JP2014011354A - Device and method for peeling sheet - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a device and method for peeling a sheet, capable of properly joining a peeling tape even if an adhesive surface is exposed on its one surface.SOLUTION: In a device for peeling a sheet, a first peeling tape PT1 and a second peeling tape PT2 are supported by a first support roller 31A and a second support roller 31B, respectively, so as to be allowed to be fed. Gas spraying means 63 sprays hot air to allow a terminal end area of one of the first peeling tape PT1 and the second peeling tape PT2 to adhere to a leading end area of the other of the tapes to join them so that they are continuously fed. The device is capable of preventing inconvenience of causing peeling tapes PT to adhere to a portion for joining the peeling tapes PT to each other, or the like, and unlike a conventional device, it is unnecessary to stop the device when replacing a peeling tape PT, thereby enabling capability of peeling adhesive sheets AS per unit time to be prevented from decreasing.

Description

  The present invention relates to a sheet peeling apparatus and a sheet peeling method for peeling an adhesive sheet affixed to an adherend.

Conventionally, in the semiconductor manufacturing process, there is a process of attaching an adhesive sheet to the surface (surface on which a circuit is formed) of a semiconductor wafer (hereinafter sometimes simply referred to as a wafer) and grinding the back surface in order to reduce the size of the semiconductor chip. The adhesive sheet is peeled off after cutting. As such a peeling apparatus for an adhesive sheet, an apparatus for peeling by peeling a peeling tape adhered to an end of the adhesive sheet has been proposed (for example, see Patent Document 1).
In the conventional peeling apparatus as described in Patent Document 1, when the tape for peeling is lost and replaced with a new tape for peeling, the residue such as the core of the peeling tape that has been used is removed and newly replaced. A new stripping tape must be installed and this new stripping tape must be hung again in the apparatus. And while performing such a tape exchange operation, since the operation of a peeling apparatus must be stopped, there exists a problem that the capability per unit time that the said peeling apparatus peels an adhesive sheet will reduce. .
Thus, for example, it is conceivable to use a roll label automatic joining device described in Patent Document 2 to join the peeling tapes together.

Japanese Patent Laid-Open No. 11-16862 Japanese Patent Laid-Open No. 3-102057

However, in the automatic joining device as described in the above-mentioned Patent Document 2, when joining a peeling tape whose adhesive surface is exposed on one surface, a contact body that abuts and joins the two peeling tapes. Adhesive surfaces are bonded, resulting in inconvenience that it is difficult to appropriately connect the peeling tapes.
The objective of this invention is providing the sheet | seat peeling apparatus and sheet | seat peeling method which can be appropriately joined even if it is the peeling tape which the adhesive surface exposed on one side.

  In order to achieve the above object, the sheet peeling apparatus of the present invention applies a peeling tape having an adhesive surface exposed on one surface to an adhesive sheet affixed to an adherend and applies tension to the peeling tape. A sheet peeling apparatus for peeling the adhesive sheet from the adherend by applying, a feeding means for feeding at least one of the first peeling tape and the second peeling tape, the first peeling tape and the first peeling tape A connecting means for bringing the other end region of the first peeling tape and the second peeling tape into contact with one end region of the two peeling tape, and the first peeling tape or the second peeling tape; A sticking means for sticking the adhesive surface of the adhesive tape to the adhesive sheet; and a moving means for applying a tension to the peeling tape by relatively moving the peeling tape stuck to the adhesive sheet and the adherend. And the connecting means sprays gas on one terminal region of the first peeling tape and the second peeling tape to the other end of the first peeling tape and the second peeling tape. A configuration in which gas blowing means for joining the tip regions is provided is adopted.

  Under the present circumstances, in the sheet peeling apparatus of this invention, it is preferable that the said gas spraying means sprays a hot air as gas.

