JP2014103651A - Earphone - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide an earphone which prevents a carbon nanotube film of a speaker from being damaged easily, achieves excellent stereo effect, has a simple structure, facilitates manufacturing, downsizing, and industrialization, and facilitates replacement of a sound wave generator in repair.SOLUTION: An earphone includes an outer case 110, and at least one speaker 100'. The outer case has a storage space, and each speaker includes: a first substrate; a sound wave generator; at least one first electrode; and at least one second electrode. The first electrode includes a first surface and a second surface which face each other. The sound wave generator is installed on the first surface of the first substrate. The at least one first electrode and the at least one second electrode are installed on the first surface of the first substrate, with some interval apart from each other and are electrically connected with the sound wave generator.

Description

  The present invention relates to an earphone, and more particularly to a thermoacoustic earphone.

  In general, the acoustic device includes a signal device and a sound wave generator. The signaling device transmits a signal to the sound wave generator. An earphone is a type of acoustic device that uses a thermoacoustic phenomenon, and generates sound by heat when an alternating current is passed through a conductor. The conductor has a small heat capacity and a small thickness. Also, the heat generated inside the conductor is quickly propagated to the surrounding medium, and the thermal expansion caused by the propagated heat can change the density of the surrounding medium and generate sound waves. .

  Referring to Non-Patent Document 1, in a thermoacoustic apparatus, a carbon nanotube film is used for a sound wave generator. This carbon nanotube film generates sound waves by a thermoacoustic phenomenon.

  However, when the carbon nanotube film is used for the sound wave generator, the carbon nanotube film is easily broken by an external force, which is disadvantageous for industrialization of the earphone. Further, since the conventional electromagnetic earphone adjusts the sound wave according to the input signal, it is difficult to realize the stereo effect. In addition, the sound wave generator cannot be easily replaced during repair.

Chinese Patent Application No. 101239712 JP 2004-107196 A JP 2006-161563 A

Lin Xiao et al. "Flexible, Stretchable, Transparent Carbon Nanotube Thin Film Speakers", Nano Letters, Vol. 8 (12), p. 4539-4545

  In order to solve the above-described problems, the present invention provides an earphone that is difficult to break the carbon nanotube film of a loudspeaker and has an excellent stereo effect, and that has a simple structure, and is capable of production, miniaturization, and industrialization. Provided is an earphone that can be easily replaced and the sound wave generator can be easily replaced when repaired.

  The earphone of the present invention is an earphone including an outer case and at least one loudspeaker, wherein the outer case has an accommodation space, and the at least one loudspeaker is accommodated in the accommodation space. The vessel includes a first substrate, a sound wave generator, at least one first electrode, and at least one second electrode, wherein the first substrate includes opposing first and second surfaces, A sound wave generator is installed on the first surface of the first substrate, and the at least one first electrode and the at least one second electrode are installed at a distance from each other on the first surface of the first substrate, The recess is electrically connected to the sound wave generator and has a plurality of recesses parallel to the first surface of the substrate at intervals, and the depth of the recess is 100 μm to 200 μm.

  In the earphone according to the present invention, the outer case has a sounding part, and there are a plurality of loudspeakers, and the plurality of loudspeakers are installed at different angles with respect to the sounding part.

  In the earphone of the present invention, the number of loudspeakers is one, further includes a housing, the housing has a space, the loudspeaker is accommodated in the space of the housing, and an acoustic chip is formed. The acoustic chip is accommodated in a housing space of the outer case and fixed to the outer case by a removable method, the space of the housing has at least one opening, and the sound wave generator The case is disposed to face at least one aperture, the case has at least two pins, and the at least two pins are electrically connected to the at least one first electrode and at least one second electrode of the loudspeaker. Connected.

  Compared to the prior art, the earphone of the present invention has the following excellent points. First, since a plurality of recesses are formed in the first substrate, the carbon nanotube structure can be effectively protected and the acoustic effect is not affected. Secondly, the depth of the plurality of recesses is 100 μm to 200 μm. In this case, the distance between the first area of the sound wave generator and the bottom surface of the recess can be secured at the same time as protecting the sound wave generator. Due to the distance, the heat generated by the operation of the sound wave generator can be completely absorbed by the first substrate. This prevents the generated heat from being propagated to the surrounding medium, thereby preventing the sound volume from being lowered, and ensures that the sound wave generator has an excellent acoustic effect at each acoustic frequency. Third, the earphone includes a plurality of loudspeakers, by inputting different sound sources to each loudspeaker, or adjusting the order in which the sounds of each loudspeaker are generated, or by arranging the loudspeakers in different arrangements, A three-dimensional sound effect can be realized. Fourth, the sound wave generator is installed on the acoustic chip, and the acoustic chip is fixed to the outer case by a removable method, so that it can be disassembled. Thereby, when a sound wave generator fails, an acoustic chip can be easily replaced.

1 is a structural diagram of an earphone according to Embodiment 1 of the present invention. It is sectional drawing of the earphone in Example 1 of this invention. It is a three-dimensional view of the loudspeaker in the earphone of Example 1 of this invention. FIG. 4 is a cross-sectional view taken along IV-IV in FIG. 3. It is a scanning electron micrograph of the carbon nanotube film in the earphone of Example 1 of the present invention. 2 is a scanning electron micrograph of a non-twisted carbon nanotube wire used in Example 1 of the present invention. 2 is a scanning electron micrograph of a twisted carbon nanotube wire used in Example 1 of the present invention. It is an optical microscope photograph of the carbon nanotube wire after processing with the organic solvent in Example 1 of this invention. It is sectional drawing of the loudspeaker in the earphone of Example 2 of this invention. It is an optical microscope photograph of the loudspeaker in Example 2 of this invention. It is a curve figure of the sound pressure level-frequency of the earphone in Example 2 of this invention. It is an effect figure of generation | occurrence | production of the sound of the earphone in Example 2 of this invention. It is sectional drawing of the loudspeaker in the earphone of Example 3 of this invention. It is sectional drawing of the loudspeaker in the earphone of Example 4 of this invention. It is a structural diagram of the earphone in Example 5 of the present invention. It is a three-dimensional view of the sound generating assembly formed with a plurality of loudspeakers in the earphone of Example 5 of the present invention. It is a structural diagram of the earphone in Example 9 of the present invention. It is sectional drawing of the earphone in Example 10 of this invention. It is sectional drawing of the acoustic chip 10A in Example 10 of this invention. It is sectional drawing of the acoustic chip 20A in Example 11 of this invention. It is sectional drawing of the acoustic chip 30A in Example 12 of this invention. It is sectional drawing of the acoustic chip 40A in Example 13 of this invention. It is sectional drawing of the acoustic chip 50A in Example 14 of this invention. It is sectional drawing of the acoustic chip 60A in Example 15 of this invention.

  Embodiments of the present invention will be described below with reference to the drawings.

Example 1
1 and 2, the earphone 10 of the present embodiment includes an outer case 110 and a loudspeaker 100 ′. The outer case 110 has an accommodation space, and the loudspeaker 100 ′ is accommodated in this accommodation space.

  The structure of the outer case 110 is not limited, and may be integrally formed or other methods as long as there is a space. In the present embodiment, the outer case 110 includes a front cover 112, a rear cover 114, and a through hole 116. The through hole 116 is formed in the front cover 112. The front cover 112 and the rear cover 114 are tightly coupled to form the outer case 110. If installed in the outer case 110 and opposed to the through hole 116, the fixed position of the loudspeaker 100 'is not limited. To be installed facing the through hole 116 means that the sound wave generator in the loudspeaker 100 ′ is installed to face the through hole 116. In the present embodiment, the loudspeaker 100 ′ is fixedly installed on the rear cover 114 of the outer case 110 and is installed at a distance from the front cover 112 of the outer case 110. Further, the loudspeaker 100 ′ is positioned to face the through hole 116 in the front cover 112 and is spaced from the through hole 116. The sound generated by the loudspeaker 100 ′ is transmitted to the outside of the earphone 10 through the through hole 116.

  The material of the outer case 110 is light and has a specific strength. For example, plastic or resin. The size and shape of the outer case 110 can be selected as necessary. The size of the outer case 110 is the same as or larger than the size of the human ear and covers the human ear. The design of the outer case 110 may be a structural design suitable for ergonomics.

