JP2014138129A - Electronic component mounting device - Google Patents

Electronic component mounting device Download PDF

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JP2014138129A
JP2014138129A JP2013006805A JP2013006805A JP2014138129A JP 2014138129 A JP2014138129 A JP 2014138129A JP 2013006805 A JP2013006805 A JP 2013006805A JP 2013006805 A JP2013006805 A JP 2013006805A JP 2014138129 A JP2014138129 A JP 2014138129A
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light
electronic component
component
mounting head
diffused
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JP6068989B2 (en
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Kunimune Komaike
国宗 駒池
Osamu Kanai
修 金井
Kazutaka Tsukahara
一貴 塚原
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Hitachi High Tech Instruments Co Ltd
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Hitachi High Tech Instruments Co Ltd
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Abstract

PROBLEM TO BE SOLVED: To provide an electronic component mounting device which is capable of discriminating the posture of an electronic component by capturing an image transmitted through the electronic component held by an article holder as parallel light, even when the electronic component held by the article holder is irradiated with diffused light.SOLUTION: When an LED 12 is turned on, light from the LED 12 is guided downward while being diffused by a light guide body 13 by a light-shielding body 14. In other words, the light diffused by the light guide body 13 is guided downward while being reflected by the light-shielding body 14 and is reflected upward by the painting 15 as the light-shielding body of the lower surface of the light guide body 13. As a result, the diffused light is emitted to the outside in all directions of 360 degrees from the peripheral side surface of the lower half part of the light guide body 13 not covered with the light-shielding body 14. An electronic component D sucked and held by a suction nozzle 5 is irradiated with the diffused light and the light transmitted through the electronic component D becomes the parallel light by three telecentric lenses 21 and is captured by an imaging element 22.

Description

本発明は、周縁部に所定間隔を存して複数の部品保持具を備えた装着ヘッドが装着ヘッド体に回転可能に支持され、部品供給装置から前記部品保持具により電子部品を取出して、基板上に装着する電子部品装着装置に関する。   According to the present invention, a mounting head having a plurality of component holders with a predetermined interval at the periphery is rotatably supported by a mounting head body, and an electronic component is taken out from the component supply device by the component holder, The present invention relates to an electronic component mounting apparatus to be mounted on top.

従来は、例えば特許文献1に開示するように、電子部品の吸着動作後、吸着ノズルに電子部品が吸着されているか否かの検出や、吸着姿勢の不良の検出のために装着ヘッドの中央部に設けた発光ユニットと、該発光ユニットとの間に選択された吸着ノズルに吸着保持された電子部品を位置させたときの発光ユニットからの光を受光する受光ユニットとから成るラインセンサユニットとを設ける技術が開示されている。   Conventionally, as disclosed in, for example, Patent Document 1, after the electronic component suction operation, the central portion of the mounting head is used to detect whether or not the electronic component is suctioned by the suction nozzle and to detect a suction posture failure. A line sensor unit comprising: a light emitting unit provided on the light emitting unit; and a light receiving unit that receives light from the light emitting unit when the electronic component sucked and held by the suction nozzle selected between the light emitting units is positioned. The providing technique is disclosed.

また、吸着ノズル等の物品保持具により保持された電子部品に水平方向から平行光を照射して、これを光源から見て前記保持具の裏方に配設された部品保持姿勢認識カメラで撮像して、前述したような姿勢検出を行うことが考えられる。   In addition, the electronic component held by the article holder such as the suction nozzle is irradiated with parallel light from the horizontal direction, and this is viewed by the component holding posture recognition camera arranged behind the holder as viewed from the light source. Thus, it is conceivable to perform posture detection as described above.

特開2003−332791号公報JP 2003-332791 A

しかし、前述したように、物品保持具により保持された電子部品に平行光を照射する構造であれば、コスト高のものとなり、実用には適さないという問題がある。   However, as described above, a structure that irradiates an electronic component held by an article holder with parallel light has a problem of high cost and is not suitable for practical use.

そこで本発明は、前記物品保持具により保持された電子部品に拡散光を照射しても、平行光として前記物品保持具に保持された電子部品の透過像を撮像して、前記電子部品の姿勢を判別できる電子部品装着装置を提供することを目的とする。   Therefore, the present invention captures a transmission image of the electronic component held by the article holder as parallel light even when the electronic component held by the article holder is irradiated with diffused light, and the attitude of the electronic component It is an object of the present invention to provide an electronic component mounting apparatus capable of discriminating the above.

このため第1の発明は、周縁部に所定間隔を存して複数の部品保持具を備えた装着ヘッドが装着ヘッド体に回転可能に支持され、部品供給装置から前記部品保持具により電子部品を取出して、基板上に装着する電子部品装着装置であって、
前記装着ヘッドに設けられる光源と、この光源より下方に配設されて前記光源からの光を拡散しながら下方へ導く導光体とを備え、この導光体により拡散された光を前記装着ヘッドに備えられた前記部品保持具に保持された電子部品に照射する照明装置と、
前記導光体により拡散された光を前記部品保持具に保持された電子部品に照射してテレセントリックレンズを介して平行光とし透過像として撮像する部品保持姿勢認識カメラとを
設けたことを特徴とする。
Therefore, according to the first aspect of the present invention, a mounting head having a plurality of component holders with a predetermined interval at the periphery is rotatably supported by the mounting head body, and an electronic component is received from the component supply device by the component holder. An electronic component mounting device that is taken out and mounted on a substrate,
A light source provided in the mounting head; and a light guide disposed below the light source and guiding the light from the light source while diffusing the light. The light diffused by the light guide is transmitted to the mounting head. An illuminating device for irradiating an electronic component held by the component holder
A component holding posture recognition camera is provided that irradiates an electronic component held by the component holder with the light diffused by the light guide and takes a parallel light through a telecentric lens to capture a transmitted image. To do.

