JP2014116235A - Illumination device - Google Patents

Illumination device Download PDF

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Publication number
JP2014116235A
JP2014116235A JP2012270693A JP2012270693A JP2014116235A JP 2014116235 A JP2014116235 A JP 2014116235A JP 2012270693 A JP2012270693 A JP 2012270693A JP 2012270693 A JP2012270693 A JP 2012270693A JP 2014116235 A JP2014116235 A JP 2014116235A
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Prior art keywords
light
opening
light emitting
light guide
guide plate
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Granted
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JP2012270693A
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Japanese (ja)
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JP5740560B2 (en
Inventor
Naoki Kotani
直樹 小谷
Ichiro Tanimura
一郎 谷村
Yuuji Nakagawa
有士 中川
Ryuma Murase
龍馬 村瀬
Shinji Kadoriku
晋二 角陸
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Panasonic Corp
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Panasonic Corp
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Priority to JP2012270693A priority Critical patent/JP5740560B2/en
Priority to DE112013005914.2T priority patent/DE112013005914T5/en
Priority to PCT/JP2013/006826 priority patent/WO2014091686A1/en
Priority to CN201390000939.7U priority patent/CN204805985U/en
Publication of JP2014116235A publication Critical patent/JP2014116235A/en
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Publication of JP5740560B2 publication Critical patent/JP5740560B2/en
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Classifications

    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21LIGHTING
    • F21SNON-PORTABLE LIGHTING DEVICES; SYSTEMS THEREOF; VEHICLE LIGHTING DEVICES SPECIALLY ADAPTED FOR VEHICLE EXTERIORS
    • F21S8/00Lighting devices intended for fixed installation
    • F21S8/02Lighting devices intended for fixed installation of recess-mounted type, e.g. downlighters
    • F21S8/026Lighting devices intended for fixed installation of recess-mounted type, e.g. downlighters intended to be recessed in a ceiling or like overhead structure, e.g. suspended ceiling
    • GPHYSICS
    • G02OPTICS
    • G02BOPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/0001Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings specially adapted for lighting devices or systems
    • G02B6/0011Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings specially adapted for lighting devices or systems the light guides being planar or of plate-like form
    • G02B6/0013Means for improving the coupling-in of light from the light source into the light guide
    • G02B6/0023Means for improving the coupling-in of light from the light source into the light guide provided by one optical element, or plurality thereof, placed between the light guide and the light source, or around the light source
    • G02B6/0031Reflecting element, sheet or layer
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21LIGHTING
    • F21VFUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V2200/00Use of light guides, e.g. fibre optic devices, in lighting devices or systems
    • F21V2200/20Use of light guides, e.g. fibre optic devices, in lighting devices or systems of light guides of a generally planar shape
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21LIGHTING
    • F21YINDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
    • F21Y2103/00Elongate light sources, e.g. fluorescent tubes
    • F21Y2103/30Elongate light sources, e.g. fluorescent tubes curved
    • F21Y2103/33Elongate light sources, e.g. fluorescent tubes curved annular
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21LIGHTING
    • F21YINDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
    • F21Y2115/00Light-generating elements of semiconductor light sources
    • F21Y2115/10Light-emitting diodes [LED]
    • GPHYSICS
    • G02OPTICS
    • G02BOPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/0001Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings specially adapted for lighting devices or systems
    • G02B6/0011Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings specially adapted for lighting devices or systems the light guides being planar or of plate-like form
    • G02B6/0013Means for improving the coupling-in of light from the light source into the light guide
    • G02B6/0015Means for improving the coupling-in of light from the light source into the light guide provided on the surface of the light guide or in the bulk of it
    • G02B6/0018Redirecting means on the surface of the light guide

Abstract

PROBLEM TO BE SOLVED: To provide an illumination device including a light guide plate in which a light incident part has an inclined part in which, even when chip dislocation occurs in a mounting position of a light emitting element, occurrence of luminance unevenness can be suppressed and uniform surface emission can be expected.SOLUTION: An illumination device 100 is configured in which an LED mounting substrate, a reflection member and a light guide plate are arranged in this order upward. In the reflection member 30, an opening 34 for communicating with a light emitting element in a thickness direction is provided. The light guide plate 40 has a light-incident part 42 in a position of a surface corresponding to the opening 34. The light-incident part 42 includes: an element facing part 420 facing the light emitting element 22; and inclined parts 422A and 422B having inclined surfaces in which an inclination angle with respect to a vertical (Z) direction increases as going further away from the element facing part 420, on a surface opposite to the surface where the element facing part 420 of the light guide plate 40 exists. In a Y direction, the width of the element facing part 420 is set to be larger than the width of the opening 34, and both end parts on the peripheral edge of the opening 34 are positioned further inner side than both end parts of the element facing part 420.

Description

本発明は、LED(Light Emitting Diode)等の発光素子を光源として備える照明装置に関する。本発明は特に、導光板を用いた面発光する照明装置において輝度ムラを低減させる技術に関する。   The present invention relates to an illumination device including a light emitting element such as an LED (Light Emitting Diode) as a light source. The present invention particularly relates to a technique for reducing luminance unevenness in a lighting device that emits light using a light guide plate.

導光板を用いた面発光方式の照明装置として、例えば図16の断面図に示す照明装置900が開発されている。照明装置900は、複数の発光素子922と、反射部材945と、導光板940とを備える。反射部材945と導光板940とは共に紙面に垂直な方向を平面方向とする円盤状である。導光板940は各発光素子922を上方より取り囲む入光部941を有する。各発光素子922は主な出射方向を導光板940に向けた状態で、間隔をおいて円周状に配列される。装置900は各発光素子922に電力供給するための電源ユニット(不図示)を有する。駆動時には、発光素子922からの出射光が入光部941における入射面944bに入射する。入射光は入光部941の表側に位置する反射面941aで反射され、入光部941より内側に位置する内側導光部942と、入光部941より外側に位置する外側導光部943とに導光される。その後、入射光は内側導光部942および外側導光部943の表側の面である光出射面942a、943aより、外部に均一な照明光として出射される。   For example, an illumination device 900 shown in a cross-sectional view of FIG. 16 has been developed as a surface-emitting illumination device using a light guide plate. The lighting device 900 includes a plurality of light emitting elements 922, a reflecting member 945, and a light guide plate 940. Both the reflection member 945 and the light guide plate 940 have a disk shape whose plane direction is a direction perpendicular to the paper surface. The light guide plate 940 has a light incident portion 941 that surrounds each light emitting element 922 from above. The light emitting elements 922 are arranged circumferentially at intervals with the main emission direction directed toward the light guide plate 940. The apparatus 900 includes a power supply unit (not shown) for supplying power to each light emitting element 922. At the time of driving, light emitted from the light emitting element 922 enters the incident surface 944b of the light incident portion 941. Incident light is reflected by the reflecting surface 941 a located on the front side of the light incident portion 941, and includes an inner light guide portion 942 located inside the light incident portion 941, and an outer light guide portion 943 located outside the light incident portion 941. Is guided to. Thereafter, the incident light is emitted to the outside as uniform illumination light from the light emitting surfaces 942a and 943a which are front surfaces of the inner light guide portion 942 and the outer light guide portion 943.

特開2012−104476号公報JP 2012-104476 A

面発光方式の照明装置では、例えば照明装置910の部分断面図(図17(a))に示す入光部946Xを備えた導光板940Xの利用も想定できる。入光部946Xは、素子対向部947Xと、傾斜部948X、949Xと、傾斜部948X、949Xの反対側に存在する側面部950X、951Xとを有する。素子対向部947Xは発光素子922の周囲に存在する反射部材30Xの間隙において、発光素子922の出射面と対向配置される。傾斜部948X、949Xは導光板940Xにおける素子対向部947Xの配設面と反対側の面において、素子対向部947Xより遠ざかるにつれて垂直(Z)方向に対する傾斜角度が増大するように配された傾斜面を有する。駆動時には、発光素子922よりL9〜L12等を含む出射光が素子対向部947Xに入射される。その後、出射光は傾斜部948X、949X付近で効率よく正反射され、導光板940Xの全体に導光される。尚、反射部材945Xで一旦反射された反射光は図17(a)の光L13のように側面部950X、951Xから入射する。 In the surface light emission type illumination device, for example, the use of the light guide plate 940X including the light incident portion 946X illustrated in the partial cross-sectional view of the illumination device 910 (FIG. 17A) can be assumed. The light incident portion 946X includes an element facing portion 947X, inclined portions 948X and 949X, and side surface portions 950X and 951X existing on the opposite side of the inclined portions 948X and 949X. The element facing portion 947 </ b> X is disposed to face the emission surface of the light emitting element 922 in the gap between the reflecting members 30 </ b> X existing around the light emitting element 922. The inclined portions 948X and 949X are inclined surfaces arranged such that the inclination angle with respect to the vertical (Z) direction increases on the surface of the light guide plate 940X opposite to the element facing portion 947X, as the distance from the element facing portion 947X increases. Have At the time of driving, emitted light including L 9 to L 12 and the like is incident on the element facing portion 947X from the light emitting element 922. Thereafter, the emitted light is efficiently regularly reflected in the vicinity of the inclined portions 948X and 949X and guided to the entire light guide plate 940X. The reflection member reflected light is once reflected by 945X side surface portion 950X as light L 13 in FIG. 17 (a), incident 951x.

照明装置910で上記効果を得るには、発光素子22と導光板940Xとの位置関係に厳密性が求められる。しかしながら発光素子922の実装位置が目標位置とずれる、位置ずれ誤差(以降、「チップずれ」と称する。)を生じうる。
チップずれを生じると、図17(b)に示す部分断面図のように、発光素子922と入光部946Xとの相対位置もずれる。これに伴い、チップずれを生じた方向(ここでは右側)において、発光素子922から素子対向部947Xを介さず、反射部材945Xで反射せずに側面部950X、951X(ここでは951X)より直接入射し、傾斜部949Xに比較的大きな入射角度で入射する光が増える。この入射光は、傾斜部949Xを突き抜けて外部に出射され、高輝度の直接光L14となりうる。照明装置910を外部から見た場合、チップずれを生じた領域での輝度がその他の領域での輝度に比べて高くなる。よって照明装置910の発光面には、直接光L14の出射領域と、直接光L14の非出射領域とが生じうる。これが原因となって輝度ムラを生じるという課題の発生が想定される。尚、反射部材945Xで一旦反射されて拡散されて外部に出射される光L13、L15も存在するが(図17(a)、図17(b))、これらの光は拡散されて強度が弱いため、上記課題の原因にはなりにくい。
In order to obtain the above effect with the lighting device 910, strictness is required for the positional relationship between the light emitting element 22 and the light guide plate 940X. However, a misalignment error (hereinafter referred to as “chip misalignment”) in which the mounting position of the light emitting element 922 deviates from the target position may occur.
When the chip is displaced, the relative position between the light emitting element 922 and the light incident portion 946X is also shifted as shown in the partial cross-sectional view in FIG. Accordingly, in the direction in which the chip is displaced (here, the right side), the light is directly incident from the side surface portions 950X and 951X (here, 951X) without being reflected by the reflecting member 945X without passing through the element facing portion 947X. In addition, the light incident on the inclined portion 949X at a relatively large incident angle increases. The incident light is emitted to the outside penetrating the inclined portion 949X, can be a direct light L 14 of high luminance. When the illumination device 910 is viewed from the outside, the luminance in the region where the chip shift has occurred is higher than the luminance in other regions. Therefore the light emitting surface of the illumination apparatus 910, and the output region of the direct light L 14, may occur directly non emitting area of the light L 14 is. The generation | occurrence | production of the subject that a brightness nonuniformity arises for this causes is assumed. There are also lights L 13 and L 15 that are once reflected and diffused by the reflecting member 945X and emitted to the outside (FIGS. 17A and 17B), but these lights are diffused and intensified. Is difficult to cause the above problem.

本発明は上記課題に鑑みてなされたものであって、入光部が傾斜部を有する導光板を備えた照明装置において、発光素子の実装位置がチップずれを生じた場合でも、輝度ムラの発生を抑えて均一な面発光を期待することができる照明装置を提供することを目的とする。   The present invention has been made in view of the above problems, and in a lighting device including a light guide plate having a light incident portion having an inclined portion, even when the mounting position of the light emitting element is displaced from the chip, luminance unevenness occurs. An object of the present invention is to provide an illuminating device that can suppress uniform light emission and can expect uniform surface light emission.

