JP2013113969A - Defect correcting apparatus - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a defect correcting apparatus allowing a user to observe a heating condition of a correction liquid while heating the correction liquid applied to a defective portion.SOLUTION: A defect correcting apparatus 1 comprises: an observation optical system 7 for observing a front face of a substrate 4; an imaging camera 12 for imaging an image of the front face of the substrate 4 through the observation optical system 7; a coating unit 11 for coating a disconnection defective portion 4b with a correction liquid 22; a heating laser 8 for irradiating and calcinating the correction liquid 22 applied to the disconnection defective portion 4b with a laser beam; and an attenuation filter 14 provided insertably and removably in front of the imaging camera 12 to attenuate scattered light of the laser beam. Accordingly, the apparatus 1 can prevent halation arising from the scattered light of the laser beam.

Description

  The present invention relates to a defect correction apparatus, and more particularly to a defect correction apparatus that corrects a defect portion of a pattern formed on a surface of a substrate, for example, a disconnection defect portion of a wiring.

  In recent years, with the increase in size and definition of flat panel displays such as plasma displays, liquid crystal displays, and EL displays, there is a probability that defects (such as wiring (electrodes), liquid crystal color filters, and masks formed on glass substrates exist. A method for correcting defects has been proposed in order to improve the yield.

  For example, wiring is formed on the surface of a glass substrate of a liquid crystal display. When a part of this wiring is disconnected, after applying a correction liquid (conductive ink) containing conductive metal particles attached to the tip of the application needle to the disconnection defect part (open defect part), the laser beam The correction liquid is heated (fired) by locally irradiating and forming a conductive film for correction (see, for example, Patent Document 1).

  Alternatively, after applying the correction liquid to the disconnection portion using a pipette (dispenser), an ink jet, a film mask or the like as the application means, the disconnection portion is corrected by local heating (see, for example, Patent Documents 2, 3, and 4).

JP-A-8-292442 JP-A-9-275104 Japanese Patent No. 4248840 JP 2009-86500 A

  However, in the conventional defect correction apparatus, when the correction liquid applied to the defective portion is locally heated, a part of the laser beam is reflected by the correction liquid and is incident on the imaging camera to cause halation, thereby heating the correction liquid. It was difficult to observe the situation and the influence on the substrate with a monitor.

  Therefore, a main object of the present invention is to provide a defect correction apparatus capable of observing the heating state of the correction liquid while heating the correction liquid applied to the defect portion.

  A defect correction apparatus according to the present invention is a defect correction apparatus for correcting a defect portion of a pattern formed on a surface of a substrate, and includes an observation optical system for observing the surface of the substrate, and the substrate via the observation optical system. Imaging means for taking an image of the surface of the coating, application means for applying a correction liquid to the defective part, a local heating light source for locally irradiating and heating the correction liquid applied to the defective part, and an imaging means, An attenuating unit is provided between the observation optical systems. The attenuating unit attenuates the light emitted from the local heating light source, reflected by the correction liquid, and incident on the imaging unit.

  Preferably, the attenuation means is provided so as to be insertable / removable between the imaging means and the observation optical system, and attenuates light having a wavelength of light emitted from the local heating light source, and light is emitted from the local heating light source Includes an attenuating filter inserted between the imaging means and the observation optical system, and driving means for extracting the attenuation filter from between the imaging means and the observation optical system when light is not emitted from the local heating light source.

  Preferably, the attenuation means is further provided so as to be insertable / removable between the imaging means and the observation optical system, and has a first window on which an attenuation filter is mounted, and a movable plate having a second window made of a through hole. including. The driving means moves the movable plate and arranges the first window between the imaging means and the observation optical system when emitting light from the local heating light source, and the second window when emitting light from the local heating light source. A window is disposed between the imaging means and the observation optical system.

  Preferably, the local heating light source includes a laser, and the light emitted from the local heating light source is laser light emitted from the laser.

  Preferably, the local heating light source further includes a shutter for switching between irradiating the correction liquid with the laser light emitted from the laser or blocking the correction liquid.

  Preferably, the shutter is closed when the laser beam is not emitted from the laser, and is opened after the laser beam is actually emitted from the laser.

  Further preferably, an objective lens provided at the lower end of the observation optical system is further provided, and the laser is fixed to the observation optical system. Laser light emitted from the laser is applied to the correction liquid via the observation optical system and the objective lens, and spot light having a predetermined size is formed on the surface of the correction liquid.