  Further, the outer case 110 includes a protective cover 118. The protective cover 118 is installed between the loudspeaker 100 'and the front cover 112, and is spaced from the loudspeaker 100'. The protective cover 118 is connected to the front cover 112 by a fixing element (not shown). The protective cover 118 has a plurality of openings (not shown). The material of the protective cover 118 is not limited, but is preferably plastic or metal. The protective cover 118 protects the loudspeaker 100 'from dust and the like. Further, the protective cover 118 may not be installed as necessary.

  Further, the earphone 10 includes at least one conducting wire 130. The at least one conducting wire 130 is electrically connected to the loudspeaker 100 ′ through the inside of the outer case 110, and transmits a frequency electrical signal to the loudspeaker 100 ′.

  3 and 4, the loudspeaker 100 ′ includes a first substrate 101, a sound wave generator 102, an insulating layer 103, a first electrode 104, and a second electrode 105. The first substrate 101 has a first surface 106 and a second surface 107 facing each other. The first electrode 104 and the second electrode 105 are disposed with a space therebetween and are electrically connected to the sound wave generator 102. The first surface 106 forms a plurality of recesses 108 and a plurality of protrusions 109. The insulating layer 103 is disposed on the first surface 106 of the first substrate 101 and adheres to the surfaces of the plurality of recesses 108 and the plurality of protrusions 109. The sound wave generator 102 is installed on the first surface 106 of the first substrate 101, and is insulated from the first substrate 101 by the insulating layer 103. The sound wave generator 102 has a first area 1020 and a second area 1021. The first area 1020 corresponds to the position of the recess 108. That is, the sound wave generator 102 in the first area 1020 is suspended. The sound wave generator 102 in the second area 1021 is installed on the surface of the protrusion 109 and is insulated from the first substrate 101 by the insulating layer 103.

The shape of the first substrate 101 is not limited, and may be circular, square, rectangular, and other shapes. The first surface 106 and the second surface 107 of the first substrate 101 are flat or curved. Size of the first substrate 101 is not limited, but is selected as required, preferably, the area of the first substrate 101 is 25 mm ² 100 mm ^2. Specifically, the area of the first substrate 101 is 36 mm ² , 64 mm ² or 80 mm ² . The thickness of the first substrate 101 is 0.2 mm to 0.8 mm. As long as it is ensured that the first substrate 100 has a surface that supports the sound wave generator 102, the first substrate 101 may have other structures. For example, a lump structure, a curved surface structure, an arc surface structure, or the like.

  The material of the first substrate 101 is single crystal silicon or polycrystalline silicon. Since the first substrate 101 is excellent in thermal conductivity, the heat generated during operation of the sound wave generator 102 is propagated to the outside and the service life of the sound wave generator 102 can be extended. In the present embodiment, the first substrate 101 has a square planar structure, the length of one side of the first substrate 101 is 8 mm, the thickness of the first substrate 101 is 0.6 mm, and the first substrate 101 This material is single crystal silicon.

  The plurality of recesses 108 are any one type or various types of through grooves, through holes, blind grooves, and blind holes. The plurality of recesses 108 are distributed on the first surface 106 of the first substrate 101 by a uniform distribution method, distributed by a specific rule, or distributed by a random distribution method. The recess 108 has one bottom surface and two side surfaces connected to the bottom surface. Further, a projection 109 is provided between two adjacent recesses 108. The surface of the first substrate 101 between the two adjacent recesses 108 is the surface of the protrusion 109. The first area 1020 corresponds to the position of the recess 108. Accordingly, the sound wave generator 102 in the first area 1020 is suspended and does not contact the bottom and side surfaces of the recess 108.

  The depth of the recess 108 can be selected according to need and the thickness of the first substrate 101. Preferably, the depth of the recess 108 is 100 μm to 200 μm. At this time, the first substrate 101 protects the sound wave generator 102 and at the same time secures a distance between the first substrate 101 and the sound wave generator 102. Due to the distance, heat generated when the sound wave generator 102 is operated can be completely absorbed by the first substrate 101. This prevents the sound volume from being lowered because heat is not propagated to the surrounding medium. It also ensures that the sound wave generator 102 has an excellent acoustic effect at each acoustic frequency.

  On the first surface 106, the length that the plurality of recesses 108 extends is equal to or less than the length of the side of the first substrate 101. The shape of the cross section in the direction in which the recess 108 extends is V-shaped, rectangular, square-shaped, trapezoidal, polygonal, circular, or other irregular shape. The width of the recess 108 (that is, the maximum value of the length of the cross section of the recess 108) is 0.2 mm to 1 mm. In this embodiment, the recess 108 has a groove structure, and its cross section is an inverted trapezoid. That is, the width of the groove becomes narrower as the groove becomes deeper. The angle formed between the bottom surface and the side surface of the inverted trapezoid is α, and the magnitude of the angle α is related to the material of the first substrate 101. Specifically, the angle α is the same as the angle of the crystal plane of the single crystal silicon of the first substrate 101. Preferably, the plurality of recesses 108 are evenly distributed in parallel to each other and spaced from each other. The distance between two adjacent grooves is d1, and d1 is 20 μm to 200 μm. Since d1 is 20 μm to 200 μm, it is possible to form the first electrode 104 and the second electrode 106 on the surface of the first substrate 101 by the subsequent screen printing method, and at the same time ensure the etching accuracy. Furthermore, it is ensured that the sound effect is enhanced. The extending direction of the recess 108 is parallel to the extending direction of the first electrode 104 and the second electrode 106.

    In the present embodiment, the first surface 106 of the first substrate 101 has a plurality of inverted trapezoidal grooves that are parallel to each other and are evenly distributed at intervals. The width (maximum width) of the inverted trapezoidal groove on the first surface 106 is 0.6 mm, the depth is 150 μm, d1 is 100 μm, and the angle α of the inverted trapezoid is 54.7 degrees. is there.

  The insulating layer 103 has a single layer structure or a multilayer structure. When the insulating layer 103 has a single-layer structure, the insulating layer 103 is provided only on the surface of the protrusion 109, or is attached to all of the first surface 106 of the first substrate 101. Here, sticking means that the insulating layer 103 covers the bottom and side surfaces of the recess 108 and the surface of the protrusion 109. That is, the insulating layer 103 directly covers the recess 108 and the protrusion 109, and the undulating shape of the insulating layer 103 is the same as that of the recess 108 and the protrusion 109. Thereby, in any case, the insulating layer 103 can insulate the first substrate 101 and the sound wave generator 102. The material of the insulating layer 103 is silica, silicon nitride, or a combination thereof, but other insulating materials may be used as long as the insulating layer 103 can insulate the first substrate 101 and the sound wave generator 102. The thickness of the insulating layer 103 is 10 nm to 2 μm, specifically 50 nm, 90 nm, or 1 μm. Further, when the material of the first substrate 101 is an insulating material, it is not necessary to provide the insulating layer 103. In this embodiment, the insulating layer 103 is continuous single-layer silicon, has a thickness of 1.2 μm, and covers the entire first surface 106 of the first substrate 101.

The sound wave generator 102 has a very low heat capacity per unit area. The material of the sound wave generator 102 is not limited, and is, for example, a pure carbon nanotube structure composed of only carbon nanotubes, a carbon nanotube composite structure, or another non-carbon nanotube thermosonic wave generating material. Preferably, the sound wave generator 102 includes only a carbon nanotube structure composed of a plurality of carbon nanotubes. Preferably, the sound wave generator 102 consists only of carbon nanotubes. In this embodiment, the heat capacity per unit area of the sound wave generator 102 is smaller than 2 × 10 ⁻⁴ J / cm ² · K. Specifically, the sound wave generator 102 has a conductive structure, a large specific surface area, and a small thickness. Thereby, the sound wave generator 102 can convert the input electric energy into heat. That is, the sound generator 102 can quickly raise the temperature by the input signal, quickly exchange heat with the surrounding medium, and the density of the surrounding medium is changed by the thermal expansion caused by the propagated heat, and the sound wave is generated. Can be generated. The sound wave generator 102 preferably has a self-supporting structure. Here, the self-supporting structure is a structure that can be used without using a support. That is, the sound wave generator 102 maintains its specific shape without using a support. Thereby, the sound wave generator 102 can be installed by suspending a part thereof. Moreover, it can fully contact with surrounding media and can propagate heat. The peripheral medium is a medium outside the sound wave generator 102 and does not include an internal medium. The sound wave generator 102 is a film structure, a layered structure in which a plurality of linear structures are formed in parallel, or a combination of a film structure and a linear structure.

