JP2014067911A - Semiconductor mounting device and bare chip transfer unit - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a bare chip transfer unit and a semiconductor mounting device, which pick a bare chip on a lateral face and which have high yield and high versatility.SOLUTION: A semiconductor mounting device comprises: a chucking part (chuck pins 11) which contacts a lateral face of a bare chip 3 for mechanically chucking the bare chip 3; and a rotary member which rotates simultaneously with the chucking part (chuck pins 11). The semiconductor mounting device further comprises a bare chip chucking unit (collet 1) in which rotation of the rotation member is inhibited by contact of the chucking part (chuck pins 11) with the lateral face of the bare chip 3, and the bare chip 3 is held by a force of the rotation member trying to rotate.

Description

  The present invention relates to a semiconductor mounting apparatus and a bare chip transfer unit used in a semiconductor product mounting process.

  With the dramatic progress of electronic device performance, control by semiconductor products has become indispensable. Conventionally, semiconductor products have been mounted after packaging a semiconductor chip. However, in response to recent downsizing of electronic devices, technology for mounting bare chips directly on a mounting substrate via a conductive adhesive (wax material) without packaging has been actively researched and developed. . Along with this, mounting apparatuses that efficiently realize such an assembly process have been proposed (Patent Documents 1 to 5).

  FIGS. 1 and 2 are explanatory views of a main part of a related semiconductor mounting apparatus. In these semiconductor mounting apparatuses, the bare chip 103 is sucked and held on the collet 101 by a vacuum differential pressure. Then, the mounting substrate 102 to which the wax material 104 has been applied is placed on the ceramic heater 106, and the bare chip 103 is lowered and pressed onto the mounting substrate 102. The collet 101 in FIG. 1 holds the bare chip 103 by sandwiching the side surface and the upper end of the bare chip 103 and applying a vacuum. The collet 101a in FIG. 2 holds the bare chip 103 by sandwiching the upper surface edge portion of the bare chip 103 and applying a vacuum.

  In Patent Document 1, when a semiconductor chip is die-bonded to a circuit board, a pressurized gas is introduced into the hollow portion of the die collet, and the semiconductor chip is pressed against the circuit board by this pressure, and the die collet contacts the upper edge of the semiconductor chip. An apparatus for sandwiching the side surface without doing so is disclosed. Patent Document 2 discloses a method of performing scribe bonding using a chip collet of a tweezer mechanism. Furthermore, Patent Document 5 proposes a clamping device that clamps a workpiece with a minute force so as not to damage the bare chip using a bimetal.

  FIG. 3A is a schematic view of the clamping device disclosed in Patent Document 5, and FIG. 3B is a sectional view taken along the line IIIB-IIIB in FIG. 3A. The clamping device 201 includes an air slider 202, a bare chip 203, a base plate 211, a receiving plate 212, a bimetal 213, an air cylinder 214, a shaft support member 215, a ceramic heater 216, a heat insulating block 217, and the like. The sandwiching of the bare chip 203 is performed by raising the temperature of the bimetal 213 by heating the ceramic heater 216 and deforming the bimetal 213 so as to bend in the clamping direction. More specifically, the contact member 214 is moved in the clamping direction by the parallel link mechanism, and the side surface of the bare chip 203 is clamped by the pressing force of the end surface of the contact member 214 in the clamping direction. The pressing of the bare chip 203 is released by stopping energization of the ceramic heater 216 and returning the bimetal 213 to the original linear state.

JP 58-68942 A Japanese Patent Publication No. 63-06141 Japanese Patent Laid-Open No. 11-297664 JP 11-251404 A JP 2009-83012 A

  Inspecting the recent bare chip market, the integration of bare chip surface circuit patterns has progressed, and the number of parts that can be brought into surface contact is extremely small. For this reason, a collet that does not contact the top surface of the bare chip is required. In addition, recent bare chips are becoming lighter and more vulnerable. For this reason, when holding a bare chip with a collet, it becomes easy to crack or chip. In particular, the pyramid collet as shown in FIG. 2 has a problem that chipping and cracking as shown in FIG. Further, in response to the recent demand for a small variety of semiconductor devices, there has been a demand for a semiconductor mounting device that can be shared by bare chips having different sizes and shapes. Further, if the bare chip is adsorbed by a vacuum differential pressure as shown in FIGS. 1 and 2, the bare chip may be warped and a defect may occur due to deformation, breakage, scratches, etc. of the surface circuit on the top surface of the bare chip as shown in FIG. was there.