  On the other hand, in the sheet peeling method of the present invention, the peeling tape having an adhesive surface exposed on one side is stuck to an adhesive sheet stuck on an adherend and tension is applied to the peeling tape. A sheet peeling method for peeling the adhesive sheet from an adherend, the step of feeding out at least one of a first peeling tape and a second peeling tape, and one of the first peeling tape and the second peeling tape. A step of bringing gas into contact with each other when the other end region of the first peeling tape and the second peeling tape are joined to the terminal region, and the first peeling tape; Alternatively, the step of attaching the adhesive surface of the second release tape to the adhesive sheet, and the release tape attached to the adhesive sheet and the adherend are moved relative to each other to stretch the adhesive tape. It employs a configuration that has a step of applying a.

  According to the present invention as described above, the gas blowing means for connecting the other tip region to the one terminal region of the first peeling tape and the second peeling tape by providing the gas is provided. Even if it is a peeling tape whose adhesive surface is exposed on the surface, the inconvenience that the adhesive layer of the first peeling tape or the second peeling tape adheres to the contact body is prevented, Can be connected.

  At this time, if hot air is blown onto the peeling tape and joined together, the fluidity of the adhesive can be improved, and the joining between the first peeling tape and the second peeling tape can be performed reliably.

The side view which shows the sheet peeling apparatus which concerns on one Embodiment of this invention. (A), (B) is operation | movement explanatory drawing of the sheet peeling apparatus of FIG.

Hereinafter, a sheet peeling apparatus according to an embodiment of the present invention will be described with reference to FIGS. 1 and 2.
In this embodiment, for example, when directions such as up, down, left, right, front, and back are indicated, all of FIG. When viewed from the appropriate orientation), the top, bottom, left, and right directions are parallel to the page, the front is the front direction orthogonal to the page, and the back is the back direction orthogonal to the page. To do.

[Configuration of sheet peeling apparatus]
In FIG. 1, a sheet peeling apparatus 1 applies a peeling tape PT (PT1, PT2) having an adhesive surface on one surface to an adhesive sheet AS that is affixed to the surface of a wafer WF as an adherend. A device for peeling the adhesive sheet AS from the surface of the wafer WF by applying tension to the peeling tape PT, the holding means 2 for holding the wafer WF, the first peeling tape PT1, and the second peeling tape. The other end region of the first peeling tape PT1 and the second peeling tape PT2 is provided in the one end region of the first peeling tape PT1 and the second peeling tape PT2 with the feeding means 3 for feeding at least one of the PT2. Bonding means 6 for abutting and bonding, bonding means 4 for bonding the adhesive surface of the first peeling tape PT1 or the second peeling tape PT2 to the adhesive sheet AS, and bonding And is configured to include a moving means 5 for imparting tension to the peeling tape PT by the over bets affixed to the peeling tape PT and the wafer WF to the AS are relatively moved.

  The holding unit 2 includes a table 21 that sucks and holds the wafer WF from the other surface (lower surface) through a suction port that is in communication with a decompression unit such as a decompression pump or a vacuum ejector (not shown). It is supported on a slider 54 of a linear motion motor 53 that is a device.

  The feeding means 3 includes a frame 30, a first support roller 31 </ b> A provided on the frame 30 for supporting the first peeling tape PT <b> 1 so that the first peeling tape PT <b> 1 can be fed, and a second peeling tape PT <b> 2 provided on the frame 30 for supporting the feeding. The second support roller 31B, guide rollers 32A, 32B, 32C, 32D, and 32E provided on the frame 30, optical sensors such as a projector 331A and a light receiver 332A, imaging means such as a camera, etc. The first detection means 33A that can detect that the remaining amount of the tape PT1 has decreased, an optical sensor such as a projector 331B and a light receiver 332B, an imaging means such as a camera, etc. The second detection means 33B that can detect that the remaining amount is low, and the peeling tape provided under the frame 30 and fed out. A tape support portion 34 for supporting the tip region of PT (PT1, PT2) from below, a chuck cylinder 35 as a driving device for gripping the tip portion of the peeling tape PT with a pair of grip claws 35A, and a chuck cylinder 35 A linear motion motor 35C, which is a drive device supported by the slider 35B, a tape cutting part 36 provided above the tape support part 34 for cutting the fed peeling tape PT, the first peeling tape PT1 and the first peeling tape PT1 A joining means 6 for joining the other end regions of the first peeling tape PT1 and the second peeling tape PT2 to one terminal region of the two peeling tape PT2. The first and second peeling tapes PT1 and PT2 are laminated with heat-sensitive adhesive first and second adhesive layers AD1 and AD2 on one surface of the first and second base tapes BT1 and BT2, respectively. The exposed surfaces of the first and second adhesive layers AD1 and AD2 are the adhesive surfaces.

