JP2013503104A - ガラス基板のレーザ切断方法 - Google Patents
ガラス基板のレーザ切断方法 Download PDFInfo
- Publication number
- JP2013503104A JP2013503104A JP2012527001A JP2012527001A JP2013503104A JP 2013503104 A JP2013503104 A JP 2013503104A JP 2012527001 A JP2012527001 A JP 2012527001A JP 2012527001 A JP2012527001 A JP 2012527001A JP 2013503104 A JP2013503104 A JP 2013503104A
- Authority
- JP
- Japan
- Prior art keywords
- glass substrate
- laser beam
- scanning
- cutting line
- edge
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Images
Classifications
-
- C—CHEMISTRY; METALLURGY
- C03—GLASS; MINERAL OR SLAG WOOL
- C03B—MANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
- C03B33/00—Severing cooled glass
- C03B33/09—Severing cooled glass by thermal shock
- C03B33/091—Severing cooled glass by thermal shock using at least one focussed radiation beam, e.g. laser beam
-
- C—CHEMISTRY; METALLURGY
- C03—GLASS; MINERAL OR SLAG WOOL
- C03B—MANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
- C03B33/00—Severing cooled glass
- C03B33/07—Cutting armoured, multi-layered, coated or laminated, glass products
- C03B33/072—Armoured glass, i.e. comprising reinforcement
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/36—Removing material
- B23K26/40—Removing material taking account of the properties of the material involved
-
- C—CHEMISTRY; METALLURGY
- C03—GLASS; MINERAL OR SLAG WOOL
- C03B—MANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
- C03B33/00—Severing cooled glass
- C03B33/02—Cutting or splitting sheet glass or ribbons; Apparatus or machines therefor
- C03B33/0222—Scoring using a focussed radiation beam, e.g. laser
-
- C—CHEMISTRY; METALLURGY
- C03—GLASS; MINERAL OR SLAG WOOL
- C03B—MANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
- C03B33/00—Severing cooled glass
- C03B33/02—Cutting or splitting sheet glass or ribbons; Apparatus or machines therefor
- C03B33/023—Cutting or splitting sheet glass or ribbons; Apparatus or machines therefor the sheet or ribbon being in a horizontal position
-
- C—CHEMISTRY; METALLURGY
- C03—GLASS; MINERAL OR SLAG WOOL
- C03B—MANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
- C03B33/00—Severing cooled glass
- C03B33/09—Severing cooled glass by thermal shock
- C03B33/091—Severing cooled glass by thermal shock using at least one focussed radiation beam, e.g. laser beam
- C03B33/093—Severing cooled glass by thermal shock using at least one focussed radiation beam, e.g. laser beam using two or more focussed radiation beams
-
- C—CHEMISTRY; METALLURGY
- C03—GLASS; MINERAL OR SLAG WOOL
- C03C—CHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
- C03C23/00—Other surface treatment of glass not in the form of fibres or filaments
- C03C23/0005—Other surface treatment of glass not in the form of fibres or filaments by irradiation
- C03C23/0025—Other surface treatment of glass not in the form of fibres or filaments by irradiation by a laser beam
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K2103/00—Materials to be soldered, welded or cut
- B23K2103/50—Inorganic material, e.g. metals, not provided for in B23K2103/02 – B23K2103/26
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P40/00—Technologies relating to the processing of minerals
- Y02P40/50—Glass production, e.g. reusing waste heat during processing or shaping
- Y02P40/57—Improving the yield, e-g- reduction of reject rates
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Organic Chemistry (AREA)
- Materials Engineering (AREA)
- Health & Medical Sciences (AREA)
- Toxicology (AREA)
- Thermal Sciences (AREA)
- Mechanical Engineering (AREA)
- Plasma & Fusion (AREA)
- Life Sciences & Earth Sciences (AREA)
- Geochemistry & Mineralogy (AREA)
- General Chemical & Material Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Re-Forming, After-Treatment, Cutting And Transporting Of Glass Products (AREA)
- Laser Beam Processing (AREA)
- Processing Of Stones Or Stones Resemblance Materials (AREA)
Abstract
Description
106 レーザ走査器
108 レーザビーム
109b〜109d ビームスポット
110 ガラス基板
111、113 エッジ
112 エッジ傷
116 切断ライン
117 第1表面
140 貫通割れ目
150 ガラス物品
Claims (10)
- 表面圧縮層と引張層とを含む強化ガラス基板からガラス物品を切断する方法において、
前記強化ガラス基板の第1エッジの前記表面圧縮層にエッジ傷を形成するステップ、および、
前記エッジ傷の位置で、前記表面圧縮層と前記引張層とを貫通する貫通割れ目を伝播させるステップ、
を含み、該貫通割れ目が、前記ガラス物品と前記強化ガラス基板との間の切断ラインに沿って、分離部を先導することを特徴とする方法。 - 前記エッジ傷の位置で前記貫通割れ目を伝播させるステップが、前記切断ラインの長さに沿ってレーザビームを走査させるステップをさらに含むことを特徴とする請求項1記載の方法。
- 表面圧縮層と引張層とを含む強化ガラス基板からガラス物品を切断する方法において、前記ガラス物品と前記強化ガラス基板との間の切断ラインの長さに沿って前記表面圧縮層上に入射するレーザビームを、貫通割れ目が該切断ラインに沿って伝播するように走査させるステップを含むことを特徴とする方法。
- 前記強化ガラス基板の第1エッジにエッジ傷を形成するステップをさらに含み、前記貫通割れ目が該エッジ傷の位置で開始したものであり、かつ前記貫通割れ目が、前記ガラス物品と前記強化ガラス基板との間の前記切断ラインに沿って、分離部を先導することを特徴とする請求項3記載の方法。
- 表面圧縮層と引張層とを含む強化ガラス基板を切断する方法において、
エッジ傷を、前記強化ガラス基板の前記表面圧縮層上に、切断ライン上に位置付けて形成するステップ、および、
該切断ラインに沿って前記強化ガラス基板を分離するよう、レーザビームを前記切断ラインの長さに沿って走査させるステップ、
を含むことを特徴とする方法。 - 前記レーザビームを、前記強化ガラス基板に対する該レーザビームの入射角が垂直であるときに基準走査速度で走査させ、かつ、
前記レーザビームを前記切断ラインに沿って走査させるにつれ、該走査レーザビームの入射角が増加するのにしたがって、前記レーザビームを前記基準走査速度から低下させた減速する走査速度で走査させることを特徴とする請求項2、3、または5記載の方法。 - 前記レーザビームを走査させるステップが、前記切断ラインに沿って走査レーザラインを生成するものであり、該走査レーザラインの長さが、おおよそ前記切断ラインの長さ以上であることを特徴とする請求項2、3、または5記載の方法。
- 前記レーザビームを前記エッジ傷上に短縮走査ラインに沿って走査させるステップをさらに含むことを特徴とする請求項2、4、または5記載の方法。
- 前記切断ラインと位置合わせされる主軸を有する楕円ビームスポットを前記レーザビームが前記強化ガラス基板上に照射するよう、前記レーザビームを成形するステップをさらに含むことを特徴とする請求項2、3、または5記載の方法。
- 一定時間後に前記走査レーザビームを停止させるステップ、および、