  The present invention has been made in view of the above problems, and it is an object of the present invention to provide a bare chip transfer unit and a semiconductor mounting apparatus that sandwich a side surface of a bare chip, have a high yield, and have high versatility.

  A semiconductor mounting apparatus according to the present invention comprises a plurality of clamping portions that are mechanically clamped in contact with a side surface of a bare chip, and a rotating member that rotates in conjunction with the clamping portion, wherein the clamping portion is By contacting the side surface of the bare chip, the rotation of the rotating member is prevented, and a bare chip holding unit having a mechanism for holding the bare chip by the force of the rotating member to rotate is provided. .

  A bare chip clamping unit according to the present invention includes a clamping part that mechanically clamps in contact with a side surface of a bare chip, and a rotating member that rotates in conjunction with the clamping part, and the clamping part is a part of the bare chip. By contacting the side surface, the rotation member is prevented from rotating, and the bare chip is held by the force to rotate.

  According to the present invention, it is possible to provide a bare chip transfer unit and a semiconductor mounting apparatus that sandwich a side surface of a bare chip, have a high yield, and have high versatility.

Schematic explanatory drawing which shows the principal part of a related semiconductor mounting apparatus. Schematic explanatory drawing which shows the principal part of a related semiconductor mounting apparatus. FIG. 6 is a schematic explanatory view showing a main part of a clamping device described in Patent Document 5. 3B is a cross-sectional view taken along the line IIIB-IIIB in FIG. 3A. FIG. 3 is a partially enlarged explanatory view of FIG. 2. FIG. 3 is a schematic explanatory diagram showing an example of the problem in FIG. 2. 1 is a schematic perspective view of a semiconductor mounting apparatus according to a first embodiment. Explanatory drawing which shows an example of the apparatus structure of the semiconductor mounting apparatus which concerns on 1st Embodiment. The typical side view showing an example in the state where the semiconductor chip of the collet of the semiconductor mounting device concerning a 1st embodiment is not held. FIG. 8B is a schematic plan view of the collet of FIG. 8A. The typical side view showing an example in the state where the semiconductor chip of the collet of the semiconductor mounting device concerning a 1st embodiment was held. FIG. 9B is a schematic plan view of the collet of FIG. 9A. The typical sectional view of the collet of the semiconductor mounting device concerning a 2nd embodiment. The typical top view which shows an example of the lower surface side of the collet of the semiconductor mounting apparatus which concerns on 2nd Embodiment. The typical top view which shows an example of the rotary body of the collet which concerns on a modification.

  Hereinafter, an example of an embodiment to which the present invention is applied will be described. In addition, the size and ratio of each member in the following drawings are for convenience of explanation, and do not necessarily match the actual ones. Moreover, in subsequent embodiment, the same code | symbol is attached | subjected to the same element member, and the description is abbreviate | omitted suitably.

  The bare chip transfer unit according to the present invention has a mechanical rotary opening / closing chuck mechanism. Specifically, it has a rotary opening / closing chuck mechanism including a clamping part that mechanically clamps in contact with the side surface of the bare chip, and a rotating member on which the clamping part is fixed. The clamping part rotates in conjunction with the rotation of the rotating member. When the clamping part comes into contact with the side surface of the bare chip, the rotation of the rotating member is prevented, and the clamping part is caused by the force to rotate. Hold the side of the bare chip with.

[First Embodiment]
FIG. 6 is an explanatory view showing an example of the semiconductor mounting apparatus according to the first embodiment, and FIG. 7 is a schematic view of the semiconductor mounting apparatus according to the first embodiment. The semiconductor mounting apparatus 50 includes a collet 1 that is a bare chip transfer unit, a pressure control unit 5 that is capable of weight control, a ceramic heater 6 that is a mounting table, and a supply stage 9. Further, it has a vertical drive mechanism 7 as a position adjustment mechanism, a position detection unit 8 (see FIG. 7), and a position adjustment mechanism unit 10. Furthermore, it has the rotation transmission mechanism 12 etc. which can attach the pressure detection unit 14 and the collet 1 detachably. In such a semiconductor mounting apparatus 50, the mounting substrate 2 is mounted on the ceramic heater 6, the bare chip 3 is mounted on the supply stage 9, and the bare chip 3 is mounted on the mounting substrate 2 via the brazing material 4.

