JP2013229413A - Electronic control device - Google Patents

Electronic control device Download PDF

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Publication number
JP2013229413A
JP2013229413A JP2012099397A JP2012099397A JP2013229413A JP 2013229413 A JP2013229413 A JP 2013229413A JP 2012099397 A JP2012099397 A JP 2012099397A JP 2012099397 A JP2012099397 A JP 2012099397A JP 2013229413 A JP2013229413 A JP 2013229413A
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Japan
Prior art keywords
circuit board
printed circuit
portion
control device
electronic control
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Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2012099397A
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Japanese (ja)
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JP6105855B2 (en
Inventor
Hirofumi Watabe
紘文 渡部
Kazuhiko Nakano
和彦 中野
Daisuke Yasukawa
大輔 安川
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Hitachi Automotive Systems Ltd
日立オートモティブシステムズ株式会社
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Priority to JP2012099397A priority Critical patent/JP6105855B2/en
Publication of JP2013229413A publication Critical patent/JP2013229413A/en
Application granted granted Critical
Publication of JP6105855B2 publication Critical patent/JP6105855B2/en
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Abstract

PROBLEM TO BE SOLVED: To provide a printed circuit board having a high layout property without reducing a space for forming a circuit pattern.SOLUTION: An electronic control device comprises at least a substrate body 11a, and a printed circuit board 12 on which a circuit pattern for controlling drive of an actuator. The printed circuit board 12 is supported by the substrate body 11a. The electronic control device is provided with a support member 18 standing on the substrate body 11a, contacting a side face 12a of the printed circuit board 12, and restraining displacement in a direction of the side face 12a of the printed circuit board 12.

Description

  The present invention relates to an electronic control device configured by supporting a printed board with respect to a base member.

  As a conventional electronic control device for supporting a printed circuit board with respect to a base member, for example, a device described in Patent Document 1 is known. As shown in FIG. 1B of Patent Document 1, when the rectangular portion 2-2 of the X boss 2 is inserted into the square hole 1-1 of the printed circuit board 1 and the printed circuit board 1 is rotated in the direction of the arrow A, The printed circuit board 1 rises along the inclined portion 3-1 of the boss 3, and the portion of the inclined portion 3-1 is fitted into the circular hole 1-2. -2 is supported by the lower surface, and the side surface is supported by the floating boss 4.

Japanese Patent Laid-Open No. 9-326573

  However, in the electronic control device described in Patent Document 1, a space for providing the circular hole 1-2 and the rectangular portion 2-2 of the X boss 2 needs to be provided in the printed circuit board 1, and a circuit pattern is formed on the printed circuit board. The space for doing so decreases and the layout performance deteriorates.

  Therefore, an object of the present invention is to provide an electronic control device that solves the above-described problems.

The invention according to claim 1 includes at least a base member and a printed circuit board on which a circuit pattern for driving and controlling the actuator is formed.
In the electronic control device in which the printed circuit board is supported on the base member,
A support member is provided that stands on the base member and abuts against a side surface of the printed circuit board to regulate displacement in the side surface direction of the printed circuit board.

The invention according to claim 2 is the electronic control device according to claim 1,
The support member is
A support portion erected on the base portion;
A pedestal formed at the tip of the support,
And a side surface restricting portion that extends from the pedestal portion and contacts the side surface of the printed circuit board.

The invention according to claim 3 is the electronic control device according to claim 2,
A groove portion is formed between the pedestal portion and the side surface regulating portion.

  According to a fourth aspect of the present invention, in the electronic control device according to the second or third aspect, the side surface restricting portion is formed with a pressing portion that bends and deforms a tip and contacts the flat portion of the printed circuit board. It is characterized by that.

According to the electronic control device of the first aspect, the displacement of the printed circuit board in the side surface direction can be regulated by bringing the support member into contact with the side surface of the printed circuit board.
In addition, it is possible to suppress a decrease in the layout of the circuit pattern of the printed board.