第2の発明は、周縁部に所定間隔を存して複数の部品保持具を備えた装着ヘッドが装着ヘッド体に回転可能に支持され、部品供給装置から前記部品保持具により電子部品を取出して、基板上に装着する電子部品装着装置であって、
前記装着ヘッドに設けられる光源と、この光源より下方に配設されて上部は遮光体で覆って前記光源からの光を拡散しながら下方へ導く丸棒状の導光体とを備え、この導光体により拡散された光を前記装着ヘッドに備えられた前記部品保持具に保持された電子部品に照射する照明装置と、
前記導光体により拡散された光を前記部品保持具に保持された電子部品に照射してテレセントリックレンズを介して平行光とし透過像として撮像する部品保持姿勢認識カメラとを
設けたことを特徴とする。
According to a second aspect of the present invention, a mounting head having a plurality of component holders with a predetermined interval at the periphery is rotatably supported by the mounting head body, and an electronic component is taken out from the component supply device by the component holder. An electronic component mounting apparatus mounted on a substrate,
A light source provided in the mounting head; and a round bar-shaped light guide disposed below the light source and covered with a light-shielding body to guide light downward while diffusing the light from the light source. An illumination device that irradiates an electronic component held by the component holder included in the mounting head with light diffused by a body;
A component holding posture recognition camera is provided that irradiates an electronic component held by the component holder with the light diffused by the light guide and takes a parallel light through a telecentric lens to capture a transmitted image. To do.

第3の発明は、第1又は第2の発明において、前記導光体の下面に拡散された光が下方に漏れないようにする遮光体を設けたことを特徴とする。   According to a third invention, in the first or second invention, a light-shielding body is provided to prevent light diffused on the lower surface of the light guide body from leaking downward.

本発明は、物品保持具により保持された電子部品に拡散光を照射しても、平行光として前記物品保持具に保持された電子部品の透過像を撮像して、前記電子部品の姿勢を判別できる電子部品装着装置を提供することでき、コスト高とならず実用的である。   The present invention can determine the posture of the electronic component by capturing a transmission image of the electronic component held by the article holder as parallel light even when the electronic component held by the article holder is irradiated with diffused light. An electronic component mounting apparatus that can be used can be provided, which is practical without increasing costs.

電子部品装着装置の平面図である。It is a top view of an electronic component mounting apparatus. 電子部品装着装置における装着ヘッドの側面図である。It is a side view of the mounting head in an electronic component mounting apparatus. LEDが発光した状態における装着ヘッドの底面図である。It is a bottom view of a mounting head in the state where LED emitted light. 電子部品装着装置における、特に電子部品の撮像及び認識処理に係わる制御ブロック図である。It is a control block diagram concerning the imaging and recognition processing of an electronic component in the electronic component mounting apparatus.

以下図1に基づき、基板としてのプリント基板P上に電子部品を装着する電子部品装着装置1について、本発明の実施の形態を説明する。この電子部品装着装置1には、各プリント基板Pの搬送を並列に行なう搬送装置2と、装置本体の手前側と奥側に配設され電子部品を供給する部品供給装置3A、3Bと、駆動源により一方向に移動可能(Y方向に往復移動可能)な一対のビーム4A、4Bと、前記各ビーム4A、4Bに沿った方向に各駆動源により別個に移動可能な装着ヘッド体6とが設けられている。この装着ヘッド体6については、図2に基づいて後述する。   An embodiment of the present invention will be described below with reference to FIG. 1 for an electronic component mounting apparatus 1 for mounting electronic components on a printed circuit board P as a substrate. The electronic component mounting apparatus 1 includes a transport device 2 that transports each printed circuit board P in parallel, component supply devices 3A and 3B that are disposed on the front side and the back side of the device main body and supply electronic components, A pair of beams 4A, 4B that can be moved in one direction by a source (reciprocating in the Y direction) and a mounting head body 6 that can be moved separately by each drive source in a direction along each of the beams 4A, 4B. Is provided. The mounting head body 6 will be described later with reference to FIG.

前記搬送装置2は電子部品装着装置1は供給コンベア2Aと、プリント基板Pを位置決め固定する位置決め部2Bと、排出コンベア2Cとを備えている。そして、前記供給コンベア2Aは上流より受けた各プリント基板Pを位置決め部2Bに搬送し、この各位置決め部2Bで位置決め装置により位置決めされた各基板上に電子部品が装着された後、排出コンベア2Cに搬送され、その後下流側装置に搬送される構成である。   As for the said conveying apparatus 2, the electronic component mounting apparatus 1 is provided with 2 A of supply conveyors, the positioning part 2B which positions and fixes the printed circuit board P, and the discharge conveyor 2C. Then, the supply conveyor 2A conveys each printed circuit board P received from the upstream to the positioning unit 2B, and after the electronic components are mounted on each substrate positioned by the positioning device in each positioning unit 2B, the discharge conveyor 2C It is the structure conveyed to the downstream apparatus after that.