  The collet 1 is a unit for holding the bare chip 3 and transporting / mounting the bare chip 3 on the mounting substrate 2, and is attracted and fixed to a rotation transmission mechanism 12 installed below the position adjustment mechanism unit 10. The collet 1 is detachable from the rotation transmission mechanism 12. The holding mechanism for the bare chip 3 of the collet 1 will be described later. With these position adjusting mechanisms, the collet 1 can be arranged at a desired position with respect to the semiconductor mounting apparatus 50.

  The pressure detection unit 14 is for detecting the vertical drive position, and detects the pressure by detecting the contact pressure, for example. The pressure is controlled by the pressure control unit 5 based on the detection result of the pressure detection unit 14.

  The pressure control unit 5 is a unit that applies pressure to apply a desired pressure when the bare chip 3 is mounted on the mounting substrate 2. The pressure control unit 5 can control the pressure to an appropriate pressure when the bare chip 3 is mounted on the mounting substrate 2 based on the value of the pressure detection unit 14.

  The ceramic heater 6 is a unit for mounting and heating the mounting substrate 2. The brazing material 4 applied on the mounting substrate 2 is heated and melted by the ceramic heater 6, the bare chip 3 is placed on the molten brazing material 4 and a desired pressure is applied to the bare chip 3 on the mounting substrate 2. Is installed.

  The mounting substrate 2 is a substrate on which the bare chip 3 is mounted, and the shape and size of the mounting substrate 2 are not particularly limited. It also includes so-called frames. Although the example of the ceramic heater 6 is shown as a mounting table of the mounting substrate 2, it is not limited to this. The bare chip 3 is an unpackaged chip, and its size and shape are arbitrary and not particularly limited. According to the semiconductor mounting apparatus 50 of the first embodiment, it is effective even for a light and thin bare chip 3. The brazing material 4 is a so-called conductive adhesive, and joins the bare chip 3 and the mounting substrate 2 via the brazing material 4. In 1st Embodiment, although the example which joins the bare chip 3 and the mounting substrate 2 via the brazing | wax material 4 is disclosed, the joining method is arbitrary and various changes are possible.

  FIG. 8A is a schematic side view showing an example of the collet 1 which is a bare chip transport unit, and FIG. 8B is a plan view of a surface sandwiching the bare chip 3. For convenience of explanation, the bare chip 3 is illustrated by a dotted line. 8A and 8B, the bare chip 3 shows a state before being held by the collet 1.

  The collet 1 has a chuck pin 11 that is a clamping part that holds and holds the side surface of the bare chip 3, a housing 20, a chuck pin 11, and a rotation member 21 that rotates in conjunction with the chuck pin 11. The first rotation transmission body 22 and the second rotation transmission body 23 that rotate in conjunction with the mechanism 12 are included. It should be noted that the number of chuck pins 11 is for convenience of description and may be at least two or more and can be appropriately designed according to the size and shape of the bare chip 3 and needs. From the viewpoint of more stably holding the bare chip 3, it is preferable to provide at least one check pin 11 on each side of the bare chip 3.

  In the example of FIG. 8A, six chuck pins 11 are arranged on the lower surface side of the collet 1 so as to protrude from the housing 20. The material of the chuck pin 11 is not particularly limited, and metal, resin, or the like can be used. Six rotation members 21 are provided corresponding to the chuck pins 11, and an opening is provided on the lower surface of the housing 20 so that the rotation member 21 is rotatable. The chuck pin 11 is arranged at a predetermined reference position in the open state. In the first embodiment, the reference position is a position where the movement distances of the chuck pins 11 to the contact position of the bare chip 3 are all the same.