上記目的を達成するために、本発明の一態様に係る照明装置は、複数の発光素子が実装された実装基板と、前記各発光素子の出射光を導光する導光板と、前記実装基板と前記導光板との間に挟設され、前記各発光素子と対応する位置に厚み方向に貫通する開口が存在する板状部材とを備える照明装置であって、前記導光板は前記開口と対応する位置に、前記開口を介して前記発光素子の出射光が入射される入光部を有し、前記入光部は前記発光素子と対向する素子対向部と、前記導光板の前記素子対向部が存在する面とは反対の面において、前記実装基板の表面に沿った第1方向に前記素子対向部より遠ざかるにつれて前記実装基板の表面と垂直な方向に対する傾斜角度が増大する傾斜面を備えた傾斜部とを有し、前記導光板を平面視する際、前記第1方向に沿って、前記開口の幅が前記素子対向部の幅よりも小さく且つ前記開口の周縁の両端部が前記素子対向部の両端部よりも内側に位置している構成とする。   In order to achieve the above object, an illumination device according to an aspect of the present invention includes a mounting substrate on which a plurality of light emitting elements are mounted, a light guide plate that guides light emitted from each of the light emitting elements, and the mounting substrate. A lighting device including a plate-like member sandwiched between the light guide plate and having an opening penetrating in a thickness direction at a position corresponding to each light emitting element, wherein the light guide plate corresponds to the opening. A light incident portion where the light emitted from the light emitting element is incident through the opening, the light incident portion including an element facing portion facing the light emitting element, and the element facing portion of the light guide plate. An inclined surface having an inclined surface whose angle of inclination with respect to a direction perpendicular to the surface of the mounting substrate increases as the distance from the element facing portion increases in a first direction along the surface of the mounting substrate on a surface opposite to the existing surface. The light guide plate in plan view Along the first direction, the width of the opening is configured to both end portions of the peripheral edge of small and the opening than the width of the element facing portion are positioned inside the both end portions of the element facing portion.

ここで、本発明の別の態様では、前記板状部材は表面を凹入させてなる凹入部を有し、前記凹入部の内部に前記開口が存在し、前記入光部が前記凹入部に挿入されている構成とすることもできる。
また本発明の別の態様では、前記第1方向に沿って、前記入光部は前記素子対向部の前記両端部に対応する各位置に前記傾斜部を有し、且つ前記各傾斜部の前記表面の傾斜が前記素子対向部より遠ざかるにつれて漸減する構成とすることもできる。
Here, in another aspect of the present invention, the plate-like member has a recessed portion having a recessed surface, the opening is present inside the recessed portion, and the light incident portion is in the recessed portion. It can also be set as the structure inserted.
In another aspect of the present invention, the light incident portion has the inclined portion at each position corresponding to the both end portions of the element facing portion along the first direction, and the inclined portion It is also possible to adopt a configuration in which the inclination of the surface gradually decreases as the distance from the element facing portion increases.

また本発明の別の態様では、前記開口は、前記発光素子との対応位置に存在する第1開口部と、前記第1開口部に連通し且つ前記第1開口部の最大径よりも大きい径の第2開口部とを有し、前記第1開口部に対応する位置に前記入光部が近接配置されている構成とすることもできる。
また本発明の別の態様では、前記板状部材は、前記発光素子の出射光を反射する反射部材である構成とすることもできる。
In another aspect of the present invention, the opening has a first opening existing at a position corresponding to the light emitting element, a diameter communicating with the first opening, and larger than a maximum diameter of the first opening. It is also possible to adopt a configuration in which the light incident portion is disposed close to a position corresponding to the first opening.
In another aspect of the present invention, the plate member may be a reflecting member that reflects the emitted light of the light emitting element.

また本発明の別の態様では、前記第1方向に沿って、前記反射部材は前記凹入部の内部において前記第1開口部を挟む両側に側壁を有し、且つ前記各側壁は前記第1開口部の前記周縁の両端部のいずれか一方と、これに近接する前記入光部の前記周縁の両端部のいずれか一方とを結ぶ直線上に配置されている構成とすることもできる。
また本発明の別の態様では、前記一の方向に沿って、前記一対の側壁は前記第1開口部の前記周縁の両端部よりも外側に存在する構成とすることもできる。
In another aspect of the present invention, the reflecting member has side walls on both sides of the first opening in the recessed portion along the first direction, and each side wall has the first opening. It can also be set as the structure arrange | positioned on the straight line which ties any one of the both ends of the said periphery of a part, and either one of the said both ends of the said periphery of the said light-incidence part which adjoins this.
In another aspect of the present invention, the pair of side walls may be present outside the both ends of the peripheral edge of the first opening along the one direction.

また本発明の別の態様では、前記第1方向と直交する第2方向において、前記第1開口部を挟んだ両側に一対の前記第2開口部が前記連通して存在する構成とすることもできる。
また本発明の別の態様では、前記複数の発光素子が互いに間隔をおいて前記実装され、前記第2開口部は隣接する前記発光素子の実装位置間に対応する位置に存在する構成とすることもできる。
In another aspect of the present invention, a pair of the second openings may be in communication with each other on both sides of the first opening in a second direction orthogonal to the first direction. it can.
According to another aspect of the present invention, the plurality of light emitting elements are mounted with a space therebetween, and the second opening is located at a position corresponding to a position between adjacent mounting positions of the light emitting elements. You can also.

また本発明の別の態様では、前記複数の発光素子は前記実装基板の表面において円周状に前記実装され、前記導光板の前記入光部は、前記実装基板上の各発光素子の実装位置を結ぶように連続的に形成されている構成とすることもできる。
また本発明の別の態様では、前記導光板は円盤状であり、前記入光部より内側に位置する第1導光部と、前記入光部より外側に位置する第2導光部とを有し、前記第1方向は前記導光板の直径を通る方向である構成とすることもできる。
In another aspect of the present invention, the plurality of light emitting elements are mounted on the surface of the mounting board in a circumferential shape, and the light incident portion of the light guide plate is mounted on each mounting element on the mounting board. It can also be set as the structure currently formed so that may be tied.
Moreover, in another aspect of the present invention, the light guide plate has a disk shape, and includes a first light guide portion located inside the light entrance portion and a second light guide portion located outside the light entrance portion. And the first direction may be a direction passing through the diameter of the light guide plate.

また本発明の別の態様では、前記第1導光部と前記第2導光部の各外表面が同じ高さであり、前記第1導光部と前記第2導光部の厚みが同一である構成とすることもできる。
また本発明の別の態様では、前記板状部材と前記導光板とは射出成形されている構成とすることもできる。
また本発明の別の態様では、前記発光素子をLED素子とすることもできる。
In another aspect of the present invention, the outer surfaces of the first light guide and the second light guide are the same height, and the first light guide and the second light guide have the same thickness. It can also be set as the structure which is.
In another aspect of the present invention, the plate member and the light guide plate may be formed by injection molding.
In another aspect of the present invention, the light emitting element may be an LED element.

また本発明の別の態様では、前記発光素子に電力供給するための電源装置を有する構成とすることもできる。   In another embodiment of the present invention, a power supply device for supplying power to the light emitting element may be provided.

本発明の一態様に係る照明装置では、駆動時に発光素子の出射光が板状部材の開口を通過する際、第1方向に沿って、入光部の素子対向部の幅より狭い幅を持つ開口の周縁の両端部で出射光が部分的に遮蔽される。
これにより、たとえ発光素子が入光部に対して第1方向にチップずれを生じていても、導光板に入射した強度の高い発光素子の出射光が、垂直方向に対する傾斜角度の大きい傾斜部を突き抜け、高輝度の直接光となって外部に出射されるのを防止できる。
In the lighting device according to one embodiment of the present invention, when the light emitted from the light emitting element passes through the opening of the plate-like member during driving, the lighting apparatus has a width narrower than the width of the element facing portion of the light incident portion along the first direction. The emitted light is partially shielded at both ends of the periphery of the opening.
As a result, even if the light emitting element has a chip shift in the first direction with respect to the light incident part, the light emitted from the light emitting element having a high intensity incident on the light guide plate has an inclined part with a large inclination angle with respect to the vertical direction. It can be prevented from penetrating and being emitted to the outside as direct light with high luminance.

結果として、入光部が傾斜部を有する導光板を備えた照明装置において、発光素子の実装位置がチップずれを生じた場合でも、輝度ムラの発生を抑えて均一な面発光を期待することが可能な照明装置を提供できる。   As a result, in an illuminating device including a light guide plate having a light incident portion having an inclined portion, even when the mounting position of the light emitting element is displaced from the chip, it is possible to expect uniform surface light emission while suppressing occurrence of luminance unevenness. A possible lighting device can be provided.

実施の形態1に係る照明装置100の構成及び設置例を示す、一部断面図である。It is a partial cross section figure which shows the structure and installation example of the illuminating device 100 which concern on Embodiment 1. FIG. 照明器具1の外観構成と内部構成を示す図である。It is a figure which shows the external appearance structure and internal structure of the lighting fixture 1. FIG. 照明器具1の内部構成を示す分解図(組図)である。It is an exploded view (combination drawing) which shows the internal structure of the lighting fixture 1. FIG. 照明器具1の内部構成を示す部分断面斜視図である。2 is a partial cross-sectional perspective view showing the internal configuration of the lighting fixture 1. FIG. 反射部材30の構成を示す部分断面斜視図である。4 is a partial cross-sectional perspective view showing a configuration of a reflecting member 30. FIG. 反射部材30の構成を示す図である。(a)は拡散カバー50側(上面側)から見た正面図、(b)はベース10側(下面側)から見た正面図である。FIG. 3 is a diagram showing a configuration of a reflecting member 30. (A) is the front view seen from the diffusion cover 50 side (upper surface side), (b) is the front view seen from the base 10 side (lower surface side). 入光部42周辺の構成を示す部分断面図である。FIG. 4 is a partial cross-sectional view showing a configuration around a light incident portion 42. チップずれを生じた発光素子22の出射光を示す、入光部42周辺の部分断面図である。FIG. 6 is a partial cross-sectional view around a light incident part 42 showing light emitted from the light emitting element 22 in which chip displacement has occurred. (a)は通常(チップずれ無し)の発光素子22の出射光を示す、入光部42周辺の部分断面図である。(b)は出射光L1、L2の出射角度θ1と、出射光L2、L4の出射角度θ2とを示す部分断面図である。FIG. 4A is a partial cross-sectional view around a light incident part 42 showing light emitted from a normal light emitting element 22 (no chip displacement). (B) is a partial sectional view showing the emission angle theta 1 of the emitted light L 1, L 2, an exit angle theta 2 of the outgoing light L 2, L 4. 比較例でチップずれを生じた場合の輝度ムラのパターンと照度分布を示すデータである。This is data showing a luminance unevenness pattern and an illuminance distribution when a chip shift occurs in the comparative example. 実施例でチップずれを生じた場合の輝度ムラのパターンと照度分布を示すデータである。This is data showing a luminance unevenness pattern and an illuminance distribution when a chip shift occurs in the embodiment. 比較例で輝度ムラを生じた輝度パターン(a)と実際の発光の様子を示す写真(b)である。It is the photograph (b) which shows the brightness | luminance pattern (a) which produced the brightness nonuniformity in the comparative example, and the mode of actual light emission. 実施例における模式的な輝度パターン(a)と実際の発光の様子を示す写真(b)である。It is the photograph (b) which shows the typical brightness | luminance pattern (a) in an Example, and the mode of actual light emission. 本発明の実施の形態2〜5に係る各開口の構成を示す図である。It is a figure which shows the structure of each opening which concerns on Embodiment 2-5 of this invention. 本発明の実施の形態6に係る入光部42Aの構成を示す、入光部42A周辺の部分断面図である。It is a fragmentary sectional view around 42 A of light incident parts which shows the structure of 42 A of light incident parts which concern on Embodiment 6 of this invention. 従来の照明装置900の構成を示す断面図である。It is sectional drawing which shows the structure of the conventional illuminating device 900. FIG. 照明装置910における入光部946X周辺の部分断面図(a)と、照明装置910の課題を示す入光部946X周辺の部分断面図(b)である。They are a partial sectional view (a) around the light incident portion 946X in the lighting device 910 and a partial sectional view (b) around the light incident portion 946X showing the problem of the lighting device 910.