  According to the electronic control device of the second aspect, the surface of the printed circuit board facing the base member can be supported by the pedestal portion and can be supported at a position closer to the side surface of the printed circuit board. Can be suppressed.

  According to the electronic control device of the third aspect, since the groove portion is formed, the printed circuit board easily comes into contact with the base portion or the side surface regulating portion.

  According to the electronic control device of the fourth aspect, when the printed board is supported by the base member, it is possible to reduce a stress load due to a force applied to the printed board.

The perspective view which shows the principal part of an electronic control apparatus (embodiment). The block diagram of a brake booster (embodiment). The exploded perspective view of a brake booster (embodiment). The perspective view which shows the electronic controller in ECU of a brake booster (embodiment). The block diagram which shows the relationship between a reinforcement member and a printed circuit board (embodiment). Explanatory drawing at the time of soldering a bus bar to a printed circuit board (embodiment). The principal part enlarged view of FIG. 6 (embodiment). Configuration diagram of a support member (Embodiment 2). Configuration diagram of a support member (Embodiment 3). Configuration diagram of a support member (Embodiment 4).

  Hereinafter, the case where the electronic control device according to the present invention is applied to a brake booster of an automobile will be described.

  In a brake system for an automobile, a brake pedal is connected to one piston provided in one cylinder having a small cross-sectional area, and the other cylinder having a large cross-sectional area is connected to the one cylinder to fill the pressure oil. The other piston provided on the cylinder is connected to a brake booster and an ABS (Anti-Lock-Brake-System) device that avoids locking of the tire, or a VDC (Vehicle-) that controls the posture when a side slip occurs. It is connected to the brake of each wheel via a Dynamics-Control device.

  The force when the brake pedal is depressed is doubled hydraulically by the two cylinders, and further boosted by the brake booster. The brake booster includes a configuration in which the hydraulic pressure is increased by using the exhaust pressure of the engine, and a configuration in which the hydraulic pressure is increased by driving an electric actuator including an electric motor.

In this embodiment, an electronic control device is applied to a brake booster that drives an electric actuator to increase hydraulic pressure.
(Constitution)
An external view of the brake booster is shown in FIG. As shown, a cylinder 1 is provided. The cylinder 1 corresponds to the other cylinder, and the hydraulic pressure in the other cylinder is doubled by a brake booster shown in FIG. That is, the brake booster detects the pressure of the pressure oil whose pressure has increased by depressing the brake pedal, and assists to increase the pressure of the pressure oil. Thereby, the raised pressure oil is supplied to the brake of each wheel of the vehicle directly or via the ABS device or the VDC device.

  The brake booster is coupled to the electric motor 2 as an actuator that assists and raises the pressure oil pressure, and the upper part of the casing constituting the electric motor 2 via four bolts 3a to control the electric motor 2. It is comprised from ECU (Electronic Control Unit) 3 as a control means to perform.

  As shown in FIG. 3, the ECU 3 is configured by providing a circuit portion 8 in a housing space between the housing 6 and the housing cover 7. The housing 6 has a substantially bottomed rectangular tube shape, and the housing cover 7 is placed on the upper opening through a seal member (not shown), and the housing cover 7 is coupled to the housing 6 by four screws 9. A square opening 6 a and a round opening 6 b are formed on the side surface of the housing 6, and the respiratory filter 10 is attached to the latter.

  The circuit unit 8 includes an assembly 11 having a power board (not shown) for supplying power to the electric motor 2 and a filter electronic circuit for removing energization noise, and a control for controlling the electric motor 2. And a printed circuit board 12 constituting the substrate.

  The assembly 11 is integrally molded by injection molding, and the assembly 11 is integrally formed with a female connector 13 having one end connected to a battery power source. It is fitted in the part 6a. The assembly 11 includes a substrate body 11a formed of a synthetic resin in a plate shape, a plurality of metal conductor bus bars 14 erected on the upper surface of the substrate body 11a, and a housing provided on the lower surface of the substrate body 11a. It is comprised with the part 11b. In the housing portion 11b, electronic components such as a relay circuit, a common mold coil, a normal mold coil, and a capacitor constituting the assembly 11 are housed. The assembly 11 is fixed inside the housing 6 via a plurality of screws 15.

