JP2013118360A - 高電子移動度トランジスタ構造及び方法 - Google Patents
高電子移動度トランジスタ構造及び方法 Download PDFInfo
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- 238000000034 method Methods 0.000 title claims description 39
- 230000004888 barrier function Effects 0.000 claims abstract description 61
- 125000006850 spacer group Chemical group 0.000 claims abstract description 55
- 239000000758 substrate Substances 0.000 claims abstract description 23
- 229910052738 indium Inorganic materials 0.000 claims abstract description 20
- APFVFJFRJDLVQX-UHFFFAOYSA-N indium atom Chemical compound [In] APFVFJFRJDLVQX-UHFFFAOYSA-N 0.000 claims abstract description 19
- 229910052782 aluminium Inorganic materials 0.000 claims abstract description 16
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 claims abstract description 14
- GYHNNYVSQQEPJS-UHFFFAOYSA-N Gallium Chemical compound [Ga] GYHNNYVSQQEPJS-UHFFFAOYSA-N 0.000 claims abstract description 13
- 229910052733 gallium Inorganic materials 0.000 claims abstract description 13
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 claims abstract description 8
- 229910052757 nitrogen Inorganic materials 0.000 claims abstract description 4
- 239000000463 material Substances 0.000 claims description 48
- 239000010931 gold Substances 0.000 claims description 16
- BASFCYQUMIYNBI-UHFFFAOYSA-N platinum Chemical compound [Pt] BASFCYQUMIYNBI-UHFFFAOYSA-N 0.000 claims description 15
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 claims description 14
- 238000000151 deposition Methods 0.000 claims description 13
- JMASRVWKEDWRBT-UHFFFAOYSA-N Gallium nitride Chemical compound [Ga]#N JMASRVWKEDWRBT-UHFFFAOYSA-N 0.000 claims description 10
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 claims description 9
- 229910052750 molybdenum Inorganic materials 0.000 claims description 9
- 229910052710 silicon Inorganic materials 0.000 claims description 9
- 239000010703 silicon Substances 0.000 claims description 9
- ZOKXTWBITQBERF-UHFFFAOYSA-N Molybdenum Chemical compound [Mo] ZOKXTWBITQBERF-UHFFFAOYSA-N 0.000 claims description 8
- 229910052581 Si3N4 Inorganic materials 0.000 claims description 8
- 229910052737 gold Inorganic materials 0.000 claims description 8
- 229910052751 metal Inorganic materials 0.000 claims description 8
- 239000002184 metal Substances 0.000 claims description 8
- 239000011733 molybdenum Substances 0.000 claims description 8
- HQVNEWCFYHHQES-UHFFFAOYSA-N silicon nitride Chemical compound N12[Si]34N5[Si]62N3[Si]51N64 HQVNEWCFYHHQES-UHFFFAOYSA-N 0.000 claims description 8
- 229910002601 GaN Inorganic materials 0.000 claims description 7
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 claims description 7
- PIGFYZPCRLYGLF-UHFFFAOYSA-N Aluminum nitride Chemical compound [Al]#N PIGFYZPCRLYGLF-UHFFFAOYSA-N 0.000 claims description 6
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 claims description 6
