JP2013248636A - Laser processing method - Google Patents

Laser processing method Download PDF

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JP2013248636A
JP2013248636A JP2012124424A JP2012124424A JP2013248636A JP 2013248636 A JP2013248636 A JP 2013248636A JP 2012124424 A JP2012124424 A JP 2012124424A JP 2012124424 A JP2012124424 A JP 2012124424A JP 2013248636 A JP2013248636 A JP 2013248636A
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laser beam
laser
workpiece
polarizing film
output
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JP2012124424A
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JP6020884B2 (en
Inventor
Koji Ueda
幸治 植田
Shin Oikawa
伸 及川
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Sumitomo Chemical Co Ltd
住友化学株式会社
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Abstract

PROBLEM TO BE SOLVED: To provide a laser processing method capable of stably processing a workpiece even when the processing speed of a laser beam to the workpiece changes.SOLUTION: A laser processing method for processing a workpiece F using a laser beam B includes a step of regulating the pulse oscillation frequency of laser beam B so that the lap rate of laser beam B irradiated to the workpiece F becomes constant when the processing speed of laser beam B to the workpiece F changes, and a step of regulating the output of laser beam B so that the energy amount of laser beam B irradiated to the workpiece F per unit area becomes constant.

Description

  The present invention relates to a laser processing method for processing a workpiece using laser light.

  For example, optical films such as polarizing films and retardation films are attached to optical display panels such as liquid crystal panels and organic EL panels. In general, for these optical films, a long film is unwound from an original fabric roll, and the unwound film is cut into a width and length corresponding to the display area of the optical display panel.

  Conventionally, blades have been used for cutting optical films. However, in the case of cutting with a blade, foreign matters such as film scraps are easily generated during cutting. And the optical film which such a foreign material adhered may cause a display defect etc. in an optical display panel, when affixed on an optical display panel.

  Therefore, in recent years, cutting (cutting) of an optical film using a laser beam has been performed (see, for example, Patent Documents 1 and 2). In the cutting process using this laser beam, since the generation of foreign matters such as film scraps is less than in the case of cutting with a conventional blade, it is possible to improve the product yield.

JP 2009-22978 A JP 2008-302376 A

  By the way, in the processing method using a laser beam, when the long film (workpiece) unwound from the above-mentioned raw fabric roll is cut into a predetermined width, the film feed speed varies and the like. The cutting speed (processing speed) of the laser beam with respect to the film changes.

  In this case, it is necessary to increase the output of the laser beam as the cutting speed increases, but if the output of the laser beam is too high, defects or the like are generated on the cut surface of the film, resulting in deterioration of the cross-sectional quality. become. On the other hand, if the output of the laser beam is too low, an uncut portion will occur in the film.

  Therefore, only by adjusting the output of the laser beam accompanying the above-described change in the cutting speed, the output of the laser beam may be out of the optimum range, so that the optical film may not be stably cut.

  The present invention has been proposed in view of such conventional circumstances, and laser processing capable of stably processing a workpiece even when the processing speed of laser light on the workpiece changes. It aims to provide a method.

  In order to achieve the above object, the present invention provides a laser processing method for processing a workpiece using laser light, wherein the workpiece is processed when the processing speed of the laser light for the workpiece is changed. Adjusting the pulse oscillation frequency of the laser beam so that the wrap rate of the laser beam irradiated to the object is constant, and the amount of energy per unit area of the laser beam irradiated to the workpiece is constant And adjusting the output of the laser beam.

Moreover, this invention can be used when cut | disconnecting with respect to the said to-be-processed object.
Moreover, this invention can be used when the said to-be-processed object is an optical film.

  As described above, according to the present invention, it is possible to provide a laser processing method capable of stably processing a workpiece even when the processing speed of laser light on the workpiece changes. . In particular, the present invention can be suitably used when cutting an optical film that is a workpiece.

It is a block diagram which shows schematic structure of the laser processing apparatus used by this invention. It is a schematic diagram which shows the overlapping degree of the spot of the laser beam irradiated to a polarizing film. It is a graph which shows the range of the pulse oscillation frequency of the laser beam required in order to cut | disconnect a polarizing film. It is a graph which shows the range of the output of the laser beam required in order to cut | disconnect a polarizing film. It is a block diagram which shows the modification of the laser processing apparatus used by this invention. It is a block diagram which shows another modification of the laser processing apparatus used by this invention.