  The printed circuit board 12 is supported above the assembly 11. A control circuit including a computer is attached to the printed circuit board 12, and a control signal for controlling driving of an inverter (semiconductor element) that is a drive circuit of the electric motor 2 is sent from the control circuit. A plurality of through holes 12a are formed in the printed circuit board 12. The bus bars (connection terminals) 14 are inserted into the through holes 12a and soldered.

  Next, a support structure for supporting the printed circuit board 12 with respect to the substrate body 11a as a base member will be described.

  As shown in FIGS. 1, 3, and 4, a support member 18 is erected on the substrate body 11a, and the support member 18 is integrally formed with the substrate body 11a by a resin mold.

  The support member 18 includes a support column 18a as a support unit erected on the substrate body 11a, a pedestal portion 18e formed on the distal end side of the support column 18a, and an outer peripheral side of the substrate body 11a of the pedestal portion 18e. The side surface restricting portion 18b extends and rises, and the groove portion 18c is provided at a position where the side surface restricting portion 18b rises from the pedestal portion 18e. A guide surface 18d for guiding the printed circuit board 12 when the printed circuit board 12 is placed on the pedestal 18e is formed on the side of the side regulating part 18b on the groove 18c side.

  As shown in FIG. 5, the side surface regulating portion 18 b supports the side surface 12 a of the printed circuit board 12, so that the substrate body 11 a and the printed circuit board 12 vibrate and the printed circuit board in the outer circumferential direction of the substrate body 11 a, that is, the side surface 12 a 12 regulates displacement.

  In other words, the printed circuit board 12 is supported so as to be parallel to the substrate body 11a, and restricts displacement of the printed circuit board 12 and the substrate body 11a in the parallel direction.

  As shown in FIG. 5, the pedestal portion 18 e supports a facing surface 12 c of the printed board 12 that faces the board body 11 a.

  Further, the groove portion 18c is formed in order to improve supportability when the printed circuit board 18 is supported by the side surface regulating portion 18b and the pedestal portion 18e.

  When the support member 18 is molded, the boundary between the side surface regulating portion 18b and the pedestal portion 18e may be formed in a curved surface shape. If the corner portion 12b of the printed circuit board 12 comes into contact with the curved boundary, the contact between the side surface 12a of the printed circuit board 12 and the side surface regulating portion 18b is deteriorated, and a gap is formed. There is a risk. Further, the contact between the facing surface 12c of the printed circuit board 12 and the pedestal portion 18e is deteriorated, and there is a possibility that the supportability is deteriorated such as a gap is formed. Therefore, by forming the groove portion 18c, the contact property of the printed circuit board 12 to the side surface regulating portion 18b or the pedestal portion 18e is improved.

  In other words, the formation of the groove portion 18c suppresses the boundary between the side surface restricting portion 18b and the pedestal portion 18e from being formed in a curved or tapered shape, and fulfills the function of releasing the contact of the corner portion 12b to the groove portion 18c. The support member 18 and the printed circuit board 12 can be brought into surface contact.

  A plurality of support members 18 are arranged on the outer periphery of the printed circuit board 12 as shown in FIG.

  Each support member 18 is disposed at a position shifted from the center position of one side of the side surface 12 a of the printed circuit board 12 toward the end portion. For this reason, it can suppress that the printed circuit board 12 displaces so that it may rotate to the outer peripheral direction of the board | substrate body 11a.

  Further, among the support members 18, those arranged near the connection terminals 14 that penetrate the printed circuit board 12 and are soldered to the printed circuit board 12 have the tip position of the side regulating portion 18 b as shown in FIG. 5. The printed circuit board 12 is set so as not to coincide with or protrude from the surface opposite to the base member 12.

