JP2015069857A - Organic electroluminescent display device, and method of manufacturing the same - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide an organic electroluminescent display device that has a sealing film of a multilayer structure, and that can improve the reliability of a terminal part.SOLUTION: An organic electroluminescent display device includes: a first substrate in which a plurality of pixel circuits each having a thin-film transistor are arranged in a matrix, and comprising a plurality of connection terminals electrically connected with an external electronic device, at an end part of the insulation substrate; an organic EL layer separated from a region where the plurality of connection terminals are provided, of the first substrate in a plan view, and laminated on a region where the plurality of pixel circuits are arranged; and a sealing film in which, on a surface at an opposite side to a side opposed to the first substrate, of the organic EL layer, a first inorganic sealing film, an organic sealing film, and a second inorganic sealing film are sequentially laminated from a side contacted with the organic EL layer. A convex part formed of an inorganic insulation material is provided between the plurality of connection terminals. A recessed part is formed on a lateral face of the convex part.

Description

  The present invention relates to an organic electroluminescence (organic EL) device and a manufacturing method thereof.

  An organic electroluminescence display device including an organic EL layer having an anode, a cathode, and a light emitting layer sandwiched between the anode and the cathode is expected to be further developed in electronic devices in recent years.

  The light emitting layer constituting the organic EL layer emits light when the current supplied to the anode flows into the cathode through the light emitting layer, and electrons from the cathode and holes from the anode are recombined. And since the reliability of a light emitting layer falls remarkably by presence of a water | moisture content, in order to isolate | separate an organic EL layer from an external water | moisture content, it is common to provide the sealing film. The sealing film is generally formed of an inorganic material because the moisture content is small.

  In Patent Document 1, a signal line made of a laminate of a bottom barrier metal / aluminum / top barrier metal formed on a substrate, an insulation made of a first insulating material formed on the signal line and having a first contact hole. A first pixel electrode layer made of a connecting metal provided on the insulating layer and connected to the signal line through the first contact hole; and formed on the first pixel electrode layer. A pixel portion having a second pixel electrode layer made of a reflective metal and a wiring formed on the substrate, the wiring having the same stacking structure as the bottom barrier metal / aluminum / top barrier metal stack, and provided on the wiring An insulating layer made of the same material as the first insulating material, and connected to the wiring through the second contact hole, the same as the connecting metal. It has been described for the array substrate, characterized by comprising a pad portion having a connection pad of material.

  Patent Document 2 discloses a barrier thin film composite having a sealed edge, and includes a substrate and at least one initial barrier stack adjacent to the substrate, wherein the at least one initial barrier stack includes: At least one decoupling layer and at least one barrier layer, wherein the first decoupling layer of the first initial barrier stack has a range, and the first barrier layer of the first initial barrier stack is The range of the first barrier layer is larger than the range of the first decoupling layer, and the first decoupling layer is sealed by the first barrier layer within the range of the barrier layer. The complex is described.

JP 2011-48027 A JP 2005-504652 gazette

  Since the organic EL layer is composed of various members such as a light emitting layer and various electrodes, unevenness due to the members occurs on the surface. The unevenness may cause uniform light emission, and the unevenness is preferably as small as possible.

  However, the sealing film formed of an inorganic material has a small thickness in the process, and it is difficult to provide a function of buffering the surface unevenness of the organic EL layer. In addition, pinholes may be formed in the sealing film formed of an inorganic material, and external moisture may reach the light emitting layer through the pinholes, thereby reducing the reliability of the light emitting layer. there is a possibility.

  In view of the above points, the inventors have applied a multilayer sealing film having a first inorganic sealing film, an organic sealing film, and a second inorganic sealing film to an organic electroluminescence display device. We conducted an intensive study to determine whether it was applicable. By applying the multilayer sealing film to the organic electroluminescence display device, the sealing film can be increased to a thickness that can buffer the surface irregularities of the organic EL layer, and the inorganic sealing film can be multilayered. This is because even if a pinhole is formed in one layer of the inorganic sealing film, it is considered that the light emitting layer can be reduced from being exposed to external moisture due to the presence of another inorganic sealing film.

  Here, a problem arises when a sealing film having a multilayer structure including the first inorganic sealing film, the organic sealing film, and the second inorganic sealing film is applied to the organic electroluminescence display device. In the manufacturing process of an organic electroluminescence display device, when a step of forming a sealing film on the organic EL layer is performed, a film similar to the sealing film is once formed on the terminal portion of the organic electroluminescence display device. Therefore, it is necessary to remove the film to expose the terminal portion. However, since the film is formed of a plurality of materials, the removal operation is performed with a single layer of the sealing film. It is annoying compared with.

  Furthermore, when the organic sealing film material forming the organic sealing film cannot be completely removed and remains in the vicinity of the terminal portion, there is a concern that the reliability of the terminal portion is lowered by moisture contained in the organic material.

  An object of the present invention is to provide an organic electroluminescence display in which a sealing film of an organic electroluminescence display device has a multi-layer structure, improves the reliability of an organic EL layer, and improves the reliability of a terminal portion in the organic electroluminescence display device An object is to provide an apparatus and a method for manufacturing the same.

  The above and other objects and novel features of the present invention will become apparent from the description of this specification and the accompanying drawings.

  In order to solve the above problems, an organic electroluminescence display device according to the present invention includes a plurality of pixel circuits each having a thin film transistor on an insulating substrate arranged in a matrix, and electrically connected to an external electronic device at an end of the insulating substrate. A first substrate provided with a plurality of connection terminals connected to the first substrate, and in a plan view, spaced apart from a region provided with the plurality of connection terminals of the first substrate, and the plurality of pixel circuits are arranged A first inorganic sealing film, an organic sealing film on the surface of the organic EL layer opposite to the side facing the first substrate, A second inorganic sealing film, and a sealing film laminated in order from the side in contact with the organic EL layer, and between the plurality of connection terminals, electrical connection between adjacent connection terminals is provided. Prevent, formed by inorganic insulating material A concave portion for accommodating an organic structure formed by an organic sealing material forming the organic sealing film constituting the sealing film is formed on a side surface of the convex portion. It is characterized by being.