  Preferably, the attenuation amount of the attenuation unit is set to a level at which the spot light, the correction liquid applied to the defective portion, and the pattern around the spot light can be observed in the image photographed by the imaging unit. Yes.

  In addition, preferably, a stage is provided that moves the observation optical system and the substrate relative to each other so that the spot light moves at a predetermined speed on the correction liquid applied to the defect portion.

  Preferably, the pattern is a wiring, the defect portion is a disconnection defect portion, and the correction liquid is baked to become a conductive film.

  In the defect correction apparatus according to the present invention, an attenuation unit is provided between the imaging unit and the observation optical system to attenuate the light emitted from the local heating light source and reflected by the correction liquid or the substrate surface and incident on the imaging unit. Therefore, it is possible to prevent halation from occurring in the imaging means. Therefore, it is possible to observe the heating state of the correction liquid while heating the correction liquid applied to the defective part.

1 is a perspective view showing an overall configuration of a defect correction apparatus according to an embodiment of the present invention. It is a perspective view which shows the structure of the defect correction apparatus shown in FIG. It is sectional drawing which shows the operation | movement at the time of observation of the defect correction apparatus shown in FIG. It is sectional drawing which shows the operation | movement at the time of application | coating of the defect correction apparatus shown in FIG. It is sectional drawing which shows the operation | movement at the time of baking of the defect correction apparatus shown in FIG. It is a flowchart which shows the operation | movement at the time of baking of the defect correction apparatus shown in FIG. It is sectional drawing which shows the example of a change of embodiment. It is a flowchart which shows the operation | movement at the time of baking of the defect correction apparatus shown in FIG. It is sectional drawing which shows the other example of a change of embodiment.

  In the defect correction apparatus according to the present invention, when the correction liquid applied to the defect portion is heated, an attenuation filter that attenuates light having the wavelength of the heating laser beam is inserted between the observation optical system and the imaging camera. That is, the attenuation filter is inserted in front of the imaging camera before the correction liquid (conductive ink) applied to the defective portion is heated (baked), and when the heating is completed, the attenuation filter is removed from the front of the imaging camera. .

  The laser beam for local heating passes through the observation optical system and is narrowed down by the objective lens. For this reason, a small spot light is formed on the surface of the correction liquid applied to the defective part. When the defective part is long, the correction liquid is heated while moving the spot light (laser scanning) on the correction liquid applied to the defective part.

  Therefore, since the scattered light of the laser beam irradiated to the defective part from the local heating light source is attenuated by the attenuation filter before entering the imaging camera, the halation is suppressed and the heating state of the correction liquid on the monitor screen and the substrate are suppressed. The effect can be observed directly. It is also possible to observe the irradiation position and irradiation range of the laser beam, and the correction of the irradiation position is facilitated.

  In addition, it is assumed that when the laser beam for local heating is irradiated, the correction liquid escapes around or the substrate is burned out. However, the heating condition can be observed on the monitor at all times, so the heating conditions are set. It can also be used as a judgment material. Hereinafter, the defect correction apparatus of the present invention will be described in detail with reference to the drawings.

  FIG. 1 is a perspective view showing an overall configuration of a defect correction apparatus 1 according to an embodiment of the present invention. In FIG. 1, in the defect correcting apparatus 1, a chuck 3 is provided at the center of a surface plate 2, and a substrate 4 to be corrected is fixed to the chuck 3. A gantry type XY stage 5 is mounted on the surface plate 2. The XY stage 5 includes an X-axis stage 5a and a gate-shaped Y-axis stage 5b. The Y-axis stage 5b is provided so as to straddle the chuck 3, and moves in the Y-axis direction in the figure. The X-axis stage 5a is mounted on the Y-axis stage 5b and moves in the X direction in the figure.

  A Z-axis stage 6 that can move in the vertical direction is mounted on the X-axis stage 5a. An observation optical system 7 is fixed to the Z-axis stage 6. A heating laser 8 is mounted above the observation optical system 7, and an objective lens switching device 10 for switching the objective lens 9 is fixed below the heating laser 8. Further, the application unit 11 is fixed to the objective lens switching device 10. The application unit 11 has a function of applying a correction liquid (conductive ink) to a pattern defect of the substrate 4, for example, a disconnection defect part of the wiring. As the application unit 11, one is selected from a method of transferring the correction liquid attached to the tip of the needle to the defective portion, or a method of discharging the correction liquid from the tip of the nozzle, such as an ink jet or a micropipette.