  That is, the height H1 of the support member 18 from the substrate body 11a supports the side surface 12a of the printed circuit board with a holding height H2 of the printed circuit board or less.

  For example, in FIG. 4, the second support member 18 from the right on the front side has one connection terminal 14 in the vicinity thereof, so that the position of the upper end portion of the side regulating portion 18 b is the printed circuit board as shown in FIG. 5. 12 is set to be substantially the same height as the upper surface of 12.

  In this embodiment, in addition to the support member 18, as shown in FIGS. 1, 3, and 4, six snap fits 17 are erected on the board body 11 a to hold the printed board 18.

  The snap fit 17 is integrally formed on the substrate body 11a by a resin mold. The snap fit 17 includes a column 17a standing on the substrate body 11a and an arc projection 17b projecting toward the printed circuit board 12 at the tip of the column 17a. It is configured.

  Further, an upright columnar pedestal column 16 is formed at a position away from the snap fit 17 and inside the substrate body 11 a from the snap fit 17.

  The dimension between the arc projection 17b and the pedestal column 16 is set to be equal to or less than the thickness dimension of the printed circuit board 12, and the printed circuit board 12 is inserted and fitted between the arc projection 17b and the pedestal column 16 As a result, the circular arc projection 17b and the pedestal column 16 are clamped and fixed to the substrate body 11a.

  The support 17a of the snap fit 17 has elasticity, and when the printed circuit board 12 is inserted between the arc projection 17b and the pedestal support 16, the front end side of the support 17a warps in the insertion direction of the printed circuit board. Thus, by expanding the space between the arc projection 17b and the pedestal column 16, it is easy to insert the printed circuit board 12, and the printed circuit board 12 is held by the reaction force that the column 17a returns after the printed circuit board 12 is inserted. The power is secured.

  The facing surface 12c of the printed circuit board 12 facing the substrate body 11a is preferably supported by both the pedestal portion 18e and the pedestal column 16 of the support member 18, but the height variation between the pedestal portion 18e and the pedestal column 16 and The opposing surface 12c of the printed circuit board 12 may be supported by one of the pedestal 18e and the pedestal column 16 due to the influence of the warp of the printed circuit board 12, and even if a gap or looseness occurs in the other, the printed circuit board 12 may be supported. It functions as a maintenance of.

(Function)
Next, the operation of the electronic control device will be described.

  According to this embodiment, the side surface restricting portion 18b of the support member 18 abuts on the side surface 12a of the printed board 12, and the printed board 12 is restricted from being displaced in the outer peripheral direction of the board body 11a.

  On the other hand, the printed circuit board is held near the side surface 12 a of the printed circuit board 12 by the snap fit 17 and the pedestal column 16.

  In addition, it is also possible to support the opposing surface 12c of the printed circuit board 12 by the base part 18e.

  Here, since the snap fit 17 sandwiches the printed circuit board 12 by the arc projection 17b and the pedestal column 16, the stacking direction of the printed circuit board 12 and the substrate body 11a, in other words, the printed circuit board 12 is the upper side, and the reference plate body 11a The vertical displacement of the printed circuit board can be suppressed when the is set on the lower side.

  On the other hand, regarding the displacement of the printed circuit board 12 in the outer peripheral direction of the substrate body 11a, in other words, the displacement of the printed circuit board 12 and the substrate body 11a in the parallel direction, the support 17a of the snap fit 17 has an elastic force. Since it bends in the displacement direction, the displacement cannot be suppressed and the printed circuit board 12 may be displaced.

  In this embodiment, since the support member 18 is applied and the side surface 12a of the printed circuit board 12 is supported by the side surface restricting portion 18b as described above, the vibration caused by traveling of the vehicle after the ECU 3 is mounted on the vehicle or the like. Even if the printed circuit board 12 tries to be displaced in the outer peripheral direction of the substrate body 11a due to the occurrence, this can be suppressed.

  Further, this can reduce stress applied to the solder connection portion of the printed circuit board 12 due to vibration, and can suppress deterioration of the solder connection portion.

