JP2014050957A - Substrate polishing means and substrate polishing device, and substrate polishing system - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide substrate polishing means capable of polishing a substrate satisfactorily, even if bending is caused in the substrate.SOLUTION: In substrate polishing means (16) for polishing a substrate (5) of the present invention, a polishing member (32) is connected to a turning shaft (30) through a deformable cushioning member (35) comprising elastic materials. Also, the polishing member (32) is formed by making a base metal contain grains harder than the substrate (5). The polishing member (32) also has a brush shape formed by implanting a large number of bristles (51) on a base (50). Also, the polishing member (32) comprises the materials harder than the substrate (5), and roundness is formed in the end edge coming into contact with the substrate (5). Further, the polishing member (32) is formed into a spherical form or a doughnut shape.

Description

  The present invention relates to a substrate polishing means for polishing a substrate, a substrate polishing apparatus having the substrate polishing means, and a substrate polishing system.

  Conventionally, when manufacturing semiconductor components, flat displays, etc., the substrate can be transported or the substrate can be held in a state where the substrate is held horizontally by holding the back surface of the substrate such as a semiconductor wafer or a liquid crystal substrate with a substrate holding means. Various processes such as an etching process, a film forming process, and a cleaning process are repeatedly performed on the surface.

  For this reason, when various processes are performed on the substrate, the back surface of the substrate may come into contact with the substrate holding means, and a convex portion may be formed on the back surface of the substrate.

  Even if the convex part formed in the back surface of this board | substrate wash | cleans the back surface of a board | substrate using the scrubber apparatus for particle removal using the conventional brush, it is difficult to planarize the back surface of a board | substrate favorably. .

  Therefore, for example, it is conceivable to flatten the back surface of the substrate by uniformly polishing the entire back surface of the substrate using an apparatus as described in Patent Document 1.

JP-A-8-71511

  However, when the substrate is polished using the above-described conventional apparatus, if the substrate is bent, a portion that is not polished may be generated on the substrate, or the substrate may be damaged.

  Therefore, in the present invention, in the substrate polishing means for polishing the substrate, the polishing member is connected to the rotating shaft via a deformable buffer member made of an elastic material.

  Further, the polishing member is formed by including grains harder than the substrate in the base material.

  In addition, the polishing member has a brush shape in which a large number of brush hairs are implanted in the base.

  Further, the polishing member is made of a material harder than the substrate, and is rounded at the edge that contacts the substrate.

  Further, the polishing member is formed in a spherical shape or a donut shape.

  In the present invention, the substrate polishing apparatus includes the substrate polishing unit described above and a control unit for controlling the substrate polishing unit.

  According to the present invention, in the substrate polishing system, the substrate polishing unit described above, a control unit for controlling the substrate polishing unit, and a substrate transport for carrying the substrate into and out of the substrate polishing unit. And decided to have a means.

  In the present invention, even if the substrate is bent, the polishing member can follow and polish the substrate during polishing of the substrate, so that a portion not polished on the substrate is generated or the substrate is scratched. And the substrate can be satisfactorily polished.

The top view which shows a board | substrate back surface grinding | polishing system. The top view which shows a board | substrate back surface grinding | polishing apparatus. The front view. The front view which shows a board | substrate grinding | polishing means. Explanatory drawing which shows operation | movement of a substrate back surface grinding | polishing apparatus. Explanatory drawing which shows operation | movement of a substrate back surface grinding | polishing apparatus. Explanatory drawing which shows operation | movement of a substrate back surface grinding | polishing apparatus. Explanatory drawing which shows operation | movement of a substrate back surface grinding | polishing apparatus. Explanatory drawing which shows operation | movement of a substrate back surface grinding | polishing apparatus. Explanatory drawing which shows operation | movement of a substrate back surface grinding | polishing apparatus. Front sectional drawing which shows the modification of a board | substrate grinding | polishing means.

  The specific configuration of the present invention will be described below with reference to the drawings.