前記走査レーザビームを停止させた後に前記エッジ傷にウォータージェットを適用して、前記切断ラインに沿いに貫通割れ目を生じさせるステップ、
をさらに含むことを特徴とする請求項2、4、または5記載の方法。
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US23772809P | 2009-08-28 | 2009-08-28 | |
US61/237,728 | 2009-08-28 | ||
PCT/US2010/046885 WO2011025903A1 (en) | 2009-08-28 | 2010-08-27 | Methods for laser cutting glass substrates |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2013503104A true JP2013503104A (ja) | 2013-01-31 |
JP5702785B2 JP5702785B2 (ja) | 2015-04-15 |
Family
ID=43037816
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2012527001A Expired - Fee Related JP5702785B2 (ja) | 2009-08-28 | 2010-08-27 | ガラス基板のレーザ切断方法 |
Country Status (7)
Country | Link |
---|---|
US (2) | US8932510B2 (ja) |
EP (1) | EP2470326B1 (ja) |
JP (1) | JP5702785B2 (ja) |
KR (1) | KR101718569B1 (ja) |
CN (1) | CN102574246B (ja) |
TW (1) | TWI490179B (ja) |
WO (1) | WO2011025903A1 (ja) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2018172276A (ja) * | 2012-11-21 | 2018-11-08 | コーニング インコーポレイテッド | 積層強化ガラス基板の切断方法 |
Families Citing this family (114)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US8921733B2 (en) | 2003-08-11 | 2014-12-30 | Raydiance, Inc. | Methods and systems for trimming circuits |
US8347651B2 (en) * | 2009-02-19 | 2013-01-08 | Corning Incorporated | Method of separating strengthened glass |
US8932510B2 (en) | 2009-08-28 | 2015-01-13 | Corning Incorporated | Methods for laser cutting glass substrates |
US8946590B2 (en) * | 2009-11-30 | 2015-02-03 | Corning Incorporated | Methods for laser scribing and separating glass substrates |
US20110127242A1 (en) * | 2009-11-30 | 2011-06-02 | Xinghua Li | Methods for laser scribing and separating glass substrates |
CN102883880B (zh) | 2010-03-05 | 2017-02-08 | Sage电致变色显示有限公司 | 电致变色装置到玻璃衬底的层合 |
TWI494284B (zh) | 2010-03-19 | 2015-08-01 | Corning Inc | 強化玻璃之機械劃割及分離 |
US8864005B2 (en) | 2010-07-16 | 2014-10-21 | Corning Incorporated | Methods for scribing and separating strengthened glass substrates |
FR2962682B1 (fr) | 2010-07-16 | 2015-02-27 | Saint Gobain | Vitrage electrochimique a proprietes optiques et/ou energetiques electrocommandables |
WO2012021748A1 (en) | 2010-08-12 | 2012-02-16 | Raydiance, Inc. | Polymer tubing laser micromachining |
US8720228B2 (en) | 2010-08-31 | 2014-05-13 | Corning Incorporated | Methods of separating strengthened glass substrates |
US9120181B2 (en) | 2010-09-16 | 2015-09-01 | Coherent, Inc. | Singulation of layered materials using selectively variable laser output |
US8616024B2 (en) | 2010-11-30 | 2013-12-31 | Corning Incorporated | Methods for forming grooves and separating strengthened glass substrate sheets |
JP5373856B2 (ja) * | 2011-06-22 | 2013-12-18 | 三星ダイヤモンド工業株式会社 | ガラス基板のスクライブ方法 |
CN103874668A (zh) * | 2011-08-23 | 2014-06-18 | Hoya株式会社 | 强化玻璃基板的制造方法和强化玻璃基板 |
US10239160B2 (en) | 2011-09-21 | 2019-03-26 | Coherent, Inc. | Systems and processes that singulate materials |
KR101258403B1 (ko) * | 2011-12-09 | 2013-04-30 | 로체 시스템즈(주) | 강화유리 기판 절단방법 |
WO2013106164A1 (en) * | 2012-01-13 | 2013-07-18 | Imra America, Inc. | Methods and systems for laser processing of coated substrates |
US10357850B2 (en) | 2012-09-24 | 2019-07-23 | Electro Scientific Industries, Inc. | Method and apparatus for machining a workpiece |
US9828278B2 (en) | 2012-02-28 | 2017-11-28 | Electro Scientific Industries, Inc. | Method and apparatus for separation of strengthened glass and articles produced thereby |
CN104136967B (zh) * | 2012-02-28 | 2018-02-16 | 伊雷克托科学工业股份有限公司 | 用于分离增强玻璃的方法及装置及由该增强玻璃生产的物品 |
US9227868B2 (en) | 2012-02-29 | 2016-01-05 | Electro Scientific Industries, Inc. | Method and apparatus for machining strengthened glass and articles produced thereby |
US9359251B2 (en) | 2012-02-29 | 2016-06-07 | Corning Incorporated | Ion exchanged glasses via non-error function compressive stress profiles |
CN104661787A (zh) * | 2012-04-05 | 2015-05-27 | Sage电致变色显示有限公司 | 用于电变色装置制造的热激光划线切割方法和设备及相应的切割玻璃面板 |
US9938186B2 (en) | 2012-04-13 | 2018-04-10 | Corning Incorporated | Strengthened glass articles having etched features and methods of forming the same |
US10351460B2 (en) * | 2012-05-22 | 2019-07-16 | Corning Incorporated | Methods of separating strengthened glass sheets by mechanical scribing |
JP6009225B2 (ja) * | 2012-05-29 | 2016-10-19 | 浜松ホトニクス株式会社 | 強化ガラス板の切断方法 |
US9938180B2 (en) | 2012-06-05 | 2018-04-10 | Corning Incorporated | Methods of cutting glass using a laser |
WO2014010490A1 (ja) * | 2012-07-09 | 2014-01-16 | 旭硝子株式会社 | 強化ガラス板の切断方法 |
JP2015171955A (ja) * | 2012-07-11 | 2015-10-01 | 旭硝子株式会社 | 湾曲板の製造方法 |
TW201410371A (zh) * | 2012-07-11 | 2014-03-16 | Asahi Glass Co Ltd | 小尺寸板之製造方法及構造體、以及構造體之製造方法 |
JP2015171954A (ja) * | 2012-07-11 | 2015-10-01 | 旭硝子株式会社 | 積層板の製造方法 |
JP2015171953A (ja) * | 2012-07-11 | 2015-10-01 | 旭硝子株式会社 | 機能性基板の製造方法 |
AT13206U1 (de) * | 2012-07-17 | 2013-08-15 | Lisec Maschb Gmbh | Verfahren und Anordnung zum Teilen von Flachglas |
DE102012212462A1 (de) * | 2012-07-17 | 2014-03-20 | Schott Ag | Verfahren zum Herstellen chemisch vorgespannter Glassubstrate |
TW201417928A (zh) * | 2012-07-30 | 2014-05-16 | Raydiance Inc | 具訂製邊形及粗糙度之脆性材料切割 |
WO2014022681A1 (en) * | 2012-08-01 | 2014-02-06 | Gentex Corporation | Assembly with laser induced channel edge and method thereof |
KR101355807B1 (ko) * | 2012-09-11 | 2014-02-03 | 로체 시스템즈(주) | 비금속 재료의 곡선 절단방법 |
