JP2014146690A - Ceramic electronic component and taping electronic component series - Google Patents

Ceramic electronic component and taping electronic component series Download PDF

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Publication number
JP2014146690A
JP2014146690A JP2013014322A JP2013014322A JP2014146690A JP 2014146690 A JP2014146690 A JP 2014146690A JP 2013014322 A JP2013014322 A JP 2013014322A JP 2013014322 A JP2013014322 A JP 2013014322A JP 2014146690 A JP2014146690 A JP 2014146690A
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main
electronic component
ceramic
ceramic electronic
length
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JP2013014322A
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Japanese (ja)
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Keito Itamura
啓人 板村
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Murata Mfg Co Ltd
株式会社村田製作所
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Abstract

PROBLEM TO BE SOLVED: To provide a ceramic electronic component which is hardly damaged in being mounted.SOLUTION: In a cross section along the longitudinal direction and the thickness direction of a ceramic electronic component, surfaces of portions 13a, 14a located on a respective first main face 10a of first and second external electrodes 13, 14 have a convex surface. When the ceramic electronic component 1 is arranged on a flat surface so that the first main face 10a faces the flat surface, a ceramic element assembly 10 is warped so that the first main face 10a becomes convex, within a range where the first main face 10a is not brought into contact with the flat surface.

Description

  The present invention relates to a ceramic electronic component and a taping electronic component series.

  In recent years, along with the downsizing and thinning of electronic devices such as mobile phones and portable music players, wiring boards mounted on electronic devices are becoming smaller and thinner.

  In Patent Document 1, as a method of thinning a wiring board, there is a method of embedding a ceramic electronic component in the wiring board and configuring a wiring to the ceramic electronic component by using a via-hole electrode formed on the ceramic electronic component. Proposed. According to this method, it is not necessary to secure an area for arranging the ceramic electronic component on the surface of the wiring board, and an area for providing the wiring to the ceramic electronic component is secured separately from the area where the ceramic electronic component is provided. There is no need to do. Therefore, the component built-in wiring board can be reduced in size.

JP 2002-1000087 A

  A ceramic electronic component or the like built in a wiring board is required to be thin. However, when the ceramic body is made thinner, the strength of the ceramic electronic component is reduced, and the ceramic electronic component is easily damaged during mounting or the like.

  A main object of the present invention is to provide a ceramic electronic component that is not easily damaged during mounting.

  A ceramic electronic component according to the present invention includes a ceramic body and first and second external electrodes. The ceramic body has first and second main surfaces, first and second side surfaces, and first and second end surfaces. The first and second main surfaces extend along the length direction and the width direction. The first and second side surfaces extend along the length direction and the thickness direction. The first and second end faces extend along the width direction and the thickness direction. The first and second external electrodes are spaced apart from each other along the length direction on at least the first main surface of the ceramic body. In the cross section along the length direction and the thickness direction, the surface of the portion located on the first main surface of each of the first and second external electrodes is convex. The first main surface is a mounting surface. When the ceramic electronic component is arranged on a flat surface so that the first main surface faces the flat surface, the first main surface is convex so long as the first main surface does not contact the flat surface. The ceramic body is warped so that

In a specific aspect of the ceramic electronic component according to the present invention, the maximum distance e along the length direction of the portion located on the first main surface of each of the first and second external electrodes is the ceramic body. It is larger than the dimension DT along the thickness direction.

In another specific aspect of the ceramic electronic component according to the present invention, the dimension along the thickness direction, the dimension along the length direction, and the dimension along the width direction of the ceramic body are respectively set to D T , D W , When D L is satisfied, D T <D W <D L and D T ≦ 0.3 mm are satisfied.

  In another specific aspect of the ceramic electronic component according to the present invention, the dimension along the length direction of the center portion in the width direction of the portion located on the first main surface of the first external electrode is in the width direction. It is larger than the dimension along the length direction of the end. The dimension along the length direction of the central portion in the width direction of the portion located on the first main surface of the second external electrode is larger than the dimension along the length direction of the end portion in the width direction.

  In still another specific aspect of the ceramic electronic component according to the present invention, the first external electrode is provided so as to extend from the first end surface to the first main surface. The second external electrode is provided so as to extend from the second end surface to the first main surface.