  Further, in order to support the side surface 12a of the printed circuit board 12, the layout of the printed circuit board 12 for forming a circuit pattern is provided by providing the printed circuit board 12 with circular holes or the like for attaching the printed circuit board 12 as in the past. The decrease can be suppressed.

  Further, by forming the groove portion 18c, it is possible to improve the supportability to the printed circuit board 12 and the side surface regulating portion 18b or the pedestal portion 18e, and it is possible to improve the effect of suppressing the displacement of the printed circuit board 12 due to vibration. .

  Further, the support member 18 provided in the region affected by the soldering heat when the printed circuit board 12 is soldered has a front end position of the side regulating portion 18b which is the same as that of the base member 12 of the printed circuit board 12 as shown in FIG. Is set so as not to coincide with or protrude from the opposite surface.

  For this reason, for example, the ECU in the state of FIG. 4 before the housing cover 7 is attached is reversed and placed on the upper part of the nozzle 19 of the heating furnace as shown in FIG. 6 to solder the connection terminals 14 to the printed circuit board 12. 7, the molten solder 20 can be prevented from coming into contact with the tip of the side surface restricting portion 18b of the support member 18, and the tip of the side surface restricting portion 18b is melted by the solder 20 and the surrounding heat. It is possible to suppress deformation.

  The support member 18 is disposed at a position shifted from the center position of one side of the side surface 12 a of the printed circuit board 12 toward the end side. For this reason, it can suppress that the printed circuit board 12 displaces so that it may rotate to the outer peripheral direction of the board | substrate body 11a.

Further, the plurality of side surfaces 12 a of the printed circuit board 12 may be supported by the support member 18, and can be supported by the plurality of support members 18 on one side of the printed circuit board 12.
(B) Embodiment 2
Next, a second embodiment will be described. Since this embodiment is obtained by changing a part of the first embodiment, only the parts different from the first embodiment will be described.

  This embodiment is different from the first embodiment only in the configuration of the support member.

  As shown in FIG. 8, the side surface restricting portion 18b of the support member 18 is extended to provide an extension portion, and the extension portion is thermally deformed so that the presser portion 18f that contacts the other surface of the side surface 12a of the printed circuit board 12 is provided. It is provided. Since the printed circuit board 12 can be held by the pressing portion 18f and the base 18e, the snap fit 17 in the first embodiment is omitted. The pedestal column 16 is provided, but may be omitted.

  According to this embodiment, the printed board 12 is entered from the opposite side of the board body 11a into the space surrounded by the extension part of the plurality of support members 18 before the pressing parts 18f, and the base of the support member 18 It is placed on the portion 18e, and then the extension portion of the support member 18 is heated and thermally deformed to form the presser portion 18f.

  According to this electronic control device, when the printed board 12 is fixed to the board body 11a, the stress load due to the force applied to the printed board 12 can be reduced. For this reason, the stress which acts on the connection terminal 14 soldered to the printed circuit board 12 and a solder part is suppressed.

  On the other hand, conventionally, since the substrate 1 is assembled with the substrate receiving portion 3-2 and the floating boss 4 in a state where a gap is formed below the substrate 1, stress is generated in the substrate 1, and the connection terminal and the solder portion are There is a risk of stress. Further, when the heights of the board receiving portion 3-2 and the floating boss 4 vary, and the floating boss 4 is low or the board receiving portion 3-2 is high, the fitting becomes difficult and the assembling property is reduced. May fall.

  Further, since the printed circuit board 12 is supported by the support member 18 from three directions, only one type of support member 18 is formed on the substrate body 11a.

Other configurations, operations, and effects are the same as those in the first embodiment, and thus description thereof is omitted.
(C) Embodiment 3
Next, Embodiment 3 will be described. Since this embodiment is obtained by changing a part of the second embodiment, only portions different from the second embodiment will be described.

  This embodiment is different from the first embodiment only in the configuration of the support member.