US9610653B2 (en) | 2012-09-21 | 2017-04-04 | Electro Scientific Industries, Inc. | Method and apparatus for separation of workpieces and articles produced thereby |
CN102898014A (zh) * | 2012-09-29 | 2013-01-30 | 江苏太平洋石英股份有限公司 | 无接触激光切割石英玻璃制品的方法及其装置 |
WO2014079478A1 (en) | 2012-11-20 | 2014-05-30 | Light In Light Srl | High speed laser processing of transparent materials |
EP2754524B1 (de) | 2013-01-15 | 2015-11-25 | Corning Laser Technologies GmbH | Verfahren und Vorrichtung zum laserbasierten Bearbeiten von flächigen Substraten, d.h. Wafer oder Glaselement, unter Verwendung einer Laserstrahlbrennlinie |
WO2014144322A1 (en) * | 2013-03-15 | 2014-09-18 | Kinestral Technologies, Inc. | Laser cutting strengthened glass |
EP2781296B1 (de) | 2013-03-21 | 2020-10-21 | Corning Laser Technologies GmbH | Vorrichtung und verfahren zum ausschneiden von konturen aus flächigen substraten mittels laser |
US9328011B2 (en) * | 2013-06-04 | 2016-05-03 | Coherent, Inc. | Laser-scribing of chemically strengthened glass |
US11079309B2 (en) | 2013-07-26 | 2021-08-03 | Corning Incorporated | Strengthened glass articles having improved survivability |
US10293436B2 (en) | 2013-12-17 | 2019-05-21 | Corning Incorporated | Method for rapid laser drilling of holes in glass and products made therefrom |
US10442719B2 (en) | 2013-12-17 | 2019-10-15 | Corning Incorporated | Edge chamfering methods |
US11556039B2 (en) | 2013-12-17 | 2023-01-17 | Corning Incorporated | Electrochromic coated glass articles and methods for laser processing the same |
US20150166393A1 (en) * | 2013-12-17 | 2015-06-18 | Corning Incorporated | Laser cutting of ion-exchangeable glass substrates |
US9815730B2 (en) | 2013-12-17 | 2017-11-14 | Corning Incorporated | Processing 3D shaped transparent brittle substrate |
US9676167B2 (en) | 2013-12-17 | 2017-06-13 | Corning Incorporated | Laser processing of sapphire substrate and related applications |
US9701563B2 (en) | 2013-12-17 | 2017-07-11 | Corning Incorporated | Laser cut composite glass article and method of cutting |
US9850160B2 (en) | 2013-12-17 | 2017-12-26 | Corning Incorporated | Laser cutting of display glass compositions |
US20150165560A1 (en) | 2013-12-17 | 2015-06-18 | Corning Incorporated | Laser processing of slots and holes |
KR102432658B1 (ko) * | 2014-01-27 | 2022-08-16 | 코닝 인코포레이티드 | 레이저 컷팅 유리를 기계적으로 처리하여 챔퍼링된 에지 |
US9517968B2 (en) | 2014-02-24 | 2016-12-13 | Corning Incorporated | Strengthened glass with deep depth of compression |
EP3114094B1 (de) * | 2014-03-04 | 2022-05-18 | Saint-Gobain Glass France | Verfahren und vorrichtung zum schneiden einer laminierten, ultradünnen glasschicht |
US9776906B2 (en) * | 2014-03-28 | 2017-10-03 | Electro Scientific Industries, Inc. | Laser machining strengthened glass |
TWI773291B (zh) | 2014-06-19 | 2022-08-01 | 美商康寧公司 | 無易碎應力分布曲線的玻璃 |
GB2527553B (en) | 2014-06-25 | 2017-08-23 | Fianium Ltd | Laser processing |
JP2017521259A (ja) | 2014-07-08 | 2017-08-03 | コーニング インコーポレイテッド | 材料をレーザ加工するための方法および装置 |
WO2016010949A1 (en) | 2014-07-14 | 2016-01-21 | Corning Incorporated | Method and system for forming perforations |
JP6788571B2 (ja) | 2014-07-14 | 2020-11-25 | コーニング インコーポレイテッド | 界面ブロック、そのような界面ブロックを使用する、ある波長範囲内で透過する基板を切断するためのシステムおよび方法 |
US10335902B2 (en) | 2014-07-14 | 2019-07-02 | Corning Incorporated | Method and system for arresting crack propagation |
LT3169477T (lt) * | 2014-07-14 | 2020-05-25 | Corning Incorporated | Skaidrių medžiagų apdorojimo sistema ir būdas, naudojant lazerio pluošto židinio linijas, kurių ilgis ir skersmuo yra reguliuojami |
CN106687420B (zh) | 2014-08-28 | 2020-03-27 | 康宁股份有限公司 | 用于切割玻璃板的设备和方法 |
US10730791B2 (en) | 2014-10-08 | 2020-08-04 | Corning Incorporated | Glasses and glass ceramics including a metal oxide concentration gradient |
DE102014015951A1 (de) | 2014-10-20 | 2016-04-21 | 4Jet Technologies Gmbh | Verfahren zum Bearbeiten eines elektrisch nicht leitenden oder halbleitenden Materials |
US10150698B2 (en) | 2014-10-31 | 2018-12-11 | Corning Incorporated | Strengthened glass with ultra deep depth of compression |
WO2016073539A1 (en) | 2014-11-04 | 2016-05-12 | Corning Incorporated | Deep non-frangible stress profiles and methods of making |
US10017411B2 (en) | 2014-11-19 | 2018-07-10 | Corning Incorporated | Methods of separating a glass web |
US10047001B2 (en) | 2014-12-04 | 2018-08-14 | Corning Incorporated | Glass cutting systems and methods using non-diffracting laser beams |
CN107406293A (zh) | 2015-01-12 | 2017-11-28 | 康宁股份有限公司 | 使用多光子吸收方法来对经热回火的基板进行激光切割 |
KR102546692B1 (ko) | 2015-03-24 | 2023-06-22 | 코닝 인코포레이티드 | 디스플레이 유리 조성물의 레이저 절단 및 가공 |
WO2016160391A1 (en) | 2015-03-27 | 2016-10-06 | Corning Incorporated | Gas permeable window and method of fabricating the same |
JP6638514B2 (ja) | 2015-03-31 | 2020-01-29 | 日本電気硝子株式会社 | 脆性基板の切断方法 |
CN107848859B (zh) | 2015-07-07 | 2020-12-25 | 康宁股份有限公司 | 在分离线处加热移动的玻璃带和/或从玻璃带中分离玻璃片的设备和方法 |
KR102499697B1 (ko) | 2015-07-10 | 2023-02-14 | 코닝 인코포레이티드 | 유연한 기판 시트에서의 홀의 연속 제조 방법 및 이에 관한 물품 |
US11613103B2 (en) | 2015-07-21 | 2023-03-28 | Corning Incorporated | Glass articles exhibiting improved fracture performance |
US9701569B2 (en) | 2015-07-21 | 2017-07-11 | Corning Incorporated | Glass articles exhibiting improved fracture performance |
CN106604898B (zh) | 2015-08-10 | 2021-06-04 | 法国圣戈班玻璃厂 | 用于切割薄玻璃层的方法 |
CN107922259B (zh) * | 2015-09-04 | 2021-05-07 | Agc株式会社 | 玻璃板的制造方法、玻璃板、玻璃物品的制造方法、玻璃物品以及玻璃物品的制造装置 |
