JP2014165429A - Injector mounting device and injector mounting method - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide an injector mounting device or an injector mounting method capable of keeping a proper distance between a reaction tube and an injector and preventing the injector from being damaged when mounting the injector to the reaction tube.SOLUTION: The injector mounting device includes piping in which gas to be supplied to a reaction tube is circulated, and is used for fixing to the reaction tube a horizontal portion of the injector in which the piping is substantially L-shaped in a length direction, and mounting a substantially L-shaped vertical portion along an inner surface of the reaction tube. The injector mounting device comprises: holding parts which hold the vertical portion therebetween before mounting the injector to the reaction tube and are held by the injector in a rotatable state; a positioning part which is abutted to the horizontal portion to determine positions of the holding parts in a vertical direction; and an abutting part which is brought into contact with the inner surface of the reaction tube on a side surface at a side opposite to the holding parts.

Description

  The present invention relates to an injector mounting device or an injector mounting method.

  In a substrate processing apparatus (for example, a semiconductor substrate manufacturing apparatus), a plurality of substrates are arranged inside a reaction tube, and then a processing gas is supplied to the reaction tube using an injector, and the reaction tube is heated. There are some which process the surface of the substrate.

  Patent Document 1 discloses a technique for supplying a processing gas into a reaction tube using an L-shaped injector (nozzle) composed of a vertical portion and a horizontal portion. Moreover, in patent document 1, when attaching an injector to a reaction tube, in order to ensure the space | interval (clearance) between a reaction tube and an injector, the technique which pinches | interposes a spacer (holding jig) between a reaction tube and an injector. Disclosure.

JP 2012-151386 A

  However, in the technique disclosed in Patent Document 1, when the injector is attached to the reaction tube, the operator may come into contact with the pair of arms of the holding jig and the holding jig may come off. In the technique disclosed in Patent Document 1, when the injector is attached to the reaction tube, the L-shaped horizontal portion of the injector is inserted into the gas supply portion of the reaction tube, so that the L-shaped horizontal portion is perpendicular to the L-shaped horizontal portion. A load is applied to the connection part with the part, and the injector may be damaged. Furthermore, in the technique disclosed in Patent Document 1, when an injector is hermetically attached to a gas supply portion of a reaction tube via a seal member (such as an O-ring), the injector is inserted into the gas supply portion. There is a possibility that the load applied to (the connecting portion of the like) increases and the holding jig is detached or the injector is damaged. For example, when a quartz injector is used, there is a high possibility that the injector will be damaged.

  In view of the above circumstances, the present invention can maintain a proper distance between the reaction tube and the injector when the substantially L-shaped injector is attached to the reaction tube of the substrate processing apparatus, and the injector is damaged. It is an object of the present invention to provide an injector mounting device or an injector mounting method capable of preventing the above.

  According to one aspect of the present invention, a horizontal portion of an injector including a pipe through which a gas to be supplied to a reaction tube is circulated, the shape of the pipe in the longitudinal direction being substantially L-shaped is fixed to the reaction tube. An injector attachment device used when attaching the substantially L-shaped vertical portion along the inner surface of the reaction tube, and can be attached to the injector by inserting the vertical portion before attaching the injector to the reaction tube. And a holding portion rotatably held by the injector, and a positioning portion that contacts the horizontal portion when the holding portion is attached to the injector and determines a vertical position of the holding portion. The side surface opposite to the holding portion is in contact with the inner surface of the reaction tube when the injector is attached to the reaction tube, and between the injector and the inner surface of the reaction tube. Injector attachment device having a contact portion to secure is provided. The abutting portion is an injector mounting device in which only the upper end of the vertical portion of the injector is brought into contact with the inner surface of the reaction tube, and the vertical portion is mounted so as to secure the gap along the inner surface of the reaction tube. There may be. The abutment portion is an injector mounting device that has a cylindrical surface whose axis is parallel to the longitudinal direction of the vertical portion, and that contacts the cylindrical surface with the inner surface of the reaction tube to secure the interval. There may be. The positioning unit may be an injector mounting device that has a semicircular opening and determines the position in the vertical direction by disposing the horizontal part in the opening. Any one of the above-described injector mounting devices may further include a mounting portion for mounting a tag that is visually recognized by the mounting person.

