JP2013250183A - Temperature measurement system and temperature measurement method - Google Patents

Abstract

PROBLEM TO BE SOLVED: To measure a temperature range that an object to be measured possibly has by one scanning type radiation thermometer.SOLUTION: A temperature measurement system 8a is constituted by connecting a host computer 9a and a scanning type radiation thermometer 1a. After last-time temperature measurement processing and before next-time temperature measurement processing, a measurement range determination processing part 91a of the host computer 9a determines a measurement range of the scanning type radiation thermometer 1a in the next-time temperature processing as a next-time applied measurement range according to a type of an object (steel material) to be measured in the next temperature measurement processing, and notifies the scanning type radiation thermometer 1a of the determined next-time applied measurement range. A thermometer measurement part 3a of the scanning type radiation thermometer 1a performs the next-time temperature measurement processing based upon the measurement range of the scanning type radiation thermometer 1a as the next-time applied measurement range, and measures the temperature of the object to be measured.

Description

  The present invention relates to a temperature measurement system and a temperature measurement method for measuring the temperature of a measurement object using a scanning radiation thermometer.

  Conventionally, a scanning radiation thermometer that measures a temperature profile of an object to be measured in a non-contact manner is known. This scanning radiation thermometer converts thermal radiation energy within the field of view (hereinafter also referred to as “infrared light” as appropriate) into temperature, and measures temperature while scanning in a predetermined scanning direction. The temperature profile of the measurement object is acquired.

  By the way, the temperature range (measurement range) that can be measured by a radiation thermometer such as this scanning radiation thermometer is limited to a certain range according to the required temperature resolution. For this reason, when the temperature range (hereinafter referred to as “target temperature range”) that can be taken by the target object as the measurement target is wider than the measurement range, one scanning radiation thermometer covers the entire target temperature range. There was a problem that it could not be measured.

  As a technology to solve this type of problem, measurement can be performed from low to high temperatures by selecting and switching the variable means that changes the detector output to a level corresponding to the temperature measurement range (measurement range). Is known (see Patent Document 1).

Japanese Patent Publication No. 6-65973

  However, in Patent Document 1, since the individual temperature measurement ranges (measurement ranges) to be switched and selected are fixed, if the entire temperature range to be measured is not included in any measurement range, an appropriate temperature is set. There was a problem that measurement could not be performed and the temperature range of the measurement object could not be flexibly handled.

  Moreover, in patent document 1, it is determined based on the output signal from a detector in which temperature range (measurement range) the temperature of the measurement object is switched and selected, and the determined temperature measurement range The switch is switched according to. For this reason, every time the temperature is measured, the measurement range must be determined from the output signal and the switch must be switched and selected. During this time, the temperature measurement is interrupted due to a waiting time. Therefore, when the temperature is measured by the scanning radiation thermometer that measures the temperature while scanning in the scanning direction as described above, in the usage mode in which the measured temperature is monitored in real time, the real-time property may be impaired. .

  The present invention has been made in view of the above, and provides a temperature measurement system and a temperature measurement method capable of measuring a temperature range that can be taken by an object to be measured by a single scanning radiation thermometer. The purpose is to provide.

  In order to solve the above-described problems and achieve the object, a temperature measurement system according to the present invention is a temperature measurement system configured by connecting a measurement range determination device and a scanning radiation thermometer, and the scanning type A radiation thermometer measures the temperature profile of the measurement object in a non-contact manner by intermittently performing a temperature measurement process according to the processing plan information that determines the type and processing order of the object, and performing the temperature measurement process intermittently. The measurement range determination device is based on the type of the object to be measured in the next temperature measurement process after the previous temperature measurement process and before the next temperature measurement process. And determining the measurement range of the scanning radiation thermometer at the time of the next temperature measurement processing as the next applied measurement range, and notifying the determined next applied measurement range to the scanning radiation thermometer. And the scanning radiation thermometer performs the next temperature measurement process using the measurement range of the scanning radiation thermometer as the next applied measurement range, and measures the temperature of the measurement object. It is characterized by providing.

  The temperature measurement method according to the present invention is a temperature measurement method for measuring the temperature of an object to be measured using a scanning radiation thermometer, wherein the scanning radiation thermometer determines the type of object and the processing order. The object is sequentially measured according to the processing plan information that is determined, and the temperature profile of the object to be measured is measured in a non-contact manner by intermittently performing a temperature measurement process, after the previous temperature measurement process. Before the next temperature measurement process, the measurement range of the scanning radiation thermometer at the next temperature measurement process is set next time based on the type of the object to be measured in the next temperature measurement process. A determination step of determining as an applied measurement range, and a measurement process for measuring the temperature of the measurement object by performing the next temperature measurement process using the measurement range of the scanning radiation thermometer as the next applied measurement range Characterized in that it comprises a and.

  According to the present invention, the measurement range of the scanning radiation thermometer can be determined in advance on the basis of the type of the object to be measured in the next temperature measurement process. The possible temperature range can be measured with a single scanning radiation thermometer.

FIG. 1 is a block diagram illustrating a configuration example of a scanning radiation thermometer. FIG. 2 is a schematic diagram illustrating a configuration example of a thermometer measurement unit. FIG. 3 is a schematic view showing a state in which the scanning radiation thermometer is installed in the continuous annealing line. FIG. 4 is a schematic view of the installation state of FIG. 3 viewed from the light receiving unit side. FIG. 5 is a schematic view of a steel material, which is an object to be measured, viewed from the upper surface side. FIG. 6 is a schematic diagram illustrating a configuration example of the light receiving unit. FIG. 7 is a schematic diagram of a cross section taken along the line AA shown in FIG. FIG. 8 is a schematic diagram illustrating a configuration example of the detection unit. FIG. 9 is a schematic diagram illustrating an example of a pixel group of the solid-state imaging device. FIG. 10 is an explanatory diagram for explaining the temperature profile measurement of the weld. FIG. 11 is a schematic diagram illustrating an example of a temperature profile measurement result. FIG. 12 is a diagram showing the relationship between the thickness of the steel material to be processed by the continuous annealing line and the welding temperature. FIG. 13 is a block diagram illustrating a configuration example of the temperature measurement system according to the first embodiment. FIG. 14 is a timing chart showing the execution timing of the welding process and the temperature measurement process. FIG. 15 is a block diagram illustrating a configuration example of the temperature measurement system according to the second embodiment. FIG. 16 is a flowchart illustrating a processing procedure of the temperature measurement system. FIG. 17 is a diagram for explaining the measurement range division processing. FIG. 18 is a diagram illustrating a data configuration example of a thermometer setting table.

  DESCRIPTION OF EMBODIMENTS Hereinafter, embodiments for implementing a temperature measurement system and a temperature measurement method of the present invention will be described with reference to the drawings. Note that the present invention is not limited to the embodiments. Moreover, in description of drawing, the same code | symbol is attached | subjected and shown to the same part.