CN105269228A (zh) * | 2015-10-23 | 2016-01-27 | 江苏友邦精工实业有限公司 | 一种车架大梁焊接工装 |
KR20180075707A (ko) * | 2015-11-25 | 2018-07-04 | 코닝 인코포레이티드 | 유리 웹의 분리 방법들 |
DK3386930T3 (da) | 2015-12-11 | 2021-07-26 | Corning Inc | Fusionsformbare, glasbaserede artikler indbefattende en metaloxidkoncentrationsgradient |
TWI750807B (zh) | 2016-04-08 | 2021-12-21 | 美商康寧公司 | 包含金屬氧化物濃度梯度之玻璃基底物件 |
KR20210122313A (ko) | 2016-04-08 | 2021-10-08 | 코닝 인코포레이티드 | 두 영역을 포함하는 응력 프로파일을 포함하는 유리-계 물품, 및 제조 방법 |
FR3050990B1 (fr) * | 2016-05-03 | 2018-05-18 | Saint-Gobain Glass France | Faconnage de verre apres trempe |
JP6938543B2 (ja) | 2016-05-06 | 2021-09-22 | コーニング インコーポレイテッド | 透明基板からの、輪郭設定された形状のレーザ切断及び取り外し |
US10410883B2 (en) | 2016-06-01 | 2019-09-10 | Corning Incorporated | Articles and methods of forming vias in substrates |
US10794679B2 (en) | 2016-06-29 | 2020-10-06 | Corning Incorporated | Method and system for measuring geometric parameters of through holes |
CN106186656B (zh) * | 2016-07-05 | 2018-09-04 | 温州大学 | 一种钢化玻璃的激光切割方法 |
WO2018022476A1 (en) | 2016-07-29 | 2018-02-01 | Corning Incorporated | Apparatuses and methods for laser processing |
KR102423775B1 (ko) | 2016-08-30 | 2022-07-22 | 코닝 인코포레이티드 | 투명 재료의 레이저 가공 |
WO2018064409A1 (en) | 2016-09-30 | 2018-04-05 | Corning Incorporated | Apparatuses and methods for laser processing transparent workpieces using non-axisymmetric beam spots |
EP3529214B1 (en) | 2016-10-24 | 2020-12-23 | Corning Incorporated | Substrate processing station for laser-based machining of sheet-like glass substrates |
US10752534B2 (en) | 2016-11-01 | 2020-08-25 | Corning Incorporated | Apparatuses and methods for laser processing laminate workpiece stacks |
US10688599B2 (en) | 2017-02-09 | 2020-06-23 | Corning Incorporated | Apparatus and methods for laser processing transparent workpieces using phase shifted focal lines |
US11512016B2 (en) | 2017-03-22 | 2022-11-29 | Corning Incorporated | Methods of separating a glass web |
US10580725B2 (en) | 2017-05-25 | 2020-03-03 | Corning Incorporated | Articles having vias with geometry attributes and methods for fabricating the same |
US11078112B2 (en) | 2017-05-25 | 2021-08-03 | Corning Incorporated | Silica-containing substrates with vias having an axially variable sidewall taper and methods for forming the same |
US10626040B2 (en) | 2017-06-15 | 2020-04-21 | Corning Incorporated | Articles capable of individual singulation |
CO2017012225A1 (es) | 2017-08-23 | 2018-02-20 | Agp America Sa | Blindaje transparente multi impacto |
US20190062196A1 (en) * | 2017-08-25 | 2019-02-28 | Corning Incorporated | Apparatuses and methods for laser processing transparent workpieces using an afocal beam adjustment assembly |
US11554984B2 (en) | 2018-02-22 | 2023-01-17 | Corning Incorporated | Alkali-free borosilicate glasses with low post-HF etch roughness |
CN109592892A (zh) * | 2018-11-26 | 2019-04-09 | 武汉华工激光工程有限责任公司 | 一种玻璃的激光加工方法 |
WO2020123226A1 (en) * | 2018-12-13 | 2020-06-18 | Corning Incorporated | Glass sheets with improved edge strength and methods of producing the same |
EP3914418B1 (de) * | 2019-02-25 | 2022-02-23 | Wsoptics Technologies GmbH | Prozess zur strahlbearbeitung eines platten- oder rohrförmigen werkstücks |
US11701739B2 (en) * | 2019-04-12 | 2023-07-18 | Skyworks Solutions, Inc. | Method of optimizing laser cutting of wafers for producing integrated circuit dies |
KR20200121948A (ko) * | 2019-04-16 | 2020-10-27 | 삼성디스플레이 주식회사 | 표시장치 및 이의 제조 방법 |
FR3099152B1 (fr) * | 2019-07-26 | 2021-07-23 | Saint Gobain | Procédé et système de génération d’un plan de découpe d’un produit verrier complexe |
TW202302477A (zh) * | 2021-02-26 | 2023-01-16 | 美商康寧公司 | 使用脈衝雷射光束焦線來雷射處理透明材料的方法 |
CN115521055A (zh) * | 2022-10-25 | 2022-12-27 | 深圳市益铂晶科技有限公司 | 一种玻璃激光切割的结冰裂片方法 |
Citations (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH04224091A (ja) * | 1990-03-21 | 1992-08-13 | Philips Gloeilampenfab:Nv | 脆い板を分断する方法及び装置 |
JP2004223796A (ja) * | 2003-01-21 | 2004-08-12 | Kyoto Seisakusho Co Ltd | 脆性材料の割断加工方法 |
JP2005088078A (ja) * | 2003-09-17 | 2005-04-07 | Lemi Ltd | 走査型レーザ装置 |
JP2005324997A (ja) * | 2004-05-17 | 2005-11-24 | Nippon Sheet Glass Co Ltd | マーキング付き強化ガラス板およびその製造方法 |
JP2008247038A (ja) * | 2008-05-24 | 2008-10-16 | Lemi Ltd | 脆性材料のフルカット割断方法 |
JP2009066613A (ja) * | 2007-09-11 | 2009-04-02 | Mitsuboshi Diamond Industrial Co Ltd | 脆性材料基板の分断装置および分断方法 |
Family Cites Families (155)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US1000000A (en) * | 1910-04-25 | 1911-08-08 | Francis H Holton | Vehicle-tire. |
NL103324C (ja) * | 1956-10-12 | |||
DE1244346B (de) * | 1964-10-19 | 1967-07-13 | Menzel Gerhard Glasbearbeitung | Verfahren zum Schneiden von Glas |
US3629545A (en) * | 1967-12-19 | 1971-12-21 | Western Electric Co | Laser substrate parting |
NL6801184A (ja) | 1968-01-26 | 1969-07-29 | ||
GB1246481A (en) * | 1968-03-29 | 1971-09-15 | Pilkington Brothers Ltd | Improvements in or relating to the cutting of glass |
US3629546A (en) * | 1969-04-02 | 1971-12-21 | American Can Co | Air-cooled laser processing of materials |
US3751238A (en) * | 1970-02-25 | 1973-08-07 | Corning Glass Works | Method of chemically strengthening a silicate article containing soda |
AT342232B (de) | 1972-10-12 | 1978-03-28 | Glaverbel | Verfahren und vorrichtung zum trennen eines korpers aus einem glasartigen oder vitrokristallinen material |