  As shown in FIG. 9, from the pedestal portion 18e and a pedestal portion column 18g composed of a part of the column 18a from the pedestal portion 18e to the substrate body 11a, the side surface regulating portion 18b, and the side surface regulating portion 18b. A support member 18 is constituted by a side surface restricting portion column 18h formed of a part of the column 18a up to the substrate body 11a.

  According to this embodiment, since the side regulating portion support column 18h having the side regulating portion 18b and the pedestal portion support column 18g having the pedestal portion 18e are separated, the pedestal portion support column 18g is separated from the side regulating portion support column 18h. The distance between them can be set arbitrarily.

  According to this electronic control device, since the distance between the side regulating portion support column 18h and the pedestal portion support column 18g can be arbitrarily set, the degree of freedom in selecting the installation position of the pedestal portion support column 18g is increased, and the circuit pattern is avoided. The pedestal support column 18g can be arranged, and the layout of the printed circuit board for forming the circuit pattern is improved.

Other configurations, operations, and effects are the same as those of the second embodiment, and thus description thereof is omitted.
(D) Embodiment 4
Finally, Embodiment 2 will be described. Since this embodiment is obtained by changing a part of the third embodiment, only portions different from the third embodiment will be described.

  This embodiment is different from the third embodiment only in the configuration of the support member.

  As shown in FIG. 10, an adhesive 19 is interposed between the pedestal 18 e of the pedestal support column 18 g and one surface of the printed circuit board 12. For this reason, the press part 18f like FIG. 8, FIG. 9 is not provided in the front-end | tip part of the side control part support | pillar 18h.

  According to this embodiment, the printed circuit board 12 is entered from a side opposite to the substrate body 11a into the space surrounded by the plurality of side surface restricting unit columns 18h and placed on the pedestal portion 18e, and the printed circuit board 12 and the pedestal portion 18e. Are connected through an adhesive 19.

  According to this electronic control device, when the printed board 12 is fixed to the board body 11a, the stress load due to the force applied to the printed board 12 is reduced. For this reason, the stress which acts on the connection terminal 14 soldered to the printed circuit board 12 and a solder part is suppressed.

  On the other hand, conventionally, since the substrate 1 is assembled with the substrate receiving portion 3-2 and the floating boss 4 in a state where a gap is formed below the substrate 1, stress is generated on the substrate, and stress is applied to the connection terminal and the solder portion. May act. Further, when the heights of the board receiving portion 3-2 and the floating boss 4 vary, and the floating boss 4 is low or the board receiving portion 3-2 is high, the fitting becomes difficult and the assembling property is reduced. May fall.

  Other configurations, operations, and effects are the same as those of the third embodiment, and thus description thereof is omitted.

Note that since the pedestal 18e supports only the vicinity of the side surface of one surface of the printed circuit board 12, in the first embodiment, the central portion of one surface of the printed circuit board 12 is supported and supported by the pedestal 18e. However, the pedestal column 16 may be configured not to be provided. Moreover, although the groove part 18c was formed in any of Embodiments 1-4, the structure which does not provide the groove part 18c may be sufficient. Further, in the fourth embodiment, the pedestal support column 18g and the side regulating column support 18h are divided and the adhesive 19 is interposed between the pedestal 18e and the printed circuit board 12, but FIG. Even in the support member 18 that is not divided as in FIG. 1, the adhesive member 19 may be interposed between the base 18 e and the printed board 12.
(I)
The electronic control device according to any one of claims 2 to 4,
From the pedestal part column composed of the pedestal part and a part of the support part from the pedestal part to the base member, the side regulation part and a part of the support part from the side regulation part to the base member An electronic control device characterized in that the electronic control device is separated into a side regulating portion support column.

According to the electronic control device according to (a), since the distance between the side regulating portion support column and the pedestal unit support column can be arbitrarily set, the degree of freedom in selecting the installation position of the pedestal unit support column is increased, and the circuit pattern is avoided. The pedestal support column can be arranged on the printed circuit board, and the layout of the printed circuit board for forming the circuit pattern is improved.
(B)
In the electronic control device according to claim 2, 3, 4, (a),
An electronic control device, wherein an adhesive is interposed between one surface of the printed circuit board and the pedestal portion.