  First, the basic configuration of the scanning radiation thermometer used in this embodiment will be described with reference to FIGS. FIG. 1 is a block diagram illustrating a configuration example of the scanning radiation thermometer 1. FIG. 2 is a schematic diagram showing a configuration example of a thermometer measurement unit 2 constituting the scanning radiation thermometer 1.

  A scanning radiation thermometer 1 shown in FIG. 1 captures thermal radiant energy (infrared light) of an object and performs temperature measurement. As main functional units, a thermometer measurement unit 2 and a thermometer processing unit. 3 and a thermometer display unit 4. In addition, the scanning radiation thermometer 1 appropriately includes an input device for inputting operations necessary for temperature measurement, such as a touch panel and a button switch.

  As shown in FIG. 2, the thermometer measurement unit 2 includes a light receiving unit 5 that receives infrared light emitted from a measurement object, a transmission unit 6 that transmits infrared light received by the light receiving unit 5, And a detection unit 7 that detects the intensity of infrared light transmitted by the transmission unit 6.

  The light receiving unit 5 is a cylindrical optical system formed as thin as possible and has a predetermined range of visual field A1 centering on the optical axis of the optical system. The light receiving unit 5 receives infrared light from the measurement object captured in the visual field A1 and condenses the infrared light on the transmission unit 6.

  The transmission unit 6 is for transmitting infrared light from the measurement object. Specifically, the transmission unit 6 accommodates an optical fiber bundle inside a flexible elongated cylindrical body, and the distal end surface of the optical fiber bundle is connected to the inside of the light receiving unit 5, and the optical fiber bundle The rear end face is connected to the detection unit 7. The transmission unit 6 bends freely in accordance with the movement of the light receiving unit 5 or the like, and transmits infrared light from the light receiving unit 5 to the detection unit 7 through an internal optical fiber bundle.

  The detection unit 7 is for detecting the intensity of infrared light from the measurement object, and includes an optical system 71 and a solid-state image sensor 72 as a detection element. The optical system 71 includes a plurality of lenses that can collect or image infrared light. The solid-state image sensor 72 is realized by a linear array type CCD sensor such as a Si semiconductor or an InGaAs compound semiconductor, a CMOS sensor, and the like, and includes a pixel group having sensitivity in an infrared region. In the detection unit 7, the optical system 71 condenses and images the infrared light transmitted by the transmission unit 6 and causes the solid-state image sensor 72 to receive the light. The solid-state imaging device 72 receives infrared light from the pixel group via the optical system 71 and detects the intensity of the received infrared light for each pixel in the pixel group. The solid-state imaging device 72 converts the detected intensity of infrared light, that is, the amount of thermal radiation energy, into a voltage value, and outputs an electric signal having the obtained voltage value for each pixel.

  The thermometer processing unit 3 is constituted by a microcomputer having a built-in memory for holding various data necessary for the operation of the scanning radiation thermometer 1. The memory stores in advance a program for operating the scanning radiation thermometer 1 and realizing a temperature measurement function provided in the scanning radiation thermometer 1, data used during the execution of the program, and the like. Alternatively, it is temporarily stored for each processing. For example, in addition to the conversion table in which the correspondence between the voltage value of the electrical signal output from the solid-state imaging device 72 and the temperature is set, various parameter values necessary for setting the operating environment of the scanning radiation thermometer 1 A temperature profile or the like created during temperature measurement is stored. Then, the thermometer processing unit 3 performs instructions, data transfer, and the like to each unit constituting the scanning radiation thermometer 1 based on programs and data held in the memory, and the operation of the scanning radiation thermometer 1 The temperature measurement process is performed under the overall control.

  The thermometer processing unit 3 includes a temperature conversion processing unit 31 that converts the intensity of infrared light detected by the detection unit 7 into the temperature of the measurement object. The temperature conversion processing unit 31 converts the voltage value of each pixel input from the solid-state image sensor 72 into a temperature. The temperature for each pixel after conversion corresponds to the surface temperature at each temperature measurement point of the measurement object captured in the visual field A1 described later. Thus, each temperature converted by the temperature conversion processing unit 31 for each pixel is displayed as needed on the thermometer display unit 4 as a temperature profile.

  The thermometer display unit 4 is realized by a display device such as an LCD or an EL display, and displays, for example, a temperature profile of a measurement object on the screen under the control of the thermometer processing unit 3.

  Such a scanning radiation thermometer 1 is used by appropriately selecting one that employs a detection element corresponding to the temperature of the object to be measured. That is, the thermal radiation energy captured by the scanning radiation thermometer 1 is stronger as the temperature is higher, and the wavelength band is shifted to the short wavelength side. Accordingly, a detector employing a short wavelength side detection element or optical material is used for high temperature measurement, and a long wavelength side detection element or optical material is used for low temperature measurement.

  Here, the case where the steel material continuously welded by the continuous annealing line is used as an object, and the case where the temperature measurement is performed using this steel material as an object to be measured sequentially, the scanning radiation thermometer 1 in the continuous annealing line is illustrated. The installation and the temperature measurement region of the scanning radiation thermometer 1 will be described in detail. FIG. 3 is a schematic diagram showing a state in which the scanning radiation thermometer 1 is installed in the continuous annealing line. FIG. 4 is a schematic view of the installation state of FIG. 3 viewed from the light receiving unit 5 side. FIG. 5 is a schematic view of a steel material, which is an object to be measured, viewed from the upper surface side. In FIG. 4, illustration of the apparatus main body 11 and the support part 12 of the welding machine 10 is omitted in order to facilitate explanation of a temperature measurement region on the weld part 16 to be described later.

  The continuous annealing line passes through the steel plate by welding the preceding material 14 and the following material 15 of the steel material, which are sequentially conveyed in a predetermined direction by a conveying device (not shown), and then passes through the annealing furnace. To be annealed. FIG. 3 schematically shows the surroundings of the welding machine 10 in the continuous annealing line. The welding machine 10 welds and passes the tail end of the preceding material 14 and the tip of the following material 15. .

  By the way, when the welding of the steel material performed by this welding machine 10 is insufficient, the situation where the welding part 16 fractures | ruptures during the process of a back | latter stage may arise. If the welded portion 16 breaks, the operation must be interrupted, resulting in a decrease in operation efficiency. In order to avoid such breakage of the welded portion 16, the quality of the welding is monitored during operation, and measures such as re-welding are performed when a welding failure is confirmed. There is a method for monitoring the lack of heat by measuring the temperature of the welded portion 16 to determine the welding failure. In this example, the scanning radiation thermometer 1 installed in the continuous annealing line is for this monitoring. The installation of the scanning radiation thermometer 1 in the continuous annealing line is performed by the welding machine 10 with a light receiving unit. Achieved by mounting 5.

  The welding machine 10 includes an apparatus main body 11 incorporating a drive system and the like, a support portion 12, and a pair of electrode wheels 131 and 133. The support part 12 supports the light receiving part 5 in such a manner that the welded part 16 between the preceding material 14 and the following material 15 is captured in the visual field A1. The light receiving unit 5 is attached to the welding machine 10 in such a manner that the light receiving unit 5 is supported by the support unit 12 in this manner, and moves along the welding direction A2 (the width direction of the preceding material 14 and the following material 15) together with the welding machine 10. Infrared light emitted from the welded portion 16 and its peripheral portion is received. Note that the support portion 12 preferably has a structure that can adjust the relative distance and relative angle of the light receiving portion 5 with respect to the welded portion 16.