以下、本発明の各態様に係る照明装置について図面を参照しながら説明する。
<実施の形態1>
(LED照明装置100の構成)
LED照明装置100の構成及び設置例を示す一部断面図(図1)のように、LED照明装置100(以下、単に「装置100」と称する。)は、LED照明器具1と、板バネ状の掛止部材3と、照明器具1を点灯させる電源ユニット4とを備えてなる。照明器具1は配線23により電源ユニット4と電気接続されている。掛止部材3は照明器具1の背面側にあるベース10に取着される。実施の形態1では、装置100を天井に埋設するダウンライトとしている。
Hereinafter, lighting devices according to aspects of the present invention will be described with reference to the drawings.
<Embodiment 1>
(Configuration of LED lighting device 100)
As shown in the partial cross-sectional view (FIG. 1) showing the configuration and installation example of the LED lighting device 100, the LED lighting device 100 (hereinafter simply referred to as “device 100”) includes the LED lighting device 1 and a leaf spring shape. , And a power supply unit 4 for lighting the lighting fixture 1. The luminaire 1 is electrically connected to the power supply unit 4 by wiring 23. The latch member 3 is attached to the base 10 on the back side of the lighting fixture 1. In the first embodiment, the device 100 is a downlight embedded in the ceiling.

装置100を設置する際には、天井2に設けた貫通孔2aを介し、天井2の裏面2bに電源ユニット4を載置する。貫通孔2aに対し、照明器具1をベース10が収納されるように配置する。このとき貫通孔2aの周縁に掛止部材3を掛止させる。これにより装置100を天井2に設置できる。
LED照明器具1の外観構成と内部構成を示す図(図2)に示すように、LED照明器具1は、外観構成はおよそベース10と拡散カバー50とで構成される。ベース10の切欠部16からは配線23が外部に延出される。
When the apparatus 100 is installed, the power supply unit 4 is placed on the back surface 2 b of the ceiling 2 through the through hole 2 a provided in the ceiling 2. The lighting fixture 1 is arrange | positioned with respect to the through-hole 2a so that the base 10 may be accommodated. At this time, the latch member 3 is latched around the periphery of the through hole 2a. Thereby, the apparatus 100 can be installed on the ceiling 2.
As shown in a diagram (FIG. 2) showing an external configuration and an internal configuration of the LED lighting device 1, the external configuration of the LED lighting device 1 is roughly composed of a base 10 and a diffusion cover 50. A wiring 23 is extended from the notch 16 of the base 10 to the outside.

尚、図2中の点線は、内蔵されたLED実装基板20と、発光素子22と、基板本体21の位置を示す。
(LED照明器具1の構成)
照明器具1の内部構成を示す分解図(図3)に示すように、LED照明器具1(以下、単に「器具1」と称する。)は、ベース10と、LED実装基板20と、反射部材30と、導光板40と、拡散カバー50とを有してなる。器具1は円盤状の全体形状を有する。ベース10と、LED実装基板20と、反射部材30と、導光板40と、拡散カバー50の各外周形状は、照明器具1の全体形状に合わせて円形に形成される。
[ベース10]
ベース10は放熱特性に優れる材料、例えばアルミダイキャスト材料等の金属材料で構成される。ベース10は、中央側が深く周縁側が浅い二段底構造を有する本体部11と、本体部11の周囲に立設されたフランジ部12とを有する(図3)。フランジ部12には切欠部16が存在する。
Note that the dotted lines in FIG. 2 indicate the positions of the built-in LED mounting substrate 20, the light emitting element 22, and the substrate body 21.
(Configuration of LED lighting apparatus 1)
As shown in an exploded view (FIG. 3) showing the internal configuration of the lighting fixture 1, the LED lighting fixture 1 (hereinafter simply referred to as “the fixture 1”) includes a base 10, an LED mounting substrate 20, and a reflecting member 30. And a light guide plate 40 and a diffusion cover 50. The instrument 1 has a disk-like overall shape. Each outer peripheral shape of the base 10, the LED mounting substrate 20, the reflecting member 30, the light guide plate 40, and the diffusion cover 50 is formed in a circle according to the overall shape of the lighting fixture 1.
[Base 10]
The base 10 is made of a material having excellent heat dissipation characteristics, for example, a metal material such as an aluminum die-cast material. The base 10 has a main body part 11 having a two-step bottom structure with a deep center side and a shallow peripheral edge side, and a flange part 12 erected around the main body part 11 (FIG. 3). The flange portion 12 has a notch portion 16.

本体部11は、その中央側から周縁側に向けて、底が深い円盤状の内側底部13と、底が浅い内側底部13と、内側底部13の周縁に立設された側壁部14と、側壁部14の周囲に配された環状の外側底部15とを有する。
内側底部13にはLED実装基板20と反射部材30とが順次重ねて載置される。外側底部15には導光板40の外側導光部43が載置される。
The main body 11 has a disk-shaped inner bottom 13 with a deep bottom, an inner bottom 13 with a shallow bottom, a side wall 14 erected on the periphery of the inner bottom 13, And an annular outer bottom portion 15 disposed around the portion 14.
The LED mounting substrate 20 and the reflecting member 30 are sequentially stacked on the inner bottom portion 13. The outer light guide 43 of the light guide plate 40 is placed on the outer bottom 15.

フランジ部12はそのZ方向頂部付近において、拡散カバー50の側壁部52と例えば接着剤やシール部材を用いて接合される。
[LED実装基板20]
LED実装基板20は、環状の基板本体21と、基板本体21の表面(図3では反射部材30と対向する上面)に実装された複数の発光素子22と、配線23とを有する。
The flange portion 12 is joined to the side wall portion 52 of the diffusion cover 50 using, for example, an adhesive or a seal member, in the vicinity of the top portion in the Z direction.
[LED mounting board 20]
The LED mounting substrate 20 includes an annular substrate body 21, a plurality of light emitting elements 22 mounted on the surface of the substrate body 21 (an upper surface facing the reflecting member 30 in FIG. 3), and wirings 23.

基板本体21は、例えば、セラミック材料や熱伝導樹脂等からなる絶縁層と、アルミニウム等からなる金属層とを積層した2層構造を有する。基板本体21の表面には発光素子22と配線23とを電気接続するための配線パターン(不図示)が形成されている。基板本体21の外径は側壁部14の内径とほぼ一致させている。
発光素子22は、一例としてLED素子を用いてなる。入光部42周辺の構成を示す部分断面図(図7)に示すように、具体的構成として、発光素子22は素子本体220と、素子本体220を収納する素子筐体221とを有する。発光素子22は、基板本体21の上面に対し、主な出射方向が垂直(Z)方向を向くように、互いに一定間隔をおいて円周状に実装される。LED実装基板20では、一例として合計18個の発光素子22が配線パターンに対し、COB(Chip on Board)技術を用いてフェイスアップ実装される。
The substrate body 21 has, for example, a two-layer structure in which an insulating layer made of a ceramic material or a heat conductive resin and a metal layer made of aluminum or the like are laminated. A wiring pattern (not shown) for electrically connecting the light emitting element 22 and the wiring 23 is formed on the surface of the substrate body 21. The outer diameter of the substrate body 21 is substantially matched with the inner diameter of the side wall portion 14.
The light emitting element 22 uses an LED element as an example. As shown in a partial sectional view (FIG. 7) showing the configuration around the light incident portion 42, as a specific configuration, the light emitting element 22 includes an element main body 220 and an element housing 221 that houses the element main body 220. The light-emitting elements 22 are mounted circumferentially at a constant interval so that the main emission direction faces the vertical (Z) direction with respect to the upper surface of the substrate body 21. In the LED mounting substrate 20, for example, a total of 18 light emitting elements 22 are mounted face-up on a wiring pattern using a COB (Chip on Board) technique.

尚、基板本体21の上面は、発光素子22の出射光を効率良く導光板40側へ反射させるために反射面となっている。
配線23は、電源ユニット4側より発光素子22に電力供給を行うために用いられる。配線23の両端は、基板本体21の配線パターンと、電源ユニット4とに電気接続される。
[反射部材30]
反射部材30は、発光素子22からの出射光と導光板40から漏れ出た光とを効率よく導光板40側に反射する目的で配設する、板状部材である。器具1において、反射部材30はLED実装基板20と導光板40との間に挟設される。反射部材30は、高反射特性を有する材料、例えば高光反射性ポリブチレンテレフタレート(PBT)樹脂、高反射ポリカーボネート(PC)樹脂、高光反射性ナイロン樹脂、高光反射性発泡樹脂等を用いて構成される。これらの樹脂材料を用いて反射部材30を射出成形することで、高精度で反射部材30を構成することができる。反射部材30は、少なくともその表面において反射特性を有していれば良い。
The upper surface of the substrate body 21 is a reflecting surface for efficiently reflecting the emitted light of the light emitting element 22 toward the light guide plate 40 side.
The wiring 23 is used to supply power to the light emitting element 22 from the power supply unit 4 side. Both ends of the wiring 23 are electrically connected to the wiring pattern of the substrate body 21 and the power supply unit 4.
[Reflection member 30]
The reflection member 30 is a plate-like member that is disposed for the purpose of efficiently reflecting the light emitted from the light emitting element 22 and the light leaking from the light guide plate 40 toward the light guide plate 40. In the instrument 1, the reflective member 30 is sandwiched between the LED mounting substrate 20 and the light guide plate 40. The reflection member 30 is configured using a material having high reflection characteristics, for example, a high light reflection polybutylene terephthalate (PBT) resin, a high reflection polycarbonate (PC) resin, a high light reflection nylon resin, a high light reflection foamed resin, or the like. . By reflecting and molding the reflecting member 30 using these resin materials, the reflecting member 30 can be configured with high accuracy. The reflection member 30 should just have a reflective characteristic in the surface at least.

器具1の部分斜視断面図(図4)と、反射部材30の部分斜視断面図(図5)と、反射部材30の上面図(図6(a))及び下面図(図6(b))にそれぞれ示すように、反射部材30は中央側から外側に向けて、内側反射部31と、凹入部32と、外側反射部33とを有する。反射部材30の外径は側壁部14の内径とほぼ一致させている。内側反射部31と外側反射部33とはそれぞれ上面310、320を有する(図5)。   Partial perspective sectional view of the instrument 1 (FIG. 4), partial perspective sectional view of the reflecting member 30 (FIG. 5), a top view of the reflecting member 30 (FIG. 6A) and a bottom view (FIG. 6B) As shown in FIG. 6, the reflecting member 30 includes an inner reflecting portion 31, a recessed portion 32, and an outer reflecting portion 33 from the center side toward the outer side. The outer diameter of the reflecting member 30 is substantially matched with the inner diameter of the side wall portion 14. The inner reflection part 31 and the outer reflection part 33 have upper surfaces 310 and 320, respectively (FIG. 5).

内側反射部31(外側反射部33)は、LED実装基板20の発光素子22の実装位置より内側(外側)の位置に対応して設けられる(図4)。内側反射部31(外側反射部33)は、導光板40より漏れた光を、上面310(320)において再度、導光板40側に反射させるための部位である。
凹入部32は、LED実装基板20における各発光素子22の実装位置の真上に対応する領域に設けられる。反射部材30を平面視する際、凹入部32は、反射部材30の上面(導光板40との対向面)における一定半径の円周領域を厚み(Z)方向に凹入させてなる(図5)。
The inner reflection part 31 (outer reflection part 33) is provided corresponding to a position on the inner side (outer side) than the mounting position of the light emitting element 22 of the LED mounting substrate 20 (FIG. 4). The inner reflection part 31 (outer reflection part 33) is a part for reflecting light leaking from the light guide plate 40 to the light guide plate 40 side again on the upper surface 310 (320).
The recessed portion 32 is provided in a region corresponding to the position immediately above the mounting position of each light emitting element 22 on the LED mounting substrate 20. When the reflecting member 30 is viewed in plan, the recessed portion 32 is formed by recessed a circumferential region having a constant radius on the upper surface of the reflecting member 30 (the surface facing the light guide plate 40) in the thickness (Z) direction (FIG. 5). ).