Embodiments of the present invention will be described below with reference to the drawings.
A laser processing method to which the present invention is applied performs processing on a workpiece using laser light, and a laser irradiated to the workpiece when the processing speed of the laser light on the workpiece changes. Adjust the laser pulse oscillation frequency so that the light wrapping rate is constant, and output the laser light so that the amount of energy per unit area of the laser light irradiated to the workpiece is constant Adjusting the step.

  Specifically, as one embodiment of the present invention, for example, a laser processing apparatus 100 as shown in FIG. 1 is used to cut a polarizing film (optical film) F, which is a workpiece, using laser light B ( In the case of cutting), more specifically, the case where the long polarizing film F unwound from the raw roll is cut into a predetermined width will be described as an example.

FIG. 1 is a block diagram showing a schematic configuration of the laser processing apparatus 100.
A laser processing apparatus 100 shown in FIG. 1 schematically includes a laser light source 101 that oscillates a laser beam B and an irradiation optical system 102 that irradiates a polarizing film F with the laser beam B.

As the laser light source 101, for example, a carbon dioxide (CO 2 ) laser oscillator can be used as one that can pulsate the laser beam B with an output suitable for cutting the polarizing film F. Further, in the laser light source 101, the output of the laser beam B and the pulse oscillation frequency can be variably adjusted.

  The irradiation optical system 102 has a configuration in which a bend mirror 103 and a beam splitter 104 are arranged in this order from the laser light source 101 side. Among these, the bend mirror 103 reflects the laser beam B oscillated from the laser light source 101 and variably adjusts the traveling direction of the laser beam B. On the other hand, the beam splitter 104 branches (separates) the laser beam B into a transmitted beam Bt and a reflected beam Br at a certain ratio.

  In the laser processing apparatus 100, the polarizing film L is cut by irradiating the polarizing film L with the transmitted light Bt that has passed through the beam splitter 104. On the other hand, the reflected light Br reflected by the beam splitter 104 is input to the attenuator 105. Then, the reflected light Br is attenuated by the attenuator 105.

  The laser light source 101 has a characteristic that the fluctuation range of the output value tends to be smaller as the output of the oscillating laser beam B is higher. On the other hand, if the output of the laser beam B is too high, a defect or the like is generated on the cut surface of the polarizing film F. Therefore, it is desirable to set the output of the laser beam in an appropriate range.

  On the other hand, in the laser processing apparatus 100 shown in FIG. 1, the output of the laser beam B oscillated by the laser light source 101 is increased and the output is stabilized, and the transmission separated by the beam splitter 104 is performed. Depending on the ratio of the light Bt and the reflected light Br, it is possible to set the output of the laser light B (transmitted light Bt) irradiated to the polarizing film F within an optimum range for cutting the polarizing film F. ing.

  By the way, when the long polarizing film F unwound from the raw roll described above is cut into a predetermined width, the laser beam B is cut from the polarizing film F along with fluctuations in the feeding speed of the polarizing film F, etc. The speed (processing speed) will change.

  At this time, in the laser processing method of the present invention, the pulse oscillation frequency of the laser beam B is such that the wrap rate of the laser beam B irradiated to the polarizing film F is constant with respect to the change in the cutting speed of the laser beam B. Adjust.

Here, as shown in FIG. 2, the wrap ratio refers to the degree of overlap of the spots S of the laser light B irradiated to the polarizing film F, the pulse oscillation frequency of the laser light B is f [Hz], and the laser light B When the spot diameter is d [m] and the cutting speed of the laser beam B is V [m / s], the value is represented by the following formula (1).
fd / V × 100 [%] (1)

  FIG. 2 is a schematic diagram showing the degree of overlap of the spots S of the laser light B irradiated to the polarizing film F when the wrap ratio is 200%. In the above formula (1), “fd” represents the oscillation length of the laser beam B per second, and “V” represents the cut length of the polarizing film F per second.

  In this invention, when cut | disconnecting the polarizing film F, it is preferable to set the lapping rate of this laser beam B in the range of 100 to 200%, and it is more preferable to set in the range of 120 to 180%.

  FIG. 3 is a graph showing the range of the pulse oscillation frequency f of the laser beam B necessary for cutting the polarizing film F. In this graph, the horizontal axis represents the cutting speed V [m / s] of the laser beam B, and the vertical axis represents the pulse oscillation frequency f [Hz] of the laser beam B. In FIG. 3, the output of the laser beam is constant.