  As shown in FIGS. 3 and 4, the electrode wheels 131 and 133 apply electric power while pressing the leading material 14 and the trailing material 15 so as to be sandwiched from above and below, and drive the apparatus main body 11 to drive the leading material 14. And it moves so that the following material 15 may be crossed. In this way, the electrode wheels 131 and 133 weld the tail end of the preceding material 14 and the tip of the following material 15 along the welding direction A <b> 2, and pass the leading material 14 and the following material 15.

  Here, as shown in FIG. 5, an orthogonal biaxial coordinate system based on the X axis and the Y axis is defined for the welded portion 16 of the preceding material 14 and the succeeding material 15. The Y axis is an axis parallel to the welding direction A2 and coincides with the welded portion 16. The welding direction A2 substantially coincides with the width direction of the preceding material 14 and the following material 15. The X axis is an axis perpendicular to the welding direction A2, and is an axis parallel to the longitudinal direction of the preceding material 14 and the succeeding material 15 (the conveying direction of the preceding material 14 and the following material 15). Further, the intersection of the X axis and the Y axis, that is, the origin of this orthogonal coordinate system, is the welding start point (starting point of the welded portion 16) of the preceding material 14 and the succeeding material 15 by the welding machine 10.

  In the orthogonal coordinate system of the X axis and the Y axis defined as described above, the field of view A1 of the light receiving unit 5 is a contact point between the welded part 16 and the pair of electrode wheels 131 and 133 (that is, the current time) The temperature measurement region P is set at a position separated from the welded portion 16) by a predetermined distance L1 (for example, about 70 mm). In this case, the position of the temperature measurement region P may be set based on the optical axis C of the light receiving unit 5 or the like.

  The temperature measurement region P is a region defined by the range of the visual field A1 of the light receiving unit 5 and is scattered in the positive and negative directions of the X axis around the intersection of the optical axis C of the light receiving unit 5 and the welded portion 16. It consists of a plurality of temperature measurement points. The plurality of temperature measurement points are arranged in a line along the X-axis direction, and are displaced along the positive direction of the Y-axis as the light receiving unit 5 moves. That is, as shown in FIG. 5, the displacement direction of the temperature measurement region P is the scanning direction when measuring the temperature profile for the entire range of the welded portion 16, and the scanning width thereof is the leading material 14 and the trailing material 15. Width W1 (for example, about 600 to 1100 mm). On the other hand, the longitudinal direction of the temperature measurement region P is a direction in which a plurality of temperature measurement points are connected, and corresponds to the pixel arrangement direction of the solid-state image sensor 72.

  Subsequently, the light receiving unit 5, the transmission unit 6, and the detection unit 7 will be described in detail with reference to FIGS. First, the light receiving unit 5 and the transmission unit 6 will be described. FIG. 6 is a schematic diagram illustrating a configuration example of the light receiving unit 5. FIG. 7 is a schematic diagram of a cross section taken along the line AA shown in FIG. 6, and schematically shows a cross section of the transmission unit 6.

  As shown in FIG. 6, the light receiving section 5 includes a hollow cylindrical casing 51 that is relatively small (for example, about 20 mm in diameter and about 110 mm in length), and a plurality of condensing lenses 53 and 55. The cylindrical housing 51 is made of a heat-resistant material that can withstand even when installed in the vicinity of a high-temperature steel material, and accommodates a plurality of condenser lenses 53 and 55 therein. Further, the front end 61 of the transmission unit 6 is inserted and fixed at the rear end of the cylindrical casing 51. For example, the transmission unit 6 has a cylindrical casing 51 such that a length L2 from the distal end surface of the distal end portion 61 to the distal end surface of the cylindrical casing 51 is a predetermined length (for example, about 94.3 mm). Attached to. The cylindrical housing 51 accommodates a plurality of condensing lenses 53 and 55 in the region of this length L2.

  The condensing lenses 53 and 55 are arranged inside the cylindrical housing 51 so that the optical axis C thereof coincides with the central axis of the transmission unit 6. The visual field A1 of the condensing lenses 53 and 55 has a visual field range of a visual field length L4 at a position of a distance L3 from the distal end surface of the cylindrical housing 51. For example, the visual field A1 has a visual field range of a visual field length L4 of about 47 mm when the distance L3 is about 150 mm. The visual field length L4 corresponds to the length in the X-axis direction of the temperature measurement region P shown in FIG. Such condensing lenses 53 and 55 pass infrared light from the measurement object (the preceding material 14 and the succeeding material 15 in the present embodiment) through an opening formed in the distal end surface of the cylindrical housing 51. Light is collected separately for each temperature measurement point in the temperature measurement region P. In addition, the number of the condensing lenses accommodated is not limited to two, You may arrange | position the number of condensing lenses as needed suitably.

  On the other hand, the transmission unit 6 is an elongated optical member having flexibility. As shown in FIG. 7, an optical fiber bundle 64 in which optical fiber groups 63 of a plurality of optical fibers 62 are bundled, and an optical fiber bundle 64 are combined. And a flexible elongated casing 65 for covering.

  The optical fiber 62 is a small-diameter optical transmission medium capable of propagating infrared light, and the optical fiber bundle 64 is a bundle of many optical fibers 62 necessary for measuring the temperature profile of the welded portion 16. . The optical fiber group 63 includes a predetermined number (12 in FIG. 7) of optical fibers 62 arranged in a predetermined manner (staggered in FIG. 7).

  Here, as shown in FIG. 7, when the transverse biaxial coordinate system of the X axis and the Y axis shown in FIG. 5 is collated with the cross section of the transmission unit 6, the optical fiber group 63 is in the Y axis direction (welding direction). It is a unit group in which a plurality of optical fibers 62 are arranged along A2). The optical fiber bundle 64 is a bundle of a plurality of optical fiber groups 63 along the X-axis direction (the arrangement direction of a plurality of temperature measurement points included in the temperature measurement region P). The arrangement direction of the plurality of optical fiber groups 63 in the optical fiber bundle 64 is preferably perpendicular to the welding direction A2 in order to simplify the condensing lens configuration of the light receiving unit 5.

  Each of the plurality of optical fiber groups 63 included in the optical fiber bundle 64 has a one-to-one correspondence with each of the plurality of temperature measurement points included in the temperature measurement region P of the measurement object. The infrared light condensed by the condenser lenses 53 and 55 of the unit 5 is transmitted for each temperature measurement point in the temperature measurement region P. In other words, the optical fiber group 63 corresponding to one coordinate on the X axis in the optical fiber bundle 64 is radiated from the temperature measurement point at the same coordinate position among the plurality of temperature measurement points in the temperature measurement region P. Transmit infrared light.