  As shown in FIG. 1, the substrate back surface polishing system 1 forms a substrate carry-in / out table 3 at the front end of the housing 2 and forms a substrate processing chamber 4 at the rear of the substrate carry-in / out table 3.

  The substrate carry-in / out table 3 has a plurality of (here, three) carriers 6 in which a plurality of (for example, 25, here) substrates 5 (here, semiconductor wafers) are collectively accommodated and placed side by side on the top. It is location.

  The substrate loading / unloading table 3 loads and unloads the substrate 5 between the carrier 6 and the rear substrate processing chamber 4.

  In the substrate processing chamber 4, a substrate transfer device 7 is arranged at the center, and a substrate reversing device 8 and two substrate back surface polishing devices 9 are arranged side by side on the left side of the substrate transfer device 7. 7, three substrate back surface polishing apparatuses 9 are arranged side by side in the front and rear direction.

  Then, the substrate processing chamber 4 receives a single substrate 5 from a predetermined carrier 6 of the substrate loading / unloading table 3 with the substrate transfer device 7 with the surface facing upward, and the substrate 5 is inverted by the substrate transfer device 7. The substrate is transferred to the apparatus 8, the front and back of the substrate 5 is reversed by the substrate reversing device 8, and the substrate 5 is received again from the substrate reversing device 8 by the substrate transporting device 7. Then, the substrate is transferred to one of the substrate back surface polishing apparatuses 9, and the substrate back surface polishing apparatus 9 polishes the back surface of the substrate 5. Thereafter, the substrate processing chamber 4 is transported from the substrate back surface polishing device 9 to the substrate reversing device 8 by the substrate transporting device 7, and the substrate reversing device 8 reverses the front and back of the substrate, and again from the substrate reversing device 8 by the substrate transporting device 7. The substrate 5 is received with the surface facing upward, and the substrate 5 is transferred to a predetermined carrier 6 of the substrate loading / unloading table 3 by the substrate transfer device 7.

  The substrate transfer device 7 accommodates a substrate transfer means 11 for holding and transferring the substrates 5 one by one in a transfer chamber 10 extending forward and backward.

  The substrate transport means 11 has an arm 13 for holding a single substrate 5 attached to a traveling platform 12 that travels back and forth so as to be able to advance, retract, rotate, and rotate.

  Then, the substrate transfer device 7 transfers the substrates 5 one by one using the substrate transfer means 11 between the substrate carry-in / out table 3 and the substrate reversing device 8 or between the substrate reversing device 8 and the substrate back surface polishing device 9. I am doing so.

  The substrate reversing device 8 is configured to invert the substrate 5 received from the substrate transporting device 7 and then deliver it to the substrate transporting device 7 again.

  As shown in FIGS. 2 and 3, the substrate back surface polishing apparatus 9 includes a substrate holding means 15 for holding the substrate 5 inside the casing 14, and first and second for polishing the back surface of the substrate 5. The substrate polishing means 16, 17, the substrate cleaning means 18 for cleaning the back surface of the substrate 5, and the pure water supply means 19 for supplying pure water to the back surface of the substrate 5 are accommodated. The substrate holding means 15, the first and second substrate polishing means 16, 17, the substrate cleaning means 18, and the pure water supply means 19 are connected to the control means 20 and are driven and controlled by the control means 20. The control means 20 controls not only the substrate back surface polishing device 9 but also the substrate transfer device 7 and the substrate reversing device 8.

  The substrate holding means 15 has a drive motor 21 attached to the bottom center of the casing 14, a disk-shaped turntable 23 is horizontally attached to the drive shaft 22 of the drive motor 21, and the substrate 5 is attached to the upper edge of the turntable 23. Three chucking 24 that can hold the outer peripheral edge are attached at intervals in the circumferential direction, and the outer periphery of the turntable 23 is covered with a cup 25 that can be raised and lowered. Driving of the driving motor 21 (turn table 23), driving of the chucking 24, and raising / lowering of the cup 25 are controlled by the control means 20.