  According to another aspect of the present invention, for an injector including a pipe through which a gas to be supplied to a reaction tube is circulated, and the shape of the pipe in the longitudinal direction is a substantially L shape, the holding portion held by the injector; While fixing the horizontal part of the injector to the reaction tube using an injector mounting device comprising a positioning part for determining the vertical position of the holding part and an abutting part in contact with the inner surface of the reaction tube, An injector mounting method for mounting the substantially L-shaped vertical portion along the inner surface of the reaction tube, the outer shape of the vertical portion being sandwiched by the holding portion, and the injector mounting device being mountable on the vertical portion. A holding step for rotatably holding the vertical portion; and when the holding portion is attached to the injector, the positioning portion is brought into contact with the horizontal portion, and the vertical portion A positioning step for determining a vertical position of the injector mounting device held on the side, and a side portion on the opposite side of the holding portion when the injector holding the injector mounting device is attached to the reaction tube A contact step for contacting the abutting portion with the inner surface of the reaction tube to ensure a gap between the injector and the inner surface, and after securing the spacing, the injector mounting device is rotated about the vertical portion as a rotation center. Thus, there is provided an injector mounting method including a detaching step of separating the abutting portion and the inner surface of the reaction tube while maintaining the distance and then removing the injector mounting device. The abutting step is an injector mounting method in which only the upper end of the vertical portion of the injector is brought into contact with the inner surface of the reaction tube, and the vertical portion is mounted so as to ensure the gap along the inner surface of the reaction tube. There may be. The positioning portion has a semicircular opening, and the positioning step arranges the horizontal portion in the opening by moving the injector mounting device in a vertical direction, and the removing step includes the step of The injector mounting method may be such that the injector mounting device is rotated after the injector mounting device is moved in a direction opposite to the vertical direction to separate the opening from the horizontal portion. Before the holding step, it further includes a tag attaching step for attaching a lowering tag to the injector attaching device, and the removing step is triggered by the fact that the lowering tag is visually observed by an installer. An injector mounting method in which the mounting device is removed may be used.

  According to the injector mounting device or the injector mounting method according to the present invention, when the injector is mounted on the reaction tube, the distance between the reaction tube and the injector can be properly maintained, and the injector can be prevented from being damaged. Can do.

It is explanatory drawing explaining the injector attachment apparatus which concerns on the 1st Embodiment of this invention. It is an enlarged view explaining the injector attachment apparatus which concerns on the 1st Embodiment of this invention. It is explanatory drawing explaining an example of the lowering tag attached to the injector attachment apparatus which concerns on the 1st Embodiment of this invention. It is a schematic longitudinal cross-sectional view explaining the substrate processing apparatus (vertical heat processing apparatus) which concerns on the 2nd Embodiment of this invention. It is a schematic cross-sectional view explaining the substrate processing apparatus which concerns on the 2nd Embodiment of this invention. It is explanatory drawing explaining the operation | movement which attaches an injector to the substrate processing apparatus which concerns on the 2nd Embodiment of this invention. It is an enlarged view of the principal part of the substrate processing apparatus for demonstrating the operation | movement which attaches an injector to the substrate processing apparatus which concerns on the 2nd Embodiment of this invention. It is explanatory drawing explaining the procedure of the operation | movement which removes an injector attachment apparatus, after attaching an injector to the substrate processing apparatus which concerns on the 2nd Embodiment of this invention. It is explanatory drawing explaining the operation | movement which attaches an injector to the substrate processing apparatus which concerns on the Example of this invention. It is explanatory drawing explaining the example of the clearance of the injector attached to the substrate processing apparatus which concerns on the Example of this invention. It is explanatory drawing explaining another injector attachment apparatus (comparative example 1). It is explanatory drawing explaining the example which attached the other injector attachment apparatus (comparative example 1) to the substrate processing apparatus. It is explanatory drawing explaining another injector attachment apparatus (comparative example 2). It is explanatory drawing explaining the example which attached the other injector attachment apparatus (comparative example 2) to the substrate processing apparatus.

  The present invention will be described using an injector mounting device according to a non-limiting exemplary embodiment with reference to the accompanying drawings.

  In the following description, the same or corresponding devices, parts, or members described in all the attached drawings are denoted by the same or corresponding reference numerals, and redundant description is omitted. Also, the drawings are not intended to show a limited relationship between devices, parts or members unless specifically described. Accordingly, specific correlations can be determined by one skilled in the art in light of the following non-limiting embodiments.

  The present invention will be described in the following order using the injector mounting device according to the embodiment of the present invention.

1. First embodiment (injector mounting device)
2. Second embodiment (substrate processing apparatus to which an injector can be attached)
3. Example [First Embodiment]
[Configuration of injector mounting device]
An injector mounting device 10 according to a first embodiment of the present invention will be described with reference to FIG. FIG. 1 is an explanatory view illustrating an injector mounting device 10 according to the present embodiment. Here, FIG. 1A is an explanatory diagram before the injector mounting device 10 is mounted on the injector 110. FIG. 1B is an explanatory view after the injector mounting device 10 is mounted on the injector 110.

  As shown to Fig.1 (a), the injector attachment apparatus 10 which concerns on this embodiment is an apparatus attached to the injector 110 which is a substantially L shape. The injector mounting device 10 is a device used to mount the injector 110 at a desired position of the substrate processing apparatus when mounting the injector 110 on a substrate processing apparatus (for example, the reaction tube 120 (described later) in FIG. 6). .