  Next, the detection unit 7 will be described. FIG. 8 is a schematic diagram illustrating a configuration example of the detection unit 7. FIG. 9 is a schematic diagram illustrating an example of a pixel group of the solid-state imaging device 72 provided in the detection unit 7.

  As shown in FIG. 8, the optical system 71 constituting the detection unit 7 includes a plurality of lenses 73 to 75 in a hollow cylindrical housing. A rear end portion 66 of the transmission unit 6 is inserted and fixed at the front end of the optical system 71. The lenses 73 to 75 are, for example, aspherical lenses, and are disposed between the rear end portion 66 and the solid-state imaging device 72 in such a manner that the optical axis C of the light receiving unit 5 and the optical axis coincide with each other. Such lenses 73 to 75 receive the infrared light transmitted by the transmission unit 6 from the rear end portion 66, collect the received infrared light for each optical fiber group 63, and connect it to the solid-state imaging device 72. Image. Note that the number of lenses is not limited to three, and the number of lenses may be appropriately arranged as necessary. Although not shown in FIG. 8, the front end 61 of the transmission unit 6 is inserted and fixed to the rear end of the light receiving unit 5 as described above.

  The solid-state image sensor 72 has a pixel group 721 as a light receiving surface, and is arranged in a mode in which infrared light condensed or imaged by the optical system 71 can be received by the pixel group 721. For example, the solid-state imaging device 72 is arranged inside the housing so that the optical axis C of the light receiving unit 5 and the central axis of the pixel group 721 coincide.

  The pixel group 721 has a sensitivity in the infrared region, and includes a plurality of pixels arranged in one-to-one correspondence with each of the plurality of optical fiber groups 63 constituting the transmission unit 6. That is, each pixel of the pixel group 721 is connected to each of the plurality of optical fiber groups 63 via the optical system 71 on a one-to-one basis.

  Here, as shown in FIG. 9, when the pixel group 721 is collated with the orthogonal biaxial coordinate system of the X axis and the Y axis shown in FIG. 5, each pixel in the pixel group 721 corresponds to the Y axis direction. Are formed into a shape (for example, a rectangle) capable of receiving infrared light collectively from a group of optical fibers 62 (that is, optical fiber group 63) arranged in a row. In the pixel group 721, a plurality of such pixels are arranged corresponding to the X-axis direction, that is, the arrangement direction of a plurality of temperature measurement points included in the temperature measurement region P. Each pixel in such a pixel group 721 has a one-to-one correspondence with each of a plurality of temperature measurement points included in the temperature measurement region P of the measurement object. Each transmitted infrared light is received.

  For example, in the pixel group 721, the pixel having the pixel number = 1 collectively receives infrared light transmitted by the optical fiber group 63 in the first column from the top of the optical fiber bundle 64 shown in FIG. . Similarly, the pixel of pixel number = 2 collectively receives infrared light transmitted by the optical fiber group 63 in the second row from the top, and the pixel of pixel number = 3 is the optical fiber in the third row from the top. The infrared light transmitted by the group 63 is received collectively. The pixel with the last pixel number = N (for example, number 256) collectively receives infrared light transmitted by the optical fiber group 63 in the first column from the bottom of the optical fiber bundle 64.

  The solid-state imaging device 72 having such a pixel group 721 receives infrared light for each optical fiber group 63 by each pixel of the pixel group 721, and converts the intensity of the received infrared light into a voltage value for each pixel. . In this way, the solid-state imaging device 72 detects the intensity of infrared light at each temperature measurement point in the temperature measurement region P shown in FIG.

  Note that the pixel size, the number of optical fibers, the optical fiber array, the number of pixels, the pixel array, and the like are examples, and may be set as desired as appropriate. That is, the number of optical fibers 62 connected to each pixel of the solid-state image sensor 72 is not limited to the above-described twelve, and may be appropriately set according to the pixel size of the solid-state image sensor 72 and the like. Further, the arrangement of the optical fibers 62 corresponding to one pixel of the solid-state image sensor 72 is not limited to the staggered arrangement, and may be linearly arranged in one line, a plurality of lines, or a staggered pattern. A plurality of rows may be arranged. Further, the number of pixels of the solid-state imaging device 72 is not limited to 256 pixels, and the number of pixels necessary for measuring the temperature profile of the measurement object may be appropriately selected.

  Subsequently, a temperature profile measured by the scanning radiation thermometer 1 will be described. FIG. 10 is an explanatory view for explaining the temperature profile measurement of the welded portion 16 of the steel material which is the preceding material 14 and the succeeding material 15. FIG. 11 is a schematic diagram illustrating an example of a temperature profile measurement result. In FIG. 11, the horizontal axis is the position in the welding width direction. The weld width direction position represents a displacement distance from the welded portion 16 in the temperature measurement region P, and the weld width direction position = 0 corresponds to the center position of the temperature measurement region P, that is, the position on the welded portion 16. On the other hand, the vertical axis represents the welding temperature, which corresponds to the temperature obtained at each temperature measurement point in the temperature measurement region P (the temperature of the welded portion 16).

  In the temperature measurement here, the light receiving unit 5, the transmission unit 6 and the detection unit 7 of the scanning radiation thermometer 1 were set as follows. That is, in the light receiving unit 5 (see FIG. 6), the cylindrical casing 51 has a diameter of about 20 mm and a cylindrical length of about 110 mm, and the length L2 of the cylindrical casing 51 is 94.3 mm. The distance L1 between the contact points of the electrode wheels 131 and 133 and the temperature measurement region P when the light receiving unit 5 is attached to the support unit 12 of the welding machine 10 is 70 mm. The distance L3 from the front end surface of the light receiving unit 5 to the temperature measurement region P (specifically, the welded portion 16) was set to 150 mm, and the visual field length L4 of the light receiving unit 5 from the visual field A1 was set to 47 mm. As a result, the length in the longitudinal direction of the temperature measurement region P in the X-axis direction is 47 mm with the weld 16 as the center.

  Further, in the transmission unit 6 (see FIG. 4), the number of the optical fibers 62 included in one optical fiber group 63 is twelve, and these twelve optical fibers 62 include the leading material 14, the trailing material 15, and the like. Were arranged in a staggered manner in the welding direction A2. The optical fiber bundle 64 is a bundle of 256 sets of such optical fiber groups 63 (that is, 3072 optical fibers 62). These 256 sets of optical fiber groups 63 were arranged in a direction perpendicular to the welding direction A <b> 2 between the preceding material 14 and the following material 15.

  On the other hand, in the detection unit 7 (see FIG. 8), a 256-pixel InGaAs CCD element is used as the solid-state imaging element 72. Specifically, the pixel group 721 of the solid-state image sensor 72 has a length in the vertical direction (X-axis direction shown in FIG. 9) of 12.9 mm and a length in the horizontal direction (Y-axis direction shown in FIG. 9) of 500 μm. It was. The size of one pixel in the pixel group 721 is 50 μm × 500 μm. The pixel group 721 collectively receives infrared light transmitted by the 12 optical fibers 62 in one set of optical fiber groups 63 per pixel. In addition, the 256 pixels constituting the pixel group 721 were arranged in one column along the X-axis direction. When the light receiving unit 5, the transmission unit 6, and the detection unit 7 are used in this setting, the measurement resolution in the temperature measurement region P is 0.18 mm.