凹入部32の内部には図5、図6(a)、図6(b)に示すように、その円周方向に沿って、反射部材30の厚み方向に貫通する複数の開口34が一定間隔をおいて存在する。開口34は、第1開口部340と、第1開口部340に連通する一対の第2開口部341とを有する。1の開口34において、第1開口部340と一対の第2開口部341とは、反射部材30の直径を通る第1方向(例えばY方向)に対して交差する第2方向(例えばY方向と直交するX方向)で連通している。   As shown in FIGS. 5, 6 (a), and 6 (b), a plurality of openings 34 penetrating in the thickness direction of the reflecting member 30 are arranged along the circumferential direction inside the recessed portion 32. Exist. The opening 34 has a first opening 340 and a pair of second openings 341 communicating with the first opening 340. In one opening 34, the first opening 340 and the pair of second openings 341 intersect a second direction (for example, the Y direction) that intersects a first direction (for example, the Y direction) passing through the diameter of the reflecting member 30. (X direction orthogonal to each other).

ここで反射部材30を平面視する際、第1開口部340の最大径は、第2開口部の最小径よりも小さい(図5(a))。従って開口34は、第1開口部340で径が小さく、一対の第2開口部341で径が大きい、いわゆる瓢箪型の周縁形状を有する。
第1開口部340は、LED実装基板20の発光素子22の実装位置の真上に存在する。第1開口部340では、Y方向に沿って、周縁端部342A、343Aが比較的狭い開口幅W2をおいて互いに近接される(図7)。これは第1開口部340において、発光素子22の出射光量が過度にならないように適切に制御し、導光板40側に導光するように設定したものである。Y方向に沿って第1開口部340を挟む両側には、発光素子22の出射光を反射する一対の側壁342、343が存在する。側壁342、343は図7に示すように、Y方向に沿って、第1開口部340の周縁端部342A、343Aよりも外側に存在している。これにより、導光板40の入光部42と側壁342、343との間に凹入部32の空間が確保される。周縁端部342A、343Aは、例えばYZ方向の断面形状がR=0.2程度の曲面断面形状を有するように形成されている。
Here, when the reflecting member 30 is viewed in plan, the maximum diameter of the first opening 340 is smaller than the minimum diameter of the second opening (FIG. 5A). Therefore, the opening 34 has a so-called bowl-shaped peripheral shape in which the first opening 340 has a small diameter and the pair of second openings 341 has a large diameter.
The first opening 340 exists immediately above the mounting position of the light emitting element 22 of the LED mounting substrate 20. In the first opening 340, along the Y direction, the peripheral edge 342A, 343A are close to each other at a relatively narrow opening width W 2 (Figure 7). This is set so as to guide the light to the light guide plate 40 side in the first opening 340 appropriately controlled so that the amount of light emitted from the light emitting element 22 does not become excessive. On both sides of the first opening 340 along the Y direction, there are a pair of side walls 342 and 343 that reflect the emitted light of the light emitting element 22. As shown in FIG. 7, the side walls 342 and 343 exist outside the peripheral edge portions 342A and 343A of the first opening 340 along the Y direction. Thereby, the space of the recessed portion 32 is ensured between the light incident portion 42 of the light guide plate 40 and the side walls 342 and 343. The peripheral edge portions 342A and 343A are formed to have a curved cross-sectional shape with a cross-sectional shape in the YZ direction of about R = 0.2, for example.

第2開口部341は、発光素子22からの出射光を発光素子22より遠い領域にも効率よく拡散させるために存在する。反射部材30を平面視する際、第2開口部341の幅は第1開口部340との連通方向と交差する方向において、第1開口部340から遠ざかるにつれて増大するように設定されている(図5(a))。
尚、図6(b)に示すように、反射部材30の裏面はLED実装基板20の基板本体21の表面形状に合わせた平坦面としている。
[導光板40]
導光板40は、発光素子22の出射光を主としてXY平面方向に導光し、拡散カバー50(Z方向)側に面発光させるために用いる。導光板40は、反射部材30のLED実装基板20との対向側とは反対側に配置される。導光板40の材料としては透光性に優れる材料、例えばアクリル樹脂、ポリカーボネート樹脂、ポリスチレン樹脂、ガラス等を挙げられる。これらの材料を用いて導光板40を射出成形することで、反射部材30と同様に、高精度で導光板40を構成できる。従って、反射部材30と導光板40との配置関係では位置ずれ誤差を無視できる程度に小さくできる。導光板40は中央側から外側に向けて、内側導光部41と、入光部42と、外側導光部43とを有する(図3)。導光板40の外径は側壁部14の内径とほぼ一致させている。導光板40では一例として、内側導光部41、外側導光部43の各外表面が同じ高さに設定される(図4)。また、内側導光部41、外側導光部43の厚みも同一に設定されている。
The second opening 341 is present in order to efficiently diffuse the light emitted from the light emitting element 22 to a region far from the light emitting element 22. When the reflecting member 30 is viewed in plan, the width of the second opening 341 is set to increase as the distance from the first opening 340 increases in the direction intersecting the direction of communication with the first opening 340 (see FIG. 5 (a)).
As shown in FIG. 6B, the back surface of the reflecting member 30 is a flat surface that matches the surface shape of the substrate body 21 of the LED mounting substrate 20.
[Light guide plate 40]
The light guide plate 40 is used to guide light emitted from the light emitting element 22 mainly in the XY plane direction and to emit light to the diffusion cover 50 (Z direction) side. The light guide plate 40 is disposed on the opposite side of the reflecting member 30 from the side facing the LED mounting substrate 20. Examples of the material of the light guide plate 40 include materials having excellent translucency, such as acrylic resin, polycarbonate resin, polystyrene resin, and glass. By injection-molding the light guide plate 40 using these materials, the light guide plate 40 can be configured with high accuracy in the same manner as the reflecting member 30. Accordingly, the positional relationship between the reflecting member 30 and the light guide plate 40 can be reduced to such an extent that the misalignment error can be ignored. The light guide plate 40 includes an inner light guide part 41, a light incident part 42, and an outer light guide part 43 from the center side toward the outer side (FIG. 3). The outer diameter of the light guide plate 40 is substantially matched with the inner diameter of the side wall portion 14. In the light guide plate 40, as an example, the outer surfaces of the inner light guide part 41 and the outer light guide part 43 are set to the same height (FIG. 4). The thicknesses of the inner light guide 41 and the outer light guide 43 are also set to be the same.

内側導光部41(外側導光部43)は、入光部42より導光板40の内部に入射された発光素子22の光を発光素子22の実装位置よりも内側(外側)に導光し、拡散させる部位である。
入光部42は、発光素子22の出射光を導光板40側に導光させる部位である。器具1において、入光部42は反射部材30の凹入部32に挿入される(図4)。これにより入光部42は、LED実装基板20上の各発光素子22の実装位置を結ぶように連続的に形成される。具体的な構成として、入光部42は図7に示すように、素子対向部420と、一対の傾斜部422A、422Bと、一対の傾斜部422A、422B間に存在する境界部423とを有する。入光部42は、全体的な形状としては図4、図7に示すように、一定の厚みを持つ略V字断面形状を有する。Y方向に沿った入光部420の両側には、傾斜部422A、422Bと反対側に、傾斜部422A、422Bと同様の傾斜面を有する側面部424A、424Bが存在する(図7)。
The inner light guide 41 (outer light guide 43) guides the light of the light emitting element 22 that has entered the light guide plate 40 from the light incident part 42 to the inner side (outer side) of the mounting position of the light emitting element 22. It is a site to diffuse.
The light incident part 42 is a part that guides the emitted light of the light emitting element 22 to the light guide plate 40 side. In the instrument 1, the light incident portion 42 is inserted into the recessed portion 32 of the reflecting member 30 (FIG. 4). Thereby, the light incident part 42 is continuously formed so as to connect the mounting positions of the light emitting elements 22 on the LED mounting substrate 20. As a specific configuration, as shown in FIG. 7, the light incident portion 42 includes an element facing portion 420, a pair of inclined portions 422A and 422B, and a boundary portion 423 existing between the pair of inclined portions 422A and 422B. . As shown in FIGS. 4 and 7, the light incident portion 42 has a substantially V-shaped cross-sectional shape having a certain thickness as shown in FIGS. 4 and 7. Side surfaces 424A and 424B having inclined surfaces similar to the inclined portions 422A and 422B exist on the opposite sides of the inclined portions 422A and 422B on both sides of the light incident portion 420 along the Y direction (FIG. 7).

素子対向部420は、発光素子22と近接配置され、且つ、発光素子22の出射面と対向配置される部位である。発光素子22と対向する素子対向部420の表面形状は、ここでは一例として平坦面としている。従って素子対向部420はY方向に沿って、幅W1を挟んで両側に位置する端部(入光端部420A、420B)を有する(図7)。
一対の傾斜部422A、422Bは、導光板40において、素子対向部420が形成された面と反対側の面(図7では上面)に配設される。傾斜部422A、422Bは、具体的には垂直(Z)方向に対し、素子対向部420より遠ざかるにつれて滑らかに傾斜角度が増大する傾斜面を有する。さらに傾斜部422A、422Bは、垂直(Z)方向に対して互いに略線対称の形状を有する。傾斜部422A、422Bは上記のような傾斜面を有することで、素子対向部420より直上(Z)方向に沿って入射した入射光をその表面において正反射させ、導光板40内に効率よく導光させることができる。
The element facing portion 420 is a part that is disposed in proximity to the light emitting element 22 and is disposed to face the emission surface of the light emitting element 22. The surface shape of the element facing portion 420 facing the light emitting element 22 is a flat surface as an example here. Accordingly element facing portion 420 along the Y direction, having an end positioned on both sides of the width W 1 (light input end 420A, 420B) (Fig. 7).
The pair of inclined portions 422A and 422B are disposed on the surface of the light guide plate 40 opposite to the surface on which the element facing portion 420 is formed (upper surface in FIG. 7). Specifically, the inclined portions 422A and 422B have inclined surfaces in which the inclination angle smoothly increases with increasing distance from the element facing portion 420 in the vertical (Z) direction. Further, the inclined portions 422A and 422B have shapes that are substantially line symmetrical with respect to the vertical (Z) direction. The inclined portions 422A and 422B have the inclined surfaces as described above, so that incident light incident along the (Z) direction directly above the element facing portion 420 is regularly reflected on the surface thereof and efficiently guided into the light guide plate 40. Can be lighted.

境界部423は傾斜部422A、422Bの間において、発光素子22の実装位置の真上に対応して存在する微小領域である。導光板40では境界部423のサイズをできるだけ小さくしている。これにより、装置100の駆動時に発光素子22からの出射光が境界部423を突き抜けて直接光となりにくいように調整されている。
ここで装置100の特徴として、導光板40を平面視する際、LED実装基板20の表面に沿った第1(Y)方向において、素子対向部420の両端部(入光端部420A、420B)間の幅W1が開口34の開口幅W2よりも大きく設定される(図7)。さらに第1(Y)方向において、開口34の周縁端部342A、343Aが入光端部420A、420Bよりも内側に位置している。すなわち器具1では、導光板40と反射部材30とを垂直(Z)方向から見ると、第1開口部340が素子対向部420で完全に覆われている。
The boundary portion 423 is a minute region that exists between the inclined portions 422A and 422B in correspondence with the mounting position of the light emitting element 22. In the light guide plate 40, the size of the boundary portion 423 is made as small as possible. Thus, the light emitted from the light emitting element 22 is adjusted so as not to directly pass through the boundary portion 423 when the device 100 is driven.
Here, as a feature of the device 100, when the light guide plate 40 is viewed in plan, both end portions (light incident end portions 420A and 420B) of the element facing portion 420 in the first (Y) direction along the surface of the LED mounting substrate 20 are used. The width W 1 between them is set larger than the opening width W 2 of the opening 34 (FIG. 7). Further, in the first (Y) direction, the peripheral edge portions 342A and 343A of the opening 34 are located inside the light incident end portions 420A and 420B. That is, in the instrument 1, when the light guide plate 40 and the reflection member 30 are viewed from the vertical (Z) direction, the first opening 340 is completely covered with the element facing portion 420.