  As shown in FIG.1 (b), the injector attachment apparatus 10 is hold | maintained at the substantially L-shaped vertical part 110v of the injector 110, and is attached to the injector 110 so that attachment or detachment is possible. In addition, the injector mounting device 10 is brought into contact with the substantially L-shaped horizontal portion 110h of the injector 110, and the position of the injector mounting device 10 in the vertical direction Xv is determined. Furthermore, in this embodiment, the injector mounting device 10 is attached with a lowering tag 16 (FIG. 3 to be described later) in order to prevent forgetting to remove the injector mounting device 10 after the injector 110 is mounted.

  An operator who attaches the injector 110 to the substrate processing apparatus (hereinafter referred to as “installer”) first attaches the injector mounting apparatus 10 to the injector 110 when attaching the injector 110 to the substrate processing apparatus. Next, the installer uses the injector mounting device 10 to mount the injector 110 at a desired position of the substrate processing apparatus. At this time, the installer uses the injector mounting apparatus 10 as a spacer member to mount the injector 110 at a desired position of the substrate processing apparatus. Further, the installer uses the injector mounting device 10 as a member that reinforces the connecting portion 110c (FIG. 1A) between the substantially L-shaped vertical portion 110v and the horizontal portion 110h of the injector 110, and breaks the injector 110. To prevent.

  Thereafter, the installer removes the injector mounting device 10 from the injector 110. At this time, the installer confirms that the injector mounting device 10 is attached to the injector 110 by visually observing the lowering tag 16, and prevents the removal of the injector mounting device 10 from being forgotten.

  That is, the injector mounting apparatus 10 according to the present embodiment of the present invention is configured so that when the injector 110 is mounted on the substrate processing apparatus, the injector 110 and the substrate processing apparatus are mounted in order to mount the injector 110 at a desired position of the substrate processing apparatus. It functions as a spacer member that determines the interval (clearance). Further, the injector mounting device 10 functions as a reinforcing member that reinforces the injector 110 (for example, the connecting portion 110c) when the injector 110 is mounted on the substrate processing apparatus. Thereby, according to the injector attachment device 10 according to the present embodiment, when the injector 110 is attached to the substrate processing apparatus (for example, the reaction tube), the distance between the substrate processing apparatus (reaction tube) and the injector can be appropriately maintained. And it is possible to prevent the injector from being damaged.

  The injector mounting device 10 according to the present embodiment will be specifically described with reference to FIG. FIG. 2 is an enlarged view for explaining the injector mounting device 10. Here, FIG. 2A is a perspective view illustrating the injector mounting device 10. FIG. 2B is a side view illustrating the injector mounting device 10.

  As shown in FIGS. 2A and 2B, in this embodiment, the injector mounting device 10 includes a main body portion 11 and a substantially L-shaped vertical portion 110v of the injector 110 (FIG. 1B). When attaching the holding unit 12 to the substrate processing apparatus, the positioning unit 13 for determining the mounting position of the holding unit 12 (injector mounting apparatus 10) in the vertical direction Xv (FIG. 1B), and the injector 110 to the substrate processing apparatus. A contact portion that contacts the substrate processing apparatus; In addition, as a material of the injector mounting device 10 (the main body 11 or the like), for example, synthetic resin, engineering plastic, or the like can be used.

  The main body portion 11 is a member that connects the holding portion 12, the positioning portion 13, and the contact portion 14. As shown in FIG. 2A, the main body 11 can have a hollow shape.

  The holding unit 12 is a member held by the injector 110. The holding part 12 is a substantially cylindrical member having an opening 12a. In the holding part 12, the vertical part 110v of the injector 110 is inserted into the opening part 12a. At this time, the holding part 12 is detachably attached to the injector 110 and is rotatably held by sandwiching the vertical part 110v inside the substantially cylindrical shape.

  The positioning unit 13 is a member that determines the position of the holding unit 12 in the vertical direction Xv. The positioning part 13 has a semicircular opening 13a. The positioning portion 13 is brought into contact with the substantially L-shaped horizontal portion 110 h (FIG. 1B) of the injector 110 when the holding portion 12 is attached to the injector 110. Moreover, the positioning part 13 can determine the position (attachment position) of the vertical direction Xv of the holding | maintenance part 12 (injector attachment apparatus 10) by arrange | positioning the horizontal part 110h in the opening part 13a. Further, the positioning unit 13 can prevent the injector mounting device 10 from rotating around the longitudinal direction of the injector 110 by arranging the horizontal portion 110h of the injector 110 in the opening 13a. For example, when the injector 110 is mounted, the positioning unit 13 can prevent the injector mounting device 10 from rotating (or moving) due to a load acting on the injector mounting device 10 when an operator inserts the injector 110. it can.

  The abutting portion 14 is a member that abuts (contacts) the substrate processing apparatus (for example, the inner surface of the reaction tube 120 in FIG. 6 described later) when the injector 110 is attached to the substrate processing apparatus. The contact portion 14 is formed on the side surface portion on the opposite side of the holding portion 12. The contact portion 14 has a cylindrical surface 14a whose axis is a direction parallel to the longitudinal direction of the vertical portion 110v (vertical direction Xv). When the injector 110 is attached to the substrate processing apparatus, the abutting portion 14 brings the cylindrical surface 14a into contact with the substrate processing apparatus (the inner surface of the reaction tube), and the distance between the injector 110 and the substrate processing apparatus (the inner surface of the reaction tube). (Clear) is secured, and the injector 110 is disposed at a desired position.