DE3110235A1 (de) * | 1981-03-17 | 1982-10-21 | Trumpf GmbH & Co, 7257 Ditzingen | "verfahren und vorrichtung zum brennschneiden mittels eines laserstrahls" |
US4467168A (en) * | 1981-04-01 | 1984-08-21 | Creative Glassworks International | Method of cutting glass with a laser and an article made therewith |
US4468534A (en) * | 1982-09-30 | 1984-08-28 | Boddicker Franc W | Method and device for cutting glass |
US4702042A (en) * | 1984-09-27 | 1987-10-27 | Libbey-Owens-Ford Co. | Cutting strengthened glass |
US4639572A (en) * | 1985-11-25 | 1987-01-27 | Ibm Corporation | Laser cutting of composite materials |
EP0397236B1 (en) * | 1989-05-08 | 1994-10-05 | Koninklijke Philips Electronics N.V. | Method of severing a plate of brittle material |
RU2024441C1 (ru) * | 1992-04-02 | 1994-12-15 | Владимир Степанович Кондратенко | Способ резки неметаллических материалов |
JP2524477B2 (ja) * | 1993-12-20 | 1996-08-14 | インターナショナル・ビジネス・マシーンズ・コーポレイション | 液晶パネル形成用基板及びその製造方法 |
US5776220A (en) * | 1994-09-19 | 1998-07-07 | Corning Incorporated | Method and apparatus for breaking brittle materials |
EP0847317B1 (en) * | 1995-08-31 | 2003-08-27 | Corning Incorporated | Method and apparatus for breaking brittle materials |
JP3271691B2 (ja) | 1996-02-29 | 2002-04-02 | セイコーインスツルメンツ株式会社 | 表示装置の製造方法 |
JPH10128567A (ja) * | 1996-10-30 | 1998-05-19 | Nec Kansai Ltd | レーザ割断方法 |
MY120533A (en) * | 1997-04-14 | 2005-11-30 | Schott Ag | Method and apparatus for cutting through a flat workpiece made of brittle material, especially glass. |
US5961852A (en) * | 1997-09-09 | 1999-10-05 | Optical Coating Laboratory, Inc. | Laser scribe and break process |
US6407360B1 (en) * | 1998-08-26 | 2002-06-18 | Samsung Electronics, Co., Ltd. | Laser cutting apparatus and method |
JP3178524B2 (ja) | 1998-11-26 | 2001-06-18 | 住友重機械工業株式会社 | レーザマーキング方法と装置及びマーキングされた部材 |
US6211488B1 (en) * | 1998-12-01 | 2001-04-03 | Accudyne Display And Semiconductor Systems, Inc. | Method and apparatus for separating non-metallic substrates utilizing a laser initiated scribe |
US6420678B1 (en) * | 1998-12-01 | 2002-07-16 | Brian L. Hoekstra | Method for separating non-metallic substrates |
US6259058B1 (en) * | 1998-12-01 | 2001-07-10 | Accudyne Display And Semiconductor Systems, Inc. | Apparatus for separating non-metallic substrates |
US6252197B1 (en) * | 1998-12-01 | 2001-06-26 | Accudyne Display And Semiconductor Systems, Inc. | Method and apparatus for separating non-metallic substrates utilizing a supplemental mechanical force applicator |
JP2000219528A (ja) * | 1999-01-18 | 2000-08-08 | Samsung Sdi Co Ltd | ガラス基板の切断方法及びその装置 |
US6327875B1 (en) * | 1999-03-09 | 2001-12-11 | Corning Incorporated | Control of median crack depth in laser scoring |
KR100626983B1 (ko) * | 1999-06-18 | 2006-09-22 | 미쓰보시 다이야몬도 고교 가부시키가이샤 | 레이저를 이용한 스크라이브 방법 |
US6684885B2 (en) * | 1999-06-18 | 2004-02-03 | Paul M. Graczyk | Laser surgery eye shield |
JP4172112B2 (ja) | 1999-09-03 | 2008-10-29 | 旭硝子株式会社 | ガラスリボンの割断方法 |
DE19952331C1 (de) * | 1999-10-29 | 2001-08-30 | Schott Spezialglas Gmbh | Verfahren und Vorrichtung zum schnellen Schneiden eines Werkstücks aus sprödbrüchigem Werkstoff mittels Laserstrahlen |
DE19955824A1 (de) * | 1999-11-20 | 2001-06-13 | Schott Spezialglas Gmbh | Verfahren und Vorrichtung zum Schneiden eines Werkstückes aus sprödbrüchigem Werkstoff |
EP1232038B1 (en) * | 1999-11-24 | 2008-04-23 | Applied Photonics, Inc. | Method and apparatus for separating non-metallic materials |
DE19963939B4 (de) * | 1999-12-31 | 2004-11-04 | Schott Spezialglas Gmbh | Verfahren und Vorrichtung zum Durchtrennen von flachen Werkstücken aus sprödbrüchigem Material |
DE10016628A1 (de) * | 2000-04-04 | 2001-10-18 | Schott Glas | Verfahren zum Herstellen von kleinen Dünnglasscheiben und größere Dünnglasscheibe als Halbfabrikat für dieses Herstellen |
WO2001085387A1 (en) * | 2000-05-11 | 2001-11-15 | Ptg Precision Technology Center Limited Llc | System for cutting brittle materials |
DE10041519C1 (de) * | 2000-08-24 | 2001-11-22 | Schott Spezialglas Gmbh | Verfahren und Vorrichtung zum Durchschneiden einer Flachglasplatte in mehrere Rechteckplatten |
JP4659300B2 (ja) * | 2000-09-13 | 2011-03-30 | 浜松ホトニクス株式会社 | レーザ加工方法及び半導体チップの製造方法 |
US6676878B2 (en) | 2001-01-31 | 2004-01-13 | Electro Scientific Industries, Inc. | Laser segmented cutting |
DE10196861D2 (de) | 2000-12-15 | 2003-10-30 | Lzh Laserzentrum Hannover Ev | Verfahren zum Durchtrennen von Bauteilen aus Glas, Keramik, Glaskeramik oder dergleichen durch Erzeugung eines thermischen Spannungsrisses an dem Bauteil entlang einer Trennzone |
FR2819505B1 (fr) * | 2001-01-12 | 2003-02-28 | Saint Gobain | Procede de decoupe des bords d'un ruban continu de verre, dispositif de mise en oeuvre, plateau de verre decoupe selon ce procede |
TW592867B (en) | 2001-06-11 | 2004-06-21 | Mitsuboshi Diamond Ind Co Ltd | An apparatus and a method for scribing brittle substrates |
KR100551526B1 (ko) | 2001-07-18 | 2006-02-13 | 미쓰보시 다이야몬도 고교 가부시키가이샤 | 취성재료 기판의 스크라이브 장치 및 스크라이브 방법 |
RU2206525C2 (ru) * | 2001-07-25 | 2003-06-20 | Кондратенко Владимир Степанович | Способ резки хрупких неметаллических материалов |
US6559411B2 (en) * | 2001-08-10 | 2003-05-06 | First Solar, Llc | Method and apparatus for laser scribing glass sheet substrate coatings |