  The taping electronic component series according to the present invention includes a tape and a ceramic electronic component. The tape has a long carrier tape and a cover tape. The carrier tape is provided with a plurality of recesses along the longitudinal direction. The cover tape is provided on the carrier tape so as to cover the plurality of recesses. The ceramic electronic component is disposed in the recess. The ceramic electronic component includes a ceramic body and first and second external electrodes. The ceramic body has first and second main surfaces, first and second side surfaces, and first and second end surfaces. The first and second main surfaces extend along the length direction and the width direction. The first and second side surfaces extend along the length direction and the thickness direction. The first and second end faces extend along the width direction and the thickness direction. The first and second external electrodes are spaced apart from each other along the length direction on at least the first main surface of the ceramic body. In the cross section along the length direction and the thickness direction, the surface of the portion located on the first main surface of each of the first and second external electrodes is convex. When the ceramic electronic component is arranged on a flat surface so that the first main surface faces the flat surface, the first main surface is convex so long as the first main surface does not contact the flat surface. The ceramic body is warped so that The plurality of ceramic electronic components are arranged such that the first main surface faces the bottom surface side of the recess.

  ADVANTAGE OF THE INVENTION According to this invention, the ceramic electronic component which is hard to be damaged at the time of mounting can be provided.

1 is a schematic perspective view of a ceramic electronic component according to an embodiment of the present invention. 1 is a schematic side view of a ceramic electronic component according to an embodiment of the present invention. 1 is a schematic rear view of a ceramic electronic component according to an embodiment of the present invention. FIG. 4 is a schematic cross-sectional view taken along line IV-IV in FIG. 1. It is a schematic side view of a ceramic electronic component in a reference example. 1 is a schematic side view of a ceramic electronic component according to an embodiment of the present invention. It is a schematic sectional drawing of the taping electronic component series in one Embodiment of this invention. It is a figure which shows the bending strength of the ceramic electronic component produced in the Example. It is a figure which shows the bending strength of the ceramic electronic component produced in the comparative example.

  Hereinafter, an example of the preferable form which implemented this invention is demonstrated. However, the following embodiment is merely an example. The present invention is not limited to the following embodiments.

  Moreover, in each drawing referred in embodiment etc., the member which has a substantially the same function shall be referred with the same code | symbol. The drawings referred to in the embodiments and the like are schematically described. A ratio of dimensions of an object drawn in a drawing may be different from a ratio of dimensions of an actual object. The dimensional ratio of the object may be different between the drawings. The specific dimensional ratio of the object should be determined in consideration of the following description.

As shown in FIGS. 1 to 4, the ceramic electronic component 1 includes a ceramic body 10. The ceramic body 10 is made of an appropriate ceramic material corresponding to the function of the ceramic electronic component 1. Specifically, when the ceramic electronic component 1 is a capacitor, the ceramic body 10 can be formed of a dielectric ceramic material. Specific examples of the dielectric ceramic material include BaTiO 3 , CaTiO 3 , SrTiO 3 , CaZrO 3 and the like. In addition, when the ceramic body 10 includes a dielectric ceramic material, the ceramic body 10 includes, for example, a Mn compound, a Mg compound, and the like based on the ceramic material according to the characteristics of the desired ceramic electronic component 1. Subcomponents such as Si compounds, Fe compounds, Cr compounds, Co compounds, Ni compounds, and rare earth compounds may be added as appropriate.

  In the present embodiment, the ceramic body 10 is provided in a rectangular parallelepiped shape. Here, the “cuboid shape” includes a rectangular parallelepiped with rounded corners and ridge lines.

  The ceramic body 10 has first and second main faces 10a and 10b, first and second side faces 10c and 10d, and first and second end faces 10e and 10f. The first and second main surfaces 10a and 10b extend along the length direction L and the width direction W, respectively. The first and second side surfaces 10c and 10d extend along the length direction L and the thickness direction T, respectively. The first and second end faces 10e, 10f extend along the width direction W and the thickness direction T, respectively.

The dimensions of the ceramic body 10 are not particularly limited. The ceramic body 10 has a thickness D T <D T , a length dimension D L , and a width dimension D W , where D T < It may be thin so as to satisfy D W <D L or D T ≦ 0.3 mm. Specifically, it may be 0.05 mm ≦ D T <0.3 mm, 0.4 mm ≦ D L ≦ 1 mm, 0.3 mm ≦ D W ≦ 0.5 mm.

