JP2014529193A - Apparatus and method for coating a support wafer - Google Patents

Abstract

An apparatus for coating an inner circular surface (7i) of a coated surface (3b) of a support wafer (3) with a coating material (9), the inner circular surface (7i) having the inner circular surface An application means (5) for applying a coating material (9) provided to coat the surface (7i), and the support wafer (3) is supported and rotated about the rotation axis (R), and the coated surface The inner circular surface (7i) of the coating surface (3b) of the support wafer (3) having rotating means (2, 6) for dispersing the coating material on (3b) is coated with the coating material (9). In a coating apparatus, a coating inhibitor that suppresses at least coating of the outer annular surface (7a) during dispersion of the coating material (9) on the outer annular surface (7a) surrounding the inner circular surface (7i). Characterized in that second application means (4) is provided for supplying That a device for coating the support wafer (3), as well as a corresponding method.

Description

  The invention relates to an apparatus and a method for coating an inner circular surface of a coated surface of a support wafer (carrier wafer) of the type of claims 1 and 9 with a coating material.

  In semiconductor technology, methods for temporary bonding (temporary wafer bonding) are becoming increasingly important so that structural wafers that are increasingly thinner and larger in area can be best handled. The handling of structural wafers is improved in the prior art, in particular by temporarily bonding only a part of the structural wafer, in particular the peripheral edge, to the support wafer. This prevents the adhesive from being applied to the structured surface of the structural wafer as much as possible. This is done in the prior art by forming only the edge area of the coated surface of the support wafer. Particularly in this case, the inner circular surface of the wafer is coated with a coating material that reduces the adhesive force. The non-adhesive coating material is preferably, but not limited to, an anti-adhesion layer material (ASL) such as Easy Clean Coat 1000 from 3M.

  The prior art currently has the following steps for manufacturing: First, the edge area B of the support wafer is coated with a lacquer, for example a photoresist. The photoresist is cured in an oven or on a heating plate. Next, ASL is applied over the entire surface. The ASL material does not reach the surface of the support wafer that is coated with the photoresist. The remaining ASL material is shaken off after a predetermined working time until a molecular layer is formed in the central region of the support wafer that is not coated with photoresist. The photoresist is then removed, for example with acetone. At this point, a support wafer is created that consists of two areas: an edge area without ASL coating and an ASL coated core area. Thereafter, an adhesive is applied to the entire support wafer. The adhesive adheres very well to the edge area not covered by the ASL material. The adhesive strength of the adhesive in the core area coated with ASL material is very weak. In the core area, the adhesive mainly serves to support the structure of the structural wafer that is subsequently bonded to the support wafer. The prior art clearly shows that multiple steps are required to produce the two zones. The first is the application of photoresist, the second is the curing of the photoresist, the third is the application of ASL material, the fourth is the removal of the photoresist, and the fifth is the application of adhesive.

  In this case, the application of the coating material and the adhesive to the support wafer is preferably carried out as cheaply and as quickly as possible, but at the same time with high quality, in particular with a layer thickness as uniform as possible.

  Therefore, an object of the present invention is to improve an apparatus and a method for coating a supporting wafer so that coating can be performed quickly and inexpensively and at the same time with high quality.

  This problem is solved by the configuration described in the characterizing portions of claims 1 and 9. Advantageous further configurations of the invention are described in the dependent claims. All combinations of at least two features described in the specification, claims and / or drawings are within the scope of the present invention. In the defined value range, values within the stated range should also be considered disclosed as limiting values and can be claimed in any combination.