  With reference to FIG. 3, the tag 16 attached to the injector mounting device 10 according to the present embodiment will be described. FIG. 3 is an explanatory diagram for explaining an example of the lowering tag 16. In this embodiment, a flat plate is used as the lowering tag 16.

  As shown in FIG. 3, the lowering tag 16 can write information on the type of injector to be attached and / or the type of gas to be supplied on the flat surface 16 a. Moreover, the lowering tag 16 is suspended by the tag string 16c (FIG. 1 (a)) to the mounting portion 15 (FIG. 2 (b)) of the injector mounting device 10 through the hole 16b. The information that can be written on the lowering tag 16 is not limited to that shown in FIG.

  The injector mounting device 10 is provided with a lowering tag 16 in order to prevent a wrong type of injector from being erroneously mounted when the injector is mounted on the substrate processing apparatus. In addition, the injector mounting device 10 is attached with a lowering tag 16 in order to prevent forgetting to remove the injector mounting device 10 after the injector is mounted on the substrate processing apparatus.

[Second Embodiment]
[Configuration of substrate processing apparatus]
An embodiment of a substrate processing apparatus (vertical heat treatment apparatus) 100 to which an injector 110 is attached using the injector attachment apparatus 10 according to the first embodiment will be described.

  4 and 5 show a substrate processing apparatus 100 according to this embodiment. Here, FIG. 4 is a schematic longitudinal sectional view for explaining the substrate processing apparatus 100 according to the present embodiment. FIG. 5 is a schematic cross-sectional view illustrating the substrate processing apparatus 100.

  The substrate processing apparatus 100 according to the present embodiment uses an atomic layer deposition (ALD) method or a molecular layer deposition (MLD) method as a deposition method. Here, the ALD method (MLD method) is a method of repeating a cycle in which one reaction gas of two kinds of reaction gases that react with each other is adsorbed on the substrate surface and the adsorbed reaction gas is reacted with the other reaction gas. It is. That is, in the ALD method (MLD method), a reaction product of one reaction gas and the other reaction gas is generated on a substrate, and the generated reaction product is stacked on the substrate to form a substrate surface.

  In addition, the apparatus and process which can use the injector attachment apparatus 10 which concerns on this invention are not limited to the substrate processing apparatus or ALD method etc. which are demonstrated below. That is, any apparatus that supplies gas using a substantially L-shaped injector can use the injector mounting apparatus 10 according to the present invention at the time of mounting the injector.

  As shown in FIG. 4, the substrate processing apparatus 100 has an injector 110 attached inside a reaction tube (process tube) 120 in this embodiment.

  As shown in FIG. 5, in this embodiment, the substrate processing apparatus 100 includes, as the injector 110, a first injector 110a that supplies A gas, a second injector 110b that supplies B gas, and a second gas that supplies C gas. 3 injectors 110c.

  The substrate processing apparatus 100 supplies a plurality of A gas and B gas that react with each other to the reaction tube 120 by using the injector 110 (the first injector 110a or the like), so that a plurality of substrates disposed inside the reaction tube 120 are provided. Process the substrate. In addition, the substrate processing apparatus 100 purges the atmosphere inside the reaction tube 120 using an inert gas C gas. This will be specifically described below.

  As shown in FIGS. 4 and 5, the substrate processing apparatus 100 according to this embodiment includes a substrate holder 211 on which a plurality of substrates W are loaded inside a reaction tube 120. In addition, the substrate processing apparatus 100 includes a heating furnace body 214 outside the reaction tube 120. Here, the heating furnace body 214 includes a heating unit 213 arranged in the circumferential direction facing the reaction tube 120. Further, the substrate processing apparatus 100 supports the lower ends of the reaction tube 120 and the heating furnace main body 214 using a base plate 215 extending in the horizontal direction.

  The substrate holder 211 includes a plurality of (for example, three) columns 232 extending in the vertical direction. Here, the support column 232 has a plurality of groove portions 232a. The support column 232 stacks a plurality of substrates W at respective placement positions using a plurality of groove portions 232a. The substrate processing apparatus 100 can load a plurality of substrates W having a diameter of 300 mm, for example, using the substrate holder 211.

  The ceiling surface of the reaction tube 120 is formed in a shape that swells outward. Moreover, the lower surface of the reaction tube 120 is formed in an opening shape. Furthermore, the lower surface of the reaction tube 120 is airtightly held by the flange portion 225 by abutting the lid through a seal member.

  As shown in FIG. 5, the substrate processing apparatus 100 according to the present embodiment uses a first injector 110 a and a second injector 110 b as a gas supply system in a clockwise direction (clockwise) when the reaction tube 120 is viewed from above. And the 3rd injector 110c is arrange | positioned. In the substrate processing apparatus 100, the first injector 110 a and the like are arranged inside the reaction tube 120. The first injectors 110 a and the like are arranged along the length direction of the substrate holder 211 and are arranged so as to be separated from each other along the circumferential direction of the reaction tube 120. For example, a quartz or ceramic tube can be used for the first injector 110a or the like.