  In this embodiment, the sound wave generator 102 includes a carbon nanotube structure. Specifically, the carbon nanotube structure has a layered structure. The thickness of the layered carbon nanotube structure is preferably 0.5 nm to 1 mm. When the thickness of the carbon nanotube structure is thin, for example, when it is 10 nm or less, the transparency of the carbon nanotube structure is excellent. Since the carbon nanotube structure has a self-supporting structure, and the plurality of carbon nanotubes in the carbon nanotube structure attract each other by intermolecular force, the carbon nanotube structure has a specific shape. Accordingly, a part of the carbon nanotube structure is supported by the first substrate 101 and the other part is suspended. That is, at least a part of the carbon nanotube structure is suspended.

The carbon nanotube structure includes at least one carbon nanotube film, carbon nanotube wire, or a combination thereof. A carbon nanotube film is obtained by directly stretching a carbon nanotube array. The thickness of the carbon nanotube film is 0.5 nm to 100 μm, and the heat capacity per unit area of the carbon nanotube film is smaller than 1 × 10 ⁻⁶ J / cm ² · K. The carbon nanotubes are one type or various types of single-walled carbon nanotubes, double-walled carbon nanotubes, and multi-walled carbon nanotubes. The diameter of the single-walled carbon nanotube is 0.5 nm to 50 nm, the diameter of the double-walled carbon nanotube is 1 nm to 50 nm, and the diameter of the multi-walled carbon nanotube is 1.5 nm to 50 nm. The length of the carbon nanotube film is not limited, and the width can be selected according to the width of the carbon nanotube array.

  Referring to FIG. 5, the carbon nanotube film is a self-supporting structure formed by a plurality of carbon nanotubes, and the plurality of carbon nanotubes are arranged along the same direction. The extending direction of the plurality of carbon nanotubes is basically parallel to the surface of the carbon nanotube film. The plurality of carbon nanotubes are connected by intermolecular force. Specifically, each carbon nanotube in the plurality of carbon nanotubes is connected to the adjacent carbon nanotubes in the extending direction and the ends thereof by intermolecular force. The carbon nanotube film also includes a small number of random carbon nanotubes. However, since most of the carbon nanotubes are arranged along the same direction, the stretching direction of the random carbon nanotubes does not affect the stretching direction of most of the carbon nanotubes.

  The carbon nanotube film is a free-standing structure. Here, the self-supporting structure is a form that can maintain its own form without using a support and can independently use a carbon nanotube film. That is, it means that the carbon nanotube film can be suspended by supporting the carbon nanotube film from opposite sides without changing the structure of the carbon nanotube film. The carbon nanotubes in the carbon nanotube film are self-supported by arranging the ends connected to each other by intermolecular force.

  Specifically, a large number of carbon nanotubes in the carbon nanotube film are basically not absolutely linear but may be slightly curved. Alternatively, the extending direction may not be completely arranged and may be slightly shifted. Accordingly, there is a possibility that the parallel carbon nanotubes are partially in contact with each other among the plurality of carbon nanotubes arranged along the same direction.

  The plurality of carbon nanotubes are substantially parallel to the first surface 106 of the first substrate 101. The carbon nanotube structure includes a plurality of carbon nanotube films, and when the widths of the plurality of carbon nanotube films are very small, the plurality of carbon nanotube films are arranged on the first surface 106 of the first substrate 101 on the same surface. Installed. In addition, the carbon nanotube structure includes multi-layer carbon nanotube films that overlap each other, and the carbon nanotubes in adjacent two-layer carbon nanotube films intersect to form an angle β, and this angle β is 0 ° to 90 °. °. A method for producing a carbon nanotube film is described in Patent Document 1.

  Since the carbon nanotube film has strong adhesiveness, the carbon nanotube film can be directly attached to the surface of the insulating layer 103 in the protrusion 109. The plurality of carbon nanotubes in the carbon nanotube film are arranged along the same direction. The extending direction of the plurality of carbon nanotubes and the extending direction of the recess 108 form an angle. The extending direction of the plurality of carbon nanotubes is preferably perpendicular to the extending direction of the recess 108. Furthermore, after the carbon nanotube film is attached to the surface of the insulating layer 103 in the protrusion 109, the carbon nanotube film attached to the first substrate 101 can be treated with an organic solvent.

  Specifically, using a test tube, the organic solvent is dropped until the carbon nanotube film is immersed. The organic solvent is a volatile organic solvent, for example, ethanol, methanol, acetone, dichloroethane, or chloroform. In this example, the organic solvent is ethanol. Microscopically, when a volatile organic solvent volatilizes, a part of adjacent carbon nanotubes in the carbon nanotube film contracts into a bundle by the action of surface tension. In addition, since a part of the adjacent carbon nanotubes contracts into a bundle, the mechanical strength and toughness of the carbon nanotube film are increased, the surface area of the carbon nanotube film is decreased, and the adhesiveness is decreased. Macroscopically, the carbon nanotube film has a uniform film structure.

  The layered carbon nanotube structure may be a plurality of carbon nanotube wires that are parallel and spaced apart. The plurality of carbon nanotube wires are suspended and installed at positions corresponding to the recesses 108. Preferably, the extending direction of the carbon nanotube wire is perpendicular to the extending direction of the recess 108. The distance between adjacent carbon nanotube wires is 1 μm to 200 μm. Preferably, it is 50 micrometers-130 micrometers. In this example, the distance between adjacent carbon nanotube wires is 120 μm, and the diameter of the carbon nanotube wires is 1 μm.

  The carbon nanotube wire is a non-twisted carbon nanotube wire or a twisted carbon nanotube wire. Both non-twisted carbon nanotube wires and twisted carbon nanotube wires are self-supporting structures. Referring to FIG. 6, when the carbon nanotube wire is a non-twisted carbon nanotube wire, the carbon nanotube wire includes a plurality of carbon nanotube segments (not shown) connected end to end with an intermolecular force. Further, a plurality of carbon nanotubes having the same length are arranged in parallel in each carbon nanotube segment. The plurality of carbon nanotubes are arranged parallel to the central axis of the carbon nanotube wire. The length, thickness, uniformity and shape of the carbon nanotube segments are not limited. The length of the non-twisted carbon nanotube wire is not limited, and the diameter is 0.5 nm to 100 μm. The carbon nanotube film is treated with an organic solvent to obtain a non-twisted carbon nanotube wire. Specifically, the entire surface of the carbon nanotube film is immersed with an organic solvent. After that, when the volatile organic solvent volatilizes, a plurality of carbon nanotubes that are parallel to each other in the carbon nanotube film are closely bonded by intermolecular force due to the action of surface tension, and the carbon nanotube film contracts, A non-twisted carbon nanotube wire is formed. The organic solvent is ethanol, methanol, acetone, dichloroethane or chloroform. Compared with a carbon nanotube film that is not treated with an organic solvent, a non-twisted carbon nanotube wire treated with an organic solvent has a reduced specific surface area and a low adhesion. In addition, the mechanical strength and toughness of the carbon nanotube wire are increased, and the possibility that the carbon nanotube wire is broken by an external force is reduced.

  Referring to FIG. 7, twisted carbon nanotube wires can be formed by applying opposing forces to opposite ends along the longitudinal direction of the carbon nanotube film. This twisted carbon nanotube wire preferably includes a plurality of carbon nanotube segments (not shown) connected end to end by intermolecular forces. In addition, a plurality of carbon nanotubes having the same length are arranged in parallel in each carbon nanotube segment. The length, thickness, uniformity and shape of the carbon nanotube segments are not limited. The length of one twisted carbon nanotube wire is not limited, and its diameter is 0.5 nm to 100 μm. Further, the twisted carbon nanotube wire is treated with an organic solvent. The twisted carbon nanotube wire treated with the organic solvent has a reduced specific surface area and small adhesion, but the mechanical strength and toughness of the carbon nanotube wire are enhanced. A method for producing a carbon nanotube wire is described in Patent Document 2 and Patent Document 3.

