JP2015070158A - Led light emitting device - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide an LED light emitting device capable of preventing or inhibiting the occurrence of leaked light.SOLUTION: An LED light emitting device of the invention includes: a metal substrate; a wiring formation metal layer provided on the metal substrate through an insulation layer; an LED element which is electrically connected with the wiring formation metal layer; and an intermediate insulation layer provided on the insulation layer and covering the wiring formation metal layer; and a frame-like metal thin layer which is formed on the intermediate insulation layer so as to enclose a region in which the LED element is disposed.

Description

  The present invention relates to an LED light emitting device on which an LED element is mounted.

In recent years, in light emitting devices, LED elements are used as light source elements due to demands for energy saving and miniaturization. An LED light emitting device on which such an LED element is mounted is described in Patent Document 1, for example.
In this LED light emitting device, an LED element is disposed on the surface of an insulating layer covering the patterned metal layer for wiring formation, and a light shielding frame is disposed so as to surround the LED element.

JP 2010-212352 A

However, it has been found that the above LED light emitting device has the following problems.
Since the patterned metal layer for wiring formation exists on the back surface of the insulating layer, irregularities corresponding to the pattern of the metal layer for wiring formation are formed on the surface of the insulating layer. When the light shielding frame is disposed on the insulating layer having such irregularities, a gap is generated between the insulating layer and the light shielding frame. For this reason, there exists a problem that the light from an LED element is radiated | emitted as leak light outside through the gap | interval between an insulating layer and the light shielding frame.

  This invention is made | formed based on the above situations, Comprising: The objective is to provide the LED light-emitting device which can prevent or suppress generation | occurrence | production of leakage light.

The LED light emitting device of the present invention includes a metal substrate,
A metal layer for wiring formation provided on the metal substrate via an insulating layer;
LED elements electrically connected to the wiring forming metal layer;
An intermediate insulating layer provided on the insulating layer and covering the metal layer for wiring formation;
On this intermediate | middle insulating layer, the frame-shaped thin metal layer formed so that the area | region where the said LED element is arrange | positioned may be provided, It is characterized by the above-mentioned.

In the LED light-emitting device of the present invention, it is preferable to have a light-shielding frame disposed on the frame-shaped metal thin layer so as to be in contact with the entire circumference.
Further, it is preferable that a planarizing metal layer having a thickness equivalent to the wiring forming metal layer is formed on the insulating layer in a region different from the wiring forming metal layer.

  According to the LED light emitting device of the present invention, the frame-shaped metal thin layer is formed on the intermediate insulating layer so as to surround the region where the LED element is disposed, so that the frame-shaped metal on the surface of the intermediate insulating layer is formed. In the region where the thin layer is formed, tension acts in the surface direction due to the rigidity of the frame-shaped metal thin layer. For this reason, even if the metal layer for wiring formation exists in the lower layer of this area | region, an unevenness | corrugation becomes difficult to form in the said area | region. As a result, unevenness is not formed on the surface of the frame-shaped metal thin layer, or even if unevenness is formed, the surface becomes minute. Therefore, by arranging the light shielding frame on the frame-shaped metal thin layer, the occurrence of leakage light can be prevented or suppressed.

It is a top view which shows the structure in an example of the LED light-emitting device of this invention. It is a side view of the LED light-emitting device shown in FIG. In the LED light-emitting device shown in FIG. 1, it is a top view of the state which removed the light-shielding frame. It is AA sectional drawing of FIG. It is BB sectional drawing of FIG.

Hereinafter, embodiments of the LED light emitting device of the present invention will be described.
FIG. 1 is a plan view showing the configuration of an example of the LED light-emitting device of the present invention, and FIG. 2 is a side view of the LED light-emitting device shown in FIG. 3 is a plan view of the LED light emitting device shown in FIG. 1 with the light shielding frame removed, FIG. 4 is a cross-sectional view taken along the line AA in FIG. 3, and FIG. It is sectional drawing.

  This LED light emitting device has a metal substrate 10. On the surface of the metal substrate 10, a wiring forming metal layer 12 made of, for example, copper is provided via an insulating layer 11 made of resin. On the insulating layer 11, a planarizing metal layer 13 made of, for example, copper having the same thickness as the wiring forming metal layer 12 is formed in a region different from the wiring forming metal layer 12.