  By controlling the X-axis stage 5a, the Y-axis stage 5b, and the Z-axis stage 6, each of the observation optical system 7, the heating laser 8, and the coating unit 11 is moved above a desired position on the surface of the substrate 4. Is possible. The objective lens switching device 10 includes a movable plate 10a as shown in FIG. The movable plate 10a is an XY stage and is provided so as to be movable in the XY directions. A plurality of objective lenses 9 and application units 11 having different magnifications are provided on the lower surface of the movable plate 10a. By moving the movable plate 10a, the magnification of the objective lens 9 can be changed and the application position of the application unit 11 can be moved. The application unit 11 may be directly fixed to the Z-axis stage 6.

  In addition, an imaging camera (CCD camera) 12 for displaying an image observed by the objective lens 9 on the monitor screen is fixed to the observation optical system 7, and in front of the imaging camera 12 (the imaging camera 12 and the observation optical system 7. (Between), an attenuator 13 for attenuating the light having the wavelength of the laser beam emitted from the heating laser 8 is provided.

  The attenuating device 13 includes an attenuating filter 14 that attenuates light having the wavelength of the laser light emitted from the heating laser 8, a movable plate 16, and a driving device 17. The movable plate 16 is a rectangular plate member having a window (first window) on which the attenuation filter 14 is mounted and an empty window (second window) made of a through hole. It is provided between the cameras 12 so as to be movable.

  The drive device 17 is a linear motion actuator (for example, an air cylinder), and moves the movable plate 16 in the vertical direction in FIG. By operating the driving device 17, any one of the attenuation filter 14 and the sky window 15 can be disposed in front of the imaging camera 12.

  For example, when a YAG second harmonic continuous wave laser whose emitted light has a wavelength of 532 nm is used as the heating laser 8, the attenuation filter 14 whose transmission limit wavelength is set to a wavelength slightly larger than 532 nm (for example, 560 nm) is used. To do. Since the color tone of the attenuation filter 14 whose transmission limit wavelength is 560 nm is orange, when the attenuation filter 14 is inserted in front of the imaging camera 12, the monitor screen becomes orange color and the surface of the substrate 4 is colored. It is unsuitable for observation. Therefore, when applying the correction liquid or observing the surface of the substrate 4, the problem is solved by arranging the empty window 15 in front of the imaging camera 12.

  The coating unit 11 is fixed to the movable plate 10a of the objective lens switching device 10, and the coating position can be changed by moving the movable plate 10a in the XY directions. For this reason, it is not necessary to move the large gantry type XY stage 5 and align the coating unit 11. Further, when an inkjet is used as the coating means, a discarding plate capable of discarding the correction liquid is disposed in the vicinity of the nozzle.

  Next, the process of correcting the disconnection defect portion 4b of the wiring 4a formed on the surface of the substrate 4 will be described with reference to FIGS. When observing the disconnection defect portion 4b, as shown in FIG. 3, an empty window 15 is disposed in front of the imaging camera 12, and the optical axes of the observation optical system 7 and the objective lens 9 are positioned at the disconnection defect portion 4b. .

  A heating laser 8 is provided above the observation optical system 7. Inside the observation optical system 7, a beam splitter 18, an imaging lens 19, and a beam splitter 20 are arranged in order from the top, and an objective lens switch 10 and a plurality of objective lenses 9 are provided below the beam splitter 18. The imaging camera 12 is provided to face the beam splitter 18 via the attenuation device 13. The incident light source 21 is fixed to the side surface of the observation optical system 7 and is provided to face the beam splitter 20.

  The reflected light from the incident light source 21 is irradiated onto the substrate 4 via the beam splitter 20, and the reflected light from the substrate 4 is incident on the imaging camera 12 via the beam splitter 20, the imaging lens 19, and the beam splitter 18. Thereby, the image of the surface of the board | substrate 4 is image | photographed with the imaging camera 12, and is displayed on the screen of a monitor.

  In addition, when applying the correction liquid 22 to the disconnection defect portion 4b using the application unit 11, as shown in FIG. 4, an empty window 15 is disposed in front of the imaging camera 12 and applied above the disconnection defect portion 4b. A unit 11 is arranged. For example, when an inkjet is used as the coating unit 11, an inkjet nozzle is connected from the end of one wiring 4a to the end of the other wiring 4a so as to connect two normal wirings 4a on both sides of the disconnection defect 4b. The correction liquid 22 is applied while relatively moving the substrate 4 and the substrate 4 at a predetermined speed. In this example, coating is performed while driving the movable plate 10a (XY stage) of the objective lens switching unit 10.