そして、前記部品供給装置3A、3Bは前記搬送装置2の奥側位置と手前側位置に配設され、取付台であるカート台7A、7Bのフィーダベース上に部品供給ユニット8を多数並設したものである。各カート台7A、7Bは部品供給ユニット8の部品供給側の先端部がプリント基板Pの搬送路に臨むように前記装置本体に連結具を介して着脱可能に配設され、各カート台7A、7Bが正規に装置本体に取り付けられるとカート台7A、7Bに搭載された部品供給ユニット8に電源が供給され、また前記連結具を解除して把手を引くと下面に設けられたキャスタにより移動できる構成である。   The component supply devices 3A and 3B are disposed at the back side and the front side of the transport device 2, and a large number of component supply units 8 are arranged in parallel on the feeder bases of the cart bases 7A and 7B as mounting bases. Is. Each cart base 7A, 7B is detachably disposed on the apparatus main body via a connector so that the tip on the component supply side of the component supply unit 8 faces the conveyance path of the printed circuit board P, and each cart base 7A, When 7B is properly attached to the apparatus main body, power is supplied to the component supply unit 8 mounted on the cart bases 7A and 7B, and when the handle is released and the handle is pulled, it can be moved by a caster provided on the lower surface. It is a configuration.

そして、X方向に長い前後一対の前記ビーム4A、4Bは、各リニアモータから構成されるY方向移動駆動源の駆動により左右一対の前後に延びたガイドに沿って前記各ビームに固定されたスライダが摺動して個別にY方向に移動する。前記Y方向移動駆動源は、左右一対の基体1A、1Bに沿って固定された上下一対の固定子と、前記ビーム4A、4Bの両端部に設けられた取付板の下部に固定された可動子9Aとから構成される。   The pair of front and rear beams 4A and 4B that are long in the X direction is a slider fixed to each beam along a pair of front and rear guides that are driven by a Y-direction moving drive source constituted by each linear motor. Slide and individually move in the Y direction. The Y-direction moving drive source includes a pair of upper and lower stators fixed along a pair of left and right bases 1A and 1B, and a mover fixed to lower portions of mounting plates provided at both ends of the beams 4A and 4B. 9A.

また、前記ビーム4A、4Bにはその長手方向(X方向)にリニアモータから構成されるX方向移動駆動源によりガイドに沿って移動する前記装着ヘッド体6が夫々内側に設けられており、前記X方向移動駆動源は各ビーム4A、4Bに固定された前後一対の固定子と、各固定子の間に位置して前記装着ヘッド体6に設けられた可動子とから構成される。   The beams 4A and 4B are provided with the mounting head bodies 6 that move along the guides in the longitudinal direction (X direction) by an X-direction moving drive source composed of a linear motor, respectively. The X-direction moving drive source includes a pair of front and rear stators fixed to the beams 4A and 4B, and a mover provided on the mounting head body 6 between the stators.

従って、各装着ヘッド体6は向き合うように各ビーム4A、4Bの内側に設けられ、奥側の前記装着ヘッド体6は対応する奥側の部品供給装置3Aの部品供給ユニット8から電子部品の取出し作業を行い、搬送装置2上のプリント基板Pに装着することができ、手前側の装着ヘッド体6は対応する手前側の部品供給装置3Bから電子部品を取り出して前記プリント基板Pに装着することができる。   Accordingly, each mounting head body 6 is provided inside each beam 4A, 4B so as to face each other, and the mounting head body 6 on the back side takes out electronic components from the component supply unit 8 of the corresponding back side component supply device 3A. It is possible to carry out the work and mount it on the printed circuit board P on the transport device 2, and the front mounting head body 6 takes out the electronic component from the corresponding front component supply device 3B and mounts it on the printed circuit board P. Can do.

そして、各装着ヘッド体6はヘッド取付体6Aと円柱状を呈して平面視円形状の装着ヘッド6Bとから構成され、取付け部材6Cを介して前記ビーム4A、4Bに移動可能に取り付けられる。そして、前記装着ヘッド6Bの周縁部には、部品保持具としての吸着ノズル5が同心円上に所定間隔を存して複数本配設され。この吸着ノズル5は上下軸駆動源により上下動可能であり、θ軸駆動源により回転可能であり、前記部品供給ユニット8から電子部品を取出して、プリント基板P上に取出した電子部品を装着する。   Each mounting head body 6 is composed of a head mounting body 6A and a cylindrical mounting head 6B having a circular shape in plan view, and is movably mounted on the beams 4A and 4B via mounting members 6C. A plurality of suction nozzles 5 serving as component holders are concentrically arranged at predetermined intervals on the peripheral edge of the mounting head 6B. The suction nozzle 5 can be moved up and down by a vertical axis drive source, and can be rotated by a θ axis drive source. The electronic component is taken out from the component supply unit 8 and mounted on the printed circuit board P. .