  On the insulating layer 11, an intermediate insulating layer 14 is provided so as to cover the wiring forming metal layer 12 and the planarizing metal layer 13. A plurality (four in the illustrated example) of connection terminals 15 are formed on the intermediate insulating layer 14. These connection terminals 15 are electrically connected to the wiring forming metal layer 12 via posts 16 that extend through the intermediate insulating layer 13 in the thickness direction.

The LED element 20 is disposed on one connection terminal 15. One electrode of the LED element 20 is electrically connected to the one connection terminal 15. The other electrode of the LED element 20 is electrically connected to another connection terminal 15 adjacent to the one connection terminal 15 via a bonding wire 25. Thus, the LED element 20 is electrically connected to the wiring forming metal layer 12 via the connection terminal 15 and the post 16. The two connection terminals 15 are electrically connected to the remaining two connection terminals 15 through the wiring forming metal layer 12, and the connector 30 is connected to the remaining two connection terminals 15. Electrically connected.
On the intermediate insulating layer 13, a frame-shaped thin metal layer 17 is formed so as to surround a region where the LED element 20 is disposed. On this frame-shaped metal thin layer 17, a light-shielding frame 18 provided with a lens 19 for condensing light from the LED element 20 on the upper surface is arranged so as to be in contact with the entire circumference of the frame-shaped metal thin layer 17. Has been. The light shielding frame 18 is fixed to the metal substrate 10 via the frame-shaped metal thin layer 17, the intermediate insulating layer 14, and the insulating layer 11 by screwing at the four corners.

As a metal material constituting the metal substrate 10, copper, aluminum, or the like can be used.
Moreover, the thickness of the metal board | substrate 10 is 0.1-5 mm, for example.

As a resin material constituting the insulating layer 11, for example, an epoxy resin mixed with a ceramic filler can be used.
Moreover, the thickness of the insulating layer 11 is 10-300 micrometers, for example.

  The thickness of the wiring forming metal layer 12 and the planarizing metal layer 13 is, for example, 10 to 300 μm.

As a resin material constituting the intermediate insulating layer 14, for example, an epoxy resin mixed with a ceramic filler can be used.
Moreover, the thickness of the intermediate | middle insulating layer 14 is 10-300 micrometers, for example.

As the metal material constituting the frame-shaped metal thin layer 17, copper, gold, silver, aluminum, or a metal composite material thereof can be used.
The thickness of the frame-shaped metal thin layer 17 is preferably 50 to 300 μm. When this thickness is too small, it becomes difficult to suppress unevenness due to the wiring forming metal layer 12. On the other hand, when this thickness is excessive, it is disadvantageous in manufacturing, for example, it takes a long time for the etching process at the time of pattern formation.
Moreover, it is preferable that the line width of the frame-shaped thin metal layer 17 is 0.1 mm or more, More preferably, it is 1 mm or more. When this line width is too small, it becomes difficult to control the line width by etching, and it becomes difficult to sufficiently suppress the unevenness.

  As a material constituting the light shielding frame 18, a metal, a resin that does not transmit ultraviolet light, ceramics, or the like can be used.

  As the LED element 20, a GaN-based element or an AlGaN-based element that emits light having a wavelength of 440 nm or less can be used.

Said LED light-emitting device can be manufactured as follows, for example.
First, a substrate composite in which a wiring forming metal layer 12 and a planarizing metal layer 13 are formed on a metal substrate 10 via an insulating layer 11 is produced. Next, the insulating sheet on which the frame-shaped metal thin layer 17 is formed is pressure-bonded onto the substrate composite, thereby forming the intermediate insulating layer 14 on which the frame-shaped metal thin layer 17 is formed. At this time, the region in which the frame-shaped metal thin layer 17 is formed on the surface of the intermediate insulating layer 14 is tensioned in the surface direction due to the rigidity of the frame-shaped metal thin layer 17. The formation of irregularities according to the pattern of the metal layer 12 is suppressed. Thereafter, the post 16 is formed on the intermediate insulating layer 14, and the connection terminal 15 is formed on the surface of the intermediate insulating layer 14. Then, the LED element 20 is disposed on the connection terminal 15, and required electrical connection between the LED element 20 and the connection terminal 15 is performed. Further, the light shielding frame 18 is disposed and fixed on the frame-shaped metal thin layer 17 so as to be in contact with the entire circumference of the frame-shaped metal thin layer 17. Further, the connector 30 is electrically connected to the connection terminal 15 that is not connected to the LED element 20. Thus, the above LED light emitting device is manufactured.