  In addition, the convex portion includes a first inorganic insulating layer and a second inorganic insulating layer, which are formed of different types of inorganic insulating materials, and the concave portion formed on the side surface of the convex portion is The first inorganic insulating layer is disposed at a location closer to the insulating substrate than the second inorganic insulating layer, and the outer edge of the first inorganic insulating layer is the second inorganic insulating in a plan view. It is good also as being formed by being provided inside the outer edge of a layer.

  Further, the convex portion is disposed at a location closer to the insulating substrate than the first inorganic insulating layer, and is formed of an inorganic insulating material different from the first inorganic insulating layer, and a third inorganic insulating layer is formed. In addition, the concave portion formed on the side surface of the convex portion includes an outer edge of the first inorganic insulating layer and an outer edge of the second inorganic insulating layer and the third inorganic insulating layer in plan view. It is good also as being formed by being provided inside the outer edge.

  The second inorganic insulating layer and the third inorganic insulating layer may be formed of the same kind of inorganic insulating material.

  In addition, in a method for manufacturing an organic electroluminescence display device according to the present invention for solving the above-described problem, a plurality of pixel circuits having thin film transistors are arranged in a matrix on an insulating substrate, and an external portion is provided at an end of the insulating substrate. A first substrate forming step of forming a first substrate provided with a plurality of connection terminals electrically connected to an electronic device; and in plan view, the plurality of connection terminals of the first substrate are provided An organic EL layer forming step of forming an organic EL layer that is separated from a region to be formed and stacked on a region where the plurality of pixel circuits are disposed, and the organic EL layer formed by the organic EL layer forming step The first inorganic sealing film, the organic sealing film, and the second inorganic sealing film are in contact with the organic EL layer on the surface of the layer opposite to the side facing the first substrate. Seals stacked in order from the side Forming a film, and forming a sealing film, wherein the first substrate forming step prevents electrical connection between adjacent connection terminals between the plurality of connection terminals. A convex portion forming step of forming a convex portion formed by the organic sealing material forming the organic sealing film constituting the sealing film on a side surface of the convex portion. It includes a recess forming step of forming a recess for housing the organic structure to be formed.

  The sealing film forming step includes forming the first inorganic sealing film in a region where the plurality of connection terminals of the first substrate are provided in a plan view together with the formation of the first inorganic sealing film. By the first inorganic sealing film material used for forming the first inorganic film, the surface of the first inorganic film opposite to the side facing the first substrate is the recess forming step. In the region where the plurality of connection terminals of the first substrate are provided in a plan view together with the formation of the organic sealing film and the step of forming the organic sealing film so as to be located in the recessed portion of the recess formed by the organic A step of forming an organic structure after applying an organic sealing film material used for forming a sealing film, storing the organic sealing film material in the concave portion in the concave portion, and the second inorganic sealing film And forming a plurality of the first substrate in a plan view. In the region where the connection terminal is provided, the second inorganic film is used as the first substrate of the second inorganic film by the second inorganic sealing film material used for forming the second inorganic sealing film. A step of forming the surface on the opposite side in direct contact with the surface of the front first inorganic film opposite to the side facing the first substrate; and a plurality of the first substrates in plan view The step of removing the first inorganic film and the second inorganic film formed in a region where the connection terminal is provided may be included.

  The convex portion forming step includes a step of forming a first inorganic insulating layer and a second inorganic insulating layer with different types of inorganic insulating materials, and the convex portion forming step includes the step of forming the concave portion. The recess forms the first inorganic insulating layer at a location closer to the insulating substrate than the second inorganic insulating layer, and the outer edge of the first inorganic insulating layer in the plan view It is good also as forming by forming inside the outer edge of an inorganic insulating layer.

  Moreover, the said convex part formation process is arrange | positioned in the place near the said insulated substrate rather than the said 1st inorganic insulating layer, and is formed with an inorganic insulating material different from a said 1st inorganic insulating layer, The 3rd inorganic insulation A step of forming a layer, wherein the concave portion formed by the concave portion forming step has an outer edge of the first inorganic insulating layer in plan view, the outer edge of the second inorganic insulating layer, and the third It is good also as being formed by being provided inside the outer edge of an inorganic insulating layer.

  The second inorganic insulating layer and the third inorganic insulating layer may be formed of the same kind of inorganic insulating material.

  According to the present invention, an organic electroluminescence display device having a multilayer structure as a sealing film of an organic electroluminescence display device, improving the reliability of an organic EL layer, and improving the reliability of a terminal portion in the organic electroluminescence display device, and A manufacturing method thereof is provided.

1 is a perspective view of an organic electroluminescence display device according to the present invention. It is a figure which shows the structure of the sealing film contained in the organic electroluminescent display apparatus which concerns on this invention. It is a figure explaining 1st embodiment of the connection terminal part of the organic electroluminescent display apparatus which concerns on this invention, and is sectional drawing in the III-III line of FIG. It is a figure explaining the modification of 1st embodiment of the connection terminal part of the organic electroluminescent display apparatus which concerns on this invention, and is sectional drawing in the III-III line of FIG. It is a figure explaining 2nd embodiment of the connection terminal part of the organic electroluminescent display apparatus which concerns on invention, and is sectional drawing in the III-III line of FIG. It is a figure explaining the modification of 2nd embodiment of the connection terminal part of the organic electroluminescent display apparatus which concerns on this invention, and is sectional drawing in the III-III line of FIG. It is sectional drawing which showed the state of the terminal part after the 1st board | substrate formation process and the organic EL layer formation process after the 1st inorganic sealing film in a sealing film formation process was formed. It is sectional drawing which showed the state of the terminal part after the 1st board | substrate formation process and the organic EL layer formation process after the 1st inorganic sealing film and organic sealing film in a sealing film formation process were formed. After the first substrate forming step and the organic EL layer forming step, the terminal portion after the first inorganic sealing film, the organic sealing film, and the second inorganic sealing film in the sealing film forming step are formed. It is sectional drawing which showed the state. After the first substrate forming step, the organic EL layer forming step, and the sealing film forming step, the first inorganic film and the second inorganic film formed in the region of the first substrate where the plurality of connection terminals are provided. It is sectional drawing which showed the state of the terminal part after removing a film | membrane.