Here, the first injector 110a is connected to a storage source 255a of an A gas (for example, a source gas such as a Zr-based gas containing zirconium (Zr) or tetrakisethylmethylaminozirconium (TEMAZr) gas). The second injector 110b is connected to a storage source 255b of B gas (for example, oxidizing gas such as O ₃ (ozone) gas, O ₂ (oxygen) gas). The third injector 110c is connected to a storage source 255c of C gas (for example, inert gas such as N ₂ (nitrogen) gas or Ar (argon) gas). The substrate processing apparatus 100 uses the valve 253 and the flow rate adjustment unit 254 to control the flow rate and pressure of the gas supplied from the first injector 110a and the like.

  As shown in FIG. 4 (and FIG. 5), the substrate processing apparatus 100 according to the present embodiment has an exhaust port 221 on the side wall of the flange portion 217 so as to communicate with the lower portion of the reaction tube 120 as a gas exhaust system. . In the substrate processing apparatus 100, an exhaust path 222 extending from the exhaust port 221 and a vacuum pump 224 are connected via a pressure adjustment unit 223. That is, in the substrate processing apparatus 100, the gas inside the reaction tube 120 is sucked and exhausted from the exhaust port 221 using the suction force of the vacuum pump 224.

  As shown in FIG. 4, the substrate processing apparatus 100 according to the present embodiment includes a control unit 200 </ b> C composed of a computer that controls the operation of the entire apparatus. The control unit 200C (the memory thereof) stores a control program for performing the film forming process. This control program is installed in the control unit 200C from the storage unit 200M, which is a storage medium such as a hard disk, a compact disk, a magneto-optical disk, a memory card, and a flexible disk.

  Hereinafter, an operation in which the substrate processing apparatus 100 according to the present embodiment processes the substrate W will be described.

  In the substrate processing apparatus 100, first, a transfer arm (not shown) places the substrate W (for example, 150 12-inch (300 mm) size substrates) on the substrate holder 211 of the reaction tube 120. Next, the substrate holder 211 is hermetically inserted into the reaction tube 120, and the atmosphere inside the reaction tube 120 is evacuated using the vacuum pump 224. Further, the substrate W placed on the heater 213 is heated while rotating the substrate holder 211 around the vertical axis.

  Next, in the substrate processing apparatus 100, while the pressure inside the reaction tube 120 is adjusted to the processing pressure (for example, 1.0 Torr (133 Pa)), the first injector 110a moves the A gas (the first gas into the reaction tube 120). Process gas) is supplied at, for example, 0.4 slm (liter / minute). At this time, when the A gas contacts the surface of the substrate W, the atomic layer or the molecular layer of the A gas is adsorbed on the surface of the substrate W.

Thereafter, in the substrate processing apparatus 100, the supply of the A gas is stopped, and the third injector 110c supplies the C gas (purge gas) into the reaction tube 120 at, for example, 20 slm to 100 slm. Next, in the substrate processing apparatus 100, the supply of C gas is stopped, and the second injector 110 b supplies B gas (second processing gas) into the reaction tube 120 at, for example, 300 g / Nm ³ . At this time, the B gas reacts (for example, oxidizes) with the component of the A gas adsorbed on the substrate W to generate a reaction product. Thereafter, in the substrate processing apparatus 100, the supply of the B gas is stopped, and the C gas is supplied to purge the atmosphere in the reaction tube 120.

  As described above, in the substrate processing apparatus 100, the supply cycle of A gas (first processing gas), C gas (purge gas), B gas (second processing gas), and C gas (purge gas) is performed a plurality of times. A layer of the reaction product is laminated on the surface of the substrate W. Thereby, the substrate processing apparatus 100 can form a highly uniform film on the surface of the substrate W.

[Configuration of injector mounting device]
Since the configuration of the injector mounting device according to this embodiment is the same as the configuration of the injector mounting device according to the first embodiment, the description thereof is omitted.

[Injector mounting method]
The operation of attaching the injector 110 to the substrate processing apparatus 100 according to the present embodiment (injector attaching method) will be described with reference to FIGS. 6 and 7. Here, attaching the injector 110 to the substrate processing apparatus 100 means that, in this embodiment, the horizontal portion 110h of the substantially 110-shaped injector 110 (for example, FIG. 6) is fixed to the reaction tube 120, and the substantially 110-shaped. The vertical portion 110v is attached along the inner surface of the reaction tube 120. Since the first injector 110a, the second injector 110b, and the third injector 110c shown in FIG. 5 are attached in the same manner, in the following description, the method of attaching the injector 110 will be described as a representative.