  Further, when the correction liquid 22 applied to the disconnection defect portion 4b is heated (baked), as shown in FIG. 5, an attenuation filter 14 is disposed in front of the imaging camera 12, and the observation optical system 7 and the objective lens 9 are disposed. Is positioned at the disconnection defect portion 4b. Before irradiating the substrate 4 with laser light from the heating laser 8, the movable plate 16 of the attenuation device 13 is moved so that the attenuation filter 14 is disposed in front of the imaging camera 12.

  The laser light emitted from the heating laser 8 is narrowed down by the objective lens 9 to become a spot light 8a that is smaller than the cross section of the laser beam emitted from the heating laser 8, and the correction liquid 22 and the disconnection defect portion 4b. Is irradiated. For example, when the diameter of the cross section of the laser beam emitted from the heating laser 8 is 0.3 mm and the objective lens 9 having a magnification of 20 is selected, the diameter of the spot light 8a irradiated on the surface of the substrate 4 is 10 to 15 μm. It will be about.

  After the spot light 8a of the heating laser 8 is aligned with one end of the correction liquid 22 applied to the disconnection defect portion 4b, the spot light 8a is moved (laser scanning) toward the other end at a predetermined speed. Thus, local heating (firing) is performed, and the conductive film 22A is formed in the disconnection defect portion 4b. Laser scanning is performed by driving the XY stage of the objective lens switching unit 10.

  Scattered light is generated when the disconnection defect portion 4b and the correction liquid 22 are irradiated with the spot light 8a of the heating laser 8, and the scattered light enters the imaging camera 12 through the objective lens 9 and the observation optical system 7. Adversely affected. However, in the first embodiment, the scattered light is attenuated by the attenuation filter 14, so that the halation can be suppressed and the heating state of the correction liquid 22 and the influence on the substrate 4 can be directly observed on the monitor screen. Moreover, since the irradiation position and irradiation size of the spot light 8a can be confirmed, it is possible to easily check the irradiation range and correct the irradiation position. Further, since the heating state of the correction liquid 22 can be observed on the monitor at all times, it is possible to obtain a judgment material when setting the heating conditions.

  FIG. 6 is a flowchart showing a process of heating the correction liquid 22 applied to the disconnection defect portion 4b by the heating laser 8. When receiving a heating (firing) command, the control device (not shown) switches to the objective lens 9 capable of passing the heating laser beam in step S1. For example, if the heating laser 8 is a YAG second harmonic laser, the near-infrared correction objective lens 9 is selected.

  Next, a heating range is set in step S2. The heating range is set while observing the monitor screen, and is set slightly longer than the correction liquid 22 applied to the disconnection defect portion 4b. When the setting of the heating range is completed, in step S3, the movable plate 16 of the attenuation device 13 is operated to insert the attenuation filter 14 in front of the imaging camera 12.

  Next, in step S4, a laser beam emission command is given to the heating laser 8, and laser scanning is performed in step S5 while irradiating the substrate 4 (disconnection defect portion 4b and correction liquid 22) with the spot light 8a. In this step, the correction liquid 22 applied to the disconnection defect portion 4b is heated (fired) to ensure the continuity of the wiring 4a. When the heating is completed, the emission of the laser beam of the heating laser 8 is stopped in step S6, and then the attenuator 13 is operated to insert the empty window 15 in front of the imaging camera 12 in step S7. Thus, local heating is completed by implementing step S1-S7 in order.

  FIG. 7 is a diagram showing a modification of the first embodiment and is a diagram contrasted with FIG. In FIG. 7, this modified example is different from the first embodiment in that a shutter 23 is added below the heating laser 8 (between the heating laser 8 and the observation optical system 7). The optical axis of the heating laser 8 and the optical axis of the observation optical system 7 coincide.

  The shutter 23 includes a shielding plate 23a having a through hole 23b. When the laser beam of the heating laser 8 is incident on the observation optical system 7, the shielding plate 23a is moved to position the through hole 23b on the optical axis, and when the laser beam is blocked, the penetration of the shielding plate 23a is performed. A portion other than the hole 23b is positioned on the optical axis.

  There may be a response delay of, for example, several seconds from when the irradiation command is given to the heating laser 8 to when the laser light is actually emitted from the heating laser 8. In this case, laser scanning is started after confirming that the laser beam has been emitted. However, the laser beam is applied to one point of the substrate 4 after the laser beam is emitted until it is confirmed. Continue to be.