- 238000003877 atomic layer epitaxy Methods 0.000 claims description 6
- 238000004871 chemical beam epitaxy Methods 0.000 claims description 6
- 238000005229 chemical vapour deposition Methods 0.000 claims description 6
- 229910052759 nickel Inorganic materials 0.000 claims description 6
- TWNQGVIAIRXVLR-UHFFFAOYSA-N oxo(oxoalumanyloxy)alumane Chemical compound O=[Al]O[Al]=O TWNQGVIAIRXVLR-UHFFFAOYSA-N 0.000 claims description 6
- 238000000231 atomic layer deposition Methods 0.000 claims description 5
- 229910052697 platinum Inorganic materials 0.000 claims description 5
- 229910004298 SiO 2 Inorganic materials 0.000 claims description 3
- RNQKDQAVIXDKAG-UHFFFAOYSA-N aluminum gallium Chemical compound [Al].[Ga] RNQKDQAVIXDKAG-UHFFFAOYSA-N 0.000 claims description 3
- 239000003989 dielectric material Substances 0.000 claims description 3
- 238000005530 etching Methods 0.000 claims description 3
- CJNBYAVZURUTKZ-UHFFFAOYSA-N hafnium(iv) oxide Chemical compound O=[Hf]=O CJNBYAVZURUTKZ-UHFFFAOYSA-N 0.000 claims description 3
- 238000001451 molecular beam epitaxy Methods 0.000 claims description 3
- HBMJWWWQQXIZIP-UHFFFAOYSA-N silicon carbide Chemical compound [Si+]#[C-] HBMJWWWQQXIZIP-UHFFFAOYSA-N 0.000 claims description 3
- 235000012239 silicon dioxide Nutrition 0.000 claims description 3
- 239000000377 silicon dioxide Substances 0.000 claims description 3
- 229910018072 Al 2 O 3 Inorganic materials 0.000 claims description 2
- AUCDRFABNLOFRE-UHFFFAOYSA-N alumane;indium Chemical compound [AlH3].[In] AUCDRFABNLOFRE-UHFFFAOYSA-N 0.000 claims description 2
- PMHQVHHXPFUNSP-UHFFFAOYSA-M copper(1+);methylsulfanylmethane;bromide Chemical compound Br[Cu].CSC PMHQVHHXPFUNSP-UHFFFAOYSA-M 0.000 claims description 2
- 230000000149 penetrating effect Effects 0.000 claims description 2
- 238000002488 metal-organic chemical vapour deposition Methods 0.000 claims 1
- 238000004519 manufacturing process Methods 0.000 abstract description 5
- 230000037361 pathway Effects 0.000 abstract 1
- 239000010936 titanium Substances 0.000 description 9
- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical compound [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 description 5
- 229910052719 titanium Inorganic materials 0.000 description 5
- 230000014509 gene expression Effects 0.000 description 4
- 229910052741 iridium Inorganic materials 0.000 description 4
- 239000000203 mixture Substances 0.000 description 4
- 230000005540 biological transmission Effects 0.000 description 3
- 230000015572 biosynthetic process Effects 0.000 description 3
- 238000010586 diagram Methods 0.000 description 3
- 238000002513 implantation Methods 0.000 description 3
- 150000002739 metals Chemical class 0.000 description 3
- 239000004065 semiconductor Substances 0.000 description 3
- 230000006978 adaptation Effects 0.000 description 2
- 230000003321 amplification Effects 0.000 description 2
- 230000015556 catabolic process Effects 0.000 description 2