  According to such an LED light emitting device, the frame-like metal thin layer 17 is formed on the intermediate insulating layer 14 so as to surround the region where the LED element 20 is disposed, so that the surface of the intermediate insulating layer 14 is formed. In the region where the frame-shaped metal thin layer 17 is formed, tension acts in the plane direction due to the rigidity of the frame-shaped metal thin layer 17. For this reason, even if the wiring forming metal layer 12 is locally present in the lower layer of this region, it is difficult to form irregularities in the region. As a result, irregularities are not formed on the surface of the frame-shaped thin metal layer 17 or are minute even if irregularities are formed. Therefore, by arranging the light shielding frame 18 on the frame-shaped metal thin layer 17, the occurrence of leakage light can be prevented or suppressed.

  Further, by forming the planarizing metal layer 13 in a region different from the wiring forming metal layer 12, a concave portion is formed on the wiring forming metal layer 12 side in the intermediate insulating layer 14 laminated in this region. This is suppressed, and unevenness is hardly formed in the region. As a result, irregularities are not formed on the surface of the frame-shaped thin metal layer 17 or are minute even if irregularities are formed. Therefore, by arranging the light shielding frame 18 on the frame-shaped metal thin layer 17, the occurrence of leakage light can be prevented or suppressed.

<Example 1>
According to the configuration shown in FIG. 1, an LED light-emitting device having the following specifications was produced.
Metal substrate (10): material = copper, thickness = 7 mm
Insulating layer (11): material = ceramic filler-containing epoxy resin, thickness = 100 μm
Metal layer for wiring formation (12): material = copper, thickness = 50 μm
Flattening metal layer (13): material = copper, thickness = 50 μm
Intermediate insulating layer (14): material = epoxy resin, thickness = 100 μm
Frame-shaped metal thin layer (17): material = copper, outer circumference = 8 mm × 8 mm, line width = 7 mm, thickness = 100 μm
Shading frame (18): material = aluminum, outer circumference = 8 mm × 8 mm, inner circumference = 6 mm × 6 mm, height = 8 mm
LED element (20): AlGaN-based element (wavelength 405 nm), dimensions = 1 mm × 1 mm × 0.5 mm, output = 0.6 W
When the LED light-emitting device was turned on, no leakage light was observed.

<Comparative example 1>
An LED light-emitting device having the same configuration as that of Example 1 was produced except that the frame-shaped metal thin layer was not provided. When this LED light emitting device was turned on, generation of leakage light was recognized.

DESCRIPTION OF SYMBOLS 10 Metal substrate 11 Insulating layer 12 Wiring forming metal layer 13 Flattening metal layer 14 Intermediate insulating layer 15 Connection terminal 16 Post 17 Frame-shaped metal thin layer 18 Shading frame 19 Lens 20 LED element 25 Bonding wire 30 Connector

Claims (3)

A metal substrate;
A metal layer for wiring formation provided on the metal substrate via an insulating layer;
LED elements electrically connected to the wiring forming metal layer;
An intermediate insulating layer provided on the insulating layer and covering the metal layer for wiring formation;
An LED light-emitting device comprising: a frame-like metal thin layer formed on the intermediate insulating layer so as to surround a region where the LED element is disposed.   The LED light-emitting device according to claim 1, further comprising a light-shielding frame disposed on the frame-shaped metal thin layer so as to be in contact with the entire circumference thereof.   2. The planarizing metal layer having a thickness equivalent to the wiring forming metal layer is formed on the insulating layer in a region different from the wiring forming metal layer. LED light emitting device.

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