In addition, the charge time of the solid-state imaging device 72, which is one of the parameters that determine the operating environment of the scanning radiation thermometer 1, was set as follows. The charging time corresponds to the time for receiving thermal radiation energy (infrared light), and the shorter the charging time, the lower the amount of thermal radiation energy received. For this reason, the charging time is generally set so that the amount of heat radiation energy corresponding to the lower limit temperature of the measurement range can be received, and the output value (voltage value) of the solid-state imaging device 72 is about 0.1 [V]. Is done. For example, when the lower limit temperature of the measurement range is 500 [° C.], the heat radiation energy amount is about 1.055 × 10 ⁵ , and the charge time can receive this heat radiation energy amount, and the output value is 0.1. The value is obtained as [V]. Here, the charge time was set to 44 [μsec]. The reason why the output value is set to about 0.1 [V] is that the solid-state image sensor 72 generates a minute output even in the absence of incident light called dark current. This is because an output value of Further, the upper limit of the output value from the solid-state imaging device 72 was set so that the output value when the upper limit temperature of the measurement range was measured was 3.2 [V].

  When the temperature is measured by the scanning radiation thermometer 1 set as described above, in the continuous annealing line, the leading material 14 and the trailing material 15 are conveyed to the position of the welding machine 10, and the tail end of the leading material 14 by the welding machine 10. And the tip of the following material 15 were welded. In addition, this welding process was completed in 3 to 4 seconds per time. Simultaneously with this welding process, the scanning radiation thermometer 1 performed a temperature measurement process, and the temperature profile of the welded portion 16 was measured at a predetermined interval for each temperature measurement region P displaced in the Y-axis direction.

  Thereby, the measurement result of the temperature profile as shown in FIGS. 10 and 11 was obtained. That is, as indicated by a broken line in FIG. 10, a mountain-shaped temperature profile was measured for each temperature measurement region P at each position in the welding direction A <b> 2 (Y-axis direction) of the welded portion 16. Each of the broken lines in the chevron at each position indicates the temperature measurement result at each temperature measurement point in the temperature measurement region P with the welded portion 16 as the center. The height direction of the chevron indicates an increase in the measured temperature. Corresponds to the direction.

  According to the scanning radiation thermometer 1 having the above-described configuration, the infrared light emitted from the measurement object is measured in the temperature measurement region even in a place where various devices are concentrated like a production line such as a continuous annealing line. The collected infrared light is sufficiently condensed at each temperature measurement point in P, and the collected infrared light is transmitted by a plurality of optical fiber groups 63 corresponding one-to-one with each of the plurality of temperature measurement points. Can be received collectively for each pixel. In addition, since the optical fiber group 63 corresponding to the temperature measurement point has a one-to-one correspondence with each pixel in the pixel group 721 of the solid-state image sensor 72, the amount of infrared light received by each pixel is increased. it can.

  And simultaneously with the welding process of the preceding material 14 and the succeeding material 15 by the welding machine 10, the temperature profile of the mountain shape which has a measured temperature peak as shown in FIG. It can be measured every P. The measurement result of the temperature profile by the scanning radiation thermometer 1 is appropriately displayed on the thermometer display unit 4 as a graph of the welding direction position vs. welding temperature as shown in FIG. 11, for example, and presented to the operator. By visually recognizing the graph displayed on the thermometer display unit 4, the operator can easily know the temperature profile of the welded portion 16 and its peripheral portion simultaneously with the welding operation.

  In particular, by attaching the light receiving part 5 to the welding machine 10 in the continuous annealing line, the scanning radiation thermometer 1 can be installed in the vicinity of the welded part 16 of the steel material so that the measurement visual field is not obstructed. As a result, simultaneously with the welding process, the welding temperature of the welded portion 16 that needs to be monitored in the continuous annealing line can be individually measured and presented as a temperature profile of the welded portion 16, so that the operator can appropriately determine the welding failure and It can be confirmed with certainty. Hereinafter, two embodiments in which the present invention is applied to the scanning radiation thermometer 1 configured as described above will be described.

(Embodiment 1)
In an actual continuous annealing line, various steel materials having different thicknesses are treated. FIG. 12 is a diagram showing the relationship between the thickness of the steel material to be processed by the continuous annealing line and the welding temperature. As shown in FIG. 12, the welding temperature of the steel material varies depending on the plate thickness, and the heat input increases as the plate thickness increases, so that the welding temperature increases. For example, when a steel material having a thickness of 0.1 [mm] to 0.4 [mm] shown in FIG. 12 is a processing target, all of the monitoring needs to be performed to determine the welding failure of the welded portion 16. The temperature range including the welding temperature of the steel material, that is, the temperature range (target temperature range) that can be taken by all the steel materials to be processed is about 400 [° C.] to 1050 [° C.].

  By the way, as described above, a radiation thermometer that captures thermal radiation energy (infrared light) like the scanning radiation thermometer 1 has a measurable temperature range (measurement range) fixed as one of its parameters. It is common to use in a state. This measurement range is determined by the dynamic range which is the resolution of the detection element. The value of the dynamic range D applied to a general detection element is allowed in the range of 3000 to 5000, and the measurement range has a temperature width corresponding to the resolution of the detection element.

This dynamic range is represented by the ratio between the minimum value and the maximum value of the identifiable signal. In the case of a radiation thermometer, the resolution of the lower limit temperature that can be measured corresponds to the minimum value of the identifiable signal. Specifically, the calculation formula of the dynamic range D is expressed by the following formula (1) using the radiance E _{max at} the upper limit temperature and the resolution EΔ of the lower limit temperature that can be measured. Therefore, when high temperature resolution is required, the measurement range is relatively narrow. However, if the temperature resolution is low (the lower limit temperature resolution EΔ can be measured), the measurement range can be expanded. A wide range of temperature measurements is possible.
D = E _max / EΔ (1)

Therefore, the dynamic range D of the linear array type InGaAs CCD element was verified by setting the measurement range to 400 [° C.] to 1050 [° C.] and the temperature resolution to 2 [° C.]. Specifically, the dynamic range D of the detection element was obtained using the radiance determined by the blank radiation law according to the above equation (1). The radiance E _{max at} the upper limit temperature in this case is the radiance at 1050 [° C.]. The measurable lower limit temperature resolution corresponds to the difference between the radiance at 400 [° C.] and the radiance at 402 [° C.]. The value of the obtained dynamic range D is about 21000, which is greatly deviated from the allowable value.

  Further, in the same manner, the dynamic range D when the temperature resolution is set to 10 [° C.] was also verified, and the measurement range was set to 400 [° C.] to 1050 [° C. while setting the value of the dynamic range D as an allowable value. ]. However, since the temperature resolution is lowered, the temperature measurement accuracy is also lowered.