  As shown in FIG. 4, a plurality of first and second internal electrodes 11, 12 having a substantially rectangular shape are arranged inside the ceramic body 10. The first internal electrode 11 is exposed at the first end face 10e, and is not exposed at the second end face 10f and the first and second side faces 10c, 10d. On the other hand, the second internal electrode 12 is exposed at the second end face 10f, and is not exposed at the first end face 10e and the first and second side faces 10c, 10d. The first internal electrodes 11 and the second internal electrodes 12 are alternately provided along the thickness direction T at intervals. The thickness of the ceramic portion 10g provided between the first internal electrode 11 and the second internal electrode 12 can be, for example, about 0.5 μm to 10 μm. The thickness of the 1st and 2nd internal electrodes 11 and 12 can be about 0.2 micrometer-2 micrometers, for example.

  The first and second internal electrodes 11 and 12 can be made of an appropriate conductive material. The first and second internal electrodes 11 and 12 can be made of, for example, a metal such as Ni, Cu, Ag, Pd, or Au, or an alloy such as an Ag—Pd alloy containing one of these metals. .

  At least on the first main surface 10 a of the ceramic body 10, the first external electrode 13 electrically connected to the first internal electrode 11 and the second internal electrode 12 are electrically connected. A second external electrode 14 is provided. The first and second external electrodes 13 and 14 can be made of an appropriate conductive material. The first and second external electrodes 13 and 14 can be made of, for example, Cu, Ni, Ag, Pd, an Ag—Pd alloy, Au, or the like. The first and second external electrodes 13 and 14 may be constituted by a laminate of a plurality of conductive layers. The thickness of the first and second external electrodes 13 and 14 can be, for example, about 10 μm to 60 μm.

  On the 1st main surface 10a, the 1st external electrode 13 and the 2nd external electrode 14 are distribute | arranged along the length direction L at intervals.

  Specifically, the first external electrode 13 is electrically connected to the first internal electrode 11 on the first end face 10e, and the first and second main faces 10a and 10b and the first and The second side surfaces 10c and 10d are provided. That is, the first external electrode 13 includes a first portion 13a disposed on the first main surface 10a, a second portion 13b disposed on the second main surface 10b, A third portion 13c disposed on the end face 10e, a fourth portion 13d disposed on the first side surface 10c, and a fifth portion 13e disposed on the second side surface 10d. And have. The first external electrode 13 is electrically connected to the first internal electrode 11 in the third portion 13c.

  The second external electrode 14 is electrically connected to the second internal electrode 12 on the second end face 10f, and the first and second main faces 10a and 10b and the first and second side faces 10c. 10d. That is, the second external electrode 14 includes a first portion 14a disposed on the first main surface 10a, a second portion 14b disposed on the second main surface 10b, A third portion 14c disposed on the end surface 10f, a fourth portion 14d disposed on the first side surface 10c, and a fifth portion 14e disposed on the second side surface 10d. And have. The second external electrode 14 is electrically connected to the second internal electrode 12 in the third portion 14c.

  In the present invention, the first and second external electrodes only have to be provided on the first main surface, and the second main surface, the first and second side surfaces, the first and second surfaces, and the like. It is not always necessary to be provided on the end face of the.

  At least one conductive layer constituting the first and second external electrodes 13 and 14 is formed by immersing a part of the ceramic body 10 in a conductive paste, such as a dipping method. For this reason, as shown in FIG. 4, the first and second outer electrodes 13, 14 are positioned on the first main surface 10 a of each of the first and second outer electrodes 13, 14 in the cross section along the length direction L and the thickness direction T. The surface of 1 part 13a, 14a is convex shape. That is, the first portions 13a and 14a located on the first main surface 10a of the first and second external electrodes 13 and 14 swell in the thickness direction with the vicinity of the center as the top. Further, as shown in FIG. 3, the dimension L1 along the length direction L of the central portion in the width direction W of the first portion 13a located on the first main surface 10a of the first external electrode 13 is It is larger than the dimension L2 along the length direction L of the end portion in the width direction W. Usually, L1 is 1.2 times to 2 times L2. The dimension L3 along the length direction L of the central portion in the width direction W of the first portion 14a located on the first main surface 10a of the second external electrode 14 is the length of the end portion in the width direction W. It is larger than the dimension L4 along the direction L. Usually, L3 is 1.2 to 2 times L4.

The maximum distance e along the length direction L of the first portions 13a and 14a located on the first main surface 10a of each of the first and second external electrodes 13 and 14 (in this embodiment, e is L1 and L3) are preferably D L / 5 or more, and more preferably D L / 4 or more.

