprised by the polyimide film, for example. The 1st wiring layer 12 and the 2nd wiring layer 14 are comprised by the copper (Cu) foil by which pattern formation was carried out on both surfaces of the base material 11, for example.

  The 1st soldering resist layer 13 is not provided in the area | region of the 1st wiring layer 12 to which the terminal of an electronic component is connected. The second solder resist layer 15 is not provided in the region of the second wiring layer 14 where the electrode 18 is formed. The electrode 18 has, for example, a laminated structure including a copper (Cu) base layer formed on the second wiring layer 14, a nickel (Ni) plating layer 16, and a gold (Au) plating layer 17 in this order. Yes. Thereby, the corrosion resistance of the electrode 18 can be improved.

  In the position P shown in FIG. 2B, the electrode 18, the base material 11, the first wiring layer 12, and the fingerprint sensor element 20 are laminated in order from the top in the drawing. As a result, the electrode 18 protrudes from the detection surface 20 a of the fingerprint sensor element 20, so that when the finger to be subjected to fingerprint detection touches the detection surface 20 a of the fingerprint sensor element 20, the finger can easily touch the electrode 18.

  The plurality of external connection terminals 21 of the fingerprint sensor element 20 are arranged on one end side (left side in the figure) of the main surface of the fingerprint sensor element 20 and may include gold (Au) bumps. By providing gold (Au) bumps on the external connection terminals 21 arranged on the main surface of the fingerprint sensor element 20, the detection surface 20a of the fingerprint sensor element 20 faces the sensor substrate 10 side (face down), The fingerprint sensor element 20 can be mounted on the sensor substrate 10 via the external connection terminal 21 by flip chip bonding.

  The fingerprint sensor element 20 is flip-chip bonded to the first main surface of the sensor substrate 10 using ACF (Anisotropic Conductive Film) or ACP (Anisotropic Conductive Paste). May be mounted via the external connection terminal 21.

  ACF is a film produced by molding fine conductive particles mixed with a thermosetting resin into a film shape. Here, the conductive particles are, for example, spheres having a diameter of about 3 μm to 5 μm, in which a nickel layer, a gold plating layer, and an insulating layer are stacked on the outermost side. ACP is a paste produced by diffusing conductive particles in a resin, and is different from ACF in that it is not molded as a film.

  When the ACF is used for mounting the fingerprint sensor element 20, the ACF is sandwiched between the external connection terminal 21 of the fingerprint sensor element 20 and the connection electrode formed on the first wiring layer 12 of the sensor substrate 10, and a heater or the like When the fingerprint sensor element 20 is pressurized with a pad of rubber or the like having elasticity while applying heat, pressure is applied only to the film portion to which the bumps of the external connection terminal 21 hit.

  As a result, the conductive particles dispersed in the film overlap with each other while being in contact with each other, and are eventually pressed to bond the plating layers in the conductive particles to each other in the longitudinal direction (substantially the first main surface of the sensor substrate 10). Conductive paths in the direction perpendicular to each other are formed. Thereby, the external connection terminal 21 of the fingerprint sensor element 20 and the connection electrode of the sensor substrate 10 are electrically connected.

  On the other hand, since the conductive particles in the film portion where no pressure is applied hold the insulating layer, the insulation between the terminals arranged in the lateral direction (direction substantially parallel to the first main surface of the sensor substrate 10) is not caused. Retained. That is, anisotropy having conductivity in the vertical direction and insulation in the horizontal direction is realized. Thereby, even if the interval between the terminals arranged in the horizontal direction is narrow, the fingerprint sensor element 20 can be mounted without causing a short circuit between the terminals.

  Alternatively, the fingerprint sensor element 20 is flipped to the first main surface of the sensor substrate 10 using NCF (Non-Conductive Film) or NCP (Non-Conductive Paste). It may be mounted via the external connection terminal 21 by chip bonding. NCF or NCP is a film or paste that has a resin as a main component and adheres an electronic component to a substrate.

  When NCF or NCP is used for mounting the fingerprint sensor element 20, when the fingerprint sensor element 20 is pressed, the NCF or NCP with which the bump of the external connection terminal 21 abuts is pushed away, and the external connection terminal of the fingerprint sensor element 20 21 and the connection electrode of the sensor substrate 10 are directly connected.