ここで、前記部品供給ユニット8は、カート台7A、7Bに回転自在に載置した供給リールに巻回した状態で順次繰り出される収納テープに所定間隔で開設した送り孔にその歯が嵌合した送りスプロケットを所定角度回転させて収納テープを電子部品の部品吸着取出位置まで送りモータにより間欠送りするテープ送り機構と、剥離モータの駆動により吸着取出位置の手前でキャリアテープからカバーテープを引き剥がすためのカバーテープ剥離機構とを備え、カバーテープ剥離機構によりカバーテープを剥離してキャリアテープの収納部に装填された電子部品を順次部品吸着取出位置へ供給する。   Here, the teeth of the component supply unit 8 are fitted into the feed holes opened at predetermined intervals on the storage tape that is sequentially wound in a state of being wound around the supply reel that is rotatably mounted on the cart bases 7A and 7B. A tape feed mechanism that rotates the feed sprocket by a predetermined angle and intermittently feeds the storage tape to the component pick-up / extraction position of the electronic component, and the cover tape is peeled off from the carrier tape before the pick-up / extraction position by driving the peeling motor. The cover tape peeling mechanism is used to peel the cover tape by the cover tape peeling mechanism, and sequentially supply the electronic components loaded in the carrier tape storage portion to the component suction and take-out position.

また、各部品認識カメラ10は、各装着ヘッド6Bに設けられた各吸着ノズル5に吸着保持された電子部品をプリント基板P上に装着する前に一括して撮像する。   In addition, each component recognition camera 10 captures an image of the electronic components sucked and held by each suction nozzle 5 provided in each mounting head 6B before mounting on the printed board P.

以下、図2乃至図4に基づき詳述する。先ず、前述したように、X方向移動駆動源及びY方向移動駆動源によりXY方向に装着ヘッド体6は移動可能であり、前記装着ヘッド6Bは前記ヘッド取付体6Aにサーボモータである駆動モータ11により回転可能に支持されている。   This will be described in detail below with reference to FIGS. First, as described above, the mounting head body 6 can be moved in the X and Y directions by the X direction moving drive source and the Y direction moving drive source, and the mounting head 6B is driven by the drive motor 11 which is a servo motor. Is supported rotatably.

そして、前記装着ヘッド6Bには照明装置が配設される。即ち、平面視円形状の前記装着ヘッド6Bの下部の中心部には光源であるLED12が下向きに光を照射するように埋設され、このLED12からの光を拡散しながら導く丸棒状の導光体13が前記LED12の下方に配設される。なお、前記導光体13は、例えば透明なアクリル材料の内部に光を拡散するための粒状の拡散体が混入されていて、乳白色を呈しており、より拡散光を外部へ放射するように、表面を粗面としてもよい。   An illumination device is disposed on the mounting head 6B. In other words, a round bar-shaped light guide body in which an LED 12 as a light source is embedded so as to irradiate light downward in the central portion of the lower portion of the mounting head 6B having a circular shape in plan view and guides light from the LED 12 while diffusing. 13 is disposed below the LED 12. The light guide 13 is mixed with, for example, a granular diffuser for diffusing light inside a transparent acrylic material, exhibits milky white color, and emits diffused light to the outside. The surface may be rough.

14は前記導光体13の上半部が挿入されてこれを囲むように配設された、例えばアルミニウム製の中空円筒状の遮光体としての遮光ケースで、この遮光ケース14により前記導光体13の上半部では光が外部に漏れることが防止され、この遮光ケース14より下方(下半部)へと導かれることとなる。   14 is a light shielding case as a hollow cylindrical light shielding body made of aluminum, for example, which is disposed so as to surround the upper half portion of the light guiding body 13. Light is prevented from leaking to the outside in the upper half portion of 13 and is guided downward (lower half portion) from the light shielding case 14.

また、前記導光体13の下面には、遮光体としての白色の塗装15が施されて前記拡散光が下方へ漏れないようにし、更にこの塗装15下面の中央部には黒色の塗装16が施されている。従って、前記LED12から放射された光は前記導光体13により下方へ拡散しながら導かれ、前記遮光ケース14により覆われていない部分から前記導光体13外部へ拡散光が放射されることとなる。以上のように、前記照明装置は、前記LED12、前記導光体13及び遮光ケース14等から構成される。前記導光体13は装着ヘッド6Bに固定されているが、図3において、この導光体13からの拡散光は、周囲360度全域に放射され、全ての吸着ノズル5が照射される。   Further, a white coating 15 as a light shield is applied to the lower surface of the light guide 13 so that the diffused light does not leak downward, and a black coating 16 is provided at the center of the lower surface of the coating 15. It has been subjected. Accordingly, the light emitted from the LED 12 is guided while being diffused downward by the light guide 13, and the diffused light is emitted from the portion not covered by the light shielding case 14 to the outside of the light guide 13. Become. As described above, the illumination device includes the LED 12, the light guide 13, the light shielding case 14, and the like. Although the light guide 13 is fixed to the mounting head 6B, in FIG. 3, the diffused light from the light guide 13 is radiated to the entire 360 ° circumference, and all the suction nozzles 5 are irradiated.