  Although the time for which one point of the substrate 4 is continuously irradiated is short, depending on the material of the substrate 4 and the laser power condition, it is assumed that the irradiated portion is burned out. In order to avoid this, it is preferable to block the laser beam by the shutter 23 until it is confirmed that the laser beam is emitted from the heating laser 8. When it is confirmed that the laser beam is emitted from the heating laser 8, the shutter 23 is opened (the through hole 23b is inserted into the optical path) and simultaneously the relative movement (laser scanning) between the substrate 4 and the spot beam 8a is started. Then, the correction liquid 22 applied to the disconnection defect portion 4b is heated (fired).

  FIG. 8 is a flowchart showing the operation of the defect repairing apparatus shown in FIG. 7, and is a diagram contrasted with FIG. In FIG. 8, this flowchart differs from the flowchart of FIG. 6 in that steps S41 and S42 are added between steps S4 and S5, and step S51 is added between steps S5 and S6.

  When a laser beam emission command is given to the heating laser 8 in step S4, the process waits until the laser beam is emitted from the heating laser 8 in step S41. When the laser beam is emitted, the shutter 23 is opened in step S42, and laser scanning is performed in step S5. When the laser scanning is finished, the shutter 23 is closed in step S51, and emission of the laser beam is stopped in step S6.

  Once the emission of the laser beam is stopped, there is a response delay when it is emitted again, so it is necessary to wait each time. However, since the shutter 23 is provided, the broken defect portions 2b scattered without stopping the laser emission. The applied correction liquid 22 can be heated. After the heat treatment of one disconnection defect portion 2b is completed, the processing time can be shortened by closing the shutter 23 in the laser irradiation state, moving to the next heating position (defect position), and performing the process of step S42. It becomes.

  FIG. 9 is another modification of the first embodiment, and is a diagram compared with FIG. Referring to FIG. 9, the defect correcting apparatus is different from the first embodiment in that laser 24 and slit reference light source 28 are added, and observation optical system 7 is replaced with observation optical system 7A.

  The observation optical system 7A is obtained by adding beam splitters 25 and 27 and a variable slit 26 to the observation optical system 7 of FIG. In the observation optical system 7A, beam splitters 25 and 27, a variable slit 26, a beam splitter 18, an imaging lens 19, and a beam splitter 20 are arranged in order from the top.

  The laser 24 is provided at the upper end of the observation optical system 7A, and the optical axis of the laser 24 and the optical axis of the observation optical system 7 coincide with each other. The laser 24 is provided for laser ablation (removal) of a pattern such as the wiring 4 a of the substrate 4. The laser 24 is, for example, a YAG (first to fourth) harmonic pulse laser. The wavelength of the emitted light of the laser 24 can be selected according to use conditions. The laser light emitted from the laser 24 is transmitted through the beam splitters 25 and 27, and after the cross-sectional shape is adjusted by the variable slit 26, the laser light is further transmitted through the beam splitter 18, the imaging lens 19, and the beam splitter 20. The light is squeezed by the lens 9 and irradiated onto the wiring 4 a of the substrate 4.

  The heating laser 8 is fixed to the side surface of the observation optical system 7A, and is provided to face the beam splitter 25 through the shutter 23. The laser light emitted from the heating laser 8 is reflected by the beam splitter 25, then passes through the beam splitter 27, the variable slit 26, the beam splitter 18, the imaging lens 19, and the beam splitter 20, and is reflected by the objective lens 9. The correction liquid 22 applied to the disconnection defect portion 4b is squeezed and irradiated.

  The slit reference light source 28 is fixed to the side surface of the observation optical system 7 </ b> A and is provided to face the beam splitter 25. The light emitted from the slit reference light source 28 is reflected by the beam splitter 27, and after the cross-sectional shape is adjusted by the variable slit 26, the light is further transmitted through the beam splitter 18, the imaging lens 19, and the beam splitter 20, and the objective lens 9 is applied to the wiring 4a of the substrate 4 and the like. Before the slit reference light source 28 irradiates the laser light from the laser 24 onto the wiring 4a of the substrate 4, the shape of the opening of the variable slit 26 (the cross-sectional shape of the laser light emitted from the laser 24, the irradiation region of the laser light). Used to adjust the shape).