  Incidentally, normally, as shown in FIG. 5, the first and second main surfaces 110a, 110b of the ceramic body 110 are planar. In this case, when the surfaces of the portions 113a and 114a located on the first main surface 110a of the first and second external electrodes 113 and 114 are convex, the portion 113a is mounted when the ceramic electronic component 100 is mounted. And the top of the portion 114a serve as fulcrums, and the fulcrum distance L10 increases. For this reason, the ceramic electronic component 100 is easily damaged by stress applied during mounting.

  On the other hand, as shown in FIG. 6, in the ceramic electronic component 1, when the ceramic electronic component 1 is arranged on the flat surface so that the first main surface 10 a faces the flat surface, the first main The ceramic body 10 is warped so that the first main surface 10a is convex in a range where the surface 10a does not contact the flat surface. For this reason, when the ceramic electronic component 1 is mounted, a portion closer to the center than the top of the first portion 13a and a portion closer to the center than the top of the first portion 14a serve as fulcrums, and the distance between the fulcrums L11 becomes shorter. For this reason, the ceramic electronic component 1 is not easily damaged even when stress is applied during mounting. That is, the ceramic electronic component 1 is not easily damaged during mounting.

  In general, the portions 13a and 14a located on the first major surface 10a of the first and second external electrodes 13 and 14 are most likely to be thickest in the vicinity of the center in the length direction L and the width direction W. . In this embodiment, since L1 is larger than L2 and L3 is larger than L4, the fulcrum distance L11 can be made shorter. Therefore, the ceramic electronic component 1 is less likely to be damaged during mounting.

For example, when the ceramic electronic component 1 is thin so that D T <D W <D L or D T ≦ 0.3 mm, the ceramic electronic component 1 is easily damaged when stress is applied. Therefore, it is more preferable to warp the ceramic body 10 so that the first main surface 10a is convex and the second main surface 10b is concave as in the present embodiment.

Moreover, when the maximum distance e is larger than the dimension DT , the effect that the distance L11 between fulcrums can be shortened by warping the ceramic body 10 is more greatly exhibited.

  FIG. 7 is a schematic cross-sectional view of the taping electronic component series 2 in the present embodiment. The taping electronic component series 2 is obtained by fixing a plurality of the ceramic electronic components 1 by taping. The taping electronic component series 2 has a long tape 20. The tape 20 includes a long carrier tape 21 and a long cover tape 22. The carrier tape 21 has a plurality of recesses 21a that are spaced apart from each other along the longitudinal direction. The cover tape 22 is provided on the carrier tape 21 so as to cover the plurality of recesses 21a. The ceramic electronic component 1 is accommodated in each of the plurality of recesses 21a. The plurality of ceramic electronic components 1 are arranged such that the first main surface 10a faces the bottom surface side of the recess 21a. For this reason, the plurality of ceramic electronic components 1 of the taping electronic component series 2 are sucked and held on the second main surface 10b side, and mounted such that the first main surface 10a side faces the wiring board side. For this reason, the ceramic electronic component 1 is hardly damaged during mounting.

(Example)
In practice, 20 ceramic electronic components having substantially the same configuration as the ceramic electronic component 1 were produced under the following conditions.

Dimensions of ceramic body: length 1.0 mm x width 0.5 mm x thickness 0.10 mm
Ceramic material: BaTiO 3
Thickness of the ceramic part of the effective area having the internal electrode forming the capacitance: 70 μm (after firing)
Number of laminated internal electrodes: 23 Thickness of upper and lower or lower outer layer ceramic parts not contributing to capacitance formation: 15 μm (after firing)
Ceramic electronic component capacity: 0.1 μF
Rated voltage of ceramic electronic components: 6.3V
External electrode: Laminated body of sintered electrode containing Cu and Cu plating film

(Comparative example)
Twenty ceramic electronic components having a configuration substantially similar to that of the example were manufactured except that the first and second main surfaces of the ceramic body were flat surfaces.

(Evaluation)
A ceramic electronic component is arranged on a substrate having an AE sensor so that the first main surface faces the substrate on the substrate, that is, the first main surface is a mounting surface. Each of the examples and comparative examples is pressed with a jig with a thin tip, the sound when the element is broken is detected with an AE sensor, and the load applied to the jig at that time is taken as the bending strength. The bending strength of 20 ceramic electronic components produced in the above was measured. The results are shown in FIGS. 8 and 9 and Table 1.