  Two first rotation transmitting bodies 22 are provided in the housing 20 and play a role of transmitting rotational power to the rotating member 21. One second rotation transmission body 23 is provided in the housing 20 and rotates in conjunction with the rotation transmission mechanism as described above, and plays a role of transmitting rotational power to the first rotation transmission body 22. The rotating body 21, the first rotation transmitting body 22 and the second rotation transmitting body 23 are configured such that power is transmitted by a gear mechanism. The rotation transmission mechanism 12 plays a role of giving a rotational motion in order to open and close the chuck pin 11. Note that the chuck pin 11 shown in FIGS. 8A and 8B as an example of the sandwiching portion is an example, and various modifications can be made without departing from the spirit of the present invention.

  A rotation transmission shaft for rotating the chuck pin 11 of the collet 1 is installed in the positioning unit 10. Then, the rotational motion of the shaft is transmitted to the rotational transmission mechanism 12 installed on the upper part of the collet 1, and the rotational motion is transmitted to the chuck pin 11. The rotation transmission mechanism 12 transmits the rotation member 21 via the first rotation transmission body 22 and the second rotation transmission body 23, and the chuck pin 11 rotates as the rotation member 21 rotates. The chuck pin 11 is used to perform the chuck opening / closing operation of the collet 1.

  FIG. 9A shows an example of a schematic side view of the collet 1 to which the bare chip 3 is fixed, and FIG. 9B shows an example of the plan view. For convenience of explanation, the bare chip 3 is illustrated by a dotted line. The side surface of the bare chip 3 is sandwiched and held by six chuck pins 11. The chuck pin 11 rotates in conjunction with the rotation of the rotation member 21, and the rotation of the rotation member 21 is prevented by the chuck pin 11 coming into contact with the side surface of the bare chip 3. The bare chip 3 is held by the force. The upper surface of the bare chip 3 does not contact the collet 1 and holds the side surface of the bare chip 3 while sandwiching it.

  In 1st Embodiment, although the example which provided the 1st rotation transmission body 22 and the 2nd rotation transmission body 23 in the collet 1 as a means to transmit rotation to the rotation member 21 was disclosed, the rotation member 21 is disclosed. If it is a mechanism which can rotate, the 1st rotation transmission body 22 and the 2nd rotation transmission body 23 are not essential, and can be made into arbitrary structures. Further, from the viewpoint of downsizing the apparatus, a configuration in which all the rotating members 21 are interlocked is preferable, but a mechanism that rotates separately or a mechanism that rotates in several groups may be used. Thereby, the freedom degree of the shape of a bare chip increases. That is, the present invention can be applied to a special rectangular shape or a non-rectangular bare chip. Further, a mechanism for controlling the position of the collet 1 so as to be movable in the horizontal direction and the vertical direction is preferable from the viewpoint of miniaturization and simplicity of the apparatus. However, by controlling the position on the supply stage 9 or the hot plate 6 side, the bare chip 3 And the mounting process of the mounting substrate 2 may be performed.

  In the semiconductor mounting apparatus 50 configured as described above, the bare chip 3 is mounted on the mounting substrate 2 through the following steps. First, the collet 1 chuck mechanism is opened. The chuck pin 11 is disposed at a desired position outside. Next, the collet 1 is moved above the bare chip 3 of the supply stage 9 by using the position detection unit 8 and the position adjustment mechanism unit 10.

  Next, in order for the collet 1 to sandwich the bare chip 3, the collet 1 is moved to a predetermined position using the vertical drive mechanism 7. At this time, the lowering operation state of the collet 1 is monitored by the pressure detection unit 14 installed in the vertical movement mechanism 7. The pressure detection unit 14 detects the position where the tip of the chuck pin 11 of the collet 1 is in contact with the supply stage 9 and performs a descent operation stop operation. The height position between the bare chip 3 and the supply stage 9 may be detected by a position detection unit or the like, and the descending operation stop operation of the vertical drive mechanism 7 may be performed at an appropriate position.

  Next, the collet 1 is raised by a certain amount by using the vertical drive mechanism 7 so that the chuck pin 11 and the supply stage 9 of the bare chip 3 do not interfere when the chuck mechanism is closed. This amount of increase is set to be equal to or less than the bare chip thickness. The height necessary for holding the bare chip 3 is appropriately adjusted according to the material, use, etc. of the bare chip 3. Note that the height required for holding may vary depending on the type of the bare chip 3, and therefore settings are made for each product as necessary.