  In the method of manufacturing a plurality of carbon nanotube wires, first, a carbon nanotube film is placed on the first electrode 104 and the second electrode 105, and then the carbon nanotube film is cut by a laser to be parallel to each other and spaced apart from each other. Forming a plurality of carbon nanotube strips installed. Finally, the carbon nanotube strip is contracted with an organic solvent to form a carbon nanotube wire.

  Referring to FIG. 8, the carbon nanotube strip is processed by the organic solvent to form a plurality of carbon nanotube wires that are spaced apart from each other. Both ends of the carbon nanotube wire are connected to the first electrode 104 and the second electrode 105, respectively. Thereby, the drive voltage of the sound wave generator 102 is reduced, and the stability of the sound wave generator 102 is improved. In FIG. 8, a black part is a 1st board | substrate and a white part is an electrode.

  In the process of processing the carbon nanotube film strip with the organic solvent, the carbon nanotubes positioned at the protrusions 109 are strongly fixed to the surface of the insulating layer 103 and thus basically do not shrink. Therefore, the carbon nanotube wire is preferably electrically connected to the first electrode 104 and the second electrode 105. In order to ensure that the carbon nanotube strip is favorably contracted to the carbon nanotube wire, the width of the carbon nanotube strip is between 10 μm and 50 μm. When the width of the carbon nanotube strip is wider than 10 μm to 50 μm, there is a possibility that a tear may occur in the process of contracting the carbon nanotube fill strip, which affects the thermoacoustic effect. In addition, when the width of the carbon nanotube film strip is narrower than 10 μm to 50 μm, the carbon nanotube film strip can be ruptured in the process of shrinking or the formed carbon nanotube wire is thin, so that the service life of the sound wave generator is increased. Affect. Accordingly, in this example, the width of the carbon nanotube strip is 30 μm, the diameter of the contracted carbon nanotube wire is 1 μm, and the distance between adjacent carbon nanotube wires is 120 μm. The width of the carbon nanotube strip is not limited, and the width of the carbon nanotube strip can be selected as necessary as long as the carbon nanotube wire normally generates sound. After the treatment with the organic solvent, the carbon nanotube wire is firmly attached to the surface of the first substrate 101, and the suspended portion is kept in a stretched state, and the carbon nanotube wire is not deformed during operation. Guarantee. This prevents the carbon nanotube wire from being deformed and affecting the thermoacoustic effect.

  In this embodiment, the sound wave generator 102 is made of a non-twisted carbon nanotube wire, and the non-twisted carbon nanotube wire is obtained by processing a single-walled carbon nanotube film. In each loudspeaker 100 ′, the sound wave generator 102 corresponding to the recess 108 includes a plurality of carbon nanotube wires arranged in parallel at intervals.

  The first electrode 104 and the second electrode 105 are electrically connected to the sound wave generator 102, respectively, and a frequency electric signal is input to the sound wave generator 102 through the first electrode 104 and the second electrode 105. Specifically, the first electrode 104 and the second electrode 105 may be directly installed on the first surface 106 of the first substrate 101. Or you may install in the surface on the opposite side to the 1st board | substrate 101 of the sound wave generator 102. FIG. The first electrode 104 and the second electrode 105 are made of a conductive material, and their shapes and structures are not limited. Specifically, the first electrode 104 and the second electrode 105 may have an elongated strip shape, a rod shape, or other shapes. The material is a conductive material such as metal, conductive polymer, conductive adhesive, conductive paste, metallic carbon nanotube, or ITO.

  In the present embodiment, the first electrode 104 and the second electrode 105 are respectively installed on the insulating layer 103 provided on the protrusions 109 on opposite edges of the sound wave generator 102 and installed in parallel with the extending direction of the recess 108. Is done. The first area 1020 and the second area 1021 of the sound wave generator 102 are disposed between the first electrode 104 and the second electrode 105. The first electrode 104 and the second electrode 105 are made of a metal thread.

  Since carbon nanotubes have excellent conductivity in the axial direction, when the carbon nanotubes are arranged along the same direction, the carbon nanotubes extend along the direction from the first electrode 104 to the second electrode 105. Is preferred. Preferably, the distance from the first electrode 104 to the second electrode 105 is basically the same. At this time, the carbon nanotube structure between the first electrode 104 and the second electrode 105 basically has the same resistance value. Preferably, the lengths of the first electrode 104 and the second electrode 105 are equal to or longer than the width of the carbon nanotube structure. Thereby, the whole carbon nanotube structure can be utilized on average. In this embodiment, the carbon nanotubes in the carbon nanotube structure are arranged perpendicular to the length direction of the first electrode 104 and the second electrode 105. The first electrode 104 and the second electrode 105 are parallel to each other. A frequency electrical signal is input to the carbon nanotube structure by the first electrode 104 and the second electrode 105.

  The loudspeaker 100 'is fixedly accommodated in the accommodating space of the outer case 110 by an adhesive and a groove structure. In the present embodiment, the loudspeaker 100 ′ is fixed to the rear cover 114 of the outer case 110 with an adhesive. Further, a fixing groove 120 is formed in the accommodation space of the rear cover 114 of the outer case 110. The fixing groove 120 is formed integrally with the rear cover 114. The shape of the fixed groove 120 is not limited. A part of the loudspeaker 100 ′ is in contact with the fixing groove 120, and the other part of the loudspeaker 100 ′ is suspended in the accommodation space of the rear cover 114. As a result, the loudspeaker 100 'has a large contact area with air or a surrounding medium and a high speed of exchanging heat, so that it can have excellent sound generation efficiency.

  The material of the fixing groove 120 is an insulating material or a material having low conductivity. Specifically, a hard material or a soft material may be used. Examples of the hard material include diamond, glass, ceramic, and quartz. The soft material is, for example, a plastic, resin, or paper material. Preferably, the material of the fixing groove 120 has excellent heat insulation. As a result, the heat generated by the sound wave generator 102 is not absorbed by the material of the fixed groove 120 and does not affect the sound generation efficiency.

  Since the principle of sound generation by the sound wave generator 102 is electro-thermal-sound conversion, the sound wave generator 102 generates a certain amount of heat simultaneously with the sound generation. When the earphone 10 operates, the conducting wire 130 is electrically connected to the first electrode 104 and the second electrode 105. A frequency electrical signal source and a drive signal source are connected to the loudspeaker 100 ′ by a conductor 130. The sound wave generator 102 has a small heat capacity per unit area and a large heat dissipating surface. Therefore, after inputting a signal, the sound wave generator 102 quickly rises in temperature, the temperature changes periodically, and heat is transferred to the surrounding medium. The thermal expansion caused by this propagated heat changes the density of the surrounding medium and generates sound waves. Furthermore, a heat dissipation device (not shown) may be installed in the earphone 10. The heat dissipation device is installed on the surface of the first substrate 101 opposite to the sound wave generator 102.

  The earphone 10 of the present invention has the following excellent points. First, since the plurality of recesses 108 are formed in the first substrate 101, the carbon nanotube structure can be effectively protected and the acoustic effect is not affected. Second, the depth of the plurality of recesses 108 is 100 μm to 200 μm. Accordingly, the sound wave generator 102 is protected, and at the same time, the distance between the first area 1020 of the sound wave generator 102 and the bottom surface of the recess 108 is ensured. Due to this distance, the heat generated when the sound wave generator 102 is activated can be completely absorbed by the first substrate 101. This prevents the generated sound from being lowered because the generated heat is not propagated to the surrounding medium. It also ensures that the sound wave generator 102 has an excellent acoustic effect at each acoustic frequency.

(Example 2)
The second embodiment of the present invention provides an earphone 20. The earphone 20 of the present embodiment includes an outer case 210 and a loudspeaker 200 ′. The outer case 210 has a storage space, and the loudspeaker 200 ′ is stored in this storage space.

  The structure of the earphone 20 of the present embodiment is different from the structure of the earphone 10 as follows. Referring to FIG. 9, the loudspeaker 200 ′ includes a plurality of first electrodes 104 and a plurality of second electrodes 105, and the plurality of first electrodes 104 and the plurality of second electrodes 105 are alternately disposed on the surface of the protrusion 109. The plurality of first electrodes 104 are electrically connected to each other, and the plurality of second electrodes 105 are electrically connected to each other.