  Since these films or pastes have low fluidity, there is no possibility of flowing out to the detection surface 20 a of the fingerprint sensor element 20. When at least one of ACF, ACP, NCF, and NCP is used for mounting the fingerprint sensor element 20, it constitutes the resin-containing layer 19.

  As shown in FIG. 2B, the fingerprint sensor is provided on one end side (left side in the figure) and the other end side (right side in the figure) of the main surface of the fingerprint sensor element 20 according to the thickness of the bump. A resin-containing layer 19 is included. Thereby, the gap length between the sensor substrate 10 at both ends of the principal surface of the fingerprint sensor element 20 is adjusted, and the fingerprint sensor element 20 is set so that the detection surface 20a of the fingerprint sensor element 20 is substantially parallel to the sensor substrate 10. Can be fixed to the sensor substrate 10, so that the connection reliability of the bumps is increased.

  Further, the resin-containing layer 19 may be filled between the main surface of the fingerprint sensor element 20 and the first main surface of the sensor substrate 10 around the opening 10 a of the sensor substrate 10. In that case, since the gap between the main surface of the fingerprint sensor element 20 and the first main surface of the sensor substrate 10 is closed, it is possible to prevent intrusion of dust, moisture or the like into the authentication card. .

  In order to protect the sensor substrate 10 on which the fingerprint sensor element 20 and the display unit 30 (FIG. 1) are mounted, a protective sheet 41 is disposed on the first main surface of the sensor substrate 10, and the second of the sensor substrate 10. A protective sheet 42 is disposed on the main surface. Here, a resin or the like may be filled in the gap between the protective sheet 41 and the sensor substrate 10 around the fingerprint sensor element 20 or the like.

  The protective sheet 42 has an opening formed in a portion facing the detection surface 20a of the fingerprint sensor element 20 and a region including at least a part of the electrode 18, and a region including the display surface 30a of the display unit 30 shown in FIG. An opening is formed in a portion opposite to. By providing the protective sheets 41 and 42, the internal circuit of the personal identification card can be protected.

  Here, it is assumed that the thickness of the base material 11 and the first wiring layer 12 of the sensor substrate 10 is 80 μm, the thickness of the fingerprint sensor element 20 excluding the external connection terminal 21 is 230 μm, and the external connection terminal 21 Assuming that the thickness is 20 μm and the thickness of the electrode 18 is 20 μm, the thickness T1 of the fingerprint sensor is about 350 μm.

  On the other hand, when the conductive frame is mounted on the sensor substrate so as to cover the fingerprint sensor element, the thickness of the substrate and the wiring layer of the sensor substrate is 80 μm, and the height of the conductive frame is required to be about 480 μm. The thickness of the fingerprint sensor is about 560 μm. Therefore, according to the present embodiment, the thickness of the fingerprint sensor can be reduced by about 210 μm compared to the case where the conductive frame is mounted on the sensor substrate.

  As described above, the fingerprint sensor element 20 is mounted on the first main surface of the sensor substrate 10 via the external connection terminals 21 by flip chip bonding, and the finger is detected on the second main surface of the sensor substrate 10. By providing the electrode 18, the thickness of the fingerprint sensor is mainly the sum of the thickness of the sensor substrate 10 and the thickness of the fingerprint sensor element 20, so that the thickness of the fingerprint sensor can be reduced. Further, since a conductive frame for detecting a finger is not required, the cost of the fingerprint sensor can be reduced.

  Furthermore, assuming that the thickness of each of the protective sheets 41 and 42 is 100 μm, the thickness T2 of the authentication card is about 550 μm. Thus, by using a thin fingerprint sensor, the thickness of the authentication card that performs the authentication operation based on the detection signal output from the fingerprint sensor can be reduced.

  FIG. 3 is a schematic diagram showing a configuration example of the fingerprint sensor element shown in FIG. The fingerprint sensor element 20 is an electrostatic capacitance type, and outputs a detection signal by detecting an electrostatic capacitance that changes in accordance with the distance between the fingerprint having an uneven shape and the detection surface 20a. Such a capacitance-type fingerprint sensor element 20 can be easily reduced in thickness because a light source is unnecessary, and by appropriately selecting an insulating film (passivation film) as a surface protective layer. It is possible to improve the scratch resistance.