  The first and second substrate polishing means 16 and 17 are arranged side by side at the rear part of the casing 14, and movable bases 26 and 27 extending vertically to the bottom left rear of the casing 14 are attached to be movable to the left and right. The arms 28 and 29 extending in the front-rear direction are attached to the upper parts of the movable tables 26 and 27 so as to be movable up and down, and the rotary shafts 30 and 31 extending up and down are attached to the lower parts of the front ends of the arms 28 and 29 so as to be rotatable Abrasive members 32 and 33 are attached to the lower ends of the rotary shafts 30 and 31, respectively. The movement of the moving bases 26 and 27, the raising and lowering of the arms 28 and 29, and the rotation of the rotation shafts 30 and 31 (the polishing members 32 and 33) are controlled by the control means 20.

  The first and second substrate polishing means 16, 17 are provided with a polishing member cleaning means 34 for cleaning the abrasive members 32, 33 and retaining water on the left side wall of the casing 14.

  Here, as shown in FIG. 4A, the first substrate polishing means 16 is polished via a deformable buffer member 35 made of an elastic material such as a cylindrical PVA material at the lower end of the rotating shaft 30. The member 32 is attached. On the other hand, as shown in FIG. 4 (b), the second substrate polishing means 17 has a soft cylindrical PVA material at the lower end of the rotating shaft 31 as compared with the polishing member 32 of the first substrate polishing means 16. The polishing member 33 made of, for example, is directly attached.

  In this way, the first substrate polishing means 16 has a configuration in which the polishing member 32 is attached via the buffer member 35, so that the polishing member 32 follows when the substrate 5 is polished even if the substrate 5 is bent. Since the upper surface of the substrate 5 can be polished, the upper surface of the substrate 5 can be polished well without causing an unpolished portion on the upper surface of the substrate 5 or scratching the upper surface of the substrate 5. Can do.

  The first and second substrate polishing means 16 and 17 are not limited to the configuration shown in FIG. 4 and may have other configurations. For example, as shown in FIG. 11 (a), a communication hole 36 is formed at the center of the polishing member 32 (33), and a fluid (liquid such as pure water) is passed through the communication hole 36 when the polishing member 32 (33) is lifted. Or a gas such as an inert gas) may be discharged. When the polishing member 32 (33) has a cylindrical shape, the lower end surface of the polishing member 32 (33) is in close contact with the upper surface of the substrate 5 after polishing, and the substrate 5 is lifted as the polishing member 32 (33) rises. However, when the polishing member 32 (33) is lifted, the polishing member 32 (33) is discharged from the substrate 5 by discharging a fluid (a liquid such as pure water or a gas such as an inert gas) from the communication hole 36. Can be easily separated.

  The polishing member 32 (33) is not limited to the case where the polishing member 32 (33) is formed of a grindstone, ceramic, or the like that is harder than the substrate 5 that is the member to be polished. You may use what was formed. For example, when the substrate 5 is made of a silicon material, the polishing member 32 (33) can be formed by including grains such as silicon carbide, alumina, and diamond harder than silicon in nylon as a base material. The grain size is preferably about 1 mm or less. The grains may be kneaded into the base material or bonded. As described above, when the polishing member 32 (33) is formed by including grains harder than the substrate 5 in the base material, the upper surface of the substrate 5 can be satisfactorily polished with grains harder than the substrate 5. In addition, it can be prevented from being in close contact with the upper surface of the substrate 5. .

  Further, as shown in FIG. 11 (b), the first substrate polishing means 16 attaches a pedestal 45 to the lower end portion of the rotating shaft 30 and attaches a polishing member 46 to the lower surface of the pedestal 45 via a buffer member 35. A configuration may be adopted in which the edge of the lower end surface of the polishing member 46 contacting the substrate 5 may be rounded, and the polishing member 47 may be formed in a spherical shape as shown in FIG. As shown in FIG. 11 (d), the polishing member 48 may be formed in a donut shape in which tubular members are arranged in an annular shape. Further, the polishing member 32 may be formed to have a diameter as small as possible. In that case, it is preferable to polish the substrate 5 with a plurality of thin polishing members. A communication hole for discharging fluid may be formed in the central part of these polishing members 47 and 48.