  The idea underlying the present invention is that the coating of the coating material on the support wafer is carried out in different areas of the coating surface of the support wafer (especially the inner circular surface and around the inner circular surface, preferably the Suppressing, preferably blocking, at least approximately simultaneously with the covering material of the covering surface (outer annular surface) that should not be coated in the area (consisting of the outer circular surface surrounding the inner circular surface) It is in. The coating material may in particular be an anti-adhesion material that prevents the adhesion of the structural wafer or applied adhesive to the support wafer as much as possible in the area where the coating material is applied on the coated surface of the support wafer. The covering surface of the supporting wafer is mainly the surface side of the supporting wafer on which the structural surface of the structural wafer is supported, and in particular, has the same surface and surface contour, preferably over the entire surface. The structural wafer may be a wafer having two structural surfaces. Since the coating material is preferably applied concentrically to the support wafer, the coating material is preferably applied during the rotation of the support wafer and evenly and uniformly distributed on the support wafer by the rotation of the support wafer. Is done. By applying almost simultaneously the solvent which dissolves the coating material on the uncovered area of the structural wafer, in particular on the bonding area, the coating of the coated surface in this area is at least almost completely blocked, in particular completely. . Covering the edge area (especially the outer toric surface) can also be prevented by moving the coating material outwardly through the solvent at the edge. In another configuration, what can move the coating material outward does not necessarily have to be a solvent, but can be any liquid. This means suppresses or in particular completely prevents the coating in the area (outer annular surface) where it is applied. Therefore, it is referred to herein as a coating inhibitor.

  After curing of the coating material in the area to be coated of the coated surface, and in particular after removal of the coating inhibitor by rotation or vaporization of the supporting wafer, a support wafer having a partially coated coated surface is obtained, which It can be manufactured in a continuous and one-step process of the present invention. Then, the adhesive can be applied and dispersed in the uncoated region, in particular, in the uncoated region of the coated surface by the second coating means for applying a solvent. The adhesive can be applied over the entire substrate, as is known from the prior art, in which case the adhesive is similarly applied to areas with low and high adhesion strength. Therefore, according to the present invention, a support wafer having a coated surface having a plurality of areas for supporting a structural wafer can be manufactured by the two-stage manufacturing method according to the present invention. The coating inhibitor and the coating material are preferably applied simultaneously. In the operating sequence, the solvent is preferably applied at the latest by the arrival of the coating material, more preferably simultaneously with the coating material, very preferably before the coating material. In the stop sequence, the coating with the coating material is terminated before the coating with the solvent.

  Preferably, the solvent and the coating material are rarely mixed. In the boundary layer, the coating material is most rapidly vaporized by the solvent. Since the mixing of the coating material with the coating inhibitor, in particular the solvent, is small according to the invention, the coating material is not coated in areas that should not be coated. After the central area (especially the inner circular surface) has been effectively coated, this condition is checked later by any measuring method, preferably by a contact angle measuring device. Preferably, the contact angle of the region that should not be coated varies by up to 15 °, preferably up to 10 °, more preferably up to 5 °, most preferably 0 ° according to the process of the invention. did.

  The removal of material at the edge of the wafer by a separate process step that has been performed so far is converted according to the invention into one process of edge cleaning, which is performed at the same time as the coating, whereby the coating material Can be suppressed, or preferably completely prevented. In particular, the entire adhesive application is not necessarily a component of the method and apparatus according to the invention, but can be included in the method and apparatus components of the invention.

  According to a preferred configuration, the first application means is arranged or arranged so that the application of the coating material takes place concentrically in the region of the axis of rotation of rotation, in particular with respect to the support wafer. It is. Thereby, the dispersion of the coating material is carried out very homogeneously along the coating surface, in particular at a constant rotational speed, so that a homogeneous distribution of the coating material is obtained over the entire coating surface. The support wafer is rotated by supporting the support wafer with a rotatable support portion, particularly a chuck, and fixing the position. In this case, support and position fixing of the support wafer are performed while being aligned so as to be concentric as accurately as possible with respect to the rotation axis of the support device.

  The second application means is arranged or can be arranged such that the coating inhibitor is applied at least in the circumferential section of the outer annular surface and in the region of the edge located radially inward of the outer annular surface. Thus, in this case as well, the principle of dispersion of the coating inhibitor by the rotation of the support wafer can be used, and according to the present invention, the coating inhibitor and the coating material can be applied at least almost simultaneously. . These are different from each other only at the application point on the coated surface. In this case, the solvent is applied to the support wafer away from the rotation axis R rather than the coating material.