20は3個並設されたテレセントリックレンズ21と撮像素子22とを備えて前記ヘッド取付体6Aに取付体23を介して固定される部品保持姿勢認識カメラで、前記吸着ノズル5に吸着保持された電子部品Dの透過像を撮像する。前記部品保持姿勢認識カメラ20は電子部品Dの高さと同じになるようにしてある。詳述すると、前記吸着ノズル5に吸着保持された電子部品Dを撮像する際には、この吸着ノズル5は前記上下軸駆動源により、図2に示すように上昇して原点位置にあり、前記導光体13の下端レベルと前記吸着ノズル5の下端レベルとが同一の高さレベルにあり、前記導光体13からの拡散光が前記吸着ノズル5に吸着保持された厚さtを有する電子部品Dに照射され、前記電子部品Dの透過光のうち前記テレセントリックレンズ21により平行光が選択されて前記部品保持姿勢認識カメラ20に導かれ電子部品の透過像が撮像されることとなる。   Reference numeral 20 denotes a component holding posture recognition camera which is provided with three telecentric lenses 21 and an image pickup element 22 arranged in parallel, and is fixed to the head mounting body 6A via the mounting body 23, and is held by the suction nozzle 5 by suction. A transmission image of the electronic component D is captured. The component holding posture recognition camera 20 is set to have the same height as the electronic component D. More specifically, when imaging the electronic component D sucked and held by the suction nozzle 5, the suction nozzle 5 is raised by the vertical axis drive source as shown in FIG. An electron having a thickness t in which the lower end level of the light guide 13 and the lower end level of the suction nozzle 5 are at the same height level, and the diffused light from the light guide 13 is sucked and held by the suction nozzle 5. The parallel light is selected by the telecentric lens 21 from the transmitted light of the electronic component D and guided to the component holding posture recognition camera 20 and a transmission image of the electronic component is captured.

詳述すると、平行光が選択され、前記撮像素子22に取り出され、この画像は前記導光体13が白い背景となる透過像が得られることとなる。従って、電子部品Dの透過光のうち、前記テレセントリックレンズ21により平行光が選択されて前記撮像素子22で露光して画像が取り込まれ、撮像されることとなる。   More specifically, parallel light is selected and taken out by the imaging device 22, and this image provides a transmission image in which the light guide 13 is a white background. Therefore, among the transmitted light of the electronic component D, parallel light is selected by the telecentric lens 21 and is exposed by the image sensor 22 to capture an image and be captured.

次に、図4の制御ブロック図に基づいて説明すると、25は本電子部品装着装置の電子部品の装着に係る動作を統括制御する制御装置、種々の判定をする判定装置、種々の比較をする比較装置、実行装置等してのマイクロコンピュータで、電子部品の装着ステップ番号順(装着順序毎)にプリント基板内でのX方向、Y方向及び角度位置から成る装着座標情報や各部品供給ユニットの配置番号情報等から成る装着データ、部品供給ユニットの配置番号毎の部品IDに係る部品配置位置データ、電子部品毎の電子部品のサイズデータ、厚さデータ等から成る部品ライブラリデータ等を格納する記憶部(記憶装置)をも備えている。   Next, based on the control block diagram of FIG. 4, reference numeral 25 denotes a control device that performs overall control of operations related to mounting of electronic components of the electronic component mounting device, a determination device that performs various determinations, and various comparisons. In a microcomputer as a comparison device, execution device, etc., mounting coordinate information consisting of X direction, Y direction and angular position in the printed circuit board in order of electronic component mounting step number (for each mounting order) and each component supply unit Storage for storing mounting data composed of arrangement number information, etc., component arrangement position data related to the component ID for each arrangement number of the component supply unit, electronic component size data for each electronic component, component library data composed of thickness data, etc. Unit (storage device).

そして、前記マイクロコンピュータ25は前記記憶部に記憶されたデータに基づき、モータ制御回路26を介して前記装着ヘッド6Bを回転させる駆動モータ9や、装着ヘッド体1のX方向移動駆動源及びY方向移動駆動源、前記吸着ノズル5の上下軸駆動源及びθ軸駆動源等の駆動を制御する。   Based on the data stored in the storage unit, the microcomputer 25 rotates the mounting head 6B via the motor control circuit 26, the X-direction moving drive source of the mounting head body 1 and the Y-direction. It controls the drive of the movement drive source, the vertical axis drive source of the suction nozzle 5 and the θ-axis drive source.

28は高速インターフェース27を介して前記マイクロコンピュータ25に接続される認識制御回路で、前記部品保持姿勢認識カメラ20により前記吸着ノズル5に吸着保持された電子部品Dを撮像して得られた画像を受信したり、マイクロコンピュータ25の指示に基づいて前記画像の認識処理を行ったりする。この認識制御回路28は前記モータ制御回路26からの前記駆動モータ9の現在の回転角度位置情報を受けて、前記LED12を点灯させるためのトリガー信号を照明駆動回路29に送信したり、前記撮像素子22に撮像を開始させるトリガー信号を送信したり、認識処理した結果を高速インターフェース27を介して前記マイクロコンピュータ25に送信したりする。   Reference numeral 28 denotes a recognition control circuit connected to the microcomputer 25 via a high-speed interface 27. An image obtained by imaging the electronic component D sucked and held by the suction nozzle 5 by the component holding posture recognition camera 20 is obtained. The image is received or the image is recognized based on an instruction from the microcomputer 25. The recognition control circuit 28 receives the current rotational angle position information of the drive motor 9 from the motor control circuit 26, and transmits a trigger signal for lighting the LED 12 to the illumination drive circuit 29, or the image sensor. A trigger signal for starting imaging is transmitted to 22, and a result of recognition processing is transmitted to the microcomputer 25 via the high-speed interface 27.