As shown in FIG. 3, the higher the cutting speed V of the laser beam B, the higher the pulse oscillation frequency f of the laser beam B is. However, if the pulse oscillation frequency f is too high (the line L 1 shown in FIG. 3). A region on the upper side), a defect or the like is generated on the cut surface of the polarizing film F, and the cross-sectional quality is deteriorated. On the other hand, a pulse oscillation frequency f is too low (the area below the line L 2 shown in FIG. 3), so that the uncut portion in the polarizing film F occurs.

Therefore, in this invention, even when the cutting speed V of the laser beam B changes, it is suitable for cutting the polarizing film F described above so that the wrap rate of the laser beam B irradiated to the polarizing film F is constant. in the range (the area between the line L 1 and the line L 2 shown in FIG. 3), it adjusts the pulse oscillation frequency f.

  That is, in the present invention, the laser beam B irradiated to the polarizing film F while adjusting the pulse oscillation frequency f of the laser beam B oscillated by the laser light source 101 according to the cutting speed V of the laser beam B with respect to the polarizing film F. Make the wrap rate constant.

  Thereby, even when the feeding speed of the polarizing film F changes, the cutting process can be stably performed with the number of times of irradiation of the laser light B per unit length with respect to the polarizing film F being constant.

  In the present invention, the pulse oscillation frequency f is adjusted so that the wrap rate is constant when the cutting speed V is changed, but the wrap rate is not necessarily strictly constant. In other words, the present invention allows a slight variation in the lap ratio accompanying a change in the cutting speed V within a range in which the cutting process for the polarizing film F can be stably performed. For example, the allowable range of the lap rate when the lap rate is constant can be stably cut as long as the lap rate is within a set value ± 5%.

  In the laser processing method of the present invention, the pulse oscillation frequency f of the laser beam B described above is adjusted, and the unit area of the laser beam B irradiated to the polarizing film F with respect to the change in the cutting speed V of the laser beam B The output of the laser beam B is adjusted so that the amount of energy per hit is constant.

Here, the amount of energy per unit area is a value represented by the following formula (2) when the output of the laser beam is W [J / s].
4W / πdV [J / m 2 ] (2)

  FIG. 4 is a graph showing the output range of laser light necessary to cut the polarizing film F. In this graph, the horizontal axis represents the cutting speed V [m / s] of the laser beam B, and the vertical axis represents the output W [J / s] of the laser beam B.

As shown in FIG. 4, as the cutting speed V of the laser beam B is high, although it is necessary to increase the output W of the laser beam B, the output W is too high (upper than the line L 3 shown in FIG. 4 Region), a defect or the like is generated on the cut surface of the polarizing film F, and the cross-sectional quality is deteriorated. On the other hand, the output W is too low (the area below the line L 4 shown in FIG. 4), so that the uncut portion in the polarizing film F occurs.

Therefore, in the present invention, the polarizing film F is cut so that the energy amount per unit area of the laser light B irradiated to the polarizing film F is constant even when the cutting speed V of the laser light B is changed. a range that is suitable for (the region between the line L 3 and a line L 4 shown in FIG. 4) adjusts the output W.

  That is, in the present invention, the unit of the laser beam B irradiated to the polarizing film F while adjusting the output W of the laser beam B oscillated by the laser light source 101 according to the cutting speed V of the laser beam B with respect to the polarizing film F. Make the amount of energy per area constant.

  Thereby, even when the feeding speed of the polarizing film F changes, the cutting process can be stably performed while the amount of energy per unit area with respect to the polarizing film F is kept constant.

  In the conventional case, the laser light output may be out of the optimum range only by adjusting the laser light output accompanying the change in the cutting speed, whereas in the present invention, the above-described cutting speed V is set. In addition, by controlling both the pulse oscillation frequency f of the laser beam B and the output W, it is possible to prevent the output W of the laser beam B from deviating from the optimum range.

  In the present invention, the output W is adjusted so that the energy amount per unit area is constant when the cutting speed V is changed. However, the energy amount per unit area must be strictly constant. There is no. That is, according to the present invention, it is possible to allow a slight variation in the amount of energy per unit area with a change in the cutting speed V within a range in which the cutting process for the polarizing film F can be stably performed.

  As described above, according to the present invention, even when the cutting speed V (processing speed) of the laser light L with respect to the polarizing film F (workpiece) changes as the feeding speed of the polarizing film F changes. The polarizing film F can be stably cut.

  In addition, this invention is not necessarily limited to the thing of the said embodiment, A various change can be added in the range which does not deviate from the meaning of this invention.

  For example, in the present invention, the polarizing film F may be cut using a laser processing apparatus 100A as shown in FIG. 5 or a laser processing apparatus 100B as shown in FIG. In the following description, the same parts as those of the laser processing apparatus 100 shown in FIG. 1 are not described, and the same reference numerals are given in the drawings.

