JP2014511146A5 - - Google Patents

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JP2014511146A5
JP2014511146A5 JP2014505353A JP2014505353A JP2014511146A5 JP 2014511146 A5 JP2014511146 A5 JP 2014511146A5 JP 2014505353 A JP2014505353 A JP 2014505353A JP 2014505353 A JP2014505353 A JP 2014505353A JP 2014511146 A5 JP2014511146 A5 JP 2014511146A5
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Prior art keywords
dopant material
silicon
concentration
zone
growth
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JP2014505353A
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JP2014511146A (en
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Priority claimed from PCT/US2012/033593 external-priority patent/WO2012142463A2/en
Publication of JP2014511146A publication Critical patent/JP2014511146A/en
Publication of JP2014511146A5 publication Critical patent/JP2014511146A5/ja
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Claims (10)

るつぼと、
前記るつぼの上に突き出る搬送ポイントを有し、制御可能な量のシリコンを前記るつぼ内へ搬送する送給機を含むシリコン搬送システムと、
少なくとも1つのドーパント材料を前記シリコン搬送システムに制御可能に搬送し、それによってドーパント材料を前記るつぼに搬送する少なくとも1つのドーピング機構と
を含む、チョクラルスキー成長システム。
Crucible,
A silicon transfer system having a transfer point protruding above the crucible and including a feeder for transferring a controllable amount of silicon into the crucible;
A Czochralski growth system comprising: at least one doping mechanism for controllably delivering at least one dopant material to the silicon delivery system and thereby delivering the dopant material to the crucible.
前記るつぼが、外部送給ゾーンと流体連通している内部成長ゾーンを含む、請求項1に記載のチョクラルスキー成長システム。   The Czochralski growth system of claim 1, wherein the crucible includes an internal growth zone in fluid communication with an external delivery zone. 前記送給機が、前記シリコン及びドーパント材料を前記るつぼの前記外部送給ゾーン内へ搬送する、請求項に記載のチョクラルスキー成長システム。 The Czochralski growth system according to claim 2 , wherein the feeder conveys the silicon and dopant material into the external feeding zone of the crucible. 前記システムが2つのドーピング機構を含む、請求項1に記載のチョクラルスキー成長システム。   The Czochralski growth system of claim 1, wherein the system includes two doping mechanisms. 第一のドーピング機構が第一のドーパント材料を前記送給機に制御可能に搬送し、第二のドーピング機構が第二のドーパント材料を前記送給機に制御可能に搬送し、ここで、前記第一のドーパント材料と前記第二のドーパント材料とは異なっている、請求項に記載のチョクラルスキー成長システム。 A first doping mechanism controllably transports a first dopant material to the feeder, and a second doping mechanism controllably transports a second dopant material to the feeder, where the The Czochralski growth system according to claim 2 , wherein the first dopant material and the second dopant material are different. 偏析係数kを有する濃度Cのドーパント材料を含むシリコンインゴットのチョクラルスキー成長の方法であって、
i)外部送給ゾーンと流体連通している内部成長ゾーンを有するるつぼを用意する工程と、
ii)前記内部成長ゾーンにシリコン及び前記ドーパント材料を予め投入して混合物を形成し、ここで、前記混合物は、溶融されると、前記ドーパント材料の濃度C/kを有する工程と、
iii)前記混合物を溶融する工程と、
iv)前記内部成長ゾーンからの前記シリコンインゴットの成長を開始する工程と、
v)前記シリコンインゴットを成長させながら、シリコン及び前記ドーパント材料の送給を前記外部送給ゾーン内へ搬送し、前記送給は、溶融されると、前記ドーパント材料の平均濃度Cを有する工程と、
vi)濃度Cの前記ドーパント材料を含む前記シリコンインゴットを除去する工程と
を含む方法。
A method of Czochralski growth of a silicon ingot containing a dopant material at a concentration C having a segregation coefficient k, comprising:
i) providing a crucible having an internal growth zone in fluid communication with an external feed zone;
ii) pre-loading the ingrowth zone with silicon and the dopant material to form a mixture, wherein the mixture, when melted, has a concentration C / k of the dopant material;
iii) melting the mixture;
iv) initiating growth of the silicon ingot from the internal growth zone;
v) Conveying silicon and the dopant material feed into the external feed zone while growing the silicon ingot, the feed having an average concentration C of the dopant material when melted; ,
vi) removing the silicon ingot containing the dopant material at a concentration C.
前記第一のシリコンインゴットの成長を開始する工程の前に、前記外部送給ゾーンに、シリコン及び溶融されると濃度Cの前記ドーパント材料を予め投入する工程をさらに含む、請求項に記載の方法。 The method of claim 6 , further comprising pre-filling the external feed zone with silicon and the dopant material at a concentration C when molten prior to the step of initiating growth of the first silicon ingot. Method. 前記シリコンインゴットが、濃度Cで偏析係数kを有する第一のドーパント材料を含み、濃度Cで偏析係数kを有する第二のドーパント材料をさらに含み、
前記内部成長ゾーンに、シリコン、前記第一のドーパント材料及び前記第二のドーパント材料を予め投入して、混合物を形成し、ここで、前記混合物は、溶融されると、前記第一のドーパント材料の濃度C/k及び前記第二のドーパント材料の濃度C/kを有し、
前記外部送給ゾーンに、シリコン、溶融されると濃度Cの前記第一のドーパント材料及び溶融されると濃度Cの前記第二のドーパント材料を送給する、請求項に記載の方法。
The silicon ingot further includes a first dopant material having a segregation coefficient k 1 at a concentration C 1 and further comprising a second dopant material having a segregation coefficient k 2 at a concentration C 2 ;
Silicon, the first dopant material, and the second dopant material are pre-charged into the ingrowth zone to form a mixture, where the mixture, when melted, the first dopant material has a concentration C 1 / k 1 and a concentration C 2 / k 2 of the second dopant material,
Wherein the outer feed zone, silicon, to deliver the second dopant material of the first dopant material when it is melted concentrations C 1 and when it is melted concentration C 2, The method of claim 6 .
連続的チョクラルスキー成長法である、請求項に記載の方法。 The method according to claim 6 , which is a continuous Czochralski growth method. 偏析係数kを有する濃度Cのドーパント材料を含むシリコンインゴットのチョクラルスキー成長の方法であって、
i)外部送給ゾーンと流体連通している内部成長ゾーンを有するるつぼを用意する工程と、
ii)前記内部成長ゾーンにシリコン及び前記ドーパント材料を予め投入する工程と、 iii)前記内部成長ゾーンからの前記シリコンインゴットの成長を開始する工程と、 iv)前記内部成長ゾーンにおいて、前記シリコンインゴットを成長させながら、シリコン中の前記ドーパント材料の第一の濃度を維持する工程と、
v)前記外部送給ゾーンにおいて、前記シリコンインゴットを成長させながら、シリコン中の前記ドーパント材料の第二の濃度を維持し、ここで、前記第二の濃度は、前記第一の濃度未満である工程と
を含む方法。
A method of Czochralski growth of a silicon ingot containing a dopant material at a concentration C having a segregation coefficient k, comprising:
i) providing a crucible having an internal growth zone in fluid communication with an external feed zone;
ii) pre-loading silicon and the dopant material into the internal growth zone; iii) starting growth of the silicon ingot from the internal growth zone; and iv) in the internal growth zone, the silicon ingot Maintaining a first concentration of the dopant material in the silicon while growing;
v) maintaining a second concentration of the dopant material in silicon while growing the silicon ingot in the external delivery zone, wherein the second concentration is less than the first concentration. Including the steps.
JP2014505353A 2011-04-14 2012-04-13 Silicon ingot having a plurality of uniform dopants and method and apparatus for producing the same Pending JP2014511146A (en)