以上の構成により、以下電子部品の装着動作について説明する。先ず、モニタに表示されたタッチパネルスイッチである運転開始スイッチ部を操作すると、プリント基板Pを上流側装置より電子部品装着装置1の位置決め部2Bに搬入し、位置決め機構により位置決め動作を開始する。   With the above configuration, the mounting operation of the electronic component will be described below. First, when the operation start switch portion which is a touch panel switch displayed on the monitor is operated, the printed circuit board P is carried into the positioning portion 2B of the electronic component mounting device 1 from the upstream device, and the positioning operation is started by the positioning mechanism.

そして、前記マイクロコンピュータ25は前記記憶部に格納された当該プリント基板Pの装着すべきXY座標位置、鉛直軸線回りへの回転角度位置及び配置番号等が指定された装着データ等に従い、電子部品装着装置の各装着ヘッド体6の吸着ノズル5が装着すべき電子部品を各部品供給ユニット8から吸着して取出すように制御する。具体的には、前記X方向移動駆動源及び前記Y方向移動駆動源によりXY方向に移動させて前記装着ヘッド体6を移動させ、前記駆動モータ9により前記装着ヘッド6Bを図3における反時計方向に回転させて、前記各吸着ノズル5の前記上下軸駆動源及び前記θ軸駆動源を駆動させて、図2における白抜きの矢印の位置において、前記各部品供給ユニット8から各吸着ノズル5がそれぞれ電子部品を取出す。この場合、前記吸着ノズル5が下降して部品供給ユニット8から電子部品を取出した後は、上昇する。この場合、記憶部に格納された部品ライブラリデータを構成する厚さデータに基づいて、前記吸着ノズル5の下端レベルは前記上下軸駆動源により前記導光体13の下端レベルと同一の高さレベルになるように、前記マイクロコンピュータ25により制御される。   The microcomputer 25 mounts the electronic component according to the mounting data in which the XY coordinate position, the rotation angle position around the vertical axis, the arrangement number, etc., of the printed circuit board P stored in the storage unit are specified. The electronic component to be mounted by the suction nozzle 5 of each mounting head body 6 of the apparatus is controlled so as to be sucked and taken out from each component supply unit 8. Specifically, the mounting head body 6 is moved by moving the mounting head body 6 in the XY directions by the X-direction moving drive source and the Y-direction moving drive source, and the mounting motor 6B is moved counterclockwise in FIG. 2, the vertical axis drive source and the θ axis drive source of each suction nozzle 5 are driven, and each suction nozzle 5 is moved from each component supply unit 8 at the position of the white arrow in FIG. 2. Take out each electronic component. In this case, after the suction nozzle 5 is lowered and the electronic component is taken out from the component supply unit 8, it is raised. In this case, based on the thickness data constituting the part library data stored in the storage unit, the lower end level of the suction nozzle 5 is the same height level as the lower end level of the light guide 13 by the vertical axis drive source. Is controlled by the microcomputer 25.

そして、前記マイクロコンピュータ25は、前記駆動モータ9により前記装着ヘッド6Bを撮像位置まで回転させるように制御する。即ち、前記駆動モータ9により前記装着ヘッド6Bが回転(旋回)すると、この装着ヘッド6Bに設けられた前記照明装置及び各吸着ノズル5が一緒に回転しながら移動して、撮像位置である前記照明装置と前記部品保持姿勢認識カメラ20とを結ぶ線上に、前述したように前記部品供給ユニット8から取出した撮像したい電子部品Dを吸着保持している前記吸着ノズル5が位置することとなる。   The microcomputer 25 controls the drive motor 9 to rotate the mounting head 6B to the imaging position. That is, when the mounting head 6B is rotated (turned) by the drive motor 9, the illumination device provided on the mounting head 6B and each suction nozzle 5 move while rotating together, and the illumination at the imaging position is moved. As described above, the suction nozzle 5 holding the electronic component D to be picked up and picked up from the component supply unit 8 is positioned on a line connecting the apparatus and the component holding posture recognition camera 20.

この場合、前記駆動モータ9の回転に伴い、所定角度回転するとモータ制御回路26から回転角度位置情報を前記認識制御回路28が受けて、この認識制御回路28は前記LED12を点灯させるためのトリガー信号を前記照明駆動回路29に送信して点灯させる。   In this case, when the drive motor 9 rotates, the recognition control circuit 28 receives rotation angle position information from the motor control circuit 26 when the drive motor 9 rotates by a predetermined angle, and the recognition control circuit 28 triggers the LED 12 to light up. Is transmitted to the illumination driving circuit 29 to light it.

また、前記認識制御回路28は、前記撮像素子22に撮像を開始させるトリガー信号を送信して所謂フライ認識のために、撮像位置である前記照明装置と前記部品保持姿勢認識カメラ20とを結ぶ線上を移動しながら通過する際に、前記吸着ノズル5が吸着保持している電子部品Dを撮像する。そして、この撮像後は、前記LED12を消灯するように、前記照明駆動回路29は制御する。   In addition, the recognition control circuit 28 transmits a trigger signal for starting imaging to the imaging element 22, and is on a line connecting the illumination device that is an imaging position and the component holding posture recognition camera 20 for so-called fly recognition. The electronic part D picked up and held by the suction nozzle 5 is picked up when passing through. And after this imaging, the said illumination drive circuit 29 controls so that the said LED12 may be light-extinguished.