  Thereafter, power is transmitted from the rotation shaft of the rotation transmission mechanism 12 installed in the vertical drive mechanism 7 to the second rotation transmission body 23, the first rotation transmission body 22, and the rotation member 21 of the collet 1. Close the chuck mechanism. Specifically, the bare chip 3 is held by operating power of an actuator (motor) that rotates the rotating shaft. That is, when the actuator operating current increases due to the load generated on the actuator, this output is fed back to the rotation transmission mechanism 12. This controls the force with which the side surface of the bare chip 3 and the chuck pin 11 come into contact. In other words, the holding force of the bare chip 3 is controlled by monitoring the load state during rotation of the chuck pin 11 and controlling the rotation control actuator.

  Since the collet 1 has a rotation mechanism for the chuck pin 11, even if the outer width, outer shape, and thickness of the bare chip 3 are different within the chuck opening / closing range, the collet 1 can be replaced without replacing the collet 1. It can be held and transported. As a result, it is not necessary to replace the collet 1 with respect to the bare chip 3 within the chuck opening / closing range. Therefore, a highly versatile semiconductor mounting apparatus can be provided.

  In the mounting substrate 2, the brazing material 4 is applied in advance to the mounting position of the bare chip 3. Then, the mounting substrate 2 coated with the brazing material 4 is mounted on the ceramic heater 6, and the ceramic heater 6 is heated to melt the brazing material 4 on the substrate 2 with heat. The brazing material 4 may be applied after the mounting substrate 2 is placed on the ceramic heater 6.

  Subsequently, the position detection unit 8 detects the position of the mounting substrate 2, and the collet 1 holding the bare chip 3 is moved to the mounting position on the mounting substrate 2 by the positioning unit 10 based on the data. Thereafter, as with the conveying mode of the bare chip 3, the vertical drive mechanism 7 moves the collet 1 down on the wax material 4 while monitoring the mounting height with the pressure detection unit. At that time, the pressure when the lower surface of the bare chip 3 comes into contact with the melted wax material 4 is detected by the pressure detection unit 5 in the same manner as the bare chip 3 conveyance mode, and the collet 1 is moved to the wax material 4 by the vertical movement mechanism 7. Set the fusing pressure.

  By the way, an oxide film is formed on the wax material 4 liquefied by heating by being combined with peripheral oxygen. This leads to a decrease in the adhesive force with the bare chip 3. In order to prevent this, the oxide film of the wax material 4 and the back surface of the bare chip 3 are rubbed by an operation of repeating horizontal movement (hereinafter referred to as a scribe operation) with the position adjusting mechanism unit 10 while holding the bare chip 3, Remove. And the process which produces firm fusion | bonding with the wax material 4 which is not oxidized is useful. However, when the wax material 4 is melted, surface tension is generated between it and the bare chip 3, and surface tension is generated in the melted wax material 4, and a force for fixing the bare chip 3 acts. Here, when the surface tension of the wax material that is in close contact with the collet 1 due to the adsorption force to the bare chip 3 is won, the bare chip 3 adheres to the molten wax material 4 without following the movement of the collet 1. As a result, the bare chip 3 may be misaligned, the surface pattern may be damaged, and the bare chip may be chipped or cracked.

  On the other hand, according to the present invention, by using the collet 1 as shown in FIGS. 8A and 8B, the force generated in the horizontal direction in the scribing operation for the purpose of improving the wettability of the wax material 4 is applied in the vertical direction. It is possible to cancel with the existing chuck pin 11. As a result, it is possible to achieve a reliable holding force for the bare chip 3 and prevent the slide failure of the bare chip 3. Furthermore, by holding the side surface of the bare chip 3 mechanically, the holding force of the collet 1 is set to be higher than the surface tension of the brazing material 4, and it is possible to apply not only a horizontal operation but also a vertical operation. As a result, a three-dimensional scribe operation can be realized, and a more robust bare chip mounting can be performed.