The tape support portion 34 includes a bush 341 fixed to the frame 30, a rod 342 supported by the bush 341 so as to be able to advance and retreat, and a tape receiving plate 344 fixed to the tip of the rod 342 and having a cutter groove 343. And a coil spring 345 for biasing the tape receiving plate 344 in a direction protruding from the bushing 341.
The tape cutting unit 36 includes a cutter blade 361 that cuts the peeling tape PT, and an air cylinder 362 that is a drive device that drives the cutter blade 361 in the vertical direction.

  The connecting means 6 includes a first gripping portion 61 that grips the leading end portion of the first peeling tape PT1 with a linear motion motor 611 that is a driving device and a pair of chucks 613 provided on the slider 612 of the linear motion motor 611. A direct acting motor 621 that is a driving device and a pair of chucks 623 provided on the slider 622 of the direct acting motor 621, a second grasping portion 62 that grasps the tip of the second peeling tape PT <b> 2, and hot air as a gas is blown Gas blowing means 63 for joining the other end region of the first peeling tape PT1 and the second peeling tape PT2 to one terminal region of the first peeling tape PT1 and the second peeling tape PT2, The terminal side from the joined part in one terminal region of the first peeling tape PT1 and the second peeling tape PT2, or And a removal means 64 for removing the distal end side than the stitched portion in the other of the tip region of the first stripping tape PT1 and the second stripping tape PT2.

  The gas blowing means 63 is disposed oppositely with the first peeling tape PT1 and the second peeling tape PT2 interposed therebetween, and the gas sent from the blowing means such as a fan motor or a pressure pump is used as a coil heater or an infrared heater. A hot air blowing means (not shown) that heats the heating means to produce hot air and a pair of first hot air nozzles 63A and second hot air nozzles 63B that blow hot air from the hot air blowing means in opposite directions are provided.

  The removing means 64 includes first and second cutting blades 641C and 642C respectively supported by output shafts 641B and 642B of linear motion motors 641A and 642A as drive devices provided on the left and right sides of the first hot air nozzle 63A. The first and second removing means 641 and 642 provided, and the third supported by the output shafts 643B and 644B of the linear motion motors 643A and 644A as drive devices provided on the left and right sides of the second hot air nozzle 63B, respectively. The third and fourth removing means 643 and 644 having the fourth cutting blades 643C and 644C, the first groove 645A for receiving the first cutting blade 641C, and the third groove 645B for receiving the third cutting blade 643C. A first receiving plate 645, a second groove 646A for receiving the second cutting blade 642C, and a fourth groove 646B for receiving the fourth cutting blade 644C. And a receiving plate 646.

  The sticking means 4 includes a pressing head 43 provided at the lower end portion of the output shaft 42 of the linear motion motor 41 as a driving device, and a heating means such as a coil heater or an infrared heater for heating the pressing surface portion 44 at the lower end of the pressing head 43. 45.