  Further, as shown in FIG. 11 (e), the polishing member 49 may be formed in a brush shape in which a large number of bristles 51 are implanted in the base 50. In this case, the bristle 51 is formed of a base material containing grains harder than the substrate 5 to provide flexibility, and the tip of the bristle 51 that contacts the substrate 5 is rounded. It is preferable.

  In this way, even if the substrate 5 is bent by forming a round shape at the lower end edge of the polishing member, making it spherical, making it a donut shape, reducing the diameter, or making it a brush shape, Since the polishing member can follow and polish the upper surface of the substrate 5 at the time of polishing, the upper surface of the substrate 5 can be obtained without generating an unpolished portion on the upper surface of the substrate 5 or scratching the upper surface of the substrate 5. Can be polished satisfactorily. Further, since the contact area with the upper surface of the substrate 5 is smaller than that of the columnar one, it is possible to prevent the contact with the upper surface of the substrate 5.

  In the substrate backside polishing apparatus 9, the polishing member 32 of the first substrate polishing unit 16 is different from the polishing member 33 of the second substrate polishing unit 17 in any of hardness, material, configuration, and the like. However, the substrate polishing means is not limited to the case where two different types of first and second substrate polishing means 16 and 17 are used, and the case where three or more kinds of substrate polishing means are used or one type of substrate. It may be a case where one polishing means is provided or a case where a plurality of one kind of substrate polishing means are provided.

  The substrate cleaning means 18 is attached to a movable base 37 extending vertically to the right and rear of the bottom of the casing 14 so as to be movable left and right, and an arm 38 extending forward and backward is attached to the upper part of the movable base 37 so as to be movable up and down. A rotating shaft 39 extending vertically is attached to the lower portion in a rotatable manner, and a brush 40 as a cleaning member is attached to the lower end portion of the rotating shaft 39. The movement of the movable table 37, the raising / lowering of the arm 38, and the rotation of the rotation shaft 39 (brush 40) are controlled by the control means 20. The cleaning member is not limited to the brush 40, and may be a sponge or a two-fluid nozzle.

  Further, the substrate cleaning means 18 is provided with a brush cleaning means 41 for cleaning the brush 40 and retaining water on the right side wall of the casing 14.

  The pure water supply means 19 has a flow adjustment mechanism 42 attached to the bottom left front of the casing 14, and a nozzle 43 is connected to the flow adjustment mechanism 42, and pure water from the tip of the nozzle 43 toward the center of the upper surface of the substrate 5. To supply.

  The substrate back surface polishing system 1 is configured as described above, and is driven and controlled by the control means 20 according to various programs recorded on the recording medium 44 provided in the control means 20 so as to process the substrate 5. I have to. Here, the recording medium 44 stores various setting data and various programs such as a substrate back surface polishing program, which will be described later, a memory such as a ROM and a RAM, a hard disk, a CD-ROM, a DVD-ROM, and a flexible disk. It can be composed of a known device such as a disk-shaped storage medium.

  The substrate back surface polishing apparatus 9 polishes the back surface of the substrate 5 as described below according to the substrate back surface polishing program recorded on the recording medium 44 provided in the control means 20.

  In the substrate back surface polishing program, first, the control means 20 obtains information related to processing in the previous process (upstream process) before the back surface polishing process of the substrate 5.

  Here, as the information regarding the process in the process before the back surface polishing step of the substrate 5, the position where the back surface of the substrate 5 is held (that is, the position where the convex portion is predicted to be formed on the back surface of the substrate 5). And information on the position where the convex portion is detected by actually measuring the back surface of the substrate 5 and the size (height and area) of the convex portion.

  In addition, information related to processing in the previous process of the substrate 5 may be input to the control means 20 by an input device 45 ′ connected to the control means 20, and substrate processing such as cleaning used in the previous process of the substrate 5. The control unit 20 may be input online from the apparatus.