  In the first embodiment, after the pressure control unit 5 detects the contact between the molten wax material 4 and the bare chip 3, the collet 1 is moved horizontally and the bare chip 3 is scribed using the vertical drive mechanism 7. . By this operation, it is possible to promote strong bonding on the bonding surface of the wax material 4 and the bare chip 3 without causing a bonding failure due to an oxide film or wax material unevenness. After the end of a certain scribing operation, the rotation transmitting mechanism 12 rotates the collet 1 in the direction opposite to the direction in which the chuck position is held to release the bare chip 3 from the collet 1. Thereafter, the vertical drive mechanism 7 is used to move the collet 1 to the starting point, cool the ceramic heater 6 and condense the molten wax material 4 to room temperature. Through these steps, the bare chip 3 is mounted on the mounting substrate 2.

  In the conventional adsorption type collet shown in FIG. 1 and FIG. 2 and the like, it is difficult to control the holding force of the collet, and therefore, the coating of the wax material 4 has been eliminated mainly by the scribing operation only in the horizontal direction. On the other hand, according to the collet 1 of the first embodiment, the side surface of the bare chip 3 can be mechanically held and controlled by the rotational movement of the chuck pin 11. For this reason, the scribing operation in the vertical direction, which has been difficult to realize, can also be realized. According to the semiconductor mounting apparatus 50 of the first embodiment, the melted wax material 4 can be controlled from various directions by a three-dimensional scribe operation, so that high-quality mounting without unevenness can be produced. .

  Further, according to the semiconductor mounting apparatus 50, since only the side surface is mechanically sandwiched and held without contacting the top surface of the bare chip, there is an excellent merit that the structure of the top surface of the bare chip is not restricted. Further, chipping and cracking of the bare chip can be improved as compared with a method of sandwiching an edge portion where stress tends to concentrate. In other words, in the first embodiment, since the side surfaces of the bare chip are brought into contact with each other instead of the line contact, the stress can be dispersed. As a result, it is possible to prevent bare chip breakage and chipping during transportation or pressure mounting.

  Furthermore, since it can hold | grip without using vacuum suction, generation | occurrence | production of the curvature of a bare chip can be prevented. As a result, the yield of semiconductor products can be increased. Further, it is effective for preventing the occurrence of scratches (dents) on the surface circuit of the bare chip 3 or breakage of the edge portion when the bare chip 3 is transported / mounted. That is, a fragile bare chip product can be transported safely and efficiently without contacting the surface, and can be stably mounted on a specified mounting board.

  In addition, according to the semiconductor mounting apparatus according to the first embodiment, since the holding position (opening / closing position) can be adjusted by the chuck pin, the holding position can be controlled by moving the chuck pin mechanically. Therefore, the same collet can be used even if the size and shape of the bare chip are different within the adjustment range. For this reason, the number of times of changing the collet can be reduced and the process can be simplified.

Furthermore, according to the semiconductor mounting apparatus according to the first embodiment, in the step of fusing using the wax material melted by being heated, the oxide film on the surface of the wax material that causes a fusing defect is vertically directed. The wax material removed or melted by the scribing operation in the horizontal movement direction can be spread evenly on the joint surface of the bare chip 3. Moreover, it is possible to prevent the bare chip surface from being rubbed and the cracks / chips caused by sliding of the edge portion from being eliminated. Further, since the wax material can be evenly distributed evenly on the front surface of the bare chip by the scribe operation, the quality of the adhesive force can be improved. As a result, a semiconductor mounting apparatus with a high yield can be provided.
[Second Embodiment]

  Next, an example of a semiconductor mounting apparatus different from the first embodiment will be described. FIG. 10 is a schematic cross-sectional view of a bare chip according to the second embodiment. FIG. 11 is a schematic plan view on the chuck pin side of the collet 1 of the second embodiment.

  As shown in FIG. 10, a compressed air communication path 31 is provided in the housing 20 of the collet 1. And as shown in FIG. 11, the blow groove 32 of compressed air is provided in the lower surface side of the housing | casing 20. As shown in FIG. The communication path 31 for compressed air is configured by an opening at the center of the second rotation transmission body 23 and a gap provided below the second rotation transmission body 23 and the first rotation transmission body 22. The communication path 31 is connected to the blow groove 32, from which pressure-controlled air is ejected.