  As described above, in order to accurately measure the temperature in the entire range of 400 [° C.] to 1050 [° C.], a plurality of scanning types in which each measurement range is set to include the target temperature range as a whole. It is necessary to prepare a radiation thermometer and install these scanning radiation thermometers in the continuous annealing line. However, the equipment is densely packed in the continuous annealing line, and it is difficult to secure an installation place for a plurality of scanning radiation thermometers around the welding machine 10.

  On the other hand, some steel materials to be processed by the continuous annealing line include those that require high accuracy for monitoring the welding temperature and those that do not have any problems in temperature measurement with relatively low accuracy. Therefore, in the first embodiment, two detection elements (solid-state imaging elements), specifically, a narrow measurement range so as to include the welding temperature of a steel material of a type that requires high accuracy for monitoring the welding temperature. A configuration that includes a high-resolution measurement set with a (narrow range measurement range) and a low-resolution measurement set with a wide range of measurement (including a wide measurement range) including the entire target temperature range By doing so, it is possible to monitor the welding temperature with a single scanning radiation thermometer.

  FIG. 13 is a block diagram illustrating a configuration example of the temperature measurement system 8a according to the first embodiment. In FIG. 13, the same components as those in FIG. 1 are denoted by the same reference numerals. As shown in FIG. 13, the temperature measurement system 8a of the first embodiment includes a scanning radiation thermometer 1a and a host computer 9a as a measurement range determining device, and a thermometer processing unit of the scanning radiation thermometer 1a. 3a and the host computer 9a are connected so that data can be transmitted and received.

  The scanning radiation thermometer 1a includes a thermometer measurement unit 2a, a thermometer processing unit 3a as temperature measurement processing means, and a thermometer display unit 4. This scanning radiation thermometer 1a is realized by changing a part of the configuration of the scanning radiation thermometer 1 described with reference to FIGS. Specifically, as shown in FIG. 13, the configuration of the thermometer measurement unit 2a according to the first embodiment is that a beam splitter 76a is installed at the rear stage of the lens 75 shown in FIG. This can be realized by installing two solid-state image sensors 77a and 78a in the subsequent stage instead of the solid-state image sensor 72 shown in FIG.

  The beam splitter 76a transmits half the amount of infrared light that has passed through the lens 75 to be received by one solid-state image sensor 77a, and reflects the remaining light amount to be received by the other solid-state image sensor 78a. Of these two solid-state image sensors 77a and 78a, one solid-state image sensor 77a is a low-resolution measurement detection element with a temperature resolution of 10 [° C.], for example. The other solid-state imaging element 78a is a high-resolution measurement detecting element having a temperature resolution of, for example, 2 [° C.].

  Further, in the first embodiment, the thermometer processing unit 3a includes a temperature conversion processing unit 31, a changeover switch 32a serving as a switching unit that switches between an output from the solid-state imaging element 77a and an output from the solid-state imaging element 78a, and a host. And a switching processing unit 33a as switching processing means for performing switching processing of the selector switch 32a under the instruction of the computer 9a. Then, the switching processing unit 33a controls the switching switch 32a according to the next applied measurement range notified from the host computer 9a, and performs switching processing for switching the outputs of the solid-state imaging devices 77a and 78a.

  The host computer 9a is connected to an arithmetic device such as a CPU, a main storage device, an auxiliary storage device such as a hard disk and various storage media, a communication device, an output device such as a display device and a printing device, an input device, each unit, or an external input For example, a general-purpose computer such as a workstation or a personal computer can be used.

  The host computer 9a is used as operation plan data as processing plan information that defines the type, thickness, processing order (starting time of welding processing), and the like of a steel material that is sequentially conveyed to the welding machine 10 and a measurement object. Data necessary for determination, such as steel material type data as type information in which permission of low resolution measurement is set for each type of steel material, is held. The steel material type data is a data table in which flag information indicating whether or not low-resolution measurement is permitted is set in association with all types of steel materials included in the operation plan data.

  The host computer 9a includes a measurement range determination processing unit 91a as a determination unit as a main functional unit. This measurement range determination processing unit 91a uses the measurement range of the scanning radiation thermometer 1a to be applied at the time of the temperature measurement process performed in parallel with the next welding process based on the type of steel material to be welded in the next welding process (next application). The measurement range) is determined as a wide range measurement range or a narrow range measurement range, and is notified to the thermometer processing unit 3a.

  The temperature measurement system 8a according to the first embodiment implements the thermometer measurement method according to the following processing procedure. That is, first, the measurement range determination processing unit 91a of the host computer 9a determines the next applicable measurement range after the previous welding process and before starting the next welding process.

  FIG. 14 is a timing chart showing the processing timing of the welding process and the temperature measurement process. As shown in FIG. 14, the welding process in the welding machine 10 and the temperature measurement process by the scanning radiation thermometer 1a are started at the same time (T33), and the temperature measurement process is also ended at the end of the welding process (T35). As described above, the welding process and the temperature measurement process are executed intermittently at a predetermined time interval. The measurement range determination processing unit 91a determines the next applicable measurement range, for example, at a timing T31 illustrated in FIG. 14 before the start timing T33 of these processes.

  Specifically, the measurement range determination processing unit 91a first refers to the operation plan data and the steel material type data, and based on the type of steel material to be welded in the next welding process started at the start timing T33. It is determined whether the temperature measurement process performed in parallel with the next welding process is a low resolution measurement or a high resolution measurement. Then, the measurement range determination processing unit 91a determines the low resolution measurement when the steel material to be welded next time, that is, the type of the measurement object in the next temperature measurement process allows the low resolution measurement, The wide measurement range will be the next applicable measurement range. If the type does not allow low resolution measurement, it is determined as high resolution measurement, and the narrow range measurement range is set as the next applicable measurement range. Thereafter, the measurement range determination processing unit 91a notifies the determined next applied measurement range to the thermometer processing unit 3a.

  In response to this, in the thermometer processing unit 3a, first, the switching processing unit 33a controls the switching switch 32a, and when the next applied measuring range notified from the host computer 9a is the wide range measuring range, the switching switch 32a is solid. While switching to the output side of the image sensor 77a, in the case of a narrow range measurement range, a switching process for switching the switch 32a to the output side of the solid-state image sensor 78a is performed. Thereafter, the thermometer processing unit 3a starts the temperature measurement process at the start timing of the next welding process, and measures the temperature of the measurement object to obtain a temperature profile.

  As described above, in the first embodiment, the low-resolution measurement solid-state imaging element 77a in which a wide measurement range including the entire target temperature range is set according to the type of steel material to be welded in the next welding process. And a solid-state imaging device 78a for high resolution measurement in which a narrow range measurement range including a welding temperature of a type that requires high accuracy for monitoring the welding temperature is used. According to this, before starting the next temperature measurement process, the output of the solid-state image sensor 77a for low resolution measurement and the output of the solid-state image sensor 78a for high resolution measurement can be switched in advance. Then, the temperature of the entire target temperature range is realized using the output of the solid-state imaging device 77a for low resolution measurement, and at the time of welding of a steel material of a type that requires high accuracy for monitoring the welding temperature, high resolution measurement is performed. High-precision temperature measurement can be realized using the output of the solid-state image sensor 77a. Therefore, the welding temperature of all the steel materials to be processed can be appropriately monitored by one scanning radiation thermometer 1a, and a welding failure can be reliably determined.