また側壁342、343の配置位置は、Y方向に沿って、第1開口部340の周縁端部342A、343Aのうちの一方と、これに近接する入光端部420A、420Bのうちの一方とに接する直線上に存在するように設定されている(図9(a)の出射光L2、L4を参照)。
[拡散カバー50]
拡散カバー50は、導光板40からの出射光をさらに散乱させることにより均一な輝度分布の面発光を得る目的で配設する。拡散カバー50は透光性材料、例えばシリコーン樹脂、アクリル樹脂、ポリカーボネート樹脂、ガラス等を用いて構成される。
Further, the side walls 342 and 343 are arranged along the Y direction with one of the peripheral edge portions 342A and 343A of the first opening 340 and one of the light incident end portions 420A and 420B adjacent thereto. (See the outgoing lights L 2 and L 4 in FIG. 9A).
[Diffusion cover 50]
The diffusion cover 50 is disposed for the purpose of obtaining surface light emission with a uniform luminance distribution by further scattering the light emitted from the light guide plate 40. The diffusion cover 50 is configured using a translucent material such as a silicone resin, an acrylic resin, a polycarbonate resin, or glass.

具体的構成として、拡散カバー50は導光板40を覆う本体部51と、本体部51の周縁に配された側壁部52とを有する(図3)。
本体部51には光散乱処理が施され、導光板40からの出射光を効率よく散乱するように調整される。光散乱処理としては、例えば導光板40と対向する本体部51の表面を微細に凹凸処理することが挙げられる。
(装置100の動作)
以上の構成を有する装置100をユーザが使用する際は、装置100に電源投入する。装置100では、商業用電源に接続された電源ユニット4から配線23を介して各発光素子22に電力供給がなされる。これにより各発光素子22から出射光が生ずる。
As a specific configuration, the diffusion cover 50 includes a main body 51 that covers the light guide plate 40 and a side wall 52 that is disposed on the periphery of the main body 51 (FIG. 3).
The main body 51 is subjected to a light scattering process, and is adjusted so as to efficiently scatter the light emitted from the light guide plate 40. As the light scattering treatment, for example, the surface of the main body 51 that faces the light guide plate 40 is subjected to fine uneven processing.
(Operation of apparatus 100)
When the user uses the apparatus 100 having the above configuration, the apparatus 100 is powered on. In the apparatus 100, power is supplied to each light emitting element 22 through the wiring 23 from the power supply unit 4 connected to a commercial power supply. Thereby, outgoing light is generated from each light emitting element 22.

発光素子22の出射光は、反射部材30の第1開口部340、第2開口部341を介し、入光部42より導光板40の内部に入射する。入射光は導光板40の内部で正反射を繰り返し、内側導光部41と外側導光部43の両方の内部に拡散する。また、導光板40より下方に漏れ出た光は反射部材30の上面310、320(図5)において反射され、再度、導光板40側に入射される。導光板40で拡散された発光素子22の出射光は、導光板40の上面側から出射されて拡散カバー50に入射される。入射光は光散乱処理された拡散カバー50の本体部51でさらに拡散され、最終的に照明光として外部に出射される。
(装置100で奏される効果)
装置100を駆動させた場合、以下に挙げる諸効果を期待することができる。
[1]発光素子22のチップずれに対する効果
(i)具体的効果
図8は、装置100で発光素子22の実装位置がY方向にチップずれを生じた場合に奏される効果を説明するための断面図である。
The light emitted from the light emitting element 22 enters the light guide plate 40 from the light incident portion 42 through the first opening 340 and the second opening 341 of the reflecting member 30. Incident light repeats regular reflection inside the light guide plate 40 and diffuses into both the inner light guide 41 and the outer light guide 43. Further, the light leaking downward from the light guide plate 40 is reflected on the upper surfaces 310 and 320 (FIG. 5) of the reflecting member 30 and is incident on the light guide plate 40 side again. The light emitted from the light emitting element 22 diffused by the light guide plate 40 is emitted from the upper surface side of the light guide plate 40 and enters the diffusion cover 50. Incident light is further diffused by the main body 51 of the diffusion cover 50 that has been subjected to light scattering treatment, and finally emitted as illumination light to the outside.
(Effects produced by the apparatus 100)
When the apparatus 100 is driven, the following effects can be expected.
[1] Effect on Chip Deviation of Light-Emitting Element 22 (i) Specific Effect FIG. 8 is a diagram for explaining an effect exhibited when the mounting position of the light-emitting element 22 occurs in the Y direction in the apparatus 100. It is sectional drawing.

通常、LED実装基板20において発光素子22を基板本体21に実装する際には、チップずれを生じることがある。現状では、Y方向の発光素子22の全長が1.5mm程度である場合、±0.4mm程度の範囲のチップずれを生じうる。
チップずれを生じると、すれた方向に向かって入光部42に対する発光素子22の相対位置もずれを生じる。従って、垂直(Z)方向に対する傾斜角度が比較低大きい領域(素子対向部420より遠い領域)の傾斜部422A、422Bに向かって、入光部42を介さず、且つ側壁342、343で反射しないで導光板42に入射しようとする高強度の発光素子22の出射光が増える。図8ではY方向にチップずれを生じた発光素子22から、傾斜部422Bに向かって出射光(点線)が出射された様子を示している。
Usually, when the light emitting element 22 is mounted on the substrate body 21 in the LED mounting substrate 20, chip displacement may occur. At present, when the total length of the light emitting element 22 in the Y direction is about 1.5 mm, a chip shift in a range of about ± 0.4 mm can occur.
When the chip shift occurs, the relative position of the light emitting element 22 with respect to the light incident portion 42 also shifts in the direction of the slip. Therefore, the light does not pass through the light incident portion 42 and is not reflected by the side walls 342 and 343 toward the inclined portions 422A and 422B in the regions where the inclination angle with respect to the vertical (Z) direction is relatively low (region far from the element facing portion 420). As a result, the light emitted from the high-intensity light-emitting element 22 entering the light guide plate 42 increases. FIG. 8 shows a state in which emitted light (dotted line) is emitted toward the inclined portion 422B from the light emitting element 22 in which the chip is displaced in the Y direction.

ここで仮に、図8に示す点線に沿って、入光部42を介さず、且つ側壁342、343で反射しないで高強度の出射光L8が傾斜部422Bに入射されてしまうと、傾斜部422Bに対する入射角が大きいために、出射光L8は傾斜部422Bを突き抜ける高輝度の直接光となり、外部に出射される場合がある。よって、器具1の発光面で輝度ムラを生じる原因となることが想定される。 If the high-intensity outgoing light L 8 is incident on the inclined portion 422B along the dotted line shown in FIG. 8 without passing through the light incident portion 42 and not reflected by the side walls 342 and 343, the inclined portion due to the large angle of incidence on 422B, the outgoing light L 8 will direct high-luminance light penetrating the inclined portion 422B, which may be emitted to the outside. Therefore, it is assumed that brightness unevenness is caused on the light emitting surface of the instrument 1.

これに対し器具1では、発光素子22より垂直(Z)方向に出射された出射光L8は、入光端部420A、420B間の幅W1より狭い開口幅W2を持つ第1開口部340の周縁端部343Aによって遮蔽される(図7、図8)。これにより、たとえ発光素子22がY方向にチップずれを生じていても、入光部42を介さず、且つ側壁342、343で反射しない高強度の出射光L8が傾斜部422Bに到達するのが抑制される。従って出射光L8が傾斜部422Bを突き抜け、高輝度の直接光となって外部に出射されるのを防止できる。 On the other hand, in the instrument 1, the emitted light L 8 emitted from the light emitting element 22 in the vertical (Z) direction has a first opening portion having an opening width W 2 narrower than the width W 1 between the light incident end portions 420A and 420B. It is shielded by the peripheral edge 343A of 340 (FIGS. 7 and 8). As a result, even if the light emitting element 22 is displaced in the Y direction, the high-intensity outgoing light L 8 that does not pass through the light incident part 42 and is not reflected by the side walls 342 and 343 reaches the inclined part 422B. Is suppressed. Therefore, it is possible to prevent the emitted light L 8 from penetrating the inclined portion 422B and being emitted to the outside as high-intensity direct light.

尚、図8では図示しないが、逆Y方向にチップずれを生じた場合でも、発光素子22から入光部420より外側に出射された出射光は周縁端部342Aによって遮蔽される。これにより、上記と同様の効果を奏する。
このように器具1では、Y方向または逆Y方向に沿って発光素子22の実装位置がチップずれを生じた場合でも、傾斜部422A、422Bを突き抜けて外部に出射される高輝度の直接光の発生を防止できる。
Although not shown in FIG. 8, even when a chip shift occurs in the reverse Y direction, the emitted light emitted from the light emitting element 22 to the outside of the light incident part 420 is shielded by the peripheral edge part 342A. Thereby, there exists an effect similar to the above.
As described above, in the instrument 1, even when the mounting position of the light emitting element 22 is displaced along the Y direction or the reverse Y direction, the high-luminance direct light emitted through the inclined portions 422A and 422B is emitted to the outside. Occurrence can be prevented.

また図8には図示しないが、側壁342、343で反射された反射光が入光部420以外の領域より導光板40に入射され、導光板40を突き抜けて外部に出射されることがある(図17(a)の光L13、図17(b)の光L15を参照)。しかしながら、このような光は側壁342、343での反射の際に拡散されるため強度が弱い。従って輝度ムラの原因にはなりにくい。 Although not shown in FIG. 8, the reflected light reflected by the side walls 342 and 343 may enter the light guide plate 40 from a region other than the light incident portion 420 and may pass through the light guide plate 40 and be emitted to the outside ( (See the light L 13 in FIG. 17A and the light L 15 in FIG. 17B). However, since such light is diffused when reflected by the side walls 342 and 343, the intensity is weak. Therefore, it is difficult to cause uneven brightness.

尚、チップずれを生じた場合でも、周縁端部342A、343Aで遮蔽されない発光素子22から出射光(図8中のL5、L6、L7を含む)は、第1開口部340を介して入光部42周辺より導光板40に適切に入射し、内側導光部41及び外側導光部43に導光されて発光に寄与される。結果として、輝度ムラの発生を抑えて均一な面発光を期待できる照明装置100を実現することができる。
(ii)性能確認試験
装置100を実施例として実際に作製し、意図的に一定間隔でチップずれを生じさせた場合に発生する輝度ムラのパターンとそのときの照度分布について性能確認試験を行った。
Even when the chip is displaced, the emitted light (including L 5 , L 6 , and L 7 in FIG. 8) from the light emitting element 22 that is not shielded by the peripheral edge portions 342A and 343A passes through the first opening 340. Then, the light is appropriately incident on the light guide plate 40 from the periphery of the light incident portion 42, and is guided to the inner light guide portion 41 and the outer light guide portion 43 to contribute to light emission. As a result, it is possible to realize the illumination device 100 that can suppress the occurrence of uneven brightness and can expect uniform surface light emission.
(Ii) Performance Confirmation Test The apparatus 100 was actually manufactured as an example, and a performance confirmation test was performed with respect to a pattern of luminance unevenness generated when a chip shift was intentionally generated at a constant interval and an illuminance distribution at that time. .

また実施例と対比するため、図17(a)の照明装置910に示すように、入光部946Xと発光素子922とが開口34を介さずに対向配置された構成であって、その他の構成は実施例と同様の装置を比較例として作製した。
実施例と比較例のチップずれは、LED実装基板を平面視した際、発光素子の実装位置を基準位置より内側に、−0.1mm、−0.3mm、−0.5mmのいずれかのずれ量でずらした場合と、基準位置より外側に、+0.1mm、+0.3mm、+0.5mmのいずれかのずれ量でずらした場合とに設定した。各数値での位置ずれは、LED実装基板上の全発光素子を対象として設定した。実施例と比較例の各装置は同一条件にて駆動させた。この確認試験結果を図10、図11に示す。
For comparison with the embodiment, as shown in the illumination device 910 in FIG. 17A, the light incident portion 946X and the light emitting element 922 are arranged to face each other without the opening 34. A device similar to the example was prepared as a comparative example.
The chip deviation between the example and the comparative example is any deviation of -0.1 mm, -0.3 mm, or -0.5 mm when the LED mounting substrate is viewed in plan, with the mounting position of the light emitting element inward from the reference position. It was set when shifting by the amount and when shifting by any of +0.1 mm, +0.3 mm, and +0.5 mm outside the reference position. The positional deviation at each numerical value was set for all the light emitting elements on the LED mounting substrate. The devices of the example and the comparative example were driven under the same conditions. The confirmation test results are shown in FIGS.