TW568809B (en) * | 2001-09-21 | 2004-01-01 | Mitsuboshi Diamond Ind Co Ltd | Method for scribing substrate of brittle material and scriber |
KR100786179B1 (ko) * | 2002-02-02 | 2007-12-18 | 삼성전자주식회사 | 비금속 기판 절단 방법 및 장치 |
JP4267240B2 (ja) * | 2002-02-22 | 2009-05-27 | 日本板硝子株式会社 | ガラス構造物の製造方法 |
KR100749972B1 (ko) | 2002-03-12 | 2007-08-16 | 하마마츠 포토닉스 가부시키가이샤 | 가공 대상물 절단 방법 |
US7304265B2 (en) * | 2002-03-12 | 2007-12-04 | Mitsuboshi Diamond Industrial Co., Ltd. | Method and system for machining fragile material |
US6744009B1 (en) * | 2002-04-02 | 2004-06-01 | Seagate Technology Llc | Combined laser-scribing and laser-breaking for shaping of brittle substrates |
US6787732B1 (en) * | 2002-04-02 | 2004-09-07 | Seagate Technology Llc | Method for laser-scribing brittle substrates and apparatus therefor |
FR2839508B1 (fr) * | 2002-05-07 | 2005-03-04 | Saint Gobain | Vitrage decoupe sans rompage |
KR20050016393A (ko) * | 2002-05-07 | 2005-02-21 | 쌩-고벵 글래스 프랑스 | 파단을 일으키지 않는 유리 절단 방법 |
JP4408607B2 (ja) | 2002-06-11 | 2010-02-03 | 三星ダイヤモンド工業株式会社 | スクライブ方法及びスクライブ装置 |
JP4032857B2 (ja) * | 2002-07-24 | 2008-01-16 | ソニー株式会社 | タッチパネル用のガラス基板、タッチパネル及び携帯端末 |
TWI277612B (en) | 2002-08-09 | 2007-04-01 | Mitsuboshi Diamond Ind Co Ltd | Method and device for scribing fragile material substrate |
JP2004083378A (ja) | 2002-08-29 | 2004-03-18 | Central Glass Co Ltd | 化学強化ガラス |
EP1396556A1 (en) * | 2002-09-06 | 2004-03-10 | ALSTOM (Switzerland) Ltd | Method for controlling the microstructure of a laser metal formed hard layer |
JP4373922B2 (ja) * | 2002-11-06 | 2009-11-25 | 三星ダイヤモンド工業株式会社 | スクライブライン形成装置及びスクライブライン形成方法 |
JP2004168584A (ja) * | 2002-11-19 | 2004-06-17 | Thk Co Ltd | ガラス基板材の切断方法 |
KR100497820B1 (ko) * | 2003-01-06 | 2005-07-01 | 로체 시스템즈(주) | 유리판절단장치 |
KR20050091069A (ko) * | 2003-01-10 | 2005-09-14 | 미쓰보시 다이야몬도 고교 가부시키가이샤 | 취성 재료 기판의 스크라이브 장치 및 스크라이브 방법그리고 자동 분단 라인 |
JP2004217492A (ja) * | 2003-01-17 | 2004-08-05 | Murakami Corp | ガラス板材の切抜方法 |
EP1600270A4 (en) * | 2003-01-29 | 2006-09-20 | Mitsuboshi Diamond Ind Co Ltd | DEVICE AND METHOD FOR SUBSTRATE SEPARATION |
JP4515034B2 (ja) * | 2003-02-28 | 2010-07-28 | 株式会社半導体エネルギー研究所 | 半導体装置の作製方法 |
WO2004083133A2 (en) * | 2003-03-21 | 2004-09-30 | Rorze Systems Corporation | Apparatus for cutting glass plate |
JP2004343008A (ja) * | 2003-05-19 | 2004-12-02 | Disco Abrasive Syst Ltd | レーザ光線を利用した被加工物分割方法 |
JP4535692B2 (ja) | 2003-05-28 | 2010-09-01 | セントラル硝子株式会社 | 化学強化ガラス |
JP4615231B2 (ja) | 2004-02-02 | 2011-01-19 | 三星ダイヤモンド工業株式会社 | スクライブ装置およびこの装置を用いたスクライブ方法 |
JP2005268752A (ja) * | 2004-02-19 | 2005-09-29 | Canon Inc | レーザ割断方法、被割断部材および半導体素子チップ |
DE102004014277A1 (de) * | 2004-03-22 | 2005-10-20 | Fraunhofer Ges Forschung | Verfahren zum laserthermischen Trennen von Flachgläsern |
DE102004020737A1 (de) * | 2004-04-27 | 2005-11-24 | Lzh Laserzentrum Hannover E.V. | Vorrichtung zum Durchtrennen von Bauteilen aus sprödbrüchigen Materialien mit spannungsfreier Bauteillagerung |
DE102004024475A1 (de) * | 2004-05-14 | 2005-12-01 | Lzh Laserzentrum Hannover E.V. | Verfahren und Vorrichtung zum Trennen von Halbleitermaterialien |
US20060021977A1 (en) * | 2004-07-30 | 2006-02-02 | Menegus Harry E | Process and apparatus for scoring a brittle material incorporating moving optical assembly |
US7820941B2 (en) | 2004-07-30 | 2010-10-26 | Corning Incorporated | Process and apparatus for scoring a brittle material |
WO2006011608A1 (ja) * | 2004-07-30 | 2006-02-02 | Mitsuboshi Diamond Industrial Co., Ltd. | 基板の垂直クラック形成方法および垂直クラック形成装置 |
US7575999B2 (en) * | 2004-09-01 | 2009-08-18 | Micron Technology, Inc. | Method for creating conductive elements for semiconductor device structures using laser ablation processes and methods of fabricating semiconductor device assemblies |
JP3887394B2 (ja) * | 2004-10-08 | 2007-02-28 | 芝浦メカトロニクス株式会社 | 脆性材料の割断加工システム及びその方法 |
KR20120096586A (ko) * | 2004-10-20 | 2012-08-30 | 가부시키가이샤 한도오따이 에네루기 켄큐쇼 | 반도체장치 제조방법 |
WO2006046525A1 (ja) * | 2004-10-25 | 2006-05-04 | Mitsuboshi Diamond Industrial Co., Ltd. | クラック形成方法およびクラック形成装置 |
JP4917257B2 (ja) | 2004-11-12 | 2012-04-18 | 浜松ホトニクス株式会社 | レーザ加工方法 |
JP2006159747A (ja) | 2004-12-09 | 2006-06-22 | Japan Steel Works Ltd:The | レーザ加工方法及びその装置 |
US20080305615A1 (en) * | 2004-12-28 | 2008-12-11 | Mitsuboshi Diamond Industrial Co., Ltd. | Method of Scribing and Breaking Substrate Made of a Brittle Material and System for Scribing and Breaking Substrate |
US7528342B2 (en) * | 2005-02-03 | 2009-05-05 | Laserfacturing, Inc. | Method and apparatus for via drilling and selective material removal using an ultrafast pulse laser |
JP2006294099A (ja) | 2005-04-07 | 2006-10-26 | Asahi Glass Co Ltd | 磁気記録媒体用ガラス基板の周面研磨装置及び製造方法 |
DE102005024497B4 (de) * | 2005-05-27 | 2008-06-19 | Schott Ag | Verfahren zum mechanischen Brechen von geritzten flachen Werkstücken aus sprödbrüchigem Material |
DE102006042280A1 (de) * | 2005-09-08 | 2007-06-06 | IMRA America, Inc., Ann Arbor | Bearbeitung von transparentem Material mit einem Ultrakurzpuls-Laser |
KR101081613B1 (ko) * | 2005-09-13 | 2011-11-09 | 가부시키가이샤 레미 | 취성재료의 할단방법 및 장치 |
DE102006018622B3 (de) * | 2005-12-29 | 2007-08-09 | H2B Photonics Gmbh | Vorrichtung zum durchtrennenden Bearbeiten von Bauteilen aus sprödbrüchigem Material |
JPWO2007094348A1 (ja) | 2006-02-15 | 2009-07-09 | 東レエンジニアリング株式会社 | レーザスクライブ方法、レーザスクライブ装置、及びこの方法または装置を用いて割断した割断基板 |