  Instead of the beam splitter 25, a total reflection mirror may be provided. When heating the correction liquid 22 applied to the disconnection defect portion 4b, the total reflection mirror is inserted at a position where the light of the heating laser 8 is reflected downward. Further, when the surface of the substrate 4 is irradiated with laser light emitted from the laser 24, the total reflection mirror is disposed at a position off the optical axis.

  The light emitted from the slit reference light source 28 projects the reduced shape of the opening of the variable slit 26 onto the surface of the substrate 4. When the correction liquid 22 applied to the substrate 4 is heated (baked) by the heating laser 8, the opening of the variable slit 26 is fully opened. A variable slit 26 and a slit reference light source 28 may be mounted in the laser 24. In this modification, patterns such as the wiring 4a of the substrate 4 can be laser ablated (removed).

  The embodiment disclosed this time should be considered as illustrative in all points and not restrictive. The scope of the present invention is defined by the terms of the claims, rather than the description above, and is intended to include any modifications within the scope and meaning equivalent to the terms of the claims.

  DESCRIPTION OF SYMBOLS 1 Defect correction apparatus, 2 Surface plate, 3 Chuck, 4 Substrate, 4a Wiring, 4b Disconnection defect part, 5 XY stage, 5a X axis stage, 5b Y axis stage, 6 Z axis stage, 7, 7A Observation optical system, 8 Laser for heating, 8a spot light, 9 objective lens, 10 objective lens switch, 10a movable plate, 11 coating unit, 12 imaging camera, 13 attenuation device, 14 attenuation filter, 15 sky window, 16 movable plate, 17 driving device, 18, 20, 25, 27 Beam splitter, 19 imaging lens, 21 incident light source, 22 correction liquid, 22A conductive film, 23 shutter, 23a shielding plate, 23b through-hole, 24 laser, 26 variable slit, 28 slit reference light source.

Claims (10)

A defect correction device for correcting a defect portion of a pattern formed on a surface of a substrate,
An observation optical system for observing the surface of the substrate;
An imaging means for taking an image of the surface of the substrate through the observation optical system;
Application means for applying a correction liquid to the defective portion;
A local heating light source that locally irradiates and heats the correction liquid applied to the defect portion; and
A defect correcting apparatus provided between the imaging unit and the observation optical system, and comprising an attenuating unit that attenuates light that is emitted from the local heating light source, reflected by the correction liquid, and incident on the imaging unit. The attenuation means is
An attenuation filter that is detachably provided between the imaging means and the observation optical system, and attenuates light having a wavelength of light emitted from the local heating light source;
When light is emitted from the local heating light source, the attenuation filter is inserted between the imaging means and the observation optical system. When light is not emitted from the local heating light source, the attenuation filter is inserted into the imaging means and the observation. The defect correction apparatus according to claim 1, further comprising a driving unit that extracts from between the optical systems. The attenuation means is further provided so as to be insertable / removable between the imaging means and the observation optical system, and has a first window on which the attenuation filter is mounted, and a movable plate having a second window formed of a through hole. Including
The driving means moves the movable plate and, when emitting light from the local heating light source, arranges the first window between the imaging means and the observation optical system, and emits light from the local heating light source. The defect correction apparatus according to claim 2, wherein the second window is disposed between the imaging unit and the observation optical system when the light is not emitted. The local heating light source includes a laser;
The defect correction apparatus according to claim 1, wherein the light emitted from the local heating light source is laser light emitted from the laser.   The defect correction apparatus according to claim 4, wherein the local heating light source further includes a shutter for switching whether to irradiate or block the correction liquid with laser light emitted from the laser.   The defect correction device according to claim 5, wherein the shutter is closed when laser light is not emitted from the laser, and is opened after the laser light is actually emitted from the laser. Furthermore, an objective lens provided at the lower end of the observation optical system is provided,
The laser is fixed to the observation optical system,
The laser light emitted from the laser is irradiated onto the correction liquid through the observation optical system and the objective lens, and spot light having a predetermined size is formed on the surface of the correction liquid. The defect correction apparatus according to claim 6.   The attenuation amount of the attenuation unit is set to a level at which the spot light, the correction liquid applied to the defect portion, and the surrounding pattern can be observed in the image photographed by the imaging unit. The defect correction apparatus according to claim 7.   The stage further comprises a stage for relatively moving the observation optical system and the substrate so that the spot light moves at a predetermined speed on the correction liquid applied to the defect portion. The defect correction apparatus according to claim 8. The pattern is a wiring,
The defect is a disconnection defect,
The defect correction apparatus according to claim 1, wherein the correction liquid is baked to form a conductive film.

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