  Specifically, the plurality of first electrodes 104 are electrically connected to form a first comb electrode (not shown). The plurality of second electrodes 105 are electrically connected to form a second comb electrode (not shown). Referring to FIG. 10, the tooth portions of the first comb electrode and the tooth portions of the second comb electrode are alternately arranged. By this connection method, the adjacent first electrode 104 and second electrode 105 form one thermoacoustic unit. That is, the sound wave generator 102 includes a plurality of thermoacoustic units. Moreover, the drive voltage of the sound wave generator 102 is lowered by arranging the plurality of thermoacoustic units in parallel.

  11 and 12 show the effect of the sound generation of the earphone 20 due to the different depths of the recesses 108. FIG. If the depth of the recess 108 is too deep, there is a problem of adversely affecting the acoustic effect of the sound wave generator 102. Therefore, the depth of the recess 108 is preferably 100 μm to 200 μm. At this time, the earphone 20 reaches an acoustic frequency that can be heard even by human ears and has an excellent heat wavelength. Further, the first substrate 101 protects the sound wave generator 102 and at the same time secures a sufficient distance between the first substrate 101 and the sound wave generator 102. Due to the distance, the heat generated by the operation of the sound wave generator 102 can be completely absorbed by the first substrate 101. This prevents the volume from being lowered because the generated heat is not propagated to the surrounding medium. In addition, it ensures that the sound wave generator 102 has an excellent acoustic effect for each acoustic frequency.

(Example 3)
The third embodiment of the present invention provides an earphone 30. The earphone 30 of the present embodiment includes an outer case 310 and a loudspeaker 300 ′. The outer case 310 has an accommodation space, and the loudspeaker 300 ′ is accommodated in this accommodation space.

  The structure of the earphone 30 of the present embodiment is different from the structure of the earphone 10 as follows. Referring to FIG. 13, in the loudspeaker 300 ', a groove (not shown) is formed on the second surface 107 of the first substrate 101, and the integrated circuit chip 201 is integrated into the groove.

  Specifically, a groove (not shown) is formed on the second surface 107 of the first substrate 101, and the integrated circuit chip 201 is fitted into the groove. Since the first substrate 101 is made of silicon, the integrated circuit chip 201 can be directly formed on the first substrate 101. That is, the circuits and microelectronic devices in the integrated circuit chip 201 are integrated in the grooves on the second surface 107 of the first substrate 101. The first substrate 101 is a support for electronic wiring and microelectronic devices, and the integrated circuit chip 201 and the first substrate 101 have an integral structure.

  Further, the integrated circuit chip 201 includes a third electrode (not shown) and a fourth electrode (not shown), the third electrode is electrically connected to the first electrode 104, and the fourth electrode is the second electrode. 105 is electrically connected. As a result, a signal is input to the sound wave generator 102. The third electrode and the fourth electrode may be installed inside the first substrate 101. In this case, the third electrode and the fourth electrode are insulated from the first substrate 101. In the present embodiment, the surfaces of the third electrode and the fourth electrode have an insulating layer. Thereby, the first substrate 101 is insulated. When the area of the first substrate 101 is very large, the integrated circuit chip 201 may be installed on the first surface 106 of the first substrate 101. In this case, there is no need to install a connection line inside the first substrate 101. Specifically, since the normal operation of the sound wave generator 102 is not affected, the integrated circuit chip 201 may be installed on the side surface of the first surface 106 of the first substrate 101. The integrated circuit chip 201 includes a voice processing module and a current processing module. During operation, the integrated circuit chip 201 processes the input audio signal and current signal, and then drives the sound wave generator 102. The sound processing module increases the work rate of the sound signal and inputs the increased sound signal to the sound wave generator 102. In addition, the current processing module processes the current input from the power source, provides a stable input current to the sound wave generator 102, and ensures the normal operation of the sound wave generator 102.

  Since the first substrate 101 is made of silicon, the integrated circuit chip 201 can be directly integrated on the first substrate 101. Thereby, the volume of the earphone 30 can be reduced by reducing the space for installing the integrated circuit chip 201 alone, which is advantageous for downsizing. Further, since the first substrate 101 has an excellent heat dissipation property, heat generated by the integrated circuit chip 201 and the sound wave generator 102 can be conducted to the outside to enhance the thermoacoustic effect.

Example 4
The fourth embodiment of the present invention provides an earphone 40. The earphone 40 of the present embodiment includes an outer case 410 and a loudspeaker 400 ′. The outer case 410 has an accommodation space, and the loudspeaker 400 ′ is accommodated in this accommodation space.

  The structure of the earphone 40 of the present embodiment is different from the structure of the earphone 10 as follows. Referring to FIG. 14, the loudspeaker 400 ′ includes a heat dissipation element 202, and the heat dissipation element 202 is installed on the second surface 107 of the first substrate 101.

  The heat dissipation element 202 is fixed to the second surface 107 of the first substrate 101 with an adhesive or a heat conductive material. The heat dissipation element 202 includes a second substrate 2020 and a plurality of heat dissipation fins 2021. The plurality of heat dissipation fins 2021 are installed on the surface of the second substrate 2020. The second substrate 2020 has a planar structure. The material of the second substrate 2020 is not limited as long as it has excellent thermal conductivity. Specifically, the material of the first substrate 2020 is one of single crystal silicon, polycrystalline silicon, and metal. The heat dissipation fin 2021 is a metal piece. The metal material is any one of gold, silver, copper, iron, and aluminum, or an alloy thereof. In the present embodiment, the heat dissipation fin 2021 is a copper piece, and the thickness thereof is 0.5 mm to 1 mm. The plurality of heat dissipation fins 2021 are installed on the surface of the second substrate 2020 by an adhesive or welding. In the present embodiment, the plurality of heat dissipation fins 2021 are installed on the surface of the first substrate 2020 with an adhesive. The heat dissipating fins 2021 can transmit heat generated during operation of the sound wave generator 102 to the outside, lower the temperature during operation of the earphone 40, extend the service life of the earphone 40, and increase the work rate of the earphone 40. .

  Furthermore, the earphone 40 of the present embodiment may have a plurality of heat dissipation holes (not shown). The plurality of heat dissipation holes are installed in the rear cover 114 of the outer case 110. The shape and size of the heat dissipation holes are not limited and can be selected as necessary. With this heat dissipation hole, heat generated during operation of the sound wave generator 102 can be transmitted to the outside, the temperature during operation of the earphone 40 can be lowered, the service life of the earphone 40 can be extended, and the work rate of the earphone 40 can be increased. .

(Example 5)
Referring to FIGS. 15, 16, and 4, the fifth embodiment of the present invention provides an earphone 50. The earphone 50 of the present embodiment includes an outer case 510 and a plurality of loudspeakers 100 ′. The outer case 510 has an accommodation space, and the plurality of loudspeakers 100 ′ are accommodated in the accommodation space.

  The structure of the outer case 510 is not limited, and may be integrally formed or other methods as long as there is a space. In the present embodiment, the outer case 510 includes a front cover 512, a rear cover 514, and a sound generator 515. The front cover 512 has a sound generating portion 515, and at least one through hole 516 is formed in the sound generating portion 515. The front cover 512 and the rear cover 514 are tightly coupled to form the outer case 510. If the plurality of loudspeakers 100 ′ are installed in the outer case 510 and are opposed to the sound generator 515, their fixed positions are not limited. In the present embodiment, the plurality of loudspeakers 100 ′ are fixedly installed on the rear cover 514 of the outer case 510 and are installed at a distance from the front cover 512 of the outer case 510. The plurality of loudspeakers 100 ′ form one sound generation assembly 500. The sound generation assembly 500 is disposed opposite to the sound generation unit 515 in the front cover 512 and at an interval. Thereby, the sound generated by the plurality of loudspeakers 100 ′ is transmitted to the outside of the earphone 50 through the through hole 516.

  The material of the outer case 510 is light and has a specific strength. For example, plastic or resin. The size and shape of the outer case 510 can be selected as necessary. The size of the outer case 510 is the same as or larger than the size of the human ear and covers the human ear. The design of the outer case 510 may be a structural design applied to ergonomics.

  Further, the outer case 510 may include a protective cover 518. The protective cover 518 is installed between the sound generation assembly 500 and the front cover 112, and is installed at a distance from the sound generation assembly 500. The protective cover 518 is connected to the front cover 512 by a fixing element (not shown). The protective cover 518 has a plurality of openings (not shown). The material of the protective cover 518 is not limited, and is plastic or metal. The protective cover 518 protects the plurality of loudspeakers 100 'and prevents dust and the like. However, the protective cover 518 may not be installed as necessary.