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US201161475351P 2011-04-14 2011-04-14
US61/475,351 2011-04-14
PCT/US2012/033593 WO2012142463A2 (en) 2011-04-14 2012-04-13 Silicon ingot having uniform multiple dopants and method and apparatus for producing same

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JP2014511146A5 true JP2014511146A5 (en) 2015-05-07

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US (1) US10202705B2 (en)
EP (1) EP2697412B1 (en)
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KR (1) KR20140097971A (en)
CN (1) CN103608496B (en)
MY (1) MY173316A (en)
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Families Citing this family (18)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR2994982B1 (en) * 2012-09-04 2016-01-08 Commissariat Energie Atomique PROCESS FOR MANUFACTURING MONOLITHIC SILICON PLATEBOARD WITH MULTIPLE VERTICAL JUNCTION
US9834857B2 (en) * 2013-05-16 2017-12-05 S-Tech Co., Ltd. Ingot raw material supply system
US9822466B2 (en) 2013-11-22 2017-11-21 Corner Star Limited Crystal growing systems and crucibles for enhancing heat transfer to a melt
US10724148B2 (en) * 2014-01-21 2020-07-28 Infineon Technologies Ag Silicon ingot and method of manufacturing a silicon ingot
DE102014107590B3 (en) * 2014-05-28 2015-10-01 Infineon Technologies Ag Semiconductor device, silicon wafer and method for producing a silicon wafer
JP6299543B2 (en) * 2014-09-18 2018-03-28 信越半導体株式会社 Resistivity control method and additional dopant injection device
US10337117B2 (en) 2014-11-07 2019-07-02 Infineon Technologies Ag Method of manufacturing a silicon ingot and silicon ingot
CN104499048A (en) * 2014-12-07 2015-04-08 海安县石油科研仪器有限公司 Monocrystalline silicon growth process based on continuous feeding
WO2018012654A1 (en) * 2016-07-14 2018-01-18 포토멕 주식회사 Introduction device for manuf+acturing silicon semiconductor ingot, and doping method
US10920337B2 (en) 2016-12-28 2021-02-16 Globalwafers Co., Ltd. Methods for forming single crystal silicon ingots with improved resistivity control
WO2019051247A1 (en) * 2017-09-08 2019-03-14 Corner Star Limited Hybrid crucible assembly for czochralski crystal growth
CN113272479A (en) * 2018-10-12 2021-08-17 环球晶圆股份有限公司 Controlling dopant concentration in silicon melt to enhance ingot quality
JP2022529451A (en) 2019-04-18 2022-06-22 グローバルウェーハズ カンパニー リミテッド Growth method of single crystal silicon ingot using continuous Czochralski method
US11111596B2 (en) 2019-09-13 2021-09-07 Globalwafers Co., Ltd. Single crystal silicon ingot having axial uniformity
US11111597B2 (en) 2019-09-13 2021-09-07 Globalwafers Co., Ltd. Methods for growing a nitrogen doped single crystal silicon ingot using continuous Czochralski method
CN115341264A (en) * 2019-09-13 2022-11-15 环球晶圆股份有限公司 Method for growing nitrogen-doped single crystal silicon ingot using Czochralski method and single crystal silicon ingot grown by the method
TWI784689B (en) * 2020-09-29 2022-11-21 日商Sumco股份有限公司 Method for producing silicon single crystal
US11499245B2 (en) 2020-12-30 2022-11-15 Globalwafers Co., Ltd. Additive feed systems, ingot puller apparatus and methods for forming a single crystal silicon ingot with use of such additive feed systems