- 239000002800 charge carrier Substances 0.000 description 2
- 239000004020 conductor Substances 0.000 description 2
- 239000013078 crystal Substances 0.000 description 2
- 230000008021 deposition Effects 0.000 description 2
- 238000001704 evaporation Methods 0.000 description 2
- 230000008020 evaporation Effects 0.000 description 2
- GKOZUEZYRPOHIO-UHFFFAOYSA-N iridium atom Chemical compound [Ir] GKOZUEZYRPOHIO-UHFFFAOYSA-N 0.000 description 2
- 238000003199 nucleic acid amplification method Methods 0.000 description 2
- 238000003949 trap density measurement Methods 0.000 description 2
- 238000000137 annealing Methods 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000033228 biological regulation Effects 0.000 description 1
- 238000004140 cleaning Methods 0.000 description 1
- 230000000295 complement effect Effects 0.000 description 1
- 230000003750 conditioning effect Effects 0.000 description 1
- 230000003247 decreasing effect Effects 0.000 description 1
- 238000005137 deposition process Methods 0.000 description 1
- 230000005684 electric field Effects 0.000 description 1
- 239000012777 electrically insulating material Substances 0.000 description 1
- 230000005669 field effect Effects 0.000 description 1
- -1 for example Substances 0.000 description 1
- 239000007943 implant Substances 0.000 description 1
- 239000012535 impurity Substances 0.000 description 1
- 150000002471 indium Chemical class 0.000 description 1
- 238000001465 metallisation Methods 0.000 description 1
- 230000005404 monopole Effects 0.000 description 1
- 229920002120 photoresistant polymer Polymers 0.000 description 1
- 229910052594 sapphire Inorganic materials 0.000 description 1
- 239000010980 sapphire Substances 0.000 description 1
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Abstract
【解決手段】ICデバイスは、基板102上に形成されるバッファ層104と、電流のための経路をトランジスタデバイスに与えるためにバッファ層104上に形成されるチャネル層106と、チャネル層106上に形成されるスペーサ層108と、スペーサ層108上に形成されるとともに、アルミニウム(Al)、窒素(N)、及び、インジウム(In)又はガリウム(Ga)のうちの少なくとも一方を含むバリア層110と、スペーサ層108又はチャネル層106と直接に結合されるゲート誘電体116と、ゲート誘電体116上に形成され、ゲート誘電体116と直接に結合されるゲート118とを含む。
【選択図】図1
Description
したがって、以下の詳細な説明は限定的な意味に解釈されるべきではなく、また、実施形態の範囲は添付の請求項又はそれらの等価物により規定される。
様々な実施形態によれば、ソース112及びドレイン114はオーム接点である。ソース112及びドレイン114は、標準的な成長接触よりも比較的低い接触抵抗を与え得る再成長接触を含んでもよい。実施形態において、ソース112及びドレイン114の接触抵抗は約0.01ohm-mmである。
他の実施形態では、誘電体層122に関して他の材料を使用できる。
Claims (20)
- 基板上に形成され、該基板とエピタキシャル結合されるバッファ層と、
電流のための経路をトランジスタデバイスに与えるために前記バッファ層上に形成され、前記バッファ層とエピタキシャル結合されるチャネル層と、
前記チャネル層上に形成され、前記チャネル層とエピタキシャル結合されるスペーサ層と、
前記スペーサ層上に形成され、前記スペーサ層とエピタキシャル結合されるとともに、アルミニウム(Al)、窒素(N)、及び、インジウム(In)又はガリウム(Ga)のうちの少なくとも一方を含むバリア層と、
前記スペーサ層又は前記チャネル層と直接に結合されるゲート誘電体と、前記ゲート誘電体上に形成され、前記ゲート誘電体と直接に結合されるゲートと、
を備える装置。 - 前記バッファ層が窒化アルミニウムガリウム(AlxGa1-xN)を含み、xがアルミニウムとガリウムとの相対的な量を表わす0〜1の値であり、前記チャネル層が窒化ガリウム(GaN)を含み、前記スペーサ層が窒化アルミニウム(AlN)を含み、前記バリア層が窒化インジウムアルミニウム(InyAl1-yN)を含み、yがインジウムとアルミニウムとの相対的な量を表わす0〜1の値である、請求項1に記載の装置。