A plurality of scanning lines (not shown) formed in parallel to each other at predetermined intervals on the semiconductor substrate of the fingerprint sensor element 20 and formed in parallel to each other at predetermined intervals so as to be orthogonal to the scanning lines. A plurality of signal lines 22 are provided. A detection circuit 26 including transistors 23 and 24 and a capacitor 25 is provided at a position corresponding to each of the intersections of the plurality of scanning lines and the plurality of signal lines 22. In addition, a transistor 27 is provided to supply the power supply potential V DD to the detection circuit 26.

  The plurality of scanning lines, the plurality of signal lines 22 and the plurality of detection circuits 26 constitute an active matrix array. In the upper layer of the active matrix array, a plurality of detection electrodes 28 are provided in a two-dimensional matrix at positions corresponding to the plurality of detection circuits 26. These detection electrodes 28 are covered with an insulating film (passivation film) 29, and the insulating film 29 can come into contact with a finger to be subjected to fingerprint detection.

  In the fingerprint sensor element 20 configured as described above, when a finger to be subjected to fingerprint detection comes into contact with the detection surface 20a, electrostatic capacitance (two-dimensionally distributed between the finger and the plurality of detection electrodes 28) ( C1, C2, C3, etc.) are generated. By electrically reading out the value of this capacitance using an active matrix array, a fine uneven pattern (fingerprint) formed on the surface of the finger can be detected.

Here, the electrode 18 provided on the sensor substrate 10 (FIG. 1) is used to detect that a finger to be subjected to fingerprint detection has contacted the detection surface 20a of the fingerprint sensor element 20. Electrode 18 may be connected to a reference potential V SS of the detection circuit 26 may be connected to a DC potential V1.

  In the standby mode before the fingerprint detection operation is performed, the control circuit 6 (see FIG. 4) provided in the authentication card activates at least one scanning line to a high level. As a result, the transistor 23 connected to the gate of the scanning line activated at the high level is turned on.

  When a finger to be subjected to fingerprint detection comes into contact with the electrode 18 and the detection surface 20a, the impedance of the finger is added between the electrode 18 and the detection surface 20a. As a result, the potential of the electrode 18 is applied to the gate of the transistor 24 via the impedance of the finger and the capacitance of the insulating film 29, and the gate potential varies. The transistor 24 connected to the transistor 23 in the on state generates a current corresponding to the changing gate potential as a detection signal, and sends the detection signal to the analog circuit 5 (see FIG. 4) provided in the authentication card. Output.

  When the level fluctuation of the detection signal output from the transistor 24 connected to the transistor 23 that is turned on exceeds the threshold value, the control circuit 6 causes the finger to be subjected to fingerprint detection to detect the detection surface 20a of the fingerprint sensor element 20. The fingerprint sensor is determined to have touched, and the fingerprint sensor is shifted to the fingerprint detection mode. In addition, when fingerprint authentication is attempted using an insulator having illegally acquired fingerprint information, the impedance of the insulator is very large compared to the impedance of the living body, so the level fluctuation of the detection signal has a threshold value. Never exceed.

In the capacitive fingerprint sensor element 20, in order to avoid discharge destruction due to static electricity charged on the human body, the static electricity charged on the finger to be subjected to fingerprint detection is discharged and the potential of the finger is set before the fingerprint detection. it is effective to close potential to the reference potential V SS of the detection circuit 26. In order to stably detect the capacitance value at the time of fingerprint detection, it is desirable to fix the potential of the finger to be subjected to fingerprint detection to a predetermined potential. Therefore, the potential of the electrode 18 is desirably set to a predetermined potential within the range of the reference potential V SS to the power supply potential V DD of the detection circuit 26.

In the fingerprint detection mode, the plurality of scanning lines are sequentially activated to a high level. As a result, the transistor 23 connected to the gate of the scanning line activated at the high level is turned on. In addition, the gate of the transistor 24 includes the power supply potential V DD and the potential of the electrode 18 depending on the capacitance connected to the gate (for example, the capacitance of the capacitor 25 and the capacitances C1 and C2) and the impedance of the finger. A potential generated by dividing the potential difference between the two is applied.

  The transistor 24 connected to the transistor 23 that is turned on generates a current corresponding to the potential applied to the gate as a detection signal. The detection signal generated by the transistor 24 is output to the analog circuit 5 through the signal line 22. Thereby, a fingerprint detection operation is performed. When the fingerprint detection operation is completed, the control circuit 6 shifts the fingerprint sensor to the standby mode.