この場合、前記LED12が点灯すると、このLED12からの光は前記遮光体14により前記導光体13が拡散しながら下方へ導かれることなる。即ち、前記導光体13により拡散された光は前記遮光体14により反射されながら、下方へ導かれ、前記導光体13の下面の遮光体としての前記塗装15により上方に反射され、結果としてこの遮光体14により覆われていない前記導光体13の下半部の周側面から360度全方向に拡散光が外部へ放射される。   In this case, when the LED 12 is turned on, the light from the LED 12 is guided downward while the light guide 13 is diffused by the light shield 14. That is, the light diffused by the light guide 13 is guided downward while being reflected by the light shield 14, and reflected upward by the coating 15 as the light shield on the lower surface of the light guide 13. Diffused light is radiated to the outside in all directions of 360 degrees from the peripheral side surface of the lower half of the light guide 13 that is not covered by the light shield 14.

そして、この拡散光は前記吸着ノズル5が吸着保持している電子部品Dに照射し、その透過光は3個の前記テレセントリックレンズ21により平行光が選択され、前記撮像素子22により撮像されることとなる。   The diffused light is applied to the electronic component D held by the suction nozzle 5, and the transmitted light is selected as parallel light by the three telecentric lenses 21 and picked up by the image sensor 22. It becomes.

そして、マイクロコンピュータ25の指示に基づいて前記撮像素子22が撮像した画像を前記認識制御回路28が受け取って、取込んだ画像の認識処理を認識制御回路28が行い、この認認識処理した結果を高速インターフェース27を介して前記マイクロコンピュータ25に送信される。   Then, the recognition control circuit 28 receives an image captured by the image sensor 22 based on an instruction from the microcomputer 25, and the recognition control circuit 28 performs recognition processing of the captured image. The data is transmitted to the microcomputer 25 through the high speed interface 27.

そして、前記マイクロコンピュータ25は認識処理した結果に基づいて、正規の姿勢で保持しているか否かの判別を行う。この判別に際しては、前記マイクロコンピュータ15が電子部品Dの下面レベルが所定の範囲内に入っているか否かを基準として行うこととなる。なお、電子部品Dを吸着保持した前記吸着ノズル5が移動しながら、この電子部品Dは撮像されるために、この撮像された画像は、ブレたものとなるが、電子部品Dの下面レベルは明確なものであるから、正規の姿勢でない、例えば裏面吸着や、所謂立ち吸着している場合でも、認識処理すると、確実に正規の姿勢で保持しているか否かの前記マイクロコンピュータ25による判別には問題が起こらない。また、前記吸着ノズル5に電子部品Dが吸着されているか否かの判別も、確実に行える。   The microcomputer 25 determines whether or not the microcomputer 25 is held in a normal posture based on the recognition processing result. In this determination, the microcomputer 15 performs the determination based on whether or not the lower surface level of the electronic component D is within a predetermined range. Since the electronic component D is picked up while the suction nozzle 5 holding the electronic component D is picked up, the picked-up image is blurred, but the lower surface level of the electronic component D is Since it is clear, even if the posture is not a normal posture, for example, back-side suction or so-called standing suction, the recognition processing makes it possible for the microcomputer 25 to determine whether or not the posture is reliably held. No problem. Further, it is possible to reliably determine whether or not the electronic component D is attracted to the suction nozzle 5.

なお、より明るい照明を瞬時にストロボ点灯させて、静止した画像を撮像するようにしてもよい。   Note that a still image may be taken by instantaneously lighting a brighter illumination with a strobe.

また、正規の姿勢でないと判別した場合には、例えば廃棄回収して、再度部品供給ユニット8から当該電子部品を取出すように、前記マイクロコンピュータ25は制御する。正規の姿勢であると判別した場合には、前記装着ヘッド体6をXY方向に移動させて、前記吸着ノズル5に吸着保持された電子部品を部品認識カメラ10の上方に移動させて、吸着部品の撮像及びその画像取込を実行し、前記認識制御回路28により電子部品の位置認識処理をする。次に、プリント基板に付された位置決めマークを基板認識カメラが撮像し、前記認識制御回路28によりプリント基板の位置認識処理をする。そして、これらの認識処理結果に基づき、前記マイクロコンピュータ25は前記装着ヘッド体1のX方向移動駆動源及びY方向移動駆動源、前記吸着ノズル5のθ軸駆動源を制御してXYθ補正して、電子部品を前記位置決め部2Bにあるプリント基板P上に装着する。   If it is determined that the posture is not correct, the microcomputer 25 controls to discard and collect, for example, and take out the electronic component from the component supply unit 8 again. When it is determined that the posture is normal, the mounting head body 6 is moved in the X and Y directions, the electronic component sucked and held by the suction nozzle 5 is moved above the component recognition camera 10, and the suction component And recognizing the position of the electronic component by the recognition control circuit 28. Next, the board recognition camera images the positioning mark attached to the printed circuit board, and the recognition control circuit 28 performs the process of recognizing the position of the printed board. Based on the recognition processing results, the microcomputer 25 controls the X-direction movement drive source and Y-direction movement drive source of the mounting head body 1 and the θ-axis drive source of the suction nozzle 5 to correct XYθ. The electronic component is mounted on the printed circuit board P in the positioning portion 2B.

以上のように本発明は、前記吸着ノズル5により保持された電子部品に拡散光を照射しても、平行光として前記吸着ノズルに保持された電子部品の透過像を撮像して、前記電子部品の姿勢を判別できる電子部品装着装置を提供することでき、コスト高とならず実用的である。   As described above, according to the present invention, even if the electronic component held by the suction nozzle 5 is irradiated with diffused light, a transmission image of the electronic component held by the suction nozzle is captured as parallel light to obtain the electronic component. It is possible to provide an electronic component mounting apparatus capable of discriminating the posture of the apparatus, which is practical without increasing the cost.