Family Cites Families (24)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0220174A4 (en) * 1985-05-17 1989-06-26 Schumacher Co J C Continuously pulled single crystal silicon ingots.
JPS6379790A (en) * 1986-09-22 1988-04-09 Toshiba Corp Crystal pulling up device
JPH01138192A (en) * 1987-11-25 1989-05-31 Sumitomo Electric Ind Ltd Method for growing single crystal and apparatus therefor
JP2615968B2 (en) * 1988-02-04 1997-06-04 三菱マテリアル株式会社 Single crystal pulling method
JP2755588B2 (en) * 1988-02-22 1998-05-20 株式会社東芝 Crystal pulling method
JPH0283292A (en) * 1988-09-20 1990-03-23 Nkk Corp Production of silicon single crystal and apparatus therefor
JPH0218377A (en) * 1988-07-07 1990-01-22 Nkk Corp Dopant feeder
FI893246A (en) * 1988-07-07 1990-01-08 Nippon Kokan Kk FOERFARANDE OCH ANORDNING FOER FRAMSTAELLNING AV KISELKRISTALLER.
JPH03183686A (en) * 1989-12-13 1991-08-09 Nippon Steel Corp Doping method in pulling up single crystal
JP2837903B2 (en) * 1989-12-27 1998-12-16 新日本製鐵株式会社 Method for producing silicon single crystal
DE4106589C2 (en) * 1991-03-01 1997-04-24 Wacker Siltronic Halbleitermat Continuous recharge with liquid silicon during crucible pulling according to Czochralski
DE4213097A1 (en) * 1992-04-19 1993-10-21 Nippon Kokan Kk Dopant feeding appts. for single crystal prodn. means
US5288366A (en) * 1992-04-24 1994-02-22 Memc Electronic Materials, Inc. Method for growing multiple single crystals and apparatus for use therein
JPH0676273A (en) 1992-08-27 1994-03-18 Hitachi Ltd Magnetic disk and production thereof
JPH06204150A (en) * 1992-12-28 1994-07-22 Sumitomo Sitix Corp Manufacture of silicon single crystal substrate for semiconductor
JP3484870B2 (en) * 1996-03-27 2004-01-06 信越半導体株式会社 Method for producing silicon single crystal by continuous charge method and dopant supply apparatus
JP4634553B2 (en) * 1999-06-08 2011-02-16 シルトロニック・ジャパン株式会社 Silicon single crystal wafer and manufacturing method thereof
JP2001240495A (en) * 2000-02-29 2001-09-04 Toshiba Ceramics Co Ltd Pulling-up method of single crystal silicon
JP4723071B2 (en) * 2000-10-24 2011-07-13 信越半導体株式会社 Silicon crystal, silicon crystal wafer, and manufacturing method thereof
US7635414B2 (en) * 2003-11-03 2009-12-22 Solaicx, Inc. System for continuous growing of monocrystalline silicon
US20070056504A1 (en) 2005-09-12 2007-03-15 Rexor Corporation Method and apparatus to produce single crystal ingot of uniform axial resistivity
JP5246163B2 (en) * 2007-08-21 2013-07-24 株式会社Sumco Silicon single crystal wafer for IGBT and manufacturing method of silicon single crystal wafer for IGBT
FR2929960B1 (en) * 2008-04-11 2011-05-13 Apollon Solar PROCESS FOR PRODUCING CRYSTALLINE SILICON OF PHOTOVOLTAIC QUALITY BY ADDING DOPING IMPURITIES
US8434511B2 (en) 2009-07-08 2013-05-07 Gt Advanced Cz Llc Retractable and expandable water cooled valve gate useful for sealing a hot processing chamber

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