  In this case, according to the present invention for controlling the application amount and / or application pressure and / or application speed and / or application angle and / or application time and / or application position of the first application means and / or the second application means. It is preferable if a control means is provided. If the above parameters are configured to be adjustable, the device according to the invention and the method according to the invention can be adjusted for different combinations of coating materials and corresponding coating inhibitors. When coating inhibitors are supplied in large quantities, on the one hand, the coating material is effectively peeled off or dissolved, or the coating material is more strongly prevented by the coating inhibitor from covering or covering the outer edge area. On the other hand, more coating inhibitor is consumed. By increasing the application pressure or application speed or selecting an appropriate application angle, the release of the coating inhibitor and the coating material can be optimized without particularly increasing the application amount.

  If a curing means for curing the coating material is provided, the coating material can be cured in particular simultaneously with the dispersion of the coating material on the coating surface, so that the one-stage or two-stage process according to the invention is further improved. Can be good. It is understood that in connection with ASL materials, monolayers or multi-layers are formed during curing. In the arrangement according to the invention, such a layer is formed by a separation effect on the surface. Furthermore, “curing” is to be understood in the following text as the formation of a non-adhesive layer.

  According to another preferred configuration of the invention, the second application means has at least one conduit that can be arranged with the outlet end facing the outer annular surface. Accordingly, the coating inhibitor is applied to the areas of the coated surface where the coating material is to be specially dissolved or generally separated during dispersion of the coating material, and thus is not cured there (see “curing” above). Can be sprayed and applied as desired.

  In this case, the second application means is particularly suitable if it has a controllable nozzle, particularly at each outlet end. The inner nozzle typically has an opening diameter of 0.125 inches, and the outer nozzle typically has an opening diameter of 0.25 inches. Nozzles with smaller or larger opening diameters are also conceivable. The opening diameter is greater than 0.001 inch, preferably greater than 0.01 inch, more preferably greater than 0.1 inch, especially less than 1 inch. By such means, the device according to the invention is not only adjustable for a wide variety of coating materials / solvent combinations, but also for the desired size of the adhesion area for different sizes of support wafers or anti-adhesion areas. The ratio can also be adjusted.

  If a feature disclosed for a device includes a method feature, this should be considered method disclosed as well, and vice versa.

  The drawings disclose further advantages, features and embodiments of the present invention.

It is the perspective view which showed the Example of the apparatus by this invention before coating | coated material application. FIG. 2 shows the embodiment of FIG. 1 after execution of a two-stage process according to the present invention.

  In the drawings, the same reference numerals are given to components having the same or the same function.

  The illustrated arrangement of the device according to the invention for coating the inner circular surface 7i of the coated surface 3b of the support wafer 3 with a coating material 9 is only schematically shown in the drawings and is mainly used for the explanation of the invention. It is limited to various components. Accordingly, the drawings do not show, for example, a frame for holding the illustrated components or a control device according to the present invention for controlling the components according to the present invention described below.

  After the support wafer 3 is aligned with respect to the rotation axis R, the support wafer 3 is supported and fixed on the support 2 (for example, a chuck) by the lower surface 3u opposite to the coating surface 3b. According to the present invention, the rotation axis R is located at the center point (rotation symmetry center) of the support wafer 3. The rotation is performed by a rotating shaft 6 driven by driving means (not shown) (while being controlled by the control device). The support 2, the rotary shaft 6 and the control device together form the rotating means according to the invention. Above the covering surface 3b, a first application means 5 in the form of a pipe 5l is or can be arranged. In this case, the position of the first application means 5 is fixed with respect to the rotation axis R or arranged so that the position can be fixed. In the illustrated configuration, the outlet end portion 5e of the pipe line 5l has a nozzle 5d and is directed in the direction of the center point of the support wafer 3 (intersection of the rotation axis and the covering surface 3b).

  The pipe 5l is connected to a storage container (not shown) for the coating material 9, and the supply of the coating material 9 from the storage container to the nozzle 5d and the application to the coating surface 3b are controlled by a control device. This is done via a pump (not shown). The above features form the first application means 5. The coating material 9 does not need to be applied by a pump, but can be applied only by gravity action from a high container. Furthermore, it is conceivable to apply the liquid at high pressure or high speed. It is clear to the person skilled in the art that it is only important to apply the coating material.