  First, a basic configuration of an organic electroluminescence display device according to the present invention will be described with reference to FIG. FIG. 1 is a perspective view of an organic electroluminescence display device according to the present invention.

  As shown in FIG. 1, an organic electroluminescence display device 10 according to the present invention includes a plurality of pixel circuits having thin film transistors arranged in a matrix on an insulating substrate, and external electronic devices are connected to end portions of the insulating substrate. The first substrate 100 provided with a plurality of connection terminals to be electrically connected, and in a plan view, separated from a region TA provided with the plurality of connection terminals of the first substrate 100, and the plurality of the plurality of connection terminals On the surface of the organic EL layer 200 opposite to the side facing the first substrate 100, the first inorganic sealing film is laminated on the region where the pixel circuit is disposed. And a sealing film 300 in which an organic sealing film and a second inorganic sealing film are laminated in order from the side in contact with the organic EL layer 200.

  Further, the organic EL layer 200 is a region different from the region TA provided with the plurality of connection terminals of the first substrate 100 in a plan view, and overlaps the region PA where the plurality of pixel circuits are arranged. It may be provided on the first substrate 100.

  First, the 1st board | substrate 100 which comprises the organic electroluminescent display apparatus 10 which concerns on this invention is demonstrated. Although not shown in FIG. 1, the first substrate 100 has a structure in which pixels having thin film transistors are arranged in a matrix on an insulating substrate. Here, the insulating substrate may be made of, for example, glass, plastic (polycarbonate, polyethylene terephthalate, polyimide, polyacrylate, or the like).

  Further, the insulating substrate of the first substrate 100 may be made of, for example, a light transmissive material. More specifically, the insulating substrate of the first substrate 100 may be made of glass or plastic (polycarbonate, polyethylene terephthalate, polyimide, polyacrylate, or the like).

  The first substrate 100 on which a pixel circuit using a thin film transistor is arranged is also called a TFT (Thin Film Transistor) array substrate. Here, the thin film transistor includes a semiconductor film such as polysilicon, a gate insulating film covering the semiconductor film, a gate electrode disposed above the semiconductor film via the gate insulating film, and a semiconductor film penetrating the gate insulating film. A source electrode and a drain electrode that are electrically connected to each other.

  The plurality of pixel circuits arranged on the first substrate 100 include a gate electrode line Vg (scanning wiring), a signal wiring Vsig connected to each of a gate electrode, a source electrode, and a drain electrode included in the thin film transistor, and a thin film transistor. The power supply line VDD for supplying power may be partitioned and arranged in a matrix form. Note that these wirings may be formed of a metal such as aluminum (Al), chromium (Cr), or molybdenum (Mo).

  In addition, as illustrated in FIG. 1, a driving circuit for driving a circuit using a thin film transistor disposed on the first substrate 100 may be disposed on the first substrate 100. Note that the drive circuit may be provided in the vicinity of the region TA where the plurality of connection terminals of the first substrate 100 are provided.

  In addition, an area TA provided with a plurality of the connection terminals, which is an end area of the first substrate 100, is electrically connected to another electronic device through a connection with, for example, a flexible printed circuit board (FPC). A plurality of connection terminals (not shown in FIG. 1) are provided. Further, a projection (not shown in FIG. 1) formed of an inorganic insulating material is provided between the plurality of connection terminals to prevent electrical connection between adjacent connection terminals. The plurality of connection terminals and the protrusions provided between the connection terminals in the area TA where the connection terminals are provided will be described in detail later.

  Next, the organic EL layer 200 constituting the organic electroluminescence display device 10 according to the present invention will be described. The organic EL layer 200 has at least an anode, a cathode, and a light emitting layer sandwiched between the anode and the cathode.

  Here, the anode (also referred to as pixel electrode) provided in the organic EL layer 200 is disposed at a position corresponding to each of a plurality of pixel circuits arranged in a matrix in a plan view. A current is supplied to the anode via a thin film transistor provided on the first substrate 100. And the electric current supplied to the anode flows into the cathode through the light emitting layer. In the light emitting layer sandwiched between the anode and the cathode, light is emitted by recombination of electrons from the cathode and holes from the anode. And the emitted light will be irradiated outside.

Thus, since the role of the anode is to inject holes into an organic layer such as a hole injection layer or a hole transport layer included in the light emitting layer, it is necessary that the work function is large. For example, the anode is tin oxide (SnO ₂ ), aluminum-doped zinc oxide (ZnO: Al), indium tin oxide (ITO), indium zinc oxide (In 2 O 3 —ZnO (IZO)), tin oxide, zinc oxide, oxidation It may be formed of indium, aluminum oxide composite oxide, or the like. The anode is preferably ITO because it has low resistance, has solvent resistance, and has transparency. The work function of ITO is about 4.6 to 5.0 eV, which is close to the HOMO level (5.0 to 5.5 eV) of the hole transport material, and is suitable for hole injection. ITO may be formed by sputtering, for example.