- 前記バッファ層が0.1ミクロン〜2ミクロンの厚さを有し、xが0.05〜1の値を有し、前記チャネル層が50オングストローム〜150オングストロームの厚さを有し、前記スペーサ層が5オングストローム〜約30オングストロームの厚さを有し、前記バリア層が50オングストローム〜150オングストロームの厚さを有し、yが0.13〜0.21の値を有する請求項2に記載の装置。
- 前記ゲート誘電体は、酸化アルミニウム(Al2O3)、窒化ケイ素(SiN)、酸化ハフニウム(HfO2)、二酸化ケイ素(SiO2)、又は、酸窒化ケイ素(SiON)を含み、前記ゲート誘電体が20オングストローム〜200オングストロームの厚さを有する請求項1に記載の装置。
- 前記ゲートがT形状フィールドプレートゲートであり、前記ゲートは、ニッケル(Ni)、白金(Pt)、インジウム(In)、モリブデン(Mo)、又は、金(Au)を含む請求項4に記載の装置。
- 前記バリア層上に形成されるソースと、前記バリア層上に形成されるドレインとを更に備え、前記ソース及び前記ドレインのそれぞれが前記バリア層及び前記スペーサ層を貫通して前記チャネル層中へと延びる請求項1に記載の装置。
- 前記ソースがオーム接点であり、前記ドレインがオーム接点であり、前記ドレインと前記ゲートとの間の最短距離が前記ソースと前記ゲートとの間の最短距離よりも大きい請求項6に記載の装置。
- 基板を更に備え、前記基板は、シリコン(Si)、シリコンカーバイト(SiC)、サファイア(Al2O3)、窒化ガリウム(GaN)、又は、窒化アルミニウム(AlN)を含む請求項1に記載の装置。
- 前記バリア層上に形成される誘電体層を更に備える請求項1に記載の装置。
- 前記ゲートがエンハンスメントモード(e-モード)高電子移動度トランジスタ(HEMT)スイッチデバイスの一部である請求項1に記載の装置。
- 基板上にバッファ層をエピタキシャル堆積させるステップと、前記バッファ層上にチャネル層をエピタキシャル堆積させるステップであって、前記チャネル層が電流のための経路をトランジスタデバイスに与えるステップと、前記チャネル層上にスペーサ層をエピタキシャル堆積させるステップと、前記スペーサ層上にバリア層をエピタキシャル堆積させるステップであって、前記バリア層が、アルミニウム(Al)、窒素(N)、及び、インジウム(In)又はガリウム(Ga)のうちの少なくとも一方を含むステップと、前記スペーサ層を露出させるために前記バリア層の一部を選択的に除去するステップと、前記スペーサ層と直接に結合されるゲート誘電体を形成するために、露出された前記スペーサ層上にゲート誘電体材料を堆積させるステップと、前記ゲート誘電体と直接に結合されるトランジスタデバイスのゲートを形成するために、前記ゲート誘電体上にゲート材料を堆積させるステップとを備える方法。
- 前記バッファ層が窒化アルミニウムガリウム(AlxGa1-xN)を含み、xがアルミニウムとガリウムとの相対的な量を表わす0〜1の値であり、前記チャネル層が窒化ガリウム(GaN)を含み、前記スペーサ層が窒化アルミニウム(AlN)を含み、前記バリア層が窒化インジウムガリウムアルミニウム(InyGazAl1-y-zN)を含み、y及びzがインジウムとガリウムとの相対的な量を表わす0〜1の値である、請求項11に記載の方法。
- 前記バッファ層が0.1ミクロン〜2ミクロンの厚さを有し、xが0.05〜1の値を有し、前記チャネル層が50オングストローム〜150オングストロームの厚さを有し、前記スペーサ層が5オングストローム〜約30オングストロームの厚さを有し、前記バリア層が50オングストローム〜150オングストロームの厚さを有し、yが0.13〜0.21の値を有する請求項12に記載の方法。
- 前記バリア層の一部がエッチングプロセスを使用して選択的に除去され、前記ゲート誘電体が原子層堆積(ALD)プロセスを使用して堆積され、前記ゲート誘電体は、酸化アルミニウム(Al2O3)、窒化ケイ素(SiN)、酸化ハフニウム(HfO2)、二酸化ケイ素(SiO2)、又は、酸窒化ケイ素(SiON)を含み、前記ゲート誘電体が20オングストローム〜200オングストロームの厚さを有する請求項11に記載の方法。
- 前記ゲートがT形状フィールドプレートゲートであり、前記ゲートは、ニッケル(Ni)、白金(Pt)、インジウム(In)、モリブデン(Mo)、又は、金(Au)を含む請求項14に記載の方法。
- 前記バリア層上にソースを形成するステップと、前記バリア層上にドレインを形成するステップとを更に備え、前記ソース及び前記ドレインのそれぞれが前記バリア層及び前記スペーサ層を貫通して前記チャネル層中へと延び、前記ドレインと前記ゲートとの間の最短距離が前記ソースと前記ゲートとの間の最短距離よりも大きく、前記ソース及び前記ドレインのそれぞれがオーム接点である請求項11に記載の方法。
- 基板を設けるステップを更に備え、前記基板は、シリコン(Si)、シリコンカーバイト(SiC)、サファイア(Al2O3)、窒化ガリウム(GaN)、又は、窒化アルミニウム(AlN)を含む請求項11に記載の方法。
- 前記バリア層上に誘電体層を形成するステップを更に備える請求項11の方法。
- 前記チャネル層は、電流のための経路をエンハンスメントモード(e-モード)高電子移動度トランジスタ(HEMT)スイッチデバイスに与えるように構成される請求項11に記載の方法。
- 前記バッファ層、前記チャネル層、前記スペーサ層、及び、前記バリア層のそれぞれは、分子線エピタキシー(MBE)、原子層エピタキシー(ALE)、化学ビームエピタキシー(CBE)、又は、有機金属化学気相成長法(MOCVD)によってエピタキシャル堆積される請求項11に記載の方法。
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KR102519899B1 (ko) | 2015-11-02 | 2023-04-07 | 엔지케이 인슐레이터 엘티디 | 반도체 소자용 에피택셜 기판, 반도체 소자, 및 반도체 소자용 에피택셜 기판의 제조 방법 |
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US20130105817A1 (en) | 2013-05-02 |
FR2982078A1 (fr) | 2013-05-03 |
US9054167B2 (en) | 2015-06-09 |
DE102012020978A1 (de) | 2013-05-02 |
US20130334538A1 (en) | 2013-12-19 |
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