図10と図11は同順に、比較例と実施例において、チップずれを生じた場合の輝度ムラのパターンと、そのときの照度分布を示す。各図中の輝度ムラのパターンは、いずれも装置の発光面を正面から撮影した写真で示している。また照度分布は、発光面の半径方向の相対強度分布を示している。
試験結果を見ると、比較例では図10に示すように、基準位置に対してLED実装基板の内側及び外側のいずれの方向にチップずれを生じる場合でも、ずれ量が多いほど照度分布が不均一になった。照度分布が不均一になることは、面発光における輝度ムラが発生しうることを意味する。また、ずれ量が多いほど、照度分布に不要な高輝度のピークが発生し易い傾向が見られた(例えばチップずれが−0.5mm、+0.5mmのデータを参照)。また、比較例の装置の発光面を正面から見た場合、チップずれが発生すると発光領域が大きく変化した。ずれ量の増大に従い、発光面の中央領域が縮小して輝度が不足することが確認された。さらに、ずれ量の増大に伴って、発光面の周縁にリング状の高輝度領域が発生し、輝度ムラが顕著になるのを確認した。尚、発光面における高輝度の輝度ムラの位置と、照度分布のピークの位置は互いに一致している。
FIG. 10 and FIG. 11 show the luminance unevenness pattern and the illuminance distribution at that time when chip displacement occurs in the comparative example and the example in the same order. Each of the uneven brightness patterns in each figure is shown by a photograph taken from the front of the light emitting surface of the apparatus. The illuminance distribution indicates the relative intensity distribution in the radial direction of the light emitting surface.
Looking at the test results, in the comparative example, as shown in FIG. 10, the illuminance distribution becomes more uneven as the amount of deviation increases even if the chip deviation occurs in either the inside or outside direction of the LED mounting substrate with respect to the reference position. Became. When the illuminance distribution becomes non-uniform, it means that uneven brightness in surface light emission can occur. Further, there was a tendency that as the deviation amount was larger, an unnecessary high-brightness peak was generated in the illuminance distribution (for example, refer to data with a chip deviation of −0.5 mm and +0.5 mm). In addition, when the light emitting surface of the device of the comparative example was viewed from the front, the light emitting region changed greatly when chip displacement occurred. It was confirmed that the central area of the light emitting surface was reduced and the luminance was insufficient as the amount of deviation increased. Furthermore, it was confirmed that a ring-shaped high luminance region was generated at the periphery of the light emitting surface as the deviation amount increased, and luminance unevenness became remarkable. Note that the position of the high luminance unevenness on the light emitting surface and the position of the peak of the illuminance distribution coincide with each other.

これに対し実施例では、図11に示すように、基準位置に対してLED実装基板の内側及び外側のいずれの方向にチップずれを生じる場合でも、照度分布に生じる輝度ムラが比較例に比べて小さいことが確認された。装置の発光面を正面から見た場合、ずれ量に伴う発光領域の変化は適切に抑制されている。尚、チップずれが非常に増大すると若干の輝度ムラが見られるが、総じて比較例に比べると格段に均一な面発光が実現されることが分かった。   On the other hand, in the embodiment, as shown in FIG. 11, the luminance unevenness generated in the illuminance distribution is larger than that in the comparative example even when the chip shift occurs in any direction inside or outside the LED mounting substrate with respect to the reference position. It was confirmed to be small. When the light emitting surface of the device is viewed from the front, the change in the light emitting region due to the amount of deviation is appropriately suppressed. It should be noted that when the chip deviation is greatly increased, a slight luminance unevenness is observed, but it has been found that, as a whole, much more uniform surface light emission is realized as compared with the comparative example.

以上の結果より、比較例に対する実施例の優位性を確認することができた。
[2]第1開口部340による効果
装置100では、発光素子22の出射光が第1開口部340を通過する際、狭い幅W2を有する第1開口部340の周縁端部342A、343Aで出射光が部分的に遮蔽される(図7)。これにより発光素子22の実装位置から第1開口部340を通過する出射光量が過度にならないように規制される。
From the above results, the superiority of the example over the comparative example could be confirmed.
[2] In effect device 100 according to the first opening 340, when the light emitted from the light emitting element 22 passes through the first opening 340, the peripheral edge of the first opening 340 342A having a width W 2, in 343A The emitted light is partially blocked (FIG. 7). Thereby, the emitted light quantity which passes the 1st opening part 340 from the mounting position of the light emitting element 22 is controlled so that it may not become excessive.

よって、器具1を正面から見た場合、発光素子22の実装位置からは適切に出射光量が規制される。結果として、拡散カバー50の外表面では発光素子22の実装位置に対応する領域と、それ以外の位置に対応する領域における輝度分布ムラが抑えられ、良好な面発光の実現に寄与することができる。
[3]側壁342、343と周縁端部342A、343Aと入光端部420A、420Bによる効果
装置100では、入光端部420A(420B)と周縁端部342A(343A)との間を通過する発光素子22の出射光(以下、「通過光」と称する。)は、全て反射部材30の側壁342、343の表面で反射され、その後に導光板40の入光部42に入光される(図9(a))。このときに奏される効果を、入光部42周辺の部分断面図(図9(a))と、発光素子22の拡大断面図(図9(b))とを用いて説明する。
Therefore, when the instrument 1 is viewed from the front, the amount of emitted light is appropriately regulated from the mounting position of the light emitting element 22. As a result, the luminance distribution unevenness in the region corresponding to the mounting position of the light emitting element 22 and the region corresponding to the other position on the outer surface of the diffusion cover 50 is suppressed, which can contribute to the realization of good surface light emission. .
[3] Effects of the side walls 342 and 343, the peripheral edge portions 342A and 343A, and the light incident end portions 420A and 420B The apparatus 100 passes between the light incident end portion 420A (420B) and the peripheral edge portion 342A (343A). The light emitted from the light emitting element 22 (hereinafter referred to as “passing light”) is all reflected by the surfaces of the side walls 342 and 343 of the reflecting member 30 and then enters the light incident portion 42 of the light guide plate 40 ( FIG. 9A). The effect exhibited at this time will be described with reference to a partial sectional view around the light incident portion 42 (FIG. 9A) and an enlarged sectional view of the light emitting element 22 (FIG. 9B).

図9(b)に示す出射角度θ1は、Y方向に沿って、入光端部420A(420B)より最も遠い発光素子22の位置から出射され且つ入光端部420A(420B)に接する出射光L1(L3)の出射角度である。出射角度θ2は、Y方向に沿って、周縁端部342A(343A)と入光端部420A(420B)とに接する出射光L2(L4)の出射角度である。器具1では周縁端部342A、343Aと入光端部420A、420Bとの配置関係を調節することにより、通過光はθ1以上θ2以下の出射角度を有する。θ1以上θ2以下の出射角度は適宜設定が可能であるが、一例としてθ1は25°、θ2は50°である。 The exit angle θ 1 shown in FIG. 9B is emitted from the position of the light emitting element 22 farthest from the light incident end 420A (420B) along the Y direction, and is in contact with the light incident end 420A (420B). This is the emission angle of the incident light L 1 (L 3 ). The emission angle θ 2 is an emission angle of the outgoing light L 2 (L 4 ) in contact with the peripheral edge portion 342A (343A) and the light incident end portion 420A (420B) along the Y direction. Instrument 1, the peripheral edge 342A, 343A and the light incident end 420A, by adjusting the positional relationship between 420B, the passing light having the emission angle theta 1 or θ2 less. The emission angle between θ 1 and θ 2 can be set as appropriate. For example, θ1 is 25 ° and θ2 is 50 °.

これにより、通過光は側壁342、343の表面に当たり、反射光となって導光板40に入射する。側壁342、343で反射された出射光は、傾斜部422A、422B付近に対して十分に小さい入射角で入射される(図9(a))。出射光L1〜L4は傾斜部422A、422B付近にて正反射され、導光板40の内部全体にわたって良好に導光される。 Thereby, the passing light strikes the surfaces of the side walls 342 and 343 and enters the light guide plate 40 as reflected light. The outgoing light reflected by the side walls 342 and 343 is incident at a sufficiently small incident angle on the vicinity of the inclined portions 422A and 422B (FIG. 9A). The outgoing lights L 1 to L 4 are specularly reflected in the vicinity of the inclined portions 422A and 422B, and are guided well over the entire interior of the light guide plate 40.

このような工夫により、通過光が傾斜部422A、422B付近を突き抜けて光量の多い直接光となり、外部に出射されるのを防止することができる。
尚、図8に示すように、発光素子22の実装位置が多少のチップずれを生じている場合であっても、出射光L5、L6、L7のように、通過光は傾斜部422A、422Bに対して十分に小さい入射角で入射される。従って、チップずれを生じている場合でも上記した効果を期待することができる。
[4]第1開口部340及び第2開口部341の併用による効果
装置100において、発光素子22の出射光が第2開口部341から通過する際には、第2開口部341が第1開口部340の最大径よりも大きい径を有すことにより、第1開口部340を通過する出射光量よりも比較的豊富な出射光量の光を第2開口部341に通過させることができる。
By such a device, it is possible to prevent the passing light from passing through the vicinity of the inclined portions 422A and 422B to become direct light with a large amount of light and to be emitted to the outside.
As shown in FIG. 8, even if the mounting position of the light emitting element 22 is slightly displaced, the passing light is inclined part 422A as in the case of the emitted light L 5 , L 6 , L 7. The incident angle is sufficiently small with respect to 422B. Therefore, the above-described effect can be expected even when a chip shift occurs.
[4] Effect of Combined Use of First Opening 340 and Second Opening 341 In the device 100, when the light emitted from the light emitting element 22 passes through the second opening 341, the second opening 341 is the first opening. By having a diameter larger than the maximum diameter of the portion 340, it is possible to allow the second opening 341 to pass light having an abundance of emitted light that is relatively richer than the amount of emitted light that passes through the first opening 340.

その結果、円周状の凹入部32に沿って、各発光素子22の出射光が均一に分散するように図られる。器具1の拡散カバー50を外部から見た場合、発光素子22の実装位置に対応する高輝度の発光領域と、発光素子22が実装されていない位置に対応する低輝度の発光領域とが混在して生じるのが防止される。よって、輝度ムラの発生を抑えて均一な面発光を期待することができる。   As a result, the light emitted from each light emitting element 22 is uniformly dispersed along the circumferential recess 32. When the diffusion cover 50 of the instrument 1 is viewed from the outside, a high-luminance light-emitting area corresponding to the mounting position of the light-emitting element 22 and a low-luminance light-emitting area corresponding to the position where the light-emitting element 22 is not mounted are mixed. Are prevented from occurring. Therefore, it is possible to expect uniform surface light emission while suppressing occurrence of luminance unevenness.

ここで図12(a)は、反射部材が開口34を持たない比較例の面発光方式の照明装置910(図17(a)、図17(b)に示した照明装置910と同一のもの)の駆動時における、模式的な正面図である。図12(b)は、照明装置910の駆動時における発光面の様子を正面から撮影した写真である。
図12(a)に示すように、反射部材945の内側反射部945bと外側反射部945aとの間における発光素子922の実装位置付近では、発光素子922からの出射光量が比較的多い。このため図12(a)の拡大図に示すように、発光素子922の実装位置付近には比較的高輝度の発光領域D2が存在する。一方、発光領域D2の近傍では発光素子922からの出射光量が不足するため、比較的低輝度の発光領域D1、D3が存在する。照明装置910では円周状に複数の発光素子922が間隔をおいて実装されているので、発光領域D1〜D3は発光素子922の実装位置に合わせ、拡散カバー50Xの外表面で円周状に繰り返し現れる。従って照明装置910を駆動させると、図12(b)に示すように、発光面では円周状に輝度ムラが生じうる。
Here, FIG. 12A shows a surface emitting illumination device 910 of a comparative example in which the reflecting member does not have the opening 34 (the same as the illumination device 910 shown in FIGS. 17A and 17B). It is a typical front view at the time of driving. FIG. 12B is a photograph taken from the front of the state of the light emitting surface when the lighting device 910 is driven.
As shown in FIG. 12A, the amount of light emitted from the light emitting element 922 is relatively large in the vicinity of the mounting position of the light emitting element 922 between the inner reflecting portion 945b and the outer reflecting portion 945a of the reflecting member 945. For this reason, as shown in the enlarged view of FIG. 12A, a light emitting region D 2 having a relatively high luminance exists in the vicinity of the mounting position of the light emitting element 922. On the other hand, in the vicinity of the light emitting region D 2 due to the lack of amount of light emitted from the light emitting element 922, a relatively low-luminance light emission region D 1, D 3 is present. Since a plurality of light emitting elements 922 circumferentially in the lighting apparatus 910 is mounted at a distance, the light emitting region D 1 to D 3 are combined in mounting positions of the light emitting element 922, the circumferential outside surface of the diffusion cover 50X Appear repeatedly. Therefore, when the illumination device 910 is driven, as shown in FIG. 12B, luminance unevenness may occur in a circumferential shape on the light emitting surface.