  Examples of the hole transport material for forming the hole transport layer include metal phthalocyanines and metal-free phthalocyanines such as copper phthalocyanine and tetra (t-butyl) copper phthalocyanine, quinacridone compounds, 1,1-bis (4-di -P-tolylaminophenyl) cyclohexane, N, N'-diphenyl-N, N'-bis (3-methylphenyl) -1,1'-biphenyl-4,4'-diamine, N, N'-di ( 1-naphthyl) -N, N′-diphenyl-1,1′-biphenyl-4,4′-diamine and other aromatic amine low molecular hole injection transport materials, poly (para-phenylene vinylene), polyaniline, etc. It can be selected from polymer hole transport materials, polythiophene oligomer materials, and other known hole transport materials.

  The organic light-emitting material for forming the light-emitting layer may be any material that is generally used as an organic light-emitting material, and is a coumarin, perylene, pyran, anthrone, porphyrene, quinacridone, N, N′— Known fluorescent low-molecular materials that can emit light from a singlet state, such as dialkyl-substituted quinacridone-based, naphthalimide-based, N, N'-diaryl-substituted pyrrolopyrrole-based materials, and known that can emit light from a rare-earth metal complex-based triplet state And phosphorescent low molecular weight materials.

  The cathode is a solid electrode formed on the uppermost surface of the organic EL layer 200 (the surface opposite to the first substrate 100 side of the organic EL layer 200). The cathode is formed over almost the entire surface of the organic EL layer 200 provided in the organic electroluminescence display device 10 of the present invention.

  It is advantageous that the cathode has a small work function in order to inject electrons into the electron injection layer and the electron transport layer, as opposed to the anode. For this reason, it is generally preferable to form with a metal such as Al, Mg, MgAg, or MgIn. Here, when the organic electroluminescence display device 10 according to the present invention is a top emission type organic electroluminescence display device 10, light emitted from the cathode side is taken out, so that the cathode is indium tin oxide (ITO), It may be a transparent electrode formed of a transparent metal such as indium zinc oxide (In2O3-ZnO (IZO)), tin oxide, zinc oxide, indium oxide, aluminum oxide composite oxide, or the like.

  Further, as a method for forming the cathode, a forming method by a sputtering method can be mentioned.

  The electron transport material for forming the electron transport layer may be any material that is generally used as an electron transport material. For example, a low molecular system such as triazole, oxazole, oxadiazole, silole, or boron Examples of the material include film formation by vacuum deposition.

  The above-described formation of the hole transport layer, the light emitting layer, and the electron transport layer is performed using a vacuum deposition method for the vapor deposition type material, and a nozzle printing method, a spin coating method, a slit coating method, and an ink jet method for the coating type material. Alternatively, a known film forming method such as a relief printing method may be used.

  In the above description, as an example of the organic EL layer 200, a structure in which a hole transport layer, an organic light emitting layer, and an electron transport layer are stacked from the anode side between the anode and the cathode is described. It is good also as taking the laminated structure which selected layers, such as a hole block layer and an electron injection layer other than a positive hole transport layer and an organic light emitting layer, as needed. Moreover, when forming these layers, it is good also as selecting suitably the formation method similar to a positive hole transport layer, a light emitting layer, and a cathode.

  Next, the sealing film 300 constituting the organic electroluminescence display device 10 according to the present invention will be described. The sealing film 300 is provided to separate the organic EL layer 200 from external moisture, since the reliability of the light emitting layer constituting the organic EL layer 200 is significantly reduced due to the presence of moisture.

  The sealing film is generally formed of an inorganic material because the moisture content is small. However, the sealing film formed of an inorganic material has a small thickness in the process. And a pinhole may be formed in a sealing film formed with an inorganic material in a manufacturing process, and this may cause the light emitting layer to be affected by external moisture.

  By the way, in the case of a so-called top emission type organic electroluminescence display device, it is effective to reduce the surface unevenness of the organic EL layer 200 in order to emit uniform light to the outside. Here, as described above, the sealing film formed of the inorganic material has a small thickness in the process, and thus it is difficult to form the sealing film with a thickness enough to buffer the surface unevenness of the organic EL layer 200. .

  In view of the above points, the sealing film 300 constituting the organic electroluminescence display device 10 according to the present invention includes a first inorganic sealing film, an organic sealing film, and a second inorganic sealing film. A sealing film 300 having a multilayer structure is applied. This is because the organic sealing film can be formed thicker than the inorganic sealing film, so that the surface unevenness of the organic EL layer 200 can be buffered.

  In addition, if the sealing film 300 has a multilayer structure, even if a pinhole is generated in one of the multilayers, defects in the pinhole can be compensated by forming another layer on top of each other. it can.

  That is, by applying the sealing film 300 having a multilayer structure to the organic electroluminescence display device 10, the sealing film 300 can increase the thickness of the organic EL layer 200 so that the surface unevenness is buffered. Even if a pinhole is formed in one layer of the inorganic sealing film, the organic EL layer 200 can be prevented from being exposed to external moisture due to the presence of another inorganic sealing film.

  FIG. 2 is a cross-sectional view illustrating the configuration of the sealing film 300 provided in the organic electroluminescence display device according to the present invention. As shown in FIG. 2, the sealing film 300 includes a first inorganic sealing film 311 and an organic sealing film on the surface of the organic EL layer 200 opposite to the side facing the first substrate 100. 312 and the second inorganic sealing film 313 are sequentially laminated from the side in contact with the organic EL layer 200.

  The first inorganic sealing film 311 and the second inorganic sealing film 313 have a function of protecting the organic EL layer 200 from moisture, oxygen, and the like from the outside. Therefore, the material forming the first inorganic sealing film 311 and the second inorganic sealing film 313 is selected in consideration of water permeability and air permeability.

For example, the first inorganic sealing film 311 and the second inorganic sealing film 313 include SiN, SiO ₂ , P ₂ O ₅ .SiO ₂ (PSG), Al ₂ O ₃ , PbO.SiO ₂ , Si _3. It may be formed of a compound selected from the group consisting of N ₄ , SiON, and PbO · B ₂ O ₃ .