  The coating material 9 is applied to the inner circular surface 7 i by the first application means 5, particularly at the intersection of the rotation axis R and the inner circular surface 7 i (the center point of the support wafer 3), and particularly with the rotation axis R as the center. It is dispersed on the inner circular surface 7i while being accelerated by the rotation of the rotating means.

  The coating material 9 is sent radially and concentrically from the center point of the support wafer 3 by the centrifugal force generated on the coating surface 3b by the rotation and rotation, and leaves the inner circular surface 7i to the outer annular surface 7a. It's easy to imagine going up. Due to the friction of the coating surface 3 b by the coating material 9, the coating material 9 is also accelerated in the rotation direction of the rotating means, whereby the coating material 9 follows the arcuate path from the center point of the support wafer 3 to the peripheral portion 7 e. It is accelerated to. By further rotation, the coating material 9 is further sent radially outward to the peripheral edge 7e, where the coating material 9 leaves the support wafer 3 and is collected by a collection device (not shown).

  While the coating material 9 is moving along the coating surface 3b, the coating material 9 is cured by the curing means (curing as described above), so that the coating material 9 is uniformly distributed over the entire coating surface 3b without further measures. A layer is produced.

  In the illustrated embodiment, the second coating means 4 for supplying a solvent as a coating inhibitor capable of dissolving the coating material 9 to the outer annular surface 7a surrounding the inner circular surface 7i is provided on the support wafer 3 in the illustrated embodiment. It is arranged on the upper side or can be arranged. Preferably, the place of supply to the coating surface 3b of the coating means or the second coating means 4 can be adjusted by the alignment means, in particular by adjusting the coating means 4 parallel to the coating surface 3b. It is adjustable.

  The application by the second application unit 4 is performed further away from the center point of the support wafer 3 than the application by the first application unit 5.

  The configuration of the second application means 4 may be the same as that of the first application means 5, and in particular, the conduit 41, the outlet end 4e, the nozzle 4d, and a storage container for the solvent (not shown). And a pump (controlled by the controller).

  The application of the solvent by the second application means 4 is performed in the area of the circumferential section 7u, and in the illustrated embodiment, the solvent is applied only at one location on the entire circumference. For the first time by the rotation of the support wafer 3 by the rotating means, the solvent is completely supplied to the outer annular surface 7a after the support wafer 3 makes one rotation.

  The second application unit 4 is arranged so that the solvent is applied to the edge 7 r located inside the outer annular surface 7 a, that is, toward the center point of the support wafer 3. From here, similarly to the coating agent 9, it is accelerated in the rotational direction toward the radially outer side, whereby the solvent is continuously supplied to the entire outer annular surface 7a, and the coating material 9 is dissolved by this solvent, And / or by preventing the coating material 9 on the outer annular surface 7a from curing and / or allowing the coating material 9 to be swung over the coating inhibitor. Separated from 3b.

  Therefore, after a predetermined amount of the coating material 9 is applied by the first application means 5, the hardened portion of the coating material 9 remains as a uniform anti-adhesion layer on the inner circular surface 7i, but the outer annular surface 7a Curing of the coating material 9 is prevented or at least suppressed by the solvent.

  Accordingly, the support wafer 3 in which the coating material 9 (anti-adhesion layer) is coated only on the inner circular surface 7i is produced in a one-step process by the simultaneous application of the coating material 9 and the coating inhibitor.

  Particularly in the device according to the invention, in the second step, the adhesive layer can be applied to the outer annular surface 7a, in particular to the entire coated surface 3b (ie also on the coating material 9 on the inner circular surface 7i). For this purpose, the first application means 5 and / or the second application means 4 or a separate third application means (not shown) can be used.

  Furthermore, in order to clean the support wafer 3 after coating, a fourth application means 4 can be provided according to the present invention.

  The radius X of the inner circular surface 7i is defined by the distance between the coating inhibitor application site and the rotation axis R on the coating surface 3b. Thereby, the ring width B of the outer annular surface 7a is also automatically defined. The ring width B is less than 10 mm, preferably less than 5 mm, more preferably less than 2 mm, and most preferably less than 1 mm. Due to the shape of the nozzle 4d, the application of the solvent can be carried out as a directed jet, in particular as a flat jet, whereby the inner edge 7r is defined as clearly as possible and is concentric with the support wafer 3. Extended.