  From the results shown in FIGS. 8 and 9 and Table 1, it can be seen that the bending strength of the ceramic electronic component can be improved by warping the ceramic body so that the first main surface is convex.

DESCRIPTION OF SYMBOLS 1 ... Ceramic electronic component 2 ... Taping electronic component series 10 ... Ceramic body 10a ... 1st main surface 10b ... 2nd main surface 10c ... 1st side surface 10d ... 2nd side surface 10e ... 1st end surface 10f ... 2nd end surface 10g ... ceramic part 11 ... 1st internal electrode 12 ... 2nd internal electrode 13 ... 1st external electrode 13a, 14a ... 1st part 13b, 14b ... 2nd part 13c, 14c ... 1st Third part 13d, 14d ... Fourth part 13e, 14e ... Fifth part 14 ... Second external electrode 20 ... Tape 21 ... Carrier tape 21a ... Recess 22 ... Cover tape

Claims (6)

  1. First and second main surfaces extending along the length direction and the width direction, first and second side surfaces extending along the length direction and the thickness direction, and first extending along the width direction and the thickness direction And a ceramic body having a second end face;
    First and second external electrodes spaced apart from each other along the length direction on at least the first main surface of the ceramic body;
    With
    In a cross section along the length direction and the thickness direction, the surface of the portion located on the first main surface of each of the first and second external electrodes is a convex ceramic electronic component,
    The first main surface is a mounting surface;
    When the ceramic electronic component is disposed on a flat surface so that the first main surface faces the flat surface, the first main surface is in a range where the first main surface does not contact the flat surface. A ceramic electronic component in which the ceramic body is warped so that the main surface of the substrate is convex.
  2. The maximum distance e along the length direction of the portion located on the first main surface of each of the first and second external electrodes is larger than the dimension D T along the thickness direction of the ceramic body. The ceramic electronic component according to claim 1.
  3. When the dimension along the thickness direction, the dimension along the length direction, and the dimension along the width direction of the ceramic body are D T , D W , and D L , respectively, D T <D W <D The ceramic electronic component according to claim 1, wherein L and D T ≦ 0.3 mm are satisfied.
  4. The dimension along the length direction of the central portion in the width direction of the portion located on the first main surface of the first external electrode is larger than the dimension along the length direction of the end portion in the width direction. ,
    The dimension along the length direction of the central portion in the width direction of the portion located on the first main surface of the second external electrode is larger than the dimension along the length direction of the end portion in the width direction. The ceramic electronic component according to any one of claims 1 to 3.
  5. The first external electrode is provided so as to reach from the first end surface to the first main surface,
    5. The ceramic electronic component according to claim 1, wherein the second external electrode is provided so as to extend from the second end surface to the first main surface. 6.
  6. A tape having a long carrier tape provided with a plurality of recesses along the longitudinal direction, and a cover tape provided on the carrier tape so as to cover the plurality of recesses;
    A ceramic electronic component disposed in the recess;
    A taping electronic component series comprising:
    The ceramic electronic component is
    First and second main surfaces extending along the length direction and the width direction, first and second side surfaces extending along the length direction and the thickness direction, and first extending along the width direction and the thickness direction And a ceramic body having a second end face;
    First and second external electrodes spaced apart from each other along the length direction on at least the first main surface of the ceramic body;
    With
    In the cross section along the length direction and the thickness direction, the surface of the portion located on the first main surface of each of the first and second external electrodes is convex.
    When the ceramic electronic component is disposed on a flat surface so that the first main surface faces the flat surface, the first main surface is in a range where the first main surface does not contact the flat surface. The ceramic body is warped so that the main surface of
    The plurality of ceramic electronic components are taping electronic components connected so that the first main surface faces the bottom surface of the recess.
JP2013014322A 2013-01-29 2013-01-29 Ceramic electronic component and taping electronic component series Pending JP2014146690A (en)

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Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2014183186A (en) * 2013-03-19 2014-09-29 Taiyo Yuden Co Ltd Low height multilayer ceramic capacitor
JP2016143709A (en) * 2015-01-30 2016-08-08 太陽誘電株式会社 Multilayer capacitor

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2014183186A (en) * 2013-03-19 2014-09-29 Taiyo Yuden Co Ltd Low height multilayer ceramic capacitor
JP2016143709A (en) * 2015-01-30 2016-08-08 太陽誘電株式会社 Multilayer capacitor

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