  The first inorganic sealing film 311 and the second inorganic sealing film 313 are, for example, sputtering, vapor deposition, sublimation, CVD (chemical vapor deposition), PECVD (plasma enhanced chemical vapor deposition), ECR-PECVD (electron). It may be deposited by any suitable process, including conventional vacuum processes, such as cyclotron resonance-plasma enhanced chemical vapor deposition) and combinations thereof. In addition, the material of the 1st inorganic sealing film 311 and the 2nd inorganic sealing film 313 and the formation method are not restricted to said thing.

  The thicknesses of the first inorganic sealing film 311 and the second inorganic sealing film 313 may be 50 nm or more and less than 150 nm, respectively. When the thickness of the first inorganic sealing film 311 and the second inorganic sealing film 313 is 50 nm or more and less than 150 nm, the protective effect on the organic EL layer 200 is preferably increased.

As a specific example of the film formation of the first inorganic sealing film 311 and the second inorganic sealing film 313, for example, SiN may be formed by a plasma CVD method. More specifically, when forming a SiN film, SiH ₄ , NH ₃ , and N ₂ may be used as a mixed gas, and plasma may be generated to form a SiN film. The SiN film thickness may be 100 nm and the substrate temperature may be 100 ° C. or lower.

  Moreover, it is preferable that the 1st inorganic sealing film 311 and the 2nd inorganic sealing film 313 are formed with the same kind of compound. This is because the organic sealing film 312 is sandwiched between the first inorganic sealing film 311 and the second inorganic sealing film 313 as shown in FIG. In order to prevent delamination between the first inorganic sealing film 311 and the organic sealing film 312, and between the second inorganic sealing film 313 and the organic sealing film 312, the first inorganic sealing film 311 It will be formed of an organic sealing material selected in view of the adhesion to the material forming the film 311 and the second inorganic sealing film 313. Then, the first inorganic sealing film 311 and the second inorganic sealing film 313 are formed of the same kind of compound, so that the organic sealing material for forming the organic sealing film 312 can be easily selected. Because it can be done.

  Further, the first inorganic sealing film 311 and the second inorganic sealing film 313 are formed of the same kind of compound, so that the film formed of the compound on the terminal portion of the organic electroluminescence display device 10 Has the advantage of being easy to remove. This point will be described in detail in the description of the manufacturing method of the organic electroluminescence display device 10 later.

  The organic sealing material for forming the organic sealing film 312 may be formed of, for example, a polyimide resin and / or a derivative thereof, an acrylic resin and / or a derivative thereof. In particular, the organic sealing film 312 is preferably formed of an acrylic resin and / or a derivative thereof. The organic sealing film 312 formed by the polyimide resin and / or its derivative has no problem in terms of the function of the sealing film, but has a disadvantage in process because imidization or the like is required in the film forming process. Because.

  The organic sealing film 312 may be formed, for example, by applying an organic resin varnish (a liquid material obtained by dissolving an organic resin, which is an organic sealing material, in a solvent), followed by drying. Then, after the organic resin monomer for forming the organic sealing film 312 is applied, the organic resin monomer may be polymerized by heating and / or light irradiation. Further, the varnish or the organic resin monomer may be prepared by a conventional vacuum process and nozzle printing method, spin coating method, slit coating method, ink jet method, letterpress printing method, intaglio offset printing method, letterpress reverse printing method, etc. It is good also as applying using. The formation of the organic sealing film 312 is not limited to the method described above.

  In addition, the thickness of the organic sealing film 312 may be 150 nm or more and 500 nm or less. When the thickness of the organic sealing film 312 is 150 nm or more and 150 nm or less, the effect of reducing the surface unevenness of the organic EL layer 200 is preferably increased.

  Further, the sealing film 300 may be composed of, for example, SiN / acrylic resin / SiN.

  Although not shown in the drawing, for example, when the organic electroluminescence display device according to the present invention is a top emission type organic electroluminescence display device, the organic EL layer 200 is emitted above the sealing film 300. A second substrate (also referred to as a color filter substrate) having a color filter that transmits light having a predetermined wavelength region out of the emitted light may be further provided. Further, the color filter substrate as the second substrate may include three regions partitioned by RGB.

  Next, the connection terminal structure of the organic electroluminescence display device according to the present invention will be described with reference to FIG. 3A. FIG. 3A is a diagram illustrating a first embodiment of a connection terminal portion of the organic electroluminescence display device according to the present invention, and is a cross-sectional view taken along line III-III in FIG. 1.

  As shown in FIG. 3A, between the plurality of connection terminals 110, a protrusion 120 formed of an inorganic insulating material that prevents electrical connection between adjacent connection terminals is provided on the side surface of the protrusion 120. Is formed with a recess 124 for accommodating an organic structure formed of an organic sealing material for forming the organic sealing film 312 constituting the sealing film 300.

  That is, between the plurality of connection terminals 110, provided with a convex portion 120 formed of an inorganic insulating material that prevents electrical connection between adjacent connection terminals, the side surface of the convex portion has a horizontal hole structure, A so-called overhang is formed.

  The recess 124 formed on the side surface of the protrusion 120 accommodates an organic structure formed of an organic sealing material that forms the organic sealing film 312 that forms the sealing film 300.

  A modification of the first embodiment will be described. FIG. 3B is a diagram for explaining a modification of the first embodiment of the connection terminal portion of the organic electroluminescence display device according to the present invention, and is a cross-sectional view taken along line III-III in FIG. 1.

  The convex portion 120 in the modification of the first embodiment shown in FIG. 3B includes a first inorganic insulating layer 121 and a second inorganic insulating layer 122, which are formed of different types of inorganic insulating materials. Including the concave portion 124 formed on the side surface of the convex portion 120, the first inorganic insulating layer 121 is disposed closer to the insulating substrate constituting the first substrate 100 than the second inorganic insulating layer 122, In plan view, the outer edge of the first inorganic insulating layer 121 is provided inside the outer edge of the second inorganic insulating layer 122.