  (B) According to the electronic control device, when the printed board is supported by the base member, the stress load due to the force applied to the printed board is reduced. For this reason, the stress which acts on the connection terminal and solder part soldered to a printed circuit board is suppressed.

11a: Board body (base member)
DESCRIPTION OF SYMBOLS 12 ... Printed circuit board 12a ... Side surface 18 ... Support member 18a ... Support | pillar (support part)
18b ... Side regulating part 18c ... Groove part 18e ... Pedestal part 18f ... Presser part

Claims (4)

  1. A base member and at least a printed circuit board on which a circuit pattern for driving and controlling the actuator is formed,
    In the electronic control device in which the printed circuit board is supported on the base member,
    An electronic control device, comprising: a support member that is erected on the base member and that abuts against a side surface of the printed circuit board to regulate displacement in the side surface direction of the printed circuit board.
  2. The support member is
    A support portion erected on the base portion;
    A pedestal formed at the tip of the support,
    The electronic control device according to claim 1, further comprising a side surface regulating portion that extends from the pedestal portion and contacts a side surface of the printed circuit board.
  3.   The electronic control device according to claim 2, wherein a groove portion is formed between the pedestal portion and the side surface regulating portion.
  4.   4. The electronic control device according to claim 2, wherein a pressing portion that is bent and deformed at a front end thereof and abuts against a flat portion of the printed circuit board is formed on the side regulating portion. 5.
JP2012099397A 2012-04-25 2012-04-25 Electronic control unit Active JP6105855B2 (en)

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Application Number Priority Date Filing Date Title
JP2012099397A JP6105855B2 (en) 2012-04-25 2012-04-25 Electronic control unit

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Application Number Priority Date Filing Date Title
JP2012099397A JP6105855B2 (en) 2012-04-25 2012-04-25 Electronic control unit

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JP2013229413A true JP2013229413A (en) 2013-11-07
JP6105855B2 JP6105855B2 (en) 2017-03-29

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Citations (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS60169889U (en) * 1984-04-19 1985-11-11
JPH01154680U (en) * 1988-04-18 1989-10-24
US5452184A (en) * 1994-02-22 1995-09-19 Dell Usa, L.P. Multi-position PC board fastener with grounding element
JP2000077870A (en) * 1998-09-02 2000-03-14 Pioneer Electronic Corp Hook
JP2003229682A (en) * 2002-02-06 2003-08-15 Keihin Corp Fixing member for electronic circuit board
JP3107004U (en) * 2004-08-03 2005-01-27 船井電機株式会社 Disk unit
JP2005079236A (en) * 2003-08-29 2005-03-24 Optrex Corp Substrate-fixing device
JP2012060805A (en) * 2010-09-10 2012-03-22 Hitachi Automotive Systems Ltd Drive control apparatus

Patent Citations (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS60169889U (en) * 1984-04-19 1985-11-11
JPH01154680U (en) * 1988-04-18 1989-10-24
US5452184A (en) * 1994-02-22 1995-09-19 Dell Usa, L.P. Multi-position PC board fastener with grounding element
JP2000077870A (en) * 1998-09-02 2000-03-14 Pioneer Electronic Corp Hook
US6295701B1 (en) * 1998-09-02 2001-10-02 Pioneer Corporation Securing hook
JP2003229682A (en) * 2002-02-06 2003-08-15 Keihin Corp Fixing member for electronic circuit board
JP2005079236A (en) * 2003-08-29 2005-03-24 Optrex Corp Substrate-fixing device
JP3107004U (en) * 2004-08-03 2005-01-27 船井電機株式会社 Disk unit
JP2012060805A (en) * 2010-09-10 2012-03-22 Hitachi Automotive Systems Ltd Drive control apparatus

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