  Further, the earphone 50 includes a plurality of conductive wires 530. At least two conductors are installed for each loudspeaker 100 '. The plurality of conductive wires 530 are electrically connected to the plurality of loudspeakers 100 ′ through the inside of the outer case 510, and transmit electric frequency signals to the plurality of loudspeakers 100 ′.

  Further, the earphone 50 may include a sponge cover (not shown). The sponge cover reduces the pressure on the ear by covering the outer case 510. Further, the earphone 50 may include a microphone (not shown). The microphone is connected to the outer case 510 by a conductive wire. Further, the earphone 50 may include a radio signal receiving unit (not shown). The radio signal receiving unit is installed inside the outer case 510 and is electrically connected to a plurality of loudspeakers 100 '. Thereby, the earphone 50 can receive a radio signal.

  Referring to FIG. 16, a plurality of loudspeakers 100 'are installed on the shared first surface 106' of the shared first substrate 101 '. As long as the sound wave generators 102 of the loudspeaker 100 'are insulated from each other, the arrangement of the loudspeakers 100' is not limited. Thereby, each loudspeaker 100 'can generate sound independently. In the present embodiment, the number of loudspeakers 100 ′ is four, and the four loudspeakers 100 ′ are installed on the shared first surface 106 ′ of the shared first substrate 101 ′ by a 2 × 2 method. The earphone 50 can realize an excellent three-dimensional sound effect by a method of inputting different signals to the plurality of loudspeakers 100 ′, a method of adjusting the order of sound generation of each loudspeaker 100 ′, or other methods. .

  A plurality of dividing lines 1010 are provided on the shared first surface 106 ′ of the shared first substrate 101 ′, and the shared first surface 106 ′ forms a plurality of unit lattices by the plurality of dividing lines 1010. To do. A plurality of recesses 108 are formed in each unit grid. The number of the recesses 108 formed in the unit grid is not limited and can be selected as necessary. In this embodiment, four unit grids are formed on the shared first surface 106 ′ of the first substrate 101 ′, and six recesses 108 are formed in each unit grid. The plurality of dividing lines 1010 are any one type or various types of through grooves, through holes, blind grooves, and blind holes. In the present embodiment, the plurality of dividing lines 1010 are stop grooves. When the plurality of dividing lines 1010 are through grooves, it is necessary to ensure that two adjacent dividing lines 1010 do not intersect. This ensures that the first substrate 101 'has an integral structure. The distribution of the dividing line 1010 can be selected according to the area of the first substrate 101 ′, the number and area of the obtained unit lattices. In this embodiment, the plurality of dividing lines 1010 on the first substrate 101 ′ are arranged in parallel with each other, or the plurality of dividing lines 1010 are arranged perpendicular to each other.

  The plurality of loudspeakers 100 ′ are fixed to the rear cover 514 of the outer case 510 by an adhesive and a fixing groove. In the present embodiment, the plurality of loudspeakers 100 ′ are fixed to the accommodation space of the rear cover 514 of the outer case 510 by the fixing grooves 520. The fixing groove 520 is formed by the outer case 510. The shape of the fixing groove 520 is not limited. Preferably, the fixing groove 520 is a fixing groove in the accommodation space of the rear cover 514 of the outer case 510. A part of the loudspeaker 100 ′ contacts the fixing groove 520, and the other part of the loudspeaker 100 ′ is suspended in the accommodation space of the rear cover 114. As a result, the loudspeaker 100 'has an excellent sound generation efficiency because it has a large contact area with air or a surrounding medium and also has a high rate of heat exchange.

  The material of the fixing groove 520 is an insulating material or a material having low conductivity. Specifically, a hard material or a soft material may be used. The hard material is, for example, diamond, glass, ceramic or quartz. The soft material is, for example, a plastic, resin or paper material. The material of the fixing groove 520 preferably has excellent heat insulation. As a result, the heat generated by the sound wave generator 102 is not absorbed by the material of the fixed groove 520 and does not affect the sound generation efficiency.

  The earphone 50 of the present invention has the following excellent points. First, the earphone includes a plurality of loudspeakers, and realizes a three-dimensional sound effect by adjusting the order in which different sound sources are input to each loudspeaker or the sound of each loudspeaker is generated. Second, since a plurality of recesses and protrusions are formed on the first substrate of each loudspeaker, the carbon nanotube structure can be effectively protected and an excellent acoustic effect can be realized.

(Example 6)
The sixth embodiment of the present invention provides an earphone 60. The earphone 60 of the present embodiment includes an outer case 610 and a plurality of loudspeakers 200 ′. The outer case 610 has a storage space, and the plurality of loudspeakers 200 ′ are stored in the storage space.

  The structure of the earphone 60 of the present embodiment is basically the same as the structure of the earphone 50, but the difference is that the earphone 60 includes a plurality of loudspeakers 200 '.

(Example 7)
The seventh embodiment of the present invention provides an earphone 70. The earphone 70 of the present embodiment includes an outer case 710 and a plurality of loudspeakers 300 ′. The outer case 710 has a storage space, and the plurality of loudspeakers 300 ′ are stored in the storage space.

  The structure of the earphone 70 of the present embodiment is basically the same as that of the earphone 50, but the difference is that the earphone 70 includes a plurality of loudspeakers 300 '.

(Example 8)
The eighth embodiment of the present invention provides an earphone 80. The earphone 80 of the present embodiment includes an outer case 810 and a plurality of loudspeakers 400 ′. The outer case 810 has an accommodation space, and the plurality of loudspeakers 400 ′ are accommodated in the accommodation space.

  The structure of the earphone 80 of the present embodiment is basically the same as the structure of the earphone 50, but the difference is that the earphone 80 includes a plurality of loudspeakers 400 '.

Example 9
Referring to FIG. 17, the ninth embodiment of the present invention provides an earphone 90. The earphone 90 of the present embodiment includes an outer case 910 and a plurality of loudspeakers 100 ′. The outer case 910 has an accommodation space, and the plurality of loudspeakers 100 ′ are accommodated in the accommodation space.

  Compared with the structure of the earphone 50, the structure of the earphone 90 of the present embodiment has the following different points. In the earphone 90, a plurality of loudspeakers 100 ′ are not on the same plane but are installed at different angles with respect to the sound generator 915. The plurality of loudspeakers 100 ′ do not employ the shared first substrate 101 ′, and are respectively installed in the accommodation space of the outer case 910. The sound generator 915 is installed at a different angle. The angle is 0 ° to 180 ° (not including 0 ° and 180 °). The plurality of loudspeakers 100 ′ are fixed at different positions in the housing space of the outer case 910 by the fixing groove 920. In this embodiment, the fixing groove 920 has a bottom surface (not shown) corresponding to the sound generator 915 and two side surfaces (not shown) adjacent to the bottom surface. At least one loudspeaker 100 'is installed on each of the bottom surface and the two side surfaces. Loudspeakers 100 ′ installed on the bottom surface and the two side surfaces are installed at different angles with respect to the sound generator 915. Further, the fixing groove 920 may have a plurality of surfaces, and at least one loudspeaker 100 'is installed on each surface. The plurality of loudspeakers 100 ′ are installed at different angles with respect to the sound generator 915. The plurality of loudspeakers 100 ′ independently generate sounds, and the plurality of loudspeakers 100 ′ form different angles with the sound generating unit 915 by adjusting the plane on which the plurality of loudspeakers 100 ′ are installed. . Thereby, an excellent acoustic effect is formed.

  Furthermore, the earphone 90 of the present embodiment may have a plurality of heat dissipation holes (not shown). The plurality of heat dissipation holes are installed in the rear cover 914 of the outer case 910. The shape and size of the heat dissipation holes are not limited and can be selected as necessary. The heat dissipating holes transmit heat generated during operation of the sound wave generator 102 to the outside, lower the temperature during operation of the earphone 90, extend the service life of the earphone 90, and increase the work rate of the earphone 90.

(Example 10)
18 and 19, the earphone 10 ′ of the present embodiment includes an outer case 110 ′ and an acoustic chip 10A. The outer case 110 ′ has a storage space, and the acoustic chip 10A is stored in this storage space.