  Thus, by forming the convex portion 120 with the first inorganic insulating layer 121 and the second inorganic insulating layer 122, which are formed of different types of inorganic insulating materials, for example, the first inorganic insulating layer 122 can be used. After the insulating layer 121 and the second inorganic insulating layer 122 once form a convex portion having the same width, the side surface of the convex portion can be easily formed by using an etching solution that corrodes only the first inorganic insulating layer 121. A recess can be formed in the surface to achieve a horizontal hole structure.

For example, the first inorganic insulating layer 121 may be etched by dry etching using SF ₆ and O ₂ to generate plasma.

  Another example of the connection terminal structure of the organic electroluminescence display device according to the present invention will be described. 3C is a view for explaining a second embodiment of the connection terminal portion of the organic electroluminescence display device according to the present invention, and is a cross-sectional view taken along the line III-III of FIG. 1.

  In the second embodiment of the connection terminal portion of the organic electroluminescence display device, as shown in FIG. 3C, electrical connection between adjacent connection terminals is made between the plurality of connection terminals 110 as in the first embodiment. An organic structure formed of an organic sealing material for forming an organic sealing film 312 that forms the sealing film 300 on the side surface of the convex part 120 is provided with a convex part 120 formed of an inorganic insulating material to prevent. A recess 124 is formed for storing the.

  The first embodiment described above. And in the modification of 1st embodiment, the cross-sectional shape of the convex part 120 which prevents the electrical connection of the adjacent connection terminals formed between the some connection terminals 110 has T shape. . On the other hand, the convex part 120 in 2nd embodiment has a cross-sectional shape with a hollow only in the center part of a convex part.

  A modification of the second embodiment will be described. FIG. 3D is a diagram illustrating a modification of the second embodiment of the connection terminal portion of the organic electroluminescence display device according to the present invention, and is a cross-sectional view taken along line III-III in FIG. 1.

  In addition to the configuration of the modified example of the first embodiment described above, the convex portion 120 in the modified example of the second embodiment shown in FIG. 3D is disposed at a location closer to the insulating substrate than the first inorganic insulating layer 121. And a third inorganic insulating layer 123 formed of an inorganic insulating material different from that of the first inorganic insulating layer 121.

  The concave portion 124 formed on the side surface of the convex portion 120 is such that the outer edge of the first inorganic insulating layer 121 is the outer edge of the second inorganic insulating layer 122 and the outer edge of the third inorganic insulating layer 123 in plan view. It is formed by being provided inside.

  Here, the 2nd inorganic insulating layer 122 and the 3rd inorganic insulating layer 123 of the modification of 2nd embodiment are good also as being formed with the same kind of inorganic insulating material.

  Thus, among the three layers constituting the convex portion 120, the second inorganic insulating layer 122 and the third inorganic insulating layer 123 are formed of the same kind of inorganic insulating material, and the first inorganic insulating layer For example, the first inorganic insulating layer 121, the second inorganic insulating layer 122, and the third inorganic insulating layer 123 are the same because the 121 and other layers are formed of different types of inorganic insulating materials. After forming the convex part of width once, by using the etching solution which corrodes only the 1st inorganic insulating layer 121, a concave part is easily formed in the side of a convex part and a side hole structure is realizable.

  The concave portion 124 on the side surface of the convex portion 120 formed of an inorganic insulating material that prevents electrical connection between adjacent connection terminals provided in the first embodiment and the second embodiment is the organic electroluminescence of the present invention. When forming the sealing film in the manufacturing process of the display device, the organic sealing material for forming the organic sealing film is accommodated. The organic sealing material accommodated in the recess 124 then forms an organic structure, and as a result, the organic structure is formed in the recess 124.

  Thus, the organic structure is. By being accommodated in the concave portion 124 formed on the side surface of the convex portion 120, the organic structure is present at a position separated from the terminal portion, so that the organic structure temporarily absorbs external moisture and contains moisture. Even in this case, since the position of the organic structure is physically separated from the terminal portion, the terminal portion is not rusted and the reliability of the terminal portion is improved.

  In the following, taking the structure of the terminal portion of the second embodiment described above as an example, the manner in which the organic structure is accommodated in the recess 124 will be described together with the method for manufacturing the organic electroluminescence display device of the present invention.

  In the method for manufacturing an organic electroluminescence display device of the present invention, a plurality of pixel circuits having thin film transistors are arranged in a matrix on an insulating substrate, and a plurality of pixels are electrically connected to an external electronic device at an end of the insulating substrate. A first substrate forming step of forming a first substrate provided with a connection terminal of the first substrate, and in a plan view, the first substrate is overlapped with a region where the plurality of pixel circuits are arranged on the first substrate. An organic EL layer forming step of forming an organic EL layer provided on the first substrate in a region other than the region where the plurality of connection terminals of the substrate are provided, and the organic EL layer forming step. A first inorganic sealing film, an organic sealing film, and a second inorganic sealing film are formed on the surface of the formed organic EL layer opposite to the side facing the first substrate. Product from the side in contact with the organic EL layer Forming a sealing film that is, those containing a sealing film forming step.

  In the first substrate forming step, a convex portion forming step of forming a convex portion formed of an inorganic insulating material that prevents electrical connection between adjacent connection terminals between the plurality of connection terminals. And the convex portion forming step forms, on the side surface of the convex portion, a concave portion that houses an organic structure formed by an organic sealing material that forms the organic sealing film constituting the sealing film. , Including a recess forming step.

  Here, the concave portion may be formed by, for example, forming the convex portion 120 with a plurality of layers as described above and corroding only a predetermined layer. That is, the convex portion forming step includes a step of forming the first inorganic insulating layer and the second inorganic insulating layer with different types of machine insulating materials, and the concave portion formed by the concave portion forming step. Forming the first inorganic insulating layer at a location closer to the insulating substrate than the second inorganic insulating layer, and in plan view, the outer edge of the first inorganic insulating layer is the second inorganic insulating layer It is good also as forming by forming inside the outer edge of an insulating layer.