以上のように本発明の実施態様について説明したが、上述の説明に基づいて当業者にとって種々の代替例、修正又は変形が可能であり、本発明はその趣旨を逸脱しない範囲で前述の種々の代替例、修正又は変形を包含するものである。   Although the embodiments of the present invention have been described above, various alternatives, modifications, and variations can be made by those skilled in the art based on the above description. It encompasses alternatives, modifications or variations.

6 装着ヘッド体
6B 装着ヘッド
12 LED
13 導光体
14 遮光体
20 部品保持姿勢認識カメラ
21 テレセントリックレンズ
22 撮像素子
6 Mounting head body 6B Mounting head 12 LED
13 Light Guide 14 Light Shield 20 Component Holding Posture Recognition Camera 21 Telecentric Lens 22 Image Sensor

Claims (3)

周縁部に所定間隔を存して複数の部品保持具を備えた装着ヘッドが装着ヘッド体に回転可能に支持され、部品供給装置から前記部品保持具により電子部品を取出して、基板上に装着する電子部品装着装置であって、
前記装着ヘッドに設けられる光源と、この光源より下方に配設されて前記光源からの光を拡散しながら下方へ導く導光体とを備え、この導光体により拡散された光を前記装着ヘッドに備えられた前記部品保持具に保持された電子部品に照射する照明装置と、
前記導光体により拡散された光を前記部品保持具に保持された電子部品に照射してテレセントリックレンズを介して平行光とし透過像として撮像する部品保持姿勢認識カメラとを
設けたことを特徴とする電子部品装着装置。
A mounting head provided with a plurality of component holders with a predetermined interval at the periphery is rotatably supported by the mounting head body, and an electronic component is taken out from the component supply device by the component holder and mounted on the substrate. An electronic component mounting device,
A light source provided in the mounting head; and a light guide disposed below the light source and guiding the light from the light source while diffusing the light. The light diffused by the light guide is transmitted to the mounting head. An illuminating device for irradiating an electronic component held by the component holder
A component holding posture recognition camera is provided that irradiates an electronic component held by the component holder with the light diffused by the light guide and takes a parallel light through a telecentric lens to capture a transmitted image. Electronic component mounting device.
周縁部に所定間隔を存して複数の部品保持具を備えた装着ヘッドが装着ヘッド体に回転可能に支持され、部品供給装置から前記部品保持具により電子部品を取出して、基板上に装着する電子部品装着装置であって、
前記装着ヘッドに設けられる光源と、この光源より下方に配設されて上部は遮光体で覆って前記光源からの光を拡散しながら下方へ導く丸棒状の導光体とを備え、この導光体により拡散された光を前記装着ヘッドに備えられた前記部品保持具に保持された電子部品に照射する照明装置と、
前記導光体により拡散された光を前記部品保持具に保持された電子部品に照射してテレセントリックレンズを介して平行光とし透過像として撮像する部品保持姿勢認識カメラとを
設けたことを特徴とする電子部品装着装置。
A mounting head provided with a plurality of component holders with a predetermined interval at the periphery is rotatably supported by the mounting head body, and an electronic component is taken out from the component supply device by the component holder and mounted on the substrate. An electronic component mounting device,
A light source provided in the mounting head; and a round bar-shaped light guide disposed below the light source and covered with a light-shielding body to guide light downward while diffusing the light from the light source. An illumination device that irradiates an electronic component held by the component holder included in the mounting head with light diffused by a body;
A component holding posture recognition camera is provided that irradiates an electronic component held by the component holder with the light diffused by the light guide and takes a parallel light through a telecentric lens to capture a transmitted image. Electronic component mounting device.
前記導光体の下面に拡散された光が下方に漏れないようにする遮光体を設けたことを特徴とする請求項1又は2に記載の電子部品装着装置。   The electronic component mounting apparatus according to claim 1, further comprising a light blocking body that prevents light diffused on a lower surface of the light guide body from leaking downward.
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Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP7289274B2 (en) 2020-03-10 2023-06-09 ヤマハ発動機株式会社 Lighting equipment and component mounting equipment

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH11121999A (en) * 1997-10-20 1999-04-30 Yamaha Motor Co Ltd Parts-recognizing device for surface mounting machine
JP2008135210A (en) * 2006-11-27 2008-06-12 Toshiba Lighting & Technology Corp Led bulb, and lighting equipment
JP2010087062A (en) * 2008-09-30 2010-04-15 Hitachi High-Tech Instruments Co Ltd Electronic component mounting head and electronic component mounting device using the same

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH11121999A (en) * 1997-10-20 1999-04-30 Yamaha Motor Co Ltd Parts-recognizing device for surface mounting machine
JP2008135210A (en) * 2006-11-27 2008-06-12 Toshiba Lighting & Technology Corp Led bulb, and lighting equipment
JP2010087062A (en) * 2008-09-30 2010-04-15 Hitachi High-Tech Instruments Co Ltd Electronic component mounting head and electronic component mounting device using the same

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP7289274B2 (en) 2020-03-10 2023-06-09 ヤマハ発動機株式会社 Lighting equipment and component mounting equipment

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