  FIG. 6 is an explanatory diagram for explaining the operation of attaching the injector 110 to the substrate processing apparatus 100 according to the present embodiment using the injector attaching apparatus 10. FIG. 7 is a schematic cross-sectional view of a main part of the substrate processing apparatus 100 when the injector is attached.

  First, when attaching the injector 110 to the inside of the reaction tube 120 of the substrate processing apparatus 100 (FIG. 4), the installer attaches the injector attaching apparatus 10 to the injector 110 in advance. Here, in order to prevent the injector mounting device 10 from forgetting to remove the injector mounting device 10 after the injector 110 is mounted, the lowering tag 16 (for example, FIG. 3) is mounted. As shown in FIG. 1B described above, the installer holds the holding portion 12 of the injector mounting device 10 with the substantially L-shaped vertical portion 110v of the injector 110 (holding step). Further, the installer causes the abutting portion 13 of the injector mounting device 10 to abut on the substantially L-shaped horizontal portion 110h of the injector 110 (positioning step). At this time, the installer moves the injector mounting device 10 in the vertical direction, thereby arranging the horizontal portion 110 h in the opening 13 a of the contact portion 13.

  Next, as shown in FIG. 6, the installer rotates the injector 110 inside the reaction tube 120 around the upper end of the injector 110 (Ma in the figure), and uses the lower end of the injector 110 as the lower surface of the reaction tube 120. Insert into the side (gas supply part) (contact step). Specifically, the installer inserts the horizontal part 110h of the injector 110 into the gas supply part 120S of the reaction tube 120 as shown in FIG. At this time, the injector 110 (the front end portion of the horizontal portion 110h) is airtightly attached to the gas supply unit 120S via the seal members s1 and s2. The injector 110 (the tip of the horizontal portion 110h) is supported by the seal members s1 and s2 and attached to the gas supply unit 120S. In addition, O-ring etc. can be used for sealing member s1, s2.

  Further, when the installer inserts the injector 110 (the horizontal portion 110h thereof) into the gas supply unit 120S of the reaction tube 120, the installer causes the injector mounting device 10 to function as a spacer member, and the interval between the injector 110 and the reaction tube 120 ( Clearance) can be secured. Specifically, the installer first attaches the injector mounting device 10 to the injector 110, inserts the tip of the horizontal portion 110h of the injector 110 into the gas supply portion 120S via the seal members s1, s2, The injector 110 (only the upper end thereof) is brought into contact with the inner surface of the reaction tube 120. Next, as shown in FIG. 7, the installer tightens the nut 120N to crush the seal members s1 and s2, and secures the tip of the horizontal portion 110h with airtightness secured. As a result, the installer makes sure that an appropriate distance (clearance) is ensured by bringing only the upper end of the vertical portion 110v of the injector 110 into contact with the inner surface of the reaction tube 120 and separating the vertical portion 110v from the inner surface of the reaction tube 120. Can do.

  Furthermore, the installer can cause the injector mounting device 10 to function as a reinforcing member that reinforces the injector 110 (for example, the connecting portion 110c), and prevents the injector 110 from being damaged when the injector 110 is mounted.

  Next, the installer removes the injector attachment device 10 from the injector 110 (removal step). At this time, the installer confirms that the injector attachment device 10 is attached to the injector 110 by viewing the lowering tag 16. This prevents the installer from forgetting to remove the injector mounting device 10.

  The procedure (removal step) of the operation | movement which removes the injector attachment apparatus 10 after attaching the injector 110 to the substrate processing apparatus 100 is demonstrated using FIG. Here, FIG. 8 is an explanatory diagram for explaining the procedure of the operation of removing the injector mounting device 10 after mounting the injector 110 to the substrate processing apparatus 100. FIG. 8A is an explanatory diagram for explaining that the injector 110 is attached to the substrate processing apparatus 100. FIG. 8B is an explanatory diagram for explaining that the injector mounting device 10 is rotated in order to remove the injector mounting device 10 after the injector 110 is mounted on the substrate processing apparatus 100. FIG.8 (c) is explanatory drawing explaining removing the injector attachment apparatus 10 after rotating the injector attachment apparatus 10. FIG.

  As shown in FIG. 8A, the installer attaches the injector 110 to the reaction tube 120. Next, as shown in FIG. 8 (b), the installer rotates the injector mounting device 10 around the injector 110 (vertical portion 110v in FIG. 1 (a)) (Mb in the figure). At this time, the installer moves the injector mounting device 10 upward (opposite to the vertical direction), and opens the opening 13a (FIG. 2A) of the positioning portion 13 of the injector mounting device 10 to the injector 110 (FIG. 1). After being separated from the horizontal portion 110h) of (a), the injector mounting device 10 is rotated. Further, even if the surface of the inner surface of the reaction tube 120 is uneven, the installer can contact the cylindrical surface 14a (injector) of the contact portion 14 because the inner surface of the reaction tube 120 is in contact with the cylindrical surface 14a of the contact portion 14. By rotating the mounting device 10), the cylindrical surface 14 a of the contact portion 14 can be easily separated from the inner surface of the reaction tube 120. That is, the mounter can separate the injector mounting device 10 from the inner surface of the reaction tube 120 while maintaining a space between the injector 110 and the reaction tube 120.