  In addition, the projecting portion forming step forms a third inorganic insulating layer that is disposed closer to the insulating substrate than the first inorganic insulating layer and is formed of an inorganic insulating material different from the first inorganic insulating layer. The concave portion formed by the concave portion forming step is configured such that the outer edge of the first inorganic insulating layer is in an inner side of the outer edge of the second inorganic insulating layer and the outer edge of the third inorganic insulating layer in plan view. It is good also as having been formed by.

  The first substrate forming step includes a step of forming a thin film transistor semiconductor film (made of polysilicon), a step of forming a third inorganic insulating layer and a gate insulating film together, and a gate electrode of the thin film transistor. It is good also as including the process, the process of forming a 2nd inorganic insulating layer, the process of forming the electrode of wiring and a terminal, and the process of forming a 1st insulating layer.

  FIG. 4A is a cross-sectional view illustrating a state of the terminal portion after the first inorganic sealing film is formed in the sealing film forming process after the first substrate forming process and the organic EL layer forming process.

  As shown in FIG. 4A, in the method of manufacturing an organic electroluminescence display device of the present invention, the sealing film forming step includes the formation of the first inorganic sealing film and the plurality of first substrates 100 in plan view. The first inorganic film 501 and the first substrate of the first inorganic film are formed by the first inorganic sealing film material used for forming the first inorganic sealing film in the region where the connection terminal is provided. It includes a step of forming the surface opposite to the opposite side so as to be positioned in the indented portion of the concave portion 124 formed by the concave portion forming step.

  Here, the first inorganic sealing film is formed by using, for example, a known CVD method. In this case, the first inorganic sealing film is formed in the concave portion 124 on the side surface of the convex portion 120. The first inorganic sealing film material used for formation is formed without entering. As a result, a gap is generated between the first inorganic film 501 and the recess 124.

  FIG. 4B is a cross-sectional view illustrating a state of the terminal portion after the first inorganic sealing film and the organic sealing film are formed in the sealing film forming process after the first substrate forming process and the organic EL layer forming process. FIG.

  As shown in FIG. 4B, in the method for manufacturing an organic electroluminescence display device of the present invention, the sealing film forming step includes a plurality of connection terminals of the first substrate in plan view together with the formation of the organic sealing film. A step of forming an organic structure 502 after applying an organic sealing film material used for forming an organic sealing film to the region, storing the organic sealing film material in the concave portion 124, and then forming the organic structure 502. .

  That is, when an organic sealing film material that is a liquid (for example, varnish or resin monomer) used for forming the organic sealing film is applied, the organic sealing film material includes the recess 124 and the first inorganic film 501. And flows into the recess 124 from the gap. Thereafter, the organic sealing film material accommodated in the recess 124 forms the organic structure 502 together with the formation of the organic sealing film. As a result, the organic structure 502 is accommodated in the recess 124.

  Note that when applying an organic sealing film material that is a liquid (for example, varnish or resin monomer) used for forming the organic sealing film, the organic sealing film material includes the concave portion 124 and the first inorganic film 501. In order to make it easy to flow into the recess 124 from the gap, the coating is preferably performed by adjusting the ambient temperature under a temperature condition in which the fluidity of the liquid is obtained.

  FIG. 4C shows the first substrate forming step and the organic EL layer forming step, after the first inorganic sealing film, the organic sealing film, and the second inorganic sealing film in the sealing film forming step are formed. It is sectional drawing which showed the state of the terminal part.

  As shown in FIG. 4C, in the manufacturing method of the organic electroluminescence display device of the present invention, the sealing film forming step includes a plurality of connections of the first substrate in plan view together with the formation of the second inorganic sealing film. The side of the second inorganic film facing the first substrate of the second inorganic film by the second inorganic sealing film material used for forming the second inorganic sealing film in the region where the terminal is provided And a step of directly contacting the surface of the front first inorganic film with the surface opposite to the side facing the first substrate.

  Here, the second inorganic sealing film is formed by using, for example, a known CVD method as in the case of the first inorganic sealing film. Therefore, the second inorganic sealing film material used for forming the second inorganic sealing film is formed in the concave part 124 on the side surface of the convex part 120 without entering.

  FIG. 4D shows a first inorganic film formed in a region where the plurality of connection terminals of the first substrate are provided after the first substrate forming process, the organic EL layer forming process, and the sealing film forming process. It is sectional drawing which showed the state of the terminal part after removing the 2nd inorganic film.

  As shown in FIG. 4D, in the manufacturing method of the organic electroluminescence display device of the present invention, the sealing film forming step is formed in a region provided with the plurality of connection terminals of the first substrate in a plan view. Removing the first inorganic film and the second inorganic film.

  Here, when the second inorganic insulating layer and the third inorganic insulating layer are formed of the same kind of inorganic insulating material, the first inorganic film and the second inorganic film are made of the same kind of inorganic material. Since it will be formed of an insulating material, the first inorganic film and the second inorganic film can be removed simultaneously, which is preferable.

  In the organic electroluminescence display device according to the present invention manufactured as described above, since the sealing film has a multilayer structure, the reliability of the organic EL layer is improved, and in addition, the terminal portion is rusted to increase the reliability. Since the organic structure that causes the concern of lowering can be isolated and stored in the recess, the reliability of the terminal portion in the organic electroluminescence display device is improved as a result.

  In addition, according to the method for manufacturing the organic electroluminescence display device according to the present invention described above, the step of removing the film formed on the terminal portion to expose the terminal portion also includes a single sealing film. It is not annoying even when compared to what it is.