  According to the semiconductor mounting apparatus according to the second embodiment, when the bare chip 3 is mounted on the mounting substrate 2, since the pressure-controlled air is ejected, the molten wax material 4 adheres to the surface of the bare chip 3. It is possible to prevent the occurrence of abnormality in the surface circuit of the bare chip 3. That is, according to the semiconductor mounting apparatus according to the second embodiment, by installing the blow groove 32 on the lower surface portion of the casing 20 of the collet 1, the pressure-controlled air is ejected and the surface of the bare chip 3 is positively pressurized. . Thereby, it can prevent effectively that the wax material 4 wraps around the bare chip 3 surface.

  It is also possible to perform adhesion pressurization by fine pressurization by opening the chuck pin 11 by positive pressure and indirectly pressurizing the surface of the bare chip 3 with the pressure of the pressure controlled air. Alternatively, the air ejected from the blow groove 32 may be an inert gas to reduce the ambient oxygen concentration of the wax material 4. By doing in this way, the oxide film production | generation at the time of fuse | melting the wax material 4 can be suppressed.

  According to the semiconductor mounting apparatus according to the second embodiment, the same effect as in the first embodiment can be obtained. Furthermore, since the air ejection mechanism is provided, it is possible to effectively prevent the wax material 4 from entering the bare chip 3 surface.

  Needless to say, other embodiments are also included in the scope of the present invention as long as they meet the spirit of the present invention. Moreover, the said embodiment is mutually combined suitably. Moreover, the semiconductor mounting apparatus of FIG. 6 is an example, and various modifications are possible. Furthermore, in the above embodiment, an example in which the chuck pin 11 is fixed to the rotating body 21 has been described. However, as shown in FIG. 12, a fitting portion 18 of the chuck pin 11 is provided to rotate the chuck pin 11. You may comprise so that attachment or detachment with respect to the body 21 is possible. As a result, clamping can be performed in a wider range of bare chips.

DESCRIPTION OF SYMBOLS 1 Collet 2 Board | substrate 3 Bare chip 4 Brazing material 5 Pressure control unit 6 Ceramic heater 7 Vertical drive mechanism 8 Position detection unit 9 Supply stage 10 Position adjustment mechanism unit 11 Chuck pin 12 Rotation transmission mechanism 13 Blow groove 14 Pressure detection unit 18 Fitting part DESCRIPTION OF SYMBOLS 20 Case 21 Rotating body 22 1st rotation transmission body 23 2nd rotation transmission body 31 Communication path 32 Blow groove 50 Semiconductor mounting apparatus

Claims (9)

A plurality of clamping portions that mechanically clamp in contact with the side surface of the bare chip;
A rotating member that rotates in conjunction with the clamping part,
A bare chip clamping unit having a mechanism in which rotation of the rotating member is prevented when the clamping part abuts on a side surface of the bare chip and the bare chip is held by a force of the rotating member to rotate. Semiconductor mounting apparatus provided. And a rotation transmission mechanism for transmitting power to the rotation member,
The semiconductor mounting apparatus according to claim 1, wherein power is transmitted from the rotation transmission mechanism to the plurality of clamping units.   The semiconductor mounting apparatus according to claim 1, wherein the holding portion is configured to be disposed at a predetermined reference position when the holding portion is in an open state.   The semiconductor mounting apparatus according to claim 1, wherein the clamping portion is a chuck pin.   5. The semiconductor mounting apparatus according to claim 1, wherein the bare chip clamping unit is detachably connected to a rotation transmission mechanism that transmits rotating power to the rotating member. 6.   Furthermore, the semiconductor mounting apparatus of any one of Claims 1-5 provided with the pressure adjustment mechanism which adjusts the pressure applied when mounting the said bare chip on a mounting board | substrate.   The bare chip clamping unit can be scribed in a horizontal direction operation and a vertical direction operation so that the bare chip and a mounting substrate on which the bare chip is mounted are bonded by a wax material and an oxide film of the wax material is removed. The semiconductor mounting apparatus of any one of Claims 1-6 comprised by these. A clamping part that mechanically clamps in contact with the side surface of the bare chip;
A rotating member that rotates in conjunction with the clamping part,
A bare chip clamping unit comprising a mechanism in which the rotation of the rotating member is prevented when the clamping part comes into contact with a side surface of the bare chip, and the bare chip is held by the force to rotate.   9. The bare chip clamping unit according to claim 8, wherein the clamping part is a chuck pin.