一方、図13(a)は、装置100の駆動時における模式的な正面図である。図13(b)は、装置100の駆動時における発光面の様子を正面から撮影した写真である。
図13(a)に示すように、導光板40の内側導光部41と外側導光部43との間に対応して存在する発光素子22の実装位置では、出射光量が幅狭の第1開口部340により規制されている。一方、第1開口部340と連通する幅広の第2開口部341は、第1開口部340の最大径よりも径が大きいために、発光素子22からの出射光が豊富に通過する。よって、拡散カバー50の外表面では、図13(a)の拡大図に示すように、第1開口部340に対応する発光領域C2と、第2開口部341に対応する発光領域C1、C3とにおける輝度分布が均一化される。従って実際に装置100を駆動させた場合、図13(b)に示すように、発光面ではほぼ均一な面発光を得ることができる。
<その他の実施の形態>
本発明のその他の実施の形態について、図14(a)〜(d)を用いて実施の形態1との差異を中心に説明する。
On the other hand, FIG. 13A is a schematic front view when the apparatus 100 is driven. FIG. 13B is a photograph taken from the front of the state of the light emitting surface when the device 100 is driven.
As shown in FIG. 13A, at the mounting position of the light emitting element 22 existing correspondingly between the inner light guide part 41 and the outer light guide part 43 of the light guide plate 40, the emitted light quantity is narrow and the first. It is regulated by the opening 340. On the other hand, the wide second opening 341 communicating with the first opening 340 has a diameter larger than the maximum diameter of the first opening 340, and thus the emitted light from the light emitting element 22 passes abundantly. Therefore, on the outer surface of the diffusion cover 50, as shown in the enlarged view of FIG. 13A, the light emitting region C 2 corresponding to the first opening 340 and the light emitting region C 1 corresponding to the second opening 341, luminance distribution in C 3 Metropolitan is uniform. Therefore, when the device 100 is actually driven, as shown in FIG. 13B, substantially uniform surface light emission can be obtained on the light emitting surface.
<Other embodiments>
Another embodiment of the present invention will be described with reference to FIGS. 14A to 14D focusing on differences from the first embodiment.

図14(a)は、実施の形態2に係る反射部材に設けた開口34Aの形状を示す図である。開口34Aは実施の形態1の開口34を基本構造とし、第1開口部340Aに対し、一の方向(紙面左右方向)で連通する一対の第2開口部341Aにおいて、その周縁が鋭角に形成されている特徴を有する。
実施の形態2に係る開口34Aによっても、実施の形態1の反射部材30の開口34と同様の効果を期待できる。また開口34Aは、第1開口部340Aから遠ざかるにつれて第2開口部341Aの幅が漸増する構成であるため、第1開口部340Aから遠い第2開口部341Aの領域で出射光をより多く確保し且つスムーズに出射させることができる。
FIG. 14A is a diagram showing the shape of the opening 34A provided in the reflecting member according to the second embodiment. The opening 34A has the basic structure of the opening 34 of the first embodiment, and the peripheral edge of the pair of second openings 341A communicating with the first opening 340A in one direction (left and right direction on the paper surface) is formed at an acute angle. It has the characteristic which is.
The effect similar to that of the opening 34 of the reflecting member 30 of the first embodiment can be expected also by the opening 34A according to the second embodiment. In addition, since the opening 34A has a configuration in which the width of the second opening 341A gradually increases as the distance from the first opening 340A increases, more emitted light is secured in the region of the second opening 341A that is far from the first opening 340A. And it can be made to emit smoothly.

図14(b)は、実施の形態3に係る反射部材に設けた開口34Bの形状を示す図である。開口34Bは、第1開口部340Bが一の方向(紙面左右方向)に平行な一対の周縁を有する。さらに開口34Bは第1開口部340Bに連通する、一対の矩形状の第2開口部341Bを有する。
実施の形態3に係る開口34Bによっても、実施の形態1と同様の効果を期待できる。さらに開口34Bでは、第1開口部340Bから遠ざかるにつれて第2開口部341Bの幅が急激に広くなっている。このため、第1開口部340Bに対する第2開口部341Bからの出射光量の比率を比較的多く確保することができる。
FIG. 14B is a diagram illustrating the shape of the opening 34 </ b> B provided in the reflecting member according to the third embodiment. The opening 34 </ b> B has a pair of peripheral edges in which the first opening 340 </ b> B is parallel to one direction (left and right direction in the drawing). Further, the opening 34B has a pair of rectangular second openings 341B communicating with the first opening 340B.
The same effect as in the first embodiment can also be expected by the opening 34B according to the third embodiment. Further, in the opening 34B, the width of the second opening 341B is rapidly increased as the distance from the first opening 340B increases. For this reason, a relatively large ratio of the amount of light emitted from the second opening 341B to the first opening 340B can be ensured.

図14(c)は、実施の形態4に係る反射部材に設けた開口34Cの形状を示す図である。開口34Cは、実施の形態3を基本構成とし、第1開口部340Cに連通する一対の第2開口部341Cの周縁を円形としたものである。
実施の形態4に係る開口34Cによっても、実施の形態3と同様の効果を期待できる。また、第2開口部341Cの周縁には角部が無いため、第2開口部341Cからの出射光が優れた均一性を有する。
FIG. 14C shows the shape of the opening 34 </ b> C provided in the reflecting member according to the fourth embodiment. The opening 34C has a basic configuration according to the third embodiment, and has a pair of second openings 341C communicating with the first opening 340C in a circular shape.
The effect similar to that of the third embodiment can also be expected by the opening 34C according to the fourth embodiment. In addition, since there is no corner on the periphery of the second opening 341C, the emitted light from the second opening 341C has excellent uniformity.

図14(d)は、実施の形態5に係る反射部材に設けた開口34D形状を示す図である。開口34Dは、実施の形態3を基本構成とし、第1開口部340Dに連通する一対の第2開口部341Dの周縁を、第1開口部340Dから遠ざかるにつれてステップ状に拡径する形状としたものである。
実施の形態5に係る開口34Dによっても、実施の形態3と同様の効果を期待できる。さらに、第2開口部341Dの幅をステップ状に適宜調節することにより、第2開口部341Dからの出射光量を精密に調節することができる。
FIG. 14D shows the shape of the opening 34 </ b> D provided in the reflecting member according to the fifth embodiment. The opening 34D has a basic configuration according to the third embodiment, and has a shape in which the peripheral edges of the pair of second openings 341D communicating with the first opening 340D are enlarged in a step shape as the distance from the first opening 340D increases. It is.
The same effect as in the third embodiment can also be expected by the opening 34D according to the fifth embodiment. Furthermore, the amount of light emitted from the second opening 341D can be precisely adjusted by appropriately adjusting the width of the second opening 341D in steps.

尚、図14(a)〜(d)は1個の開口のみを示しているが、当然ながら各実施の形態の反射部材にこれらの開口を複数にわたって存在させることができる。
図15は、実施の形態6に係る器具1Aにおける入光部42Aの構成を示す、入光部42周辺の部分断面図である。器具1Aが器具1と異なる点は、導光板40Aにおいて、素子対向部420Cの形状をYZ断面に沿って緩やかな曲面状とした点である。
14 (a) to 14 (d) show only one opening, it goes without saying that a plurality of these openings can exist in the reflecting member of each embodiment.
FIG. 15 is a partial cross-sectional view around the light incident portion 42 showing the configuration of the light incident portion 42A in the instrument 1A according to the sixth embodiment. The difference between the instrument 1A and the instrument 1 is that, in the light guide plate 40A, the shape of the element facing portion 420C is a gentle curved surface along the YZ cross section.

このような構成の器具1Aにおいても、実施の形態1と同様の効果を期待できる。また素子対向部420Cの断面形状が曲面状になっていることにより、発光素子22からの出射光が素子対向部420Cに当たる際の入射角度を小さくすることができる。これにより素子対向部420Cにおいて生じる反射光が増加し、側壁342、343にて反射されて導光板40に入射される入射光量が増大する。結果として、導光板40A全体に導光される光量を増やすことが可能である。
<その他の事項>
本発明に係る照明装置は、天井に埋設するシーリングライトに限定されない。その他の設置方法で設置されるシーリングライトの他、ダウンライト、バックライトなど照明用途全般に広く利用可能である。
Even in the instrument 1A having such a configuration, the same effect as in the first embodiment can be expected. Further, since the cross-sectional shape of the element facing portion 420C is a curved surface, the incident angle when the emitted light from the light emitting element 22 strikes the element facing portion 420C can be reduced. As a result, the reflected light generated at the element facing portion 420C increases, and the amount of incident light that is reflected by the side walls 342 and 343 and incident on the light guide plate 40 increases. As a result, it is possible to increase the amount of light guided to the entire light guide plate 40A.
<Other matters>
The lighting device according to the present invention is not limited to a ceiling light embedded in a ceiling. In addition to ceiling lights installed by other installation methods, it can be widely used for lighting applications such as downlights and backlights.

本発明において、掛止部材3は必須ではない。照明器具1はネジ止めやリベット、接着等を用いて天井に固定してもよい。
装置100では、電源ユニット4と照明器具1とを別個の構成としたが、本発明はこの構造に限定されない。すなわち本発明の照明装置は、照明器具1が電源ユニット4を内蔵してなる構成としてもよい。
In the present invention, the latch member 3 is not essential. The luminaire 1 may be fixed to the ceiling using screws, rivets, adhesion, or the like.
In the apparatus 100, although the power supply unit 4 and the lighting fixture 1 were comprised separately, this invention is not limited to this structure. That is, the illuminating device of the present invention may be configured such that the luminaire 1 includes the power supply unit 4 therein.

本発明に係る発光素子は、例えば、LD(レーザダイオード)や、EL素子(エレクトリックルミネッセンス素子)であっても良い。また本発明に係る発光素子としては、SMD(Surface Mount Device)型でもよい。
また本発明に係る照明装置では、拡散カバーは必須ではない。
上記実施の形態では、反射部材30を一体型として構成した。しかしながら本発明では隣接する開口34同士を互いに連通させてもよい。この場合、反射部材30は内側反射部31と外側反射部33の2部材で構成することができる。
The light emitting element according to the present invention may be, for example, an LD (laser diode) or an EL element (electric luminescence element). The light emitting device according to the present invention may be an SMD (Surface Mount Device) type.
In the lighting device according to the present invention, the diffusion cover is not essential.
In the above embodiment, the reflecting member 30 is configured as an integral type. However, in the present invention, adjacent openings 34 may communicate with each other. In this case, the reflecting member 30 can be composed of two members, an inner reflecting portion 31 and an outer reflecting portion 33.

本発明の反射部材において凹入部は必須ではない。反射部材の開口に対応する位置に入光部を配置すればよい。但し、凹入部に入光部を挿入することで、反射部材と導光板との合計厚みを薄くできる。従って器具のコンパクト化に貢献できる。
導光板は、反射部材との対向面を平坦面としてもよいが、微小なレンズを複数設けて導光板内を通る光の反射特性を変化させてもよい。これにより導光板の導光効果を向上させることができる。
In the reflecting member of the present invention, the recessed portion is not essential. What is necessary is just to arrange | position a light-incidence part in the position corresponding to opening of a reflection member. However, the total thickness of the reflection member and the light guide plate can be reduced by inserting the light incident portion into the recessed portion. Therefore, it can contribute to the downsizing of the instrument.
The light guide plate may have a flat surface facing the reflection member, but a plurality of minute lenses may be provided to change the reflection characteristics of light passing through the light guide plate. Thereby, the light guide effect of the light guide plate can be improved.