  Then, the substrate back surface polishing program is based on the information about the processing in the previous process of the substrate 5 obtained by the control means 20, and the polishing range and the polishing state for actually polishing the back surface of the substrate 5 (the substrate polishing means for the substrate 5). The pressing force of 16 and 17 and the moving speed, the rotational speed of the polishing members 32 and 33, and the rotational speed of the substrate 5 are determined, and the back surface of the substrate 5 is polished with the determined polishing range in the polished state.

  At this time, the substrate back surface polishing program selects one of the first or second substrate polishing means 16 and 17 based on the information in the previous process of the substrate 5 to polish the back surface of the substrate 5. Alternatively, all the substrate polishing means 16 and 17 may be used to polish the back surface of the substrate 5, and further, the first substrate polishing means 16 and the second substrate polishing means 17 may be used for polishing. The range and polishing state may be varied. In the following description, the case where the back surface of the substrate 5 is polished using both the first and second substrate polishing means 16 and 17 will be described.

  In the substrate back surface polishing program, the substrate transferred by the substrate transfer device 7 to the upper portion of the turntable 23 of the substrate holding means 15 with the substrate reversing device 8 facing up the back surface of the substrate 5 (the surface opposite to the circuit forming surface). Hold 5 horizontally with chucking 24.

  Next, in the substrate back surface polishing program, as shown in FIG. 5, the second substrate polishing means 17 is moved to the retreat position on the right side of the substrate 5, and the first substrate polishing means 16 is processed in the previous process. It moves to the polishing start position of the polishing range determined based on the information regarding.

  Next, in the substrate back surface polishing program, as shown in FIG. 6, the turntable 23 of the substrate holding means 15 is rotated to rotate the substrate 5 while holding it horizontally, and the substrate 5 is discharged from the nozzle 43 of the pure water supply means 19. Pure water is supplied toward the back surface of the substrate 5 and the outer periphery from the center side of the back surface of the substrate 5 in a state of being in close contact with the back surface of the substrate 5 via pure water while rotating the polishing member 32 of the first substrate polishing means 16. Only the necessary polishing range is moved toward the edge side. At this time, in the substrate back surface polishing program, the first substrate polishing means 16 is driven with the rotation speed and the pressing force determined based on the information related to the processing in the previous process.

  In this way, the substrate back surface polishing program does not polish the entire back surface of the substrate 5 by the first substrate polishing means 16, but determines a predetermined back surface of the substrate 5 determined based on information in the previous process of the substrate 5. Only the polishing range is polished with a predetermined rotational speed and pressing force.

  Next, in the substrate back surface polishing program, as shown in FIG. 7, the first substrate polishing means 16 is moved to the initial position on the left side of the substrate 5 and the second substrate polishing means 17 is processed in the previous process. It moves to the polishing start position of the polishing range determined based on the information regarding.

  Next, in the substrate back surface polishing program, as shown in FIG. 8, the turntable 23 of the substrate holding means 15 is rotated to rotate the substrate 5 while holding it horizontally, and the substrate 5 is discharged from the nozzle 43 of the pure water supply means 19. Pure water is supplied toward the back surface of the substrate 5 and the outer periphery from the center side of the back surface of the substrate 5 in a state in which the polishing member 33 of the second substrate polishing means 17 is in close contact with the back surface of the substrate 5 via pure water. Only the necessary polishing range is moved toward the edge side. At this time, in the substrate back surface polishing program, the second substrate polishing means 17 is driven with the rotational speed and the pressing force determined based on the information related to the processing in the previous process.

  In this way, the substrate back surface polishing program does not polish the entire back surface of the substrate 5 by the second substrate polishing means 17, but determines a predetermined back surface of the substrate 5 determined based on information in the previous process of the substrate 5. Only the polishing range is polished with a predetermined rotational speed and pressing force.

  Next, in the substrate back surface polishing program, as shown in FIG. 9, the second substrate polishing means 17 is moved to the initial position on the left side of the substrate 5, and the substrate cleaning means 18 is moved to the center position of the substrate 5. .