(Embodiment 2)
FIG. 15 is a block diagram illustrating a configuration example of the temperature measurement system 8b according to the second embodiment. In FIG. 15, the same components as those in FIG. As shown in FIG. 15, the temperature measurement system 8b according to the second embodiment includes a scanning radiation thermometer 1b and a host computer 9b, and includes a thermometer processing unit 3b and a host computer 9b of the scanning radiation thermometer 1b. Are connected so that data can be transmitted and received.

  The scanning radiation thermometer 1 b includes a thermometer measurement unit 2, a thermometer processing unit 3 b, and a thermometer display unit 4. The scanning radiation thermometer 1b is realized by changing a part of the configuration of the scanning radiation thermometer 1 described with reference to FIGS. Specifically, in the scanning radiation thermometer 1b of the second embodiment, the thermometer processing unit 3b includes a temperature conversion processing unit 31 and an operating environment setting unit 35b. The operating environment setting unit 35b sets the operating environment of the scanning radiation thermometer 1b in accordance with the thermometer setting data notified from the host computer 9b.

  The host computer 9b includes a measurement range determination processing unit 91b as a main functional unit, and holds the operation plan data described above. The measurement range determination processing unit 91b sets the parameters of the scanning radiation thermometer 1b including the specific value of the measurement range as the next applied measurement range based on the thickness of the steel material to be welded in the next welding process. The prepared thermometer setting data is created and notified to the thermometer processing unit 3b.

  FIG. 16 is a flowchart showing a processing procedure of the temperature measurement system 8b. The temperature measurement system 8b implements the thermometer measurement method by the host computer 9b and the thermometer processing unit 3b of the scanning radiation thermometer 1b performing processing according to the processing procedure of FIG.

  In the host computer 9b, as shown in FIG. 16, first, the measurement range determination processing unit 91b performs the measurement range division process, and divides the target temperature range into a plurality of measurement ranges to create a thermometer setting table (step s11). ). FIG. 17 is a diagram for explaining the measurement range division process performed in step s11, and shows the relationship between the thickness of the steel material to be processed by the continuous annealing line and the welding temperature. FIG. 18 is a diagram showing a data configuration example of a thermometer setting table created from the relationship between the plate thickness and the welding temperature shown in FIG.

  In the measurement range classification process, the measurement range determination processing unit 91b refers to the operation plan data and analyzes the relationship between the plate thicknesses and welding temperatures of all steel materials to be processed by the continuous annealing line. Then, the measurement range determination processing unit 91b divides the target temperature range into a plurality of measurement ranges. Specifically, the measurement range determination processing unit 91b is preset with a temperature resolution (the value of the resolution EΔ of the lower limit temperature that can be measured in the above equation (1)) so that high-resolution measurement can be realized in any measurement range. The target temperature range is divided under a condition that is equal to or less than a predetermined threshold.

  For example, when determining the upper limit temperature of the measurement range having the lower limit temperature of 400 [° C.] that is the lower limit value of the target temperature range, the above equation (1) is used, and the temperature resolution is equal to or lower than the aforementioned threshold value. The upper limit temperature for the lower limit temperature 400 [° C.] is determined so that the value of the dynamic range D is within 2000. For example, in the example of FIG. 17, 400 [° C.] to 700 [° C.] whose upper limit temperature is 700 [° C.] is classified as the measurement range 1. The value of the dynamic range D when the upper limit temperature is 700 [° C.] is 1680, which satisfies the threshold condition within 2000. At this time, the charging time is determined so that the output value of the solid-state imaging device 72 when the lower limit temperature of 400 [° C.] is measured is 0.1 [V] or more. For example, the charging time is 120 [μsec]. The numerical values exemplified are those when an InGaAs CCD element is adopted as the solid-state imaging element 72 which is a detection element constituting the detection unit 7.

  Thereafter, the process is repeated in the same manner, and the entire temperature range is divided into a plurality of measurement ranges, and the corresponding charge time is determined. At this time, the measurement ranges are preferably divided so that the temperature ranges overlap each other. In the example of FIG. 17, the entire temperature range is divided into three measurement ranges, with 500 [° C.] to 900 [° C.] as the measurement range 2 and 600 [° C.] to 1050 [° C.] as the measurement range 3.

  When the entire temperature range is divided into a plurality of measurement ranges and the charge time is determined as described above, a temperature setting table is created. For example, as shown in FIG. 18, the temperature setting table is obtained by associating the plate thickness of the welding temperature belonging to each of the measurement ranges 1 to 3, the measurement range, the charge time, and the dynamic range for each measurement range. To do.

  After creating the temperature setting table, as shown in FIG. 16, the temperature setting table is in a standby state until the notification timing of thermometer setting data is reached (step s13: No). The notification timing is a predetermined timing after the previous welding process until the next welding process is started.

  Then, when the current time comes to the notification timing (step s13: Yes), the host computer 9b acquires the plate pressure of the steel material to be welded next time from the operation plan data, and sets the measurement range to which the acquired plate thickness belongs. The temperature is selected from the temperature setting table and determined as the next applicable measurement range (step s15). Then, each value of the measurement range, the charge time, and the dynamic range set as the next applied measurement range set in the temperature setting table is set as thermometer setting data and notified to the thermometer processing unit 3b (step s17). For example, if the thickness of the steel material to be welded next time is 0.15 [mm], the measurement range 400 [° C.] to 700 [° C.] of the measurement range 1 shown in FIGS. Then, the thermometer processing unit 3b is notified of thermometer setting data including each of the next applicable measurement range 400 [° C.] to 700 [° C.], the charge time 120 [μsec], and the dynamic range value 1680. .

  Thereafter, while the process is not finished (step s19: No), the process returns to step s13 and the above-described process is repeated. Moreover, a process is complete | finished at predetermined timings, such as finishing operation (step s19: Yes).

  On the other hand, the thermometer processing unit 3b is in a standby state until the thermometer setting data is notified from the host computer 9b (step s21: No). When the thermometer setting data is notified (step s21: Yes), the operating environment setting unit 35b sets the operating environment of the scanning radiation thermometer 1b according to the notified thermometer setting data (step s23). ). Specifically, the operating environment setting unit 35b sets the measurement range of the scanning radiation thermometer 1b to the next applicable measurement range and sets the charge time according to the thermometer setting data, and operates the scanning radiation thermometer 1b. Set the environment to be suitable for monitoring the welding temperature of the steel material to be welded next time.

  Then, the thermometer processing unit 3b waits until the start timing of the next welding process, starts the temperature measurement process, and measures the temperature (temperature profile) of the measurement object (step s25 → step s27). Thereafter, while the process is not ended (step s29: No), the process returns to step s21 and the above-described process is repeated. Moreover, a process is complete | finished at predetermined timings, such as finishing operation (step s29: Yes).