  The structure of the outer case 110 ′ is not limited, and may be integrally formed or other methods as long as there is a space. In this embodiment, the outer case 110 ′ includes a front cover 112 ′, a rear cover 114 ′, and a through hole 116 ′. The through hole 116 ′ is formed in the front cover 112 ′. The front cover 112 'and the rear cover 114' are tightly coupled to form the outer case 110 '. Since the acoustic chip 10A is fixed to the outer case 110 'in a removable manner, it can be disassembled. Thereby, when the sound wave generator 102 breaks down, it is easy to replace the acoustic chip 10A. If the sound chip 10A is installed in the outer case 110 'and is opposed to the through hole 116', the fixing position of the acoustic chip 10A is not limited. Here, being installed facing the through-hole 116 'means that the sound wave generator 102 in the acoustic chip 10A is installed facing the through-hole 116'. In the present embodiment, the acoustic chip 10A is fixedly installed on the rear cover 114 'of the outer case 110', and is installed at a distance from the front cover 112 'of the outer case 110'. Further, the acoustic chip 10A is disposed so as to face the through hole 116 'in the front cover 112' and be spaced from the through hole 116 '. The sound generated by the acoustic chip 10A through the through-hole 116 'is transmitted to the outside of the earphone 10'.

  The material of the outer case 110 'is light in mass and has a specific strength. For example, plastic or resin. The size and shape of the outer case 110 'can be selected as necessary. The size of the outer case 110 ′ is the same as or larger than the size of the human ear and covers the human ear. The design of the outer case 110 'may be a structural design applied to ergonomics.

  In addition, the earphone 10 'includes at least one conductor 130'. The at least one conducting wire 130 'is electrically connected to the acoustic chip 10A through the inside of the outer case 110', and transmits a frequency electric signal to the acoustic chip 10A.

  Furthermore, the earphone 10 ′ of this embodiment may have a plurality of heat dissipation holes (not shown). The plurality of heat dissipation holes are provided in the rear cover 114 'of the outer case 110'. The shape and size of the heat dissipation holes are not limited and can be selected as necessary. The heat dissipating holes transmit heat generated during operation of the acoustic chip 10A to the outside, lower the temperature during operation of the earphone 10 ', extend the service life of the earphone 10', and increase the work rate of the earphone 10 '. Can do.

  The acoustic chip 10 </ b> A includes a loudspeaker 100 ′ and a housing 200. The housing 200 has a space, and the loudspeaker 100 'is accommodated in this space.

  In the loudspeaker 100 ′, the carbon nanotube structure included in the sound wave generator 102 is protected by the housing 200, so that the carbon nanotube structure is not broken by an external force. The size and shape of the housing 200 are not limited and can be selected as necessary. The housing 200 has at least one opening 210, and the at least one opening 210 is installed at a distance from the through hole 116 ′ of the outer case 110 ′, and the loudspeaker 100 is formed by the opening 210. The sound generated by 'can be propagated outside the housing 200. The sound wave generator 102 is preferably installed between the first substrate 101 and the opening 210 and is opposed to at least one opening 210. In the present embodiment, the housing 200 includes a third substrate 207 and a protective cover 204. The protective cover 204 is installed on the surface of the third substrate 207. The loudspeaker 100 'is installed on the surface of the third substrate 207, and the protective cover 204 covers the loudspeaker 100'. That is, the third substrate 207 and the protective cover 204 form a space, and the loudspeaker 100 'is accommodated in the space.

The third substrate 207 is a glass plate, a ceramic plate, a printed circuit board (PCB), a polymer plate or a wood plate. The third substrate 207 is used to support and fix the loudspeaker 100 ′. The size and shape of the third substrate 207 are not limited and can be selected as necessary. Area of the third substrate 207 is larger than the size of the loudspeaker 100 ', and its area is 36mm ² ~150mm ^2, for ^example, a ^{49mm 2, 64mm 2, 81mm 2} , 100mm 2. The thickness of the third substrate 207 is 0.5 mm to 5 mm, for example, 1 mm, 2 mm, 3 mm, and 4 mm. The protective cover 204 includes an annular side wall 206 and a bottom wall 208. The bottom wall 208 has a plurality of the apertures 210. The size and shape of the protective cover 204 are not limited and can be selected as necessary. The size of the protective cover 204 is slightly larger than the size of the loudspeaker 100 ′. The protective cover 204 is fixed to the surface of the third substrate 207 by an adhesive or a removable method. The material of the protective cover 204 is glass, ceramic, polymer, or metal. In the present embodiment, the third substrate 207 is a printed circuit board, and the protective cover 204 is a metal bucket type having one end opened. The protective cover 204 and the loudspeaker 100 ′ are installed at a distance from each other.

  The housing 200 has two pins 212, and the two pins 212 are installed outside the housing 200. There is no restriction on the position of the two pins 212. The two pins 212 are electrically connected to the first electrode 104 and the second electrode 105, respectively. The two pins 212 may be a pin grid array (PGA), a surface mount type (SMD), or other shapes. When the two pins 212 are a pin grid array, when the acoustic chip 10A is installed in the electronic component, the two pins 212 are directly inserted into corresponding insertion holes in the electric circuit board of the electronic component. When the two pins 212 are surface-mounted, when the acoustic chip 10A is installed on the electronic component, the two pins 212 are welded to the surface of the electric circuit board of the electronic component. In the present embodiment, the two pins 212 are a pin grid array, which is installed on the bottom surface of the third substrate 207 opposite to the loudspeaker 100 ′, and is connected to the first electrode 104 and the second electrode 105 by conducting wires, respectively. Electrically connected.

  The acoustic chip 10A is fixed to the accommodation space of the outer case 110 'by an adhesive and a groove structure. In this embodiment, the acoustic chip 10A is fixed to the accommodation space of the outer case 110 'by the fixing groove 120'. The fixing groove 120 'is formed integrally with the outer case 110'. The shape of the fixing groove 120 ′ is not limited, but preferably the fixing groove 120 ′ is a fixing groove formed in the accommodation space of the outer case 110 ′. A part of the acoustic chip 10 </ b> A contacts the fixing groove 120 ′, and the other part of the acoustic chip 10 </ b> A is suspended in the accommodation space of the rear cover 114. As a result, the contact area of the acoustic chip 10A with the air or the surrounding medium is increased, and the heat exchange speed is high, so that the sound generation efficiency is excellent.

  The material of the fixing groove 120 'is an insulating material or a material having low conductivity. Specifically, a hard material or a soft material may be used. The hard material is, for example, diamond, glass, ceramic or quartz. The soft material is, for example, a plastic, resin or paper material. Preferably, the material of the fixing groove 120 'has excellent heat insulating properties. Thereby, the heat generated by the sound wave generator 102 is not absorbed by the material of the fixed groove 120 ′ and does not affect the sound generation efficiency.

(Example 11)
The earphone 20 ′ of the present embodiment includes an outer case 210 ′ and an acoustic chip 20A. The outer case 210 'has a storage space, and the acoustic chip 20A is stored in this storage space.

  When the structure of the acoustic chip 20A of Example 11 is compared with the structure of the acoustic chip 10A of Example 10, there are the following differences. Referring to FIG. 20, the housing 200 includes a third substrate 207 and a protective net 216, and the third substrate 207 has a first recess 214. Specifically, the loudspeaker 100 ′ is installed in the first recess 214 of the third substrate 207, and the protective net 216 covers the first recess 214. The protective net 216 has a plurality of openings 210. The protective net 216 may be a metal net or a fiber net. Alternatively, a metal plate, a ceramic plate, a resin plate or a glass plate having a plurality of openings may be used. The protective net 216 is suspended from the first recess 214. The first recess 214 is manufactured by etching, imprinting, molding, and stamping. In the present embodiment, the third board 207 is a printed board, and the protective net 216 is a metal net. The housing 200 includes two pins 212, and the two pins 212 may be installed on the same side surface or different side surfaces of the bottom of the third substrate 207.

(Example 12)
The earphone 30 ′ of this embodiment includes an outer case 310 ′ and an acoustic chip 30A. The outer case 310 ′ has a storage space, and the acoustic chip 30A is stored in the storage space.