  In a preferred configuration of the invention, a plurality of pipe lines 4l distributed around can be provided for applying the solvent to the plurality of circumferential sections 7u. In a preferred configuration, the application angle (in the illustrated embodiment, parallel to the rotation axis R) is arranged so that the nozzle 4d is inclined toward the outside. Such a measure prevents the coating inhibitor from entering the inner circular surface 7i.

DESCRIPTION OF SYMBOLS 2 Support body 3 Support wafer 3b Cover surface 3u Lower surface 4 2nd application means 4l Pipe line 4d Nozzle 4e Outlet end part 5 1st application means 5l Pipe line 5d Nozzle 5e Outlet end part 6 Rotating shaft 7a Outer ring surface 7i Inner circular surface 7e Peripheral part 7r Edge located on the inner side 7u Peripheral section 8 Adhesive 9 Coating material R Rotating axis X Radius B Ring width

Claims (11)

An apparatus for coating the inner circular surface (7i) of the coated surface (3b) of the support wafer (3) with a coating material (9),
Coating means (5) for applying a coating material (9) to be coated on the inner circular surface (7i) to the inner circular surface (7i);
In an apparatus having rotating means (2, 6) for supporting and rotating the support wafer (3) about a rotation axis (R) and rotating the support wafer (3) on the coating surface (3b).
A second coating inhibitor that suppresses at least the coating of the outer annular surface (7a) during the dispersion of the coating material (9) is supplied to the outer annular surface (7a) surrounding the inner circular surface (7i). A device for coating the inner circular surface (7i) of the coating surface (3b) of the support wafer (3) with the coating material (9), characterized in that the coating means (4) is provided.   The device according to claim 1, wherein the coating inhibitor is a solvent capable of dissolving the coating material (9).   The first application means (5) is arranged so that the application of the coating material (9) is performed concentrically in the region of the rotational axis (R) of rotation, in particular with respect to the support wafer (3). The device according to claim 1, wherein the device is arranged or configurable.   In the second application means, the coating agent is applied at least at the circumferential section (7u) of the outer annular surface (7a), and at the edge (in the radial direction of the outer annular surface (7a) ( The device according to any one of claims 1 to 3, wherein the device is arranged or can be arranged to take place in the region 7r).   Control means for controlling the coating amount and / or coating pressure and / or coating speed and / or coating angle and / or coating time point of the first coating means (5) and / or the second coating means (4) is provided. The device according to any one of claims 1 to 4, wherein:   6. A device according to any one of the preceding claims, wherein a curing means for curing the coating material (9) is provided.   The second application means (4) comprises at least one conduit (41) that can be arranged with the outlet end (4e) facing the outer annular surface (7a). The apparatus according to any one of 6 to 6.   8. The device according to claim 1, wherein the second application means (4) has a particularly controllable nozzle (4d), in particular at each outlet end (4e). A method of coating an inner circular surface (7i) of a coated surface (3b) of a support wafer (3) with a coating material (9),
The coating material (9) is applied to the inner circular surface (7i) by the first application means (5), and the support wafer (3) centered on the rotation axis (R) by the rotation means (2, 6). Method of coating the inner circular surface (7i) of the coating surface (3b) of the support wafer (3) with the coating material (9), which has the step of dispersing the coating material (9) by rotation, in particular a course. In
During the dispersion of the coating material (9), the outer ring surface (7a) is coated on the outer ring surface (7a) surrounding the inner circular surface (7i) by the second application means (4). A method of coating the inner circular surface (7i) of the coating surface (3b) of the support wafer (3) with a coating material (9), characterized in that at least a coating inhibitor to suppress is supplied.   10. The method as claimed in claim 9, wherein the coating material (9) is applied concentrically in the region of the axis of rotation (R), in particular to the support wafer (3).   In particular, the coating material is applied in the region of the edge portion (7r) located radially inward of the outer annular surface (7a) in at least the circumferential section (7u) of the outer annular surface (7a). The method according to claim 9 or 10, wherein the method is carried out with a time shift from the application of (9).

Images