  Thereafter, as shown in FIG. 8C, the installer moves the injector mounting device 10 in a direction away from the injector 110 (Mc in the drawing), and removes the injector mounting device 10 from the injector 110. Here, the mounter may remove the injector mounting device 10 when he / she visually observed the lowering tag 16 (FIG. 6).

  As described above, according to the injector mounting method in which the injector 110 is mounted using the injector mounting device 10 in the substrate processing apparatus 100 according to the present embodiment, when the injector 110 is mounted on the reaction tube 120, the reaction tube 120, the injector 110, The distance (clearance) can be kept appropriate, and the injector 110 can be prevented from being damaged. Further, according to the injector mounting method, the distance between the reaction tube 120 and the injector 110 can be appropriately maintained by using the injector mounting device 10, so that the injector 110 can be damaged even in a narrow space (inside the reaction tube 120). And can be easily installed. Furthermore, according to the injector mounting method, the distance between the reaction tube 120 and the injector 110 can be kept appropriate, so that interference between the reaction tube 120 and the injector 110 can be prevented, and the injector 110 can be used during substrate processing. By contacting the reaction tube 120, the injector 110 can be prevented from being damaged.

  An embodiment of a substrate processing apparatus to which the injector 110 can be attached using the injector attachment apparatus 10E will be described. In addition, since the structure of the substrate processing apparatus and injector attachment apparatus 10E which concern on a present Example is the same as that of the substrate processing apparatus and injector attachment apparatus 10 which concern on 2nd Embodiment, description is abbreviate | omitted. In the following description, only the clearances (X1, X2, and X3 in FIG. 9 described later) of the injector 110 attached to the substrate processing apparatus will be described.

  9 and 10 show the clearance of the injector 110 attached to the substrate processing apparatus according to this embodiment. Here, FIG. 9 is an explanatory view illustrating the injector 110 attached to the substrate processing apparatus according to the present embodiment. FIG. 10 is an explanatory diagram illustrating an example of the clearance of the injector 110 attached to the substrate processing apparatus according to the present embodiment.

  As shown in FIG. 9, the substrate processing apparatus according to the present example was mounted with the injector 110 using the injector mounting apparatus 10 </ b> E. Here, in this embodiment, the injector 110 is attached with clearances X1, X2, and X3, which are distances between the injector 110 and the reaction tube 120 of the substrate processing apparatus.

  As shown in FIG. 10, the substrate processing apparatus according to the present embodiment is mounted with a clearance X1 of 24.0 mm, X2 of 2.2 to 2.3 mm, and X3 of 0.4 mm using an injector mounting apparatus 10E. I was able to.

  As described above, the substrate processing apparatus according to the present example was able to obtain the same effect as the substrate processing apparatus 100 according to the second embodiment.

[Comparative Example 1]
11 and 12 show an example in which the injector 110 can be attached using the injector attachment device 10A according to Comparative Example 1. FIG. Here, FIG. 11 is an explanatory view for explaining another injector mounting device (Comparative Example 1) 10A. FIG. 11A is a perspective view for explaining another injector mounting apparatus 10A. FIG. 11B is a side view for explaining another injector mounting apparatus 10A. FIG. 12 is an explanatory diagram for explaining an example in which another injector mounting apparatus 10A is mounted on the substrate processing apparatus.

  As shown in FIGS. 11A and 11B, the injector mounting device 10 </ b> A according to this comparative example has only an opening 10 </ b> Aa fixed to the injector 110.

  As shown in FIG. 12, the injector mounting device 10A according to this comparative example is fixed to the injector 110 using the opening 10Aa (FIG. 11A). In addition, since the injector mounting device 10A is pushed down by the installer when the injector 110 is mounted, the mounting position may change. Thereby, in the injector mounting apparatus 10A according to this comparative example, when the injector 110 is mounted, the injector 110 may not be mounted at a desired position and clearance.

[Comparative Example 2]
13 and 14 show an example in which the injector 110 can be attached using the injector attachment device 10B according to Comparative Example 2. FIG. Here, FIG. 13 is an explanatory view for explaining another injector mounting device (Comparative Example 2) 10B. FIG. 13A is a plan view for explaining another injector mounting device 10B. FIG. 13B is a side view for explaining another injector mounting device 10B. FIG. 14 is an explanatory diagram for explaining an example in which another injector mounting apparatus 10B is mounted on the substrate processing apparatus.

  As shown in FIGS. 13A and 13B, the injector mounting device 10B according to this comparative example has a substantially J-shape including a semicircular arc shape.