  FIG. 4 is a block diagram showing a configuration example of the authentication card shown in FIG. As shown in FIG. 4, the authentication card includes a fingerprint sensor element 20, an analog circuit 5, a control circuit 6, a timer unit 7, a data storage unit 8, a display unit 30, and a power supply unit 100. Yes. These are mounted on the sensor substrate 10 shown in FIG. Here, the analog circuit 5 and the control circuit 6 create fingerprint data based on the detection signal output from the fingerprint sensor element 20, and perform an authentication operation by comparing the created fingerprint data with the authentication fingerprint data. Part.

  The analog circuit 5 includes an I / V conversion circuit 51 and an amplifier 52. The I / V conversion circuit 51 converts the current (detection signal) output from the fingerprint sensor element 20 into a voltage and outputs the voltage to the amplifier 52. The amplifier 52 amplifies the voltage output from the I / V conversion circuit 51 and outputs the amplified voltage to the control circuit 6.

  The control circuit 6 includes a decoder 61, an A / D conversion circuit 62, a CPU (Central Processing Unit) 63, a volatile memory 64 such as a RAM (Random Access Memory), and a nonvolatile memory such as a ROM (Read Only Memory). And a memory 65. Under the control of the CPU 63, the decoder 61 activates at least one scanning line of the fingerprint sensor element 20 in the standby mode, and sequentially activates a plurality of scanning lines of the fingerprint sensor element 20 in the fingerprint detection mode.

  The A / D conversion circuit 62 generates detection data by performing analog / digital conversion on the voltage output from the amplifier 52, and outputs the detection data to the CPU 63. The CPU 63 operates according to the fingerprint analysis program stored in the nonvolatile memory 65 while using the volatile memory 64 as a work area. The fingerprint analysis program causes the CPU 63 to execute fingerprint analysis processing.

  The timer unit 7 measures time based on a clock signal generated inside the authentication card or a clock signal supplied wirelessly from the outside, generates time data representing the current time, and outputs the time data to the CPU 63. When a clock signal generated inside the authentication card is used for time measurement, reference time data representing a reference time is stored in the data storage unit 8 when the authentication card is manufactured, and the time measuring unit 7 generates time data based on the reference time data.

  The data storage unit 8 includes a nonvolatile memory such as an EEPROM (Electrically Erasable Programmable Read Only Memory), stores pre-registered authentication fingerprint data, and stores a plurality of times such as every hour or every minute. A plurality of passwords are stored corresponding to the time data to be represented. The password may include letters such as alphabets, or may be composed only of numbers.

  The display unit 30 includes, for example, an extremely thin display panel such as an EPD (Electrophoretic Display), and displays the password read from the data storage unit 8 by the CPU 63. The power supply unit 100 includes, for example, a lithium polymer battery and supplies power to each unit in the authentication card.

  In the fingerprint analysis process, the CPU 63 creates fingerprint data by extracting feature points from the fingerprint image based on the detection data output from the A / D conversion circuit 62, or creates a fingerprint image pattern. Create fingerprint data to represent. Further, the CPU 63 confirms the identity by comparing the created fingerprint data with the authentication fingerprint data stored in the data storage unit 8. That is, the CPU 63 compares the created fingerprint data with the authentication fingerprint data by comparing feature points, pattern matching processing, or the like, and the fingerprint represented by the created fingerprint data is changed to the fingerprint represented by the authentication fingerprint data. It is determined whether or not they match.

  Further, when the CPU 63 determines that the fingerprint represented by the fingerprint data created based on the detection data matches the fingerprint represented by the authentication fingerprint data, the CPU 63 stores a plurality of passwords stored in the data storage unit 8. The password (one-time password) corresponding to the time data output from the timer unit 7 is read from the inside, and the password is displayed on the display unit 30.

  As a result, the user of the authentication card can know an appropriate password at the current time. Therefore, for example, the key lock of the door can be released by inputting an appropriate password to a password input device provided near the door of the building. Alternatively, by entering an appropriate password in a terminal device such as a personal computer, the buying and selling procedure and the financial transaction can be performed.