[Operation of sheet peeling device]
Next, as a peeling method of the adhesive sheet AS in the present embodiment, the operation of the sheet peeling apparatus 1 will be described with reference to the drawings.
First, as shown in FIG. 1, the first peeling tape PT1 is supported by the first support roller 31A, the first peeling tape PT1 is pulled out and passed over the guide rollers 32A, 32C, 32D, 32E, and the tip thereof. The region is positioned on the tape backing plate 344. On the other hand, the second peeling tape PT2 is supported by the second support roller 31B, the second peeling tape PT2 is pulled out and passed to the guide roller 32B, and the tip end region thereof is held by the second holding portion 62. . Then, when a transfer unit (not shown) transfers the wafer WF to a predetermined position on the table 21, the holding unit 2 drives a decompression unit (not shown) and holds the wafer WF on the table 21 via the suction port.
When the moving unit 5 drives the linear motion motor 53 and the left end of the adhesive sheet AS attached to the wafer WF is positioned directly below the left end of the pressing surface portion 44, the feeding unit 3 drives the linear motion motor 35C. The tape receiving plate 344 is pushed in the direction of the bush 341 with the gripping claws 35A located below, and the tip region of the first peeling tape PT1 is received between the upper and lower gripping claws 35A. Next, the feeding means 3 drives the chuck cylinder 35, clamps the tip region of the first peeling tape PT1 with the gripping claws 35A, drives the linear motor 35C, moves the chuck cylinder 35 to the left, The peeling tape PT1 is pulled out by a predetermined length and stopped.

  Next, the sticking means 4 drives the linear motion motor 41 to lower the pressing head 43 and press the first peeling tape PT1 against the adhesive sheet AS at the pressing surface portion 44 as shown by the double chain line in FIG. Then, the heating means 45 is driven to heat the pressing surface portion 44 and to stick the first peeling tape PT1 to the adhesive sheet AS. Next, the feeding means 3 drives the air cylinder 362 and lowers the cutter blade 361 into the cutter groove 343 to cut the first peeling tape PT1. Thereafter, the sticking means 4 drives the linear motor 41 to raise the pressing head 43, and the feeding means 3 drives the air cylinder 362 to raise the cutter blade 361.

  Next, the moving means 5 drives the linear motor 53 to move the table 21 in the left direction, whereby the adhesive sheet AS is sequentially peeled from the wafer WF, and the wafer WF from which the entire adhesive sheet AS is peeled is appropriately It is conveyed from the table 21 to another process by a simple conveying device. The adhesive sheet AS peeled off from the wafer WF is separated from the chuck cylinder 35 and collected by a collecting means (not shown), and thereafter the same operation as described above is repeated.

When the above operation is repeated and the remaining amount of the first peeling tape PT1 decreases as shown in FIG. 2A, and the light receiver 332A receives the light from the projector 331A, the gas blowing means 63 is not shown. The blowing means is driven, hot air from the hot air blowing means is blown out from the first hot air nozzle 63A and the second hot air nozzle 63B, and the end region of the first peeling tape PT1 and the leading end region of the second peeling tape PT2 are sandwiched. Connect together. Here, the position sandwiched and pasted by the hot air from the first hot air nozzle 63A and the second hot air nozzle 63B is referred to as a connecting portion PTX.
Then, the removing means 64 drives the linear motion motor 641A, lowers the first cutting blade 641C into the first groove 645A, cuts and removes the terminal side from the joining portion PTX in the first peeling tape PT1, and linearly moves. The motor 644A is driven, the fourth cutting blade 644C is raised into the fourth groove 646B, and the front end side of the second peeling tape PT2 is cut and removed from the connecting portion PTX.
Thereby, the second peeling tape PT2 connected to the first peeling tape PT1 is sequentially fed out, and the peeling of the adhesive sheet AS by the second peeling tape PT2 similar to the first peeling tape PT1 is continued. While the peeling is performed by the second peeling tape PT2, the operator removes the residue such as the paper tube of the first peeling tape PT1 remaining on the first support roller 31A, and starts a new first peeling. The tape PT1 for support is supported by the first support roller 31A, and the new first peeling tape PT1 is pulled out as shown in FIG.