  When the structure of the acoustic chip 30A of Example 12 is compared with the structure of the acoustic chip 10A of Example 10, there are the following differences. Referring to FIG. 21, the loudspeaker 100 ′ includes a first electrode 104, a second electrode 105, and a sound wave generator 102. Moreover, the housing | casing 200 has the two pins 212, and these two pins 212 are surface mounting types, and are installed in the both sides of the housing | casing 200, respectively. Specifically, the first electrode 104 and the second electrode 105 are directly installed on the surface of the third substrate 207, and the sound wave generator 102 is suspended and installed by the first electrode 104 and the second electrode 105. . That is, the loudspeaker 100 ′ can omit the first substrate 101. Thereby, the structure of the earphone 30 'is further simplified, easy to produce, and advantageous for industrialization.

(Example 13)
The earphone 40 ′ of the present embodiment includes an outer case 410 ′ and an acoustic chip 40A. The outer case 410 ′ has a storage space, and the acoustic chip 40A is stored in the storage space.

  When the structure of the acoustic chip 40A of the thirteenth embodiment is compared with the structure of the acoustic chip 20A of the eleventh embodiment, there are the following differences. Referring to FIG. 22, the loudspeaker 100 ′ includes a first electrode 104, a second electrode 105, and a sound wave generator 102. Moreover, the housing | casing 200 has the two pins 212, and these two pins 212 are surface mounting types, and are installed in the both sides of the housing | casing 200, respectively. Specifically, in the present embodiment, the bottom surface of the first recess has one recess, and the sound wave generator 102 is suspended and installed by this recess. That is, the loudspeaker 100 ′ can omit the first substrate 101. This further simplifies the structure of the earphone 40 '. The third substrate 207 is preferably an insulating substrate. In this embodiment, the two pins 212 are attached to the outer surface of the second substrate 202.

(Example 14)
The earphone 50 ′ of the present embodiment includes an outer case 510 ′ and an acoustic chip 50A. The outer case 510 ′ has a storage space, and the acoustic chip 50A is stored in this storage space.

  When the structure of the acoustic chip 50A of the fourteenth embodiment is compared with the structure of the acoustic chip 20A of the eleventh embodiment, there are the following differences. Referring to FIG. 23, the acoustic chip 50 </ b> A includes an integrated circuit chip 201, and the integrated circuit chip 201 is accommodated in the space of the housing 200. Specifically, the first surface 106 of the first substrate 101 has a second recess 218, and the sound wave generator 102 is suspended and installed by the second recess 218. A third recess 220 is formed on the second surface 107 of the first substrate 101, and the integrated circuit chip 201 is installed in the third recess 220. The housing 200 has four pins 212, of which two pins 212 are electrically connected to the integrated circuit chip 201. Thereby, a driving voltage can be provided to the integrated circuit chip 201. The other two pins 212 are electrically connected to the first electrode 104 and the second electrode 105 via the integrated circuit chip 201, and input a frequency electric signal to the loudspeaker 100 '.

The position where the integrated circuit chip 201 is installed is not limited. For example, the integrated circuit chip 201 can be installed on the first surface 106 of the first substrate 101, installed on the second surface 107, or installed inside the first substrate 101. . The integrated circuit chip 201 includes a power amplification circuit (not shown) for frequency electrical signals and a DC bias circuit (not shown). The integrated circuit chip 201 has a power amplification function and a direct current bias function with respect to the frequency electric signal. As a result, the integrated circuit chip 201 increases the input frequency electric signal and then inputs the frequency electric signal to the sound wave generator 102. At the same time, the integrated circuit chip 201 can solve the problem of frequency multiplication of the frequency electric signal by the DC bias. Further, the integrated circuit chip 201 may be a packaged chip or an unpackaged bare chip. The size and shape of the integrated circuit chip 201 are not limited. Since the integrated circuit chip 201 only realizes a power amplification action and a direct current bias action, the internal circuit structure is simple and its area is smaller than 1 cm ² , for example, 49 mm ² , 25 mm ² , 9 mm ² or 9 mm. ^Even smaller than ² . Thereby, the acoustic chip 50A is reduced in size. In this embodiment, the integrated circuit chip 201 is fixed in the third recess 220 of the first substrate 101 with an adhesive. Further, the integrated circuit chip 201 is electrically connected to the first electrode 104 and the second electrode 105 by two conductive wires 140, respectively. When the first substrate 101 is an insulating substrate, two holes are formed in the first substrate 101, and the two conductive wires 140 are passed through the two holes. When the first substrate 101 is a conductive substrate, the conductive wire 140 needs to be covered with an insulating material. When the acoustic chip 50A is activated, the integrated circuit chip 201 outputs a frequency electric signal to the sound wave generator 102, and the sound wave generator 102 intermittently heats the surrounding medium by the output frequency electric signal. The medium is thermally expanded and heat exchange is performed to generate sound waves.

(Example 15)
Earphone 60 'of the present embodiment includes an outer case 610' and an acoustic chip 60A. The outer case 610 ′ has an accommodation space, and the acoustic chip 60A is accommodated in this accommodation space.

  When the structure of the acoustic chip 60A of the fifteenth embodiment and the structure of the acoustic chip 50A of the fourteenth embodiment are compared, there are the following differences. Referring to FIG. 24, the first substrate 101 is made of silicon, and the integrated circuit chip 201 is directly placed on the first substrate 101 and is integrally formed with the first substrate 101 by microelectronic processing. The structure of the loudspeaker in the acoustic chip 60A is the same as that of the loudspeaker 200 'of the second embodiment. A plurality of recesses 108 and a plurality of protrusions 109 are formed on the first surface 106 of the first substrate 101, and the loudspeaker 100 ′ in the acoustic chip 60 </ b> A includes a plurality of first electrodes 104 and a plurality of second electrodes 105. .

  The earphone of the present invention has the following excellent points. Since the sound wave generator is installed in the housing to form an acoustic chip, if the acoustic chip of the earphone breaks down, the acoustic chip can be easily replaced and the service life of the earphone can be extended.

10, 20, 30, 40, 50, 60, 70, 80, 90, 10 ', 20', 30'40 ', 50', 60 'Earphone 10A, 20A, 30A, 40A, 50A, 60A Acoustic chip 100' , 200 ′, 300 ′, 400 ′ Loudspeaker 101 First substrate 101 ′ Shared first substrate 102 Sound wave generator 103 Insulating layer 104 First electrode 105 Second electrode 106 First surface 106 ′ Shared first surface 107 Second surface 108 Concave 109 Protrusion 1010 Dividing line 1020 First area 1021 Second area 110, 210, 310, 410, 510, 610, 710, 810, 910, 110 ′, 210 ′, 310 ′, 410 ′, 510 ′, 610 ′ Outer case 112, 512, 912, 112 'Front cover 114, 514, 914, 114' Rear cover 116, 516, 916, 116 ' 18, 204, 518, 918 Protective cover 120, 520, 920, 120 ′ Fixing groove 130, 530, 130 ′, 140 Conductor 201 Integrated circuit chip 202 Heat dissipating element 2020 Second substrate 2021 Heat dissipating fin 200 Housing 206 Annular side wall 207 No. Three substrates 208 Bottom wall 210 Opening 212 Pin 214 First recess 216 Protective net 218 Second recess 220 Third recess 500 Sound generation assembly 515, 915 Sound generator

Claims (3)

An earphone including an outer case and at least one loudspeaker,
The outer case has a storage space, and the at least one loudspeaker is stored in the storage space,
Each of the loudspeakers includes a first substrate, a sound wave generator, at least one first electrode, and at least one second electrode;
The first substrate includes opposing first and second surfaces;
The sound wave generator is installed on the first surface of the first substrate;
The at least one first electrode and the at least one second electrode are spaced from each other on the first surface of the first substrate and electrically connected to the sound wave generator;
The earphone according to claim 1, wherein the first surface of the first substrate has a plurality of parallel recesses spaced apart from each other, and the depth of the recesses is 100 μm to 200 μm.   The outer case includes a sound generation unit and includes a plurality of loudspeakers, and the plurality of loudspeakers are installed at different angles with respect to the sound generation unit. Earphone. The number of loudspeakers is one;
Further including a housing;
The housing has a space, and the loudspeaker is accommodated in the housing space to form an acoustic chip,
The acoustic chip is housed in a housing space of the outer case, and is fixed to the outer case by a removable method.
The housing has at least one aperture, and the sound wave generator is installed to face the at least one aperture,
The outer case has at least two pins, and the at least two pins are electrically connected to the at least one first electrode and the at least one second electrode of the loudspeaker. The earphone according to claim 1.