上記各実施の形態では、LED実装基板20の上方に設ける板状部材として反射部材30を例示した。しかしながら本発明では板状部材の構成を反射部材に限定しない。すなわち、板状部材を反射性を有さない構成とすることもできる。
上記各実施の形態では器具を円盤状としているが、器具はこの形状に限定されない。例えば長尺状の基板本体に複数の発光素子を配列させてLED実装基板を構成してもよい。この場合、ベース、反射部材、導光板、導光カバーをLED実装基板と同様に長尺状に構成する。これにより器具を長尺状とすることもできる。
In each said embodiment, the reflection member 30 was illustrated as a plate-shaped member provided above the LED mounting substrate 20. FIG. However, in the present invention, the configuration of the plate member is not limited to the reflecting member. That is, the plate-like member can be configured not to have reflectivity.
In each said embodiment, although the instrument is disk shape, an instrument is not limited to this shape. For example, the LED mounting substrate may be configured by arranging a plurality of light emitting elements on a long substrate body. In this case, the base, the reflection member, the light guide plate, and the light guide cover are configured to be long like the LED mounting substrate. Thereby, an instrument can also be made long.

1、1A LED照明器具
2 天井
4 回路ユニット
10 ベース
20 LED実装基板
21 基板本体
22 発光素子
30、945X 反射部材
31 内側反射部
32 凹入部
33 外側反射部
34、34A〜34D 開口
40、40A、940X 導光板
41 内側導光部
42、42A、946X 入光部
43 外側導光部
50 拡散カバー
51 本体部
100、900、910 LED照明装置
220 素子本体
221 素子筐体
310、320 反射部材の上面
340、340A〜340D 第1開口部
341、341A〜341D 第2開口部
342、343 側壁
342A、343A 第1開口部の周縁端部
420、420C、947X 素子対向部
420A、420B 入光端部
422A、422B、948X、949X 傾斜部
423 境界部
424A、424B、950X、951X 側面部
DESCRIPTION OF SYMBOLS 1, 1A LED lighting fixture 2 Ceiling 4 Circuit unit 10 Base 20 LED mounting board 21 Substrate body 22 Light emitting element 30, 945X Reflective member 31 Inner reflection part 32 Recessed part 33 Outer reflection part 34, 34A-34D Opening 40, 40A, 940X Light guide plate 41 Inner light guide part 42, 42A, 946X Light incident part 43 Outer light guide part 50 Diffusion cover 51 Main body part 100, 900, 910 LED lighting device 220 Element main body 221 Element housing 310, 320 Upper surface 340 of reflecting member 340A to 340D First opening portion 341, 341A to 341D Second opening portion 342, 343 Side wall 342A, 343A First opening peripheral edge portion 420, 420C, 947X Element facing portion 420A, 420B Light incident end portion 422A, 422B, 948X, 949X inclined part 423 boundary part 4 4A, 424B, 950X, 951X side portions

Claims (15)

複数の発光素子が実装された実装基板と、前記各発光素子の出射光を導光する導光板と、前記実装基板と前記導光板との間に挟設され、前記各発光素子と対応する位置に厚み方向に貫通する開口が存在する板状部材とを備える照明装置であって、
前記導光板は前記開口と対応する位置に、前記開口を介して前記発光素子の出射光が入射される入光部を有し、
前記入光部は前記発光素子と対向する素子対向部と、前記導光板の前記素子対向部が存在する面とは反対の面において、前記実装基板の表面に沿った第1方向に前記素子対向部より遠ざかるにつれて前記実装基板の表面と垂直な方向に対する傾斜角度が増大する傾斜面を備えた傾斜部とを有し、
前記導光板を平面視する際、前記第1方向に沿って、前記開口の幅が前記素子対向部の幅よりも小さく且つ前記開口の周縁の両端部が前記素子対向部の両端部よりも内側に位置している
照明装置。
A mounting board on which a plurality of light emitting elements are mounted, a light guide plate that guides light emitted from each light emitting element, and a position that is sandwiched between the mounting board and the light guide plate and corresponds to each light emitting element And a plate-like member having an opening penetrating in the thickness direction.
The light guide plate has a light incident portion where light emitted from the light emitting element is incident through the opening at a position corresponding to the opening.
The light incident portion is opposed to the element in a first direction along the surface of the mounting substrate on an element facing portion facing the light emitting element and on a surface opposite to a surface where the element facing portion of the light guide plate exists. An inclined portion with an inclined surface that increases in inclination angle with respect to a direction perpendicular to the surface of the mounting substrate as it is further from the portion;
When the light guide plate is viewed in plan, the width of the opening is smaller than the width of the element facing portion along the first direction, and both end portions of the periphery of the opening are inside of both end portions of the element facing portion. Located in the lighting device.
前記板状部材は表面を凹入させてなる凹入部を有し、前記凹入部の内部に前記開口が存在し、
前記入光部が前記凹入部に挿入されている
請求項1に記載の照明装置。
The plate-like member has a recessed portion formed by recessed the surface, and the opening exists inside the recessed portion,
The lighting device according to claim 1, wherein the light incident portion is inserted into the recessed portion.
前記第1方向に沿って、前記入光部は前記素子対向部の前記両端部に対応する各位置に前記傾斜部を有し、且つ前記各傾斜部の前記表面の傾斜が前記素子対向部より遠ざかるにつれて漸減する
請求項1または2に記載の照明装置。
Along the first direction, the light incident portion has the inclined portion at each position corresponding to the both end portions of the element facing portion, and the inclination of the surface of each inclined portion is greater than that of the element facing portion. The lighting device according to claim 1, wherein the lighting device gradually decreases as the distance increases.
前記開口は、前記発光素子との対応位置に存在する第1開口部と、前記第1開口部に連通し且つ前記第1開口部の最大径よりも大きい径の第2開口部とを有し、
前記第1開口部に対応する位置に前記入光部が近接配置されている
請求項1〜3のいずれかに記載の照明装置。
The opening has a first opening that exists at a position corresponding to the light emitting element, and a second opening that communicates with the first opening and has a diameter larger than the maximum diameter of the first opening. ,
The illuminating device according to any one of claims 1 to 3, wherein the light incident portion is disposed close to a position corresponding to the first opening.
前記板状部材は、前記発光素子の出射光を反射する反射部材である
1〜4のいずれかに記載の照明装置。
The lighting device according to any one of claims 1 to 4, wherein the plate-like member is a reflecting member that reflects light emitted from the light emitting element.
前記第1方向に沿って、前記反射部材は前記凹入部の内部において前記第1開口部を挟む両側に側壁を有し、且つ前記各側壁は前記第1開口部の前記周縁の両端部のいずれか一方と、これに近接する前記入光部の前記周縁の両端部のいずれか一方とを結ぶ直線上に配置されている
請求項5に記載の照明装置。
Along the first direction, the reflecting member has side walls on both sides sandwiching the first opening inside the recessed portion, and each of the side walls is one of both end portions of the peripheral edge of the first opening. The illuminating device according to claim 5, wherein the illumination device is disposed on a straight line that connects either one of the two ends of the peripheral edge of the light incident portion adjacent thereto.
前記一の方向に沿って、前記一対の側壁は前記第1開口部の前記周縁の両端部よりも外側に存在する
請求項6に記載の照明装置。
The lighting device according to claim 6, wherein the pair of side walls exist outside the both ends of the peripheral edge of the first opening along the one direction.
前記第1方向と直交する第2方向において、前記第1開口部を挟んだ両側に一対の前記第2開口部が前記連通して存在する
請求項4〜7のいずれかに記載の照明装置。
The lighting device according to any one of claims 4 to 7, wherein in a second direction orthogonal to the first direction, a pair of the second openings are provided on both sides of the first opening so as to communicate with each other.
前記複数の発光素子が互いに間隔をおいて前記実装され、
前記第2開口部は隣接する前記発光素子の実装位置間に対応する位置に存在する
請求項4〜8のいずれかに記載の照明装置。
The plurality of light emitting elements are mounted at intervals from each other,
The lighting device according to claim 4, wherein the second opening is present at a position corresponding to a position between mounting positions of the adjacent light emitting elements.
前記複数の発光素子は前記実装基板の表面において円周状に前記実装され、
前記導光板の前記入光部は、前記実装基板上の各発光素子の実装位置を結ぶように連続的に形成されている
請求項1〜9のいずれかに記載の照明装置。
The plurality of light emitting elements are mounted on the surface of the mounting substrate in a circumferential shape,
The lighting device according to claim 1, wherein the light incident portion of the light guide plate is continuously formed so as to connect the mounting positions of the light emitting elements on the mounting substrate.
前記導光板は円盤状であり、前記入光部より内側に位置する第1導光部と、前記入光部より外側に位置する第2導光部とを有し、
前記第1方向は前記導光板の直径を通る方向である
請求項10に記載の照明装置。
The light guide plate has a disc shape, and has a first light guide part located inside the light incident part, and a second light guide part located outside the light incident part,
The lighting device according to claim 10, wherein the first direction is a direction passing through a diameter of the light guide plate.
前記第1導光部と前記第2導光部の各外表面が同じ高さであり、
前記第1導光部と前記第2導光部の厚みが同一である
請求項11に記載の照明装置。
The outer surfaces of the first light guide and the second light guide are the same height,
The lighting device according to claim 11, wherein the first light guide unit and the second light guide unit have the same thickness.
前記板状部材と前記導光板とは射出成形されている
請求項1〜12のいずれかに記載の照明装置。
The lighting device according to claim 1, wherein the plate member and the light guide plate are injection-molded.
前記発光素子はLED素子である
請求項1〜13のいずれかに記載の照明装置。
The lighting device according to claim 1, wherein the light emitting element is an LED element.
前記発光素子に電力供給するための電源装置を有する
請求項1〜14のいずれかに記載の照明装置。
The lighting device according to claim 1, further comprising a power supply device for supplying power to the light emitting element.
JP2012270693A 2012-12-11 2012-12-11 Lighting device Active JP5740560B2 (en)

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Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2021057575A (en) * 2019-09-25 2021-04-08 日亜化学工業株式会社 Light-emitting module
US11307455B2 (en) 2019-09-25 2022-04-19 Nichia Corporation Light-emitting module having array of light sources, some aligned and others offset with array of lense structures

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2017110366A1 (en) * 2015-12-24 2017-06-29 林テレンプ株式会社 Vehicular lighting system
CN207471460U (en) * 2017-10-27 2018-06-08 漳州立达信光电子科技有限公司 Led lamp
EP3756202A4 (en) * 2018-02-22 2021-11-17 AVX Corporation Electrical circuit including a supercapacitor with reduced leakage

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2004031064A (en) * 2002-06-25 2004-01-29 Kawaguchiko Seimitsu Co Ltd Backlight device
JP2007329089A (en) * 2006-06-09 2007-12-20 Yuka Denshi Co Ltd Light-emitting unit
JP2012104476A (en) * 2010-10-12 2012-05-31 Toshiba Lighting & Technology Corp Lighting device
JP2012138255A (en) * 2010-12-27 2012-07-19 Sony Corp Surface light-emitting device and display device

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2004031064A (en) * 2002-06-25 2004-01-29 Kawaguchiko Seimitsu Co Ltd Backlight device
JP2007329089A (en) * 2006-06-09 2007-12-20 Yuka Denshi Co Ltd Light-emitting unit
JP2012104476A (en) * 2010-10-12 2012-05-31 Toshiba Lighting & Technology Corp Lighting device
JP2012138255A (en) * 2010-12-27 2012-07-19 Sony Corp Surface light-emitting device and display device

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2021057575A (en) * 2019-09-25 2021-04-08 日亜化学工業株式会社 Light-emitting module
US11307455B2 (en) 2019-09-25 2022-04-19 Nichia Corporation Light-emitting module having array of light sources, some aligned and others offset with array of lense structures
JP7078865B2 (en) 2019-09-25 2022-06-01 日亜化学工業株式会社 Luminous module

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