Further, the peeling operation of the adhesive sheet AS by the second peeling tape PT2 is repeated, and as shown in FIG. 2B, the remaining amount of the second peeling tape PT2 decreases, and the light receiver 332B emits light from the projector 331B. In the same manner as described above, the terminal region of the second peeling tape PT2 and the tip region of the first peeling tape PT1 are sandwiched and joined in the same manner as described above.
Then, the removing unit 64 drives the linear motion motor 643A to raise the third cutting blade 643C into the third groove 645B and cut and remove the rear end side of the joining portion PTX in the second peeling tape PT2 to directly The driving motor 642A is driven, the second cutting blade 642C is lowered into the second groove 646A, and the tip side of the connecting portion PTX in the first peeling tape PT1 is cut and removed.
Thereby, the 1st peeling tape PT1 connected with the 2nd peeling tape PT2 is drawn | fed out sequentially, and peeling of the adhesive sheet AS similar to the above is continued.
2 (A) and 2 (B), the portion where the first peeling tape PT1 and the second peeling tape PT2 overlap in the connecting portion PTX in two layers is formed on the adhesive sheet AS by the sticking means 4. When the part is fed to the position where it is applied, this part is not applied by the applying means 4, and is cut and discarded by the tape cutting unit 36, and newly peeled off by the chuck cylinder 35. Grip and pull out. Detection of these overlapping portions can be detected by a detection means such as an optical sensor or an image pickup means, or can be detected by a feeding amount of the peeling tape PT.

According to this embodiment as described above, the following effects are obtained.
That is, since the gas blowing means 63 for joining the other tip region is provided in one terminal region of the first peeling tape PT1 and the second peeling tape PT2 by blowing hot air, the adhesive surface is provided on one surface. Prevents the inconvenience that the adhesive layers AD1 and AD2 of the first peeling tape PT1 or the second peeling tape PT2 adhere to the contact body even if the peeling tape PT (PT1, PT2) is exposed. And connect them appropriately.

[Modification]
As described above, the best configuration, method and the like for carrying out the present invention have been disclosed in the above description, but the present invention is not limited to this. That is, the invention has been illustrated and described with particular reference to certain specific embodiments, but without departing from the spirit and scope of the invention, Various modifications can be made by those skilled in the art in terms of material, quantity, and other detailed configurations. In addition, the description limited to the shape, material, etc. disclosed above is an example for easy understanding of the present invention, and does not limit the present invention. The description by the name of the member which remove | excluded the limitation of one part or all of such is included in this invention.

For example, in the above-described embodiment, the case where the adherend is the semiconductor wafer WF is shown. However, the adherend is not limited to the semiconductor wafer WF, but a glass plate, a steel plate, or a resin plate, a substrate, and an optical disc. Other adherends such as silicon wafers and compound wafers can be exemplified as the semiconductor wafer WF, and an adhesive sheet (sheet, film, tape, etc.) attached to the adherend is peeled off. The present invention can also be applied to a peeling device or a peeling method.
Furthermore, in the said embodiment, although the heat sensitive adhesive was used as the peeling tape PT, not only this but pressure sensitive adhesive, photosensitive adhesive, etc. may be used. In the case where the peeling tape PT is pressure-sensitive adhesive or photosensitive adhesive, a configuration in which the applying unit 4 also presses correspondingly or a conventionally known configuration in which application is performed by irradiation with light may be applied.
Further, the peeling tape PT may be, for example, a tape having an intermediate layer between the base tape BT and the adhesive layer AD, or a tape having another layer on the base tape BT. It may be composed only of the adhesive layer AD without BT.
Furthermore, the adhesive sheet AS may be an appropriate sheet, film, tape, or the like.

Further, the wafer WF and the peeling tape PT may be moved and moved relative to each other, or the wafer WF may be stopped and the peeling tape PT may be moved.
As the first detection means 33A and the second detection means 33B for detecting the terminal area of the peeling tape PT, for example, the color or magnetism provided in the terminal area of the peeling tape PT is detected, or the peeling tape PT A known method can be applied, such as detecting the end region by counting the number of rotations of the winding core and detecting the feeding amount of the peeling tape PT.