  DESCRIPTION OF SYMBOLS 10 Organic electroluminescent display device, 100 1st board | substrate, 110 connection terminal, 120 convex part, 121 1st insulating layer, 122 2nd insulating layer, 123 3rd insulating layer, 124 recessed part, 130 Polysilicon, PA Region where pixel circuit is arranged, region where TA connection terminal is provided, 200 organic EL film, 300 sealing film, 311 first inorganic sealing film, 312 organic sealing film, 313 second inorganic sealing film, 501 First inorganic film, 502 organic structure, 503 second inorganic film.

Claims (9)

A plurality of pixel circuits having thin film transistors on an insulating substrate, arranged in a matrix, and a first substrate provided with a plurality of connection terminals electrically connected to an external electronic device at an end of the insulating substrate;
In plan view, an organic EL layer that is separated from a region where the plurality of connection terminals of the first substrate are provided and is stacked on a region where the plurality of pixel circuits are disposed;
On the surface of the organic EL layer opposite to the side facing the first substrate, a first inorganic sealing film, an organic sealing film, and a second inorganic sealing film are provided on the organic EL layer. A sealing film laminated in order from the side in contact with the layer,
Between the plurality of connection terminals, provided with a convex portion formed of an inorganic insulating material, preventing electrical connection between adjacent connection terminals,
On the side surface of the convex portion, a concave portion for accommodating an organic structure formed by an organic sealing material that forms the organic sealing film constituting the sealing film is formed.
An organic electroluminescence display device. The convex portion includes a first inorganic insulating layer and a second inorganic insulating layer, each formed of a different type of inorganic insulating material,
The concave portion formed on the side surface of the convex portion has the first inorganic insulating layer disposed closer to the insulating substrate than the second inorganic insulating layer, and the first inorganic insulating layer in a plan view The outer edge of the insulating layer is provided inside the outer edge of the second inorganic insulating layer.
The organic electroluminescence display device according to claim 1. The convex portion is disposed at a location closer to the insulating substrate than the first inorganic insulating layer, and is formed of an inorganic insulating material different from the first inorganic insulating layer, and a third inorganic insulating layer, Including
The concave portion formed on the side surface of the convex portion has an outer edge of the first inorganic insulating layer on an inner side of an outer edge of the second inorganic insulating layer and an outer edge of the third inorganic insulating layer in a plan view. Provided, formed by,
The organic electroluminescence display device according to claim 2. The second inorganic insulating layer and the third inorganic insulating layer are formed of the same kind of inorganic insulating material.
The organic electroluminescence display device according to claim 3. A plurality of pixel circuits having thin film transistors are arranged in a matrix on an insulating substrate, and a first substrate having a plurality of connection terminals electrically connected to an external electronic device is formed at an end of the insulating substrate. A first substrate forming step;
An organic EL layer that forms an organic EL layer that is separated from a region in which the plurality of connection terminals are provided on the first substrate and is stacked on a region in which the plurality of pixel circuits are disposed in a plan view. Forming process;
A surface of the organic EL layer formed by the organic EL layer forming step opposite to the side facing the first substrate is provided with a first inorganic sealing film, an organic sealing film, and a second A sealing film forming step of forming an inorganic sealing film and a sealing film laminated in order from the side in contact with the organic EL layer;
Including
The first substrate forming step includes a protruding portion forming step of forming a protruding portion formed of an inorganic insulating material that prevents electrical connection between adjacent connecting terminals between the plurality of connecting terminals. ,
In the convex portion forming step, a concave portion for forming an organic structure formed by an organic sealing material forming the organic sealing film constituting the sealing film is formed on a side surface of the convex portion. Including steps,
A method for producing an organic electroluminescence display device. The sealing film forming step includes
Along with the formation of the first inorganic sealing film, a first inorganic sealing film used for forming the first inorganic sealing film in a region provided with the plurality of connection terminals of the first substrate in a plan view. The surface of the first inorganic film on the opposite side of the first inorganic film from the side facing the first substrate is formed into a recessed portion formed in the concave portion by the concave portion forming step. Forming to be positioned;
Along with the formation of the organic sealing film, an organic sealing film material used for forming the organic sealing film is applied to a region where the plurality of connection terminals of the first substrate are provided in plan view, and the concave portion A step of forming an organic structure after storing the organic sealing film material in the recess;
Along with the formation of the second inorganic sealing film, a second inorganic sealing film used for forming the second inorganic sealing film in a region provided with the plurality of connection terminals of the first substrate in a plan view. The surface of the second inorganic film that faces the first substrate of the second inorganic film is defined as the side of the front first inorganic film that faces the first substrate. Forming it in direct contact with the opposite surface;
Removing the first inorganic film and the second inorganic film formed in a region where the plurality of connection terminals of the first substrate are provided in a plan view. The manufacturing method of the organic electroluminescent display apparatus of Claim 5 characterized by these. The convex portion forming step includes a step of forming a first inorganic insulating layer and a second inorganic insulating layer with different types of inorganic insulating materials,
The recess formed by the recess forming step forms the first inorganic insulating layer in a place closer to the insulating substrate than the second inorganic insulating layer, and the first inorganic insulating in a plan view. Formed by forming the outer edge of the layer inside the outer edge of the second inorganic insulating layer;
The manufacturing method of the organic electroluminescent display apparatus of Claim 5 or 6 characterized by the above-mentioned. The convex portion forming step includes a third inorganic insulating layer that is disposed in a place closer to the insulating substrate than the first inorganic insulating layer and is formed of an inorganic insulating material different from the first inorganic insulating layer. Further comprising forming,
The concave portion formed by the concave portion forming step includes an outer edge of the first inorganic insulating layer on an inner side of an outer edge of the second inorganic insulating layer and an outer edge of the third inorganic insulating layer in plan view. Formed by,
The manufacturing method of the organic electroluminescent display apparatus of Claim 7 characterized by the above-mentioned. The second inorganic insulating layer and the third inorganic insulating layer are formed of the same kind of inorganic insulating material.
The organic electroluminescence display device according to claim 8.

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