  A laser processing apparatus 100A shown in FIG. 5 performs cutting processing on a plurality of polarizing films F at the same time. Specifically, the laser processing apparatus 100A includes another bend mirror 106 instead of the attenuator 105 shown in FIG. Other than that, it has the structure fundamentally the same as the laser processing apparatus 100 shown in the said FIG.

  In this laser processing apparatus 100A, the transmitted light Bt that has passed through the beam splitter 104 is irradiated onto the polarizing film L, and the reflected light Br reflected by the beam splitter 104 is reflected by the bend mirror 106 while being applied to another polarizing film F. By irradiating, the two polarizing films F can be cut simultaneously.

  Also in this case, by using the laser processing method of the present invention, the cutting speed V (processing speed) of the laser light L with respect to the polarizing film F (workpiece) is changed with the fluctuation of the feeding speed of the polarizing film F and the like. Even when it changes, the polarizing film F can be stably cut.

  On the other hand, the laser processing apparatus 100B shown in FIG. 6 includes an output measuring device 107 instead of the attenuator 105 shown in FIG. The output measuring device 107 continuously measures the output of the laser light B from the reflected light Br reflected by the beam splitter 104. Other than that, it has the structure fundamentally the same as the laser processing apparatus 100 shown in the said FIG.

  In the laser processing apparatus 100A, control is performed to keep the output of the laser beam B oscillated by the laser light source 101 constant based on the result measured by the output measuring device 107. Thereby, it is possible to perform the cutting process with respect to the polarizing film F more stably.

  In addition, although the laser processing method of this invention is used suitably when cut | disconnecting optical films, such as a polarizing film and retardation film, which are affixed on optical display panels, such as a liquid crystal panel and an organic electroluminescent panel mentioned above, this invention is. The object to be processed is not limited to these, and the present invention can be widely applied to objects that can be processed using laser light.

  Further, the laser processing method of the present invention is not limited to the case of cutting the workpiece described above, but can also be used when the workpiece is half-cut at a certain depth. Also in this case, by using the laser processing method of the present invention, it is possible to perform stable half-cut processing while keeping the depth of cut with respect to the workpiece constant.

DESCRIPTION OF SYMBOLS 100,100A, 100B ... Laser processing apparatus 101 ... Laser light source 102 ... Irradiation optical system 103 ... Bend mirror 104 ... Beam splitter 105 ... Attenuator 106 ... Bend mirror 107 ... Output measuring device F ... Polarizing film (workpiece) B ... Laser light Bt ... Transmitted light Br ... Reflected light S ... Spot

Claims (3)

  1. A laser processing method for processing a workpiece using laser light,
    When the processing speed of the laser beam for the workpiece changes,
    Adjusting the pulse oscillation frequency of the laser beam so that the wrap rate of the laser beam irradiated on the workpiece is constant;
    Adjusting the output of the laser beam so that the amount of energy per unit area of the laser beam irradiated onto the workpiece is constant.
  2.   The laser processing method according to claim 1, wherein a cutting process is performed on the workpiece.
  3.   The laser processing method according to claim 1, wherein the workpiece is an optical film.
JP2012124424A 2012-05-31 2012-05-31 Laser processing method Active JP6020884B2 (en)

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Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE102014224232A1 (en) 2013-11-29 2015-06-03 Hitachi Automotive Systems, Ltd. cylinder device

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2004009139A (en) * 2002-06-10 2004-01-15 New Wave Research Method and system which manufacture die
US20070075060A1 (en) * 2005-09-30 2007-04-05 Shedlov Matthew S Method of manufacturing a medical device from a workpiece using a pulsed beam of radiation or particles having an adjustable pulse frequency
JP2012076143A (en) * 2010-10-06 2012-04-19 Sumitomo Chemical Co Ltd Laser cutter and slitter with same

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2004009139A (en) * 2002-06-10 2004-01-15 New Wave Research Method and system which manufacture die
US20070075060A1 (en) * 2005-09-30 2007-04-05 Shedlov Matthew S Method of manufacturing a medical device from a workpiece using a pulsed beam of radiation or particles having an adjustable pulse frequency
JP2012076143A (en) * 2010-10-06 2012-04-19 Sumitomo Chemical Co Ltd Laser cutter and slitter with same

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE102014224232A1 (en) 2013-11-29 2015-06-03 Hitachi Automotive Systems, Ltd. cylinder device

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