Furthermore, although hot air was blown from the gas blowing means, the configuration may be such that air is simply blown.
Further, in the case where the peeling tape PT has an adhesive force (exhibits) with energy rays such as ultraviolet rays, infrared rays, microwaves, and ultrasonic waves, instead of the heating means, an ultraviolet ray irradiation device, an infrared ray irradiation device, and a microwave irradiation device. An energy beam irradiation device such as an ultrasonic beam irradiation device or a combination thereof may be used as appropriate, or the energy layer may be irradiated in advance with the energy beam irradiation device, and the adhesive layer AD increases the adhesive force. In such a state, gas may be blown to join them together.
Moreover, although the 1st holding part 61 and the 2nd holding part 62 were provided, as a structure which hold | maintains the edge part of the 1st peeling tape PT1 or the 2nd peeling tape PT2, any conventionally well-known structure can be utilized. .
Further, the removing means 64 may not be provided, and for example, when the position of the joint portion PTX is extended, the tape cutting unit 36 may cut and remove it without sticking with the sticking means 4.
In addition, the first hot air nozzle 63A in the above embodiment does not need to be provided, and instead of the first hot air nozzle 63A, for example, a pressure receiving member such as a plate member or a roller may be used.
Furthermore, instead of the second hot air nozzle 63B in the above-described embodiment, a pressure receiving member such as a plate-like member or a roller subjected to a non-adhesive process to which the adhesive layer AD does not adhere is adopted, and gas is blown from the first hot air nozzle 63A. It is good.

  The drive device in the embodiment includes an electric device such as a rotation motor, a linear motion motor, a linear motor, a single axis robot, an articulated robot, an actuator such as an air cylinder, a hydraulic cylinder, a rodless cylinder, and a rotary cylinder. In addition to the above, it is possible to adopt a combination of them directly or indirectly (some of them overlap with those exemplified in the embodiment).

DESCRIPTION OF SYMBOLS 1 Sheet peeling apparatus 3 Feeding means 4 Sticking means 5 Moving means 6 Connecting means 63 Gas spraying means 64 Removing means AS Adhesive sheet PT peeling tape PT1 1st peeling tape PT2 2nd peeling tape WF Semiconductor wafer (adhered body)

Claims (3)

A sheet that peels off the adhesive sheet from the adherend by applying a release tape having an adhesive surface on one surface to the adhesive sheet attached to the adherend and applying tension to the peel tape. A peeling device,
A feeding means for feeding out at least one of the first peeling tape and the second peeling tape;
A joining means for bringing the other end region of the first peeling tape and the second peeling tape into contact with and joining one terminal region of the first peeling tape and the second peeling tape;
A sticking means for sticking the adhesive surface of the first peeling tape or the second peeling tape to the adhesive sheet;
A moving means for applying a tension to the peeling tape by relatively moving the peeling tape attached to the adhesive sheet and the adherend;
The connecting means blows gas so that the other end region of the first peeling tape and the second peeling tape is applied to one terminal region of the first peeling tape and the second peeling tape. A sheet peeling apparatus comprising gas blowing means for joining together.   The sheet peeling apparatus according to claim 1, wherein the gas blowing unit blows hot air as a gas. A sheet that peels off the adhesive sheet from the adherend by applying a release tape having an adhesive surface on one surface to the adhesive sheet attached to the adherend and applying tension to the peel tape. A peeling method,
Feeding out at least one of the first peeling tape and the second peeling tape;
When connecting the other end region of the first peeling tape and the second peeling tape to one terminal region of the first peeling tape and the second peeling tape, they are blown to blow them. A process of contacting and joining,
Attaching the adhesive surface of the first peeling tape or the second peeling tape to the adhesive sheet;
And a step of applying a tension to the peeling tape by relatively moving the peeling tape attached to the adhesive sheet and the adherend.

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