JP2008007360A (ja) | 2006-06-28 | 2008-01-17 | Optrex Corp | マザーガラス基板及びガラス基板ならびにそのガラス基板の製造方法 |
JP2008007384A (ja) | 2006-06-30 | 2008-01-17 | Optrex Corp | ガラス基板の製造方法 |
US7897487B2 (en) * | 2006-07-03 | 2011-03-01 | Hamamatsu Photonics K.K. | Laser processing method and chip |
DE102006033217A1 (de) | 2006-07-14 | 2008-01-17 | Jenoptik Automatisierungstechnik Gmbh | Verfahren zur Erzeugung optisch wahrnehmbarer laserinduzierter Risse in sprödes Material |
TWI350824B (en) | 2006-08-30 | 2011-10-21 | Nat Applied Res Laboratories | A pre-fixed position thermal fracturing method of brittle material and device for the same |
JP4954653B2 (ja) | 2006-09-19 | 2012-06-20 | 浜松ホトニクス株式会社 | レーザ加工方法 |
JP5132911B2 (ja) * | 2006-10-03 | 2013-01-30 | 浜松ホトニクス株式会社 | レーザ加工方法 |
JP2008115067A (ja) | 2006-11-07 | 2008-05-22 | Lemi Ltd | フラットパネルディスプレィ薄板の割断方法 |
US20080110952A1 (en) * | 2006-11-15 | 2008-05-15 | Marvin William Kemmerer | Sheet separation through fluid impact |
TWI394731B (zh) | 2007-03-02 | 2013-05-01 | Nippon Electric Glass Co | 強化板玻璃及其製造方法 |
US7977602B2 (en) | 2007-03-21 | 2011-07-12 | Photon Dynamics, Inc. | Laser ablation using multiple wavelengths |
JP2008229711A (ja) | 2007-03-23 | 2008-10-02 | Toray Eng Co Ltd | レーザスクライブ方法およびその装置 |
US7982162B2 (en) * | 2007-05-15 | 2011-07-19 | Corning Incorporated | Method and apparatus for scoring and separating a brittle material with a single beam of radiation |
US8062732B2 (en) * | 2007-05-22 | 2011-11-22 | Corning Incorporated | Glass article having improved edge |
WO2008146522A1 (ja) | 2007-05-30 | 2008-12-04 | Toyo Kohan Co., Ltd. | 磁気ディスク用ガラス基板の表面仕上げ方法及び磁気ディスク用ガラス基板 |
JP4730345B2 (ja) | 2007-06-18 | 2011-07-20 | ソニー株式会社 | ガラス基板対を有する表示装置及びその切断方法 |
JP4886620B2 (ja) | 2007-07-04 | 2012-02-29 | 株式会社東芝 | レーザ割断装置及び基板の製造方法 |
JP4402708B2 (ja) | 2007-08-03 | 2010-01-20 | 浜松ホトニクス株式会社 | レーザ加工方法、レーザ加工装置及びその製造方法 |
US20090040640A1 (en) * | 2007-08-07 | 2009-02-12 | Jinnam Kim | Glass cutting method, glass for flat panel display thereof and flat panel display device using it |
JP5113462B2 (ja) | 2007-09-12 | 2013-01-09 | 三星ダイヤモンド工業株式会社 | 脆性材料基板の面取り方法 |
JP2009090598A (ja) | 2007-10-11 | 2009-04-30 | Mitsuboshi Diamond Industrial Co Ltd | 脆性材料基板の曲線状クラック形成方法および脆性材料基板 |
US8011207B2 (en) * | 2007-11-20 | 2011-09-06 | Corning Incorporated | Laser scoring of glass sheets at high speeds and with low residual stress |
KR100949152B1 (ko) | 2007-11-23 | 2010-03-25 | 삼성코닝정밀유리 주식회사 | 유리 기판 레이저 절단 장치 |
CN101468875A (zh) * | 2007-12-24 | 2009-07-01 | 鸿富锦精密工业(深圳)有限公司 | 脆性非金属基材及其切割方法 |
CN101497493B (zh) | 2008-02-01 | 2012-12-26 | 鸿富锦精密工业(深圳)有限公司 | 激光切割装置 |
GB2457720A (en) | 2008-02-23 | 2009-08-26 | Philip Thomas Rumsby | Method for laser processing on the opposite sides of thin transparent substrates |
US8232218B2 (en) * | 2008-02-29 | 2012-07-31 | Corning Incorporated | Ion exchanged, fast cooled glasses |
CN101977860B (zh) | 2008-03-19 | 2013-08-21 | Hoya株式会社 | 磁记录介质基板用玻璃、磁记录介质基板、磁记录介质和它们的制造方法 |
JP5345334B2 (ja) * | 2008-04-08 | 2013-11-20 | 株式会社レミ | 脆性材料の熱応力割断方法 |
US8173038B2 (en) | 2008-04-18 | 2012-05-08 | Corning Incorporated | Methods and systems for forming microstructures in glass substrates |
JP2009280452A (ja) | 2008-05-23 | 2009-12-03 | Central Glass Co Ltd | ガラス基板及び製造方法 |
US8053704B2 (en) * | 2008-05-27 | 2011-11-08 | Corning Incorporated | Scoring of non-flat materials |
US8258427B2 (en) * | 2008-05-30 | 2012-09-04 | Corning Incorporated | Laser cutting of glass along a predetermined line |
US8051679B2 (en) * | 2008-09-29 | 2011-11-08 | Corning Incorporated | Laser separation of glass sheets |
DE102008052006B4 (de) | 2008-10-10 | 2018-12-20 | 3D-Micromac Ag | Verfahren und Vorrichtung zur Herstellung von Proben für die Transmissionselektronenmikroskopie |
CN102264659B (zh) | 2008-12-25 | 2014-03-12 | 旭硝子株式会社 | 脆性材料基板的割断方法、装置及车辆用窗玻璃 |
JP2010150068A (ja) | 2008-12-25 | 2010-07-08 | Mitsuboshi Diamond Industrial Co Ltd | 脆性材料基板の割断方法 |
US8347651B2 (en) | 2009-02-19 | 2013-01-08 | Corning Incorporated | Method of separating strengthened glass |
US8327666B2 (en) | 2009-02-19 | 2012-12-11 | Corning Incorporated | Method of separating strengthened glass |
US8245540B2 (en) | 2009-02-24 | 2012-08-21 | Corning Incorporated | Method for scoring a sheet of brittle material |
TWI490176B (zh) | 2009-03-20 | 2015-07-01 | Corning Inc | 分離玻璃板材的製程與設備 |
US8590873B2 (en) | 2009-04-08 | 2013-11-26 | Corning Incorporated | Method and device for restraining movement of continuously traveling glass sheet |
US20100279067A1 (en) | 2009-04-30 | 2010-11-04 | Robert Sabia | Glass sheet having enhanced edge strength |
US8132427B2 (en) | 2009-05-15 | 2012-03-13 | Corning Incorporated | Preventing gas from occupying a spray nozzle used in a process of scoring a hot glass sheet |
US8269138B2 (en) | 2009-05-21 | 2012-09-18 | Corning Incorporated | Method for separating a sheet of brittle material |
KR101549721B1 (ko) | 2009-05-27 | 2015-09-02 | 코닝 인코포레이티드 | 고온에서의 유리의 레이저 스코어링 |
US8543888B2 (en) | 2009-06-09 | 2013-09-24 | Microchip Technology Incorporated | Programmable cyclic redundancy check CRC unit |
WO2011002089A1 (ja) | 2009-07-03 | 2011-01-06 | 旭硝子株式会社 | 脆性材料基板の割断方法及び割断装置並びにその割断方法により得られる車両用窓ガラス |
US8932510B2 (en) | 2009-08-28 | 2015-01-13 | Corning Incorporated | Methods for laser cutting glass substrates |
EP2480507A1 (en) | 2009-08-28 | 2012-08-01 | Corning Incorporated | Methods for laser cutting articles from chemically strengthened glass substrates |