  In the above-described embodiment, the example in which the password is displayed on the display unit has been described. However, the present invention is not limited to the above-described embodiment. For example, a transmission unit that wirelessly transmits a password or an authentication signal may be provided without providing a display unit. Further, the password or the authentication signal does not necessarily change according to the time, and may be always constant. Thus, many modifications are possible within the technical idea of the present invention by those who have ordinary knowledge in the technical field.

  DESCRIPTION OF SYMBOLS 10 ... Sensor board | substrate, 10a ... Opening part, 11 ... Base material, 12 ... 1st wiring layer, 13 ... 1st soldering resist layer, 14 ... 2nd wiring layer, 15 ... 2nd soldering resist layer, 16 DESCRIPTION OF SYMBOLS ... Nickel (Ni) plating layer, 17 ... Gold (Au) plating layer, 18 ... Electrode, 19 ... Resin containing layer, 20 ... Fingerprint sensor element, 20a ... Detection surface, 21 ... External connection terminal, 22 ... Signal line, 23 24, 27 ... transistor, 25 ... capacitor, 26 ... detection circuit, 28 ... detection electrode, 29 ... insulating film, 30 ... display portion, 30a ... display surface, 41, 42 ... protection sheet, 5 ... analog circuit, 51 ... I / V conversion circuit, 52 ... Amplifier, 6 ... Control circuit, 61 ... Decoder, 62 ... A / D conversion circuit, 63 ... CPU, 64 ... Volatile memory, 65 ... Nonvolatile memory, 7 ... Time measuring unit, 8 ... Data storage, 00 ... power supply unit

Claims (9)

  1. A fingerprint sensor element having a detection surface for detecting a fingerprint and a plurality of external connection terminals on the main surface;
    The fingerprint sensor element has a first main surface mounted via an external connection terminal, an opening is formed in a portion facing a region including a detection surface of the fingerprint sensor element, and the first main surface A sensor substrate provided with an electrode for detecting a finger around the opening in the second main surface facing
    A fingerprint sensor.
  2.   The fingerprint sensor according to claim 1, wherein the plurality of external connection terminals of the fingerprint sensor element are arranged on one end side of the main surface of the fingerprint sensor element and include gold (Au) bumps.
  3.   The fingerprint sensor according to claim 2, further comprising a resin-containing layer provided in accordance with the thickness of the bump on one end side and the other end side of the main surface of the fingerprint sensor element.
  4.   The resin-containing layer includes at least one of ACF (anisotropic conductive film), ACP (anisotropic conductive paste), NCF (non-conductive film), and NCP (non-conductive paste). The fingerprint sensor according to claim 3, further comprising:
  5.   The sensor substrate includes a base material and a wiring layer provided on the first main surface, and the electrode, the base material, the wiring layer, and the fingerprint sensor element are sequentially stacked. The fingerprint sensor according to any one of claims 1 to 4.
  6.   The fingerprint sensor according to claim 1, wherein the electrode has a laminated structure including a copper (Cu) base layer, a nickel (Ni) plating layer, and a gold (Au) plating layer in order.
  7. The fingerprint sensor according to any one of claims 1 to 6,
    A data storage unit for storing pre-registered authentication fingerprint data;
    An authentication unit that creates fingerprint data based on a detection signal output from the fingerprint sensor element and performs an authentication operation by comparing the fingerprint data with authentication fingerprint data;
    An authentication card comprising:
  8. A timekeeping unit that measures time and outputs time data representing the current time;
    A display for displaying the password;
    Further comprising
    The data storage unit further stores a plurality of passwords corresponding to time data representing a plurality of times,
    When the authentication unit determines that the fingerprint represented by the fingerprint data created based on the detection signal matches the fingerprint represented by the authentication fingerprint data, the plurality of passwords stored in the data storage unit Read the password corresponding to the time data output by the timekeeping unit from within, and display the password on the display unit,
    The authentication card according to claim 7.
  9. A first protective sheet disposed on the first main surface of the sensor substrate;
    An opening is formed in a portion disposed on the second main surface of the sensor substrate and facing a detection surface of the fingerprint sensor element and a region including at least a part of the electrode, and a display surface of the display unit A second protective sheet in which an opening is formed in a portion facing the containing region;
    The authentication card according to claim 8, further comprising:
JP2013219892A 2013-10-23 2013-10-23 Fingerprint sensor and authentication card using the same Withdrawn JP2015082217A (en)

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