  As shown in FIG. 14, the injector mounting device 10B according to this comparative example is fixed to the injector 110 using a semicircular arc shape. At this time, the injector mounting device 10B was fixed to the upper side of the injector 110 in comparison with the first embodiment and the second embodiment. However, in the injector attachment device 10B, when the injector 110 is attached to the reaction tube 120, the L-shaped horizontal portion of the injector 110 is inserted into the gas supply portion of the reaction tube 120, so that the L-shaped horizontal portion and the vertical portion are inserted. There is a possibility that the injector 110 may be damaged by applying a load to the connecting portion. In addition, in the injector mounting device 10B, when the injector 110 is hermetically attached to the gas supply part of the reaction tube 120 via a seal member (O-ring or the like), when the injector 110 is inserted into the gas supply part, the injector 110 ( The load applied to the connecting portion of the injector 110 may increase and the injector 110 may be damaged. Further, in the injector mounting device 10B, for example, when a quartz injector is used, it is considered that the possibility that the injector is damaged increases.

  The present invention has been described above with reference to the injector mounting device and the injector mounting method according to the embodiments or examples of the present invention. However, the present invention is not limited to the above-described embodiments and examples, and the attached patents. Various modifications and variations are possible in light of the claims.

DESCRIPTION OF SYMBOLS 10,10E: Injector attachment apparatus 11: Main-body part 12: Holding | maintenance part 13: Positioning part 13a: Opening part 14: Contact part 14a: Cylindrical surface 15: Attachment part 16: Lowering bill 16a: Bill string 100: Substrate processing apparatus 110 110a, 110b, 110c: Injector 110c: Injector connection part 110h: Injector horizontal part 110v: Injector vertical part 120: Reaction tube (process tube)
Xh: Horizontal direction Xv: Vertical direction X1, X2, X3: Interval (clearance)

Claims (9)

Including a pipe through which a gas to be supplied to the reaction tube is circulated, the horizontal portion of the injector whose longitudinal shape is substantially L-shaped is fixed to the reaction tube, and the substantially L-shaped vertical portion is An injector mounting device used when mounting along the inner surface of the reaction tube,
Before attaching the injector to the reaction tube, holding the vertical portion, can be attached to the injector, a holding portion that is rotatably held by the injector,
A positioning portion that is in contact with the horizontal portion when the holding portion is attached to the injector and determines a vertical position of the holding portion;
And a contact portion that is in contact with the inner surface of the reaction tube when the injector is attached to the reaction tube and secures a gap between the injector and the inner surface of the reaction tube at a side surface opposite to the holding portion. Injector mounting device.   The contact portion is attached so that only the upper end of the vertical portion of the injector is in contact with the inner surface of the reaction tube, and the vertical portion is secured along the inner surface of the reaction tube. The injector mounting device described.   The contact portion has a cylindrical surface whose axis is parallel to the longitudinal direction of the vertical portion, and the cylindrical surface is brought into contact with the inner surface of the reaction tube to secure the interval. The injector mounting device according to claim 2.   The said positioning part has a semicircle-shaped opening part, The position of the said perpendicular direction is determined by arrange | positioning the said horizontal part in the said opening part, The Claim 1 thru | or 3 characterized by the above-mentioned. Injector mounting device.   The injector attachment device according to any one of claims 1 to 4, further comprising an attachment portion for attaching a tag that is visually recognized by an installer. For an injector including a pipe through which gas to be supplied to the reaction tube is circulated, and the shape of the pipe in the longitudinal direction is substantially L-shaped, the holding portion held by the injector and the vertical position of the holding portion are determined. A horizontal portion of the injector is fixed to the reaction tube, and the substantially L-shaped vertical portion is fixed to the reaction tube. An injector mounting method for mounting along the inner surface of the reaction tube,
A holding step for sandwiching the outer shape of the vertical portion with the holding portion, and attaching the injector mounting device to the vertical portion, and rotatably holding the vertical portion;
A positioning step of bringing the positioning portion into contact with the horizontal portion when the holding portion is attached to the injector, and determining a vertical position of the injector mounting device held by the vertical portion;
When attaching the injector holding the injector mounting device to the reaction tube, the abutting portion, which is the side surface opposite to the holding portion, is brought into contact with the inner surface of the reaction tube, and the injector and the inner surface An abutting step to ensure a spacing;
After securing the interval, the injector attachment device is rotated about the vertical portion as a rotation center, and the contact portion and the inner surface of the reaction tube are separated from each other while maintaining the interval, and then the injector attachment An injector mounting method comprising a removal step of removing the device.   The abutting step is such that only the upper end of the vertical portion of the injector is brought into contact with the inner surface of the reaction tube, and the vertical portion is attached so as to secure the gap along the inner surface of the reaction tube. The injector mounting method described. The positioning portion has a semicircular opening,
The positioning step arranges the horizontal portion in the opening by moving the injector mounting device in a vertical direction,
The removing step rotates the injector mounting device after moving the injector mounting device in a direction opposite to the vertical direction and separating the opening from the horizontal portion.
The injector mounting method according to claim 6 or 7. Before the holding step, further comprising a tag mounting step of mounting a tag to the injector mounting device,
In the removal step, the injector mounting device is removed by the mounter when the mount tag is visually observed by the mounter.
The injector mounting method according to any one of claims 6 to 8.

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