US8426767B2 (en) | 2009-08-31 | 2013-04-23 | Corning Incorporated | Methods for laser scribing and breaking thin glass |
JP2011088382A (ja) | 2009-10-23 | 2011-05-06 | Mitsuboshi Diamond Industrial Co Ltd | ブレイク装置およびブレイク方法 |
US8171753B2 (en) | 2009-11-18 | 2012-05-08 | Corning Incorporated | Method for cutting a brittle material |
US8946590B2 (en) | 2009-11-30 | 2015-02-03 | Corning Incorporated | Methods for laser scribing and separating glass substrates |
US20110127242A1 (en) | 2009-11-30 | 2011-06-02 | Xinghua Li | Methods for laser scribing and separating glass substrates |
US8720228B2 (en) | 2010-08-31 | 2014-05-13 | Corning Incorporated | Methods of separating strengthened glass substrates |
US20120175652A1 (en) | 2011-01-06 | 2012-07-12 | Electro Scientific Industries, Inc. | Method and apparatus for improved singulation of light emitting devices |
US8677783B2 (en) | 2011-11-28 | 2014-03-25 | Corning Incorporated | Method for low energy separation of a glass ribbon |
CN104136967B (zh) | 2012-02-28 | 2018-02-16 | 伊雷克托科学工业股份有限公司 | 用于分离增强玻璃的方法及装置及由该增强玻璃生产的物品 |
US9938180B2 (en) | 2012-06-05 | 2018-04-10 | Corning Incorporated | Methods of cutting glass using a laser |
-
2010
- 2010-06-28 US US12/824,609 patent/US8932510B2/en not_active Expired - Fee Related
- 2010-08-26 TW TW099128551A patent/TWI490179B/zh active
- 2010-08-27 CN CN201080045044.6A patent/CN102574246B/zh not_active Expired - Fee Related
- 2010-08-27 EP EP10752228.6A patent/EP2470326B1/en not_active Not-in-force
- 2010-08-27 WO PCT/US2010/046885 patent/WO2011025903A1/en active Application Filing
- 2010-08-27 KR KR1020127007862A patent/KR101718569B1/ko active IP Right Grant
- 2010-08-27 JP JP2012527001A patent/JP5702785B2/ja not_active Expired - Fee Related
-
2014
- 2014-12-11 US US14/567,083 patent/US9533910B2/en active Active
Patent Citations (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH04224091A (ja) * | 1990-03-21 | 1992-08-13 | Philips Gloeilampenfab:Nv | 脆い板を分断する方法及び装置 |
JP2004223796A (ja) * | 2003-01-21 | 2004-08-12 | Kyoto Seisakusho Co Ltd | 脆性材料の割断加工方法 |
JP2005088078A (ja) * | 2003-09-17 | 2005-04-07 | Lemi Ltd | 走査型レーザ装置 |
JP2005324997A (ja) * | 2004-05-17 | 2005-11-24 | Nippon Sheet Glass Co Ltd | マーキング付き強化ガラス板およびその製造方法 |
JP2009066613A (ja) * | 2007-09-11 | 2009-04-02 | Mitsuboshi Diamond Industrial Co Ltd | 脆性材料基板の分断装置および分断方法 |
JP2008247038A (ja) * | 2008-05-24 | 2008-10-16 | Lemi Ltd | 脆性材料のフルカット割断方法 |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2018172276A (ja) * | 2012-11-21 | 2018-11-08 | コーニング インコーポレイテッド | 積層強化ガラス基板の切断方法 |
Also Published As
Publication number | Publication date |
---|---|
TWI490179B (zh) | 2015-07-01 |
US20150096329A1 (en) | 2015-04-09 |
JP5702785B2 (ja) | 2015-04-15 |
KR20120064091A (ko) | 2012-06-18 |
EP2470326A1 (en) | 2012-07-04 |
US8932510B2 (en) | 2015-01-13 |
CN102574246A (zh) | 2012-07-11 |
CN102574246B (zh) | 2015-04-01 |
US20110049765A1 (en) | 2011-03-03 |
TW201129514A (en) | 2011-09-01 |
US9533910B2 (en) | 2017-01-03 |
WO2011025903A1 (en) | 2011-03-03 |
KR101718569B1 (ko) | 2017-03-21 |
EP2470326B1 (en) | 2016-12-28 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
JP5702785B2 (ja) | ガラス基板のレーザ切断方法 | |
JP6018503B2 (ja) | 脆性材料シートの分割方法 | |
US8584490B2 (en) | Laser cutting method | |
KR101804585B1 (ko) | 박막 유리의 레이저 스크라이빙 및 절단 방법 | |
US8720228B2 (en) | Methods of separating strengthened glass substrates | |
JP5795000B2 (ja) | ガラス基板のレーザスクライブおよび分離方法 | |
US10358374B2 (en) | Methods for laser scribing and separating glass substrates | |
TWI243081B (en) | Method for cutting a non-metal substrate | |
JP6397821B2 (ja) | ワークピースの分離のための方法及び装置 | |
US9302346B2 (en) | Precision laser scoring | |
US20130221053A1 (en) | Method and apparatus for separation of strengthened glass and articles produced thereby | |
US20110127242A1 (en) | Methods for laser scribing and separating glass substrates | |
JP2010501456A (ja) | ガラス板の残留応力低減熱エッジ仕上用プロセス及び装置 | |
CN107001106A (zh) | 玻璃板材的分离方法 | |
WO2020032124A1 (ja) | ガラス板の製造方法 | |
TWI765990B (zh) | 分離玻璃纖維網的方法及設備 | |
US20220135463A1 (en) | Methods and apparatus for free-form cutting of flexible thin glass |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
A621 | Written request for application examination |
Free format text: JAPANESE INTERMEDIATE CODE: A621 Effective date: 20130827 |
|
A977 | Report on retrieval |
Free format text: JAPANESE INTERMEDIATE CODE: A971007 Effective date: 20140328 |
|
A131 | Notification of reasons for refusal |
Free format text: JAPANESE INTERMEDIATE CODE: A131 Effective date: 20140401 |
|
A521 | Request for written amendment filed |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20140701 |
|
TRDD | Decision of grant or rejection written | ||
A01 | Written decision to grant a patent or to grant a registration (utility model) |
Free format text: JAPANESE INTERMEDIATE CODE: A01 Effective date: 20150127 |
|
A61 | First payment of annual fees (during grant procedure) |
Free format text: JAPANESE INTERMEDIATE CODE: A61 Effective date: 20150220 |
|
R150 | Certificate of patent or registration of utility model |
Ref document number: 5702785 Country of ref document: JP Free format text: JAPANESE INTERMEDIATE CODE: R150 |
|
R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
LAPS | Cancellation because of no payment of annual fees |