  Next, in the substrate back surface polishing program, as shown in FIG. 10, the turntable 23 of the substrate holding means 15 is rotated to rotate the substrate 5 while holding it horizontally, and the substrate 5 is discharged from the nozzle 43 of the pure water supply means 19. The pure water is supplied toward the back surface of the substrate 5, and the brush 40 of the substrate cleaning means 18 is rotated so as to be in close contact with the back surface of the substrate 5 through the pure water, from the center of the back surface of the substrate 5 toward the outer peripheral edge. Accordingly, the entire back surface of the substrate 5 is cleaned by the substrate cleaning means 18.

  Thereafter, in the substrate back surface polishing program, the substrate transfer device 7 carries the substrate 5 from the top of the turntable 23 to the substrate reversing device 8.

  As described above, in the substrate back surface polishing program, the back surface of the substrate 5 is polished.

  As described above, the substrate back surface polishing apparatus 9 (substrate back surface polishing system 1) polishes the back surface of the substrate 5 by controlling the driving of the substrate polishing means 16 and 17 in accordance with the information related to the processing of the substrate 5 in the previous process. I am going to do it. Therefore, the back surface of the substrate 5 can be sufficiently and sufficiently polished, so that a reduction in throughput due to polishing the back surface of the substrate 5 can be prevented. Further, since the life of the polishing members 32 and 33 can be extended, the labor, time and cost required for replacing the polishing members 32 and 33 can be reduced.

  In particular, when the back surface of the substrate 5 is polished using a plurality of types of substrate polishing means 16, 17 or selectively using a plurality of types of substrate polishing means 16, 17, the back surface of the substrate 5 is used. The back surface of the substrate 5 can be satisfactorily polished according to the state of the substrate 5 such as the size of the protrusions.

  Further, when the polishing range of the back surface of the substrate 5 is limited to a specific range rather than the entire back surface, the processing time required for polishing the back surface of the substrate 5 can be shortened.

  Further, when the back surface of the substrate 5 is polished by the substrate cleaning means 18 after the back surface of the substrate 5 is polished, particles generated by polishing the back surface of the substrate 5 can be eliminated, and It is possible to prevent reattachment to the surface.

DESCRIPTION OF SYMBOLS 1 Substrate back surface polishing system 2 Housing 3 Substrate loading / unloading stand 4 Substrate processing chamber 5 Substrate 6 Carrier 7 Substrate transfer device 8 Substrate reversing device 9 Substrate back surface polishing device 10 Transfer chamber
11 Substrate transfer means 12 Traveling platform
13 Arm 14 Casing
15 Substrate holding means 16 First substrate polishing means
17 Second substrate polishing means 18 Substrate cleaning means
19 Pure water supply means 20 Control means
21 Drive motor 22 Drive shaft
23 Turntable 24 Chucking
25 cup 26,27 moving platform
28,29 Arm 30,31 Rotation axis
32,33 Abrasive member 34 Abrasive member cleaning means
35 Shock absorber 36 Communication hole
37 Moving base 38 Arm
39 Rotating shaft 40 Brush
41 Brush cleaning means 42 Flow control mechanism
43 Nozzle 44 Recording medium
45 Base 46, 47, 48, 49 Abrasive material
50 base 51 brush hair

Claims (7)

In substrate polishing means for polishing a substrate,
A substrate polishing means characterized in that a polishing member is connected to a rotating shaft via a deformable buffer member made of an elastic material.   The substrate polishing means according to claim 1, wherein the polishing member is formed by including grains harder than the substrate in a base material.   The substrate polishing means according to claim 1, wherein the polishing member has a brush shape in which a large number of brush hairs are implanted in a base.   2. The substrate polishing means according to claim 1, wherein the polishing member is made of a material harder than the substrate, and is rounded at an edge portion contacting the substrate.   The substrate polishing means according to claim 4, wherein the polishing member has a spherical shape or a donut shape. 6. A substrate polishing apparatus comprising: the substrate polishing means according to claim 1; and a control means for controlling the substrate polishing means.
  6. The substrate polishing means according to claim 1, a control means for controlling the substrate polishing means, and a substrate transfer means for carrying the substrate into and out of the substrate polishing means. And a substrate polishing system.

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