  As described above, in the second embodiment, the target temperature range, that is, the entire temperature range including the welding temperatures of the plate thicknesses of all the steel materials to be processed by the continuous annealing line is high resolution in any measurement range. It was decided to divide into several measurement ranges so that measurement could be realized. And before the start timing of the next welding process, the measurement range of the scanning radiation thermometer 1b is set to the next applied measurement range determined as the measurement range according to the thickness of the steel material to be welded in the next welding process. I set it. According to this, before starting the next temperature measurement process, the operating environment of the scanning radiation thermometer 1b is set to a setting suitable for monitoring the welding temperature of the steel material to be welded next time each time in advance. Can do. Therefore, the welding temperature of all the steel materials to be processed can be properly monitored by one scanning radiation thermometer 1b, and a welding failure can be reliably determined.

  In the above-described embodiment, the case of measuring the temperature of the welded portion of the steel material welded in the continuous annealing line is exemplified, but the present invention is not limited to this, and the temperature of various heat source bodies is measured. Applicable to as well.

1, 1a, 1b Scanning type radiation thermometer 2, 2a Thermometer measuring unit 76a Beam splitter 77, 77a, 78a Solid-state imaging device 3, 3a, 3b Thermometer processing unit 31 Temperature conversion processing unit 32a Changeover switch 33a Switching processing unit 35b Operating environment setting unit 4 Thermometer display unit 8a, 8b Temperature measurement system 9a, 9b Host computer 91a, 91b Measurement range determination processing unit

Claims (12)

A temperature measurement system configured by connecting a measurement range determination device and a scanning radiation thermometer,
The scanning radiation thermometer uses the object as a measurement object sequentially in accordance with the processing plan information that defines the type and processing order of the object, and intermittently performs a temperature measurement process to remove the temperature profile of the measurement object. Measured by contact,
The measurement range determination device is configured to determine the next temperature based on the type of the object to be measured in the next temperature measurement process after the previous temperature measurement process and before the next temperature measurement process. Determining a measurement range of the scanning radiation thermometer at the time of measurement processing as a next applied measurement range, and determining means for notifying the scanning radiation thermometer of the determined next applied measurement range;
The scanning radiation thermometer includes temperature measurement processing means for performing the next temperature measurement process using the measurement range of the scanning radiation thermometer as the next applied measurement range and measuring the temperature of the measurement object. Characteristic temperature measurement system. The scanning radiation thermometer includes, as detection elements, a high-resolution measurement detection element in which a wide measurement range is set, and a low-resolution measurement detection element in which a narrow measurement range is set,
The determination means determines whether the type of the object to be measured in the next temperature measurement process is the low-resolution measurement based on the type information in which permission for low-resolution measurement is set for each type of the object. In the case of a type that is permitted, a wide range of measurement is determined, and in the case of a type that is not permitted, a narrow range is determined as the next applicable measurement range.
The temperature measurement processing means includes
Switching means for switching between the output from the detection element for high resolution measurement and the output from the detection element for low resolution measurement;
When the next applied measurement range is the wide range measurement range, the switching unit is switched to the output side of the low resolution measurement detection element, while when the next applied measurement range is the narrow range measurement range, the switching unit is Switching processing means for switching to the output side of the detection element for high resolution measurement,
The temperature measurement system according to claim 1, further comprising:   The determination means divides a temperature range that can be taken by all objects included in the processing plan information into a plurality of measurement ranges under a condition that each has a predetermined temperature resolution, and from among the divided measurement ranges, The temperature measurement system according to claim 1, wherein a measurement range corresponding to a type of the object to be measured in the next temperature measurement process is determined as the next applied measurement range. The scanning radiation thermometer is
A condensing lens is housed in a cylindrical housing, receives infrared light emitted from the measurement object, and is divided into temperature measurement points of the measurement object by the condensing lens. A light receiving unit that collects light;
A plurality of optical fiber groups corresponding one-to-one with each of the plurality of temperature measurement points in the measurement object are bundled and housed inside a flexible elongated cylindrical body, and the temperature is controlled by the plurality of optical fiber groups. A transmission unit for transmitting the infrared light for each measurement point;
A solid-state image sensor that is a detection element having sensitivity in an infrared light region, and the infrared light is applied to a plurality of pixels arranged in the solid-state image sensor in one-to-one correspondence with each of the plurality of optical fiber groups. And detecting the intensity of the infrared light for each temperature measurement point;
The temperature measurement system according to any one of claims 1 to 3, further comprising: The measurement object is a steel material welded by a welding machine,
The temperature measurement system according to claim 4, wherein an arrangement direction of the plurality of optical fiber groups is perpendicular to a welding direction of the steel material.   The temperature measuring system according to claim 5, wherein the light receiving unit is attached to the welding machine, moves along the welding direction of the steel material together with the welding machine, and receives the infrared light.   The temperature measurement system according to claim 5 or 6, wherein a plurality of optical fibers included in each of the plurality of optical fiber groups are arranged in a staggered manner in a welding direction of the steel material.   8. The number of optical fibers included in each of the plurality of optical fiber groups is set to a plurality according to the pixel size of the solid-state imaging device. Temperature measurement system.   The temperature measurement system according to claim 8, wherein the number of the optical fibers is 12 per pixel of the solid-state imaging device. A temperature measurement method for measuring the temperature of an object to be measured using a scanning radiation thermometer,
The scanning radiation thermometer uses the object as a measurement object sequentially in accordance with the processing plan information that defines the type and processing order of the object, and intermittently performs a temperature measurement process to remove the temperature profile of the measurement object. Measured by contact,
After the previous temperature measurement process and before the next temperature measurement process, the scanning type in the next temperature measurement process based on the type of the object to be measured in the next temperature measurement process A determination step of determining the measurement range of the radiation thermometer as the next applicable measurement range;
A measurement step of performing the next temperature measurement process with the measurement range of the scanning radiation thermometer as the next applied measurement range, and measuring the temperature of the measurement object;
A temperature measuring method comprising: The scanning radiation thermometer includes, as detection elements, a high-resolution measurement detection element in which a wide measurement range is set, and a low-resolution measurement detection element in which a narrow measurement range is set,
In the determination step, the type of the object to be measured in the next temperature measurement process is determined based on the type information in which permission or disapproval of the low resolution measurement is set for each type of the object. In the case of a type that is permitted, a wide range of measurement is determined, and in the case of a type that is not permitted, a narrow range is determined as the next applicable measurement range.
The measurement step uses the output of the detection element for low resolution measurement when the wide range measurement range is determined as the next applied measurement range, while the narrow range measurement range is determined as the next applied measurement range. The temperature measurement method according to claim 10, wherein the temperature of the measurement object is measured using the output of the detection element for high resolution measurement.   The determination step divides a temperature range that can be taken by all the objects included in the processing plan information into a plurality of measurement ranges under a condition that each has a predetermined temperature resolution, and from among the divided measurement ranges, The temperature measurement method according to claim 10, wherein a measurement range corresponding to a type of the object to be measured in the next temperature measurement process is determined as the next applied measurement range.

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